WO2017056276A1

WO2017056276A1 - Electronic component insertion and assembly machine

Info

Publication number: WO2017056276A1
Application number: PCT/JP2015/077869
Authority: WO
Inventors: 拓也永石
Original assignee: 富士機械製造株式会社
Priority date: 2015-09-30
Filing date: 2015-09-30
Publication date: 2017-04-06
Also published as: JPWO2017056276A1; JP6682546B2

Abstract

Provided is an electronic component insertion and assembly machine equipped with a cut-and-clinch device (20), wherein a backup preliminary operation, in which a cut-and-clinch head (21) is moved below a component mounting position on a circuit board (14) and raised up to a backup position, is initiated before the timing at which an operation, in which an electronic component (12) supplied by a component supply device (13) is picked up by a mounting head (17) and the mounting head is moved above the component mounting position on the circuit board, is complete. For example, the backup preliminary operation of the cut-and-clinch head is initiated at the same time as the electronic component pickup operation of the mounting head is initiated. Due to this configuration, when the operation in which the mounting head is moved above the component mounting position on the circuit board has completed, the mounting head can be immediately lowered without any delay at the component mounting position to carry out the cut-and-clinch operation.

Description

Electronic component insertion assembly machine

The present invention performs a clinching operation for inserting a lead of an electronic component into a through hole of a circuit board from above and bending the lead protruding downward from the through hole, or a cut and clinching operation for cutting and bending the lead. The present invention relates to an electronic component insertion assembly machine equipped with a function to perform.

As this type of electronic component inserting and assembling machine, for example, as described in Patent Document 1 (Japanese Patent Laid-Open No. 60-189291), a circuit board is held movably in an XY direction by an XY table, A mounting head for picking up electronic components supplied by the component supply device is arranged so as to be movable in the XYZ directions, and a clinch head for performing a clinch operation is arranged below the circuit board so as to be movable in the Z direction (vertical direction). In response to a component mounting position command for each electronic component to be supplied, the circuit board is moved in the XY direction by an XY table to align the circuit board component mounting position above the clinch head, and the electronic component The picked-up mounting head is moved above the component mounting position of the circuit board and the mounting head is lowered to connect the lead of the electronic component to the circuit After inserted from above into the through holes of the plate, there is that to perform the clinching operation by raising the clinch head.

However, in this configuration, the circuit board must be moved in the XY direction by the XY table for each component mounting position of the circuit board, and the angle correction in the θ direction of the electronic component mounted on the circuit board (horizontal direction) (Angle correction) is not possible, so there is a disadvantage that versatility is low.

Therefore, in recent years, the circuit board carried by the conveyor is clamped and fixed at a fixed position, and both the mounting head and the clinch head can be driven in the XYZ direction and the θ direction, respectively, and the supplied electronic parts For each mounting position, both the mounting head and the clinch head are driven in the XYZ direction and θ direction, respectively.

JP 60-189291 A

In the conventional configuration, after moving the mounting head picking up the electronic component above the component mounting position on the circuit board, the clinch head is moved below the component mounting position on the circuit board to move the clinch head After the backup operation for raising to the backup position that abuts on or close to the lower surface of the circuit board is completed, the mounting head is lowered and the lead of the electronic component is inserted into the through hole of the circuit board from above, and the clinch head is The clinch is operated. At this time, if it is necessary to correct the angle in the θ direction between the mounting head and the clinch head, the angle correction in the θ direction is performed while each head is moving or after the movement is stopped.

However, in this configuration, after the operation of moving the mounting head picked up the electronic component to the position above the component mounting position of the circuit board is completed, the backup operation of the clinch head is completed until the component mounting position of the circuit board is completed. The mounting head has to wait on the upper side, and there is a disadvantage that the cycle time becomes longer and the productivity is lowered.

Therefore, the problem to be solved by the present invention is to provide an electronic component inserting and assembling machine capable of shortening cycle time and improving productivity.

In order to solve the above-described problems, the present invention picks up an electronic component supplied by a component supply device, moves it upward above the component mounting position of the circuit board, and lowers the electronic component lead to the circuit board. A mounting head that is inserted into the through hole from above, a mounting head drive device that drives the mounting head in the XYZ direction and the θ direction, and a clinch that bends the lead that is inserted into the through hole of the circuit board and protrudes downward. A clinch head that performs a cut and clinch operation to cut or bend the operation (the “clinch head” of the present invention is a concept that also includes a “cut and clinch head” that performs a cut and clinch operation), and the circuit board A clinch head driving device for driving the clinch head in the XYZ direction and the θ direction below the head, and the mounting head driving An electronic component inserting and assembling machine including an apparatus and a control device for controlling the operation of the clinch head driving device, wherein the control device picks up the electronic component supplied by the component supply device with the mounting head and mounts the electronic component Prior to the completion of the operation of moving the head above the component mounting position of the circuit board, the clinch head is moved below the component mounting position of the circuit board so that the backup position on the lower surface side of the circuit board is reached. This is characterized in that a backup preceding operation for starting up is started.

In this configuration, the mounting head starts the backup preceding operation that raises the clinch head to the backup position prior to the completion of the operation of moving the mounting head above the component mounting position of the circuit board. Can be shortened or zeroed in the waiting time above the component mounting position of the circuit board, and accordingly, the cycle time can be shortened and the productivity can be improved.

In this case, the start timing of the backup preceding operation of the clinch head may be any timing as long as the operation of moving the mounting head to above the component mounting position of the circuit board is completed. Although the effect of shortening the waiting time of the mounting head above the component mounting position of the circuit board can be obtained, preferably, the start timing of the backup advance operation is an operation of moving the mounting head above the component mounting position of the circuit board. It is preferable that the time before the completion of the backup is preceded by the time required from the start to the completion of the backup advance operation. In this way, the time that the mounting head waits above the component mounting position of the circuit board can be made zero.

Alternatively, the clinch head may start the backup preceding operation at the same time when the mounting head starts the electronic component pickup operation. In this way, before the operation of moving the mounting head to the position above the component mounting position of the circuit board is completed, the backup preceding operation of the clinch head can be completed with a margin, and the electronic components of the mounting head can be picked up. The start timing of the operation can be used as it is as the start timing of the backup preceding operation of the clinch head, and the start timing of the backup preceding operation can be easily determined.

FIG. 1 is a block diagram showing a configuration of a control system of an electronic component insertion assembly machine according to an embodiment of the present invention. FIG. 2 is a perspective view showing a configuration of a cut and clinching apparatus according to an embodiment of the present invention. FIG. 3 is a perspective view showing the configuration of the cut and clinch head. 4A and 4B are diagrams for explaining the cut-and-clinch operation of the cut-and-clinch head. FIG. 5 is a diagram for explaining the positional relationship among the mounting head, the circuit board, and the cut and clinch head and the backup preceding operation.

Hereinafter, an embodiment in which the mode for carrying out the present invention is applied to an electronic component inserting and assembling machine equipped with a cut and clinching apparatus will be described.

In the electronic component inserting and assembling machine, a component supply device 13 for supplying an electronic component 12 with leads 11 (see FIGS. 4 to 5) is set to be replaceable. Further, the electronic component inserting and assembling machine includes a board transfer device 15 for transferring the circuit board 14 (see FIGS. 4 to 5), and a board clamp device for clamping the circuit board 14 carried into a predetermined position by the board transfer device 15. 18, a mounting head 17 (see FIG. 5) that picks up the electronic component 12 supplied by the component supply device 13 and inserts the lead 11 of the electronic component 12 into the through hole 16 of the circuit board 14 from above, and a mounting head A mounting head driving device 19 for driving 17 in the XYZ direction and the θ direction, and a cut and clinch device for performing a cut and clinch operation for cutting and bending the lead 11 inserted into the through hole 16 of the circuit board 14 and projecting downward. 20 etc. are provided. The cut and clinching device 20 is obtained by adding a function of cutting the lead 11 to the clinching device that performs only the clinching operation for bending the lead 11, and the present invention is applied to either the cut and clinching device 20 or the clinching device. Is also applicable.

Hereinafter, the configuration of the cut and clinching apparatus 20 will be described with reference to FIGS.
The cut and clinch device 20 includes a cut and clinch head 21 that performs a cut and clinch operation, an X-axis drive device 22 that drives the head 21 in the X direction (the conveyance direction of the circuit board 14), and the head 21 in the X direction. A Y-axis drive device 23 that drives in a Y direction that is orthogonal to the horizontal direction, a Z-axis drive device 24 that drives the head 21 in the Z direction (vertical direction), and a head 21 that moves the head 21 in the θ direction (centering on the Z axis). And a θ-axis drive device 25 that is driven in the direction of rotation).

The cut-and-clinch head 21 is driven by the X-axis, Y-axis, Z-axis, and θ-axis drive devices 22 to 25 (cut-and-cut) below the circuit board 14 that is carried in by the substrate transport device 15 and clamped by the substrate clamp device 18. It is driven in the XYZ direction and the θ direction by a clinch head driving device. The cut and clinching head 21 includes a head main body 28, a pair of first

movable parts

29a and 29b held by the head main body 28 so as to be movable in the horizontal direction, and a pair of first

movable parts

29a and 29b. The distance between the pair of first

movable parts

29a and 29b is determined by moving the pair of second

movable parts

30a and 30b held movably in the horizontal direction and the pair of first

movable parts

29a and 29b close to each other. The distance between the pair of second

movable portions

30a and 30b is adjusted by moving the first movable portion drive device 31 that is adjusted according to the distance between the leads 11 of the component 12 and the pair of second

movable portions

30a and 30b. A pair of second movable

part drive devices

32a and 32b to be changed is provided. The first movable part drive device 31 is attached to the head main body 28, and the pair of second movable

part drive devices

32a and 32b is attached to the pair of first

movable parts

29a and 29b. As shown in FIG. 4,

lead insertion holes

49a and 49b for inserting the lead 11 of the electronic component 12 from above are formed in each of the pair of first

movable portions

29a and 29b, and the pair of second

movable portions

30a and 29b. Each of 30b is formed with

lead insertion holes

50a and 50b for inserting the lead 11 of the electronic component 12 from above.

As shown in FIG. 2, the X-axis drive device 22 for driving the cut and clinching head 21 in the X direction moves the X slider 34 by an X-axis ball screw mechanism 33 using an X-axis motor (not shown) as a drive source. It is configured to move in the X direction along the X axis guide 35, and the Y axis drive device 23 is attached on the X slider 34.

The Y-axis drive device 23 is configured to move a Y slider 38 in the Y direction along a Y-axis guide 39 by a Y-axis ball screw mechanism 37 using a Y-axis motor (not shown) as a drive source. A Z-axis drive device 24 is attached to the Y slider 38.

The Z-axis drive device 24 is configured to move the Z slider 43 in the Z direction along the Z-axis guide 44 by a Z-axis ball screw mechanism 42 using a Z-axis motor 41 (for example, a servo motor) as a drive source. The θ-axis drive device 25 is attached to the Z slider 43. The Z-slider 43 holds the cut-and-clinch head 21 so as to be rotatable in the θ direction by the θ-axis drive device 25.

The θ-axis drive device 25 is configured to rotate a θ-axis rotary table 48 in the θ direction by a θ-axis drive mechanism 47 using a θ-axis motor 46 as a drive source, and cut and clinch on the θ-axis rotary table 48. A head main body 28 of the head 21 is attached, and the cut and clinch head 21 rotates in the θ direction integrally with the θ-axis rotary table 48.

The operation of the electronic component inserting and assembling machine configured as described above is controlled by a control device 51 (see FIG. 1) including one or a plurality of computers. As shown in FIG. 1, the control device 51 of the electronic component inserting and assembling machine includes an input device 52 (input means) such as a keyboard, a mouse, and a touch panel, and a hard disk, RAM, ROM, etc. for storing various programs and data. The storage device 53 (storage means) is connected to a display device 54 such as a liquid crystal display or a CRT.

The control device 51 of the electronic component inserting and assembling machine controls the operation of the component supply device 13, the substrate transport device 15, the substrate clamp device 18, the mounting head drive device 19, the cut and clinching device 20, etc. The operation of mounting the component 12 is performed in the following order.

First, both side edges of the circuit board 14 carried into a predetermined position in the electronic component inserting and assembling machine are clamped by the board clamping device 18 by the board conveying device 15. Then, the control device 51 of the electronic component inserting and assembling machine determines a component mounting position for mounting the electronic component 12 supplied by the component supply device 13 on the circuit board 14 according to a production job (production program). Then, the cut and clinching head 21 waiting at a standby position away from the lower surface of the circuit board 14 is moved in the XY directions by the X-axis driving device 22 and the Y-axis driving device 23, so that the cutting and clinching head 21 is moved. A backup preceding operation is performed in which the circuit board 14 is moved downward to the component mounting position and raised to a backup position on the lower surface side of the circuit board 14 (a height position in contact with or close to the lower surface of the circuit board 14). At this time, if it is necessary to correct the angle of the cut and clinching head 21 in the θ direction, the θ direction drive 25 corrects the angle of the cut and clinching head 21 in the θ direction during the backup preceding operation.

In parallel with this backup preceding operation, the mounting head drive device 19 moves the mounting head 17 to the component pickup position of the component supply device 13, and the electronic component 12 supplied by the component supply device 13 is moved by the mounting head 17. Then, the mounting head 17 is moved above the component mounting position of the circuit board 14. At this time, if it is necessary to correct the angle of the electronic component 12 in the θ direction, the mounting head drive device 19 corrects the angle of the mounting head 17 in the θ direction while the mounting head 17 is moving, so that the θ direction of the electronic component 12 is corrected. Correct the angle.

When the operation of moving the mounting head 17 to the position above the component mounting position of the circuit board 14 is completed, the cut-and-clinch head 21 has already been raised to the backup position by the above-described backup advance operation and is in a standby state. Therefore, when the operation of moving the mounting head 17 to the position above the component mounting position of the circuit board 14 is completed, the mounting head 17 is immediately lowered without waiting at that position, and the two leads 11 of the electronic component 12 are moved. Are inserted into the two through holes 16 of the circuit board 14.

As a result, as shown in FIG. 4A, the two leads 11 projecting downward from the two through holes 16 of the circuit board 14 are connected to the pair of first

movable parts

29a and 29b of the cut and clinch head 21. The

lead insertion holes

49a and 49b are inserted into the

lead insertion holes

50a and 50b of the pair of second

movable portions

30a and 30b. In this state, as shown in FIG. 4B, by moving the pair of second

movable parts

30a, 30b relative to the pair of first

movable parts

29a, 29b by the second movable part driving device 32, The unnecessary part of the tip of the two leads 11 of the electronic component 12 is cut, and the part protruding from the through hole 16 of each lead 11 after cutting is bent along the lower surface of the circuit board 14 to be placed on the circuit board 14. 12 is temporarily fixed. At this time, the direction in which the lead 11 is bent (the moving direction of the second

movable parts

30a and 30b) may be either the inner side or the outer side.

After such a cut and clinching operation is completed and the mounting of the electronic component 12 to the circuit board 14 is completed, both the mounting head 17 and the cut and clinching head 21 are in a movable state. If the next component mounting position is determined, immediately after the operation of picking up the electronic component 12 supplied by the component supply device 13 by the mounting head 17 is started, the backup preceding operation of the cut and clinching head 21 described above is started. To start. At this time, if it is necessary to correct the angle of the mounting head 17 and the cut and clinching head 21 in the θ direction, the angle correction of the

heads

17 and 21 in the θ direction is performed while the

heads

17 and 21 are moving.

As a result, when the operation of moving the mounting head 17 picking up the electronic component 12 to the upper position of the next component mounting position of the circuit board 14 is completed, the cut-and-clinch head 21 has already performed the circuit board by the backup preceding operation described above. When the operation of moving the mounting head 17 to the position above the next component mounting position on the circuit board 14 is completed, the position rises to the backup position immediately below the next component mounting position of 14 and is in a standby state. Without immediately waiting, the mounting head 17 is immediately lowered, and the two leads 11 of the electronic component 12 are inserted into the two through holes 16 at the next component mounting position of the circuit board 14. Thereafter, the cut and clinching head 21 is operated to perform the cut and clinching operation, and the electronic component 12 is mounted on the circuit board 14. Thereafter, the series of operations described above is repeated, and all the electronic components 12 designated by the production job are sequentially mounted on the circuit board 14.

As described above, conventionally, after the operation of moving the mounting head 17 picking up the electronic component 12 to above the component mounting position of the circuit board 14 is completed, the cut and clinch head 21 is moved to the component mounting position of the circuit board 14. After the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed, the backup operation for moving the mounting head 17 upward to the backup position is started. However, until the backup operation of the cut and clinching head 21 is completed, the mounting head 17 must be kept on the upper side of the component mounting position of the circuit board 14, and the cycle time is increased accordingly, resulting in a decrease in productivity. There was a drawback of doing.

In contrast, in this embodiment, the backup preceding operation of the cut and clinching head 21 is started at the same time as the operation of picking up the electronic component 12 supplied by the component supply device 13 by the mounting head 17 is started. Therefore, when the operation of moving the mounting head 17 picking up the electronic component 12 to the position above the component mounting position of the circuit board 14 is completed, the cut and clinching head 21 has already been moved to the backup position by the backup preceding operation described above. It is in a state of rising and waiting. Thereby, when the operation of moving the mounting head 17 to the position above the component mounting position of the circuit board 14 is completed, the mounting head 17 can be immediately lowered and cut and clinching can be performed without waiting at that position. The time that the mounting head 17 waits above the component mounting position of the circuit board 14 can be made zero, and accordingly, the cycle time can be shortened and the productivity can be improved.

In addition, in this embodiment, since the mounting head 17 starts the pickup operation of the electronic component 12 and the cut and clinching head 21 starts the backup preceding operation, the mounting head 17 is attached to the circuit board 14. Before the operation of moving the component mounting position upward is completed, the backup preceding operation of the cut and clinch head 21 can be completed with a margin, and the start timing of the pickup operation of the electronic component 12 of the mounting head 17 is cut as it is. It can be used as the start timing of the backup preceding operation of the AND clinching head 21, and there is also an advantage that it is easy to determine the start timing of the backup preceding operation.

However, according to the present invention, the start timing of the backup advance operation of the cut-and-clinch head 21 is any timing as long as the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed. In this case, the effect of shortening the waiting time of the mounting head 17 above the component mounting position of the circuit board 14 can be obtained. It is preferable that the time required for starting and completing the backup preceding operation is set ahead of the timing at which the operation of moving the board 14 above the component mounting position is completed. In this way, the time that the mounting head 17 waits above the component mounting position of the circuit board 14 can be made zero.

The present invention is not limited to an electronic component insertion assembly machine equipped with a cut and clinching device 20 that performs a cut and clinching operation, but can also be applied to an electronic component insertion assembly machine equipped with a clinching device that performs only a clinching operation. is there.

In addition, it goes without saying that the present invention can be implemented with various modifications within a range not departing from the gist, such as the configuration of the cut and clinching apparatus 20 may be appropriately changed.

DESCRIPTION OF SYMBOLS 11 ... Lead, 12 ... Electronic component, 13 ... Component supply apparatus, 14 ... Circuit board, 15 ... Board | substrate conveyance apparatus, 16 ... Through-hole, 17 ... Mounting head, 18 ... Board clamping apparatus, 19 ... Mounting head drive device, 20 ... Cut and clinch device, 21 ... Cut and clinch head, 22 ... X-axis drive device, 23 ... Y-axis drive device, 24 ... Z-axis drive device, 25 ... θ-axis drive device, 29a, 29b ... first movable part, 30a, 30b ... 2nd movable part, 31 ... 1st movable part drive device, 32 ... 2nd movable part drive device, 41 ... Z-axis motor, 50a, 50b ... Lead insertion hole, 51 ... Control device

Claims

A mounting head for picking up an electronic component supplied by the component supply device, moving the electronic component above the component mounting position of the circuit board, and lowering it to insert the lead of the electronic component into the through hole of the circuit board from above; A mounting head driving device for driving the mounting head in the XYZ direction and the θ direction, a clinching operation for bending a lead inserted into a through hole of the circuit board and projecting downward, or a cut-and-cut for cutting and bending the lead A clinch head that performs a clinch operation, a clinch head drive device that drives the clinch head in the XYZ direction and θ direction below the circuit board, a mounting head drive device, and a control device that controls the operation of the clinch head drive device In an electronic component insertion assembly machine equipped with
The control device precedes the timing at which the operation of picking up the electronic component supplied by the component supply device with the mounting head and moving the mounting head above the component mounting position of the circuit board is completed. An electronic component inserting and assembling machine for starting a backup preceding operation for moving a clinch head below a component mounting position of the circuit board and raising it to a backup position on the lower surface side of the circuit board.
The control device starts the backup preceding operation from the start of the clinch head before the completion of the operation to complete the operation of moving the mounting head above the component mounting position of the circuit board. 2. The electronic component inserting and assembling machine according to claim 1, wherein the electronic component inserting and assembling machine is preceded by a time required for the electronic component.
3. The electronic component inserting and assembling machine according to claim 1, wherein the control device starts a backup preceding operation of the clinch head at the same time as the pickup operation of the electronic component of the mounting head is started.