WO2015182558A1

WO2015182558A1 - Method for manufacturing glass substrate and electronic device

Info

Publication number: WO2015182558A1
Application number: PCT/JP2015/064937
Authority: WO
Inventors: 翔伊東
Original assignee: 日本電気硝子株式会社
Priority date: 2014-05-28
Filing date: 2015-05-25
Publication date: 2015-12-03
Also published as: JPWO2015182558A1; TW201601925A

Abstract

Provided is a method for manufacturing a glass substrate including: a laminate producing step of producing a laminate (4) in which a glass film (1) and a support glass (2) are placed in close contact with an inorganic film (3) therebetween; a processing step of forming an electronic device material (5) on the glass film (1) of the laminate (4) to form a glass substrate (6); and a separation step of separating the entire glass substrate (6) from the support glass (2). After the processing step and before the separation step, a separation starting point forming step of forming a separation starting point (6x), which is to be the starting point of the separation step, is performed by irradiating the inorganic film (3) with a pulse laser (7) and separating a portion of the glass substrate (6) from the support glass (2) at the irradiated region (7x).

Description

Manufacturing method of glass substrate and electronic device

The present invention relates to a method for producing a glass substrate by forming an electronic device material such as a liquid crystal element on a glass film, and an electronic device.

In recent years, mobile devices such as smartphones and tablet PCs, which are rapidly spreading, are required to be lightweight. Therefore, the glass substrates incorporated in these products are being thinned. It is. And as what responds to such a request | requirement, the glass film which thinned plate glass to the film form (for example, thickness is 300 micrometers or less) has come to be developed. This glass film has a very flexible property because its thickness is extremely thin.

For example, in the case of manufacturing a glass substrate by performing a process for forming an electronic device material such as a liquid crystal element on the glass film, in order to facilitate the handling of the glass film, There is a case where a laminated body in which a supporting glass to be supported is overlapped is used. If this laminated body is utilized, the flexible property of the glass film can be temporarily excluded by superimposing it on the supporting glass. In addition, since an adhesion force acts between the two laminated glasses, there is an advantage that patterning positional deviation hardly occurs.

Although it is a laminate having such an excellent function, when the glass film after processing is incorporated into a product as a glass substrate, the following problems may occur when the glass film is peeled from the supporting glass. is there. That is, when the glass film is subjected to a treatment such that the laminate is placed in a high temperature atmosphere, the adhesion force acting between the glass film and the supporting glass increases, and the glass film is peeled off from the supporting glass. May become difficult. Therefore, Patent Document 1 discloses a technique that can eliminate such a problem.

The same document discloses a laminate for easily peeling the glass film from the supporting glass. This laminated body becomes a structure which a support glass supports a rectangular glass film. The supporting glass is formed with a hole extending in the thickness direction, and the two glasses are placed so that one of the corner portions of the glass film (hereinafter referred to as a specific corner portion) is positioned on the hole. It is superimposed. That is, in this laminated body, the specific corner portion of the glass film is in a non-contact state with the supporting glass.

As a result, when the glass film is peeled from the supporting glass, it is possible to start the peeling of the glass film starting from a specific corner portion that does not adhere to the supporting glass, and the force required to peel the glass film is reduced. It becomes possible to make it act suitably on a film. Therefore, it becomes easy to peel a glass film from support glass also about the laminated body put in the high temperature atmosphere during the process of a glass film.

JP 2012-30404 A

However, the following problems still need to be solved by the above technique. That is, in the above laminate, holes are formed in the support glass so that the specific corner portion of the glass film that is the starting point of peeling is not in contact with the support glass. And in the site | part along the inner periphery of this hole, unlike another site | part, there exists a tendency for a clearance gap to be easy to be inevitable between a glass film and support glass.

For this reason, for example, when a treatment that requires the use of a liquid such as formation of a photoresist is performed on the glass film, the liquid may enter a gap formed between the two glasses. is there. When such a situation occurs, it becomes difficult to appropriately process the glass film, and as a result, the quality of the glass substrate to be manufactured is deteriorated.

As described above, the above technique has an advantage that the glass film is easily peeled even for the laminate placed in a high temperature atmosphere, but on the other hand, it is still improved from the viewpoint of the quality of the glass substrate to be manufactured. There is room for this. The present invention made in view of such circumstances, when manufacturing a glass substrate using a laminate, even if the laminate is placed in a high temperature atmosphere, the glass film that has been processed It is a technical problem to enable smooth peeling and to prevent deterioration of the quality of the glass substrate.

The present invention, which was created to solve the above problems, produces a laminate in which a flexible glass film and a supporting glass that supports the glass film are adhered to each other via a light absorption layer. A glass substrate including a laminate manufacturing step, a processing step of forming an electronic device material on the glass film in the laminate and using the glass film as a glass substrate, and a peeling step of peeling the entire glass substrate from the supporting glass. In the manufacturing method, after the execution of the treatment step and before the peeling step, the light absorption layer is irradiated with a pulse laser, and a part of the glass substrate is peeled off from the supporting glass in the irradiation region. It is characterized by performing a peeling start point portion forming step for forming a peeling start point portion that is a starting point of the peeling step.

According to such a method, the separation starting point forming step is performed after the processing step is performed and before the separation step is performed. Therefore, when the processing step is performed, the separation starting point that is the starting point of the separation step is performed. The part is naturally in an unformed state. Therefore, due to the formation of the peeling start point portion, a situation in which the processing step is executed under a state where a gap is formed between the support glass and the glass film cannot occur. As a result, the electronic device material can be suitably formed on the glass film, and the deterioration of the quality of the glass substrate due to the formation of the gap can be reliably prevented. In this method, in the laminate production step, the laminate is produced by bringing the glass film and the supporting glass into close contact with each other through the light absorption layer. Therefore, at the time of executing the peeling start point forming step, the following action occurs in the pulse laser irradiation region. That is, the light absorption layer is turned into plasma as the light absorption layer is irradiated with the pulse laser. Furthermore, among the glass substrate and the supporting glass, the glass located on the irradiation side of the pulse laser absorbs more energy than the glass located on the irradiation side, and a part thereof (light The vicinity of the absorption layer) becomes plasma. Then, a part of the glass positioned on the irradiation source side and the light absorption layer, both of which are converted into plasma, adhere to the glass positioned on the irradiation destination side. In addition, the gases generated by the pulse laser irradiation push the two glasses apart so that the glass substrate and the supporting glass are separated. By these actions, a part of the glass substrate is peeled off from the supporting glass, and a peeling starting point is formed. Then, the whole glass substrate is peeled from support glass by performing a peeling process. At this time, since the light absorption layer is interposed between the glass substrate and the supporting glass, even when the laminate is placed in a high temperature atmosphere, the adhesion force acting between the two glasses is reduced. Since the increase is suppressed, the entire glass substrate can be smoothly peeled from the supporting glass.

In the above method, the light absorption layer is preferably composed of an inorganic film.

In this way, the light absorption layer is composed of a thermally stable inorganic film, so that the glass substrate can be peeled off from the supporting glass more smoothly even when the laminate is placed in a high-temperature atmosphere. Can be made. Moreover, since outgas generation is suppressed as much as possible, contamination of the glass substrate by the outgas can be suitably prevented.

In the above method, the pulse laser irradiation region is preferably a region along the outer peripheral edge of the glass substrate.

In this way, even after the processing step is performed, even if an adhering substance that joins the outer peripheral edge of the glass substrate and the supporting glass remains, the adhering substance can be removed by irradiation with a pulsed laser. it can. For this reason, it is possible to prevent as much as possible the occurrence of a situation in which peeling of the glass substrate is hindered by the deposit and the glass substrate is cracked. As a result, the glass substrate and the supporting glass can be stably peeled off.

In the above method, it is preferable that the glass substrate has a rectangular shape, and the peeling start point is formed at the corner of the glass substrate.

If it does in this way, in a peeling process, peeling from the support glass of a glass substrate can be started from a corner part. Thereby, since it becomes possible to make the force required in order to peel a glass substrate work efficiently, it becomes easier to peel a glass substrate from support glass.

In the above method, it is preferable to irradiate the pulse laser from the supporting glass side.

In this way, the support glass absorbs more energy than the glass substrate in the irradiation region of the pulse laser at the time of performing the peeling start point forming step, and a part thereof (near the light absorption layer) ) Becomes plasma. And in the said irradiation area | region, a part of support glass and light absorption layer which were made into plasma together adhere to a glass substrate. For this reason, unlike support glass, it is avoided that the thickness becomes thin with execution of a peeling start part formation process. Thereby, it becomes possible to prevent the surface strength of the glass substrate from being lowered.

In the above method, the pulse width of the pulse laser is preferably 500 ps or less.

In this way, since the pulse width is sufficiently short, excessive energy absorption in the glass substrate and the supporting glass can be prevented, and damage to both glasses can be suppressed as much as possible. In addition, by using a material having a short pulse width, various inorganic films can be satisfactorily processed.

In addition, when a pulse width of 100 ps or less is used, particularly preferable actions and effects can be obtained. That is, in the glass substrate and the supporting glass, a processing mark is formed on the surface region corresponding to the irradiation region of the pulse laser, but the unevenness included in the processing mark is made as small as possible. be able to. As a result, good surface strength can be secured for both glasses.

Further, the above glass substrate manufacturing method may be repeated a plurality of times by repeatedly using the same supporting glass. At this time, both of the glass film and the surface area of the supporting glass corresponding to the irradiation area of the pulse laser in the peeling start point forming process executed before the previous time and the glass film do not overlap during the second and subsequent laminate manufacturing processes. It is preferable to adhere the glass. Here, the “surface region of the supporting glass corresponding to the irradiation region of the pulse laser” means the surface region of the supporting glass that overlaps with the irradiation region of the pulse laser in a plan view when the separation starting portion forming step is performed. (same as below).

As described above, a processing mark is formed on the surface region corresponding to the irradiation region of the pulse laser on the support glass that has undergone the peeling start point forming step. The presence of this processing mark can be confirmed visually. Therefore, when the same supporting glass is repeatedly used and the above glass substrate manufacturing method is repeated, the pulse laser in the peeling start point forming step executed before the previous time is executed at the time of the second and subsequent laminate manufacturing steps. If the two glasses are brought into close contact with each other so that the surface region of the supporting glass corresponding to the irradiation region and the glass film do not overlap, the following actions and effects can be obtained. That is, if it does in this way, the processing trace formed in support glass will be formed in a mutually different location, whenever a peeling starting part formation process is performed. And it becomes possible to discriminate | determine the frequency | count of having used the support glass repeatedly based on the number of this process trace. Thereby, the number of times the support glass is used can be managed very easily. Moreover, since the same support glass is repeatedly used, it is possible to suppress the cost for manufacturing the glass substrate. Furthermore, it is possible to prevent the glass film from being superimposed on the unevenness included in the processing mark. For this reason, it is possible to avoid bubbles from entering between the glass film and the support glass due to the unevenness. Therefore, it is also suitable for preventing deterioration of the quality of the manufactured glass substrate.

In the above method, in the separation starting point forming step, the light absorbing layer may be irradiated with a plurality of pulse lasers, and at least a part of these irradiation spots may overlap.

In this way, when the peeling start point forming step is performed, a plurality of pulse lasers interfere with each other in the irradiation region by the overlapping irradiation spots, and the light absorption layer can be processed according to the interference pattern. Here, the “irradiation area by the overlapping irradiation spot” means the entire area where the overlapping irradiation spot is formed on the light absorption layer during the execution of the peeling start point forming step (hereinafter the same). Due to this, after completion of the peeling step, the light absorption layer remains as a fine convex portion on the surface region of the supporting glass corresponding to the irradiation region by the overlapping irradiation spot. Here, the “surface region of the supporting glass corresponding to the irradiation region by the overlapping irradiation spot” means the surface region of the supporting glass that overlaps with the irradiation region by the overlapping irradiation spot in a plan view when the peeling start point forming step is executed. (same as below). And the light which permeate | transmitted the location where the fine convex part remained came to be seen differently from the light which permeate | transmitted the part other than the said location. For this reason, it becomes possible to visually recognize the location of the portion where the fine convex portion remains. Furthermore, since it becomes possible to process a light absorption layer with the total energy of a several pulse laser in the irradiation area | region by an overlapped irradiation spot, a light absorption layer can also be processed suitably. Moreover, according to this method, it is also possible to adjust the size of the area of the glass substrate that is partially peeled from the supporting glass in the peeling start point forming step by adjusting the size of the irradiation area by the overlapping irradiation spots. It becomes. As a result, it is possible to easily create a state in which the glass substrate is easily peeled from the supporting glass in the peeling step.

In the above method, it is preferable to oscillate a plurality of pulse lasers from the same oscillation source.

In this way, since the plurality of pulse lasers become coherent with each other, it is possible to increase the coherence of the plurality of pulse lasers in the irradiation region by the overlapping irradiation spots when the peeling start point forming step is performed. Thereby, after the peeling process is completed, fine convex portions are likely to remain periodically in the surface region of the supporting glass corresponding to the irradiation region by the overlapping irradiation spots. As a result, the location of the portion where the fine convex portion remains can be more clearly visually recognized. Further, according to this method, it is not necessary to prepare the same number of oscillation sources as the number of pulse lasers irradiated to the light absorption layer when irradiating the light absorption layer with a plurality of pulse lasers. Therefore, it becomes possible to process the light absorption layer efficiently.

In the above method, the plurality of pulse lasers include a first pulse laser irradiated from the support glass side and a second pulse laser irradiated from the glass substrate side, and the first pulse laser and the second pulse laser Of the pulse lasers, one pulse laser is preferably generated by reflecting the other pulse laser that has passed through the laminate toward the laminate.

In this way, one of the first pulse laser and the second pulse laser can be generated by simply reflecting the other pulse laser that has passed through the laminate toward the laminate. . Therefore, the light absorption layer can be processed more efficiently.

Further, the above glass substrate manufacturing method may be repeated a plurality of times by repeatedly using the same supporting glass. At this time, during the execution of the second and subsequent laminate manufacturing steps, the surface region of the supporting glass corresponding to the irradiation region due to the overlapping irradiation spot in the separation starting point forming step executed before the previous time and the glass film do not overlap. It is preferable to adhere both glasses.

In this way, every time the peeling start point forming step is executed, the number of places where fine convex portions remain increases, and these locations are in different states. Moreover, since the location where the fine convex part remained can be visually recognized, it becomes possible to discriminate the number of times the support glass has been repeatedly used based on the number of places where the fine convex part remained. . Thereby, the number of times the support glass is used can be managed very easily. Moreover, since the same support glass is repeatedly used, it is possible to suppress the cost for manufacturing the glass substrate. Furthermore, since it is prevented that a glass film is superimposed on a fine convex part, it can avoid that a bubble enters between a glass film and support glass resulting from a fine convex part. . Therefore, it is also suitable for preventing deterioration of the quality of the manufactured glass substrate.

In the above method, the light absorbing layer is formed on the supporting glass, and in the peeling starting point forming step, the light absorbing layer is irradiated with the pulse laser as the starting pulse laser from the supporting glass side, and then the starting pulse is further formed. You may irradiate the pulsed laser of the laser irradiation area | region from the glass substrate side later.

In this way, as the first pulse laser is irradiated from the supporting glass side, the light absorption layer formed on the supporting glass adheres to the glass substrate in the irradiation region. Thereafter, as the subsequent pulse laser is irradiated from the glass substrate side, the light absorption layer attached to the glass substrate at the time of irradiation with the first pulse laser can be attached to the supporting glass again in the irradiation region. . That is, it becomes possible to repair the light absorption layer on the supporting glass.

In the above method, it is preferable that the first pulse laser and the second pulse laser are oscillated from the same oscillation source.

In this manner, when the light-absorbing layer is irradiated with the first pulse laser and the second pulse laser, the first pulse laser oscillation source and the second pulse laser oscillation source are prepared separately. There is no need. Therefore, it becomes possible to process the light absorption layer efficiently.

In the above method, it is preferable to irradiate the first pulse laser and the second pulse laser so that the electronic device material on the glass substrate passes through the non-formed region.

In this manner, the light absorbing layer can be irradiated with the first pulse laser and the subsequent pulse laser without adversely affecting the electronic device material by the pulse laser. In addition, since a situation in which the energy of the pulse laser is absorbed by the electronic device material does not occur, it is possible to suitably apply the energy of the first and second pulse lasers to the light absorption layer.

In the above method, an irradiation spot of the irradiation spot and subsequent pulse laser Advance pulse laser, it is preferable that the area of each within the range of 1mm ² ^~ 500mm 2.

This makes it easier to repair the light absorption layer to a flat state in the surface region of the supporting glass corresponding to the irradiation region of the subsequent pulse laser after execution of the peeling start point forming step. Moreover, damage to the supporting glass and the glass substrate can be prevented as much as possible by setting the irradiation spots of the first and second pulse lasers to the areas as described above.

In the above method, in the separation starting point forming step, the part of the glass substrate corresponding to the irradiation region of the first pulse laser and the part of the glass substrate corresponding to the irradiation region of the subsequent pulse laser are separated from the support glass. It is preferable to restrict the displacement in the direction. Here, “the part of the glass substrate corresponding to the irradiation region of the first (later) pulsed laser” refers to the glass that overlaps with the irradiation region of the first (later) pulsed laser in plan view when the separation starting portion forming step is performed. It means the part of the substrate (hereinafter the same).

When the adhesion between the glass substrate and the support glass is large, at the part of the glass substrate that corresponds to the irradiation area of the first and subsequent pulse lasers (hereinafter referred to as the corresponding part), the corresponding part expands due to the heat of both pulse lasers. Due to this, there is a possibility of causing the following problems. That is, excessive stress acts at the boundary between the corresponding part and the part where the glass substrate and the supporting glass existing in the vicinity of the corresponding part are in close contact, and the glass substrate may be damaged. However, if the displacement of the corresponding part in the direction away from the supporting glass is restricted, the action of stress at the boundary between the two parts can be reduced as much as possible. It becomes possible to eliminate.

Further, the above glass substrate manufacturing method may be repeated a plurality of times by repeatedly using the same supporting glass. At this time, both the support glass surface area corresponding to the irradiation area of the subsequent pulse laser in the previously-executed peeling start point forming process and the glass film overlap during the second and subsequent laminate manufacturing processes. It is preferable to adhere the glass. Here, the “surface region of the support glass corresponding to the irradiation region of the subsequent pulse laser” means the surface region of the support glass that overlaps with the irradiation region of the subsequent pulse laser in plan view when the peeling start point forming step is performed. Meaning (hereinafter the same).

In this way, in the second and subsequent laminate manufacturing steps, the light that has been repaired to the supporting glass in the separation starting point forming step that was previously performed in the light absorbing layer interposed between the supporting glass and the glass film. An absorption layer will be included. Thereby, the light absorption layer restored to the supporting glass can be effectively used without waste. Moreover, since the same support glass is repeatedly used, it is possible to suppress the cost for manufacturing the glass substrate.

Further, if the above glass substrate manufacturing method is used, the following electronic device can be manufactured. That is, this electronic device is provided with a glass substrate in which an electronic device material is formed on a glass film, and the glass film has an irradiated region irradiated with a pulse laser from both the front and back sides. It is characterized in that a plurality of convex portions made of a film are formed in the irradiated region.

According to such an electronic device, it is possible to impart individual identification (traceability) to the glass substrate by acquiring an enlarged image of the irradiated region of the glass film with a CCD camera or the like. As a result, individual identification can be imparted to an electronic device including this glass substrate as well, which is extremely advantageous in managing the quality.

In the above electronic device, the plurality of convex portions are formed in parallel, and the width of the convex portion and the width of the gap formed between adjacent convex portions are each 0.1 μm to 20 μm, and It is preferable that the formation pitch of the plurality of convex portions is 0.2 μm to 40 μm, and the area of the convex portion formed in the irradiated region is 10% or more.

According to such an electronic device, it becomes easy to specify the region and shape of the convex portion occupying the irradiated region, so that the individual identification of the electronic device can be further improved.

As described above, according to the method for manufacturing a glass substrate according to the present invention, when a glass substrate is manufactured using the laminate, even if the laminate is placed in a high-temperature atmosphere, the processing is performed. As a result, the glass film can be smoothly peeled and the quality of the glass substrate can be prevented from deteriorating.

It is a vertical side view which shows the laminated body preparation process in the manufacturing method of the glass substrate which concerns on 1st embodiment of this invention. It is a vertical side view which shows the process process in the manufacturing method of the glass substrate which concerns on 1st embodiment of this invention. It is a vertical side view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 1st embodiment of this invention. It is a vertical side view which shows the peeling process in the manufacturing method of the glass substrate which concerns on 1st embodiment of this invention. It is a top view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 1st embodiment of this invention. It is a vertical side view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 1st embodiment of this invention. It is a top view which shows the laminated body preparation process in the manufacturing method of the glass substrate which concerns on 1st embodiment of this invention. It is a vertical side view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention. It is a top view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention. It is a top view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention. It is a vertical side view which shows the peeling process in the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention. It is a vertical side view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention. It is a vertical side view which shows the glass substrate manufactured by the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention. It is a vertical side view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 3rd embodiment of this invention. It is a top view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 3rd embodiment of this invention. It is a vertical side view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 3rd embodiment of this invention. It is a vertical side view which shows the peeling origin part formation process in the manufacturing method of the glass substrate which concerns on 3rd embodiment of this invention. It is a top view which shows the laminated body preparation process in the manufacturing method of the glass substrate which concerns on 3rd embodiment of this invention.

Hereinafter, a glass substrate manufacturing method and an electronic device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

<First embodiment>
1 to 4 are diagrams showing each step included in the glass substrate manufacturing method according to the first embodiment of the present invention. As shown in these figures, this glass substrate manufacturing method is a laminate in which a laminate 4 is produced in which a glass film 1 and a supporting glass 2 are brought into close contact with each other through an inorganic film 3 as a light absorption layer. From the supporting glass 2, a manufacturing process (FIG. 1), a processing process (FIG. 2) in which an electronic device material 5 is formed on the glass film 1 to form a glass substrate 6, and the inorganic film 3 is irradiated with a pulse laser 7. By peeling off a part of the glass substrate 6, a peeling starting point forming step (FIG. 3) for forming the peeling starting point 6 x and a peeling step (FIG. 4) for peeling the entire glass substrate 6 from the support glass 2 are performed. Contains. And the same support glass 2 is repeatedly used and this glass substrate manufacturing method is repeated a plurality of times.

In the laminate manufacturing step, first, the surfaces of the glass film 1 having flexibility and the supporting glass 2 that supports the glass film 1 that are in close contact with each other (adhering via the inorganic film 3) (hereinafter referred to as “infrared film 3”). The surface roughness Ra of the contact side surface is finished to a smooth surface of 2.0 nm or less. The surface roughness Ra can be obtained by, for example, using unmolded glass formed by the overflow downdraw method, adjusting the concentration of the etching solution, the solution temperature, and the processing time when performing chemical etching on the glass, It is possible to control by performing mirror polishing or optical polishing. In the present embodiment, both the

glasses

1 and 2 have a rectangular shape, and the support glass 2 has a size that is slightly larger than the glass film 1. Next, with respect to the supporting glass 2, the inorganic film 3 is formed with a uniform thickness on the entire surface of the contact surface. Here, the inorganic film 3 is composed of a film having a lower transmittance with respect to light having a wavelength of 300 nm to 3000 nm than both the

glasses

1 and 2. As the inorganic film _{_{_{_{3, SiO, SiO 2, Al}}}} 2 O 3, MgO, Y 2 O 3, La 2 O 3, Pr 6 O 11, Sc 2 O 3, WO 3, HfO 2, In 2 O 3, Oxide films such as ITO, ZrO ₂ , Nd ₂ O ₃ , Ta ₂ O ₅ , CeO ₂ , Nb ₂ O ₅ , TiO, TiO ₂ , Ti ₃ O ₅ , NiO and ZnO, and nitrides such as SiN, SiAlN and SiON A film or a film made of a combination of these can be used. The thickness of the inorganic film 3 is preferably in the range of 1 nm to 200 nm. Finally, the laminated body 4 is produced by bringing the two

glasses

1 and 2 into close contact with each other through the inorganic film 3. In the present embodiment, the inorganic film 3 may be formed on the adhesion side surface of the glass film 1 instead of the adhesion side surface of the support glass 2.

In the treatment step, the electronic device material 5 is formed on the glass film 1 for the laminate 4 produced in the laminate production step, and the glass film 1 is used as the glass substrate 6. Here, as the electronic device material 5, for example, a liquid crystal element, an organic EL element, a touch panel element, a solar cell element, a piezoelectric element, a light receiving element, a battery element such as a lithium ion secondary battery, a MEMS element, a semiconductor element, or the like is formed. To do.

In the peeling start point forming step, the pulsed laser 7 is focused on the inorganic film 3 from the support glass 2 side and irradiated (the inorganic film 3 is set as the focal position of the pulsed laser 7). The pulse laser 7 is irradiated by a galvanometer mirror (not shown) and an f-θ lens (not shown) so that its optical axis extends in the thickness direction of the laminate 4. As shown in FIG. 5, the irradiation region 7 x of the pulse laser 7 is a square region including the corner portion of the glass substrate 6 among the regions along the outer peripheral end 6 a of the glass substrate 6. Further, in the present embodiment, the irradiation region 7x is set so that each side of the square formed by the irradiation region 7x is inclined by 45 ° with respect to each of the two sides forming the corner portion of the glass substrate 6. ing. Then, the pulse laser 7 is scanned along the scanning path S so that the irradiation spots 7a of the pulse laser 7 are arranged at a constant irradiation pitch P. In the present embodiment, as shown in FIG. 5, the pulse laser 7 is irradiated so that the adjacent irradiation spots 7a do not overlap each other, but the adjacent irradiation spots 7a partially overlap each other. It may be irradiated.

Thereby, in the irradiation region 7x of the pulse laser 7, the following action occurs. That is, as shown in FIG. 6, with the irradiation of the pulsed laser 7 to the inorganic film 3, the inorganic film 3 absorbs the laser light and is turned into plasma (cross-hatched part). Furthermore, the supporting glass 2 positioned on the irradiation source side of the pulse laser 7 absorbs more energy than the glass substrate 6 positioned on the irradiation destination side, and the vicinity of the inorganic film 3 is turned into plasma. (Cross-hatched part). Then, a part of the supporting glass 2 and the inorganic film 3 that are plasmatized together adhere to the glass substrate 6. In addition, the gas generated by the irradiation of the pulse laser 7 pushes the two

glasses

2 and 6 apart so that the supporting glass 2 and the glass substrate 6 are separated. By these actions, a part of the glass substrate 6 is peeled off from the support glass 2 to form a peeling starting point 6x. In the support glass 2 and the glass substrate 6, processing traces due to the irradiation of the laser 7 are formed on the surface region corresponding to the irradiation region 7 x of the pulse laser 7. This processing mark includes irregularities.

Here, as the kind of the pulse laser 7, a solid laser, LD laser, disk laser, fiber laser, or the like can be used. The wavelength of the pulse laser 7 is preferably in the range of 300 nm to 3000 nm. Further, although the pulse width is 500 ps or less, it is preferably in the range of 10 fs to 500 ps, more preferably in the range of 100 fs to 100 ps. However, the present invention is not limited to this, and the pulse width may be on the order of nanoseconds. In addition, the frequency is preferably in the range of 1 kHz to 50 MHz. The pulse energy is preferably in the range of 1 μJ to 50 μJ. Further, the peak value of the pulse energy is preferably in the range of 5.0 × 10 ⁹ J / cm ² · s to 1.0 × 10 ¹⁵ J / cm ² · s. In addition, the irradiation pitch P of the pulse laser 7 is preferably in the range of 1 μm to 100 μm. The length (irradiation range) R of one side of the square formed by the irradiation region 7x is preferably in the range of 0.1 mm to 100 mm. Furthermore, in the processing traces formed on the support glass 2 and the glass substrate 6, the size of the dents (dimensions in the thickness direction) is preferably 1000 nm or less. Note that only a part of the thickness of the inorganic film 3 or only the entire thickness may be processed by the irradiation of the pulse laser 7. In this case, the size of the recess is zero.

In the peeling process, a plurality of suction pads 8 are used for peeling the glass substrate 6 from the support glass 2. Each of the suction pads 8 has a plurality of suction holes at the contact portion with the glass substrate 6, and the glass substrate 6 is sucked by generating a negative pressure on the glass substrate 6 through the suction holes. To do. And each suction pad 8 which adsorb | sucked the glass substrate 6 moves to the upper direction sequentially from the peeling start part 6x side, and peels the whole glass substrate 6 from the support glass 2. FIG. The glass substrate 6 is manufactured through the above steps. Here, the surface strength of the glass substrate 6 and the supporting glass 2 after the peeling step is preferably in the range of 100 MPa to 3000 MPa.

In addition, the support glass 2 after peeling the glass substrate 6 is repeatedly used for the manufacturing method of said glass substrate. At this time, at the time of execution of the second and subsequent laminate manufacturing steps, the surface region of the support glass 2 corresponding to the irradiation region 7x of the pulse laser 7 in the peeling start point forming step executed before the previous time overlaps with the glass film 1. The two

glasses

1 and 2 are brought into close contact with each other. Here, one specific example is given. FIG. 7 is a plan view showing a laminate manufacturing process executed for the third time. The supporting glass 2 has already undergone two peeling start point forming steps. Thereby, in the laminated body manufacturing process performed for the first time and the second time, the surface regions 2ax and 2bx of the supporting glass corresponding to the corner portions of the

glass films

1a and 1b in close contact with the supporting glass 2 are respectively provided. A processing mark is formed. The support glass 2 and the glass film 1c are brought into close contact so that the surface regions 2ax, 2bx (processing marks) and the glass film 1c used in the third laminate manufacturing process do not overlap.

Hereinafter, the operation and effect of the glass substrate manufacturing method according to the first embodiment will be described.

According to the method for manufacturing a glass substrate according to the first embodiment, after executing the processing step and before executing the peeling step, the peeling start point forming step is executed. Naturally, the peeling starting point portion 6x that is the starting point of the peeling step is in an unformed state. Therefore, due to the formation of the separation starting point portion 6x, a situation in which the processing step is performed under a state where a gap is formed between the support glass 2 and the glass film 1 cannot occur. Therefore, even when a treatment that requires the use of a liquid such as water is performed, there is no possibility that the liquid enters the gap. As a result, the electronic device material 5 can be suitably formed on the glass film 1, and it is possible to reliably prevent the quality of the glass substrate 6 from being deteriorated due to the formation of the gap.

Further, in this glass substrate manufacturing method, the laminate 4 is produced by bringing the glass film 1 and the supporting glass 2 into close contact with each other through the inorganic film 3 in the laminate production step. Therefore, even when the laminate 4 is placed in a high temperature atmosphere, an increase in the adhesion force acting between the two

glasses

2 and 6 is suppressed. It becomes possible to peel from the supporting glass 2 smoothly. This effect is further enhanced by the fact that the inorganic film 3 is thermally stable.

Moreover, the following operation | movement and effect are acquired by making the irradiation area | region 7x of the pulse laser 7 into the area | region including the corner part of the said glass substrate 6 among the areas along the outer periphery edge part 6a of the glass substrate 6. FIG. It is done. That is, even if an adherent (for example, a photoresist agent) that joins the corner portion of the glass substrate 6 and the support glass 2 remains after the processing step is performed, the adherent is removed from the pulse laser 7. Can be removed by irradiation. For this reason, it is possible to prevent as much as possible the occurrence of a situation in which peeling of the glass substrate 6 is hindered by the deposit and the glass substrate 6 is cracked. Furthermore, in the peeling step, peeling of the glass substrate 6 from the support glass 2 can be started from the corner portion. Thereby, the force required to peel the glass substrate 6 can be efficiently applied. As a result, the glass substrate 6 and the support glass 2 can be stably peeled off.

Also, the pulse width of the pulse laser 7 is 500 ps or less, and the pulse width is sufficiently short. For this reason, absorption of excessive energy in the glass substrate 6 and the supporting glass 2 can be prevented, and damage to both the

glasses

2 and 6 can be suppressed as much as possible. Note that this effect can be further enhanced by controlling the size of the overlapped area when the adjacent irradiation spots 7a are overlapped. In addition, by using the pulse laser 7 having a short pulse width, it is possible to satisfactorily process various inorganic films 3. Further, since outgas generation from the inorganic film 3 is suppressed as much as possible, contamination of the glass substrate 6 by the outgas can be suitably prevented. In addition, by irradiating the pulse laser 7 from the support glass 2 side, as described above, a part of the support glass 2 and the inorganic film 3 that are plasmatized together at the time of performing the peeling start point forming step, It adheres to the glass substrate 6. For this reason, unlike the supporting glass 2, the glass substrate 6 is prevented from having a reduced thickness with the execution of the peeling start point forming step. Thereby, it becomes possible to prevent the surface strength of the glass substrate 6 from being lowered. In particular, when the pulse laser 7 having a pulse width of 100 ps or less is used, the unevenness included in the processing trace can be made as small as possible. As a result, both

glasses

2 and 6 are advantageous in securing good surface strength.

In addition, the surface region of the supporting glass 2 corresponding to the irradiation region 7x of the pulse laser 7 in the peeling start point forming step executed before the previous time overlaps with the glass film 1 during the second and subsequent laminate manufacturing steps. The following actions and effects can be obtained by bringing the two

glasses

1 and 2 into close contact with each other. That is, every time the peeling start point forming step is executed, processing marks formed on the support glass 2 are formed at different locations. Further, the presence of this processing mark can be confirmed visually. Therefore, it is possible to determine the number of times the support glass 2 has been repeatedly used based on the number of processing marks. Thereby, the number of times the support glass 2 is used can be managed very easily. In addition, if the amount of dents in the processing mark is approximately the same as the wavelength of visible light, the visibility of the processing mark can be improved. Moreover, since the same support glass 2 is repeatedly used, it is possible to suppress the cost for manufacturing the glass substrate 6. Furthermore, since the glass film 1 is not superimposed on the unevenness included in the processing mark, it is possible to avoid bubbles from entering between the glass film 1 and the support glass 2 due to the unevenness. Therefore, it is also suitable for preventing deterioration of the quality of the manufactured glass substrate 6.

<Second embodiment>
Hereinafter, the manufacturing method of the glass substrate which concerns on 2nd embodiment of this invention is demonstrated. In addition, in description of the manufacturing method of the glass substrate which concerns on this 2nd embodiment, about the matter already demonstrated in said 1st embodiment, it attaches | subjects the same code | symbol to drawing referred in description of 2nd embodiment. The overlapping description will be omitted, and only differences from the first embodiment will be described.

FIG. 8 is a longitudinal side view showing a peeling starting point forming step in the method for manufacturing a glass substrate according to the second embodiment of the present invention, and FIG. 9 is a plan view showing the step. As shown in these drawings, in the method for manufacturing a glass substrate according to the second embodiment, in the peeling start point forming step, the inorganic film 3 is divided into two of the first pulse laser 9 and the second pulse laser 10. And an overlapping irradiation spot Z in which a part of these

irradiation spots

9a and 10a overlaps is formed.

As shown in FIG. 8, the first pulse laser 9 is oscillated from a laser oscillator 11 as an oscillation source and reflected by a mirror 12 to irradiate the inorganic film 3 from the support glass 2 side. . On the other hand, the second pulse laser 10 is generated by reflecting the first pulse laser 9 transmitted through the laminated body 4 by the mirror 12x toward the laminated body 4, and is formed on the glass substrate with respect to the inorganic film 3. Irradiated from the 6th side. That is, the first pulse laser 9 and the second pulse laser 10 are lasers oscillated from the same laser oscillator 11 (oscillation source). The second pulse laser 10 transmitted through the laminate 4 is scattered by the scattering plate 13. In this embodiment, unlike the first embodiment, the first pulse laser 9 and the second pulse laser 10 are irradiated in a defocused state without being focused on the inorganic film 3. (The inorganic film 3 is not used as the focal position of both pulse lasers 9 and 10). The polarized light of both

pulse lasers

9 and 10 is linearly polarized light. Further, the optical axis of the second pulse laser 10 generated by being reflected by the mirror 12x is inclined with respect to the optical axis of the first pulse laser 9 that is transmitted through the laminate 4 and incident on the mirror 12x. The angle at which the mirror 12x is installed is adjusted.

Here, as a kind of both

pulse lasers

9 and 10, a solid laser, LD laser, disk laser, fiber laser, etc. can be used. The wavelengths of both

pulse lasers

9 and 10 are preferably in the range of 300 nm to 3 μm. Further, the pulse width is preferably in the range of 1 ps to 1 μs. In addition, the frequency is preferably in the range of 0.5 Hz to 10 kHz. The pulse energy is preferably in the range of 1 mJ to 2J. Further, the peak value of the pulse energy is preferably in the range of 5.0 × 10 ⁶ J / cm ² · s to 1.0 × 10 ¹⁵ J / cm ² · s. In addition, the area of the

irradiation spots

9a, 10a of both

pulse lasers

9, 10 is preferably in the range of 1 mm ² to 500 mm ² . The area of the overlapping irradiation spot Z is preferably 10% to 99.9% of the area of the

irradiation spots

9a and 10a.

As shown in FIG. 9, the overlapping irradiation spot Z in which the

irradiation regions

9 a and 10 a of both

pulse lasers

9 and 10 partially overlap is the glass substrate 6 in the region along the outer peripheral edge 6 a of the glass substrate 6. It is formed in a region including the corner portion. Here, in the present embodiment, the overlapping irradiation spot Z is formed at only one place on the inorganic film 3.

It should be noted that the present invention is not limited to the embodiment, and as a modification, the overlapping irradiation spots Z may be intermittently formed at a plurality of locations whose positions are different from each other. In addition, when forming the overlapping irradiation spot Z intermittently in a plurality of places, for example, the following procedures (A) and (B) are repeatedly executed. (A) After forming both

irradiation spots

9a and 10a on the inorganic film 3 to form the overlapping irradiation spot Z, the irradiation of both

pulse lasers

9 and 10 is once stopped. (B) After moving the laminated body 4 and shifting the positions where both

irradiation spots

9a, 10a are formed, both

pulse lasers

9, 10 are re-irradiated to re-form the overlapping irradiation spots Z at different positions. At this time, two adjacent overlapping irradiation spots Z may be formed so that a part of them overlaps or may not be overlapped. As a further modification, the overlapping irradiation spot Z is formed as an overlapping irradiation spot Z that continuously scans the inorganic film 3 by moving the laminated body 4 in a state where both the

pulse lasers

9 and 10 are irradiated to the inorganic film 3. May be.

As a result, the following action occurs in the irradiation region by the overlapping irradiation spot Z. That is, a separation starting point portion 6x in which a part of the glass substrate 6 is separated from the support glass 2 is formed. Further, when the peeling start point forming step is executed, both

pulse lasers

9 and 10 interfere in the irradiation region by the overlapping irradiation spot Z, and the inorganic film 3 is processed according to the interference pattern. As a result, as shown in FIG. 11, after the peeling process is completed, the inorganic film 3 is formed as fine protrusions 3 x on the surface region 2 y of the support glass 2 corresponding to the irradiation region by the overlapping irradiation spot Z. It remains. And the light which permeate | transmitted the location where the fine convex part 3x remained came to be seen differently from the light which permeate | transmitted other than the said location. Thereby, it becomes possible to visually recognize the location of the portion where the fine convex portion 3x remains.

Further, in the glass substrate manufacturing method according to the second embodiment, the support glass 2 is repeatedly used in the glass substrate manufacturing method after the peeling step is completed, as in the first embodiment. At this time, the surface area 2y of the supporting glass 2 corresponding to the irradiation area by the overlapping irradiation spot Z in the peeling starting point forming process executed before the previous time and the glass film 1 are executed at the time of the second and subsequent laminate manufacturing processes. Both

glasses

1 and 2 are brought into close contact so as not to overlap.

Here is one specific example. FIG. 12 is a vertical cross-sectional side view showing a laminate manufacturing process executed for the third time. The supporting glass 2 has already undergone two peeling start point forming steps. As a result, in the peeling start point forming process executed for the first time and the second time, fine convex portions 3x remain in the surface regions 2ay and 2by of the support glass 2 corresponding to the irradiation regions by the overlapping irradiation spots Z, respectively. is doing. The support glass 2 and the glass film 1c are brought into close contact so that the surface regions 2ay and 2by and the glass film 1c used in the third laminate manufacturing process do not overlap.

Hereinafter, the operation and effect of the glass substrate manufacturing method according to the second embodiment will be described.

According to the method for manufacturing a glass substrate according to the second embodiment, it becomes possible to process the inorganic film 3 with the energy of both

pulse lasers

9 and 10 in the irradiation region by the overlapping irradiation spot Z, and preferably The inorganic film 3 can be processed. Further, by adjusting the size of the area of the irradiation region by the overlapping irradiation spot Z, it is possible to adjust the size of the area of the glass substrate 6 that is partially peeled from the support glass 2 in the peeling start point forming step. As a result, it is possible to easily create a state in which the glass substrate 6 is easily peeled from the support glass 2 in the peeling step.

Further, since the first pulse laser 9 and the second pulse laser 10 are oscillated from the same laser oscillator 11, both the

pulse lasers

9 and 10 become coherent with each other. Therefore, it is possible to enhance the coherence of both

pulse lasers

9 and 10 in the irradiation region by the overlapping irradiation spot Z when executing the peeling start point forming step. Thereby, the fine convex part 3x tends to remain periodically. As a result, the location of the portion where the fine convex portion 3x remains can be visually recognized more clearly. Furthermore, when irradiating both the

pulse lasers

9 and 10 to the inorganic film 3, it is not necessary to prepare the same number of oscillation sources as the number of pulse lasers (two in the present embodiment) irradiated to the inorganic film 3. . Therefore, it becomes possible to process the inorganic film 3 efficiently. This effect is further enhanced by generating the second pulse laser 10 by reflecting the first pulse laser 9 transmitted through the laminate 4 toward the laminate 4.

Moreover, the surface area | region 2y of the support glass 2 corresponding to the irradiation area | region by the overlap irradiation spot Z in the peeling origin part formation process performed before the last time, and the glass film 1 overlap at the time of execution of the laminated body manufacturing process after the 2nd time. The following actions and effects can be obtained by bringing the two

glasses

1 and 2 into close contact with each other. That is, in this method, each time the peeling start point forming step is executed, the number of places where the fine convex portions 3x remain increases, and the locations of these portions become different from each other. Moreover, since the location where the fine convex part 3x remained can be visually recognized, it can discriminate | determine the frequency | count that the support glass 2 was repeatedly used based on the number of the location where this fine convex part 3x remained. It becomes possible. Thereby, the number of times the support glass 2 is used can be managed very easily. Furthermore, since it is prevented that the glass film 1 is superimposed on the fine convex part 3x, air bubbles enter between the glass film 1 and the supporting glass 2 due to the fine convex part 3x. It can be avoided. Therefore, it is also suitable for preventing deterioration of the quality of the manufactured glass substrate 6.

In addition, as shown in FIG. 13, the glass substrate 6 manufactured by the glass substrate manufacturing method according to the second embodiment (the glass film 1 on which the electronic device material 5 is formed) is irradiated with a pulse laser from both front and back sides. The irradiated region T (the region where the overlapping irradiation spot Z is formed) is irradiated. In the irradiated region T, a plurality of convex portions 3z made of the inorganic film 3 are formed in parallel. In FIG. 13, since the pulse laser having linearly polarized light is used, the convex portions 3z are formed in parallel. However, the present invention is not limited to this, but when a pulse laser having circularly polarized light is used, it is not shown. It may be formed in a dot shape.

Each of the convex portions 3z is formed so as to be elongated along a direction perpendicular to the paper surface in FIG. 13 and is formed outside the region where the electronic device material 5 is formed in the glass film 1. The width W1 of the protrusion 3z and the width W2 of the gap formed between the adjacent protrusions 3z are in the range of 0.1 μm to 20 μm, respectively. The plurality of protrusions 3z are formed periodically (three periods in FIG. 13) along the direction in which they are arranged, and the formation pitch PT of the protrusions 3z is in the range of 0.2 μm to 40 μm. It has become. Furthermore, the area of the region where the convex portion 3z occupying the irradiated region T is 10% or more. In addition, the height H of the protrusion 3z is substantially equal to the thickness of the inorganic film 3. These measurements can be performed by using an atomic force microscope, a laser microscope, a surface shape measuring device by light interference, or the like. In the present embodiment, the area of the region where the convex portion 3z occupying the irradiated region T is the region where the convex portion and the concave portion are formed in the irradiated region T. The area of only the portion 3z is integrated and calculated.

In the present embodiment, in the irradiated region T, the region of the protrusion 3z to be formed, the width W1, the pitch PT, and the like are randomly formed to some extent. Accordingly, a part of the irradiated region T irradiated with the pulse laser is enlarged and observed, and converted into data as an image by a photographing means such as a CCD camera, and compared with each other, thereby making the glass substrate 6 have individual identification (traceability). It becomes possible to grant. Furthermore, it is also possible to identify by the cross-sectional shape of the convex portion 3z and the power spectrum obtained by performing Fourier transform on the image. As a result, an electronic device (for example, a liquid crystal panel, an organic EL panel, a touch panel, a solar cell panel, a panel on which other semiconductor elements are formed, etc.) provided with the glass substrate 6 can be obtained by various known methods. If manufactured, individual identification can be imparted to the electronic device as well. This is extremely advantageous for quality control of electronic devices.

Here, FIG. 13 illustrates the case where the convex portion 3z is formed over three periods. For example, by changing the size of the area of the overlapping irradiation spot Z formed, The number of periods in which the convex portions 3z are formed can be changed. The number of periods in which the convex portions 3z are formed is preferably 2 periods to 30000 periods. Moreover, the area of the area | region in which the convex part 3z which occupies for the to-be-irradiated area | region T can also be changed by changing the size of the area | region in which the overlapping irradiation spot Z is formed. And it is preferable that the area of the area | region in which the convex part 3z which occupies for the to-be-irradiated area | region T was formed is 20% or more. By doing so, the discriminability of the glass substrate 6 can be further improved.

<Third embodiment>
Hereinafter, the manufacturing method of the glass substrate which concerns on 3rd embodiment of this invention is demonstrated. In the description of the glass substrate manufacturing method according to the third embodiment, the same reference numerals are used in the drawings referred to in the description of the third embodiment for the matters already described in the first and second embodiments. The description which overlaps by affixing is abbreviate | omitted, and only the difference with 1st and 2nd embodiment is demonstrated.

FIG. 14 is a longitudinal side view showing a peeling starting point forming step in the method for manufacturing a glass substrate according to the third embodiment of the present invention. As shown in the figure, in the method for manufacturing a glass substrate according to the third embodiment, in the peeling starting point forming step, the inorganic film 3 formed on the adhesion side surface of the support glass 2 is started from the support glass 2 side. Then, the subsequent pulse laser 15 is irradiated from the glass substrate 6 side to the irradiation region 14x of the previous pulse laser 14.

Both

pulse lasers

14 and 15 perform irradiation sorting by branching the optical path L through which the pulse laser 16 oscillated from the laser oscillator 11 passes. That is, both

pulse lasers

14 and 15 are lasers oscillated from the same laser oscillator 11 (oscillation source). The pulse laser 16 oscillated from the laser oscillator 11 passes through the half-wave plate 17 installed in the optical path L and reaches the polarization beam splitter 18. The polarization beam splitter 18 switches whether the pulse laser 16 travels to the optical path L1 for the preceding pulse laser 14 or the optical path L2 for the subsequent pulse laser 15. In the present embodiment, the polarization of both

pulse lasers

14 and 15 is linearly polarized light.

First, the inorganic film 3 is irradiated with the pulse laser 16 as the first pulse laser 14 by advancing the optical path L1 for the first pulse laser 14 to the pulse laser 16. Next, after the irradiation with the first pulse laser 15 is completed, switching is performed by the polarization beam splitter 18 so that the pulse laser 16 travels in the optical path L2. As a result, the optical path L2 for the subsequent pulse laser 15 is advanced to the pulse laser 16, and the inorganic film 3 is irradiated with the pulse laser 16 as the subsequent pulse laser 15. Both

pulse lasers

14 and 15 irradiate the electronic device material 5 on the glass substrate 6 so as to pass through the non-formed region. Further, in the present embodiment, unlike the first embodiment described above, both

pulse lasers

14 and 15 are irradiated in a defocused state without being focused on the inorganic film 3 (both inorganic films 3 are both focused). It is not the focal position of the pulse lasers 14 and 15). Further, the angle of the mirror 12y installed in the optical path L2 is adjusted so that the optical axis of the subsequent pulse laser 15 is inclined with respect to the optical axis of the previous pulse laser 14.

Here, as a kind of both pulse lasers 14 and 15 (pulse laser 16), a solid laser, LD laser, disk laser, fiber laser, etc. can be used. The wavelengths of both pulse lasers 14 and 15 (pulse laser 16) are preferably in the range of 300 nm to 3 μm. Further, the pulse width is preferably in the range of 10 fs to 1 μs. In addition, the frequency is preferably in the range of 0.5 Hz to 10 kHz. The pulse energy is preferably in the range of 1 mJ to 2J. Further, the peak value of the pulse energy is preferably in the range of 5.0 × 10 ⁶ J / cm ² · s to 1.0 × 10 ¹⁵ J / cm ² · s.

Hereinafter, a specific mode of irradiation of both

pulse lasers

14 and 15 will be described with reference to FIG. As shown in FIG. 15, on the inorganic film 3, the irradiation region 14 x of the first pulse laser 14 and the irradiation region 15 x of the subsequent pulse laser 15 are among the regions along the outer peripheral edge 6 a of the glass substrate 6. A circular region including a corner portion of the glass substrate 6 is used. In the present embodiment, both

irradiation regions

14x and 15x are set so that both

irradiation regions

14x and 15x overlap substantially completely on the inorganic film 3. However, the present invention is not limited to this, and as a modification, both the

irradiation regions

14x and 15x may have a mode in which only a part of them overlaps. Moreover, the shape of both irradiation area |

regions

14x and 15x is good not only in circular but arbitrary shapes.

Here, the area of both

irradiation regions

14x and 15x is preferably an area within a range of 10 mm ² to 10000 mm ² . When only a part of both

irradiation regions

14x and 15x is overlapped, the area of the overlapping portion is preferably 10% to 99.9% of the area of both

irradiation regions

14x and 15x.

In the irradiation region 14x of the previous pulse laser 14, the irradiation spot 14a of the previous pulse laser 14 is intermittently formed at a plurality of locations whose positions are different from each other. The plurality of irradiation spots 14a are uniformly formed in the irradiation region 14x. In the present embodiment, the two adjacent irradiation spots 14a are formed so as to partially overlap each other. The area of each irradiation spot 14a is set to an area within the range of 1 mm ² to 500 mm ² . For example, the following procedures (A) and (B) are repeatedly performed to form the irradiation spot 14a at a plurality of locations. (A) After the irradiation pulse 14a is formed on the inorganic film 3 by irradiating the starting pulse laser 14, the irradiation of the starting pulse laser 14 is once stopped. (B) After moving the laminated body 4 to shift the position where the irradiation spot 14a is formed, the irradiation pulse 14a is re-formed at a different position by re-irradiating the previous pulse laser 14.

It should be noted that the present invention is not limited to the embodiment, and as a modification, adjacent irradiation spots 14a may be formed so as not to overlap each other. As another modification, the irradiation with the first pulse laser 14 is performed by moving the stacked body 4 in a state where the first pulse laser 14 is irradiated onto the inorganic film 3, so that the irradiation spot 14a moves within the irradiation region 14x. You may perform in the aspect which scans uniformly. As a further modification, the irradiation with the preceding pulse laser 14 may be performed in such a manner that the irradiation spot 14a having an area equal to the irradiation region 14x is formed only once.

When the formation of each irradiation spot 14a is completed, next, the irradiation spot 15a of the preceding pulse laser 15 is intermittently formed at a plurality of positions different from each other in the irradiation region 15x of the subsequent pulse laser 15. To go. Each irradiation spot 15a is formed so as to overlap a portion where each of the irradiation spots 14a has been formed. The formation of these irradiation spots 15a is performed in the same manner as in the case of forming the irradiation spots 14a. Further, the formation of these irradiation spots 15a may be executed by a modification similar to the case of forming the irradiation spots 14a.

In this embodiment, the formation of the irradiation spot 15a at a plurality of locations is collectively executed after the formation of the irradiation spot 14a at a plurality of locations, but this is not restrictive. As a modification, the formation of the irradiation spot 14a and the formation of the irradiation spot 15a may be performed alternately one by one. In this case, the peeling start point forming step is executed a plurality of times (each of the

irradiation spots

14a and 15a is formed one by one by executing one peeling start point forming step). )

As a result, the following effects occur in the irradiation region 14x of the preceding pulse laser 14 and the irradiation region 15x of the subsequent pulse laser 15. That is, as shown in FIG. 16a, the inorganic film 3 formed on the supporting glass 2 adheres to the glass substrate 6 in the irradiation region 14x as the first pulse laser 14 is irradiated from the supporting glass 2 side. To do. Thereafter, as shown in FIG. 16 b, the inorganic film 3 adhered to the glass substrate 6 during irradiation of the first pulse laser 14 in the irradiation region 15 x as the subsequent pulse laser 15 is irradiated from the glass substrate 6 side. Can be attached to the supporting glass 2 again. That is, the inorganic film 3 is repaired on the support glass 2. In addition, a separation starting point portion 6x in which a part of the glass substrate 6 is separated from the support glass 2 is formed. In addition, when only a part of both irradiation area |

regions

14x and 15x overlaps, in the surface area | region of the support glass 2 corresponding to the location where both irradiation area |

regions

14x and 15x overlapped, the inorganic film | membrane 3 is on the support glass 2. It will be repaired.

Further, in the glass substrate manufacturing method according to the third embodiment, the support glass 2 is repeatedly used in the glass substrate manufacturing method after the peeling step is completed, as in the first and second embodiments. At this time, at the time of executing the second and subsequent laminate manufacturing steps, the irradiation region 15x of the subsequent pulse laser 15 in the separation start portion forming step performed last time (in this embodiment, the irradiation region 14x of the preceding pulse laser 14). Both

glass

1 and 2 are closely_contact | adhered so that the surface area | region of the support glass 2 corresponding to (equal) and the glass film 1 may overlap.

Here is one specific example. FIG. 17 is a plan view showing a laminate manufacturing process executed for the second time. The supporting glass 2 has already undergone a single peeling start point forming step. Thereby, in the peeling start part forming process performed for the first time, the inorganic film 3 is repaired on the support glass 2 in the surface region of the support glass 2 corresponding to the irradiation region 15x of the subsequent pulse laser 15. The support glass 2 and the glass film 1b are brought into close contact so that the surface region and the glass film 1b used in the second laminate manufacturing process overlap. In this specific example, the glass film 1b is brought into close contact with the support glass 2 while avoiding the central portion 2c of the surface region of the support glass 2 corresponding to the irradiation region 15x.

Hereinafter, the operation and effect of the glass substrate manufacturing method according to the third embodiment will be described.

According to the glass substrate manufacturing method of the third embodiment, since both

pulse lasers

14 and 15 are oscillated from the same laser oscillator 11, the first pulse laser 14 and the subsequent pulse laser 15 are combined with the inorganic film 3. Therefore, it is not necessary to separately prepare an oscillation source for the first pulse laser 14 and an oscillation source for the subsequent pulse laser 15. Therefore, it becomes possible to process the inorganic film 3 efficiently.

Further, both

pulse lasers

14 and 15 are irradiated so that the electronic device material 5 on the glass substrate 6 passes through the non-formed region. Therefore, the inorganic film 3 can be irradiated with both

pulse lasers

14 and 15 without adversely affecting the electronic device material 5 due to the pulse laser. Furthermore, since the situation where the energy of the pulse laser is absorbed in the electronic device material 5 does not occur, the energy of both

pulse lasers

14 and 15 can be suitably applied to the inorganic film 3.

Further, by setting the areas of the

irradiation spots

14a and 15a of the two

pulse lasers

14 and 15 within the range of 1 mm ² to 500 mm ² , the irradiation area of the subsequent pulse laser 15 after execution of the peeling start point forming step In the surface region of the supporting glass 2 corresponding to 15x, the inorganic film 3 can be easily restored to a flat state. Moreover, damage to the support glass 2 and the glass substrate 6 can be prevented as much as possible.

Moreover, if the glass film 1 and the support glass 2 are made to adhere | attach, avoiding the center part 2c among the surface area | regions of the support glass 2 corresponding to the irradiation area | region 15x like said specific example, it is as follows. Action and effect are obtained. That is, since the energy of both

pulse lasers

14 and 15 acts the most at the center of the irradiation region 15x, there is a possibility that the inorganic film 3 is not sufficiently repaired on the support glass 2 after the irradiation with the subsequent pulse laser 15. is there. However, if the glass film 1 and the supporting glass 2 are kept in close contact with each other while avoiding the central portion 2c of the surface region of the supporting glass 2 corresponding to the irradiation region 15x, the glass film 1 and the supporting glass 2 are directly attached. It is possible to reliably prevent a situation where a close contact portion is generated or a bubble enters between the two

glasses

1 and 2.

Moreover, the surface area | region of the support glass 2 corresponding to the irradiation area | region 15x of the subsequent pulse laser 15 in the peeling starting part formation process performed last time and the glass film 1 overlap at the time of execution of the laminated body manufacturing process after the 2nd time. As described above, by bringing the two

glasses

1 and 2 into close contact, the following actions and effects can be obtained. That is, in this method, in the second and subsequent laminate manufacturing steps, the inorganic glass 3 interposed between the supporting glass 2 and the glass film 1 is repaired to the supporting glass 2 in the previously performed peeling starting point forming step. The inorganic film 3 made to be included is included. Thereby, the inorganic film | membrane 3 restored | repaired to the support glass 2 can be utilized effectively without waste.

Here, one specific example of the manufacturing method of the glass substrate according to the third embodiment will be given.

As a glass film 1 and a supporting glass 2, OA-10G (non-alkali glass) manufactured by Nippon Electric Glass Co., Ltd. was prepared. The glass film 1 has a thickness of 0.2 mm, and the support glass 2 has a thickness of 0.5 mm. Next, a laminated body production process was performed, and both

glasses

1 and 2 were brought into close contact with each other through the inorganic film 3 at room temperature to produce a laminated body 4. Next, a processing step was performed to form the electronic device material 5 on the glass film 1 to obtain a glass substrate 6. The process temperature of the treatment process was 300 ° C.

Next, a peeling starting point forming step was performed, and a pulse laser 16 having a wavelength of 1064 nm, a pulse width of 5 ns, a frequency of 10 Hz, and a pulse energy of 800 mJ was oscillated from the laser oscillator 11. Then, the inorganic film 3 was irradiated with the first pulse laser 14 and the subsequent pulse laser 15 by switching the optical paths L1 and L2 by the polarization beam splitter 18. As the inorganic film 3, an ITO film (indium tin oxide film) having a thickness of 20 nm was used. Finally, the peeling process was performed and the glass substrate 6 was peeled from the support glass 2 using the suction pad 8.

After executing the peeling step, the same support glass 2 was used again, and the second laminate manufacturing step, the processing step, the peeling start point forming step, and the peeling step were executed under the same conditions as the first time. Then, whether the inorganic film 3 was repaired on the supporting glass 2 in the first peeling starting point forming step and whether the glass substrate 6 was peeled from the supporting glass 2 in the first and second peeling steps were verified. As a result of the verification, it was possible to satisfactorily execute the repair of the inorganic film 3 on the supporting glass 2 in the first peeling starting point forming step. Moreover, in the 1st time and the 2nd peeling process, peeling from the support glass 2 of the glass substrate 6 was able to be performed favorably.

Here, the manufacturing method of the glass substrate which concerns on this invention is not limited to the aspect demonstrated by said each embodiment. In said 1st embodiment, although the pulse laser is irradiated from the support glass side, you may irradiate from the glass substrate side. In this case, the glass substrate positioned on the irradiation source side of the pulse laser absorbs more energy than the supporting glass positioned on the irradiation destination side. Thereby, a part of the glass substrate and the inorganic film are both turned into plasma and adhere to the supporting glass. Therefore, in this case, since the thickness of the supporting glass is avoided from being reduced, it is possible to prevent the surface strength of the supporting glass from being lowered, and it is advantageous in repeatedly using the supporting glass. It becomes.

In each of the above embodiments, the inorganic film is formed with a uniform thickness, but this is not restrictive. For example, in the entire inorganic film, only the portion corresponding to the pulse laser irradiation region in the peeling start point forming step may be thinner than the other portions, or conversely thick. Further, in each of the above embodiments, the inorganic film is formed on the entire surface of the supporting glass in the close contact side. However, the present invention is not limited to this, and the inorganic film may be formed only in a partial region of the close contact side. For example, the inorganic film may be formed only in the region corresponding to the irradiation region of the pulse laser (first and second pulse lasers, first and second pulse lasers) in the peeling start point forming step on the adhesion side surface. The same applies not only when the inorganic film is formed on the adhesion side surface of the supporting glass, but also when the inorganic film is formed on the adhesion side surface of the glass film as a modification of the first and second embodiments. It is.

In each of the above embodiments, an inorganic film is used as the light absorption layer, but this is not necessarily the case. As the light absorption layer, an organic film may be used, or a two-layer film in which an inorganic film and an organic film are stacked may be used. Furthermore, two different kinds of inorganic films or a film composed of two layers in which organic films are stacked may be used. In these cases, the first layer film and the second layer film may not have the same area. For example, after an inorganic film (organic film) is formed on the entire surface of the adhesion glass in the supporting glass, an organic film or an inorganic film is formed only on a part of the surface of the inorganic film (organic film). May be. In addition, these things are the same not only when forming a film on the adhesion side surface of the supporting glass but also when forming a film on the adhesion side surface of the glass film as a modification of the first and second embodiments. It is.

In the first embodiment described above, the pulse laser is irradiated so that the optical axis extends along the thickness direction of the laminate, but the optical axis extends in a direction inclined with respect to the thickness direction of the laminate. May be irradiated with a pulsed laser. Furthermore, the shape of the irradiation region of the pulse laser is not limited to the square as in the first embodiment, and may be an arbitrary shape. For example, it may be a circle or an ellipse, or may be a rectangle or a polygon. In addition, the scanning path for scanning with the pulse laser is not limited to the scanning path shown in FIG. 5 and may be an arbitrary scanning path. For example, scanning may be performed along a spiral scanning path, or scanning may be performed along a zigzag scanning path. Furthermore, in said 1st embodiment, although the irradiation pitch of a pulse laser is constant, it does not need to be constant. In each of the above embodiments, the peeling start point is formed at the corner of the glass substrate, but may be formed at an arbitrary position. For example, an area along one side of the outer peripheral edge of the rectangular glass substrate is an irradiation area of a pulse laser (first and second pulse lasers, first and second pulse lasers), and the side is A separation starting point portion may be formed along. Even when the laminated body is heated uniformly when a processing step involving heating is performed, the supporting glass and the glass substrate are located at the side of the glass substrate (especially the portion about 30 mm inside from the outer contour) rather than the central portion. There is a tendency for the adhesive strength to increase easily. Therefore, if the peeling starting point is formed along the side, it is extremely effective for peeling the glass substrate from the supporting glass. Furthermore, in the first embodiment described above, the pulse laser is irradiated by the galvanometer mirror and the f-θ lens. However, for example, a polygon mirror may be used, or multipoint simultaneous irradiation by a spatial light modulator or the like. May be performed.

In the second embodiment, the irradiation spots of both pulse lasers are formed so that a part of the irradiation spot of the first pulse laser and the irradiation spot of the second pulse laser overlap. This is not the case. It is good also as an aspect which forms both irradiation spots so that both irradiation spots may overlap substantially completely. In this case, the areas of the irradiation spot of the first pulse laser, the irradiation spot of the second pulse laser, and the overlapping irradiation spot are substantially equal.

In the second embodiment, the first pulse laser is irradiated from the support glass side and the second pulse laser is irradiated from the glass substrate side, but this is not restrictive. For example, both pulse lasers may be irradiated from the supporting glass side or from the glass substrate side. Furthermore, it is good also as an aspect which irradiates not only two of the 1st and 2nd pulse lasers but more many pulse lasers to an inorganic film | membrane. For example, when the inorganic film is irradiated with a new third pulse laser, the third pulse laser is generated by reflecting the second pulse laser that has passed through the laminate toward the laminate with a mirror. May be. Also in this case, the third pulse laser is irradiated so that at least a part of the irradiation spot of the third pulse laser overlaps with the irradiation spots of the first and second pulse lasers. Similarly, when the inorganic film is irradiated with a new fourth pulse laser, the fourth pulse laser is reflected by reflecting the third pulse laser that has passed through the laminate to the laminate with a mirror. It may be generated. If the thus-reflected pulse laser is repeatedly irradiated to the inorganic film, the energy of the pulse laser can be used efficiently. In addition, even when using a plurality of pulsed lasers having linearly polarized light, if three or more pulsed lasers are reflected simultaneously, the projections tend to be formed in a staggered dot shape, A peculiar periodic pattern corresponding to the number of pulse laser irradiations is formed.

In the second embodiment, the first pulse laser and the second pulse laser are oscillated from the same laser oscillator. In the third embodiment, the first pulse laser and the second pulse laser are the same. Although oscillating from a laser oscillator, these may be oscillated from separate laser oscillators. However, even in this case, it is preferable to irradiate the inorganic film with mutually coherent pulse lasers. Moreover, in said 2nd and 3rd embodiment, although polarized light of each pulse laser is made into linearly polarized light, it is good also as circularly polarized light, elliptically polarized light, radial polarized light, azimuth polarized light etc., for example.

Moreover, in said 3rd embodiment, even if it controls the displacement to the direction away from a support glass with respect to the site | part of the glass substrate corresponding to the irradiation area | region of the starting and subsequent pulse laser in a peeling starting part formation process. Good. As an example of the mode for regulating displacement, there can be mentioned a mode in which a glass plate is placed on a glass substrate and the glass substrate is pressed against the supporting glass by its own weight. In this way, it is possible to accurately eliminate the fear that the glass substrate will be damaged. In the same manner, in the separation starting point forming step of the second embodiment, the direction away from the support glass with respect to the portion of the glass substrate corresponding to the irradiation region by the overlapping irradiation spots of the first and second pulse lasers The displacement may be restricted (the same applies when overlapping irradiation spots are formed by three or more pulse lasers). In this way, the possibility that the glass substrate may be damaged can be accurately eliminated, as in the case where displacement is regulated in the separation starting point forming step of the third embodiment. Note that this displacement regulation is preferably executed when the area of the overlapping irradiation spot is 20 mm ² or more. Here, “the part of the glass substrate corresponding to the irradiation region by the overlapping irradiation spot” means the part of the glass substrate that overlaps with the irradiation region by the overlapping irradiation spot in plan view when the peeling start point forming step is executed.

In addition, the manufacturing method of the glass substrate which concerns on this invention is applicable also in the following cases, for example. That is, when manufacturing the liquid crystal panel, after facing the two laminated bodies so that the two glass substrates are bonded together with a sealing member for enclosing the liquid crystal, each of the two laminated bodies, It can be applied to the case where the supporting glass side is adsorbed and the glass substrate is peeled off from the supporting glass.

Here, the electronic device according to the present invention is not limited to the configuration described in the above embodiment. In the above embodiment, in the glass substrate provided in the electronic device, the convex portion formed of the inorganic film is periodically formed. However, this is not the only case, and there is a portion where the convex portion is not periodically formed. It may be included. Such a glass substrate can be manufactured, for example, in the case of using a glass film having fine particles attached to a region where an overlapping irradiation spot is formed in the glass substrate manufacturing method according to the second embodiment. is there. And in an electronic device provided with this glass substrate, it becomes discriminable also by the positional relationship of a particle and a convex part, and individual discernibility can be further raised about this electronic device.

As an example of the present invention, the method for producing a glass substrate according to the first embodiment was performed under the following conditions, and the possibility of peeling of the glass substrate from the supporting glass was verified. The example was verified under five conditions, and the comparative example was verified only under one condition.

Hereinafter, implementation conditions common to all of Examples 1 to 5 will be described. OA-10G (non-alkali glass) manufactured by Nippon Electric Glass Co., Ltd. was prepared as a glass film and supporting glass. The glass film has a thickness of 0.2 mm, and the supporting glass has a thickness of 0.5 mm. Next, as a laminated body production process, both glasses were brought into close contact with each other through an inorganic film at room temperature to produce a laminated body. Next, a processing step was performed. In the processing step, the formation of the electronic device material is omitted, and as an alternative, the laminated body is heated to apply a temperature change to the laminated body when the electronic device material is formed, and the resist ink is applied. , Curing and removal. The resist ink was applied to the heated laminate, dried in an oven, and then cured by irradiation with UV light. Furthermore, the hardened resist was removed by using a resist remover. Next, as the separation starting point forming step, a pulse laser was condensed on the inorganic film and irradiated by a galvanometer mirror and an f-θ lens. Finally, as a peeling process, the glass substrate was adsorbed by a plurality of suction pads, and an attempt was made to peel the glass substrate from the supporting glass.

Hereinafter, the implementation conditions unique to each of Examples 1 to 5 will be described. In Examples 1 to 5, (1) the kind of inorganic film interposed between the glass film and the supporting glass, (2) the thickness of the inorganic film, and (3) the process temperature in the treatment step (heating of the laminate) The four points of (temperature) and (4) pulse laser irradiation conditions were set as specific implementation conditions. The implementation conditions (1) to (3) are as shown in [Table 1] below. Regarding (4), in Examples 1 to 4, the wavelength of the pulse laser is 532 nm, the pulse width is 20 ps, the frequency is 100 kHz, the pulse energy is 7 μJ, the length of one side of the square formed by the irradiation region is 10 mm, and the irradiation pitch is 10 μm. The focal length was 160 mm. In Example 5, the wavelength of the pulse laser was 1552 nm, the pulse width was 800 fs, the frequency was 100 kHz, the pulse energy was 4 μJ, the length of one side of the square formed by the irradiation region was 10 mm, the irradiation pitch was 20 μm, and the focal length was 100 mm. .

Hereinafter, the implementation conditions of the comparative example will be described. The implementation conditions of the comparative example differ from the implementation conditions of Examples 1 to 5 in that (1) no inorganic film is interposed between the glass film and the supporting glass, and (2) laminate production After implementing a process and a process process, it is two points with the point which is implementing the peeling process, without implementing the peeling origin part formation process. In addition, the process temperature (heating temperature of a laminated body) of the process process in a comparative example was 300 degreeC.

[Table 1] shows the results of verifying whether the glass substrate can be peeled from the supporting glass in Examples 1 to 5 and Comparative Example. In Table 1, the value shown in parentheses in the item of film type represents the thickness of the inorganic film. In the laser irradiation item, the value shown in parentheses represents the pulse width of the pulse laser.

From the results of [Table 1], it can be seen that in Examples 1 to 5, good results were obtained unlike the comparative examples. From the above, it is presumed that according to the method for producing a glass substrate according to the present invention, the glass substrate can be smoothly peeled from the supporting glass.

DESCRIPTION OF SYMBOLS 1 Glass film 2 Support glass 2ax, 2bx Support glass surface area 2y Support glass surface area 3 Inorganic film 3z Convex part 4 Laminated body 5 Electronic device material 6 Glass substrate 6x Peeling origin part 6a Outer edge part of glass substrate 7 Pulse laser 7x irradiation region 9 first pulse laser 9a first pulse laser irradiation spot 10 second pulse laser 10a second pulse laser irradiation spot Z overlap irradiation spot 11 laser irradiator 14 first pulse laser 14a first pulse Laser irradiation spot 14x First pulse laser irradiation region 15 Subsequent pulse laser 15a Subsequent pulse laser irradiation spot 15x Width PT formation pitch width W2 gap irradiated region T irradiated region W1 protrusion of the origination of the pulsed laser

Claims

A laminate production step of producing a laminate in which a flexible glass film and a supporting glass supporting the glass film are adhered to each other via a light absorption layer;
Forming an electronic device material on the glass film in the laminate, and processing the glass film as a glass substrate,
A method for producing a glass substrate including a peeling step of peeling the entire glass substrate from the supporting glass,
After the execution of the processing step and before the peeling step, the light absorption layer is irradiated with a pulse laser, and a part of the glass substrate is peeled off from the support glass in the irradiation region. The manufacturing method of the glass substrate characterized by performing the peeling starting point part formation process which forms the peeling starting point part used as the starting point of a peeling process.
The method for producing a glass substrate according to claim 1, wherein the light absorption layer is composed of an inorganic film.
The method for producing a glass substrate according to claim 1 or 2, wherein an irradiation region of the pulse laser is a region along an outer peripheral edge of the glass substrate.
The glass substrate has a rectangular shape;
The method for producing a glass substrate according to any one of claims 1 to 3, wherein the separation starting point is formed at a corner of the glass substrate.
The method for producing a glass substrate according to any one of claims 1 to 4, wherein the pulse laser is irradiated from the supporting glass side.
The method for producing a glass substrate according to any one of claims 1 to 5, wherein a pulse width of the pulse laser is set to 500 ps or less.
While repeatedly using the same supporting glass, the method for producing a glass substrate according to any one of claims 1 to 6 is repeated a plurality of times,
At the time of executing the laminate manufacturing process for the second and subsequent times, the glass film does not overlap with the surface area of the support glass corresponding to the irradiation area of the pulse laser in the peeling start point forming process executed before the previous time. A method for producing a glass substrate, wherein both glasses are brought into close contact with each other.
5. The method according to claim 1, wherein, in the separation starting portion forming step, the light absorption layer is irradiated with a plurality of pulse lasers, and at least a part of these irradiation spots overlaps to form an overlapping irradiation spot. The manufacturing method of the glass substrate in any one.
The method for producing a glass substrate according to claim 8, wherein the plurality of pulse lasers are oscillated from the same oscillation source.
The plurality of pulse lasers include a first pulse laser irradiated from the support glass side and a second pulse laser irradiated from the glass substrate side,
One of the first pulse laser and the second pulse laser is generated by reflecting the other pulse laser transmitted through the laminate toward the laminate. The manufacturing method of the glass substrate of Claim 9.
While repeatedly using the same supporting glass, the method for producing a glass substrate according to any one of claims 8 to 10 is repeated a plurality of times,
At the time of executing the laminate manufacturing process after the second time, the glass film does not overlap with the surface area of the supporting glass corresponding to the irradiation area by the overlapping irradiation spot in the peeling start point forming process executed before the previous time. A method for producing a glass substrate, characterized in that both glasses are brought into close contact with each other.
While forming the light absorption layer on the support glass,
In the peeling start point forming step, after the pulse laser is irradiated to the light absorption layer as a starting pulse laser from the supporting glass side, further, from the glass substrate side to the irradiation region of the starting pulse laser. The method for producing a glass substrate according to any one of claims 1 to 4, wherein a subsequent pulse laser is irradiated.
The method for producing a glass substrate according to claim 12, wherein the first pulse laser and the second pulse laser are oscillated from the same oscillation source.
14. The glass substrate according to claim 12, wherein the first pulse laser and the subsequent pulse laser are irradiated so that the electronic device material in the glass substrate passes through a non-formation region. Production method.
Glass according to any one of claims 12 to 14, characterized in that the area within the range irradiated with the spot of 1 mm 2 ~ 500 mm 2 each pulse laser irradiation spot and the subsequent pulse laser of the starting A method for manufacturing a substrate.
In the peeling starting point forming step, from the support glass, the part of the glass substrate corresponding to the irradiation region of the preceding pulse laser and the part of the glass substrate corresponding to the irradiation region of the subsequent pulse laser. The method for manufacturing a glass substrate according to claim 15, wherein displacement in the direction of separation is restricted.
The same supporting glass is repeatedly used, and the method for producing a glass substrate according to any one of claims 12 to 16 is repeated a plurality of times,
At the time of executing the laminate manufacturing process for the second and subsequent times, the glass film overlaps with the surface area of the support glass corresponding to the irradiation area of the subsequent pulse laser in the peeling start point forming process executed last time. A method for producing a glass substrate, wherein both glasses are brought into close contact with each other.
An electronic device comprising a glass substrate in which an electronic device material is formed on a glass film,
An electronic device, wherein the glass film has an irradiated region irradiated with a pulse laser from both front and back sides, and a plurality of convex portions made of a film are formed in the irradiated region.
The plurality of convex portions are formed in parallel,
The width of the convex portions and the width of the gap formed between the adjacent convex portions are each 0.1 μm to 20 μm, and the formation pitch of the plurality of convex portions is 0.2 μm to 40 μm, and 19. The electronic device according to claim 18, wherein an area of the region where the protrusion is formed in the irradiated region is 10% or more.