WO2017077970A1 - Vacuum pump determination system and vacuum pump - Google Patents

Vacuum pump determination system and vacuum pump Download PDF

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Publication number
WO2017077970A1
WO2017077970A1 PCT/JP2016/082228 JP2016082228W WO2017077970A1 WO 2017077970 A1 WO2017077970 A1 WO 2017077970A1 JP 2016082228 W JP2016082228 W JP 2016082228W WO 2017077970 A1 WO2017077970 A1 WO 2017077970A1
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Prior art keywords
vacuum pump
gas
determination system
parameter
determination
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PCT/JP2016/082228
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French (fr)
Japanese (ja)
Inventor
高橋　克典
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エドワーズ株式会社
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Publication of WO2017077970A1 publication Critical patent/WO2017077970A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F04B37/16—Means for nullifying unswept space
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B51/00—Testing machines, pumps, or pumping installations

Definitions

  • the present invention relates to a determination system for a vacuum pump and a vacuum pump including the determination system for the vacuum pump. Specifically, a vacuum pump determination system that can determine in advance the abnormal state that is predicted to occur from various parameters related to the vacuum pump, measures were taken against the abnormal state, and the abnormal state was canceled by the measures taken The present invention relates to a determination system for a vacuum pump capable of determining this, and a vacuum pump including the determination system for the vacuum pump.
  • a vacuum for generating a Si film A process gas such as silane gas (SiH 4 ) is used in the chamber.
  • the exhaust gas discharged after use is exhausted to the outside from a reactor of a vacuum pump connected to a vacuum chamber which is an apparatus for a semiconductor manufacturing process.
  • Such exhaust gas may cause deposits / products to accumulate inside the vacuum pump over time. In order to remove this deposit, it is necessary to periodically maintain the vacuum pump. Generally, this maintenance is performed once every three months with the vacuum pump removed. It took time and effort to remove the vacuum pump in this way.
  • FIG. 5 is a diagram showing an example in which parameter analysis (data analysis) related to the occurrence of an abnormality in the vacuum pump is performed by a system using a computer and presented.
  • parameter analysis data analysis
  • FIG. 5 shows an example of a screen for monitoring the value of time on the horizontal axis and the value of the parameter on the vertical axis, and monitoring what numerical value the parameter targeted in advance shows over time.
  • the time value can be set in minutes, hours, weeks, months, etc. since the vacuum pump was first operated.
  • Parameters include the current value and pressure of the vacuum pump in operation. Value, temperature value, vibration value, etc. can be set.
  • FIG. 5 as an example, the monitoring of the vacuum pump is started at the point A, it is determined that the maintenance (overhaul) of the vacuum pump is necessary according to the parameter value at the point B, and At point C, it is shown that the value of the parameter encouraged the prohibition of operating the vacuum pump in a new process.
  • Patent Document 1 a detection current value detected at a predetermined position in the vacuum pump is set in advance for the purpose of preventing back flow to the vacuum chamber (chamber) due to the stop of the vacuum pump and facilitating recovery. Further, it describes a technique for closing a valve when a current set value that is smaller than an abnormal current value serving as a guideline for emergency stop of the vacuum pump and larger than a normal current value of the vacuum pump is exceeded. .
  • Patent Document 1 the technique described in Patent Document 1 is based on the premise that the vacuum pump is brought to an emergency stop when an abnormal state occurs in the vacuum pump. Therefore, abnormal conditions related to the vacuum pump that are predicted to occur are determined in advance from parameters (for example, current, voltage, temperature, etc.), and some measures are taken or taken against the abnormal conditions. Therefore, there is a problem that it cannot be determined that the abnormal state has been canceled. Further, since the occurrence of an emergency stop of the vacuum pump is confirmed, there is a problem that it is impossible to perform on-site maintenance (that is, maintenance without removing the vacuum pump from the process apparatus).
  • on-site maintenance that is, maintenance without removing the vacuum pump from the process apparatus.
  • a vacuum pump determination system that can determine in advance an abnormal state that is predicted to occur from parameters related to the vacuum pump, measures are taken against the abnormal state, and the abnormal state is canceled by the measures taken It is an object of the present invention to provide a determination system for a vacuum pump that can determine this, and a vacuum pump including the determination system for the vacuum pump.
  • the invention of claim 1 is a vacuum pump determination system that determines in advance, based on various parameters relating to the vacuum pump, an abnormality that is predicted to occur in the vacuum pump, wherein the vacuum pump is disposed. Due to the judgment gas inflow means for flowing a judgment gas in an amount more than the quantity that flows through the apparatus during operation of the apparatus and the judgment gas that is caused to flow by the judgment gas inflow means during operation of the apparatus And a parameter acquisition means for acquiring the parameter.
  • a vacuum pump determination system is provided.
  • the invention of claim 2 further includes parameter change acquisition means for acquiring the acquired change of the parameter, the change of the parameter acquired by the parameter change acquisition means, and the change of the predetermined parameter stored in advance. 2.
  • the vacuum pump determination system further comprising determination means for determining whether there is an abnormality occurring in the vacuum pump by comparing the reference values.
  • a vacuum pump determination system according to the first or second aspect, further comprising display means for displaying the parameter or a change in the parameter.
  • the determination gas is a gas other than a process gas that is flowed to the apparatus during operation of the apparatus.
  • the determination system of the vacuum pump described in 1. is provided.
  • the invention of claim 5 provides the vacuum pump judgment system according to claim 4, wherein the judgment gas is nitrogen or argon.
  • the invention according to claim 6, wherein the determination gas is a process gas that is flowed to the apparatus during operation of the apparatus.
  • a determination system for a vacuum pump is provided.
  • the present invention according to claim 7 is a vacuum pump determination system that determines in advance, based on various parameters relating to the vacuum pump, an abnormality that is predicted to occur in the vacuum pump, wherein the vacuum pump is disposed.
  • a determination system for a vacuum pump is provided.
  • the invention of claim 8 provides a vacuum pump determination system according to claim 7, further comprising display means for displaying the parameter acquired by the parameter acquisition means.
  • a vacuum pump comprising the vacuum pump determination system according to any one of the first to eighth aspects.
  • an abnormal state that is predicted to occur can be determined in advance from parameters related to the vacuum pump. Further, a measure can be taken against the abnormal state, and it can be determined that the abnormal state has been canceled by the taken measure.
  • a vacuum pump (dry pump) provided with a vacuum pump determination system according to Embodiment 1 of the present invention is not subjected to a process from the process apparatus provided in the vacuum pump.
  • a specific gas other than the process gas defined in the process apparatus hereinafter referred to as an abnormality measurement gas (judgment gas)
  • judgment gas an abnormality measurement gas
  • the vacuum pump (dry pump) is overloaded. In this way, each parameter that reacts more sensitively from each sensor is acquired. Thus, by making it react sensitively, the change of each parameter can be caught more correctly.
  • the vacuum pump (dry pump) including the vacuum pump determination system according to the second embodiment of the present invention performs cleaning in the vacuum pump (dry pump) by flowing a cleaning gas for the vacuum chamber, It is configured to monitor (monitor) the process in which the parameters relating to the vacuum pump return from the increased (amplified) numerical value to the original numerical value.
  • FIG. 1 shows a schematic configuration example for explaining a vacuum pump determination system 20 (and a vacuum pump determination system 21 described later) according to Embodiment 1 (and Embodiment 2 described later) of the present invention.
  • FIG. A vacuum pump determination system 20 according to Embodiment 1 of the present invention includes a vacuum chamber 11, a vacuum pump 12, a vacuum pipe 4, a vacuum pump 2, an exhaust pipe 5 through which exhaust gas discharged from the vacuum pump 2 flows, and an exhaust pipe 5 It comprises a detoxifying device 3 for detoxifying exhaust gas exhausted from the air, a server 6 and the like.
  • the vacuum chamber 11 is a process apparatus (process chamber) such as a wafer film forming apparatus, and is installed in a clean room.
  • the vacuum pump 12 is a vacuum pump for evacuating the process apparatus, for example, a turbo molecular pump.
  • the vacuum pipe 4 is a flow path through which the exhaust gas discharged from the vacuum pump 12 flows.
  • the vacuum pump 2 is a dry pump that serves as an auxiliary pump for the vacuum pump 12, and is connected to the vacuum pump 12 via the vacuum pipe 4.
  • the exhaust pipe 5 is a flow path through which the exhaust gas discharged from the vacuum pump 2 flows.
  • the abatement device 3 is a combustion type, plasma type or gasoline engine type abatement device connected to the vacuum pump 2 via the exhaust pipe 5.
  • Exhaust gas discharged from the process apparatus 1 including the vacuum chamber 11 and the vacuum pump 12 passes through the vacuum pipe 4, passes through the vacuum pump 2, passes through the exhaust pipe 5, and is removed to the abatement apparatus 3. It is discharged as harmless gas by being oxidized in the harming device 3.
  • the server 6 includes a CPU (Central Processing Unit) 61, a ROM (Read Only Memory) 62, a RAM (Random Access Memory) 63, a display device 64, a communication unit 65, a storage unit 66, a bus line 67, and the like.
  • the CPU 61 is a central processing unit of the server 6, and performs various numerical calculations, information processing, and device control in the RAM 63 according to programs such as an application for the determination system 20 of the vacuum pump of the first embodiment stored in the ROM 62 and the like. And so on. In the first embodiment, various calculations related to the control of the determination system 20 of the vacuum pump are performed.
  • the display device 64 is a display unit for displaying information. In the first embodiment, the display device 64 displays increase / decrease of parameters related to the determination system 20 of the vacuum pump.
  • the display device 64 may include an input unit that can accept an input operation.
  • the communication unit 65 is configured to allow the server 6 to communicate with other devices (such as the vacuum pump 2) in the vacuum pump determination system 20, and can be designed with either wireless communication or wired communication. .
  • the storage unit 66 is a large-scale storage device configured with a hard disk or the like, and stores, for example, reference parameters used for various determinations. Each configuration described above is connected by a bus line 67 which is a common path in order to exchange each data within the server 6.
  • This server 6 may be provided for each vacuum pump 2 or may be connected to a plurality of vacuum pumps 2 in a factory for processing by one server 6. In addition, a large number of vacuum pumps 2 installed in a plurality of factories may be processed by one server 6 by connecting via the Internet or the like.
  • the vacuum pipe 4 on the process apparatus 1 side disposed in the vacuum pump 2 is caused to flow to the normal process apparatus 1.
  • a configuration is adopted in which an abnormality measurement gas, which is a specific gas other than the process gas defined in the process apparatus 1, is flowed to the vacuum pump 2 in an amount equal to or greater than the amount.
  • parameter increase / decrease (determination screen) caused by flowing the abnormality measurement gas is displayed on the display device 64.
  • the display device 64 may display the acquired parameter itself, or display the change by comparing the acquired parameter with a predetermined reference value.
  • FIG. 2 is a diagram for explaining a determination (monitoring) screen in the vacuum pump determination system 20 according to the present invention.
  • the vacuum pump determination system 20 when an abnormal measurement gas of a specified amount or more flows through the vacuum pump 2 as described above, as shown in FIG. 2, various parameters monitored for the vacuum pump 2 (for example, A state in which variable factors such as a current value, a voltage value, a temperature value, a vibration value, or a combination of these values are increased is displayed on the display device 64.
  • a larger amount of gas is allowed to flow than a normal amount of gas. In this way, it is possible to react more sensitively with the abnormality measuring gas to be detected, and it is possible to increase the accuracy of each acquired parameter.
  • “SURGE” is a point that shows a numerical value that is abnormally higher than the reference value when a normal amount of gas is flowing.
  • “DIP” is a point that shows a numerical value that is abnormally lower than the reference value when a normal amount of gas is flowing.
  • the abnormality measurement gas is preferably a gas that does not generate deposits such as nitrogen (N 2 ) and argon (Ar), or silane (SiH 4 , monosilane). Further, the abnormality measurement gas may be configured to flow periodically or may be configured to flow irregularly. It should be noted that “more than the normal flow rate” corresponds to a situation such as several times, several hundred times, and several thousand times the amount of the process gas being normally flowed. Furthermore, in the above-described configuration, the abnormality measurement gas is allowed to flow from the vacuum pipe 4 provided in the vacuum pump 2, but the configuration is not limited thereto. For example, the abnormality measurement gas may be flowed through the process device 1 disposed upstream of the vacuum pump 2.
  • FIG. 3 is a flowchart for explaining the operation of the vacuum pump determination system 20 according to the first embodiment of the present invention.
  • the server 6 CPU 61
  • the server 6 supplies a large amount of abnormality measurement gas to the vacuum pump 2 (that is, more than the amount of gas flowing to the process apparatus 1 during the process).
  • Step 20 The inflow of the abnormality measurement gas is automatically caused to flow from an inlet (not shown) provided in the vacuum pipe 4 under the control of the server 6. Further, the administrator may cause the abnormality measurement gas to flow in based on the signal from the server 6. Further, it may be caused to flow from an inlet (not shown) provided in the process apparatus 1 under the control of the server 6.
  • the server 6 displays on the display device 64 an analysis screen (FIG. 2) showing the parameters of the vacuum pump 2 increased by flowing the abnormality measurement gas (step 30).
  • the increased parameter that is, an abnormal value is indicated
  • the server 6 is configured to include an audio device. This warning is performed separately from an urgent warning and the previous stage. This determination is made based on the reference values of the “SURGE” level and “DIP” level for each parameter stored in the storage unit 66. This reference value is updated sequentially in the course of many processes.
  • the update of the reference value is performed by the CPU 61 changing the value of the reference value stored in the storage unit 66 by an input from the administrator.
  • This reference value may be set finely and in detail according to the conditions of the place where the vacuum pump 2 is installed, the type of gas used, the years of use of the vacuum pump, the total usage time, and the like.
  • the warning to the administrator may be configured such that the administrator of the server 6 visually recognizes the display device 64 to determine a sign that an abnormality has occurred in the vacuum pump 2.
  • the server 6 determines whether or not to continue the operation of flowing the abnormality measurement gas (step 40).
  • This determination of continuation is configured such that the inflow continuation time when counting starts after the abnormality measurement gas has started flowing, the time when a parameter specified in advance reaches a preset threshold value, etc.
  • a configuration may be adopted in which an operation stop input by the administrator of the server 6 is received.
  • the server 6 continues to flow the abnormality measurement gas (step 20).
  • the server 6 ends the series of operations. (End).
  • various parameters monitored for the vacuum pump 2 by flowing an abnormal measurement gas in an amount more than a specified amount increase the variable factors (for example, the current value, voltage value, temperature value, vibration value, combined value, etc.), and from the parameter fluctuation values ( Figure 2) obtained in advance,
  • the variable factors for example, the current value, voltage value, temperature value, vibration value, combined value, etc.
  • Figure 2 obtained in advance
  • the occurrence of an abnormality in the vacuum pump 2 can be detected at an early stage, the detection probability can be improved, or the reliability of failure diagnosis can be improved.
  • the vacuum pump 2 can be maintained before the abnormal state occurs based on the prediction, the life of the vacuum pump 2 can be extended.
  • the exhaust gas discharged from the process apparatus 1 including the vacuum chamber 11 and the vacuum pump 12 such as a turbo molecular pump passes through the vacuum pipe 4 as in the first embodiment. Then, it is transported to the abatement device 3 through the exhaust pipe 5 via the vacuum pump 2 which is a dry pump.
  • the CPU 61 of the server 6 performs various calculations related to the control of the vacuum pump determination system 21 in the RAM 63 by a program such as an application for the vacuum pump determination system 21 stored in the ROM 62 or the like. Performs various numerical calculations, information processing, and device control.
  • the display device 64 displays the increase / decrease in parameters related to the determination system 21 of the vacuum pump.
  • the cleaning gas for the vacuum chamber 11 is caused to flow to the vacuum pump 2 from the vacuum pipe 4 on the process apparatus 1 side provided in the vacuum pump 2.
  • the vacuum pump 2 is increased in comparison with the normal values related to the vacuum pump 2.
  • the parameters that have been changed ie, the vacuum pump 2 was in an abnormal state
  • returned to the original value for example, in FIG. 2, the value that exceeded the “SURGE” level or dropped below the “DIP” level.
  • the display device 64 displays a state in which the stored value falls within the range of the “SURGE” level and the “DIP” level).
  • the cleaning gas used is desirably a gas that reduces deposits such as NF 3 (nitrogen trifluoride) and F 2 (fluorine). Furthermore, in the above-described configuration, the cleaning gas is allowed to flow from the vacuum pipe 4 on the process apparatus 1 side, but is not limited thereto.
  • the cleaning gas may be supplied to the vacuum pump 2 at the same timing as the cleaning gas for the vacuum chamber 11 is supplied to the process apparatus 1 (vacuum chamber 11).
  • FIG. 4 is a flowchart for explaining the operation of the vacuum pump determination system 21 according to the second embodiment of the present invention.
  • the server 6 first determines whether or not the process apparatus 1 disposed upstream of the vacuum pump 2 is in process (step 50). When it is determined that the process device 1 is in process (step 50: Y), the server 6 continues to monitor whether or not it is in process. Or you may make it the structure which complete
  • the server 6 displays on the display device 64 an analysis screen indicating the parameter that has been lowered (that is, returned to the normal value) by flowing the cleaning gas (step 70). At this time, it may be determined whether or not the lowered parameter is within the range of the “SURGE” level and the “DIP” level, and if it is not within the range, a warning sound or the like may be issued. This determination is made by comparing with a reference value stored in the storage unit 66. In this case, the server 6 is configured to include an audio device. The administrator of the server 6 may make a determination by visually checking the display device 64.
  • the server 6 of the vacuum pump determination system 21 determines whether or not to continue the operation of flowing the cleaning gas (step 80).
  • the determination of this continuation is configured such that the inflow continuation time when counting is started after the cleaning gas starts flowing, the time when a parameter specified in advance reaches a preset threshold value, and the like are set. Alternatively, a configuration may be adopted in which an operation stop input by the administrator of the server 6 is received.
  • the server 6 continues to flow the cleaning gas (step 60).
  • the server 6 ends the series of operations (end). ). By flowing the cleaning gas, it can be determined how much the state of the vacuum pump 2 is improved by the change in the parameters of the vacuum pump 2.
  • the vacuum pump 2 provided with the vacuum pump determination system 21 according to the second embodiment of the present invention can determine that the abnormal state has been canceled based on a change in the monitored parameter. As a result, maintenance can be performed without removing (without replacing) the vacuum pump 2. Moreover, since the maintenance is performed before the abnormal state occurs, the life of the vacuum pump 2 can be extended.
  • the specific gas in the present invention is other than the process gas specified in the process apparatus, the process gas may be used as long as the flow rate is higher than the amount that flows during the operation of the normal process apparatus.
  • the first and second embodiments of the present invention may be combined.

Abstract

[Problem] To provide a vacuum pump determination system that predetermines an abnormality that may occur in a vacuum pump, and a vacuum pump provided with the determination system. [Solution] A vacuum pump (dry pump) provided with a determination system according to an embodiment 1 of the present invention is configured to supply, during the state where a process is not being executed, a gas for abnormality measurement, other than a process gas, defined for a process apparatus in an amount equal to or greater than the normal supply amount from the process apparatus side arranged in the vacuum pump. An abnormality can be determined more accurately beforehand by increasing (amplifying) and then displaying various parameters.

Description

真空ポンプの判断システム、および真空ポンプVacuum pump judgment system and vacuum pump
　本発明は、真空ポンプの判断システム、および当該真空ポンプの判断システムを備える真空ポンプに関する。
　詳しくは、発生が予測される異常状態を、真空ポンプに関わる各種パラメータから事前に判断可能な真空ポンプの判断システム、異常状態に対して策を講じ、講じた策により当該異常状態が解除されたことを判断可能な真空ポンプの判断システム、および当該真空ポンプの判断システムを備える真空ポンプに関する。 The present invention relates to a determination system for a vacuum pump and a vacuum pump including the determination system for the vacuum pump.
Specifically, a vacuum pump determination system that can determine in advance the abnormal state that is predicted to occur from various parameters related to the vacuum pump, measures were taken against the abnormal state, and the abnormal state was canceled by the measures taken The present invention relates to a determination system for a vacuum pump capable of determining this, and a vacuum pump including the determination system for the vacuum pump.
　真空ポンプの上流に配設されるプロセス装置が、たとえば半導体や太陽電池、液晶などを製造する際の工程の１つである成膜のための装置である場合、Ｓｉ膜を生成するための真空チャンバ内でシランガス（ＳｉＨ4）等のプロセスガスが使用される。
　この使用された後に排出させる排ガスは、半導体製造工程用の装置である真空チャンバに接続された真空ポンプの反応炉から外部に排気される。こうした排ガスによって、時間の経過とともに真空ポンプの内部に堆積物・生成物が堆積してしまうことがある。
　この堆積物を取り除くために、真空ポンプを定期的にメンテナンスすることが必要になる。一般的に、このメンテナンスは三ヶ月に一度程度の頻度で、真空ポンプを取り外して実施される。このように真空ポンプを取り外すことは手間と時間がかかっていた。
　また、運用面・費用面を鑑みたときに、当該メンテナンスから次のメンテナンスを行う迄の間隔（フリーメンテナンス期間）は長ければ長い方が良い。あるいは、取り外しを要するメンテナンスが必要になる前に、取り外さなくてもできるメンテナンスを実施できることが望ましい。
　さらに、堆積物・生成物の体積を何らかの理由で見過ごし、真空ポンプが緊急停止すると、真空チャンバに大気が逆流し、莫大な損害に繋がるため、是非とも真空ポンプの緊急停止は回避しなければならない。 When the process apparatus disposed upstream of the vacuum pump is an apparatus for film formation, which is one of the steps when manufacturing semiconductors, solar cells, liquid crystals, etc., a vacuum for generating a Si film A process gas such as silane gas (SiH 4 ) is used in the chamber.
The exhaust gas discharged after use is exhausted to the outside from a reactor of a vacuum pump connected to a vacuum chamber which is an apparatus for a semiconductor manufacturing process. Such exhaust gas may cause deposits / products to accumulate inside the vacuum pump over time.
In order to remove this deposit, it is necessary to periodically maintain the vacuum pump. Generally, this maintenance is performed once every three months with the vacuum pump removed. It took time and effort to remove the vacuum pump in this way.
In view of operation and cost, it is better that the interval (free maintenance period) from the maintenance to the next maintenance is longer. Alternatively, it is desirable that maintenance that can be performed without being removed can be performed before maintenance that requires removal is required.
Furthermore, if the volume of the sediment / product is overlooked for some reason and the vacuum pump is shut down urgently, the atmosphere will flow back into the vacuum chamber, causing enormous damage. .
　一方、近年、真空ポンプ（ドライポンプ）の、上述した堆積物・生成物が堆積してしまうことによる異常検知に関しては、異常発生に係る様々なパラメータをモニタリングすることで真空ポンプが停止することを事前に予知・予測することができるようなシステムの開発が進められている。
　図５は、真空ポンプの異常発生に係るパラメータ分析（データ分析）をコンピュータを用いたシステムで行い、これを提示した一例を示した図である。
　このシステムでは、パラメータ分析（データ分析）を所定の画面に表示し、管理者に提示している。
　図５は、横軸に時間の値、縦軸にパラメータの値がとられ、時間の経過とともに、予めターゲティングされたパラメータがどのような数値を示しているかをモニタリングする画面の一例である。
　時間の値は、真空ポンプが初めて稼働してから経過した分単位、時間単位、週単位、月単位など設定が可能であり、また、パラメータには、稼働中の真空ポンプの電流の値、圧力の値、温度の値、振動の値などが設定可能である。
　図５では、一例として、地点Ａにて、真空ポンプのモニタリングが開始されたこと、地点Ｂにて、パラメータの値により真空ポンプのメンテナンス（オーバーホール）が必要であることが判断されたこと、そして、地点Ｃにて、パラメータの値により真空ポンプを新しいプロセスで稼働することの禁止が奨励されたこと、が示されている。 On the other hand, in recent years, regarding the abnormality detection of the vacuum pump (dry pump) due to the accumulation of deposits and products described above, the vacuum pump can be stopped by monitoring various parameters related to the occurrence of the abnormality. Development of a system that can predict and predict in advance is underway.
FIG. 5 is a diagram showing an example in which parameter analysis (data analysis) related to the occurrence of an abnormality in the vacuum pump is performed by a system using a computer and presented.
In this system, parameter analysis (data analysis) is displayed on a predetermined screen and presented to the administrator.
FIG. 5 shows an example of a screen for monitoring the value of time on the horizontal axis and the value of the parameter on the vertical axis, and monitoring what numerical value the parameter targeted in advance shows over time.
The time value can be set in minutes, hours, weeks, months, etc. since the vacuum pump was first operated. Parameters include the current value and pressure of the vacuum pump in operation. Value, temperature value, vibration value, etc. can be set.
In FIG. 5, as an example, the monitoring of the vacuum pump is started at the point A, it is determined that the maintenance (overhaul) of the vacuum pump is necessary according to the parameter value at the point B, and At point C, it is shown that the value of the parameter encouraged the prohibition of operating the vacuum pump in a new process.
特許第５５０４１０７号Patent No. 5504107
　特許文献１には、真空ポンプの停止による真空チャンバ（チャンバー）への逆流を防止するとともに復旧を容易にすることを目的として、真空ポンプにおける所定箇所で検出された検出電流値が、予め設定された、真空ポンプを緊急停止する目安となる異常電流値よりも小さく且つ真空ポンプの常用電流値よりも大きい値である電流設定値を超えた場合に、バルブの閉止を行う技術について記載されている。 In Patent Document 1, a detection current value detected at a predetermined position in the vacuum pump is set in advance for the purpose of preventing back flow to the vacuum chamber (chamber) due to the stop of the vacuum pump and facilitating recovery. Further, it describes a technique for closing a valve when a current set value that is smaller than an abnormal current value serving as a guideline for emergency stop of the vacuum pump and larger than a normal current value of the vacuum pump is exceeded. .
　しかしながら、特許文献１に記載の技術では、真空ポンプに異常な状態が発生することで真空ポンプが緊急停止することが前提となっている。そのため、真空ポンプに関わる、これから発生が予測される異常状態について、パラメータ（たとえば、電流や電圧、温度など）から事前に判断し、当該異常状態に対して何らかの策を講じることや、策を講じたことで当該異常状態が解除されたことを判断するということはできないという問題があった。
　また、真空ポンプの緊急停止の発生が確定した後であるため、真空ポンプをオンサイトメンテナンスする（すなわち、プロセス装置から取り外さずにメンテナンスする）ことは不可能であるという問題があった。 However, the technique described in Patent Document 1 is based on the premise that the vacuum pump is brought to an emergency stop when an abnormal state occurs in the vacuum pump. Therefore, abnormal conditions related to the vacuum pump that are predicted to occur are determined in advance from parameters (for example, current, voltage, temperature, etc.), and some measures are taken or taken against the abnormal conditions. Therefore, there is a problem that it cannot be determined that the abnormal state has been canceled.
Further, since the occurrence of an emergency stop of the vacuum pump is confirmed, there is a problem that it is impossible to perform on-site maintenance (that is, maintenance without removing the vacuum pump from the process apparatus).
　本発明は、発生が予測される異常状態を、真空ポンプに関わるパラメータから事前に判断可能な真空ポンプの判断システム、異常状態に対して策を講じ、講じた策により当該異常状態が解除されたことを判断可能な真空ポンプの判断システム、および当該真空ポンプの判断システムを備える真空ポンプを提供することを目的とする。 In the present invention, a vacuum pump determination system that can determine in advance an abnormal state that is predicted to occur from parameters related to the vacuum pump, measures are taken against the abnormal state, and the abnormal state is canceled by the measures taken It is an object of the present invention to provide a determination system for a vacuum pump that can determine this, and a vacuum pump including the determination system for the vacuum pump.
　請求項１記載の本願発明では、真空ポンプに発生が予測される異常を、前記真空ポンプに関する各種のパラメータにより、事前に判断する真空ポンプの判断システムであって、前記真空ポンプが配設される装置の非稼働中に、当該装置の稼働中に当該装置に流される量以上の量の判断用ガスを流す判断用ガス流入手段と、前記判断用ガス流入手段により流される前記判断用ガスに起因した前記パラメータを取得するパラメータ取得手段と、を備えることを特徴とする真空ポンプの判断システムを提供する。
　請求項２記載の本願発明では、取得した前記パラメータの変化を取得するパラメータ変化取得手段を備え、前記パラメータ変化取得手段により取得した前記パラメータの変化と、予め記憶されている所定の前記パラメータの変化の基準値を比較することにより、真空ポンプに発生する異常の有無を判断する判断手段をさらに備えたことを特徴とする請求項１に記載の真空ポンプの判断システムを提供する。
　請求項３記載の本願発明では、前記パラメータまたは前記パラメータの変化を表示する表示手段を備えたことを特徴とする請求項１又は請求項２に記載の真空ポンプの判断システムを提供する。
　請求項４記載の本願発明では、前記判断用ガスは、前記装置の稼働中に当該装置に流されるプロセスガス以外のガスであることを特徴とする請求項１から請求項３のいずれか１項に記載の真空ポンプの判断システムを提供する。
　請求項５記載の本願発明では、前記判断用ガスは、窒素またはアルゴンであることを特徴とする請求項４に記載の真空ポンプの判断システムを提供する。
　請求項６記載の本願発明では、前記判断用ガスは、前記装置の稼働中に当該装置に流されるプロセスガスであることを特徴とする請求項１から請求項３のいずれか１項に記載の真空ポンプの判断システムを提供する。
　請求項７記載の本願発明では、真空ポンプに発生が予測される異常を、前記真空ポンプに関する各種のパラメータにより、事前に判断する真空ポンプの判断システムであって、前記真空ポンプが配設される装置の非稼働中に、前記真空ポンプの内部をクリーニングするガスを流すクリーニングガス流入手段と、前記クリーニングガス流入手段により流される前記ガスに起因した前記パラメータを取得するパラメータ取得手段と、を備えることを特徴とする真空ポンプの判断システムを提供する。
　請求項８記載の本願発明では、前記パラメータ取得手段で取得した前記パラメータを表示する表示手段をさらに備えたことを特徴とする請求項７に記載の真空ポンプの判断システムを提供する。
　請求項９記載の本願発明では、請求項１から請求項８のいずれか１項に記載の真空ポンプの判断システムを備えることを特徴とする真空ポンプを提供する。 The invention of claim 1 is a vacuum pump determination system that determines in advance, based on various parameters relating to the vacuum pump, an abnormality that is predicted to occur in the vacuum pump, wherein the vacuum pump is disposed. Due to the judgment gas inflow means for flowing a judgment gas in an amount more than the quantity that flows through the apparatus during operation of the apparatus and the judgment gas that is caused to flow by the judgment gas inflow means during operation of the apparatus And a parameter acquisition means for acquiring the parameter. A vacuum pump determination system is provided.
The invention of claim 2 further includes parameter change acquisition means for acquiring the acquired change of the parameter, the change of the parameter acquired by the parameter change acquisition means, and the change of the predetermined parameter stored in advance. 2. The vacuum pump determination system according to claim 1, further comprising determination means for determining whether there is an abnormality occurring in the vacuum pump by comparing the reference values.
According to a third aspect of the present invention, there is provided a vacuum pump determination system according to the first or second aspect, further comprising display means for displaying the parameter or a change in the parameter.
According to a fourth aspect of the present invention, the determination gas is a gas other than a process gas that is flowed to the apparatus during operation of the apparatus. The determination system of the vacuum pump described in 1. is provided.
The invention of claim 5 provides the vacuum pump judgment system according to claim 4, wherein the judgment gas is nitrogen or argon.
The invention according to claim 6, wherein the determination gas is a process gas that is flowed to the apparatus during operation of the apparatus. A determination system for a vacuum pump is provided.
The present invention according to claim 7 is a vacuum pump determination system that determines in advance, based on various parameters relating to the vacuum pump, an abnormality that is predicted to occur in the vacuum pump, wherein the vacuum pump is disposed. A cleaning gas inflow unit for flowing a gas for cleaning the inside of the vacuum pump and a parameter acquisition unit for acquiring the parameter caused by the gas flowing through the cleaning gas inflow unit when the apparatus is not in operation. A determination system for a vacuum pump is provided.
The invention of claim 8 provides a vacuum pump determination system according to claim 7, further comprising display means for displaying the parameter acquired by the parameter acquisition means.
According to a ninth aspect of the present invention, there is provided a vacuum pump comprising the vacuum pump determination system according to any one of the first to eighth aspects.
　本発明によれば、発生が予測される異常状態を、真空ポンプに関わるパラメータから事前に判断することができる。また、異常状態に対して策を講じ、講じた策により当該異常状態が解除されたことを判断することができる。 According to the present invention, an abnormal state that is predicted to occur can be determined in advance from parameters related to the vacuum pump. Further, a measure can be taken against the abnormal state, and it can be determined that the abnormal state has been canceled by the taken measure.
本発明に係る真空ポンプの判断システムを説明するための概略構成例を示した図である。It is the figure which showed the schematic structural example for demonstrating the judgment system of the vacuum pump which concerns on this invention. 本発明に係る真空ポンプの判断システムにおける監視画面を説明するための図である。It is a figure for demonstrating the monitoring screen in the judgment system of the vacuum pump which concerns on this invention. 本発明の実施形態１に係る真空ポンプの判断システムの動作を説明するためのフローチャートである。It is a flowchart for demonstrating operation | movement of the determination system of the vacuum pump which concerns on Embodiment 1 of this invention. 本発明の実施形態２に係る真空ポンプの判断システムの動作を説明するためのフローチャートである。It is a flowchart for demonstrating operation | movement of the determination system of the vacuum pump which concerns on Embodiment 2 of this invention. 異常発生に係るパラメータ分析を説明するための一例を示した図である。It is the figure which showed an example for demonstrating the parameter analysis which concerns on abnormality generation.
（ｉ）実施形態の概要
　本発明の実施形態１に係る真空ポンプの判断システムを備えた真空ポンプ（ドライポンプ）は、当該真空ポンプに配設されるプロセス装置側から、プロセスが行われていない状態時に、当該プロセス装置に規定されているプロセスガス以外の特定のガス（以後、異常測定用ガス（判断用ガス）とする）を、通常流す量以上の量を流す構成にする。すなわち、当該真空ポンプ（ドライポンプ）を過負荷の状態にする。こうすることで、各センサからより鋭敏に反応した各パラメータを取得するようにする。このように、鋭敏に反応させることで、各パラメータの変化をより正確に捉えることができる。
　また、本発明の実施形態２に係る真空ポンプの判断システムを備えた真空ポンプ（ドライポンプ）は、真空チャンバ用のクリーニングガスを流して、真空ポンプ（ドライポンプ）内のクリーニングを行うと同時に、当該真空ポンプに関わるパラメータが、増長（増幅）した数値から元の数値に戻る過程をモニタリング（監視）する構成にする。 (I) Outline of Embodiment A vacuum pump (dry pump) provided with a vacuum pump determination system according to Embodiment 1 of the present invention is not subjected to a process from the process apparatus provided in the vacuum pump. In a state, a specific gas other than the process gas defined in the process apparatus (hereinafter referred to as an abnormality measurement gas (judgment gas)) is configured to flow in an amount greater than the normal flow rate. That is, the vacuum pump (dry pump) is overloaded. In this way, each parameter that reacts more sensitively from each sensor is acquired. Thus, by making it react sensitively, the change of each parameter can be caught more correctly.
In addition, the vacuum pump (dry pump) including the vacuum pump determination system according to the second embodiment of the present invention performs cleaning in the vacuum pump (dry pump) by flowing a cleaning gas for the vacuum chamber, It is configured to monitor (monitor) the process in which the parameters relating to the vacuum pump return from the increased (amplified) numerical value to the original numerical value.
（ｉｉ）実施形態１の詳細
　以下、本発明の好適な実施の形態について、図１から図４を参照して詳細に説明する。
　図１は、本発明の実施形態１（および、後述する実施形態２）に係る真空ポンプの判断システム２０（および、後述する真空ポンプの判断システム２１）を説明するための概略構成例を示した図である。
　本発明の実施形態１に係る真空ポンプの判断システム２０は、真空チャンバ１１、真空ポンプ１２、真空配管４、真空ポンプ２、真空ポンプ２から排出された排出ガスが流れる排気配管５、排気配管５から排気された排出ガスを除害するための除害装置３、そして、サーバ６などから構成される。
　真空チャンバ１１は、ウェハ成膜装置などのプロセス装置（プロセスチャンバ）であり、クリーンルーム内に設置される。
　真空ポンプ１２は、プロセス装置を真空にするための真空ポンプであり、たとえばターボ分子ポンプである。
　真空配管４は、真空ポンプ１２から排出された排出ガスが流れる流路である。
　真空ポンプ２は、真空ポンプ１２の補助ポンプのような役割を果たすドライポンプであり、真空配管４を介して真空ポンプ１２に連結される。
　排気配管５は、真空ポンプ２から排出された排出ガスが流れる流路である。
　除害装置３は、排気配管５を介して真空ポンプ２と連結される、燃焼式、プラズマ式、あるいはガソリンエンジン式の除害装置である。
　真空チャンバ１１や真空ポンプ１２から構成されるプロセス装置１から排出された排出ガスは、真空配管４を通って真空ポンプ２を経由し、排気配管５を通って除害装置３へ運ばれ、除害装置３において酸化されることで無害なガスとして排出される。 (Ii) Details of Embodiment 1 Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS.
FIG. 1 shows a schematic configuration example for explaining a vacuum pump determination system 20 (and a vacuum pump determination system 21 described later) according to Embodiment 1 (and Embodiment 2 described later) of the present invention. FIG.
A vacuum pump determination system 20 according to Embodiment 1 of the present invention includes a vacuum chamber 11, a vacuum pump 12, a vacuum pipe 4, a vacuum pump 2, an exhaust pipe 5 through which exhaust gas discharged from the vacuum pump 2 flows, and an exhaust pipe 5 It comprises a detoxifying device 3 for detoxifying exhaust gas exhausted from the air, a server 6 and the like.
The vacuum chamber 11 is a process apparatus (process chamber) such as a wafer film forming apparatus, and is installed in a clean room.
The vacuum pump 12 is a vacuum pump for evacuating the process apparatus, for example, a turbo molecular pump.
The vacuum pipe 4 is a flow path through which the exhaust gas discharged from the vacuum pump 12 flows.
The vacuum pump 2 is a dry pump that serves as an auxiliary pump for the vacuum pump 12, and is connected to the vacuum pump 12 via the vacuum pipe 4.
The exhaust pipe 5 is a flow path through which the exhaust gas discharged from the vacuum pump 2 flows.
The abatement device 3 is a combustion type, plasma type or gasoline engine type abatement device connected to the vacuum pump 2 via the exhaust pipe 5.
Exhaust gas discharged from the process apparatus 1 including the vacuum chamber 11 and the vacuum pump 12 passes through the vacuum pipe 4, passes through the vacuum pump 2, passes through the exhaust pipe 5, and is removed to the abatement apparatus 3. It is discharged as harmless gas by being oxidized in the harming device 3.
　サーバ６は、ＣＰＵ（Ｃｅｎｔｒａｌ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ）６１、ＲＯＭ（Ｒｅａｄ　Ｏｎｌｙ　Ｍｅｍｏｒｙ）６２、ＲＡＭ（Ｒａｎｄｏｍ　Ａｃｃｅｓｓ　Ｍｅｍｏｒｙ）６３、表示装置６４、通信部６５、記憶部６６およびバスライン６７などにより構成される。
　ＣＰＵ６１は、サーバ６の中央演算処理装置であり、ＲＯＭ６２などに保存された、本実施形態１の真空ポンプの判断システム２０用アプリケーションなどのプログラムによって、ＲＡＭ６３で様々な数値計算や情報処理、機器制御などを行う。本実施形態１では、真空ポンプの判断システム２０の制御に係わる各種演算を行う。
　表示装置６４は、情報の表示を行うための表示部であり、本実施形態１では、真空ポンプの判断システム２０に係るパラメータの増減を表示する。
　なお、表示装置６４は、入力操作を受け付けることが可能な入力部を備える構成にしても良い。 The server 6 includes a CPU (Central Processing Unit) 61, a ROM (Read Only Memory) 62, a RAM (Random Access Memory) 63, a display device 64, a communication unit 65, a storage unit 66, a bus line 67, and the like.
The CPU 61 is a central processing unit of the server 6, and performs various numerical calculations, information processing, and device control in the RAM 63 according to programs such as an application for the determination system 20 of the vacuum pump of the first embodiment stored in the ROM 62 and the like. And so on. In the first embodiment, various calculations related to the control of the determination system 20 of the vacuum pump are performed.
The display device 64 is a display unit for displaying information. In the first embodiment, the display device 64 displays increase / decrease of parameters related to the determination system 20 of the vacuum pump.
The display device 64 may include an input unit that can accept an input operation.
　通信部６５は、サーバ６が真空ポンプの判断システム２０内の他の装置（真空ポンプ２など）と通信をするための構成であり、無線通信と有線通信のいずれかの構成で設計可能である。
　記憶部６６は、ハードディスクなどで構成された大規模記憶装置であり、たとえば各種判断に用いる基準パラメータが記憶されている。
　上述した各構成は、サーバ６内で各々のデータを交換するために、共通の経路であるバスライン６７で接続されている。
　このサーバ６は、各真空ポンプ２に各々設けても良いし、一つのサーバ６で工場内の複数の真空ポンプ２に接続して処理を行うようにしても良い。
　また、インターネットなどで接続することで、複数の工場に設置された多数の真空ポンプ２を一つのサーバ６で処理を行うようにしても良い。 The communication unit 65 is configured to allow the server 6 to communicate with other devices (such as the vacuum pump 2) in the vacuum pump determination system 20, and can be designed with either wireless communication or wired communication. .
The storage unit 66 is a large-scale storage device configured with a hard disk or the like, and stores, for example, reference parameters used for various determinations.
Each configuration described above is connected by a bus line 67 which is a common path in order to exchange each data within the server 6.
This server 6 may be provided for each vacuum pump 2 or may be connected to a plurality of vacuum pumps 2 in a factory for processing by one server 6.
In addition, a large number of vacuum pumps 2 installed in a plurality of factories may be processed by one server 6 by connecting via the Internet or the like.
　本発明の実施形態１に係る真空ポンプの判断システム２０では、プロセスが行われていない状態時に、真空ポンプ２に配設されるプロセス装置１側の真空配管４から、通常プロセス装置１に流される量以上の量の、当該プロセス装置１に規定されているプロセスガス以外の特定のガスである異常測定用ガスが、真空ポンプ２に流される構成にする。
　本実施形態１では、異常測定用ガスを流したことに起因するパラメータの増減（判断画面）が表示装置６４に表示される。
　なお、表示装置６４には、取得したパラメータ自体を表示しても良いし、取得したパラメータを所定の基準値と比較することで、その変化を表示するようにしても良い。 In the vacuum pump determination system 20 according to the first embodiment of the present invention, when the process is not performed, the vacuum pipe 4 on the process apparatus 1 side disposed in the vacuum pump 2 is caused to flow to the normal process apparatus 1. A configuration is adopted in which an abnormality measurement gas, which is a specific gas other than the process gas defined in the process apparatus 1, is flowed to the vacuum pump 2 in an amount equal to or greater than the amount.
In the first embodiment, parameter increase / decrease (determination screen) caused by flowing the abnormality measurement gas is displayed on the display device 64.
The display device 64 may display the acquired parameter itself, or display the change by comparing the acquired parameter with a predetermined reference value.
　図２は、本発明に係る真空ポンプの判断システム２０における判断（監視）画面を説明するための図である。
　真空ポンプの判断システム２０では、上述したように真空ポンプ２に規定以上の量の異常測定用ガスを流すと、図２に示したように、真空ポンプ２についてモニタリングしている各種パラメータ（たとえば、電流の数値、電圧の数値、温度の数値、振動の数値、あるいは各々を組み合わせた数値など）の可変要因が増長した様子が表示装置６４に表示される。この実施形態１では、通常の量のガスより多い量のガスを流すようにする。こうすることで、検知する異常測定用ガスにより鋭敏に反応させることができ、取得する各パラメータの精度を高めることができる。 FIG. 2 is a diagram for explaining a determination (monitoring) screen in the vacuum pump determination system 20 according to the present invention.
In the vacuum pump determination system 20, when an abnormal measurement gas of a specified amount or more flows through the vacuum pump 2 as described above, as shown in FIG. 2, various parameters monitored for the vacuum pump 2 (for example, A state in which variable factors such as a current value, a voltage value, a temperature value, a vibration value, or a combination of these values are increased is displayed on the display device 64. In the first embodiment, a larger amount of gas is allowed to flow than a normal amount of gas. In this way, it is possible to react more sensitively with the abnormality measuring gas to be detected, and it is possible to increase the accuracy of each acquired parameter.
　「ＳＵＲＧＥ」は、通常の量のガスを流している場合の基準値よりも異常に高い数値を示したポイントである。
　「ＤＩＰ」は、通常の量のガスを流している場合の基準値よりも異常に低い数値を示したポイントである。これらの基準値は、記憶部６６に予め記憶されている。
　このようにして得られるパラメータの変動数値から、事前に、発生が予測される真空ポンプ２の異常状態についてその前兆を捉え、異常発生の目安や予定・予測を早期に立てることができる。
　なお、「ＳＵＲＧＥ」レベルや「ＤＩＰ」レベルをどこに設定するかは、装置（真空ポンプ２）ごとの状況に合わせ、最適な値を設定する構成にする。 “SURGE” is a point that shows a numerical value that is abnormally higher than the reference value when a normal amount of gas is flowing.
“DIP” is a point that shows a numerical value that is abnormally lower than the reference value when a normal amount of gas is flowing. These reference values are stored in the storage unit 66 in advance.
From the numerical values of the parameter fluctuations obtained in this way, it is possible to grasp in advance a sign of the abnormal state of the vacuum pump 2 that is predicted to occur in advance, and to establish a rough standard, schedule, and prediction of the occurrence of the abnormality.
Note that where the “SURGE” level and the “DIP” level are set, an optimum value is set according to the situation of each device (vacuum pump 2).
　なお、異常測定用ガスは、窒素（Ｎ2）やアルゴン（Ａｒ）などの堆積物が生成されないガスか、あるいはシラン（ＳｉＨ4、モノシラン）であることが望ましい。
　また、異常測定用ガスは、定期的に流す構成にしても良いし、不定期に流す構成にしても良い。なお、通常流す量以上とは、通常流しているプロセスガスの量の数倍、数百倍、数千倍など、状況に応じて対応可能とする。
　さらに、上述した構成では、真空ポンプ２に配設される真空配管４から異常測定用ガスを流す構成にしたが、これに限られることはない。たとえば、真空ポンプ２の上流に配設されるプロセス装置１を経由して異常測定用ガスが流される構成にしても良い。 The abnormality measurement gas is preferably a gas that does not generate deposits such as nitrogen (N 2 ) and argon (Ar), or silane (SiH 4 , monosilane).
Further, the abnormality measurement gas may be configured to flow periodically or may be configured to flow irregularly. It should be noted that “more than the normal flow rate” corresponds to a situation such as several times, several hundred times, and several thousand times the amount of the process gas being normally flowed.
Furthermore, in the above-described configuration, the abnormality measurement gas is allowed to flow from the vacuum pipe 4 provided in the vacuum pump 2, but the configuration is not limited thereto. For example, the abnormality measurement gas may be flowed through the process device 1 disposed upstream of the vacuum pump 2.
　図３は、本発明の実施形態１に係る真空ポンプの判断システム２０の動作を説明するためのフローチャートである。
　本実施形態１に係る真空ポンプの判断システム２０では、まず、サーバ６（ＣＰＵ６１）は、真空ポンプ２の上流に配設されたプロセス装置１がプロセス中か否かを判断する（ステップ１０）。
　プロセス装置１がプロセス中であると判断された場合（ステップ１０：Ｙ）、サーバ６は、プロセス中か否かの監視を続ける。あるいは、ここで一連の動作を終了する構成にしても良い（エンド）。
　プロセス装置１がプロセス中であると判断されなかった場合（ステップ１０：Ｎ）、サーバ６は、異常測定用ガスを真空ポンプ２へ大量に（すなわち、プロセス中にプロセス装置１に流すガス量以上の量を）流入させる（ステップ２０）。
　この異常測定用ガスの流入は、サーバ６による制御で、自動的に真空配管４に設けられた流入口（図示せず）から流入させるようにする。また、サーバ６からの信号に基づいて、管理者が異常測定用ガスを流入させるようにしても良い。
　さらに、サーバ６による制御で、プロセス装置１に設けられた流入口（図示せず）から流入させるようにしても良い。 FIG. 3 is a flowchart for explaining the operation of the vacuum pump determination system 20 according to the first embodiment of the present invention.
In the vacuum pump determination system 20 according to the first embodiment, the server 6 (CPU 61) first determines whether or not the process device 1 disposed upstream of the vacuum pump 2 is in process (step 10).
If it is determined that the process device 1 is in process (step 10: Y), the server 6 continues to monitor whether or not it is in process. Or you may make it the structure which complete | finishes a series of operation | movement here (end).
When it is not determined that the process apparatus 1 is in process (step 10: N), the server 6 supplies a large amount of abnormality measurement gas to the vacuum pump 2 (that is, more than the amount of gas flowing to the process apparatus 1 during the process). (Step 20).
The inflow of the abnormality measurement gas is automatically caused to flow from an inlet (not shown) provided in the vacuum pipe 4 under the control of the server 6. Further, the administrator may cause the abnormality measurement gas to flow in based on the signal from the server 6.
Further, it may be caused to flow from an inlet (not shown) provided in the process apparatus 1 under the control of the server 6.
　次に、サーバ６は、異常測定用ガスを流したことで増長した真空ポンプ２のパラメータを示す分析画面（図２）を表示装置６４に表示する（ステップ３０）。
　このとき、増長された（つまり、異常値を示した）パラメータが「ＳＵＲＧＥ」レベルと「ＤＩＰ」レベルの範囲内にあるか否かを判断し、範囲内にない場合に、警告音などのワーニングを出す構成にしても良い。なお、その場合は、サーバ６には音声装置を備える構成にする。この警告は、緊急な警告と、その前段階とを分けて行うようにする。
　この判断は、記憶部６６に記憶された各パラメータに対する「ＳＵＲＧＥ」レベルと「ＤＩＰ」レベルの基準値に基づいて判断される。この基準値は、多数の処理を経る過程で順次更新するようにする。すなわち、各基準値が高すぎる、又は低すぎるといった処理の評価を織り込むことで、より適切な基準値を設定できるようにする。
　この基準値の更新は管理者からの入力によりＣＰＵ６１が、記憶部６６に記憶されている基準値の値を変更することにより行う。
　この基準値は、真空ポンプ２の設置場所の条件、使用するガスの種類、当該真空ポンプの使用年数、通算の使用時間等により細かく、詳細に設定するようにしても良い。
　なお、管理者に対する警告は、サーバ６の管理者が表示装置６４を目視することで、真空ポンプ２に異常が発生する前兆を判断する構成にしても良い。 Next, the server 6 displays on the display device 64 an analysis screen (FIG. 2) showing the parameters of the vacuum pump 2 increased by flowing the abnormality measurement gas (step 30).
At this time, it is determined whether or not the increased parameter (that is, an abnormal value is indicated) is within the range of the “SURGE” level and the “DIP” level. It may be configured to output. In this case, the server 6 is configured to include an audio device. This warning is performed separately from an urgent warning and the previous stage.
This determination is made based on the reference values of the “SURGE” level and “DIP” level for each parameter stored in the storage unit 66. This reference value is updated sequentially in the course of many processes. That is, it is possible to set a more appropriate reference value by incorporating the evaluation of processing such that each reference value is too high or too low.
The update of the reference value is performed by the CPU 61 changing the value of the reference value stored in the storage unit 66 by an input from the administrator.
This reference value may be set finely and in detail according to the conditions of the place where the vacuum pump 2 is installed, the type of gas used, the years of use of the vacuum pump, the total usage time, and the like.
Note that the warning to the administrator may be configured such that the administrator of the server 6 visually recognizes the display device 64 to determine a sign that an abnormality has occurred in the vacuum pump 2.
　次に、サーバ６は、異常測定用ガスを流す動作を続行するか否かを判断する（ステップ４０）。この続行の判断については、異常測定用ガスを流し始めてからカウントを開始した流入継続時間や、事前に指定されたパラメータが、事前に設定された閾値に達した時点、などと設定しておく構成にしても良いし、サーバ６の管理者による動作停止の入力を受け付ける構成にしても良い。
　動作を続行する場合（ステップ４０：Ｙ）、サーバ６は異常測定用ガスを流し続け（ステップ２０）、一方、動作を続行しない場合（ステップ４０：Ｎ）、サーバ６は一連の動作を終了する（エンド）。 Next, the server 6 determines whether or not to continue the operation of flowing the abnormality measurement gas (step 40). This determination of continuation is configured such that the inflow continuation time when counting starts after the abnormality measurement gas has started flowing, the time when a parameter specified in advance reaches a preset threshold value, etc. Alternatively, a configuration may be adopted in which an operation stop input by the administrator of the server 6 is received.
When the operation is continued (step 40: Y), the server 6 continues to flow the abnormality measurement gas (step 20). On the other hand, when the operation is not continued (step 40: N), the server 6 ends the series of operations. (End).
　上述した構成により、本発明の実施形態１に係る真空ポンプの判断システム２０が備わる真空ポンプ２では、規定以上の量の異常測定用ガスを流すことで、真空ポンプ２についてモニタリングしている各種パラメータ（たとえば、電流の数値、電圧の数値、温度の数値、振動の数値や、各々を組み合わせた数値など）の可変要因を増長させ、そうして得られるパラメータの変動数値（図２）から、事前に、発生が予測される真空ポンプ２の異常状態についてその目安や予定・予測を早期に立てることができる。
　その結果、真空ポンプ２の異常発生について、早期に検知できたり、あるいは検知の確率を向上させたり、または、故障診断の信頼性を向上させることができる。
　また、当該予測に基づき、異常状態が発生する前に真空ポンプ２のメンテナンスを行うことができるので、真空ポンプ２の寿命を延長させることができる。 With the configuration described above, in the vacuum pump 2 provided with the vacuum pump determination system 20 according to the first embodiment of the present invention, various parameters monitored for the vacuum pump 2 by flowing an abnormal measurement gas in an amount more than a specified amount. Increase the variable factors (for example, the current value, voltage value, temperature value, vibration value, combined value, etc.), and from the parameter fluctuation values (Figure 2) obtained in advance, In addition, it is possible to make a rough estimate, schedule, and prediction of the abnormal state of the vacuum pump 2 that is predicted to occur at an early stage.
As a result, the occurrence of an abnormality in the vacuum pump 2 can be detected at an early stage, the detection probability can be improved, or the reliability of failure diagnosis can be improved.
Moreover, since the vacuum pump 2 can be maintained before the abnormal state occurs based on the prediction, the life of the vacuum pump 2 can be extended.
（ｉｉｉ）実施形態２の詳細
　次に、再度図１を用いて、本発明の実施形態２に係る真空ポンプの判断システム２１について説明する。
　本発明の実施形態２では、先述した実施形態１と同様に、真空チャンバ１１や、ターボ分子ポンプなどの真空ポンプ１２から構成されるプロセス装置１から排出された排出ガスは、真空配管４を通ってドライポンプである真空ポンプ２を経由し、排気配管５を通って除害装置３へ運ばれる。
　しかし、本実施形態２では、サーバ６のＣＰＵ６１は、ＲＯＭ６２などに保存された真空ポンプの判断システム２１用アプリケーションなどのプログラムによって、ＲＡＭ６３において、真空ポンプの判断システム２１の制御に係わる各種演算である様々な数値計算や情報処理、機器制御などを行う。
　また、本実施形態２では、表示装置６４は真空ポンプの判断システム２１に係るパラメータの増減を表示する。 (Iii) Details of Embodiment 2 Next, a determination system 21 for a vacuum pump according to Embodiment 2 of the present invention will be described using FIG. 1 again.
In the second embodiment of the present invention, the exhaust gas discharged from the process apparatus 1 including the vacuum chamber 11 and the vacuum pump 12 such as a turbo molecular pump passes through the vacuum pipe 4 as in the first embodiment. Then, it is transported to the abatement device 3 through the exhaust pipe 5 via the vacuum pump 2 which is a dry pump.
However, in the second embodiment, the CPU 61 of the server 6 performs various calculations related to the control of the vacuum pump determination system 21 in the RAM 63 by a program such as an application for the vacuum pump determination system 21 stored in the ROM 62 or the like. Performs various numerical calculations, information processing, and device control.
Further, in the second embodiment, the display device 64 displays the increase / decrease in parameters related to the determination system 21 of the vacuum pump.
　本発明の実施形態２に係る真空ポンプの判断システム２１では、真空ポンプ２に、真空チャンバ１１用のクリーニングガスが、当該真空ポンプ２に配設されるプロセス装置１側の真空配管４から流される構成にする。
　つまり、真空ポンプの判断システム２１では、真空チャンバ１１用のクリーニングガスを真空ポンプ２に流しながら、真空ポンプ２内部のクリーニングを行うと同時に、真空ポンプ２に関わる、通常の数値に比べて増長していた（すなわち、真空ポンプ２が異常状態であることを示していた）パラメータが元の数値に戻る過程（たとえば、図２において、「ＳＵＲＧＥ」レベルを超えていた値や「ＤＩＰ」レベルを下回っていた値が、「ＳＵＲＧＥ」レベルと「ＤＩＰ」レベルの範囲内におさまる様子）を表示装置６４に表示する。 In the vacuum pump determination system 21 according to the second embodiment of the present invention, the cleaning gas for the vacuum chamber 11 is caused to flow to the vacuum pump 2 from the vacuum pipe 4 on the process apparatus 1 side provided in the vacuum pump 2. Make the configuration.
That is, in the vacuum pump determination system 21, while cleaning the inside of the vacuum pump 2 while flowing the cleaning gas for the vacuum chamber 11 to the vacuum pump 2, the vacuum pump 2 is increased in comparison with the normal values related to the vacuum pump 2. The parameters that have been changed (ie, the vacuum pump 2 was in an abnormal state) returned to the original value (for example, in FIG. 2, the value that exceeded the “SURGE” level or dropped below the “DIP” level). The display device 64 displays a state in which the stored value falls within the range of the “SURGE” level and the “DIP” level).
　なお、使用するクリーニングガスは、ＮＦ3（三フッ化窒素）や、Ｆ2（フッ素）などの堆積物を低減するガスであることが望ましい。
　さらに、上述した構成では、プロセス装置１側の真空配管４からクリーニングガスを流す構成にしたが、これに限られることはない。たとえば、プロセス装置１（真空チャンバ１１）に真空チャンバ１１用のクリーニングガスを流すタイミングと同じタイミングで、真空ポンプ２にも当該クリーニングガスを流す（流用する）構成にしても良い。 The cleaning gas used is desirably a gas that reduces deposits such as NF 3 (nitrogen trifluoride) and F 2 (fluorine).
Furthermore, in the above-described configuration, the cleaning gas is allowed to flow from the vacuum pipe 4 on the process apparatus 1 side, but is not limited thereto. For example, the cleaning gas may be supplied to the vacuum pump 2 at the same timing as the cleaning gas for the vacuum chamber 11 is supplied to the process apparatus 1 (vacuum chamber 11).
　図４は、本発明の実施形態２に係る真空ポンプの判断システム２１の動作を説明するためのフローチャートである。
　本実施形態２に係る真空ポンプの判断システム２１では、サーバ６は、まず、真空ポンプ２の上流に配設されたプロセス装置１がプロセス中か否かを判断する（ステップ５０）。
　プロセス装置１がプロセス中であると判断された場合（ステップ５０：Ｙ）、サーバ６はプロセス中か否かの監視を続ける。あるいは、ここで一連の動作を終了する構成にしても良い（エンド）。
　一方、プロセス装置１がプロセス中であると判断されなかった場合（ステップ５０：Ｎ）、サーバ６は、真空ポンプ２へクリーニングガスを流入させる（ステップ６０）。
　次に、サーバ６は、クリーニングガスを流したことで降下した（すなわち、正常値に戻った）パラメータを示す分析画面を表示装置６４に表示する（ステップ７０）。
　このとき、降下したパラメータが「ＳＵＲＧＥ」レベルと「ＤＩＰ」レベルの範囲内にあるか否かを判断し、範囲内にない場合に、警告音などのワーニングを出す構成にしても良い。この判断は、記憶部６６に記憶されている基準値と比較することにより行う。
　なお、その場合は、サーバ６には音声装置を備える構成にする。
　また、サーバ６の管理者が表示装置６４を目視することで、その判断をする構成にしても良い。 FIG. 4 is a flowchart for explaining the operation of the vacuum pump determination system 21 according to the second embodiment of the present invention.
In the vacuum pump determination system 21 according to the second embodiment, the server 6 first determines whether or not the process apparatus 1 disposed upstream of the vacuum pump 2 is in process (step 50).
When it is determined that the process device 1 is in process (step 50: Y), the server 6 continues to monitor whether or not it is in process. Or you may make it the structure which complete | finishes a series of operation | movement here (end).
On the other hand, if it is not determined that the process apparatus 1 is in process (step 50: N), the server 6 causes the cleaning gas to flow into the vacuum pump 2 (step 60).
Next, the server 6 displays on the display device 64 an analysis screen indicating the parameter that has been lowered (that is, returned to the normal value) by flowing the cleaning gas (step 70).
At this time, it may be determined whether or not the lowered parameter is within the range of the “SURGE” level and the “DIP” level, and if it is not within the range, a warning sound or the like may be issued. This determination is made by comparing with a reference value stored in the storage unit 66.
In this case, the server 6 is configured to include an audio device.
The administrator of the server 6 may make a determination by visually checking the display device 64.
　次に、真空ポンプの判断システム２１のサーバ６は、クリーニングガスを流す動作を続行するか否かを判断する（ステップ８０）。この続行の判断については、クリーニングガスを流し始めてからカウントを開始した流入継続時間や、事前に指定されたパラメータが、事前に設定された閾値に達した時点、などと設定しておく構成にしても良いし、サーバ６の管理者による動作停止の入力を受け付ける構成にしても良い。
　動作を続行する場合（ステップ８０：Ｙ）、サーバ６はクリーニングガスを流し続け（ステップ６０）、一方、動作を続行しない場合（ステップ８０：Ｎ）、サーバ６は一連の動作を終了する（エンド）。
　クリーニングガスを流すことで、真空ポンプ２のパラメータの変化によって、当該真空ポンプ２の状態がどの程度改善しているかも判断できる。 Next, the server 6 of the vacuum pump determination system 21 determines whether or not to continue the operation of flowing the cleaning gas (step 80). The determination of this continuation is configured such that the inflow continuation time when counting is started after the cleaning gas starts flowing, the time when a parameter specified in advance reaches a preset threshold value, and the like are set. Alternatively, a configuration may be adopted in which an operation stop input by the administrator of the server 6 is received.
When the operation is continued (step 80: Y), the server 6 continues to flow the cleaning gas (step 60). On the other hand, when the operation is not continued (step 80: N), the server 6 ends the series of operations (end). ).
By flowing the cleaning gas, it can be determined how much the state of the vacuum pump 2 is improved by the change in the parameters of the vacuum pump 2.
　上述した構成により、本発明の実施形態２に係る真空ポンプの判断システム２１が備わる真空ポンプ２では、モニタリングしているパラメータの変化から当該異常状態が解除されたことを判断することができる。
　その結果、真空ポンプ２を取り外すことなく（交換せずに）メンテナンスを行うことができる。また、異常状態が発生する前にメンテナンスを行うので、真空ポンプ２の寿命を延長させることができる。
　本発明での特定のガスは、プロセス装置に規定されているプロセスガス以外としたが、通常のプロセス装置の稼働中に流される量以上の流量を流すのであれば、プロセスガスとしても良い。 With the configuration described above, the vacuum pump 2 provided with the vacuum pump determination system 21 according to the second embodiment of the present invention can determine that the abnormal state has been canceled based on a change in the monitored parameter.
As a result, maintenance can be performed without removing (without replacing) the vacuum pump 2. Moreover, since the maintenance is performed before the abnormal state occurs, the life of the vacuum pump 2 can be extended.
Although the specific gas in the present invention is other than the process gas specified in the process apparatus, the process gas may be used as long as the flow rate is higher than the amount that flows during the operation of the normal process apparatus.
　なお、本発明の実施形態１および実施形態２は、組み合わせる構成にしても良い。 The first and second embodiments of the present invention may be combined.
　　　１　プロセス装置
　　　２　真空ポンプ（ドライポンプ）
　　　３　除害装置
　　　４　真空配管
　　　５　排気配管
　　　６　サーバ
　　１１　真空チャンバ
　　１２　真空ポンプ（ターボ分子ポンプ）
　　２０　真空ポンプの判断システム
　　２１　真空ポンプの判断システム
　　６１　ＣＰＵ
　　６２　ＲＯＭ
　　６３　ＲＡＭ
　　６４　表示装置
　　６５　通信部
　　６６　記憶部
　　６７　バスライン 1 Process equipment 2 Vacuum pump (dry pump)
3 Detoxifier 4 Vacuum piping 5 Exhaust piping 6 Server 11 Vacuum chamber 12 Vacuum pump (turbomolecular pump)
20 Vacuum Pump Judgment System 21 Vacuum Pump Judgment System 61 CPU
62 ROM
63 RAM
64 Display device 65 Communication unit 66 Storage unit 67 Bus line

Claims (9)

  1. 　真空ポンプに発生が予測される異常を、前記真空ポンプに関する各種のパラメータにより、事前に判断する真空ポンプの判断システムであって、
    　前記真空ポンプが配設される装置の非稼働中に、当該装置の稼働中に当該装置に流される量以上の量の判断用ガスを流す判断用ガス流入手段と、
    　前記判断用ガス流入手段により流される前記判断用ガスに起因した前記パラメータを取得するパラメータ取得手段と、
    を備えることを特徴とする真空ポンプの判断システム。
    A vacuum pump determination system that determines in advance an abnormality that is predicted to occur in a vacuum pump based on various parameters related to the vacuum pump,
    A judgment gas inflow means for causing a judgment gas to flow in an amount equal to or larger than an amount to be flowed to the apparatus during operation of the apparatus during non-operation of the apparatus in which the vacuum pump is disposed;
    Parameter acquisition means for acquiring the parameter resulting from the determination gas flowing by the determination gas inflow means;
    A determination system for a vacuum pump comprising:
  2. 　取得した前記パラメータの変化を取得するパラメータ変化取得手段を備え、
    　前記パラメータ変化取得手段により取得した前記パラメータの変化と、予め記憶されている所定の前記パラメータの変化の基準値を比較することにより、真空ポンプに発生する異常の有無を判断する判断手段をさらに備えたことを特徴とする請求項１に記載の真空ポンプの判断システム。
    Parameter change acquisition means for acquiring the acquired change of the parameter,
    The apparatus further comprises determination means for determining whether or not there is an abnormality occurring in the vacuum pump by comparing the parameter change acquired by the parameter change acquisition means with a predetermined reference value of the parameter change stored in advance. The determination system for a vacuum pump according to claim 1.
  3. 　前記パラメータまたは前記パラメータの変化を表示する表示手段を備えたことを特徴とする請求項１又は請求項２に記載の真空ポンプの判断システム。
    The vacuum pump determination system according to claim 1 or 2, further comprising display means for displaying the parameter or a change in the parameter.
  4. 　前記判断用ガスは、前記装置の稼働中に当該装置に流されるプロセスガス以外のガスであることを特徴とする請求項１から請求項３のいずれか１項に記載の真空ポンプの判断システム。
    The determination system for a vacuum pump according to any one of claims 1 to 3, wherein the determination gas is a gas other than a process gas that flows into the apparatus during operation of the apparatus.
  5. 　前記判断用ガスは、窒素またはアルゴンであることを特徴とする請求項４に記載の真空ポンプの判断システム。
    5. The determination system for a vacuum pump according to claim 4, wherein the determination gas is nitrogen or argon.
  6. 　前記判断用ガスは、前記装置の稼働中に当該装置に流されるプロセスガスであることを特徴とする請求項１から請求項３のいずれか１項に記載の真空ポンプの判断システム。
    The determination system for a vacuum pump according to any one of claims 1 to 3, wherein the determination gas is a process gas that flows into the apparatus during operation of the apparatus.
  7. 　真空ポンプに発生が予測される異常を、前記真空ポンプに関する各種のパラメータにより、事前に判断する真空ポンプの判断システムであって、
    　前記真空ポンプが配設される装置の非稼働中に、前記真空ポンプの内部をクリーニングするガスを流すクリーニングガス流入手段と、
    　前記クリーニングガス流入手段により流される前記ガスに起因した前記パラメータを取得するパラメータ取得手段と、
    を備えることを特徴とする真空ポンプの判断システム。
    A vacuum pump determination system that determines in advance an abnormality that is predicted to occur in a vacuum pump based on various parameters related to the vacuum pump,
    Cleaning gas inflow means for flowing a gas for cleaning the inside of the vacuum pump during non-operation of the apparatus in which the vacuum pump is disposed;
    Parameter acquisition means for acquiring the parameter resulting from the gas flowing by the cleaning gas inflow means;
    A determination system for a vacuum pump comprising:
  8. 　前記パラメータ取得手段で取得した前記パラメータを表示する表示手段をさらに備えたことを特徴とする請求項７に記載の真空ポンプの判断システム。
    8. The vacuum pump determination system according to claim 7, further comprising display means for displaying the parameters acquired by the parameter acquisition means.
  9. 　請求項１から請求項８のいずれか１項に記載の真空ポンプの判断システムを備えることを特徴とする真空ポンプ。 A vacuum pump comprising the vacuum pump determination system according to any one of claims 1 to 8.
PCT/JP2016/082228 2015-11-06 2016-10-31 Vacuum pump determination system and vacuum pump WO2017077970A1 (en)

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JP7374158B2 (en) 2021-10-15 2023-11-06 株式会社荏原製作所 Product removal device, treatment system and product removal method
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