JPH10163276A - Thermocompression bonding device for work - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermocompression bonding device for work which has such a structure that can be reduced in size and simplified in constitution. SOLUTION: A thermocompression bonding head 30 and a backup member 33 are respectively attached to the upper and the lower projecting end sections of a frame 21. While the connector 6 of a work 3 placed on a receiving base 90 is positioned to the edge section of a substrate 1, the lower surface of the substrate 1 is supported from the bottom side by raising the backup member 33, and the thermocompression tool 31 of the head 30 is lowered and pressed against the connector 6. Consequently, the edge section of the substrate 1 and the connector 6 are held between the tool 31 and the member 33 from both the top and bottom sides, and the connector 6 is bonded by thermocompression to the substrate 1 through an ACF (anisotropically conductive film) tape 7. By moving the frame 21 in the X-direction along a feed screw 26, works 3 are successively bonded by thermocompression to the substrate 1 along one edge section of the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work thermocompression device for thermocompression-bonding a work to an edge of a substrate.

[0002]

2. Description of the Related Art A panel such as a liquid crystal panel or a plasma panel used as a display of an electronic device such as a personal computer or a television is assembled by bonding a work as a driver to an edge of a substrate such as a glass substrate. As a work, a TAB (Ta
A work manufactured by a method (pe Automated Bonding) is often used.

In a conventional thermocompression bonding apparatus for a work, a substrate is placed on a holding table in a horizontal posture, and in this state, the lead of the work is thermocompression bonded to an electrode on the edge of the substrate by a thermocompression head. It was like. Also, it is necessary to bond a large number of workpieces to the edges of a plurality of orthogonal sides of the substrate in a horizontal row, and therefore, the holding table holding the substrate is horizontally moved by the movable table, and the edges of the plurality of sides of the substrate are The workpiece is to be bonded.

[0004]

In recent years, the size of the panel has been increased in accordance with the wide screen of the television. For this reason, the horizontal movement range of the substrate by driving the movable table is widened, and the size of the thermocompression bonding apparatus tends to be further increased. For this reason, the installation space of the thermocompression bonding apparatus has been widened, and downsizing of the apparatus has been desired due to the restriction of the area of the installation factory.

The work is bonded to the substrate by pressing the lead against the electrode of the substrate with a thermocompression head while the lower surface of the edge of the substrate is received from below by the lower receiving member. In order to oppose the force, the support structure for the thermocompression bonding head and the support member must be firmly constructed, which has also been a major cause of an increase in the size of the apparatus.

Accordingly, an object of the present invention is to provide a thermocompression bonding apparatus for a work, whose structure can be reduced in size and simplified.

[0007]

According to the present invention, there is provided a thermocompression bonding apparatus for a work, comprising: a holding table for holding a substrate; and a work positioned at an edge of the substrate held by the holding table. A thermocompression bonding head, and a backup member that supports the pressing force of the thermocompression bonding head by supporting the edge of the substrate, and the thermocompression head and the backup member are attached to upper and lower portions of the same frame so as to face each other, In addition, moving means for moving the frame along the edge of the substrate is provided.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention having the above-described structure, according to the present invention, heats a work to the edge of the substrate by sandwiching the edge of the substrate and the work positioned at the edge by a thermocompression head and a backup member from above and below. Crimping and bonding. Further, by moving the thermocompression bonding head and the backup member along the edge of the substrate integrally, a large number of works are thermocompression-bonded to the edge of the substrate in a horizontal line.

An embodiment of the present invention will be described below with reference to the drawings. 1A and 1B are plan views of a substrate to which a work according to an embodiment of the present invention is bonded, FIG. 2 is a plan view of a thermocompression bonding apparatus for the work, and FIG. 3 is thermocompression bonding of the work. FIG. 4 is a side view of the sticking unit of the ACF, FIG. 5, FIG. 6, FIG. 7, FIG.
FIG. 11 is a plan view of a transfer unit of the thermocompression bonding apparatus for the work, FIG. 12, FIG.
14, 15, and 16 are explanatory views of the operation of the transfer unit of the thermocompression bonding apparatus for the work, FIG. 17 is a side view of the observation unit of the thermocompression bonding apparatus for the work, and FIGS. It is explanatory drawing of the thermocompression bonding operation | movement of the thermocompression bonding apparatus of FIG.

First, the substrate will be described with reference to FIG. FIG. 1A shows a substrate on which a work is being bonded, and FIG. 1B shows a substrate on which the work has been bonded. In FIG. 1A, a substrate 1 is a plasma panel and is formed by bonding two rectangular glass plates. Electrodes 2 of a circuit pattern are formed at a narrow pitch on the edges of three sides of the substrate 1. Reference numeral 3 denotes a work, which is formed by mounting a chip 5 as a driver on an elongated sub-substrate 4 such as a glass epoxy substrate, and bonding two connectors 6 to the edge thereof. This connector 6 is an FPC (Flexible P
printed circuit).

As shown in FIG. 1A, an anisotropic conductive tape (hereinafter referred to as “AC”) adhered on an electrode 2 at an edge of a substrate 1.
F)) and the free end of the connector 6 is bonded by thermocompression bonding. As shown in FIG. 1B, finally, the work 3 is bonded in a horizontal line to the edges of a total of three sides of two long sides and one short side of the substrate 1. In addition,
The work 3 on the long side is bonded to the front surface of the substrate 1, and the work 3 on the short side is bonded to the back surface of the substrate 1 by turning over. Usually, the types of the work 3 bonded to the long side and the work 3 bonded to the short side are different.

As will be described later, the ACF 7 is attached to the edge of the substrate 1 by the attaching means shown in FIG. The work 3 is subjected to ACF by the thermocompression bonding apparatus shown in FIGS.
7 are bonded by thermocompression bonding. Connector 6
Is formed by forming a large number of leads (not shown) at a narrow pitch on a film carrier (resin film).
Bonded to the substrate 1 via F7.

Next, a thermocompression bonding apparatus for a work will be described with reference to FIGS. 2 and 3, reference numeral 10 denotes a base on which the elements described below are assembled. Reference numeral 11 denotes a movable table provided at the center of the side of the base 10, and a Zθ table 1 on the Y table 12.
3 is placed. A circular holding table 15 is provided on a rotating shaft 14 projecting upward from the Zθ table 13. The substrate 1 is held on a holding table 15.

As shown in FIG. 2, Y table 12 has Y
Direction feed screw 16 is built in, and the Y-axis motor 17
Is driven and the feed screw 16 rotates, the Y table 11
Table 13 moves horizontally in the Y direction, thereby moving substrate 1 in the Y direction. Table 13
When a Z-axis motor (not shown) built in the motor is driven, the rotating shaft 14 moves up and down, and the substrate 1 also moves up and down. Also, a θ motor (not shown) built in the Zθ table 13
Is driven, the rotation shaft 14 rotates, and the substrate 1 rotates horizontally. That is, the position, height, and rotation angle of the substrate 1 in the Y direction are adjusted by the movable table 11.

In FIG. 2, conveyors 18 and 19 are provided on both sides of the movable table 11. One conveyor 18 carries the substrate 1 onto the movable table 11.
The other conveyor 19 carries out the substrate 1 on which the bonding of the work 3 has been completed to the next step. Conveyor 1
The transfer direction of the substrate 1 by 8, 19 is defined as the X direction.

Next, with reference to FIG.
The thermocompression bonding means for thermocompression bonding to the edge of will be described. 21
Is a substantially U-shaped frame. Frame 21 is base 2
2 is set up. The base 22 has a U-shaped cross section, and rails 23 that are long in the X direction are provided on the upper surfaces of both sides. The rail 2 is provided on the lower surface of the frame 21.
3 is provided with a slider 24 which is slidably fitted. A nut 25 is mounted at the center of the lower surface of the frame 21. The base portion 22 is provided with a long feed screw 26 (see also FIG. 2) in the X direction to which the nut 25 is screwed. When the feed screw 26 rotates by being driven by the motor 27, the nut 25 moves along the feed screw 26, whereby the frame 21 moves in the X direction.

Referring to FIG. 3, a thermocompression bonding head 30 is mounted on the upper end of the frame 21. A thermocompression bonding tool 31 is provided below the thermocompression bonding head 30.
Further, a vertically moving means 32 is provided on the upper part thereof. As the vertical movement means 32, for example, a cylinder is used.
When the vertical movement means 32 is driven, the thermocompression bonding tool 31 performs a vertical movement.

Next, referring to FIG. 3 and FIG.
The lower receiving means for supporting the lower surface of the edge portion from below will be described. 3 and 4, reference numeral 33 denotes a long plate-shaped backup member, which is provided on a block 34 which is horizontally long in the X direction. In FIG. 3, a slider 35 is provided on the back surface of the block 34. The slider 35 is slidably fitted on a vertical rail 36 provided on the lower end surface of the frame 21. As shown in FIG. 3, the thermocompression bonding tool 31 of the thermocompression bonding head 30 and the backup member 3
Reference numerals 3 are attached to the frame 21 so as to face each other so as to sandwich the edge of the substrate 1 from above and below.

In FIG. 4, a saw blade-shaped inclined surface 37 is formed on the lower surface of the block 34 at three places in the horizontal direction. Each of these inclined surfaces 37 is grounded to a roller 38. The roller 38 is mounted on a horizontal shaft 39. The left end of the shaft 39 is connected to a nut 40. The nut 40 is slidably provided on a horizontal rail 41. A horizontal feed screw 42 is screwed into the nut 41.

When the motor 43 is driven and the feed screw 42 rotates forward, the nut 40 moves along the feed screw 42 in the X1 direction. Then, the roller 38 rolls on the lower base 44 in the X1 direction, whereby the inclined surface 37 is pushed up by the roller 38, and the block 34 and the backup member 33 are raised. When the feed screw 42 rotates in the reverse direction, the nut 40
And the roller 38 moves in the X2 direction, and the block 34 and the backup member 33 descend. That is, the inclined surface 37, the roller 38, the nut 40, the feed screw 42, the motor 43, and the like constitute a means for vertically moving the backup member 33.

In FIG. 3, the backup member 33 rises to support the lower surface of the edge of the substrate 1 from below. In this state, the thermocompression bonding tool 31 descends and presses the connector 6 against the ACF 7 attached to the electrode 2 at the edge of the substrate 1 to perform thermocompression bonding. When the thermocompression bonding tool 31 is pressed against the connector 6 and the substrate 1 is supported from below by the backup member 33, a large upward reaction force is generated in the thermocompression bonding head 30, and a large downward reaction force is generated in the backup member 33. A reaction force occurs. However, since the thermocompression bonding head 30 and the backup member 33 are mounted on the same substantially U-shaped frame 21, the reaction forces cancel each other out inside the frame 21. Therefore, if the frame 21 is formed of a strong material such as a steel material, the above-mentioned reaction force can be sufficiently absorbed, so that the support structure of the thermocompression bonding head 30 and the backup member 33 can be reduced in size and simplified.

Next, a description will be given of the sticking means 50 for sticking the ACF 7 on the electrode 2 at the edge of the substrate 1 with reference to FIG. In FIG. 4, reference numeral 51 denotes a support plate serving as a main body of the attaching means 50, to which elements described below are assembled. Reference numeral 52 denotes a supply reel on which the ACF 7 is wound. The ACF 7 is adhered to the base tape 8. After the ACF 7 is adhered to the substrate 1 by a method described later, the base tape 8 is wound on a take-up reel 53. A motor 54 for rotating the take-up reel 53 is built in the support frame 51.

The ACF 7 wound on the supply reel 52 is fed by a feed roller 55 and is guided by guide rollers 56 and 5.
It is sent along 7, 62, 63. Feeding roller 55
A tension means 58 is provided between the guide roller 56 and the guide roller 56. The ACF 7 hangs down in the tension means 58, is sucked by a suction mechanism (not shown) of the tension means 58, and tension is applied so as not to be unnecessarily loosened.

A cutter unit 59 is provided between the guide rollers 56 and 57. ACF7
Is cut to a predetermined length by the blade 60 of the cutter unit 59. Reference numeral 61 denotes a receiving portion of the blade 60. The blade 60 cuts only the ACF 7 and does not cut the base tape 8.
Reference numeral 66 denotes a peeling roller for peeling the base tape 8 from the ACF 7.

A pressure bonding head 64 is provided between the guide roller 57 and the guide roller 62. Crimp head 6
A crimping tool 65 that is long in the X direction is provided at a lower portion of the tool 4. The crimping tool 65 moves up and down by a vertical movement mechanism built in the crimping head 64. 67 is a roller for holding the base tape 8 together with the guide roller 62,
The base tape 8 is fed to the take-up reel 53 by a desired length by rotation by a motor (not shown).

Next, the operation of attaching the ACF 7 to the substrate 1 by the attaching means 50 will be described with reference to FIGS. FIG. 5 shows a state in which the base tape 8 is along the lower surface of the crimping tool 65. During the operation described below, the edge of the substrate 1 is supported by the backup member 33 from below.

Now, as shown in FIG. 5, the cutter unit 59 is advanced rightward to cut the ACF 7 to a predetermined length. Next, while feeding the base tape 8 with the feed roller 67, the ACF 7 is fed out from the supply reel 52 by a predetermined length.
The CF 7 is moved along the lower surface of the crimping tool 65 (FIG. 6). The fed base tape 8 is automatically taken up by a take-up reel.

Next, the pressure bonding head 64 is lowered and the ACF 7
Is pressed against the substrate 1 (FIG. 7), and then the pressure bonding head 64 is raised to release the pressing (FIG. 8). Next, as shown in FIG. 9, the peeling roller 66 is advanced to the left,
The base tape 8 is forcibly peeled off from the ACF 7. When the peeling is completed, the peeling roller 66 is retracted to the right and returned to the original position (FIG. 10). As described above, the ACF 7 is peeled off from the base tape 8 and adhered on the electrode 2 of the substrate 1. By repeating the above operation, the substrate 1
ACFs 7 are adhered one after another on the electrode 2 at the edge of.

In FIG. 2, a plurality of magazines 70 (four in this example) are installed at the corners of the upper surface of the base 10.
The works 3 are stored in a stack in each magazine 70. Reference numeral 71 denotes a lifter for moving the magazine 70 up and down, and reference numeral 72 denotes a drive motor for the lifter. Magazine 70
Is adjusted to a level at which a desired work 3 can be taken out. Such a magazine mechanism is well known. Numeral 80 denotes a transfer unit for the work 3, which takes out the works 3 in the magazine 70 one by one,
The workpiece 3 is transferred to the receiving table 90. Next, the structure of the transfer unit 80 will be described with reference to FIG.

In FIG. 15, reference numeral 81 denotes a θ table on which a first chuck unit 82a and a second chuck unit 82b are mounted. The first chuck unit 82a and the second chuck unit 82b have the same structure, and each have a long main body 83, a feed screw 84 provided in the longitudinal direction of the main body 83, and a feed screw 84. Motor 85 and nut 8 screwed on feed screw 84
6, an arm 87 having a rear end portion connected to a nut 86,
A first chuck 88 attached to the tip of the arm 87
a and a second chuck element 88b.

When the motor 85 is driven to rotate the feed screw 84, the nut 86 moves along the feed screw 84, and the first chuck 88a and the second chuck 88b move in a horizontal direction independently of each other. Move forward and backward. That is, the feed screw 84, the motor 85, and the nut 86 constitute horizontal moving means for horizontally moving the first chuck 88a and the second chuck 88b.

In FIG. 15, the cradle 90 is a magazine 7
It is arranged at a position orthogonal to 0 (see also FIG. 2). As shown in FIGS. 2 and 3, an X-direction feed screw 91 is screwed to a nut 93 mounted on the lower surface of the receiving base 90. In FIG. 3, a base 94 is provided below the receiving base 90. An X-direction rail 95 is provided on the upper surface of both sides of the base 94, and a slider 96 provided on the lower surface of the receiving base 90 is fitted to the rail 95. Accordingly, when the motor 92 (FIG. 2) is driven and the feed screw 91 rotates, the receiving table 90 moves in the X direction along the rail 95.

In FIGS. 3 and 15, reference numeral 100 denotes an observation unit. The observation unit 100 includes a support 101
And two cameras 102 mounted on the camera. Support table 1
Numeral 01 stands on the base 103. A slider 104 is mounted on the lower surface of the base plate 103. Slider 10
4 is fitted on the rail 106 on the plate 105.
A cam follower 107 is provided on the lower surface of the base plate 103. The cam follower 107 is in contact with the cam 108. On the lower surface of the plate 105, a motor 109 for rotating the cam 108 is provided. When the motor 109 is driven to rotate the cam 108, the cam follower 107 is pushed by the cam 108 and moves in the Y direction, whereby the base 103 and the camera 102 on the base 103 are moved to the rail 10.
It moves in the Y direction along 6.

In FIG. 3, a nut 110 is mounted on the lower surface of the plate 105. The nut 110 is screwed to a feed screw 111 in the X direction (see also FIG. 2). 1
A motor 12 rotates the feed screw 111. 11
Reference numeral 3 denotes a base, and rails 114 are provided on the upper surfaces of both sides. The slider 115 provided on the lower surface of the plate 105 is fitted on the rail 114. Therefore, when the motor 112 (FIG. 2) is driven to rotate the feed screw 111, the nut 110 moves in the X direction along the feed screw 111, and the observation unit 100 also moves in the same direction.
In FIG. 15, reference numeral 99 denotes a control unit which analyzes image data captured by the camera 102, controls the motor 85, and the like.

Next, the transfer unit 80 and the observation unit 10
The operation of 0 will be described. 11 to 16 show the operation order. FIG. 11 shows an initial state. In this state, two first chucks 88 a and second chucks 88 b face the work 3 in the magazine 70. Now, when the motor 85 is driven as shown in FIG. 12, the nut 86 advances along the feed screw 84, whereby the first chuck element 88a and the second chuck element 88b are moved.
Moves forward toward the magazine 70 and the sub-substrate 4 of the work 3
Chuck. Next, the motor 85 is driven in the reverse direction, and the first chuck element 88a and the second chuck element 88b are retracted to pull out the chucked work 3 from the magazine 70 (FIG. 13).

Next, when the θ table 81 is driven, the first chuck unit 82a and the second chuck unit 82b are horizontally rotated 90 ° clockwise, and the first chuck unit 88a and the second chuck unit 88b are rotated. The work 3 chucked in the step is directed to the receiving table 90 (FIGS. 2 and 14).
Next, the motor 85 is driven to advance the first chuck piece 88a and the second chuck piece 88b toward the receiving table 90,
The work 3 is positioned on the cradle 90. FIG. 15 shows the state at this time.

Next, a method of correcting the horizontal direction (posture) of the work 3 will be described with reference to FIGS. Note that this correction is performed in order to make the direction of the work 3 exactly coincide with the direction of the substrate 1 to be bonded. In FIG. 15, two cameras 10
2. The connector 6 is observed at 2 and the image data is
The rotation angle α (FIG. 16) of the work 3 with respect to the X direction is obtained by the analysis. Note that such image analysis can be performed by a well-known image processing technique.

As shown in FIG. 16, on the basis of the analysis result, the motor 85 is driven to move the first chuck 88a and the second chuck 88b forward and backward independently of each other (arrows A and B). ), The work 3 is horizontally rotated, and the orientation of the work 3 is corrected so that the rotation angle α matches the orientation of the substrate 1. The direction of the substrate is detected in advance by the observation unit. In FIG. 16, a work 3 indicated by a dashed line indicates that the posture is being corrected, and a work 3 indicated by a solid line indicates a state after the correction. Each motor 8
5 by controlling the driving amount of the first chuck 8.
The amount of movement of the 8a and the second chuck 88b in the directions of the arrows A and B can be freely adjusted, whereby the work 3 can be freely horizontally rotated to correct its direction.

The thermocompression bonding apparatus for a workpiece has the above-described configuration. Next, the entire operation will be described with reference to the drawings. First, in FIG. 2, the substrate 1 is loaded on the movable table 11 by the conveyor 18. In FIG. 2, the substrate 1 indicated by a broken line shows a state where the substrate 1 is positioned on the movable table 11.

Next, in FIG. 2, the motor 27 is driven to move the frame 21 to a position facing the edge of the substrate 1, and then the ACF 7 is attached to the electrode 2 on the edge of the substrate 1. This sticking operation is as described with reference to FIGS.

Next, in FIG. 2, one work 3 in the magazine 70 is taken out by the transfer unit 80 and
Hand over to 0. This transfer operation is as described with reference to FIGS. Next, the direction of the work 3 placed on the receiving table 90 is corrected. This straightening method is
This is as described with reference to FIGS. 15 and 16.

When the preparation is completed as described above, the work 3 is bonded to the substrate 1 as follows. First, in FIG. 2, the motor 92 is driven to move the receiving table 90 on which the work 3 is mounted to the movable table 1.
The work 3 and the substrate 1 are moved to a position facing the substrate 1 on the substrate 1. FIG. 17 shows this positioning operation. FIG. 17 shows a state in which the board 1 is raised by driving the Zθ table 13 and the edge of the board 1 is brought close to the connector 6.

In FIG. 2, the camera 112 is moved rightward by driving the motor 112 to move the observation unit 100 below the substrate 1 and then rotating the cam 108 (FIG. 3) in FIG. Then, it is positioned below the connector 6. Then, the camera 102 observes whether or not the electrode 2 of the substrate 1 matches the lead of the connector 6.

As a result of this observation, if there is a positional deviation between the electrode 2 and the lead exceeding an allowable amount, the positional deviation is corrected by relatively moving the substrate 1 and the work 3. Among the displacements, the displacement in the X direction is corrected by driving the motor 92 (FIG. 2) to move the receiving table 90 in the X direction and move the work 3 in the same direction. The displacement in the Y direction is performed by driving the Y table 12 to move the substrate 1 in the Y direction. However, since the Y-direction positional deviation tolerance is generally large, there is no need to correct this Y-directional positional deviation. The positional deviation in the rotation direction is corrected by driving the Zθ table 13 to rotate the substrate 1 horizontally.

After the alignment of the work 3 and the substrate 1 is completed as described above, the work 3 is then thermocompression-bonded to the substrate 1. 18 to 20 show the thermocompression bonding operation.
FIG. 18 shows that after the alignment of the work 3 and the substrate 1 is completed,
The observation unit 100 is moved backward and the thermocompression bonding head 3
0 and the state where the backup member 33 has been moved to the sticking position.

First, as shown in FIG. 19, the motor 43 (FIG. 4) is driven to raise the backup member 33 to support the lower surface of the edge of the substrate 1. Next, the cylinder 32 (FIG. 3)
Is driven to lower the thermocompression bonding tool 31 and press it against the connector 6 (FIG. 20). Next, when the thermocompression bonding tool 31 is raised and the backup member 33 is lowered, the state returns to the state shown in FIG. As described above, the connector 6 is ACF
7 and bonded to the upper surface of the substrate 1 by thermocompression bonding. By repeating the above operation while moving the observation unit 100 and the frame 21 in the X direction, the works 3 are successively bonded to the edge of one side of the substrate 1.

When the bonding of the workpiece 3 to one side of the substrate 1 is completed, the Zθ table 13 (FIG. 2) is driven to rotate the substrate 1 horizontally by 90 °, and the same operation as described above is performed for the next side. Work 3 is bonded.
When all the bonding of the work 3 is completed, the substrate 1 is transported to the next step by the conveyor 19 (FIG. 2).

[0048]

According to the present invention, the work is thermocompression-bonded to the edge of the substrate by clamping the edge of the substrate and the work positioned on the edge from above and below by the thermocompression bonding head and the backup member. Therefore, the frame on which the thermocompression bonding head and the backup member are attached may be formed firmly, and a strong support means for opposing the reaction force generated in the thermocompression bonding head and the backup member can be eliminated. Can be reduced in size and simplified.

Also, by moving the thermocompression bonding head and the backup member integrally along the edge of the substrate, a large number of works are thermocompression-bonded to the edge of the substrate in a horizontal line. It is not necessary to move the substrate in the direction of thermocompression bonding of the work (in the above-described embodiment, in the X direction). Therefore, the moving range of the substrate can be greatly reduced. Can be greatly reduced.

[Brief description of the drawings]

FIG. 1A is a plan view of a substrate to which a work according to an embodiment of the present invention is bonded. FIG. 1B is a plan view of a substrate to which a work according to an embodiment of the present invention is bonded.

FIG. 2 is a plan view of a work thermocompression bonding apparatus according to an embodiment of the present invention.

FIG. 3 is a side view of the work thermocompression bonding apparatus according to the embodiment of the present invention;

FIG. 4 is a side view of the ACF attaching unit according to the embodiment of the present invention.

FIG. 5 is an explanatory diagram of an operation of the ACF attaching unit according to the embodiment of the present invention;

FIG. 6 is an explanatory diagram of an operation of the ACF attaching unit according to the embodiment of the present invention.

FIG. 7 is an explanatory diagram of the operation of the ACF sticking unit according to the embodiment of the present invention;

FIG. 8 is an explanatory diagram of an operation of the ACF attaching unit according to the embodiment of the present invention.

FIG. 9 is an explanatory diagram of the operation of the ACF attaching unit according to the embodiment of the present invention.

FIG. 10 is an explanatory diagram of an operation of the ACF attaching unit according to the embodiment of the present invention;

FIG. 11 is a plan view of a transfer unit of the work thermocompression bonding apparatus according to one embodiment of the present invention.

FIG. 12 is an operation explanatory view of a transfer unit of the work thermocompression bonding apparatus according to one embodiment of the present invention;

FIG. 13 is an operation explanatory view of a transfer unit of the work thermocompression bonding apparatus according to one embodiment of the present invention.

FIG. 14 is an explanatory diagram of the operation of the transfer unit of the work thermocompression bonding apparatus according to one embodiment of the present invention.

FIG. 15 is an operation explanatory view of a transfer unit of the work thermocompression bonding apparatus according to the embodiment of the present invention;

FIG. 16 is an operation explanatory view of a transfer unit of the work thermocompression bonding apparatus according to one embodiment of the present invention.

FIG. 17 is a side view of an observation unit of the work thermocompression bonding apparatus according to an embodiment of the present invention.

FIG. 18 is an explanatory diagram of a thermocompression bonding operation of the work thermocompression bonding apparatus according to one embodiment of the present invention.

FIG. 19 is an explanatory diagram of a thermocompression bonding operation of the work thermocompression bonding apparatus according to one embodiment of the present invention.

FIG. 20 is an explanatory diagram of a thermocompression bonding operation of the work thermocompression bonding apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 substrate 2 electrode 3 work 11 movable table 15 holding table 21 frame 25 nut 26 feed screw 27 motor 30 thermocompression head 33 backup member

Claims (1)

[Claims] A holding table for holding the substrate, a thermocompression head for pressing a work positioned at an edge of the substrate held by the holding table against the substrate and thermocompression bonding; and supporting the edge of the substrate by supporting the edge of the substrate. A backup member for supporting the pressing force of the thermocompression head; mounting the thermocompression head and the backup member on the upper and lower portions of the same frame so as to face each other; and moving the frame along the edge of the substrate. A thermocompression bonding apparatus for a workpiece, characterized by comprising means.