WO2019032079A1

WO2019032079A1 - Housing for computing device

Info

Publication number: WO2019032079A1
Application number: PCT/UA2018/000085
Authority: WO
Inventors: Сергей Сергеевич ТОВАРНИЦКИЙ
Original assignee: Сергей Сергеевич ТОВАРНИЦКИЙ
Priority date: 2017-08-11
Filing date: 2018-07-31
Publication date: 2019-02-14

Abstract

The invention relates to the field of computer engineering and pertains to the cooling of equipment while said equipment is operating. A housing for a computing device comprises at least two compartments, on the boundary of which a computing device is installed such that a stream of cold air moving from outside of the housing by means of the convective movement of a heat transfer agent and by means of air propulsors passes from one compartment through a ventilation opening to a heated element of the computing device and becomes warmed, and the warmed air then moves into the second compartment, from which it is expelled through a ventilation opening, wherein the housing can be equipped with additional propulsors and additional air ducts in order to increase and improve cooling efficiency.

Description

Enclosure for computing device

TECHNICAL FIELD

The invention relates to the field of computing technology in general, and to cooling devices, as a result of which can be used in the design and manufacture of computers, servers, information processing systems, the manufacture of components for them and in other industries.

PRIOR ART

At the present time, computer technology is developing very rapidly. Most electronic devices, which are used both in computers, servers, and independently, during normal operation emit a certain amount of heat. With increasing power of computer systems, the amount of heat that devices and computer modules emit is rapidly growing. This trend is a problem both at the device or module level and at the system level. Excess temperature leads to instability, malfunctioning or even failure of devices and in some cases their failure.

Also, with the development, some information processing technologies, such as mining cryptocurrencies, for example, need to simultaneously use many devices at the same time, such as video cards, which are usually located in the same package. In such cases, the problem becomes even more acute, because in order to increase the efficiency of information processing, devices are used at capacities close to the maximum, which leads to the release of large amounts of heat.

Hereinafter, the terms computing device, electronic device, refers to devices for processing graphic information that contain a graphic processor — video cards, central processors, memory modules, information storage modules, and other information processing modules as part of computers and servers , and those that can be used separately.

Modern computing devices, such as graphic adapters (video cards), processors, memory modules, etc., contain

SUBSTITUTE SHEET (RULE 26) integrated circuits - chips, and other parts that produce a fairly large amount of heat during normal operation. The largest number of emit chips and usually their surface is not enough to utilize the heat generated by them. In such cases, heat-removing elements are installed on the chip - radiators that are made from materials with high thermal conductivity - aluminum, for example. To improve heat dissipation, a radiator can have many fins through which air passes for cooling. The presence of fins significantly increases the area of cooling, but this is not enough in the current environment, when the power of computing devices is constantly growing. In such cases, a fan is installed on the radiator, which acts as a propeller of the cooling medium — air. Under the condition of a constant cooling area, an increase in the velocity of the coolant, air, again makes it possible to significantly increase the cooling efficiency of the device.

But under conditions of a total increase in the power of all electronic devices and, if necessary, to use them at high or maximum power, there comes a time when the use of both the radiator and the fan becomes insufficient and the device becomes too hot or overheated and stops working.

Close to the claimed invention is a computer case with the possibility of additional cooling of individual components that need it, by installing additional blower fans, the air flow from which is directed primarily to the component that needs it (see US patent specification US5876278A 02.03.1999)

Also close to the claimed invention is the case for PC1-e devices (electronic resource https://www.akitio.com/expansion/thunder2-pcie-box).

The disadvantage of the aforementioned devices is that the use of electronic components, in particular video cards, which emit part or all of the air that is used for cooling, into the body in which they are located, and from there take away the air for cooling under high or maximum loads on the video card quite problematic, and with the use of more than one video card in one package, it is sometimes impossible at all due to the large or excessive heating of graphics processors and other parts in ideo card or electronic component. This is due to the fact that inside there is an intensive mixing of the cooling air flow, even with the active ventilation of the whole body, therefore, as a result,

SUBSTITUTE SHEET (RULE 26) for cooling electronic devices inside the case, not only the air drawn in from the outside, but also part of the heated air is used.

In most cases, excessive heating occurs due to a general local increase in temperature around the device. This most often occurs when the devices are in the same housing, but this effect is sometimes observed even when the devices operate separately in open space.

The essence of this effect is as follows. With an increase in the velocity of the coolant - air, the intensity of mixing of air flows increases, when air comes in contact with the elements of the cooling system and the computer case, turbulence is generated, due to which air flows are mixed even more intensively. In a closed case, it is almost impossible to avoid mixing the air flow, which is directed to the cooling and the heated air flow between them. It is often impossible to avoid such an effect in open space, as usually the ejection of heated air does not occur, but in a chaotic manner, under the influence of turbulence, as a result of which in the nearest space of the computing device there is also an active mixing of cold and heated air flows between them. This effect is greatly enhanced by placing several powerful devices nearby, for example, several video cards, even in open space.

The basis of the claimed invention is the task of developing a device that will more efficiently cool video cards and other electronic components and, as a result, make them more stable, save resources, reduce the temperature of operation of chips (graphics processor, etc.) and the card as a whole, and in some cases it will make the operation of the computing device possible as such.

DISCLOSURE OF INVENTION

The problem is solved using a device that is made in the form of a housing for an arbitrary-shaped computing device, with ventilation openings for taking in cold outside air and removing heated air from the housing in which at least one computing device is located, which has several compartments, at least at least two of which are adjacent or interconnected duct, which are connected to the external space, or to other compartments, which in turn are connected to outside These space vents or ducts

REPLACEMENT VICT (RULE 26) arbitrary shape and size according to which the computing device is installed on the border of these two compartments in such a way that the flow of cold air from the outside, moving due to the convection movement of the coolant, and due to the propellants that are installed on the computing device, from one compartment through the vent hole falls on the heating element of the computing device is heated, and the air heated thereafter enters another compartment, from which it is removed through the vent hole to the outside, according to which the computing device is installed on the border of these two compartments in such a way that the flow of cold air from the outside, moving due to the convection movement of the coolant, and due to air propellers that are installed on the computing device, and due to at least one other propeller from one compartment through the vent hole enters the heating element of the computing device, heats up, and the heated after that air enters the second compartment, from which from the vent and at least one coolant propulsion device is brought out, according to which the computing device is installed on the border of these two compartments in such a way that the flow of cold air from the outside, moving through the duct, due to the convection movement of the coolant, and on the computing device, from one compartment through the vent hole gets on the heating element of the computing device, heats up, and then heated spirit falls into the second compartment, from which through a vent duct and discharged to the outside.

When designing a hull, it is possible to direct the flows in space to an arbitrary angle, and at a value of this angle of 180 degrees, the greatest effect of separation of the above-mentioned air flows is achieved.

Flows, or one of the flows of cold or heated air for cooling individual electronic components, can be combined for two or more components, while the flows of cold and heated air also do not mix with each other.

BRIEF DESCRIPTION OF THE DRAWINGS

For better understanding, there are drawings with which

4 The essence of the invention.

FIG. 1 Schematic view of 4electronic device

FIG. 2 Schematic diagram of the electronic device 4

SUBSTITUTE SHEET (RULE 26) FIG. 3 Exterior view of the housing for computing devices, front view

FIG. 4 Exterior view of the housing for computing devices, rear view

FIG. 5 Schematic cooling circuit, option 1

FIG. 6 Schematic cooling circuit, option 2

FIG. 7 Schematic cooling circuit, option 3

BEST MODE FOR CARRYING OUT THE INVENTION

A modern computing device, such as a video card,

(Fig. 1, Fig. 2) have a wiring board 1, on which components are located, chips, in particular, a graphics processor 2, on top of the processor, which is a heat source, usually mounted a heat diffuser - radiator 3, which may have many ribs. To improve efficiency, at least one fan 4 is additionally mounted on the radiator, which is mounted on the lid 5. The cold air flow 13 (Fig. 7) gets to the duct 10 and then passes through the blowing fan 8, then through the ventilation hole in the housing 12 to the compartment 6 from which air through an opening between compartments 6 and 7 gets to compartment 7, from which a stream of heated air 14 gets to the suction fan 9 and further to air duct 11 and is discharged outside.

To improve and improve the cooling efficiency, according to the proposed invention, the computing device is placed in the housing 12 (Fig. 6) in such a way that the cold air is drawn by the computing device for cooling from one compartment 6, and the heated air is withdrawn through another compartment 7.

At the same time, in the first embodiment, it is seen (FIG. 5) that the flow of cold air 13 through the vent hole in the housing 12 goes to the compartment 6, from which air through the hole between the compartments 6 and 7 and the hole in the device case or lid falls on the radiator 3, accelerating at the same time with the fans 4. Further, removing heat from the radiator 3, the air heats up and flows to the compartment 7, from which the flow of heated air 14 is removed to the outside. The proposed design allows you to significantly separate the air flow and dilute the direction of their removal in different directions, which in turn leads to a significant reduction or disappearance of the effect of mixing air flow, which increases the cooling efficiency of the computing device.

SUBSTITUTE SHEET (RULE 26) In the second variant (Fig. 6), at least one injection fan 8 is mounted on the vent hole in the housing 12 to the compartment b, and at least one suction fan 9 is mounted on the ventilation hole to the compartment 7.

It can be seen (6) that the flow of cold air 13 passes through the forcing fan 8, then through the vent hole in the housing 12 enters the compartment 6, from which the air through the hole between the compartments 6 and 7, and, if present, the hole in the housing or the lid of the device falls on the radiator 3, accelerating with the fans 4, which are installed on the device. Further, removing heat from the radiator 3, the air heats up and enters the compartment 7, from which the flow of heated air 14 enters the suction fan 9 and is discharged to the outside.

The proposed design through the use of additional fans allows you to increase the speed of the coolant - air, resulting in increased cooling efficiency compared with option 1, especially when the design of the computing device does not include the use of at least one own fan.

In the third variant (Fig. 7), at least one injection fan 8 is installed with duct 10, of arbitrary shape and length, and at least one suction fan 9 is installed with duct 11, of arbitrary shape and length.

It can be seen (Fig. 7) that the flow of cold air 13 enters the duct 10 and then passes through the injection fan 8, then through the vent hole in the housing 12 enters the compartment 6, from which air passes through the opening between compartments 6 and 7, and if present, the holes in the case or the lid of the device falls on the radiator 3, accelerating at the same time by the fans 4, which are installed on the device. Further, removing heat from the radiator 3, the air heats up and enters the compartment 7, from which the flow of heated air 14 enters the suction fan 9 and further into the duct 11 and is discharged outside.

The proposed design due to the use of additional pipelines allows to increase the cooling efficiency in comparison with options 1 and 2, because it allows to take in cold air and dispose of heated at arbitrary points of space, thereby minimizing or making impossible the effect of mixing flows.

From the above options it is clear that the use of pipelines and suction and injection fans can

SUBSTITUTE SHEET (RULE 26) occur in different ways, while the duct can be installed on the vent hole and in the absence of a fan between them, and the fan, in turn, can be installed on either end of the duct.

It is also clear that when using several computing devices in one case, one case can be divided into a huge number of compartments, some of which can be combined with each other, and one compartment can be adjacent to many others.

This invention has been described in its preferred forms and in various examples with a certain degree of certainty, it is clear that the above disclosure of preferred forms and various examples can be changed in the details of the design, and the scope of the invention is defined by the claims, which are attached.

Consequently, when the cooling process is noted, the flow of cold and heated air is separated.

Thus, this invention allows to significantly increase the cooling efficiency of computing devices, and in some cases even create an opportunity for their use.

SUBSTITUTE SHEET (RULE 26)

Claims

FORMULA

Enclosure for an arbitrary-shaped computing device, with ventilation openings for drawing in cold outside air and removing heated air from the enclosure containing at least one computing device that has several compartments, at least two of which are adjacent or interconnected by an air duct which are connected to the external space, or to other compartments, which in turn are connected to the external space by ventilation openings or air ducts Its shape and size are different in that the computing device is installed on the border of these two compartments in such a way that the flow of cold air from the outside, moving due to the convection movement of the coolant, and due to the propellers that are installed on the computing device, from one compartment through the vent hole gets on the heating element of the computing device, heats up, and the air then heated enters the second compartment, from which it is led out through the vent uzhu.

A housing according to claim 1, characterized in that the computing device is installed at the border of these two compartments in such a way that the flow of cold air from the outside, moving due to the convection movement of the coolant, and due to the propellers that are installed on the computing device, and due to at least one other air propeller from one compartment through the vent hole gets onto the heating element of the computing device, heats up, and the air heated after that enters the second compartment, from which through the vent hole and at least one coolant propulsion is output to the outside.

A housing according to claim 1, characterized in that the computing device is installed on the border of these two compartments in such a way that the flow of cold air from the outside, moving through the duct, due to the convection movement of the coolant, and due to the propellants that are installed on the computing device, from one compartment through the vent hole enters the heating element of the computing device, heats up, and the air heated thereafter enters the second compartment, from which through the vent hole and the uhovod is expelled.

A housing according to claim 2, characterized in that the computing device is installed on the border of these two compartments in such a way that the flow of cold air from the outside, moving through the duct, due to the convection movement of the coolant, and due to the propellants,

SUBSTITUTE SHEET (RULE 26) which are installed on the computing device, from one compartment through the vent hole enters the heating element of the computing device, heats up, and the air heated thereafter enters the second compartment, from which it is discharged through the vent opening and duct.

SUBSTITUTE SHEET (RULE 26)