WO2016166810A1 - Module d'imagerie - Google Patents

Module d'imagerie Download PDF

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Publication number
WO2016166810A1
WO2016166810A1 PCT/JP2015/061429 JP2015061429W WO2016166810A1 WO 2016166810 A1 WO2016166810 A1 WO 2016166810A1 JP 2015061429 W JP2015061429 W JP 2015061429W WO 2016166810 A1 WO2016166810 A1 WO 2016166810A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging module
wiring board
angle
imaging
light receiving
Prior art date
Application number
PCT/JP2015/061429
Other languages
English (en)
Japanese (ja)
Inventor
和也 前江田
Original Assignee
オリンパス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Priority to PCT/JP2015/061429 priority Critical patent/WO2016166810A1/fr
Priority to JP2017512490A priority patent/JP6542876B2/ja
Publication of WO2016166810A1 publication Critical patent/WO2016166810A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation

Definitions

  • an imaging element in which a plurality of electrode pads are arranged in a row on an inclined surface which is inclined at an acute angle with respect to a light receiving surface, and a plurality of electrode pads joined in each of the plurality of electrode pads
  • the present invention relates to an imaging module including a wiring board in which first bonding electrodes are arranged in a row at an end.
  • the imaging module manufactured by the wafer level CSP technology is small, for example, it greatly contributes to the diameter reduction of the endoscope.
  • a plurality of light receiving units and a plurality of external electrodes connected to the respective light receiving units are formed on the light receiving surface of the semiconductor wafer.
  • a glass wafer is bonded to the light receiving surface of the semiconductor wafer to produce a bonded wafer.
  • Through-wires are formed which reach from the light-receiving surface of the bonded wafer to the opposing surface.
  • the light receiving surface of the imaging device of the imaging module obtained by cutting the bonded wafer is covered with a cover glass. Since the light receiving unit is connected to the electrode on the opposite surface through the through wiring, it can transmit and receive an electrical signal.
  • an imaging module 101 shown in FIG. 1 is disclosed.
  • the imaging module 101 arranges a plurality of wires in one through trench 110T instead of the plurality of through wires.
  • the imaging module 101 includes an imaging element 110 to which a cover glass 130 is bonded by an adhesive layer 120, a wiring board 140, and a signal cable 150.
  • a plurality of electrode pads 113 connected to the external electrode 113L of the light receiving surface 110SA are arranged in a row on the inclined wall surface (inclined surface) 110SS of the through trench 110T.
  • the inclined surface 110SS is inclined with respect to the light receiving surface 10SA of the imaging element 110 at a first inclination angle ⁇ 1 which is an acute angle.
  • Each of the plurality of electrode pads 113 is bonded to the plurality of bonding electrodes 141 arranged in a row at the end of the main surface 140SA of the wiring board 140 via the bumps 144. That is, in the wiring board 140, the main surface 140SA is inclined with respect to the facing surface 110SB of the imaging element 110.
  • the signal cable 150 is joined to the other end of the wiring board 140.
  • the imaging module 101 Since the imaging module 101 is fixed between the imaging element 110 and the wiring board 140 only at the bonding portion of the bump 144, the mechanical strength is not high. For this reason, the imaging module 101 may be easily damaged when handled, and the yield may not be high.
  • An object of the present invention is to provide an imaging module with high yield.
  • the light receiving surface on which the light receiving portion is formed, the facing surface facing the light receiving surface, and the light receiving surface are inclined at a first acute angle.
  • An imaging element having a sloped surface, and a plurality of electrode pads arranged in a row on the sloped surface, and a transparent member adhered through an adhesive layer to cover the light receiving surface of the imaging element
  • Each of the plurality of electrode pads of the imaging device and the plurality of bonding electrodes to which each of the plurality of electrode pads of the imaging device are arranged are arranged in parallel in parallel to the side portion of the main surface.
  • An imaging module including a wiring board having an electronic component mounted on the main surface, wherein the wiring board is in contact with the facing surface of the image pickup element, and a tip end of the main surface of the wiring board Defining the first angle with the opposite surface of the image sensor It is, further comprising a holding member.
  • an imaging module with high yield can be provided.
  • an imaging module 1 according to a first embodiment of the present invention will be described with reference to the drawings.
  • the drawings are schematic, and the relationship between the thickness and width of each member, the ratio of the thickness of each member, the number of electrode pads, the arrangement pits, etc. are different from the actual ones.
  • parts having different dimensional relationships and proportions are included among the drawings.
  • some configurations, for example, a silicon oxide layer on the surface of a silicon substrate, wiring, and the like are not shown.
  • the imaging module 1 includes an imaging element 10 made of a silicon substrate, a cover glass 30 which is a transparent member, a wiring board 40, and a signal cable 50.
  • the imaging device 10 has substantially the same configuration as the imaging device 110 of the conventional imaging module 101 described above.
  • the entire light receiving surface 10SA of the imaging element 10 is covered with a cover glass 30 via an adhesive layer 20.
  • a notch 10T On the side of the facing surface 10SB of the image pickup device 10, there is a notch 10T whose wall surface is the inclined surface 10SS which is inclined at the first angle ⁇ 1 with respect to the light receiving surface 10SA.
  • the first angle ⁇ 1 is an acute angle.
  • the through trench formed by the etching process from the facing surface 10SB side of the bonded wafer becomes the notch 10T by cutting the bonded wafer.
  • the back surface of the external electrode 12 of the imaging element 10 is exposed at the bottom surface of the notch 10T.
  • a plurality of electrode pads 13 electrically connected to each other through the external electrodes 12 and the solder bumps 44 are arranged in a row on the inclined surface 10SS. For this reason, the electrode pad 13 is electrically connected to the light receiving unit 11.
  • the extended portion of the wiring 13 ⁇ / b> L may be the electrode pad 13.
  • a plurality of bonding electrodes 41 are arranged in a row at the end of the main surface 40SA of the flat flexible wiring board 40, and a bonding electrode 42 is arranged in a row at the other end.
  • the bonding electrode 41 is bonded to the electrode pad 13 via the solder bump 44.
  • the bonding electrode 42 is bonded to the conducting wire 51 of the signal cable 50.
  • the bonding electrode 41 and the bonding electrode 42 are electrically connected via the electronic component 69 mounted on the main surface 40SA or a wire (not shown).
  • the joining location of the 1st joining electrode 42 and the electrode pad 13 may be sealed by sealing resin.
  • sealing resin it may not be easy to ensure sufficient mechanical strength with a sealing resin that fixes only the bonding points.
  • the distal end portion of the main surface 40SA of the wiring board 40 and the opposing surface 10SB of the imaging element 10 are defined at a first angle ⁇ 1 while in contact with the opposing surface 10SB of the imaging element 10
  • the holding member 70 is provided.
  • the holding member 70 has a rectangular central plate 70L, and angle defining portions 70W1 and 70W2 disposed upright on both sides of the central plate 70L.
  • the angle defining units 70W1 and 70W2 are triangles in plan view in which an angle formed by the first side L1 and the second side L2 is a first angle ⁇ 1.
  • the holding member 70 has the two angle defining portions 70W1 and 70W2 at the ends of both long sides, but may have only one of them. Further, hereinafter, each of the two angle defining portions 70W1 and 70W2 is referred to as an angle defining portion 70W.
  • the central plate 70 ⁇ / b> L of the holding member 70 is bonded to the facing surface 10 ⁇ / b> SB of the imaging device 10.
  • the first side L1 of the angle defining portion 70W abuts on the main surface 40SA of the wiring board 40 and is bonded with an adhesive (not shown).
  • the angle defining portion 70W is disposed on the outer peripheral portion of the central plate 70L. Therefore, even if the angle defining portion 70W is present, the electronic component 69 can be mounted on the main surface 40SA of the wiring board 40. That is, although the imaging module 1 includes the angle defining unit 70W as a holding member, the angle defining unit 70W and the electronic component 69 overlap when viewed from the side.
  • a resin member 65 is injected between the holding member 70 and the wiring board 40 and hardened. That is, the relative position of the wiring board 40 and the imaging device 10 is fixed by the resin member 65.
  • the resin member 65 is, for example, a thermosetting epoxy resin which is liquid in an uncured state.
  • the surface of the electronic component 69 mounted on the wiring board 40 is covered with the resin member 65 and protected.
  • the angle defining portion 70W illustrated in FIG. 4A is strictly trapezoidal. However, if the angle between the first side L1 and the second side L2 is the first angle ⁇ 1, the angle defining portion 70W may be substantially triangular.
  • the central plate 70L and the angle defining portion 70W may be manufactured as an integral body, or the angle defining portion 70W may be bonded to the central plate 70L. Further, the central plate 70L and the angle defining portion 70W of the holding member 70 made of metal, resin, or ceramic may be made of different materials.
  • the holding member 70 can stably define the relative angle between the imaging device 10 and the wiring board 40. Further, if the length of the second side L2 is 80% or less of the length of the imaging device 10, the signal cable 50 connected to the wiring board 40 can be placed in the projection plane of the imaging device 10 as described later. It can be arranged.
  • the imaging module 1 the imaging element 10 and the wiring board 40 are held by the holding member 70 with the relative angle defined at the first angle ⁇ 1. For this reason, the imaging module 1 has high mechanical strength between the imaging element 10 and the wiring board 40, is less likely to be damaged by handling, and has a sufficiently high final yield.
  • the wiring portion 40L of the wiring board 40 is flexible, even if the length of the wiring board 40 is long, the whole can be disposed within the projection plane of the imaging device 10 by being curved and deformed.
  • the imaging module 1 has a small diameter because the wiring board 40 and the signal cable 50 do not protrude outside the outer shape of the imaging device 10.
  • an imaging module 1B according to a modification of the second embodiment will be described.
  • the imaging module 1B is similar to the imaging module 1 and has the same effect, the same code
  • the wiring board 40B has a function of a holding unit. That is, in the wiring board 40B, angle defining portions 40W1 and 40W2 upright with respect to the main surface 40SA are extended at the long side of the rectangular wiring portion 40L.
  • a wiring layer is disposed on a base at least the surface of which is nonconductive.
  • the angle defining portion 40W is preferably made of the same material as that of the base, particularly, a high thermal conductivity material having a thermal conductivity of 10 W / (mK) or more.
  • the substrate may be coated with a non-conductive material such as copper (398 W / (mK)) or aluminum (236 W / (mK)), alumina (20 W / (mK)), carbonized Ceramics such as silicon (200 W / (mK)), silicon nitride (27 W / (mK)) and aluminum nitride (170 W / (mK)) may be used.
  • a non-conductive material such as copper (398 W / (mK)) or aluminum (236 W / (mK)), alumina (20 W / (mK)), carbonized Ceramics such as silicon (200 W / (mK)), silicon nitride (27 W / (mK)) and aluminum nitride (170 W / (mK) may be used.
  • the imaging module 1 ⁇ / b> B is easy to manufacture because the process of bonding the holding portion to the wiring board is unnecessary. Further, the imaging module 1B in which a part of the base made of the high thermal conductivity material is bonded to the imaging device 10 can efficiently transfer the heat generated by the imaging device 10, so it has high reliability.
  • an imaging module 1C of a modification of the second embodiment will be described.
  • the imaging module 1C is similar to the imaging module 1B and has the same effect, the same code
  • the holding member 40W is an angle defining member of a triangle in plan view, in which the angle formed by the first side L1 and the second side L2 is a first angle ⁇ 1.
  • the wiring board 40C is a flexible wiring board having, for example, a polyimide as a base.
  • the base of the wiring portion 40L and the holding member 40W may be a non-flexible substrate made of glass epoxy resin or the like, but a portion to be bent for bending to be described later, that is, the wiring portion 40L and the holding member 40W Only the border area with must be flexible.
  • the wiring board 40C be a flexible substrate.
  • Electronic components 69 such as chip capacitors and chip inductors are mounted on the main surface 40SA of the wiring portion 40L. Note that the electronic component may be mounted also on the main surface 40SB facing the main surface 40SA.
  • the holding members 40W1 and 40W2 are bent so as to stand upright on the main surface 40SA of the wiring board 40C.
  • the width of the wiring board 40 may be equal to or less than the width of the imaging device 10, including the bent holding member 40W.
  • the holding members 40W1 and 40W2 are preferably fixed in an upright state by the curable resin 45.
  • an ultraviolet curable resin is used as the curable resin 45.
  • the imaging module 1C is three-dimensionally formed by bending the extended portion of the general flat wiring board 40C, and therefore is easier to manufacture than the imaging module 1B.
  • an imaging module 1D according to a modification of the third embodiment will be described.
  • the imaging module 1B is similar to the imaging module 1 and has the same effect, the same code
  • the image pickup device 10D of the image pickup module 1D As shown in FIG. 7, in the image pickup device 10D of the image pickup module 1D, as in the case of the image pickup device 110 of the conventional image pickup module 101 described above, through trenches 10TA having inclined surfaces 10SS and 10ST are formed. There is. That is, the cutting position of the bonded wafer is different from that of the imaging device 10. However, the basic configuration of the imaging device 10D is the same as that of the imaging device 10.
  • the bonding electrodes provided in a row on the end face are the flying leads 41A.
  • the flying leads 41A (referred to as outer leads in the lead frame) are made of conductor wiring from which the insulating base of the wiring board 40A is selectively removed.
  • the flying leads 41A can be easily bent, and the solder bumps 44 can be directly heated without passing through the base of the wiring board 40D.
  • the imaging module 1D is easier to manufacture than the imaging module 1 and the like.
  • the electronic components 69A and 69B mounted on the main surface 40SA of the wiring board 40D form a first angle ⁇ 1 between the tip of the main surface 40SA of the wiring board 40D and the opposing surface 10SB of the imaging element 10D.
  • the function of the holding member defined in That is, the electronic components 69A and 69B are in contact with the facing surface 10SB of the imaging element 10D.
  • at least one electronic component may be in contact with the facing surface 10SB, but when the plurality of electronic components 69A and 69B are in contact, angle definition is easier.
  • the main surface 40SA of the wiring board 40D and the opposing surface 10SB of the imaging device 10D have a first angle ⁇ 1 when the corners thereof abut on the opposing surface 10SB of the imaging device 10D.
  • the placement position is determined in consideration of the height.
  • the imaging module 1D is easy to manufacture because it does not require a dedicated holding member for angle definition.
  • the resin member 65 is injected into the space between the imaging element 10D and the wiring board 40D and is cured.
  • the electronic component 69C is also mounted on the main surface 40SB of the wiring board 40D.
  • the electronic components 69A and 69B define angles, the imaging element 10D and the wiring board 40D are not fixed.
  • the relative positions of the imaging element 10D and the wiring board 40D are fixed by the resin member 65.
  • the imaging module 1D fixed by the resin member 65 has a mechanical strength higher than that of the imaging module 1 and the like.
  • an imaging module 1E according to a modification of the fourth embodiment will be described.
  • the imaging module 1E is similar to the imaging module 1 etc. and has the same effect, the same code
  • a block 70E having an inclined surface inclined at a first inclination angle ⁇ 1 with respect to the bottom surface corresponds to the main surface 40SA of the wiring board 40E and the imaging device 10D. It is a holding
  • FIG. The bottom surface 70SB of the block 70E is bonded to the wiring board 40E and the imaging device 10D by an adhesive (not shown).
  • the block 70E is preferably made of a high thermal conductivity material having a thermal conductivity of 10 W / (mK) or more in order to efficiently transfer the heat generated by the imaging device 10D.
  • a concave portion 70H in accordance with the size of the electronic component 69A is formed on the inclined surface 70SA. Therefore, the electronic component 69A can be disposed on the main surface 40SA of the wiring board 40E. Electronic parts 69B and 69C are also mounted on the main surface 40SB of the wiring board 40E.
  • the imaging module 1E includes the block 70E as a holding member, the holding member and the electronic component overlap when viewed from the side.
  • imaging module 10 imaging element 20: adhesive layer 30: cover glass 40: wiring board 40L: wiring portion 40W: angle defining portion (holding member) 41: bonding electrode 41A: flying lead 42: bonding electrode 44: solder bump 45: hardening resin 65: resin member 69: electronic component 70: holding member 70E: block 70H: recess 70L: central plate 70W: angle defining portion

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Endoscopes (AREA)
  • Studio Devices (AREA)

Abstract

L'invention concerne un module d'imagerie (1) qui est équipé d'un élément d'imagerie (10) dans lequel une pluralité de pastilles d'électrode (13) sont agencés dans une rangée sur une surface inclinée (10SS), inclinée à un premier angle aigu (θ1) par rapport à une surface de réception de lumière (10SA), d'un couvercle en verre (30) qui est collé par l'intermédiaire d'une couche adhésive (20) d'une manière recouvrant la surface de réception de lumière (10SA), de chacun de la pluralité de plots d'électrode (13) mentionnés ci-dessus, et d'un tableau de connexions (40) dans lequel une pluralité d'électrodes de jonction (41) auxquelles chacun des plots est connecté sont agencées dans une rangée parallèle sur une section latérale d'une surface principale (40SA) et dans lequel un composant électronique (69) est monté sur la surface principale (40SA) mentionnée ci-dessus, et est en outre équipé d'un élément de support (70) qui vient en contact avec une surface opposée (10SB) de l'élément d'imagerie (10) mentionné ci-dessus et régule l'extrémité avant de la surface principale (40SA) du tableau de connexions (40) et de la surface opposée (10SB) de l'élément d'imagerie (10) au premier angle (θ1) mentionné ci-dessus.
PCT/JP2015/061429 2015-04-14 2015-04-14 Module d'imagerie WO2016166810A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2015/061429 WO2016166810A1 (fr) 2015-04-14 2015-04-14 Module d'imagerie
JP2017512490A JP6542876B2 (ja) 2015-04-14 2015-04-14 撮像モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/061429 WO2016166810A1 (fr) 2015-04-14 2015-04-14 Module d'imagerie

Publications (1)

Publication Number Publication Date
WO2016166810A1 true WO2016166810A1 (fr) 2016-10-20

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PCT/JP2015/061429 WO2016166810A1 (fr) 2015-04-14 2015-04-14 Module d'imagerie

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JP (1) JP6542876B2 (fr)
WO (1) WO2016166810A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109716523A (zh) * 2016-10-27 2019-05-03 奥林巴斯株式会社 摄像组件、内窥镜和摄像组件的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1033470A (ja) * 1996-07-18 1998-02-10 Olympus Optical Co Ltd 撮像装置
JP2009176815A (ja) * 2008-01-22 2009-08-06 Olympus Corp 実装構造体
JP2011217887A (ja) * 2010-04-07 2011-11-04 Olympus Corp 撮像装置、電子内視鏡および撮像装置の製造方法
JP2014075764A (ja) * 2012-10-05 2014-04-24 Olympus Corp 撮像装置、該撮像装置を具備する内視鏡

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1033470A (ja) * 1996-07-18 1998-02-10 Olympus Optical Co Ltd 撮像装置
JP2009176815A (ja) * 2008-01-22 2009-08-06 Olympus Corp 実装構造体
JP2011217887A (ja) * 2010-04-07 2011-11-04 Olympus Corp 撮像装置、電子内視鏡および撮像装置の製造方法
JP2014075764A (ja) * 2012-10-05 2014-04-24 Olympus Corp 撮像装置、該撮像装置を具備する内視鏡

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109716523A (zh) * 2016-10-27 2019-05-03 奥林巴斯株式会社 摄像组件、内窥镜和摄像组件的制造方法
CN109716523B (zh) * 2016-10-27 2023-10-10 奥林巴斯株式会社 摄像组件、内窥镜和摄像组件的制造方法

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JP6542876B2 (ja) 2019-07-10
JPWO2016166810A1 (ja) 2018-02-15

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