WO2018194169A1 - Photosensitive resin composition - Google Patents
Photosensitive resin composition Download PDFInfo
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- WO2018194169A1 WO2018194169A1 PCT/JP2018/016354 JP2018016354W WO2018194169A1 WO 2018194169 A1 WO2018194169 A1 WO 2018194169A1 JP 2018016354 W JP2018016354 W JP 2018016354W WO 2018194169 A1 WO2018194169 A1 WO 2018194169A1
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- HCSDAMGBOVWGEO-UHFFFAOYSA-N O=CCC(c1ccccc1)=O Chemical compound O=CCC(c1ccccc1)=O HCSDAMGBOVWGEO-UHFFFAOYSA-N 0.000 description 1
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
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Abstract
Description
より詳細には、高い撥水性と撥油性を硬化膜表面に有する画像を形成可能な感光性樹脂組成物及びその硬化膜、並びに該硬化膜を用いた各種材料に関する。このポジ型感光性樹脂組成物は、特に液晶ディスプレイやELディスプレイにおける層間絶縁膜、インクジェット方式に対応した遮光材料や隔壁材料として用いるのに好適である。 The present invention relates to a photosensitive resin composition and a cured film obtained therefrom.
More specifically, the present invention relates to a photosensitive resin composition capable of forming an image having high water repellency and oil repellency on the surface of the cured film, a cured film thereof, and various materials using the cured film. This positive photosensitive resin composition is particularly suitable for use as an interlayer insulating film in a liquid crystal display or an EL display, a light shielding material corresponding to an inkjet method, or a partition material.
しかしインクジェット法でバンクに囲まれた領域にインク滴を滴下する場合、バンクを超えて隣の画素にインク滴が溢れる事態を防ぐため、基板には親インク性(親水性)を持たせ、バンク表面には撥水性を持たせる必要がある。 In recent years, a full color display substrate manufacturing technique using an ink jet in a manufacturing process of a display element such as a thin film transistor (TFT) type liquid crystal display element or an organic EL (electroluminescent) element has been actively studied. For example, with respect to the production of a color filter in a liquid crystal display element, light is blocked from a section (hereinafter referred to as a bank) that defines pixels that have been patterned in advance, compared to a conventional printing method, electrodeposition method, dyeing method, or pigment dispersion method. A color filter that is formed of a photosensitive resin layer and drops ink droplets in a region surrounded by the bank, a manufacturing method thereof (Patent Document 1), and the like have been proposed. Also, a method has been proposed (Patent Document 2) in which an organic EL display element is manufactured by preparing a bank in advance and dropping an ink serving as a light emitting layer in the same manner.
However, when ink droplets are dropped onto the area surrounded by the bank by the inkjet method, the substrate has ink affinity (hydrophilicity) to prevent the ink droplet from overflowing to the adjacent pixel beyond the bank. The surface needs to have water repellency.
1.下記(A)成分、(B)成分、(C)溶剤及び(D)成分を含有する熱硬化可能な感光性樹脂組成物。
(A)成分:下記基(A1)及び(A2)を有する重合体
(A1)撥液性基
(A2)N-アルコキシメチルアミド基、ブロックイソシアネート基及びトリアルコキシシリル基から選ばれる基、
(B)成分:アルカリ可溶性樹脂、
(C)溶剤、
(D)成分:キノンジアジド基を有する化合物。
2.更に(A)成分が下記(A3)を有する重合体である上記1に記載の感光性樹脂組成物。
(A3):ヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基
3.更に下記(Z1)及び(Z2)の少なくとも一方を満足する上記1または2に記載の感光性樹脂組成物。
(Z1):(E)成分である架橋剤をさらに含有する、
(Z2):(B)成分のアルカリ可溶性樹脂が、自己架橋性基をさらに有するか、又はヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基と反応する基をさらに有する。
4.(A)成分の上記撥液性基が炭素原子数3乃至10のフルオロアルキル基、ポリフルオロエーテル基、シリルエーテル基及びポリシロキサン基から選ばれる少なくとも一種の基である上記1乃至3のいずれか1つに記載の感光性樹脂組成物。
5.(A)成分の重合体がアクリル重合体である上記1乃至4のいずれか1つに記載の感光性樹脂組成物。
6.(A)成分のアクリル重合体の数平均分子量がポリスチレン換算で2,000乃至100,000である上記5に記載の感光性樹脂組成物。
7.(B)成分のアルカリ可溶性樹脂の数平均分子量がポリスチレン換算で2,000乃至50,000である上記1乃至6のいずれか1つに記載の感光性樹脂組成物。
8.(B)成分100質量部に対して0.1質量部乃至20質量部の(A)成分を含有することを特徴とする上記1乃至7のいずれか1つに記載の感光性樹脂組成物。
9.(A)成分と(B)成分の合計100質量部に対して、(D)成分が5質量部乃至100質量部であることを特徴とする上記1乃至8のいずれか1つに記載の感光性樹脂組成物。
10.(A)成分と(B)成分の合計100質量部に対して、(E)成分が1質量部乃至50質量部であることを特徴とする上記3乃至9のいずれか1つに記載の感光性樹脂組成物。
11.上記1乃至10のいずれか1つに記載の感光性樹脂組成物を用いて得られる硬化膜。
12.上記11に記載の硬化膜を有する表示素子。
13.上記11に記載の硬化膜を画像形成用隔壁として有する表示素子。 That is, the present invention relates to the following.
1. A thermosetting photosensitive resin composition containing the following component (A), component (B), solvent (C) and component (D).
(A) Component: Polymer having the following groups (A1) and (A2) (A1) Liquid repellent group (A2) A group selected from N-alkoxymethylamide group, blocked isocyanate group and trialkoxysilyl group,
(B) component: alkali-soluble resin,
(C) solvent,
(D) Component: A compound having a quinonediazide group.
2. The photosensitive resin composition according to 1 above, wherein the component (A) is a polymer having the following (A3).
(A3): at least one group selected from the group consisting of a hydroxy group, a carboxyl group, an amide group and an amino group; Furthermore, the photosensitive resin composition of said 1 or 2 which satisfies at least one of following (Z1) and (Z2).
(Z1): further containing a crosslinking agent as component (E),
(Z2): The alkali-soluble resin of the component (B) further has a self-crosslinkable group or a group that reacts with at least one group selected from the group consisting of a hydroxy group, a carboxyl group, an amide group, and an amino group. Also have.
4). Any of the above 1 to 3, wherein the liquid repellent group of the component (A) is at least one group selected from a fluoroalkyl group having 3 to 10 carbon atoms, a polyfluoroether group, a silyl ether group, and a polysiloxane group. The photosensitive resin composition as described in one.
5). (A) The photosensitive resin composition as described in any one of 1 to 4 above, wherein the polymer of the component is an acrylic polymer.
6). (A) The photosensitive resin composition of said 5 whose number average molecular weight of the acrylic polymer of a component is 2,000-100,000 in polystyrene conversion.
7). (B) The photosensitive resin composition as described in any one of 1 to 6 above, wherein the number average molecular weight of the alkali-soluble resin as a component is 2,000 to 50,000 in terms of polystyrene.
8). (B) 0.1 to 20 mass parts of (A) component is contained with respect to 100 mass parts of component, The photosensitive resin composition as described in any one of 1 to 7 above.
9. The photosensitive material as described in any one of 1 to 8 above, wherein the component (D) is 5 to 100 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B). Resin composition.
10. The photosensitive composition as described in any one of 3 to 9 above, wherein the component (E) is 1 part by mass to 50 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (B). Resin composition.
11. The cured film obtained using the photosensitive resin composition as described in any one of said 1 thru | or 10.
12 12. A display element having the cured film as described in 11 above.
13. A display element comprising the cured film according to 11 as a partition for image formation.
(A)成分:下記基(A1)及び(A2)を有する重合体
(A1)撥液性基
(A2)N-アルコキシメチルアミド基、ブロックイソシアネート基及びトリアルコキシシリル基から選ばれる基、
(B)成分:アルカリ可溶性樹脂、
(C)溶剤、
(D)成分:キノンジアジド基を有する化合物。 The photosensitive resin composition of this invention is a positive photosensitive resin composition containing the following (A) component, (B) component, (C) solvent, and (D) component.
(A) Component: Polymer having the following groups (A1) and (A2) (A1) Liquid repellent group (A2) A group selected from N-alkoxymethylamide group, blocked isocyanate group and trialkoxysilyl group,
(B) component: alkali-soluble resin,
(C) solvent,
(D) Component: A compound having a quinonediazide group.
(A3):ヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基 The photosensitive resin composition of the present invention is preferably a polymer in which the component (A) further has the following (A3).
(A3): at least one group selected from the group consisting of hydroxy group, carboxyl group, amide group and amino group
(Z1):(E)成分である架橋剤をさらに含有する、
(Z2):(B)成分のアルカリ可溶性樹脂が、自己架橋性基をさらに有するか、又はヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基と反応する基をさらに有する。 The photosensitive resin composition of the present invention preferably further satisfies at least one of the following (Z1) and (Z2).
(Z1): further containing a crosslinking agent as component (E),
(Z2): The alkali-soluble resin of the component (B) further has a self-crosslinkable group or a group that reacts with at least one group selected from the group consisting of a hydroxy group, a carboxyl group, an amide group, and an amino group. Also have.
<(A)成分>
(A)成分は、下記基(A1)及び(A2)を有する重合体である。
(A1)撥液性基
(A2)N-アルコキシメチルアミド基、ブロックイソシアネート基及びトリアルコキシシリル基から選ばれる基 Hereinafter, details of each component will be described.
<(A) component>
The component (A) is a polymer having the following groups (A1) and (A2).
(A1) Liquid repellent group (A2) Group selected from N-alkoxymethylamide group, blocked isocyanate group and trialkoxysilyl group
上記撥液性基としては、例えば、炭素原子数3乃至10のフルオロアルキル基、ポリフルオロエーテル基、シリルエーテル基及びポリシロキサン基から選ばれる少なくとも一種の基が挙げられる。 <(A1) Introduction of liquid repellent group>
Examples of the liquid repellent group include at least one group selected from a fluoroalkyl group having 3 to 10 carbon atoms, a polyfluoroether group, a silyl ether group, and a polysiloxane group.
このようなフルオロアルキル基としては、2,2,2-トリフルオロエチル基、2,2,3,3,3-ペンタフルオロプロピル基、2-(パーフルオロブチル)エチル基、3-パーフルオロブチル-2-ヒドロキシプロピル基、2-(パーフルオロヘキシル)エチル基、3-パーフルオロヘキシル-2-ヒドロキシプロピル基、2-(パーフルオロオクチル)エチル基、3-パーフルオロオクチル-2-ヒドロキシプロピル基、2-(パーフルオロデシル)エチル基、2-(パーフルオロ-3-メチルブチル)エチル基、3-(パーフルオロ-3-メチルブチル)-2-ヒドロキシプロピル基、2-(パーフルオロ-5-メチルヘキシル)エチル基、2-(パーフルオロ-5-メチルヘキシル)-2-ヒドロキシプロピル基、2-(パーフルオロ-7-メチルオクチル)エチル基、及び2-(パーフルオロ-7-メチルオクチル)-2-ヒドロキシプロピル基、等が挙げられる。 The fluoroalkyl group has 3 to 10 carbon atoms, preferably a fluoroalkyl group having 4 to 10 carbon atoms.
Examples of such a fluoroalkyl group include 2,2,2-trifluoroethyl group, 2,2,3,3,3-pentafluoropropyl group, 2- (perfluorobutyl) ethyl group, and 3-perfluorobutyl. -2-hydroxypropyl group, 2- (perfluorohexyl) ethyl group, 3-perfluorohexyl-2-hydroxypropyl group, 2- (perfluorooctyl) ethyl group, 3-perfluorooctyl-2-hydroxypropyl group 2- (perfluorodecyl) ethyl group, 2- (perfluoro-3-methylbutyl) ethyl group, 3- (perfluoro-3-methylbutyl) -2-hydroxypropyl group, 2- (perfluoro-5-methyl) (Hexyl) ethyl group, 2- (perfluoro-5-methylhexyl) -2-hydroxypropyl group, 2- (perful) B-7-methyl-octyl) ethyl group, and 2- (perfluoro-7-methyl-octyl) -2-hydroxypropyl group, and the like.
-(X-O)n-Y ・・・式1
式1中、Xは、炭素原子数1乃至10の2価飽和炭化水素基又は炭素原子数1乃至10のフルオロ化された2価飽和炭化水素基であって、nで括られた単位毎に同一の基又は異なる基を示し、Yは、水素原子(Yに隣接する酸素原子に隣接する炭素原子にフッ素原子が結合していない場合に限る)、炭素原子数1乃至20の1価飽和炭化水素基又は炭素原子数1乃至20のフルオロ化された1価飽和炭化水素基を示し、nは2乃至50の整数を示す。ただし、式1におけるフッ素原子の総数は2以上である。 Examples of the polyfluoroether group include an Rf group (a) having a polyfluoroether structure represented by the following formula 1.
-(XO) n -Y Formula 1
In Formula 1, X is a divalent saturated hydrocarbon group having 1 to 10 carbon atoms or a fluorinated divalent saturated hydrocarbon group having 1 to 10 carbon atoms, and each unit united by n Y represents the same group or different groups, and Y represents a hydrogen atom (only when a fluorine atom is not bonded to a carbon atom adjacent to an oxygen atom adjacent to Y), a monovalent saturated carbon atom having 1 to 20 carbon atoms A hydrogen group or a fluorinated monovalent saturated hydrocarbon group having 1 to 20 carbon atoms is shown, and n is an integer of 2 to 50. However, the total number of fluorine atoms in Formula 1 is 2 or more.
-Cp-1F2(p-1)-O-(CpF2p-O)n-1-CqF2q+1 ・・・式2
式2中、pは2又は3の整数を示し、nで括られた単位毎に同一の基であり、qは1乃至20の整数、nは2乃至50の整数を示す。 A preferred embodiment of the Rf group (a) having a polyfluoroether structure represented by Formula 1 includes the Rf group (a) represented by Formula 2.
-C p-1 F 2 (p-1) -O- (C p F 2p -O) n-1 -C q F 2q + 1
In Formula 2, p represents an integer of 2 or 3, and is the same group for each unit surrounded by n, q represents an integer of 1 to 20, and n represents an integer of 2 to 50.
-CF2O(CF2CF2O)n-1CF3 (nは2乃至9)、
-CF(CF3)O(CF2CF(CF3)O)n-1C6F13 (nは2乃至6)、
-CF(CF3)O(CF2CF(CF3)O)n-1C3F7 (nは2乃至6)
が合成の容易さの点から好ましく挙げられる。 As Rf group (a) represented by Formula 2, specifically,
-CF 2 O (CF 2 CF 2 O) n-1 CF 3 (n is 2 to 9),
-CF (CF 3 ) O (CF 2 CF (CF 3 ) O) n-1 C 6 F 13 (n is 2 to 6),
-CF (CF 3 ) O (CF 2 CF (CF 3 ) O) n-1 C 3 F 7 (n is 2 to 6)
Is preferable from the viewpoint of ease of synthesis.
-X4-Si(O-SiX1X2X3)3
(式中、X1、X2、X3はそれぞれ独立して炭素原子数1乃至3のアルキル基を表し、X4は炭素原子数1乃至6のアルキレン基を表す。) The silyl ether group means a group in which a hydroxy group of an alcohol is protected with a trialkylsilyl group, and is preferably a group represented by the following formula.
-X 4 -Si (O-SiX 1 X 2 X 3 ) 3
(Wherein X 1 , X 2 and X 3 each independently represents an alkyl group having 1 to 3 carbon atoms, and X 4 represents an alkylene group having 1 to 6 carbon atoms.)
-(SiR1R2-O)n-SiR1R2R3 ・・・式3
(ただし、R1、R2は独立に水素、アルキル基、シクロアルキル基またはアリール基を表し、R3は水素または炭素原子数1乃至10の有機基を表し、nは1乃至200の整数を表す。)。 Examples of the polysiloxane group include a group (a) having a polysiloxane structure represented by Formula 3. Hereinafter, the group (a) having a polysiloxane structure represented by Formula 3 is referred to as a pSi group (a).
— (SiR 1 R 2 —O) n —SiR 1 R 2 R 3 Formula 3
(Wherein R 1 and R 2 independently represent hydrogen, an alkyl group, a cycloalkyl group or an aryl group, R 3 represents hydrogen or an organic group having 1 to 10 carbon atoms, and n represents an integer of 1 to 200) To express.).
本発明の(A)成分である重合体にN-アルコキシメチルアミド基、ブロックイソシアネート基及びトリアルコキシシリル基から選ばれる基を導入するには、N-アルコキシメチルアミド基、ブロックイソシアネート基及びトリアルコキシシリル基から選ばれる基を有するモノマーを共重合させれば良い。 <(A2) Introduction of group selected from N-alkoxymethylamide group, blocked isocyanate group and trialkoxysilyl group>
In order to introduce a group selected from an N-alkoxymethylamide group, a blocked isocyanate group and a trialkoxysilyl group into the polymer which is the component (A) of the present invention, an N-alkoxymethylamide group, a blocked isocyanate group and a trialkoxy group are introduced. A monomer having a group selected from silyl groups may be copolymerized.
本発明の(A)成分である重合体に(A3)ヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基を導入するには、(A3)ヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基を有するモノマーを共重合させれば良い。 <(A3) Introduction of at least one group selected from the group consisting of hydroxy group, carboxyl group, amide group and amino group>
In order to introduce at least one group selected from the group consisting of (A3) hydroxy group, carboxyl group, amide group and amino group into the polymer which is component (A) of the present invention, (A3) hydroxy group, carboxyl group A monomer having at least one group selected from the group consisting of an amide group and an amino group may be copolymerized.
本発明においては、上記特定共重合体の粉体をそのまま用いても良く、あるいはその粉体を、たとえば後述する(C)溶剤に再溶解して溶液の状態として用いても良い。 In addition, the solution of the specific copolymer obtained as described above is re-precipitated by stirring with stirring such as diethyl ether or water, and the generated precipitate is filtered and washed, and then under normal pressure or reduced pressure. Thus, the powder of the specific copolymer can be obtained by drying at room temperature or by heating. By such an operation, the polymerization initiator and unreacted monomer coexisting with the specific copolymer can be removed, and as a result, a purified powder of the specific copolymer can be obtained. If sufficient purification cannot be achieved by a single operation, the obtained powder may be redissolved in a solvent and the above operation may be repeated.
In the present invention, the powder of the specific copolymer may be used as it is, or the powder may be redissolved in a solvent (C) described later and used as a solution.
本発明の(B)成分は、アルカリ可溶性基を有する樹脂である。アルカリ可溶性基としては、例えば、フェノール性ヒドロキシ基、カルボキシル基、酸無水物基、イミド基、スルホニル基、リン酸、ボロン酸及び活性メチレン基および活性メチン基が挙げられる。 <(B) component>
The component (B) of the present invention is a resin having an alkali-soluble group. Examples of the alkali-soluble group include a phenolic hydroxy group, a carboxyl group, an acid anhydride group, an imide group, a sulfonyl group, phosphoric acid, a boronic acid, an active methylene group, and an active methine group.
そのようなアルキル基としては、例えば、メチル基、エチル基、n-プロピル基、i-プロピル基等が挙げられる。
その中でも、メチル基、エチル基、n-プロピル基等が好ましい。 In the above formula (b1), examples of the alkyl group represented by R include an alkyl group having 1 to 20 carbon atoms, and an alkyl group having 1 to 5 carbon atoms is preferable.
Examples of such an alkyl group include a methyl group, an ethyl group, an n-propyl group, and an i-propyl group.
Of these, a methyl group, an ethyl group, an n-propyl group, and the like are preferable.
そのようなアルコキシ基としては、例えば、メトキシ基、エトキシ基、n-プロポキシ基、i-プロポキシ基、n-ブトキシ基、i-ブトキシ基、s-ブトキシ基、t-ブトキシ基等が挙げられる。
その中でも、メトキシ基、エトキシ基及びn-プロポキシ基等が好ましい。 In the above formula (b1), examples of the alkoxy group represented by R include an alkoxy group having 1 to 20 carbon atoms, and an alkoxy group having 1 to 5 carbon atoms is preferable.
Examples of such an alkoxy group include a methoxy group, an ethoxy group, an n-propoxy group, an i-propoxy group, an n-butoxy group, an i-butoxy group, an s-butoxy group, and a t-butoxy group.
Of these, a methoxy group, an ethoxy group, an n-propoxy group, and the like are preferable.
上記(B)成分のアルカリ可溶性樹脂は、斯かる構造を有するアルカリ可溶性樹脂であればよく、樹脂を構成する高分子の主鎖の骨格及び側鎖の種類などについて特に限定されない。 Among the alkali-soluble groups, an alkali-soluble resin having at least one organic group selected from the group consisting of a phenolic hydroxy group and a carboxyl group, and having a number average molecular weight of 2,000 to 50,000 Preferably there is.
The alkali-soluble resin as the component (B) may be an alkali-soluble resin having such a structure, and is not particularly limited with respect to the main chain skeleton and side chain type of the polymer constituting the resin.
カルボキシル基を有するモノマーとしては、例えば、アクリル酸、メタクリル酸、クロトン酸、モノ-(2-(アクリロイルオキシ)エチル)フタレート、モノ-(2-(メタクリロイルオキシ)エチル)フタレート、N-(カルボキシフェニル)マレイミド、N-(カルボキシフェニル)メタクリルアミド、N-(カルボキシフェニル)アクリルアミド等が挙げられる。 Hereinafter, although the specific example of the said monomer is given, it is not limited to these.
Examples of the monomer having a carboxyl group include acrylic acid, methacrylic acid, crotonic acid, mono- (2- (acryloyloxy) ethyl) phthalate, mono- (2- (methacryloyloxy) ethyl) phthalate, and N- (carboxyphenyl). ) Maleimide, N- (carboxyphenyl) methacrylamide, N- (carboxyphenyl) acrylamide and the like.
等が挙げられる。 Examples of the monomer having a phenolic hydroxy group include hydroxystyrene, N- (hydroxyphenyl) acrylamide, N- (hydroxyphenyl) methacrylamide, N- (hydroxyphenyl) maleimide, 4-hydroxyphenyl methacrylate and the like.
以下、当該その他モノマーの具体例を挙げるが、これらに限定されるものではない。 In the present invention, the acrylic polymer of component (B) may be a copolymer formed with monomers other than the above-described monomers (hereinafter referred to as other monomers) as constituent units. Specifically, the other monomer may be any one that can be copolymerized with at least one selected from the group consisting of the above-mentioned monomer having a carboxyl group and a monomer having a phenolic hydroxy group. There is no particular limitation as long as it is not impaired. Specific examples of such monomers include acrylic ester compounds, methacrylic ester compounds, maleimides, acrylamide compounds, acrylonitrile, styrene compounds and vinyl compounds.
Hereinafter, although the specific example of the said other monomer is given, it is not limited to these.
本発明においては、上記特定共重合体の粉体をそのまま用いても良く、あるいはその粉体を、たとえば後述する(C)溶剤に再溶解して溶液の状態として用いても良い。 In addition, the solution of the specific copolymer obtained as described above is re-precipitated by stirring with stirring such as diethyl ether or water, and the generated precipitate is filtered and washed, and then under normal pressure or reduced pressure. Thus, the powder of the specific copolymer can be obtained by drying at room temperature or by heating. By such an operation, the polymerization initiator and unreacted monomer coexisting with the specific copolymer can be removed, and as a result, a purified powder of the specific copolymer can be obtained. If sufficient purification cannot be achieved by a single operation, the obtained powder may be redissolved in a solvent and the above operation may be repeated.
In the present invention, the powder of the specific copolymer may be used as it is, or the powder may be redissolved in a solvent (C) described later and used as a solution.
これらは、1種単独で用いてもよく、又は2種以上の化合物を組み合わせて用いてもよい。 The (a) tetracarboxylic dianhydride compound is not particularly limited, and specific examples thereof include pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′. , 4,4′-Benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenyl ether tetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenylsulfone tetracarboxylic dianhydride Aromatic tetracarboxylic acid such as 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2, 3,4-tetramethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetra Carbo Alicyclic tetracarboxylic dianhydrides such as acid dianhydrides, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic dianhydride, 1,2,3,4 Mention may be made of aliphatic tetracarboxylic dianhydrides such as butanetetracarboxylic dianhydride.
These may be used alone or in combination of two or more compounds.
これらは、1種単独で用いてもよく、又は2種以上の化合物を組み合わせて用いてもよい。 The diamine compound (b) is not particularly limited, and examples thereof include 2,4-diaminobenzoic acid, 2,5-diaminobenzoic acid, 3,5-diaminobenzoic acid, 4,6-diamino-1 , 3-benzenedicarboxylic acid, 2,5-diamino-1,4-benzenedicarboxylic acid, bis (4-amino-3-carboxyphenyl) ether, bis (4-amino-3,5-dicarboxyphenyl) ether, Bis (4-amino-3-carboxyphenyl) sulfone, bis (4-amino-3,5-dicarboxyphenyl) sulfone, 4,4′-diamino-3,3′-dicarboxybiphenyl, 4,4′- Diamino-3,3′-dicarboxy-5,5′-dimethylbiphenyl, 4,4′-diamino-3,3′-dicarboxy-5,5′-dimethoxybiphenyl, 1,4-bis 4-amino-3-carboxyphenoxy) benzene, 1,3-bis (4-amino-3-carboxyphenoxy) benzene, bis [4- (4-amino-3-carboxyphenoxy) phenyl] sulfone, bis [4- (4-amino-3-carboxyphenoxy) phenyl] propane, 2,2-bis [4- (4-amino-3-carboxyphenoxy) phenyl] hexafluoropropane, 2,4-diaminophenol, 3,5-diamino Phenol, 2,5-diaminophenol, 4,6-diaminoresorcinol, 2,5-diaminohydroquinone, bis (3-amino-4-hydroxyphenyl) ether, bis (4-amino-3-hydroxyphenyl) ether, bis (4-amino-3,5-dihydroxyphenyl) ether, bis (3-amino No-4-hydroxyphenyl) methane, bis (4-amino-3-hydroxyphenyl) methane, bis (4-amino-3,5-dihydroxyphenyl) methane, bis (3-amino-4-hydroxyphenyl) sulfone, Bis (4-amino-3-hydroxyphenyl) sulfone, bis (4-amino-3,5-dihydroxyphenyl) sulfone, 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, 2,2 -Bis (4-amino-3-hydroxyphenyl) hexafluoropropane, 2,2-bis (4-amino-3,5-dihydroxyphenyl) hexafluoropropane, 4,4'-diamino-3,3'-dihydroxy Biphenyl, 4,4'-diamino-3,3'-dihydroxy-5,5'-dimethylbiphenyl, 4,4'-dia -3,3'-dihydroxy-5,5'-dimethoxybiphenyl, 1,4-bis (3-amino-4-hydroxyphenoxy) benzene, 1,3-bis (3-amino-4-hydroxyphenoxy) benzene 1,4-bis (4-amino-3-hydroxyphenoxy) benzene, 1,3-bis (4-amino-3-hydroxyphenoxy) benzene, bis [4- (3-amino-4-hydroxyphenoxy) phenyl ] Sulfone, bis [4- (3-amino-4-hydroxyphenoxy) phenyl] propane, 2,2-bis [4- (3-amino-4-hydroxyphenoxy) phenyl] hexafluoropropane, etc. Diamine compound, 1,3-diamino-4-mercaptobenzene, 1,3-diamino-5-mercaptobenzene 1,4-diamino-2-mercaptobenzene, bis (4-amino-3-mercaptophenyl) ether, 2,2-bis (3-amino-4-mercaptophenyl) hexafluoropropane and the like having a thiophenol group Diamine compounds, 1,3-diaminobenzene-4-sulfonic acid, 1,3-diaminobenzene-5-sulfonic acid, 1,4-diaminobenzene-2-sulfonic acid, bis (4-aminobenzene-3-sulfonic acid) ) Ether, 4,4′-diaminobiphenyl-3,3′-disulfonic acid, 4,4′-diamino-3,3′-dimethylbiphenyl-6,6′-disulfonic acid and the like diamine compounds having a sulfonic acid group Can be mentioned. P-phenylenediamine, m-phenylenediamine, 4,4′-methylene-bis (2,6-ethylaniline), 4,4′-methylene-bis (2-isopropyl-6-methylaniline), 4, 4'-methylene-bis (2,6-diisopropylaniline), 2,4,6-trimethyl-1,3-phenylenediamine, 2,3,5,6-tetramethyl-1,4-phenylenediamine, o- Tolidine, m-tolidine, 3,3 ′, 5,5′-tetramethylbenzidine, bis [4- (3-aminophenoxy) phenyl] sulfone, 2,2-bis [4- (3-aminophenoxy) phenyl] Propane, 2,2-bis [4- (3-aminophenoxy) phenyl] hexafluoropropane, 4,4′-diamino-3,3′-dimethyldicyclohexylmethane, 4,4 ′ Diaminodiphenyl ether, 3,4-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane, 2,2-bis (4-anilino) hexafluoropropane, 2,2-bis (3-anilino) hexafluoropropane, 2,2- Bis (3-amino-4-toluyl) hexafluoropropane, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, bis [4- (4-aminophenoxy) Phenyl] sulfone, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane, 2,2′-bis (tri And diamine compounds such as (fluoromethyl) benzidine.
These may be used alone or in combination of two or more compounds.
このようなカルボン酸無水物の例としてはフタル酸無水物、トリメリット酸無水物、無水マレイン酸、ナフタル酸無水物、水素化フタル酸無水物、メチル-5-ノルボルネン-2,3-ジカルボン酸無水物、無水イタコン酸、テトラヒドロフタル酸無水物等を挙げることができる。 Moreover, when it superposes | polymerizes using a diamine compound excessively, a carboxylic anhydride can be made to react with the terminal amino group of the remaining polyamic acid, and a terminal amino group can also be protected.
Examples of such carboxylic anhydrides include phthalic anhydride, trimellitic anhydride, maleic anhydride, naphthalic anhydride, hydrogenated phthalic anhydride, methyl-5-norbornene-2,3-dicarboxylic acid There may be mentioned anhydrides, itaconic anhydride, tetrahydrophthalic anhydride and the like.
また、末端アミノ基を酸無水物で保護する場合の反応温度は-20℃乃至150℃、好ましくは-5℃乃至100℃の任意の温度を選択することができる。 In the production of the polyamic acid, the reaction temperature of the reaction between the diamine compound and the tetracarboxylic dianhydride compound can be selected from -20 ° C to 150 ° C, preferably -5 ° C to 100 ° C. In order to obtain a high molecular weight polyamic acid, the reaction temperature is appropriately selected within the range of 5 to 40 ° C. and the reaction time of 1 to 48 hours. In order to obtain a partially imidized polyamic acid having a low molecular weight and high storage stability, it is more preferable to select from a reaction temperature of 40 ° C. to 90 ° C. and a reaction time of 10 hours or more.
The reaction temperature for protecting the terminal amino group with an acid anhydride can be selected from -20 ° C to 150 ° C, preferably -5 ° C to 100 ° C.
ポリイミドへのカルボキシル基又はフェノール性ヒドロキシ基の導入方法は、カルボキシル基又はフェノール性ヒドロキシ基を有するモノマーを用いる方法、カルボキシル基又はフェノール性ヒドロキシ基を有する酸無水物でアミン末端を封止する方法、或いは、ポリアミド酸などのポリイミド前駆体をイミド化する際にイミド化率を99%以下にする方法等が用いられる。 The polyimide used in the positive photosensitive resin composition of the present invention preferably has a group selected from a carboxyl group and a phenolic hydroxy group in order to impart alkali solubility.
The method of introducing a carboxyl group or a phenolic hydroxy group into polyimide is a method using a monomer having a carboxyl group or a phenolic hydroxy group, a method of sealing an amine terminal with an acid anhydride having a carboxyl group or a phenolic hydroxy group, Alternatively, a method of setting the imidization rate to 99% or less when imidizing a polyimide precursor such as polyamide acid is used.
化学イミド化の方法としては一般的にポリイミド前駆体溶液に過剰の無水酢酸およびピリジンを添加し室温から100℃で反応させる方法が用いられる。また、熱イミド化の方法としては一般的に、ポリイミド前駆体溶液を温度180℃乃至250℃で脱水しながら過熱する方法が用いられる。 Such a polyimide can be obtained by synthesizing a polyimide precursor such as the above-mentioned polyamic acid and then performing chemical imidization or thermal imidization.
As a method of chemical imidization, generally, a method of adding excess acetic anhydride and pyridine to a polyimide precursor solution and reacting at room temperature to 100 ° C. is used. As a method for thermal imidization, generally, a method in which a polyimide precursor solution is heated while being dehydrated at a temperature of 180 ° C. to 250 ° C. is used.
酸二無水物としては、上記(a)テトラカルボン酸二無水物が挙げられる。
ジオールとしては、ビスフェノールA、ビスフェノールF、4,4’-ジヒドロキシビフェニル、ベンゼン-1,3-ジメタノール、ベンゼン-1,4-ジメタノール等の芳香族ジオール、水添ビスフェノールA、水添ビスフェノールF、1,4-シクロヘキサンジオール、1,3-シクロヘキサンジメタノール、1,4-シクロヘキサンジメタノール等の脂環族ジオール、及びエチレングリコール、プロピレングリコール、1,4-ブタンジオール、1,6-ヘキサンジオール等の脂肪族ジオール等が挙げられる。 Further, as the alkali-soluble resin of component (B), polyester polycarboxylic acid can also be used. The polyester polycarboxylic acid can be obtained from an acid dianhydride and a diol by the method described in International Publication No. 2009/051186.
Examples of the acid dianhydride include the above (a) tetracarboxylic dianhydride.
Examples of the diol include bisphenol A, bisphenol F, 4,4′-dihydroxybiphenyl, aromatic diols such as benzene-1,3-dimethanol, benzene-1,4-dimethanol, hydrogenated bisphenol A, and hydrogenated bisphenol F. 1,4-cyclohexanediol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, and other alicyclic diols, and ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol And the like, and the like.
本発明に用いる(C)溶剤は、(A)成分、(B)成分、及び必要に応じて後述の(D)成分、(E)成分を溶解し、且つ所望により添加される後述の(F)成分やその他添加剤などを溶解するものであり、斯様な溶解能を有する溶剤であれば、その種類及び構造などは特に限定されるものでない。 <(C) Solvent>
The (C) solvent used in the present invention dissolves the (A) component, the (B) component, and the later-described (D) component and (E) component as necessary, and is added as desired (F) ) Components and other additives are dissolved, and the type and structure thereof are not particularly limited as long as the solvent has such a dissolving ability.
これら(C)溶剤の中、プロピレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテルアセテート、2-ヘプタノン、プロピレングリコールプロピルエーテル、プロピレングリコールプロピルエーテルアセテート、乳酸エチル、乳酸ブチル等が、塗膜性が良好で安全性が高いという観点より好ましい。これら溶剤は、一般にフォトレジスト材料のための溶剤として用いられている。 These solvents can be used singly or in combination of two or more.
Among these (C) solvents, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 2-heptanone, propylene glycol propyl ether, propylene glycol propyl ether acetate, ethyl lactate, butyl lactate, etc. have good coating properties and safety Is preferable from the viewpoint of high. These solvents are generally used as solvents for photoresist materials.
(D)成分である1,2-キノンジアジド化合物としては、水酸基又はアミノ基のいずれか一方か、水酸基及びアミノ基の両方を有する化合物であって、これらの水酸基又はアミノ基(水酸基とアミノ基の両方を有する場合は、それらの合計量)のうち、好ましくは10モル%乃至100モル%、特に好ましくは20モル%乃至95モル%が1,2-キノンジアジドスルホン酸でエステル化、またはアミド化された化合物を用いることができる。
上記1,2-キノンジアジドスルホン酸としては、例えば1,2-ナフトキノン-2-ジアジド-5-スルホン酸、1,2-ナフトキノン-2-ジアジド-4-スルホン酸、1,2-ベンゾキノン-2-ジアジド-4-スルホン酸等が挙げられ、前述のヒドロキシ基又はアミノ基のいずれか一方あるいは両方を有する化合物との反応では、該1,2-キノンジアジドスルホン酸の塩化物を用いることができる。 <(D) component>
The 1,2-quinonediazide compound as component (D) is a compound having either a hydroxyl group or an amino group, both a hydroxyl group and an amino group, and these hydroxyl groups or amino groups (of hydroxyl groups and amino groups). In the case of having both, 10 mol% to 100 mol%, particularly preferably 20 mol% to 95 mol% of the total amount) is esterified or amidated with 1,2-quinonediazidesulfonic acid. Compounds can be used.
Examples of the 1,2-quinonediazidosulfonic acid include 1,2-naphthoquinone-2-diazide-5-sulfonic acid, 1,2-naphthoquinone-2-diazide-4-sulfonic acid, and 1,2-benzoquinone-2- Examples thereof include diazide-4-sulfonic acid, and the 1,2-quinonediazidesulfonic acid chloride can be used in the reaction with the compound having either one or both of the hydroxy group and amino group.
(E)成分は架橋剤であり、本発明のポジ型感光性樹脂組成物が要件(Z1)を満たす場合に組成物中に導入されるものである。より具体的には、(B)成分の熱反応性部位(たとえば、カルボキシル基及び/又はフェノール性水酸基)と熱反応により橋架け構造を形成しうる構造を有する化合物である。以下、具体例を挙げるがこれらに限定されるものではない。熱架橋剤は、例えば、(E1)アルコキシメチル基及びヒドロキシメチル基から選ばれる置換基を2個以上有する架橋性化合物や(E2)式(2)で表される架橋性化合物から選ばれるものが好ましい。これらの架橋剤は単独または2種以上の組み合わせで使用することができる。 <(E) component>
The component (E) is a cross-linking agent, and is introduced into the composition when the positive photosensitive resin composition of the present invention satisfies the requirement (Z1). More specifically, it is a compound having a structure capable of forming a bridge structure by a thermal reaction with a thermally reactive site (for example, carboxyl group and / or phenolic hydroxyl group) of component (B). Specific examples will be given below, but the present invention is not limited thereto. Examples of the thermal crosslinking agent include those selected from (E1) a crosslinkable compound having two or more substituents selected from an alkoxymethyl group and a hydroxymethyl group, and (E2) a crosslinkable compound represented by formula (2). preferable. These crosslinking agents can be used alone or in combination of two or more.
更に、本発明のポジ型感光性樹脂組成物は、本発明の効果を損なわない限りにおいて、必要に応じて、レオロジー調整剤、顔料、染料、保存安定剤、消泡剤、密着促進剤、または多価フェノール、多価カルボン酸等の溶解促進剤等を含有することができる。 <Other additives>
Furthermore, as long as the positive photosensitive resin composition of the present invention does not impair the effects of the present invention, the rheology modifier, pigment, dye, storage stabilizer, antifoaming agent, adhesion promoter, or It can contain dissolution promoters such as polyphenols and polycarboxylic acids.
本発明の感光性樹脂組成物は、下記(A)成分、(B)成分、(C)溶剤及び(D)成分を含有する感光性樹脂組成物であり、且つ、所望により、(E)成分、及びその他添加剤のうち一種以上を更に含有することができる組成物である。
(A)成分:下記基(A1)及び(A2)を有する重合体
(A1)撥液性基
(A2)トリアルコキシシリル基、
(B)成分:アルカリ可溶性樹脂、
(C)溶剤、
(D)成分:キノンジアジド基を有する化合物。 <Photosensitive resin composition>
The photosensitive resin composition of the present invention is a photosensitive resin composition containing the following component (A), component (B), component (C) and component (D), and, if desired, component (E) In addition, the composition may further contain one or more of other additives.
(A) Component: Polymer having the following groups (A1) and (A2) (A1) Liquid repellent group (A2) Trialkoxysilyl group,
(B) component: alkali-soluble resin,
(C) solvent,
(D) Component: A compound having a quinonediazide group.
(Z1):(E)成分である架橋剤をさらに含有する、
(Z2):(B)成分のアルカリ可溶性樹脂が、自己架橋性基をさらに有するか、又はヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基と反応する基をさらに有する。 The photosensitive resin composition of the present invention preferably further satisfies at least one of the following (Z1) and (Z2).
(Z1): further containing a crosslinking agent as component (E),
(Z2): The alkali-soluble resin of the component (B) further has a self-crosslinkable group or a group that reacts with at least one group selected from the group consisting of a hydroxy group, a carboxyl group, an amide group, and an amino group. Also have.
[1]:(B)成分100質量部に対して0.1質量部乃至20質量部の(A)成分、5質量部乃至100質量部の(D)成分を含有し、これら成分が(C)溶剤に溶解された感光性樹脂組成物。
[2]:(B)成分100質量部に対して0.1質量部乃至20質量部の(A)成分、5質量部乃至100質量部の(D)成分を含有し、これら成分が(C)溶剤に溶解されたポジ型感光性樹脂組成物であって、(B)成分のアルカリ可溶性樹脂が、さらにエポキシ基を有する繰り返し単位を有するポジ型感光性樹脂組成物。
[3]:(B)成分100質量部に対して0.1質量部乃至20質量部の(A)成分、5質量部乃至100質量部の(D)成分を含有し、これら成分が(C)溶剤に溶解されたポジ型感光性樹脂組成物であって、さらに(E)成分である架橋剤を、(A)成分と(B)成分の合計の100質量部に対して1質量部乃至50質量部含有する感光性樹脂組成物。 Especially, the preferable example of the photosensitive resin composition of this invention is as follows.
[1]: It contains 0.1 to 20 parts by weight of component (A), 5 to 100 parts by weight of component (D), and 100 parts by weight of component (B). ) A photosensitive resin composition dissolved in a solvent.
[2]: 0.1 parts by mass to 20 parts by mass of the component (A), 5 parts by mass to 100 parts by mass of the component (D) with respect to 100 parts by mass of the component (B). ) A positive photosensitive resin composition dissolved in a solvent, wherein the alkali-soluble resin of component (B) further has a repeating unit having an epoxy group.
[3]: It contains 0.1 to 20 parts by weight of component (A), 5 to 100 parts by weight of component (D), and 100 parts by weight of component (B). ) A positive photosensitive resin composition dissolved in a solvent, and further, the crosslinking agent (E) is added in an amount of 1 part by mass to 100 parts by mass of the total of the components (A) and (B). A photosensitive resin composition containing 50 parts by mass.
本発明のポジ型感光性樹脂組成物を半導体基板(例えば、シリコン/二酸化シリコン被覆基板、シリコンナイトライド基板、金属例えばアルミニウム、モリブデン、クロムなどが被覆された基板、ガラス基板、石英基板、ITO基板等)の上に、回転塗布、流し塗布、ロール塗布、スリット塗布、スリットに続いた回転塗布、インクジェット塗布などによって塗布し、その後、ホットプレートまたはオーブン等で予備乾燥することにより、塗膜を形成することができる。その後、この塗膜を加熱処理することにより、ポジ型感光性樹脂膜が形成される。 <Coating film and cured film>
The positive photosensitive resin composition of the present invention is applied to a semiconductor substrate (for example, a silicon / silicon dioxide coated substrate, a silicon nitride substrate, a substrate coated with a metal such as aluminum, molybdenum, or chromium, a glass substrate, a quartz substrate, or an ITO substrate. Etc.) by spin coating, flow coating, roll coating, slit coating, spin coating following slit, ink jet coating, etc., and then pre-dried in a hot plate or oven to form a coating film can do. Then, a positive photosensitive resin film is formed by heat-treating this coating film.
本発明の硬化膜は、表示素子に有利に使用することができ、特に、表示素子の画像形成用隔壁として有利に使用し得る。 The present invention also relates to a cured film obtained using the above-described photosensitive resin composition.
The cured film of the present invention can be advantageously used for display elements, and in particular, can be advantageously used as image-forming partition walls for display elements.
[重合体の分子量の測定]
重合体の数平均分子量及び重量平均分子量の測定は、装置として日本分光社製GPCシステムを用い、カラムとしてShodex(登録商標)KF-804L及び803Lを用い、下記の条件にて実施した。
カラムオーブン:40℃
流量:1ml/分
溶離液:テトラヒドロフラン
なお、下記の数平均分子量(以下、Mnと称す。)及び重量平均分子量(以下、Mwと称す。)は、ポリスチレン換算値にて表される。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in more detail, this invention is not limited to these Examples. The molecular weight of the polymer is measured as follows.
[Measurement of molecular weight of polymer]
The measurement of the number average molecular weight and the weight average molecular weight of the polymer was carried out under the following conditions using a GPC system manufactured by JASCO Corporation as a device and Shodex (registered trademark) KF-804L and 803L as columns.
Column oven: 40 ° C
Flow rate: 1 ml / min Eluent: Tetrahydrofuran The following number average molecular weight (hereinafter referred to as Mn) and weight average molecular weight (hereinafter referred to as Mw) are expressed in terms of polystyrene.
MMA:メチルメタクリレート
HEMA:2-ヒドロキシエチルメタクリレート
HPMA:4-ヒドロキシフェニルメタクリレート
HPMA-QD:4-ヒドロキシフェニルメタクリレート1molと1,2-ナフトキノン-2-ジアジド-5-スルホニルクロリド1.1molとの縮合反応によって合成される化合物
CHMI:N-シクロヘキシルマレイミド
PFHMA:2-(パーフルオロヘキシル)エチルメタクリレート
TMSSMA:メタクリルオキシプロピルトリス(トリメチルシロキシ)シラン
MAA:メタクリル酸
MAAm:メタクリルアミド
BMAA:N-(ブトキシメチル)アクリルアミド
MOI-BM:メタクリル酸2-(0-[1’-メチルプロピリデンアミノ]カルボキシアミノ)エチル
KBM-503:3-メタクリロキシプロピルトリエトキシシラン
P11:ヒドロキシスチレン85%とスチレン15%の重合体と、ヒドロキシスチレン70%とスチレン30%の重合体とを3:7で混合したスチレン重合体
AIBN:α、α’-アゾビスイソブチロニトリル
QD:α、α、α’-トリス(4-ヒドロキシフェニル)-1-エチル-4-イソプロピルベンゼン1molと1,2-ナフトキノン-2-ジアジド-5-スルホニルクロリド2molとの縮合反応によって合成される化合物
GT-401:ブタンテトラカルボン酸 テトラ(3,4-エポキシシクロヘキシルメチル) 修飾ε-カプロラクトン
PGME:プロピレングリコールモノメチルエーテル
PGMEA:プロピレングリコールモノメチルエーテルアセテート
CHN:シクロヘキサノン
MIBK:メチルイソブチルケトン
DME:ジプロピレングリコールジメチルエーテル
TMAH:水酸化テトラメチルアンモニウム The meanings of the abbreviations used in the following examples are as follows.
MMA: methyl methacrylate HEMA: 2-hydroxyethyl methacrylate HPMA: 4-hydroxyphenyl methacrylate HPMA-QD: condensation reaction of 1 mol of 4-hydroxyphenyl methacrylate and 1.1 mol of 1,2-naphthoquinone-2-diazide-5-sulfonyl chloride CHMI: N-cyclohexylmaleimide PFHMA: 2- (perfluorohexyl) ethyl methacrylate TMSSMA: methacryloxypropyltris (trimethylsiloxy) silane MAA: methacrylic acid MAAm: methacrylamide BMAA: N- (butoxymethyl) acrylamide MOI-BM: 2- (0- [1′-methylpropylideneamino] carboxyamino) ethyl methacrylate KBM-503: 3-methacrylic acid Xylpropyltriethoxysilane P11: Styrene polymer AIBN obtained by mixing a polymer of 85% hydroxystyrene and 15% styrene with a polymer of 70% hydroxystyrene and 30% styrene at 3: 7: α, α′-azo Bisisobutyronitrile QD: Condensation of 1 mol of α, α, α'-tris (4-hydroxyphenyl) -1-ethyl-4-isopropylbenzene with 2 mol of 1,2-naphthoquinone-2-diazide-5-sulfonyl chloride Compound synthesized by reaction GT-401: Butanetetracarboxylic acid tetra (3,4-epoxycyclohexylmethyl) Modified ε-caprolactone PGME: Propylene glycol monomethyl ether PGMEA: Propylene glycol monomethyl ether acetate CHN: Cyclohexanone MIBK: Methyl Ketone DME: dipropylene glycol dimethyl ether TMAH: tetramethylammonium hydroxide
PFHMA 5.00g、BMAA 1.82g、HEMA 1.00g、CHMI 1.38g、AIBN 0.46gをPGME 22.55gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P1)。得られたアクリル重合体のMnは5000、Mwは6600であった。 <Synthesis Example 1>
PFHMA 5.00 g, BMAA 1.82 g, HEMA 1.00 g, CHMI 1.38 g, AIBN 0.46 g were dissolved in PGME 22.55 g and reacted at 80 ° C. for 20 hours to obtain an acrylic polymer solution (solid content (P30) was obtained. Mn of the obtained acrylic polymer was 5000 and Mw was 6600.
PFHMA 5.00g、BMAA 1.82g、MAA 0.66g、CHMI 1.38g、AIBN 0.44gをPGME 21.72gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P2)。得られたアクリル重合体のMnは5000、Mwは6700であった。 <Synthesis Example 2>
PFHMA 5.00 g, BMAA 1.82 g, MAA 0.66 g, CHMI 1.38 g, AIBN 0.44 g were dissolved in PGME 21.72 g and reacted at 80 ° C. for 20 hours to obtain an acrylic polymer solution (solid content (Concentration 30% by mass) was obtained (P2). Mn of the obtained acrylic polymer was 5000 and Mw was 6700.
PFHMA 5.00g、MOI-BM 2.80g、HEMA 1.00g、CHMI 1.38g、AIBN 0.51gをPGME 24.96gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P3)。得られたアクリル重合体のMnは5600、Mwは6900であった。 <Synthesis Example 3>
PFHMA 5.00 g, MOI-BM 2.80 g, HEMA 1.00 g, CHMI 1.38 g, AIBN 0.51 g were dissolved in PGME 24.96 g and reacted at 80 ° C. for 20 hours to prepare an acrylic polymer solution ( A solid content concentration of 30% by mass was obtained (P3). Mn of the obtained acrylic polymer was 5600 and Mw was 6900.
PFHMA 5.00g、MOI-BM 2.80g、MAAm 0.66g、CHMI 1.38g、AIBN 0.49gをPGME 24.11gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P4)。得られたアクリル重合体のMnは5800、Mwは7600であった。 <Synthesis Example 4>
PFHMA 5.00 g, MOI-BM 2.80 g, MAAm 0.66 g, CHMI 1.38 g, AIBN 0.49 g were dissolved in PGME 24.11 g and reacted at 80 ° C. for 20 hours to prepare an acrylic polymer solution ( A solid concentration of 30% by mass was obtained (P4). Mn of the obtained acrylic polymer was 5800, and Mw was 7600.
PFHMA 5.00g、KBM-503 2.87g、HEMA 1.00g、CHMI 1.38g、AIBN 0.51gをPGME 25.14gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P5)。得られたアクリル重合体のMnは4900、Mwは6600であった。 <Synthesis Example 5>
PFHMA 5.00 g, KBM-503 2.87 g, HEMA 1.00 g, CHMI 1.38 g, AIBN 0.51 g were dissolved in PGME 25.14 g and reacted at 80 ° C. for 20 hours to prepare an acrylic polymer solution ( A solid content concentration of 30% by mass was obtained (P5). Mn of the obtained acrylic polymer was 4900 and Mw was 6600.
PFHMA 5.00g、KBM-503 3.83g、HEMA 1.51g、AIBN 0.52gをPGME 25.32gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P6)。得られたアクリル重合体のMnは4800、Mwは6700であった。 <Synthesis Example 6>
PFHMA 5.00 g, KBM-503 3.83 g, HEMA 1.51 g, AIBN 0.52 g were dissolved in PGME 25.32 g and reacted at 80 ° C. for 20 hours to obtain an acrylic polymer solution (solid content concentration 30 mass). %) Was obtained (P6). Mn of the obtained acrylic polymer was 4800 and Mw was 6700.
PFHMA 5.00g、MMA 1.16g、HEMA 1.00g、CHMI 1.38g、AIBN 0.43gをPGME 20.93gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P7)。得られたアクリル重合体のMnは4800、Mwは6600であった。 <Synthesis Example 7>
PFHMA 5.00 g, MMA 1.16 g, HEMA 1.00 g, CHMI 1.38 g, AIBN 0.43 g were dissolved in PGME 20.93 g and reacted at 80 ° C. for 20 hours to obtain an acrylic polymer solution (solid content (Concentration 30% by mass) was obtained (P7). Mn of the obtained acrylic polymer was 4800 and Mw was 6600.
PFHMA 5.00g、MAAm 0.98g、HEMA 1.00g、CHMI 1.38g、AIBN 0.42gをPGME 20.51gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P8)。得られたアクリル重合体のMnは4900、Mwは6700であった。 <Synthesis Example 8>
PFHMA 5.00 g, MAAm 0.98 g, HEMA 1.00 g, CHMI 1.38 g, AIBN 0.42 g were dissolved in PGME 20.51 g and reacted at 80 ° C. for 20 hours to obtain an acrylic polymer solution (solid content (Concentration 30% by mass) was obtained (P8). Mn of the obtained acrylic polymer was 4900 and Mw was 6700.
MAA 90.00g、HEMA 225.00g、HPMA 45.00g、MMA 180・00g、CHMI 360.00g、AIBN 57.60gをPGME 1436.40gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度40質量%)を得た(P9)。得られたアクリル重合体のMnは3100、Mwは6100であった。 <Synthesis Example 9>
90.00 g of MAA, 225.00 g of HEMA, 45.00 g of HPMA, 180.00 g of MMA, 360.00 g of CHMI, 57.60 g of AIBN were dissolved in 1436.40 g of PGME, and reacted at 80 ° C. for 20 hours. A coalesced solution (solid concentration 40% by mass) was obtained (P9). Mn of the obtained acrylic polymer was 3100 and Mw was 6100.
MAA 100.00g、HEMA 188.89g、MMA 190.37g、CHMI 262.96g、AIBN 47.50gをPGME 1184.59gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度40質量%)を得た(P10)。得られたアクリル重合体のMnは3800、Mwは7300であった。 <Synthesis Example 10>
100.00 g of MAA, 188.89 g of HEMA, 190.37 g of MMA, 262.96 g of CHMI and 47.50 g of AIBN were dissolved in 1184.59 g of PGME and reacted at 80 ° C. for 20 hours to obtain an acrylic polymer solution (solid content (P10) was obtained. Mn of the obtained acrylic polymer was 3800 and Mw was 7300.
HPMA-QD 2.50g、TMSSMA 2.58g、PFHMA 5.26g、MAA 0.70g、CHMI 1.46g、AIBN 0.33gをCHN 51.3gに溶解し、110℃にて20時間撹拌させることによりアクリル重合体溶液(固形分濃度20質量%)を得た(P12)。得られたアクリル重合体のMnは7,200、Mwは11,000であった。 <Synthesis Example 11>
By dissolving HPMA-QD 2.50 g, TMSSMA 2.58 g, PFHMA 5.26 g, MAA 0.70 g, CHMI 1.46 g, AIBN 0.33 g in CHN 51.3 g and stirring at 110 ° C. for 20 hours. An acrylic polymer solution (solid concentration 20% by mass) was obtained (P12). Mn of the obtained acrylic polymer was 7,200 and Mw was 11,000.
PFHMA 5.00g、BMAA 3.03g、CHMI 1.38g、AIBN 0.47gをPGME 23.06gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P13)。得られたアクリル重合体のMnは3900、Mwは6900であった。 <Synthesis Example 12>
PFHMA 5.00 g, BMAA 3.03 g, CHMI 1.38 g, AIBN 0.47 g were dissolved in PGME 23.06 g and reacted at 80 ° C. for 20 hours to obtain an acrylic polymer solution (solid content concentration 30% by mass). (P13). Mn of the obtained acrylic polymer was 3900 and Mw was 6900.
PFHMA 5.00g、KBM-503 6.70g、AIBN 0.59gをPGME 28.68gに溶解し、80℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度30質量%)を得た(P14)。得られたアクリル重合体のMnは6700、Mwは9800であった。 <Synthesis Example 13>
PFHMA 5.00 g, KBM-503 6.70 g, AIBN 0.59 g were dissolved in PGME 28.68 g and reacted at 80 ° C. for 20 hours to obtain an acrylic polymer solution (solid content concentration 30 mass%). (P14). Mn of the obtained acrylic polymer was 6700 and Mw was 9800.
表1に示す組成で(A)乃至(E)の各成分及び溶剤を混合し、最終組成物の固形分濃度が21.0質量%となるように溶剤の添加量を調整することで実施例1乃至13、比較例1乃至2の感光性樹脂組成物を調製した。また、最終組成物の固形分濃度が17.0の質量%となるように溶剤の添加量を調整することで実施例14乃至18、比較例3の感光性樹脂組成物を調製した。なお、表1中の組成比は固形分での比を表すものとする。
By mixing the components (A) to (E) and the solvent in the composition shown in Table 1, and adjusting the addition amount of the solvent so that the solid content concentration of the final composition is 21.0% by mass, Examples Photosensitive resin compositions 1 to 13 and Comparative Examples 1 and 2 were prepared. Moreover, the photosensitive resin composition of Examples 14-18 and the comparative example 3 was prepared by adjusting the addition amount of a solvent so that the solid content concentration of a final composition might be 17.0 mass%. In addition, the composition ratio in Table 1 represents the ratio in solid content.
ポジ型感光性樹脂組成物をITO-ガラス上にスピンコーターを用いて塗布した後、温度100℃で120秒間ホットプレート上においてプリベークを行い、膜厚1.7μmの塗膜を形成した。この塗膜に長さ50μm、幅100μmの長方形パターンが、バンク幅が30μmとなるように碁盤目状に形成されたマスクを介しキヤノン(株)製紫外線照射装置PLA-600FAにより365nmにおける光強度が5.5mW/cm2の紫外線を一定時間照射した。その後2.58%TMAH水溶液に20秒間浸漬することで現像を行った後、超純水で20秒間流水洗浄を行った。次いでこの長方形パターンが形成された塗膜を温度230℃で30分間加熱することによりポストベークを行い硬化させた。得られた硬化膜の長方形開口部上にクラスターテクノロジー(株)製 Inkjet Designerを用いて駆動波形:B、繰り返し周波数:1kHz、駆動電圧:8Vで約20plの溶液を吐出した。吐出溶液は特願2016-141326、実施例1-1に記載の溶液を使用した。得られた結果を表2に示す。 [Evaluation of wettability]
The positive photosensitive resin composition was applied onto ITO-glass using a spin coater and then pre-baked on a hot plate at a temperature of 100 ° C. for 120 seconds to form a coating film having a thickness of 1.7 μm. The light intensity at 365 nm was measured by an ultraviolet irradiation device PLA-600FA manufactured by Canon Inc. through a mask in which a rectangular pattern having a length of 50 μm and a width of 100 μm was formed on this coating film in a grid pattern so that the bank width was 30 μm. An ultraviolet ray of 5.5 mW / cm 2 was irradiated for a certain time. Thereafter, the film was developed by immersing it in a 2.58% TMAH aqueous solution for 20 seconds, and then washed with running ultrapure water for 20 seconds. Next, the coating film on which the rectangular pattern was formed was heated at 230 ° C. for 30 minutes to be post-baked and cured. About 20 pl of solution was discharged onto the rectangular opening of the obtained cured film using an Inkjet Designer manufactured by Cluster Technology Co., Ltd. with a drive waveform of B, a repetition frequency of 1 kHz, and a drive voltage of 8V. As the discharge solution, the solution described in Japanese Patent Application No. 2016-141326 and Example 1-1 was used. The obtained results are shown in Table 2.
○:長方形開口部に溶液が完全に濡れ広がっている。
×:長方形開口部に溶液が濡れ広がっていない部分が観察される。
○: The solution completely spreads out in the rectangular opening.
X: The part where the solution does not spread wet in the rectangular opening is observed.
Claims (13)
- 下記(A)成分、(B)成分、(C)溶剤及び(D)成分を含有する熱硬化可能な感光性樹脂組成物。
(A)成分:下記基(A1)及び(A2)を有する重合体
(A1)撥液性基
(A2)N-アルコキシメチルアミド基、ブロックイソシアネート基及びトリアルコキシシリル基から選ばれる基、
(B)成分:アルカリ可溶性樹脂、
(C)溶剤、
(D)成分:キノンジアジド基を有する化合物。 A thermosetting photosensitive resin composition containing the following component (A), component (B), solvent (C) and component (D).
(A) Component: Polymer having the following groups (A1) and (A2) (A1) Liquid repellent group (A2) A group selected from N-alkoxymethylamide group, blocked isocyanate group and trialkoxysilyl group,
(B) component: alkali-soluble resin,
(C) solvent,
(D) Component: A compound having a quinonediazide group. - 更に(A)成分が下記(A3)を有する重合体である請求項1に記載の感光性樹脂組成物。
(A3):ヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基 The photosensitive resin composition according to claim 1, wherein the component (A) is a polymer having the following (A3).
(A3): at least one group selected from the group consisting of hydroxy group, carboxyl group, amide group and amino group - 更に下記(Z1)及び(Z2)の少なくとも一方を満足する請求項1または2に記載の感光性樹脂組成物。
(Z1):(E)成分である架橋剤をさらに含有する、
(Z2):(B)成分のアルカリ可溶性樹脂が、自己架橋性基をさらに有するか、又はヒドロキシ基、カルボキシル基、アミド基及びアミノ基からなる群から選ばれる少なくとも1つの基と反応する基をさらに有する。 Furthermore, the photosensitive resin composition of Claim 1 or 2 which satisfies at least one of following (Z1) and (Z2).
(Z1): further containing a crosslinking agent as component (E),
(Z2): The alkali-soluble resin of the component (B) further has a self-crosslinkable group or a group that reacts with at least one group selected from the group consisting of a hydroxy group, a carboxyl group, an amide group, and an amino group. Also have. - (A)成分の上記撥液性基が炭素原子数3乃至10のフルオロアルキル基、ポリフルオロエーテル基、シリルエーテル基及びポリシロキサン基から選ばれる少なくとも一種の基である請求項1乃至3のいずれか一項に記載の感光性樹脂組成物。 The liquid-repellent group of component (A) is at least one group selected from a fluoroalkyl group having 3 to 10 carbon atoms, a polyfluoroether group, a silyl ether group, and a polysiloxane group. A photosensitive resin composition according to claim 1.
- (A)成分の重合体がアクリル重合体である請求項1乃至4のいずれか一項に記載の感光性樹脂組成物。 The photosensitive resin composition according to claim 1, wherein the polymer of the component (A) is an acrylic polymer.
- (A)成分のアクリル重合体の数平均分子量がポリスチレン換算で2,000乃至100,000である請求項5に記載の感光性樹脂組成物。 The photosensitive resin composition according to claim 5, wherein the acrylic polymer of the component (A) has a number average molecular weight of 2,000 to 100,000 in terms of polystyrene.
- (B)成分のアルカリ可溶性樹脂の数平均分子量がポリスチレン換算で2,000乃至50,000である請求項1乃至6のいずれか一項に記載の感光性樹脂組成物。 The number average molecular weight of (B) component alkali-soluble resin is 2,000 to 50,000 in polystyrene conversion, The photosensitive resin composition as described in any one of Claims 1 thru | or 6.
- (B)成分100質量部に対して0.1質量部乃至20質量部の(A)成分を含有することを特徴とする請求項1乃至7のいずれか一項に記載の感光性樹脂組成物。 (B) 0.1 mass part thru | or 20 mass parts (A) component are contained with respect to 100 mass parts of component, The photosensitive resin composition as described in any one of Claims 1 thru | or 7 characterized by the above-mentioned. .
- (A)成分と(B)成分の合計100質量部に対して、(D)成分が5質量部乃至100質量部であることを特徴とする請求項1乃至8のいずれか一項に記載の感光性樹脂組成物。 The component (D) is 5 to 100 parts by mass with respect to a total of 100 parts by mass of the (A) component and the (B) component, according to any one of claims 1 to 8. Photosensitive resin composition.
- (A)成分と(B)成分の合計100質量部に対して、(E)成分が1質量部乃至50質量部であることを特徴とする請求項3乃至9のいずれか一項に記載の感光性樹脂組成物。 The component (E) is 1 part by mass to 50 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B), according to claim 3. Photosensitive resin composition.
- 請求項1乃至10のいずれか一項に記載の感光性樹脂組成物を用いて得られる硬化膜。 The cured film obtained using the photosensitive resin composition as described in any one of Claims 1 thru | or 10.
- 請求項11に記載の硬化膜を有する表示素子。 A display element comprising the cured film according to claim 11.
- 請求項11に記載の硬化膜を画像形成用隔壁として有する表示素子。 The display element which has the cured film of Claim 11 as a partition for image formation.
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