WO2015060289A1 - Phosphor composition, phosphor sheet, phosphor sheet laminate, led chip and led package each using said phosphor composition, phosphor sheet or phosphor sheet laminate, and method for manufacturing led package - Google Patents
Phosphor composition, phosphor sheet, phosphor sheet laminate, led chip and led package each using said phosphor composition, phosphor sheet or phosphor sheet laminate, and method for manufacturing led package Download PDFInfo
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- WO2015060289A1 WO2015060289A1 PCT/JP2014/077914 JP2014077914W WO2015060289A1 WO 2015060289 A1 WO2015060289 A1 WO 2015060289A1 JP 2014077914 W JP2014077914 W JP 2014077914W WO 2015060289 A1 WO2015060289 A1 WO 2015060289A1
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- Prior art keywords
- phosphor
- phosphor sheet
- compound particles
- metal compound
- refractive index
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Definitions
- the present invention relates to a phosphor composition, a phosphor sheet, a phosphor sheet laminate, an LED chip using them, an LED package, and a method for producing the same.
- LEDs Light-emitting diodes
- LCD backlights LCD backlights
- in-vehicle headlights spotlights
- general lighting applications featuring low power consumption, long service life, and design with a dramatic improvement in luminous efficiency.
- the market is expanding rapidly.
- the refractive index of the LED chip or phosphor is higher than the refractive index of the resin contained in the phosphor sheet, the light generated in the LED chip is sufficiently externally reflected by the reflection at the LED chip or phosphor interface. It cannot be taken out.
- a conversion layer disposed on an LED chip contains a fluorescent agent, a binder material, and a plurality of nanoparticles, and the nanoparticles are dispersed so as to closely match the refractive index of the fluorescent agent particles.
- the above method has a problem in that the cost increases because the number of processes such as etching by dry etching or the like on the LED chip, or by laminating thin layers having different refractive indexes many times. There is also a problem that the brightness of the LED package is not improved.
- the present inventors have found that the brightness of the LED package is not improved due to the following two reasons.
- the present invention focuses on the above problems and aims to reduce the LED package manufacturing process and improve the brightness of the LED package.
- One feature of the present invention is a phosphor composition containing a phosphor, a matrix resin, and metal compound particles, wherein the metal compound particles have a refractive index of 1.7 or more, and an average particle diameter. 1 to 50 nm, the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship with the refractive index N2 of the phosphor, and the metal compound particles are grafted: A phosphor composition. 0.20 ⁇
- Another feature of the present invention is a phosphor sheet containing a phosphor, a matrix resin, and metal compound particles, wherein the metal compound particles have a refractive index of 1.7 or more and an average particle diameter. Is 1 to 50 nm, the metal compound particles are grafted, and the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship (i) with the refractive index N2 of the phosphor:
- the phosphor sheet is characterized in that the viscoelastic behavior of the sheet satisfies the following relationships (ii), (iii), and (iv).
- the storage elastic modulus G ′ is 1.0 ⁇ 10 4 Pa ⁇ G ′ ⁇ 1.0 ⁇ 10 6 Pa at a temperature of 25 ° C. and tan ⁇ ⁇ 1
- Storage modulus G ′ is 1.0 ⁇ 10 2 Pa ⁇ G ′ ⁇ 1.0 ⁇ 10 4 Pa at a temperature of 100 ° C. and tan ⁇ ⁇ 1
- the storage elastic modulus G ′ is 1.0 ⁇ 10 4 Pa ⁇ G ′ ⁇ 1.0 ⁇ 10 6 Pa at a temperature of 200 ° C. and tan ⁇ ⁇ 1.
- an LED package with improved brightness can be provided by a simple process.
- An example of the LED package using the fluorescent substance sheet laminated body of this invention An example of the LED package using the fluorescent substance sheet laminated body of this invention.
- the schematic diagram of an illumination intensity measurement system An example of the LED package manufacturing method using the fluorescent substance composition of this invention.
- An example of the manufacturing method of the LED package using the fluorescent substance sheet laminated body of this invention An example of the manufacturing method of the LED chip with a fluorescent substance sheet using the fluorescent substance sheet laminated body of this invention.
- An example of the method for attaching the phosphor sheet laminate of the present invention An example of the method for attaching the phosphor sheet laminate of the present invention An example of the manufacturing method of the LED package using the fluorescent substance sheet laminated body of this invention. An example of the manufacturing method of the LED package using the fluorescent substance sheet laminated body of this invention.
- a phosphor composition that is one feature of the present invention is a phosphor composition containing a phosphor, a matrix resin, and metal compound particles, and the refractive index of the metal compound particles is 1.7 or more.
- the average particle diameter is 1 to 50 nm
- the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship with the refractive index N2 of the phosphor, and the metal compound particles are grafted: It is characterized by. 0.20 ⁇
- the phosphor composition refers to a composition containing a phosphor, a matrix resin, and metal compound particles.
- the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship with the refractive index N2 of the phosphor. 0.20 ⁇
- the phosphor composition of the present invention when installed on the light emitting surface of the LED chip, the light extracted from the LED chip can be efficiently applied to the phosphor, and the light extraction performance of the LED chip is improved. As a result, the brightness of the LED package is improved.
- the matrix resin contains the metal compound particles
- the difference in refractive index between the mixed component and the phosphor can be reduced.
- the refractive index of the entire phosphor composition can be brought close to the refractive index of the LED chip. Therefore, total reflection inside the LED chip can also be suppressed, and light extraction from the LED chip is improved. As a result of these two effects, the brightness of the LED package can be improved.
- is 0.20, more preferably 0.10, and particularly preferably 0.05.
- the greater the effect. Therefore, the lower limit is not particularly limited, but
- the average refractive index N1 of the matrix resin containing metal compound particles is represented by the sum of the product of the refractive index and volume fraction of the metal compound particles and the product of the refractive index and volume fraction of the matrix resin.
- the refractive index can be measured using a refractive index / film thickness measuring device “Prism Coupler Model 2010 / M” (manufactured by Metricon). Specifically, a transparent film of a composition in which metal compound particles are dispersed in a matrix resin is prepared, and the refractive index (TE) in the direction perpendicular to the film surface at 633 nm (using a He—Ne laser) is measured at a measurement temperature of 25 ° C. The average refractive index N1 can be obtained by measuring.
- the refractive index N2 of the phosphor can be obtained by the Becke line method, the liquid immersion method, and the extrapolation method.
- Metal compound particles used in the present invention have a refractive index of 1.7 or more and an average particle diameter of 1 to 50 nm.
- such metal compound particles are referred to as “high refractive index nanoparticles”.
- high refractive index nanoparticles are sufficiently smaller than the wavelength of visible light, they can be regarded as optically homogeneous by being dispersed in a matrix resin.
- the average refractive index of the matrix resin containing metal compound particles having an average particle diameter of 1 to 50 nm is the refractive index and volume of the metal compound particles. It is expressed as the sum of the product of the fraction and the product of the refractive index and the volume fraction of the matrix resin. That is, if the metal compound particles have a refractive index larger than that of the matrix resin, the average refractive index can be increased.
- the average particle diameter is smaller than 1 nm, the metal compound particles are difficult to exist as particles, and when the average particle diameter is larger than 50 nm, light is easily scattered and the light transmittance is lowered. From the viewpoint of suppressing light scattering, the average particle diameter is preferably 1 to 30 nm.
- the average particle diameter of the metal compound particles is an average value of particle diameters obtained by the following method. From the two-dimensional image obtained by observing the particles with a scanning electron microscope (SEM), the one that maximizes the distance between the two intersections of the straight line that intersects the outer edge of the particles at two points is calculated as the particle diameter. It is defined as Measurement is performed on 200 particles observed, and the average value of the obtained particle diameters is defined as the average particle diameter.
- SEM scanning electron microscope
- Metal compound particles include titania, zirconia, alumina, ceria, tin oxide, indium oxide, zircon, iron oxide, zinc oxide, niobium oxide, silicon nitride, boron nitride, aluminum nitride, silicon carbide, aluminum hydroxide, barium titanate Diamond etc. are mentioned, These may be used independently and may be used together 2 or more types. From the viewpoint of high refractive index and easy availability, at least one selected from the group consisting of aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles, and niobium compound particles is preferably used.
- oxides, sulfides and hydroxides of aluminum, tin, titanium, or zirconium are preferably used.
- the metal compound particles have a high refractive index, the average refractive index when dispersed in the matrix resin can be increased, and as described above, the difference in refractive index from the LED chip is reduced to extract light from the LED chip. Efficiency can be improved.
- Commercially available metal compound particles include tin oxide-titanium oxide composite particles “OPTRAIK TR-502”, “OPTRAIK TR-504”, “OPTRAIK TR-520”, and silicon oxide-titanium oxide composite particles.
- the fact that the metal compound particles are grafted means that the polymer is chemically bonded (grafted) to the particle surface using hydroxyl groups present on the particle surface.
- the adhesion between the phosphor composition and the light emitting surface of the LED chip is an important factor for improving the brightness of the LED package. If the adhesiveness with the LED chip decreases due to the occurrence of voids or cracks such as air between the light emitting surface of the LED chip and the phosphor composition or phosphor sheet, the light extraction efficiency decreases.
- the dispersibility of the metal compound particles in the matrix resin is improved, and the compatibility between the metal compound particles and the matrix resin is improved. This makes it difficult for the interface between the matrix resin and the metal compound particles to occur. Therefore, when installing the phosphor composition or the phosphor sheet on the light emitting surface of the LED chip, it is possible to suppress voids or cracks that occur when the phosphor composition or the phosphor sheet is cured. Therefore, when they are installed on the light emitting surface of the LED chip, the adhesion between them and the light emitting surface is improved, the light extraction from the LED chip is improved, and as a result, the brightness of the LED package is improved.
- FIGS. 1 and 2 Examples of the state where the interface between the matrix resin and the metal compound particles is not generated are shown in FIGS. 1 and 2, and examples of the state where the interface is generated are shown in FIGS. 1 and 2 are photographs obtained by cutting a cross section of a cured film of the phosphor composition of Example 10 described later and observing with a scanning electron microscope (SEM), and FIGS. 3 and 4 are comparative examples described later. It is the photograph which cut
- SEM scanning electron microscope
- the metal compound particles are uniformly dispersed in the matrix resin, and the boundary portion between the metal compound particles and the matrix resin is not present. It becomes clear.
- the metal compound particles 102 form an aggregate in which the metal compound particles are aggregated. The boundary between the aggregate and the matrix resin 101 is clearly observed.
- the type of polymer used for grafting the metal compound particles is not particularly limited as long as it is chemically bonded to the surface of the metal compound particles. It may be a water-soluble polymer (for example, poly (N-isopropylacrylamide), polyethylene glycol, polyacrylamide, polyvinyl alcohol, polyethylene oxide, polyvinyl pyrrolidone, initial condensate such as resole resin, urea resin, melamine resin, etc.) or water-insoluble.
- a water-soluble polymer for example, poly (N-isopropylacrylamide), polyethylene glycol, polyacrylamide, polyvinyl alcohol, polyethylene oxide, polyvinyl pyrrolidone, initial condensate such as resole resin, urea resin, melamine resin, etc.
- It may be a polymer (for example, polysiloxane, 1,4-cis-isoprene, isoprene elastomer, polystyrene, polybutadiene, polyisoprene, polymethyl methacrylate, poly n-butyl acrylate, polyvinyl chloride, polyacrylonitrile, polylactic acid, etc.).
- polysiloxane which is a condensate of alkoxysilane described later.
- the presence or absence of grafting on the particle surface is observed with a scanning electron microscope (hereinafter referred to as SEM) or a transmission electron microscope (hereinafter referred to as TEM) at the boundary between the metal compound particles and the matrix resin.
- SEM scanning electron microscope
- TEM transmission electron microscope
- the method of grafting the polymer onto the metal compound particle surface is not particularly limited, but it is desirable to graft the particle surface by condensation polymerization of a siloxane compound.
- Particularly preferred is a method in which an alkoxysilane compound is hydrolyzed with an acid catalyst in a solvent in the presence of metal compound particles, and then the hydrolyzate is subjected to a condensation reaction.
- Polysiloxane is a condensate of alkoxysilane, which can be obtained by hydrolyzing an alkoxysilane compound in a solvent with an acid catalyst to form a silanol compound and then subjecting the silanol compound to a condensation reaction.
- alkoxysilane compound one or more alkoxysilane compounds selected from the alkoxysilane compounds represented by the following general formulas (1) to (3) are preferable.
- R 1 Si (OR 4 ) 3 (1)
- R 1 represents hydrogen, an alkyl group, an alkenyl group, an aryl group, or a substituted product thereof. From the viewpoint of crack resistance, it is preferable to use an alkoxysilane compound having a methyl group or a phenyl group as R 1 .
- R 4 represents a methyl group, an ethyl group, a propyl group, an isopropyl group, or a butyl group, and may be the same or different.
- R 4 is more preferably a methyl group or an ethyl group.
- R 2 and R 3 each represent hydrogen, an alkyl group, an alkenyl group, an aryl group, or a substituted product thereof.
- R 5 represents a methyl group, an ethyl group, a propyl group, an isopropyl group, or a butyl group, and may be the same or different.
- R5 is more preferably a methyl group or an ethyl group.
- R 6 represents a methyl group or an ethyl group, and may be the same or different.
- alkoxysilane compounds represented by the general formulas (1) to (3) are shown below.
- Examples of the trifunctional alkoxysilane compound represented by the general formula (1) include methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, methyltriisopropoxysilane, methyltributoxysilane, and ethyltrimethoxysilane.
- Ethyltriethoxysilane hexyltrimethoxysilane, octadecyltrimethoxysilane, octadecyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriisopropoxysilane, 3-aminopropyltriethoxysilane, N- (2- Aminoethyl) -3-aminopropyltrimethoxysilane, 3-chloropropyltrimethoxysilane, 3- (N, N-diglycidyl) aminopropyltrimethoxysilane, 3-glycidoxyship Pyrtrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ -methacryloxypropyltriethoxysilane, ⁇ -a
- Examples of the bifunctional alkoxysilane compound represented by the general formula (2) include dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methylphenyldimethoxysilane, methylvinyldimethoxysilane, and methylvinyl.
- Examples of the tetrafunctional alkoxysilane compound represented by the general formula (3) include tetramethoxysilane and tetraethoxysilane.
- alkoxysilane compounds represented by the general formulas (1) to (3) may be used alone or in combination of two or more.
- a phenyl group-containing alkoxysilane compound and a methyl group-containing alkoxysilane compound are preferable to use.
- the matrix resin is a silicone resin, compatibility with the matrix resin is improved, and a phosphor composition and a phosphor sheet having excellent adhesion can be obtained.
- the trifunctional alkoxysilane compound is preferably contained in an amount of 100 to 70 mol%
- the bifunctional alkoxysilane compound is preferably contained in an amount of 0 to 30 mol%. More preferably, it contains 10 to 20 mol% of a functional alkoxysilane compound.
- the handleability of the phosphor sheet indicates the ease of handling of the sheet when the sheet is attached to the LED chip.
- the handleability is correlated with the hardness of the phosphor sheet. If the sheet is too hard, the sheet may crack or break when the sheet is handled using tweezers or a thermocompression bonding tool. On the other hand, if the sheet is too soft, when the sheet is lifted with tweezers or a thermocompression bonding tool, the shape is deformed, or the sheet is stuck to the tweezers or thermocompression bonding tool, making it difficult to adhere to the LED chip.
- the trifunctional alkoxysilane compound is preferably a trifunctional alkoxysilane compound represented by the general formula (1), and the bifunctional alkoxysilane compound is a bifunctional alkoxy compound represented by the general formula (2). It is preferable that it is a functional alkoxysilane compound.
- an acid catalyst and water are added to the above alkoxysilane compound in a solvent in the presence of the metal compound particles over 1 to 180 minutes, and then reacted at room temperature to 110 ° C. for 1 to 180 minutes. preferable.
- the reaction temperature is more preferably 40 to 105 ° C.
- the condensation reaction by heating the reaction solution as it is at 50 ° C. or higher and below the boiling point of the solvent for 1 to 100 hours.
- Examples of the acid catalyst used in the hydrolysis reaction include acid catalysts such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyvalent carboxylic acid or anhydrides thereof, and ion exchange resins.
- acid catalysts such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyvalent carboxylic acid or anhydrides thereof, and ion exchange resins.
- an acidic aqueous solution using formic acid, acetic acid or phosphoric acid is preferred.
- a preferable content of these acid catalysts is preferably 0.05 parts by weight or more, more preferably 0.1 parts by weight or more, preferably 100 parts by weight or more with respect to 100 parts by weight of the total alkoxysilane compound used in the hydrolysis reaction. Is 10 parts by weight or less, more preferably 5 parts by weight or less.
- the total amount of the alkoxysilane compound means an amount including all of the alkoxysilane compound, its hydrolyzate and its condensate, and the same shall apply hereinafter.
- the solvent is appropriately selected in consideration of the dispersion stability of the metal compound particles.
- the solvent can be used not only as one type but also as a mixture of two or more types.
- the solvent include diacetone alcohol, propylene glycol monomethyl ether acetate, ethyl lactate, and ⁇ -butyrolactone.
- Propylene glycol monomethyl ether acetate, ⁇ -butyrolactone, and diacetone alcohol are particularly preferably used from the viewpoint of transmittance, ease of hydrolysis, and control of condensation reaction.
- the amount of the solvent used in the hydrolysis reaction is preferably 50 parts by weight or more and more preferably 80 parts by weight or more with respect to 100 parts by weight of the total alkoxysilane compound. Moreover, 500 weight part or less is preferable and 200 weight part or less is more preferable.
- generation of a gel can be suppressed by making the quantity of a solvent into 50 weight part or more. Moreover, a hydrolysis reaction advances rapidly by setting it as 500 parts weight or less.
- water used for the hydrolysis reaction ion-exchanged water is preferable.
- the amount of water can be arbitrarily selected, but it is preferably used in the range of 1.0 to 4.0 mol with respect to 1 mol of the alkoxysilane compound.
- the phosphor absorbs light emitted from the LED chip, performs wavelength conversion, and emits light having a wavelength different from that of the LED chip. Thereby, a part of the light emitted from the LED chip and a part of the light emitted from the phosphor can be mixed to produce a multicolor LED package containing white. Specifically, white light can be emitted by optically coupling a fluorescent material that emits a yellow light emission color with light from the LED chip to the blue LED chip.
- the phosphors as described above include various phosphors such as a phosphor that emits green light, a phosphor that emits blue light, a phosphor that emits yellow light, and a phosphor that emits red light.
- the phosphor is not particularly limited as long as it can finally reproduce a predetermined color, and a known phosphor can be used.
- Examples of phosphors corresponding to blue LED chips include YAG phosphors, TAG phosphors, silicate phosphors, nitride phosphors, oxynitride phosphors, and the like.
- the matrix resin forms a continuous phase and is an epoxy resin, silicone resin (silicone rubber, silicone gel or other organopolysiloxane cured material as long as it is a material excellent in moldability, transparency, heat resistance, adhesiveness, etc. Products (including cross-linked products), urea resins, fluororesins, polycarbonate resins and the like can be used. By appropriately designing these resins, a resin useful for the phosphor composition of the present invention can be obtained.
- a dispersing agent or leveling agent for stabilizing the coating film as an additive, and an adhesion aid such as a silane coupling agent as a sheet surface modifier.
- an adhesion aid such as a silane coupling agent
- inorganic particles such as silica particles and silicone fine particles as a phosphor sedimentation inhibitor.
- a thermosetting or photocurable one is preferable. From the viewpoints of transparency and heat resistance, an epoxy resin, a silicone resin, or a mixture thereof can be suitably used.
- the matrix resin is most preferably a silicone resin from the viewpoint of heat resistance.
- silicone resins addition reaction curable silicone compositions are preferred.
- the addition reaction curable silicone composition is heated and cured at room temperature or 50 to 200 ° C., and is excellent in transparency, heat resistance, and adhesiveness.
- a silicone having an alkenyl group bonded to a silicon atom, a silicone having a hydrogen atom bonded to a silicon atom, and a catalytic amount of a platinum-based catalyst can be used.
- a silicone resin containing a silicon atom having a siloxane bond and having an aryl group directly bonded thereto is preferably used.
- a silicone resin having a siloxane bond and containing a silicon atom directly bonded to a naphthyl group is preferable because both a high refractive index and heat and light resistance can be achieved.
- the silicone resin having a siloxane bond and containing a silicon atom directly bonded to an aryl group includes a silicone resin having a siloxane bond and containing a silicon atom directly bonded to a phenyl group, a siloxane bond, and a methyl resin. And a silicone resin containing a silicon atom in which a group and a phenyl group are directly connected.
- Silicone resins having a siloxane bond and containing a silicon atom directly bonded to a naphthyl group include a silicone resin having a siloxane bond and a silicon atom directly bonded to a methyl group and a naphthyl group, and having a siloxane bond. And a silicone resin containing a silicon atom in which a methyl group, a phenyl group, and a naphthyl group are directly connected.
- the silicone resin will be described in more detail.
- An addition reaction curable silicone composition containing a silicone having an alkenyl group bonded to a silicon atom, a silicone having a hydrogen atom bonded to a silicon atom, and a platinum-based catalyst as a hydrosilylation reaction catalyst is preferable.
- sealing materials “OE6630” and “OE6636” manufactured by Toray Dow Corning Co., Ltd., “SCR-1012” and “SCR1016” manufactured by Shin-Etsu Chemical Co., Ltd. can be used.
- the matrix resin of the phosphor composition of the present invention is particularly preferably a crosslinked product obtained by hydrosilylation reaction of a crosslinkable silicone composition containing the compositions (A) to (D).
- This crosslinked product can be preferably used as a matrix resin for a phosphor sheet that does not require an adhesive because the storage elastic modulus decreases at 60 ° C. to 250 ° C. and a high adhesive force is obtained by heating.
- this cross-linked product is referred to as a heat sealing resin.
- R 1 is an alkenyl group
- R 2 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 3 is an alkenyl group, and m is an integer of 5 to 50.
- m is an integer of 5 to 50.
- R 4 is a phenyl group, or an alkyl group or cycloalkyl group having 1 to 6 carbon atoms, provided that 30 to 70 mol% of R 4 is phenyl.
- ⁇ Amount such that the molar ratio of silicon-bonded hydrogen atoms in this component to the total of alkenyl groups in component (A) and component (B) is 0.5 to 2 ⁇
- D Catalyst for hydrosilylation reaction ⁇ Amount sufficient to promote hydrosilylation reaction between alkenyl group in component (A), component (B) and silicon atom-bonded hydrogen atom in component (C) ⁇ .
- component (A) the values of a, b, and c are sufficient to obtain sufficient hardness at room temperature of the resulting crosslinked product, and softening at high temperature.
- component (B) if the content of the phenyl group is less than the lower limit of the above range, the resulting crosslinked product is insufficiently softened at a high temperature. The resulting crosslinked product loses its transparency, and its mechanical strength also decreases.
- at least one R 3 is an alkenyl group. This is because if the alkenyl group is not present, this component is not taken into the crosslinking reaction, and this component may bleed out from the resulting crosslinked product.
- m is an integer in the range of 5 to 50, and this is a range in which handling workability is maintained while maintaining the mechanical strength of the resulting crosslinked product.
- the content of the component (B) is within a range of 5 to 15 parts by weight with respect to 100 parts by weight of the component (A), and is a range for obtaining sufficient softening at a high temperature of the resulting crosslinked product. .
- R 4 is a phenyl group, or an alkyl group or cycloalkyl group having 1 to 6 carbon atoms.
- alkyl group for R 4 include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a heptyl group.
- cycloalkyl group for R 4 include a cyclopentyl group and a cycloheptyl group.
- the phenyl group content is in the range of 30 to 70 mol%. This is a range in which the obtained crosslinked product can be sufficiently softened at a high temperature and can maintain transparency and mechanical strength.
- component (C) is such that the molar ratio of silicon-bonded hydrogen atoms in this component to the total of alkenyl groups in component (A) and component (B) is in the range of 0.5 to 2. This is a range in which sufficient hardness at room temperature of the resulting crosslinked product can be obtained.
- the component (D) is a hydrosilylation catalyst for promoting the hydrosilylation reaction between the alkenyl group in the components (A) and (B) and the silicon atom-bonded hydrogen atom in the component (C).
- the component (D) include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts, and platinum-based catalysts are preferred because they can significantly accelerate the curing of the silicone composition.
- platinum-based catalyst include platinum fine powder, chloroplatinic acid, alcohol solution of chloroplatinic acid, platinum-alkenylsiloxane complex, platinum-olefin complex, and platinum-carbonyl complex, particularly platinum-alkenylsiloxane complex. It is preferable.
- alkenylsiloxane examples include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, Examples thereof include alkenyl siloxanes in which part of the methyl groups of these alkenyl siloxanes are substituted with ethyl groups, phenyl groups, and the like, and alkenyl siloxanes in which the vinyl groups of these alkenyl siloxanes are substituted with allyl groups, hexenyl groups, and the like.
- 1,3-divinyl-1,1,3,3-toteramethyldisiloxane is preferred because the stability of the platinum-alkenylsiloxane complex is good. Further, since the stability of the platinum-alkenylsiloxane complex can be improved, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 1,3-diallyl-1,1 are added to this complex.
- the content of the component (D) is an amount sufficient to promote the hydrosilylation reaction between the alkenyl group in the components (A) and (B) and the silicon-bonded hydrogen atom in the component (C).
- the amount of metal atoms in the present component is within a range of 0.01 to 500 ppm by mass unit with respect to the silicone composition, and more preferably 0.01 to 100 ppm.
- the amount is preferably in the range of 0.01 to 50 ppm, and particularly preferably in the range of 0.01 to 50 ppm. This is a range in which the obtained silicone composition is sufficiently crosslinked and does not cause problems such as coloring.
- the silicone composition is composed of at least the above components (A) to (D), and other optional components include ethynylhexanol, 2-methyl-3-butyn-2-ol, and 3,5-dimethyl-1-hexyne.
- Alkyne alcohols such as 3-ol and 2-phenyl-3-butyn-2-ol; enyne compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-in 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane;
- a reaction inhibitor such as benzotriazole may be contained.
- the content of the reaction inhibitor is not limited, but is preferably in the range of 1 to 5,000 ppm with respect to the weight of the silicone composition.
- the phosphor composition of the present invention may contain silicone fine particles.
- silicone fine particles By containing the silicone fine particles, it is possible to obtain a phosphor sheet having not only adhesiveness and workability but also good film thickness uniformity.
- silicone fine particles having an average particle size of 0.1 ⁇ m or more and 2.0 ⁇ m or less it is possible to obtain a phosphor sheet that is excellent in dischargeability and excellent in film thickness uniformity when a slit die coater is used. it can.
- the grafted metal compound particles cover the silicone fine particles. This further improves the compatibility between the matrix resin and the metal compound particles, so that the interface between them is less likely to occur. Therefore, since the adhesiveness with the light emitting surface of the LED chip is further improved, a further luminance improvement effect can be obtained.
- the storage elastic modulus (G ′) at 100 ° C. can be lowered and the adhesion to the LED chip can be improved.
- the grafted metal compound particles cover the silicone fine particles means a state in which the grafted metal compound particles uniformly cover the surfaces of the silicone fine particles.
- the state can be known by observing a cured product of the phosphor composition or a cross section of the phosphor sheet with SEM or TEM.
- FIGS. 5 and 6 Examples of the state in which the grafted metal compound particles are coated with the silicone fine particles are shown in FIGS. 5 and 6, and examples of the uncoated state are shown in FIGS. 5 and 6 are photographs obtained by cutting a cross section of a phosphor sheet of Example 19 described later and observing with a scanning electron microscope (SEM), and FIGS. 7 and 8 are Comparative Examples 12 and 13 described later, respectively. It is the photograph which cut
- SEM scanning electron microscope
- the silicone fine particles 103 are uniformly dispersed in the matrix resin 101, and the surface of the silicone fine particles is grafted. It is observed that the converted metal compound particles 104 are covered.
- the grafted metal compound particles do not cover the silicone fine particles, as shown in FIGS. 7 and 8, the phosphor 105 is present in the matrix resin 101, and the silicone fine particles 103, the metal compound particles It is observed that the 102s are aggregated to form an aggregate.
- the grafted metal compound particles are in a state in which the silicone fine particles are coated.
- the grafted metal compound particles and the silicone fine particles are weak in hydrogen bonds, van der Waals forces and the like. This is thought to be due to the fact that the connection is a pseudo connection.
- the silicone fine particles are preferably fine particles made of silicone resin and / or silicone rubber.
- silicone fine particles obtained by a method of hydrolyzing organosilane such as organotrialkoxysilane, organodialkoxysilane, organotriacetoxysilane, organodiacetoxysilane, organotrioxime silane, organodioxime silane, and then condensing them. preferable.
- organotrialkoxysilane examples include methyltrimethoxysilane, methyltriethoxysilane, methyltri-n-proxysilane, methyltri-i-proxysilane, methyltri-n-butoxysilane, methyltri-i-butoxysilane, methyltri-s-butoxy Silane, methyltri-t-butoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, i-propyltrimethoxysilane, n-butyltributoxysilane, i-butyltributoxysilane, s-butyltrimethoxysilane, t -Butyltributoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane,
- Organodialkoxysilanes include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, diethyldiethoxysilane, diethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, N- (2- Aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminoisobutylmethyldimethoxysilane, N-ethylaminoisobutylmethyldiethoxysilane, (phenylaminomethyl) methyldimethoxysilane, vinylmethyl Examples include diethoxysilane.
- organotriacetoxysilane examples include methyltriacetoxysilane, ethyltriacetoxysilane, vinyltriacetoxysilane, and the like.
- organodiacetoxysilane examples include dimethyldiacetoxysilane, methylethyldiacetoxysilane, vinylmethyldiacetoxysilane, and vinylethyldiacetoxysilane.
- organotrioxime silane examples include methyl trismethyl ethyl ketoxime silane, vinyl trismethyl ethyl ketoxime silane, and examples of the organodioxime silane include methyl ethyl bismethyl ethyl ketoxime silane.
- silicone fine particles are reported in the method reported in JP-A-63-77940, the method reported in JP-A-62-248081, and reported in JP-A-2003-342370. For example, the method reported in JP-A-4-88022.
- organosilane such as organotrialkoxysilane, organodialkoxysilane, organotriacetoxysilane, organodiacetoxysilane, organotrioxime silane, organodioxime silane and / or a partial hydrolyzate thereof are added to an alkaline aqueous solution, Hydrolyzing and condensing to obtain silicone fine particles, or adding organosilane and / or a partial hydrolyzate thereof to water or an acidic solution to obtain a hydrolyzed partial condensate of the organosilane and / or the partial hydrolyzate thereof.
- a method of obtaining an alkali fine particle by adding an alkali and proceeding a condensation reaction, an organosilane and / or a hydrolyzate thereof as an upper layer, an alkali or a mixed solution of an alkali and an organic solvent as a lower layer, the interface at these interfaces Organosilane and / or A hydrolyzate thereof by hydrolysis and polycondensation are also known a method of obtaining particles, In any of these methods, it is possible to obtain the silicone fine particles used in the present invention.
- organosilane and / or its partial hydrolyzate is hydrolyzed and condensed, and in the presence of a polymer dispersant and a salt that act as a protective colloid in a solvent in an acidic aqueous solution, Silicone fine particles produced by adding an organosilane and / or a hydrolyzate thereof to obtain a hydrolyzate and then adding an alkali to advance the condensation reaction can also be used.
- the polymer dispersant is a water-soluble polymer, and any synthetic polymer or natural polymer can be used as long as it acts as a protective colloid in a solvent. Specifically, polyvinyl alcohol, polyvinyl pyrrolidone and the like can be used. It can be illustrated.
- a method for adding the polymer dispersant a method of adding in advance to the reaction initial solution, a method of adding organotrialkoxysilane and / or a partial hydrolyzate thereof simultaneously, an organotrialkoxysilane and / or a partial hydrolyzate thereof, The method of adding after hydrolyzing partial condensation can be illustrated, and any of these methods can be selected.
- the addition amount of the polymer dispersant is preferably in the range of 5 ⁇ 10 ⁇ 7 to 10 ⁇ 2 parts by weight with respect to 1 part by weight of the reaction solution, and in this range, aggregation of the silicone fine particles hardly occurs. .
- the organic substituents contained in the silicone fine particles are preferably a methyl group and a phenyl group, and the refractive index of the silicone fine particles can be adjusted by the content of these substituents.
- the matrix resin is a silicone resin
- the difference in refractive index between the refractive index d1 of the silicone fine particles and the refractive index d2 due to components other than the silicone fine particles and the phosphor is reduced.
- the difference in refractive index between the refractive index d1 of the silicone fine particles and the refractive index d2 due to components other than the silicone fine particles and the phosphor is preferably less than 0.10, and more preferably 0.03 or less.
- Abbe refractometer For the refractive index measurement, Abbe refractometer, Pulfrich refractometer, immersion type refractometer, immersion method, minimum declination method, etc. are used as the total reflection method, but Abbe refractometer is used to measure the refractive index of silicone resin.
- the immersion method is useful for measuring the refractive index of refractometers and silicone fine particles.
- the refractive index difference can be adjusted by changing the amount ratio of the raw materials constituting the silicone fine particles. That is, for example, by adjusting the mixing ratio of methyltrialkoxysilane and phenyltrialkoxysilane, which are raw materials, and increasing the composition ratio of methyl groups, it is possible to achieve a refractive index close to 1.4. On the contrary, a relatively high refractive index can be achieved by increasing the constituent ratio of the phenyl group.
- the average particle diameter of the silicone fine particles is represented by a median diameter (D50).
- the lower limit of the average particle diameter is preferably 0.1 ⁇ m or more, and more preferably 0.5 ⁇ m or more.
- the upper limit is preferably 2.0 ⁇ m or less, and more preferably 1.0 ⁇ m or less.
- the average particle diameter, that is, the median diameter (D50) and the particle size distribution of the silicone fine particles can be measured by SEM observation.
- a particle size distribution is obtained by performing image processing on a measurement image obtained by SEM, and in the particle size distribution obtained therefrom, the particle diameter of 50% of the accumulated portion from the small particle diameter side is obtained as the median diameter D50. If this method is used, the volume-based particle size obtained from the particle size distribution of the silicone fine particles is obtained by observing the cross-sectional SEM of the phosphor sheet and then calculating the average particle size of the silicone fine particles themselves. In the distribution, it is also possible to obtain a particle diameter of 50% accumulated from the small particle diameter side as the median diameter D50. In this case, the average particle size of the silicone fine particles determined from the cross-sectional SEM image of the phosphor sheet is theoretically 78.5% compared to the true average particle size, and is actually about 70% to 85%.
- the content of the silicone fine particles is preferably 1 part by weight or more as a lower limit with respect to 100 parts by weight of the resin, and more preferably 10 parts by weight or more. Further, the upper limit is preferably 100 parts by weight or less, and more preferably 80 parts by weight or less. By containing 1 part by weight or more of silicone fine particles, a particularly good phosphor dispersion stabilizing effect can be obtained. On the other hand, by containing 80 parts by weight or less, the viscosity of the phosphor composition is not excessively increased.
- the phosphor composition of the present invention may contain a solvent.
- a solvent will not be specifically limited if the viscosity of resin of a fluid state can be adjusted.
- toluene, methyl ethyl ketone, methyl isobutyl ketone, hexane, acetone, terpineol, texanol, methyl cellosolve, butyl carbitol, butyl carbitol acetate, propylene glycol monomethyl ether acetate and the like can be mentioned.
- the phosphor composition of the present invention contains a dispersing agent and a leveling agent for stabilizing the coating film, an adhesion assistant such as a silane coupling agent as a sheet surface modifier when the phosphor sheet is used. May be.
- a silanol group-containing methylphenyl silicone resin may be contained as a heating adhesive.
- the structure of the silanol group-containing methylphenyl silicone resin is particularly preferably the following general formula (E).
- R 5 and R 6 are each an alkyl group or cycloalkyl group having 1 to 6 carbon atoms
- Ph is a phenyl group
- the phosphor sheet laminate refers to a laminate containing a substrate and a phosphor sheet formed by applying a phosphor composition onto the substrate.
- Base material As a base material, a well-known metal, a film, glass, a ceramic, paper, etc. can be used without a restriction
- glass and resin films are preferably used because of the ease of producing the phosphor sheet and the ease of individualizing the phosphor sheet.
- the base material is preferably a flexible film because of the adhesion when the phosphor sheet is attached to the LED chip.
- a film having a high strength is preferred so that there is no fear of breakage when handling a film-like substrate.
- Resin films are preferred in terms of their required characteristics and economy, and among these, plastic films selected from the group consisting of PET, polyphenylene sulfide, and polypropylene are preferred in terms of economy and handleability.
- a polyimide film is preferable at a heat resistant surface.
- the surface of the base material may be subjected to a mold release treatment in advance for ease of peeling of the sheet.
- the thickness of the substrate is not particularly limited, but the lower limit is preferably 25 ⁇ m or more, and more preferably 38 ⁇ m or more. Moreover, as an upper limit, 5000 micrometers or less are preferable and 3000 micrometers or less are more preferable.
- the phosphor sheet refers to a sheet containing a phosphor inside.
- a phosphor sheet which is one feature of the present invention is a phosphor sheet containing a phosphor, a matrix resin, and metal compound particles, wherein the metal compound particles have a refractive index of 1.7 or more, and The average particle diameter is 1 to 50 nm, the metal compound particles are grafted, and the average refractive index N1 of the metal compound particles and the matrix resin is related to the refractive index N2 of the phosphor as follows: And the viscoelastic behavior of the sheet satisfies the following relationships (ii), (iii) and (iv).
- the storage elastic modulus G ′ is 1.0 ⁇ 10 4 Pa ⁇ G ′ ⁇ 1.0 ⁇ 10 6 Pa at a temperature of 25 ° C. and tan ⁇ ⁇ 1
- Storage modulus G ′ is 1.0 ⁇ 10 2 Pa ⁇ G ′ ⁇ 1.0 ⁇ 10 4 Pa at a temperature of 100 ° C. and tan ⁇ ⁇ 1
- the storage elastic modulus G ′ is 1.0 ⁇ 10 4 Pa ⁇ G ′ ⁇ 1.0 ⁇ 10 6 Pa at a temperature of 200 ° C. and tan ⁇ ⁇ 1.
- the phosphor sheet of the present invention preferably has high elasticity near room temperature from the viewpoints of storage properties, transportability, and processability.
- the elasticity becomes low under certain temperature conditions, and the flexibility, adhesion, and fluidity are expressed. It is preferable.
- the phosphor sheet of the present invention preferably exhibits fluidity when heated at 60 ° C. or higher. It is important that the phosphor sheet of the present invention has high adhesion to the light extraction surface of the LED chip, and this greatly improves the light extraction from the LED chip. Therefore, it is necessary for the viscoelastic behavior of the phosphor sheet to satisfy the above (ii) to (iv).
- the storage elastic modulus (G ′) of the phosphor sheet is a storage elastic modulus (G ′) when the dynamic viscoelasticity measurement (temperature dependence) of the phosphor sheet is performed by a rheometer.
- Dynamic viscoelasticity means that when shear strain is applied to a material at a sinusoidal frequency, the shear stress that appears when a steady state is reached is divided into a component (elastic component) whose strain and phase match, and the strain and phase are This is a technique for analyzing the dynamic mechanical properties of a material by decomposing it into components (viscous components) delayed by 90 °.
- Dynamic viscoelasticity measurement (temperature dependency) can be measured using a general viscosity / viscoelasticity measuring device. In this invention, it is set as the value at the time of measuring on the following conditions.
- Measuring device Viscosity and viscoelasticity measuring device HAAKE MARSIII (Thermo Fisher SCIENTIFIC made) Measurement conditions: OSC temperature-dependent measurement Geometry: Parallel disk type (20mm) Measurement time: 1980 seconds Angular frequency: 1 Hz Angular velocity: 6.2832 rad / sec Temperature range: 25 to 200 ° C (with low temperature control function) Temperature increase rate: 0.08333 ° C./sec Sample shape: Circular (diameter 18 mm).
- the storage elastic modulus (G ′) is obtained by dividing the stress component whose phase coincides with the shear strain by the shear strain. Since the storage elastic modulus (G ′) represents the elasticity of the material against dynamic strain at each temperature, it is closely related to the hardness of the phosphor sheet, that is, the processability.
- the loss elastic modulus (G ′′) is obtained by dividing the shear strain and the stress component whose phase is delayed by 90 ° by the shear strain.
- the loss elastic modulus represents the viscosity of the material. That is, it is closely related to adhesion.
- the loss tangent (tan ⁇ ) obtained by dividing the loss elastic modulus (G ′′) by the storage elastic modulus (G ′) is an index indicating the state in which the material is placed.
- elasticity is dominant and it is in a solid state, whereas if tan ⁇ is 1 or more, viscosity is dominant and it indicates a liquid state.
- the phosphor sheet in the present invention is sufficiently elastic at room temperature (25 ° C.) because 1.0 ⁇ 10 4 Pa ⁇ G ′ ⁇ 1.0 ⁇ 10 6 Pa at 25 ° C. and tan ⁇ ⁇ 1. It is. For this reason, the sheet is cut without deformation of the surroundings even with a high shear stress such as a cutting process with a blade, and processability with high dimensional accuracy is obtained.
- the storage elastic modulus at 25 ° C. of the phosphor sheet is more preferably 9.0 ⁇ 10 5 Pa or less from the viewpoint of crack prevention during handling and workability.
- Tan ⁇ at room temperature is more preferably 0.7 or less from the viewpoint of lowering the attaching temperature. Moreover, there is no restriction
- the phosphor sheet satisfies 1.0 ⁇ 10 2 Pa ⁇ G ′ ⁇ 1.0 ⁇ 10 4 Pa at 100 ° C. and tan ⁇ ⁇ 1, the sheet is sufficiently viscous at 100 ° C. High fluidity. Therefore, if the phosphor sheet having this physical property is heated to 100 ° C. or higher and attached to the LED chip, the phosphor sheet quickly flows and deforms according to the shape of the light emitting surface of the LED chip, and is high. Adhesion can be obtained. Thereby, the light extraction property from the LED chip is improved, and the luminance is improved.
- the storage elastic modulus at 100 ° C. of the phosphor sheet is more preferably 9.0 ⁇ 10 3 Pa or less from the viewpoint of lowering the attaching temperature.
- Tan ⁇ at 100 ° C. is more preferably 1.6 or more from the viewpoint of adhesion.
- the upper limit is not particularly limited, but is preferably 4.0 or less, more preferably 3.6 or less, and even more preferably 3.3 or less.
- the LED chip can finally operate stably. Can be made. If the phosphor sheet is heated at 200 ° C. or higher, complete curing of the sheet is completed and the entire resin is integrated, so that it is not affected by thermal factors such as heat when the LED chip is lit.
- the storage elastic modulus (G ′) at 200 ° C. of the phosphor sheet is more preferably 9.0 ⁇ 10 5 Pa or less from the viewpoint of preventing cracks.
- Tan ⁇ at 200 ° C. is more preferably tan ⁇ ⁇ 0.08 from the viewpoint of thermal stability.
- the lower limit is not particularly limited, but is preferably 0.01 or more, more preferably 0.02 or more, and further preferably 0.03 or more.
- the resin contained therein may be in an uncured state.
- the resin contained is not completely cured as a whole but is cured to some extent.
- the curing has progressed to such an extent that the storage elastic modulus (G ′) does not change for a long period of time of 1 month or longer after storage at room temperature.
- the phosphor sheet of the present invention can be obtained from the phosphor composition described above. Details of the manufacturing method will be described later.
- the thickness of the phosphor sheet of the present invention is not particularly limited, but is preferably 10 to 1000 ⁇ m. If it is smaller than 10 ⁇ m, it is difficult to form a uniform sheet because of unevenness caused by the phosphor particles. If it exceeds 1000 ⁇ m, cracks tend to occur and sheet molding is difficult. More preferably, it is 30 to 100 ⁇ m.
- the thickness of the sheet is preferably 200 ⁇ m or less, more preferably 100 ⁇ m or less, and even more preferably 50 ⁇ m or less.
- the film thickness of the sheet in the present invention is the film thickness (average film thickness) measured based on JIS K7130 (1999) Plastic-Film and Sheet-Thickness Measuring Method A Method for Measuring Thickness by Mechanical Scanning. That means.
- Heat resistance refers to resistance to heat generated in the LED package.
- the heat resistance can be evaluated by comparing the luminance when the LED package emits light at room temperature and when the LED package emits light at a high temperature, and measuring how much the luminance at the high temperature decreases.
- the LED chip is in an environment where a large amount of heat is generated in a small space, and particularly in the case of a high power LED, heat generation is significant. Due to such heat generation, the temperature of the phosphor rises and the brightness of the LED package decreases. Therefore, it is important how efficiently the generated heat is radiated.
- seat excellent in heat resistance can be obtained by making a sheet
- the film thickness variation referred to here is a thickness measurement method based on the thickness measurement method A by mechanical scanning in JIS K7130 (1999) plastic-film and sheet-thickness measurement method, and is shown below. Calculated by the formula.
- film thickness variation B (%) (maximum film thickness deviation value * ⁇ average film thickness) / average film thickness ⁇ 100 * For the maximum film thickness deviation value, the one with the larger difference from the average film thickness is selected from the maximum value or the minimum value.
- ⁇ Method for producing phosphor composition below, an example of the manufacturing method of the fluorescent substance composition of this invention is demonstrated.
- a predetermined amount of the aforementioned metal compound particles, matrix resin, phosphor, silicone fine particles, solvent and the like are mixed.
- the phosphor composition is uniformly mixed and dispersed with an agitator / kneader such as a homogenizer, a self-revolving stirrer, a 3-roller, a ball mill, a planetary ball mill, or a bead mill. Things are obtained.
- Defoaming is preferably carried out under vacuum or reduced pressure conditions after mixing or dispersing.
- a specific component may be mixed in advance or a process such as aging may be performed. It is also possible to remove the solvent with an evaporator to obtain a desired solid content concentration.
- ⁇ Method for producing phosphor sheet laminate> an example of the manufacturing method of the fluorescent substance composition of this invention is demonstrated.
- the phosphor composition produced by the method described above is applied onto a substrate and dried to produce a phosphor sheet laminate.
- Application is reverse roll coater, blade coater, slit die coater, direct gravure coater, offset gravure coater, kiss coater, natural roll coater, air knife coater, roll blade coater, varibar roll blade coater, two stream coater, rod coater, wire
- a bar coater, an applicator, a dip coater, a curtain coater, a spin coater, a knife coater or the like can be used.
- it is preferably applied by a slit die coater.
- the phosphor sheet can be dried using a general heating device such as a hot air dryer or an infrared dryer.
- a general heating device such as a hot air dryer or an infrared dryer is used.
- the heating conditions are usually 40 to 250 ° C. for 1 minute to 5 hours, preferably 60 ° C. to 200 ° C. for 2 minutes to 4 hours. It is also possible to perform heat curing stepwise such as step cure.
- the concentration of the metal compound particles in the phosphor sheet of the present invention can be changed depending on the viscosity of the phosphor composition and the drying conditions (speed) after coating.
- the viscosity of the phosphor composition is high, the metal compound particles hardly flow, and it is difficult to obtain a constant concentration region and a concentration change region. Therefore, it is preferable to prepare a phosphor composition containing a solvent.
- the viscosity of the paste is preferably 3000 to 100,000 mPa ⁇ s. Further, even if the drying temperature is increased and the drying speed is increased, the metal compound particles are less likely to flow, so that it is difficult to obtain a constant concentration region and a concentration changing region. Preferred drying conditions are as described above.
- the substrate it is also possible to change the substrate as necessary after preparing the phosphor sheet laminate.
- a surface with a high concentration of high refractive index nanoparticles is attached to the light emitting surface of the LED chip, it is preferable to change the base material to adjust the attachment surface.
- examples of a simple method include a method of performing replacement using a hot plate, a method of using a vacuum laminator and a dry film laminator, and the like, but are not limited thereto.
- the same method can also be used when the surface with the higher concentration of the high refractive index nanoparticles is made to face the light emitting surface of the LED chip.
- the phosphor sheet laminate of the present invention is preferably a fluorescent material in which a phosphor sheet is laminated on the surface of an LED chip by being attached to a light emitting surface of an LED chip having a general structure such as lateral, vertical, and Philip chip.
- An LED chip with a body sheet can be formed, and can be suitably used for a vertical or flip chip type LED chip having a large light emitting area.
- the light emitting surface is a surface from which light from the LED chip is extracted.
- the light emitting surface from the LED chip may be a single plane or not a single plane.
- a single plane there are mainly those having only the upper light emitting surface.
- a vertical type LED chip an LED chip whose side surface is covered with a reflective layer and light is extracted only from the upper surface are exemplified.
- an LED chip having an upper light emitting surface and a side light emitting surface and an LED chip having a curved light emitting surface can be mentioned.
- the light emitting surface is not a single plane because the light emitted from the side can be used and brightened.
- a flip chip type LED chip having an upper light emitting surface and a side light emitting surface is preferable because the light emitting area can be increased and the chip manufacturing process is easy.
- the light emitting surface may be processed into a texture or the like based on an optical design in order to improve the light emission efficiency.
- the phosphor sheet laminate of the present invention can be pasted using an adhesive such as a transparent resin without being directly pasted on the LED chip.
- an adhesive such as a transparent resin
- the wavelength conversion layer here refers to a layer that absorbs light emitted from the LED chip, converts the wavelength, and emits light having a wavelength different from that of the LED chip.
- the LED chip with a phosphor sheet obtained by these methods is packaged with metal wiring and sealing, and then incorporated into a module to illuminate various LEDs including various types of lighting, liquid crystal backlights, and headlamps. It can be used suitably for an apparatus.
- FIG. 9 shows a suitable example of an LED chip with a phosphor sheet.
- A is one in which a phosphor sheet is attached to the upper surface of the LED chip.
- B is one in which the phosphor sheet 2 is attached not only to the upper surface but also to the side surface of the LED chip 1.
- the wavelength conversion is also possible for light emission from the side surface, which is preferable.
- C uses a flip chip type LED, and the phosphor sheet 2 covers the upper and side surfaces, which are light emitting surfaces.
- D) attaches the surface where the density
- 10A to 10B show suitable examples of LED packages.
- A is the one in which the phosphor composition 4 is injected into the mounting substrate 7 with the reflector 5 on which the LED chip 1 is installed and then sealed with the transparent sealing material 6.
- B is one in which the phosphor sheet 2 is pasted on the LED chip 1 installed on the mounting substrate 7 with the reflector 5, and then sealed with the transparent sealing material 6.
- C is the one in which the phosphor sheet 2 is attached not only to the upper surface but also to the side surface of the LED chip 1 and is preferable because the wavelength can be converted even for light emission from the side surface. Further, a lens made of a transparent sealing material 6 is also attached.
- (D) is the same as (b) except that the reflector 5 is not used and the lens molded body of the transparent sealing material 6 is used for sealing.
- (E) is the same as (c) except that the reflector 5 is not used.
- (F) is the same as (c) except that a flip-chip type LED is used and the upper surface and side surfaces, which are light emitting surfaces, are covered with the phosphor sheet 2.
- the phosphor sheet 2 may extend to the upper surface of the mounting substrate 7 as shown in FIG.
- (G) is the same as (e) except that the reflector 5 is not used and the lens is molded by the lens molding of the transparent sealing material 6.
- (H) is obtained by pasting the LED chip 1 and the phosphor sheet 2 with the transparent adhesive 9, and otherwise the same as (b).
- (I) is the same as (h) except that the phosphor sheet 2 with the base material 10 prepared in advance is used and the base material 10 is used without being peeled from the phosphor sheet 2.
- glass is preferable.
- the transparent sealing material 6 in (b) may have a shape as shown in (c), and the phosphor sheet 2 may be attached not only to the upper surface but also to the side surface of the LED chip 1. .
- the structures of the parts exemplified in (a) to (i) can be appropriately combined. Moreover, you may substitute or combine with well-known parts other than these.
- the transparent sealing material is an epoxy resin, silicone resin (cured organopolysiloxane (crosslinked product) such as silicone rubber, silicone gel, etc.) as long as it is a material excellent in moldability, transparency, heat resistance, adhesiveness, etc. And other known resins such as urea resins, fluororesins, and polycarbonate resins can be used. Moreover, the transparent sealing material mentioned above can be used for a transparent adhesive agent.
- a method for producing an LED package using the phosphor composition of the present invention will be described. Although the suitable example of a manufacturing method of the LED chip which uses the fluorescent substance composition is shown in FIG. 12, it is not limited to this method.
- a manufacturing method using the phosphor composition of the present invention particularly preferably, (A) a step of injecting the phosphor composition into a package frame, and (B) a package is sealed with a sealing material after that step. It is a manufacturing method of the LED package including the process to perform.
- a mounting substrate 7 with a reflector 5 is prepared as a package frame 18.
- the LED chip 1 is mounted on the mounting substrate 7 and installed.
- a desired amount of the phosphor composition of the present invention is injected into the package frame 18 on which the LED chip 1 is installed.
- the injection method at this time include injection molding, compression molding, cast molding, transfer molding, coating, potting (dispensing), printing, transfer, and the like, but are not limited thereto. Particularly preferably, potting (dispensing) can be used.
- the phosphor composition can be placed on the LED chip in a form suitable for the package by heating and curing the phosphor composition.
- Heat curing can be performed using a general heating device such as a hot air dryer or an infrared dryer.
- the heat curing conditions are usually 40 to 250 ° C. for 1 minute to 5 hours, preferably 60 ° C. to 200 ° C. for 2 minutes to 4 hours. In this case, it is possible to perform heat curing stepwise such as step cure.
- the transparent sealing material 6 is injected and heat-cured to seal the LED chip 1.
- the injection method and heating conditions at this time conform to the conditions of the phosphor composition described above.
- the LED package 19 is manufactured by the above process. You may install an overcoat layer, a lens, etc. by transparent resin as needed.
- a typical method for producing an LED package using the phosphor sheet laminate of the present invention is as follows: (1) A method of cutting a phosphor sheet into individual pieces and attaching them to individual LED chips, (2) There is a method in which dicing of the wafer and cutting of the phosphor sheet are collectively performed by pasting the wafer on which the LED chip before dicing has been fabricated, but it is not limited thereto. Particularly preferably (A) an alignment step in which one section of the phosphor sheet opposes the light emitting surface of one LED chip, and (B) pressurizing while heating with a thermocompression bonding tool.
- the step (A) is an alignment step in which the surface of the phosphor sheet having the higher concentration of inorganic particles among the upper and lower surfaces of one section of the phosphor sheet is opposed to the light emitting surface of the one LED chip. It is preferable that it is a manufacturing method of an LED package.
- the phosphor sheet laminate of the present invention can be adhered using an adhesive such as a transparent resin without being directly adhered to the LED chip, but a phosphor using a heat-sealing resin as a matrix resin.
- an adhesive such as a transparent resin without being directly adhered to the LED chip, but a phosphor using a heat-sealing resin as a matrix resin.
- the use of a sheet is preferable because it can be easily attached to the LED chip without an adhesive.
- the phosphor sheet is affixed to the LED chip, the phosphor sheet is affixed by applying pressure while heating at a desired temperature.
- the heating temperature is preferably 60 ° C. or higher and 250 ° C. or lower, and more preferably 60 ° C. or higher and 160 ° C. or lower.
- the resin design for increasing the difference in elastic modulus between the room temperature and the attaching temperature becomes easy.
- the thermal expansion and thermal shrinkage of the base material and the phosphor sheet can be reduced by setting the temperature to 250 ° C. or lower, the accuracy of pasting can be increased.
- the position accuracy of pasting is important. In order to increase the accuracy of pasting, it is more preferable to paste at 160 ° C. or lower.
- any existing apparatus can be used as long as it can be bonded at a desired temperature, and a thermocompression bonding tool such as a mounter or a flip chip bonder can be used.
- a thermocompression bonding tool such as a mounter or a flip chip bonder can be used.
- the phosphor sheet when affixing to the wafer level LED chips at once, it can be affixed using a vacuum laminator or a thermocompression bonding tool having a heating portion of about 100 to 200 mm square.
- the phosphor sheet is pressure-bonded to the LED chip at a desired temperature and thermally fused, and then allowed to cool to room temperature, and the substrate is peeled off.
- the phosphor sheet after being allowed to cool to room temperature after heat fusion can be easily peeled off from the substrate while firmly adhering to the LED chip. It becomes possible.
- the method for cutting the phosphor sheet will be described.
- the phosphor sheet is pre-cut into individual pieces before being attached to the LED chip, and then attached to individual LED chips, and the phosphor sheet is attached to the wafer level LED chip and then simultaneously with wafer dicing. Then, there is a method of cutting the phosphor sheet.
- the uniformly formed phosphor sheet is processed into a predetermined shape by laser processing or cutting with a blade and divided. Since processing with a laser gives high energy, it is very difficult to avoid scorching of the resin and deterioration of the phosphor, and cutting with a blade is desirable.
- a cutting method with a blade there are a method of pushing and cutting a simple blade and a method of cutting with a rotary blade, both of which can be suitably used.
- an apparatus for cutting with a rotary blade an apparatus used for cutting (dicing) a semiconductor substrate (wafer) called a dicer into individual chips can be suitably used. If the dicer is used, the width of the dividing line can be precisely controlled by the thickness of the rotary blade and the condition setting, so that higher processing accuracy can be obtained than when cutting with a simple cutting tool.
- FIG. 13 shows an example of individualization, LED chip application, and dicing steps when the phosphor sheet is divided into individual substrates.
- the process of FIG. 13 includes a step of cutting the phosphor sheet into individual pieces, and a step of pressing the phosphor sheet cut into the individual pieces at a desired temperature and attaching them to the LED chip.
- FIG. 13A shows a state where the phosphor sheet 2 laminated with the base material 20 is fixed to the temporarily fixing sheet 21.
- both the phosphor sheet 2 and the base material 20 are separated, they are fixed to the temporarily fixing sheet 21 so as to be easy to handle.
- the phosphor sheet 2 and the substrate 20 are cut into individual pieces.
- the separated phosphor sheet 2 and the base material 20 are aligned on the LED chip 1 mounted on the mounting substrate 7 and heated as shown in (d). Crimping is performed at a desired temperature using the crimping tool 22.
- the substrate is allowed to cool to room temperature, and the substrate 20 is peeled off as shown in FIG.
- the base material 20 is glass or the like, the base material may be used as it is as shown in FIG.
- FIG. 14 shows an example of individualization, LED chip attachment, and dicing steps when the phosphor sheet is separated into individual pieces while the base material is continuous.
- the process of FIG. 14 also includes a step of cutting the phosphor sheet into individual pieces and a step of heating the phosphor sheet cut into the individual pieces and attaching them to the LED chip.
- the base material 20 is not separated.
- the substrate 20 is not cut at all, but may be partially cut as long as the substrate 20 is continuous.
- the phosphor sheet 2 that has been separated into pieces is opposed to the wafer 23 on which the LED chips before dicing are formed, and alignment is performed.
- the wafer 23 on the surface of which the phosphor sheet 2 and the LED chip before dicing are formed is crimped at a desired temperature using the thermocompression bonding tool 22.
- the pressure bonding process is performed under vacuum or under reduced pressure so that air is not caught between the wafer 23 having the phosphor sheet 2 and the LED chip 1 formed on the surface.
- the substrate is allowed to cool to room temperature.
- the wafer is diced into individual pieces, and the LED chips with phosphor sheets separated into individual pieces as shown in (f) Get 24.
- FIG. 15 shows an example of a process in the case where the phosphor sheet and the wafer are diced together after being attached.
- the process of FIG. 15 includes a process of pressing and bonding a phosphor sheet to a plurality of LED chips at a desired temperature and a process of dicing the phosphor sheet and the LED chip together.
- the phosphor sheet 2 is not cut in advance, and the phosphor sheet 2 side is made to face the wafer 23 on which the LED chips before dicing are formed as shown in FIG. Align.
- the wafer 23 on which the phosphor sheet 2 and the LED chip before dicing are formed on the surface is crimped by a thermocompression bonding tool 22 at a desired temperature.
- the pressure bonding it is allowed to cool to room temperature, and after peeling the substrate 20 as shown in (c), the wafer is diced, and at the same time, the phosphor sheet 2 is cut into individual pieces, as shown in (d). An LED chip 24 with a phosphor sheet is obtained.
- the phosphor sheet is not attached to the electrode portion in order to remove the phosphor sheet. It is desirable to make a hole in the part in advance.
- known methods such as laser processing and die punching can be suitably used for drilling, laser processing causes burning of the resin and deterioration of the phosphor, so punching with a die is more desirable.
- punching cannot be performed after the phosphor sheet is attached to the LED chip. Therefore, it is essential to perform punching before attaching the phosphor sheet.
- a hole having an arbitrary shape or size can be formed depending on the electrode shape of the LED chip to be attached. Any size and shape of the hole can be formed by designing the mold, but the electrode joint portion on the LED chip inside and outside the 1 mm square is preferably 500 ⁇ m or less in order not to reduce the area of the light emitting surface.
- the hole is formed with a size of 500 ⁇ m or less in accordance with its size.
- an electrode for performing wire bonding or the like needs to have a certain size and is at least about 50 ⁇ m. Therefore, the hole is about 50 ⁇ m in accordance with the size.
- an affixing device having an optical alignment (alignment) mechanism is required. At this time, it is difficult to align the phosphor sheet and the LED chip in terms of work, and in practice, the alignment is often performed in a state where the phosphor sheet and the LED chip are lightly contacted. At this time, if the phosphor sheet has adhesiveness, it is very difficult to move it in contact with the LED chip. If the phosphor sheet laminate of the present invention is aligned at room temperature, it is not sticky, so that it is easy to align the phosphor sheet and the LED chip with light contact.
- the mass production method of the LED chip with the phosphor sheet and the LED package using the phosphor sheet laminate of the present invention will be described.
- a method for manufacturing an LED chip with a phosphor sheet will be described.
- a method of attaching the phosphor sheet to the LED chip as shown in FIG. 16, a method of attaching one by one using the phosphor sheet laminate 26 separated for each LED chip, and as shown in FIG.
- the phosphor sheet 2 is collectively coated on a plurality of LED chips, and then cut and individualized. Any method may be used.
- the phosphor sheet is attached by pressing in a state where the base material softens and flows.
- the sticking temperature is preferably 60 ° C. or higher, and more preferably 80 ° C. or higher, from the viewpoint of enhancing adhesiveness.
- the heat-fusible resin used for the phosphor sheet has a property that the viscosity is temporarily lowered by heating, and is further cured by heating. Therefore, the temperature of the attaching step is preferably 150 ° C. or lower from the viewpoint of maintaining adhesiveness, and more preferably 120 ° C. or lower from the viewpoint of maintaining the shape of the phosphor sheet at a certain level or higher. .
- Examples of the manufacturing apparatus for performing such affixing include vacuum affixing machines such as a vacuum diaphragm laminator, a vacuum roll laminator, a vacuum hydraulic press, a vacuum servo press, a vacuum electric press, and a TOM molding machine.
- vacuum affixing machines such as a vacuum diaphragm laminator, a vacuum roll laminator, a vacuum hydraulic press, a vacuum servo press, a vacuum electric press, and a TOM molding machine.
- a vacuum diaphragm muraminator is preferable because a large number of treatments can be performed at one time, and pressure can be applied without deviation from directly above.
- the LED package manufacturing method is not limited to these examples.
- the first manufacturing example is shown in FIG. (A)
- the LED chip 1 is temporarily fixed on the base 30 via the double-sided adhesive tape 29.
- the phosphor sheet laminate 26 is laminated so that the phosphor sheet 2 is in contact with the LED chip 1.
- C After the laminate of (b) is placed in the lower chamber 32 of the vacuum diaphragm muraminator 35, the upper chamber 31 and the lower chamber 32 are depressurized while being heated. After heating under reduced pressure until the base material 25 flows, the diaphragm 33 is expanded by sucking the air into the upper chamber 31 through the air inlet 34, pressing the phosphor sheet 2 through the base material 25, and the LED chip 1. Paste to follow the light emitting surface.
- the laminate is taken out from the vacuum diaphragm muraminator 33, and the substrate 25 is peeled off after being allowed to cool. Subsequently, the LED chip space 36 is cut with a dicing cutter or the like to produce an individual LED chip 37 with a phosphor sheet.
- the LED chip 37 with the phosphor sheet is bonded to the package electrode 28 on the mounting substrate 27 via the gold bumps 8.
- the LED package 38 is manufactured by the above process. If necessary, install an overcoat layer or lens with a transparent resin.
- FIG. 19 shows a second manufacturing example.
- the LED chip 1 is bonded to the package electrode 28 on the mounting substrate 27 via the gold bumps 8.
- the phosphor sheet laminate 26 is laminated so that the phosphor sheet 2 is in contact with the LED chip 1.
- E) The LED package 39 is manufactured through the above steps. If necessary, install an overcoat layer or lens with a transparent resin.
- Nanoparticle 1 Titanium oxide “Optlake TR-527” (manufactured by Catalyst Kasei Kogyo Co., Ltd. Composition: average particle diameter 15 nm, refractive index 2.50, titanium oxide particles 20% by weight)
- Nanoparticle 2 Titanium oxide “Optlake TR-520” (manufactured by Catalyst Kasei Kogyo Co., Ltd. Composition: average particle diameter 15 nm, refractive index 2.50, titanium oxide particles 30% by weight)
- Nanoparticle 3 Titanium oxide “Optlake TR-521” (manufactured by Catalytic Chemical Industry Co., Ltd.
- Nanoparticle 4 Tin oxide particle “SN1” (average particle diameter 19 nm, refractive index 2.38)
- Nanoparticle 5 Aluminum oxide particle “SA1” (average particle diameter 34 nm, refractive index 1.76)
- Nanoparticle 6 Cerium oxide particle “CS1” (average particle diameter 34 nm, refractive index 2.20)
- Nanoparticle 7 Zirconia oxide “ZS1” (average particle diameter 15 nm, refractive index 2.40, zirconia oxide particle 20% by weight)
- Nanoparticle 8 Magnesium oxide particle “MS1” (average particle diameter 44 nm, refractive index 1.76)
- Nanoparticle 9 Zinc oxide particle “AS1” (average particle diameter 94 nm, refractive index 1.95)
- Nanoparticle 10 Titanium oxide particles “TS1” (average particle diameter 30 nm, refractive index 2.50, titanium oxide particles 20% by weight)
- Nanoparticle 11 Titanium oxide particles “TS1” (average particle diameter 30 nm, refractive
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 130 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- ⁇ Grafting example 3> 8.2 g of methyltrimethoxysilane, 55.5 g of phenyltrimethoxysilane, 7.2 g of dimethyldimethoxysilane, “OPTRAIK TR-521” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd., composition: oxidation 71.1 g of titanium particles (70 wt% of titanium particles, 70 wt% of diacetone alcohol) and 23.9 g of ⁇ -butyrolactone were placed in a reaction vessel, and 34.5 g of water and 1.0 g of phosphoric acid were added to this solution while stirring.
- the solution was added dropwise so that the temperature did not exceed 40 ° C.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 130 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- ⁇ Grafting example 6> 18.05 g of vinyltrimethoxysilane, 56.36 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 805.7%) 205.7 g and propylene glycol monomethyl ether acetate 131.3 g were put in a reaction vessel. To this solution, 21.9 g of water and 0.36 g of phosphoric acid were stirred and the reaction temperature did not exceed 40 ° C. Was dropped.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 1 hour, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 1 hour, and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 1 hour, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 15 minutes and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- TKP-102 powdered titanium oxide particles “TKP-102” (trade name, manufactured by Teika Co., Ltd.) are spread thinly on a glass petri dish, and the petri dish is made into a plasma etcher (Meiwa Forsys, SEDE). ) And plasma treatment was performed for 15 minutes. The plasma-treated particles were transferred to a capped test tube, and a 9.6 mM 2,2,6,6-tetramethylpiperidine 1-oxyl (TEMPO) styrene solution prepared in advance was placed in the test tube and sealed with a cap. Thereafter, it was inserted into an aluminum block heater heated to 125 ° C., and radical polymerization was performed.
- TEMPO 2,2,6,6-tetramethylpiperidine 1-oxyl
- test tube was taken out of the heater and the glove box, and oxygen bubbled chloroform was added to completely stop the polymerization. After the titanium oxide particles and the solvent were separated by centrifugation, the titanium oxide particles were taken out. The titanium oxide particles were washed with acetone to obtain grafted titanium oxide particles.
- ⁇ Grafting Example 10> 5.59 g of methyltrimethoxysilane, 19.0 g of phenyltrimethoxysilane, “OPTRAIK TR-527” (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) having a number average particle diameter of 15 nm, composition: 20% by weight of titanium oxide particles, methanol 804.6%) (264.6 g) and propylene glycol monomethyl ether acetate (103.3 g) were placed in a reaction vessel. To this solution, 7.39 g of water and 0.12 g of phosphoric acid were stirred and the reaction temperature did not exceed 40 ° C. Was dropped.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- ⁇ Grafting example 13> 14.64 g of dimethyldimethoxysilane, 56.36 g of phenyltrimethoxysilane, “OPTRAIK TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Chemical Industry Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 (Weight%) 185.94 g and 121.7 g of propylene glycol monomethyl ether acetate are put in a reaction vessel, and 21.9 g of water and 0.36 g of phosphoric acid are added to this solution while stirring so that the reaction temperature does not exceed 40 ° C. It was dripped.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
- ⁇ Surface treatment example 1> Put 24.5 g of methyltrimethoxysilane, 83.3 g of phenyltrimethoxysilane, and 124.0 g of ⁇ -butyrolactone in a reaction vessel and stir while stirring with 38 g of water and 0.57 g of phosphoric acid so that the reaction temperature does not exceed 30 ° C. It was dripped in. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis.
- “Optlake TR-527” trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd., composition: titanium oxide particles 20% by weight, methanol 80% by weight
- the solvent was distilled off from the acetone solution and dried under reduced pressure at 80 ° C. for 10 hours to obtain titania particles surface-modified with phenyltrimethoxysilane.
- ⁇ Silicon fine particles> Attach stirrer, thermometer, reflux tube and dropping funnel to 2L four-necked round bottom flask. Put 2L of 2.5% ammonia water containing 1ppm of polyether-modified siloxane "BYK333" as a surfactant into the flask. The temperature was raised in an oil bath while stirring at. When the internal temperature reached 50 ° C., 200 g of a mixture of methyltrimethoxysilane and phenyltrimethoxysilane (23/77 mol%) was dropped from the dropping funnel over 30 minutes. Stirring was continued for 60 minutes at the same temperature, then about 5 g of acetic acid (special grade reagent) was added, mixed with stirring, and then filtered.
- acetic acid special grade reagent
- the product particles on the filter were added with 600 mL of water twice and 200 mL of methanol once, followed by filtration and washing.
- the cake on the filter was taken out, crushed, and freeze-dried over 10 hours to obtain 60 g of white powder.
- the obtained particles were monodisperse spherical fine particles as observed by SEM.
- As a result of measuring the refractive index of this fine particle by the immersion method it was 1.54.
- As a result of observing the particles with a cross-sectional TEM it was confirmed that the particles had a single structure.
- Phosphor “YAG81003” (YAG phosphor, median diameter (D 50 ): 8.6 ⁇ m, refractive index: 1.8) manufactured by Nemoto Lumi Material Co., Ltd.
- ⁇ Matrix resin> Ingredients for compounding silicone resin Resin main component (MeViSiO 2/2 ) 0.25 (Ph 2 SiO 2/2 ) 0.3 (PhSiO 3/2 ) 0.45 (HO 1/2 ) 0.03 (average composition, (A) Applicable) Hardness modifier ViMe 2 SiO (MePhSiO) 17.5 SiMe 2 Vi (average composition, corresponding to component (B)) Crosslinking agent (HMe 2 SiO) 2 SiPh 2 (corresponds to component (C).) * However, Me: Methyl group, Vi: Vinyl group, Ph: Phenyl group Reaction inhibitor 1-Ethynylhexanol Platinum catalyst Platinum complex (1,3-divinyl-1,1,3,3-tetramethyldisiloxane solution) Contains platinum Amount 5% by weight.
- Silicone resins 1 and 7 to 19 used for preparing the phosphor composition were blended with the above silicone components to prepare a matrix resin.
- silicone resins 2 to 6 commercially available products (two-component mixed products) were used, and in some cases, the mixing ratio (A / B ratio) of the liquid A and the liquid B was changed to produce a matrix resin.
- Silicone resin 1 Resin main component 16.7 parts by weight, hardness adjusting agent 16.7 parts by weight, cross-linking agent 66.7 parts by weight, 0.025 weight part of reaction inhibitor, 0.03 weight part of platinum catalyst
- Silicone resin 2 “OE6630 (A liquid, B liquid)” (manufactured by Dow Corning Toray) A / B ratio 1/4 Silicone resin 3: “OE6336 (liquid A, liquid B)” (manufactured by Dow Corning Toray) A / B ratio 1/1 Silicone resin 4: “KER6075 (A liquid, B liquid)” (manufactured by Shin-Etsu Chemical) A / B ratio 1/1 Silicone resin 5: “KER6075 (A liquid, B liquid)” (manufactured by Shin-Etsu Chemical) A / B ratio 1 / 1.14 Silicone resin 6: “KER6075 (A liquid, B liquid)” (manufactured by Shin-Etsu Chemical) A / B ratio 0.5 / 1
- ⁇ Preparation of refractive index measurement sample Metal compound particles were mixed in the matrix resin, and the dispersion was prepared by stirring and defoaming for 10 minutes at 1,000 rpm using a planetary stirring deaerator “Mazerustar KK-400” manufactured by Kurabo Industries. After 5 cc of the dispersion was dropped onto the film substrate, the sample was heated in an oven at 150 ° C. for 1 hour to prepare an average refractive index N1 measurement sample. If necessary, the solvent may be removed by an evaporator after preparing the liquid.
- ⁇ Transparency test> A sample for transparency evaluation was prepared by dispersing metal compound particles in a matrix resin, and the transparency was evaluated by observing the sample with an optical microscope.
- a diffusion sheet 13 (Stock Co., Ltd.) cut so as to cover the LED light source 17 on the LED light source 17 (“MS-LED-460” manufactured by Prizmatix, wavelength: 460 nm, output:> 50 mW).
- MS-LED-460 manufactured by Prizmatix, wavelength: 460 nm, output:> 50 mW.
- black metal shading plate 16 with a hole with a diameter of 1 mm, and a surface with a high refractive index of the phosphor sheet is affixed so that bubbles do not enter the GaN substrate.
- illuminance (lx) of the measurement sample 12 by placing the light receiving part of the sample (measurement sample) 12, the light shielding cylinder 15 made of black metal, and the illuminance meter 11 (color illuminance meter “CL-200A” manufactured by Konica Minolta, Inc.) in this order. did. If measurement is always performed at a constant distance and a fixed angle, the illuminance is proportional to the luminance.
- the illuminance of Comparative Example 11 was set to 100, and the relative value of illuminance relative to this was shown.
- a GaN substrate (plate thickness 0.5 mm) is set on the hot plate, the temperature of the hot plate is set to 130 ° C., and then the phosphor sheet is placed on the GaN substrate so that the phosphor sheet surface is in contact with the GaN substrate surface.
- the laminate was stacked. Thereafter, the base material (base film) side of the phosphor sheet laminate was squeezed for 60 seconds using a rubber roller, and the phosphor sheet was attached to the GaN substrate. After moving the GaN substrate sample from the hot plate and returning to room temperature, the base material was peeled off to produce a sample substrate.
- sample preparation for adhesion test A GaN substrate (plate thickness 0.5 mm) is set on the hot plate, the temperature of the hot plate is set to 130 ° C., and then the phosphor sheet is placed on the GaN substrate so that the phosphor sheet surface is in contact with the GaN substrate surface. The laminate was stacked. Thereafter, the base material (base film) side of the phosphor sheet laminate was squeezed for 60 seconds using a rubber roller, and the phosphor sheet was attached to the GaN substrate. After moving the GaN substrate sample from the hot plate and returning to room temperature, the base material was peeled off to produce a sample substrate.
- Measuring device Viscosity / viscoelasticity measuring device HAAKE MARS III (Thermo Fisher SCIENTIFIC made) Measurement conditions: OSC temperature-dependent measurement Geometry: Parallel disk type (20mm) Measurement time: 1980 seconds Angular frequency: 1 Hz Angular velocity: 6.2832 rad / sec Temperature range: 25 to 200 ° C (with low temperature control function) Temperature increase rate: 0.08333 ° C./sec Sample shape: Circular (diameter 18 mm).
- ⁇ Heat resistance test> The LED chip is turned on by applying an electric current to the LED package using the phosphor sheet so that the surface temperature of the package is from room temperature (25 ° C.) to 170 ° C. Was used to measure the luminance.
- the luminance at room temperature (25 ° C.) and 170 ° C. was measured, and the heat retention was evaluated by calculating the luminance retention rate according to the following formula. It shows that it is excellent in heat resistance, so that a luminance retention is high. If the rating is B or more, there is no practical problem, and if the rating is A or more, it is practically excellent.
- Luminance retention ratio I (%) (luminance at 170 ° C./luminance at room temperature (25 ° C.)) ⁇ 100 (Rounded to the first decimal place) S: Retention rate 90% or more Heat resistance is very good A: Retention rate 81-89% Good heat resistance B: Retention rate 51-80% Heat resistance is practically no problem C: Retention rate 50% or less bad.
- Hardness measurement was carried out as an index of handleability when using a phosphor sheet (such as cracking during handling, soft shape breaking). Measurement of rubber / plastic soft hardness tester “Durometer Type D” (Product No .: GSD-720J manufactured by Teclock Co., Ltd.) based on JIS K6253 (2012) Durometer Hardness Test Method Used as an apparatus, the hardness of the sheet at room temperature (25 ° C.) was measured. Based on the experience so far, there is a correlation between the hardness of the phosphor sheet and the ease of handling. Therefore, the handleability was evaluated based on the hardness. If the rating is B or more, there is no practical problem, and if the rating is A or more, it is practically excellent. S: Hardness 60-79 Very easy to handle A: Hardness 80-89 or 50-59 Good handleability B: Hardness 40-49 Tweezers are shaped but handleability is practically acceptable C: Hardness 90 More than or less than 39 Handling is poor.
- the LED packages in Examples 1 to 18 and Comparative Examples 1 to 10 were produced as follows.
- the obtained phosphor composition was placed on a package frame (Enomoto's frame “TOP LED BASE”) on which an LED chip (“GM2QT450G” manufactured by Showa Denko KK, average wavelength: 453.4 nm) was mounted.
- An LED package was manufactured by casting using “MPP-1” manufactured by Musashino Engineering Co., Ltd. and curing at 80 ° C. for 1 hour and 150 ° C. for 2 hours.
- the manufactured LED package was turned on by passing a current of 20 mA, and the luminance immediately after the start of the test was measured using an instantaneous multi-metering system (“MCPD-7700” manufactured by Otsuka Electronics Co., Ltd.). It was.
- the illuminance of Comparative Example 1 was set to 100, and the relative value of illuminance relative to this was shown.
- Example 1 (with silicone fine particles, effect of grafting) ⁇ Preparation of phosphor composition> Using a planetary stirring and degassing apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries), 6.0 g of silicone resin 1 is added to and mixed with 3.0 g of titanium oxide particles obtained by the method of grafting example 1, The mixture was stirred and degassed at 1000 rpm for 10 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%, and then a sample for refractive index measurement and a sample for transparency evaluation were prepared. As a result of the refractive index evaluation, the average refractive index N1 was 1.60. Further, the transparency was very good.
- silicone resin 1 is added to and mixed with 30.0 g of the titanium oxide particles obtained by the method of Grafting Example 1 using a planetary stirring and defoaming device, and the mixture is stirred and removed at 1000 rpm for 3 minutes. Foamed. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%. Next, 6.67 g of silicone fine particles, 26.67 g of phosphor, and 2.35 g of butyl carbitol were added and mixed.
- Comparative Example 1 (with silicone fine particles, influence of graft) A phosphor composition was produced in the same manner as in Example 1 except that no metal compound particles were added. Then, the LED package by the same operation as Example 1 was produced and evaluated. The results are shown in Tables 3 and 4.
- Comparative Example 2 (with silicone fine particles, graft effect) A phosphor composition was produced in the same manner as in Example 1 except that the powder was changed to powdered titanium oxide particles “TKP-102” (trade name, manufactured by TEIKA CORPORATION) as the metal compound particles. Then, the LED package by the same operation as Example 1 was produced and evaluated. The results are shown in Tables 3 and 4. Since the dispersibility in the matrix resin was poor and agglomerated, the phosphor composition could not be produced.
- TKP-102 powdered titanium oxide particles
- Comparative Example 3 (with silicone fine particles, graft effect) The same operation as in Example 1 except that the metal compound particles were changed to "Optlake TR-527" (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd., composition: titanium oxide particles 20 wt%, methanol 80 wt%). A phosphor composition was prepared. Then, the LED package by the same operation as Example 1 was produced and evaluated. The results are shown in Tables 3 and 4. Compared to Comparative Example 1, the luminance further decreased.
- Comparative Examples 4 and 5 (with silicone fine particles, effect of grafting) A phosphor composition was prepared in the same manner as in Example 1 except that the compositions shown in Tables 1 and 3 were changed. Then, the LED package by the same operation as Example 1 was produced, and evaluation was performed. The results are shown in Tables 1 to 4. From these examples, it was found that the brightness was greatly improved with the phosphor composition of the present invention. In Comparative Examples 4 and 5, the luminance was not improved.
- Examples 10 to 18 and Comparative Examples 6 to 10 (no silicone fine particles, effect of grafting)
- a phosphor composition was prepared in the same manner as in Example 1, except that the silicone fine particles were not added and the compositions shown in Tables 5 and 7 were changed. Then, the LED package by the same operation as Example 1 was produced, and evaluation was performed. The results are shown in Tables 5-8. From these examples, it was found that the luminance was improved with the phosphor composition of the present invention. In Comparative Examples 6 to 10, the luminance was not improved.
- Example 19 (with silicone fine particles, graft effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using a planetary stirring and degassing apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries), 6.0 g of silicone resin 1 is added to and mixed with 3.0 g of titanium oxide particles obtained by the method of grafting example 1, The mixture was stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%, and then a sample for refractive index measurement and a sample for transparency evaluation were prepared. As a result of the refractive index evaluation, the average refractive index N1 was 1.60. Further, the transparency was very good.
- silicone resin 1 is added to and mixed with 30.0 g of the titanium oxide particles obtained by the method of Grafting Example 1 using a planetary stirring and defoaming device, and the mixture is stirred and removed at 1000 rpm for 3 minutes. Foamed. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%. Next, 6.67 g of silicone fine particles, 26.67 g of phosphor, and 2.35 g of butyl carbitol were added and mixed.
- Comparative Examples 11 to 15 (with silicone fine particles, graft effect, phosphor sheet) A phosphor composition was prepared in the same manner as in Example 19 except that the compositions described in Tables 9 and 11 were changed. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 9-12. From these examples, it was found that a phosphor sheet obtained by forming the phosphor composition of the present invention into a sheet has good film thickness uniformity and greatly improved luminance. In Comparative Examples 10 to 14, the film thickness uniformity was poor and the luminance was not improved.
- Examples 28 to 36, Comparative Examples 16 to 20 (no silicone fine particles, graft effect, phosphor sheet)
- a phosphor composition was prepared in the same manner as in Example 19 except that the silicone fine particles were not added and the compositions shown in Tables 13 and 15 were changed. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 13-16. From these examples, it was found that if the phosphor sheet is formed by forming the phosphor composition of the present invention into a sheet shape, the film thickness uniformity is within the practical range and the luminance is also improved. In Comparative Examples 16 to 20, the film thickness uniformity was poor and the luminance was not improved.
- Example 37 (refractive index effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using a planetary stirring and defoaming device “Mazerustar KK-400” (manufactured by Kurabo Industries), 1.58 g of silicone resin 1 is added to 9.52 g of titanium oxide particles obtained by the method of grafting example 1, and mixed. The mixture was stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%, and then a sample for refractive index measurement and a sample for transparency evaluation were prepared. As a result of the refractive index evaluation, the average refractive index N1 was 1.63. Further, the transparency was very good.
- silicone resin 1 was added to 47.57 g of titanium oxide particles obtained by the method of grafting example 1 using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries). The mixture was mixed and stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%. Next, 6.67 g of silicone fine particles, 26.67 g of phosphor, and 2.66 g of butyl carbitol were added and mixed.
- the phosphor composition 29 as a base material was coated on a release treatment surface of “Therapy” BX9 (manufactured by Toray Film Processing Co., Ltd., average film thickness 50 ⁇ m), and heated at 120 ° C. for 30 minutes. It dried and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 square mm. Then, the fluorescent sheet was replaced using a dry film laminator, and the base film was changed to a polyphenylene sulfide film “Torelina 3000” (manufactured by Toray Industries, Inc., average film thickness 50 ⁇ m). As a result of the illuminance measurement, relative illuminance was 111 with respect to Comparative Example 11, and a large luminance improvement effect was obtained.
- Example 38 (refractive index effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using a planetary stirring and defoaming device “Mazerustar KK-400” (manufactured by Kurabo Industries Co., Ltd.), 0.6 g of silicone resin 1 is added to 12.0 g of titanium oxide particles obtained by the method of grafting example 1 and mixed. The mixture was stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%, and then a sample for refractive index measurement and a sample for transparency evaluation were prepared. As a result of the refractive index evaluation, the average refractive index N1 was 1.70. Further, the transparency was very good.
- silicone resin 1 is added to and mixed with 60.0 g of titanium oxide particles obtained by the method of Grafting Example 1 using a planetary agitation / deaeration apparatus, and the mixture is agitated and removed at 1000 rpm for 3 minutes. Foamed. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%. Next, 6.67 g of silicone fine particles, 26.67 g of phosphor, and 2.89 g of butyl carbitol were added and mixed.
- Example 39 (refractive index effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries), 2.26 g of silicone resin 1 was added to 7.94 g of the titanium oxide particles obtained by the method of grafting Example 10 and mixed. The mixture was stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%, and then a sample for refractive index measurement and a sample for transparency evaluation were prepared. As a result of the refractive index evaluation, the average refractive index N1 was 1.73. Further, the transparency was very good.
- silicone resin 1 was added to 39.67 g of titanium oxide particles obtained by the method of grafting example 5 using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries). The mixture was mixed and stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%. Next, 6.67 g of silicone fine particles, 26.67 g of phosphor, and 2.53 g of butyl carbitol were added and mixed.
- Example 40 (refractive index effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using a planetary stirring and defoaming device “Mazerustar KK-400” (manufactured by Kurabo Industries), 2.08 g of silicone resin 1 was added to 8.32 g of the titanium oxide particles obtained by the method of grafting Example 10 and mixed. The mixture was stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%, and then a sample for refractive index measurement and a sample for transparency evaluation were prepared. As a result of the refractive index evaluation, the average refractive index N1 was 1.75. Further, the transparency was very good.
- silicone resin 1 was added to 41.60 g of titanium oxide particles obtained by the method of grafting example 5 using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries). The mixture was mixed and stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%. Next, 6.67 g of silicone fine particles, 26.67 g of phosphor, and 2.56 g of butyl carbitol were added and mixed.
- the phosphor composition 32 is obtained. Produced.
- resin was discharged from the die simultaneously with the start of discharge, and good discharge property was confirmed.
- Example 41 (refractive index effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries), 1.58 g of silicone resin 1 was added to 9.52 g of titanium oxide particles obtained by the method of grafting Example 10 and mixed. The mixture was stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%, and then a sample for refractive index measurement and a sample for transparency evaluation were prepared. As a result of the refractive index evaluation, the average refractive index N1 was 1.78. Further, the transparency was very good.
- silicone resin 1 was added to 47.57 g of titanium oxide particles obtained by the method of grafting example 1 using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries). The mixture was mixed and stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%. Next, 6.67 g of silicone fine particles, 26.67 g of phosphor, and 2.66 g of butyl carbitol were added and mixed.
- the phosphor composition 33 is obtained. Produced.
- resin was discharged from the die simultaneously with the start of discharge, and good dischargeability was confirmed.
- Comparative Example 21 (refractive index effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using silicone resin 2, a sample for refractive index measurement and a sample for transparency evaluation were prepared without using metal compound particles. As a result of the refractive index evaluation, the average refractive index N1 was 1.54. Further, the transparency was very good.
- Comparative Example 22 (refractive index effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using a planetary stirring and defoaming device “Mazerustar KK-400” (manufactured by Kurabo Industries), 3.8 g of silicone resin 1 is added to and mixed with titanium oxide particles 3.88 obtained by the method of grafting example 1, The mixture was stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%, and then a sample for refractive index measurement and a sample for transparency evaluation were prepared. As a result of the refractive index evaluation, the average refractive index N1 was 1.58. Further, the transparency was very good.
- silicone resin 1 was added to 19.0 g of the titanium oxide particles obtained by the method of grafting example 1 using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries). The mixture was mixed and stirred and degassed at 1000 rpm for 3 minutes. After leaving for a desired time, the solvent was removed by an evaporator to prepare a sample having a solid content concentration of 80 wt%. Next, 6.67 g of silicone fine particles, 26.67 g of phosphor, and 2.14 g of butyl carbitol were added and mixed.
- Comparative Example 23 (refractive index effect, phosphor sheet) ⁇ Preparation of phosphor composition> Using silicone resin 3, a sample for refractive index measurement and a sample for transparency evaluation were prepared without using metal compound particles. As a result of the refractive index evaluation, the average refractive index N1 was 1.40. Further, the transparency was very good.
- Examples 42 to 47 (Solvent effect, phosphor sheet) Grafted titanium oxide particles were obtained in the same manner as Grafting Example 1 except that the solvents listed in Table 19 were used.
- a phosphor composition was prepared in the same manner as in Example 19 except that this was used.
- the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 19 and 20. From these examples, it was found that a phosphor sheet formed by forming the phosphor composition of the present invention into a sheet shape has good paste transparency and improved luminance.
- Examples 58 to 64 (Effect of base material, phosphor sheet) A phosphor composition was prepared in the same manner as in Example 19. Thereafter, a phosphor sheet laminate was prepared and evaluated in the same manner as in Example 19 except that the base material described in Table 25 was used. The results are shown in Table 25. In Examples 58 to 64, the film thickness uniformity was better than that of Comparative Example 11. In addition, as a result of the illuminance measurement, in comparison with Comparative Example 11, Examples 58 to 64 obtained an effect of improving luminance. From these results, it was found that changing the base material did not change the effect on luminance.
- Examples 65 to 71 (Effect of phosphor sheet thickness, phosphor sheet) A phosphor composition was prepared in the same manner as in Example 19. Thereafter, a phosphor sheet laminate was produced and evaluated in the same manner as in Example 19 except that the sheet thickness was changed to that shown in Table 26. The results are shown in Table 26. As a result of the heat resistance test, it was confirmed that the heat resistance tends to deteriorate as the film thickness increases. Further, as a result of the illuminance measurement, it was found that the luminance was improved in Examples 65 to 71 as compared with Comparative Example 11.
- Example 72 (Effect of high refractive index nanoparticles, phosphor sheet) Grafted nanoparticles were obtained in the same manner as Grafting Example 1, except that the metal compound particles listed in Table 19 were used. A phosphor composition was prepared in the same manner as in Example 19 except that this was used. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Table 28. From Example 72, it turned out that a brightness
- Examples 19, 73 to 82, Comparative Example 14 (Effect of molar ratio of alkoxysilane compound, phosphor sheet)
- a phosphor composition was prepared in the same manner as in Example 19 except that the grafting method described in Tables 29 and 31 was used. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 29-32.
- Examples 19 and 73 to 82 obtained practically no problem with respect to Comparative Example 11, and Examples 19, 73 to 75 were particularly excellent in handleability. Further, as a result of the illuminance measurement, Examples 19, 73 to 82 showed a great brightness improvement effect as compared with Comparative Example 11.
- Examples 19, 83 to 91, Comparative Examples 11, 13, 14, 29 to 35 (with silicone fine particles, viscoelastic behavior, phosphor sheet)
- a phosphor composition was prepared in the same manner as in Example 19 except that the matrix resin described in Tables 33, 35, and 37 was used. Then, the fluorescent substance sheet laminated body by the same operation as Example 19 was produced, and viscoelastic behavior and various evaluation were performed. The results are shown in Tables 33-38.
- Examples 19, 83 to 91 which are within the range of the viscoelastic behavior of the present invention, showed good adhesion, whereas Comparative Examples 11, 13, 14, 29 ⁇ 35 was the result of poor adhesion.
- Examples 28, 92 to 96, Comparative Examples 16, 18, 19, 36 (no silicone fine particles, viscoelastic behavior, phosphor sheet)
- a phosphor composition was prepared in the same manner as in Example 19 except that the silicone fine particles were not added and the matrix resin described in Table 39 was used. Then, the fluorescent substance sheet laminated body by the same operation as Example 19 was produced, and viscoelastic behavior and various evaluation were performed. The results are shown in Tables 39 and 40.
- Examples 28 and 92 to 96 which are within the range of the viscoelastic behavior of the present invention, showed good adhesion, whereas Comparative Examples 16, 18, 19, and 36. was the result of poor adhesion.
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Abstract
Description
0.20≧|N1-N2|。 One feature of the present invention is a phosphor composition containing a phosphor, a matrix resin, and metal compound particles, wherein the metal compound particles have a refractive index of 1.7 or more, and an average particle diameter. 1 to 50 nm, the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship with the refractive index N2 of the phosphor, and the metal compound particles are grafted: A phosphor composition.
0.20 ≧ | N1-N2 |.
<屈折率の関係>
(i)0.20≧|N1-N2|
<粘弾性挙動>
(ii)温度25℃において貯蔵弾性率G’が1.0×104Pa≦ G’≦1.0×106Paであり、かつtanδ<1
(iii)温度100℃において貯蔵弾性率G’が1.0×102Pa≦ G’<1.0×104Paであり、かつtanδ≧1
(iv)温度200℃において貯蔵弾性率G’が1.0×104Pa≦ G’≦1.0×106Paであり、かつtanδ<1。 Another feature of the present invention is a phosphor sheet containing a phosphor, a matrix resin, and metal compound particles, wherein the metal compound particles have a refractive index of 1.7 or more and an average particle diameter. Is 1 to 50 nm, the metal compound particles are grafted, and the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship (i) with the refractive index N2 of the phosphor: The phosphor sheet is characterized in that the viscoelastic behavior of the sheet satisfies the following relationships (ii), (iii), and (iv).
<Refractive index relationship>
(I) 0.20 ≧ | N1-N2 |
<Viscoelastic behavior>
(Ii) The storage elastic modulus G ′ is 1.0 × 10 4 Pa ≦ G ′ ≦ 1.0 × 10 6 Pa at a temperature of 25 ° C. and tan δ <1
(Iii) Storage modulus G ′ is 1.0 × 10 2 Pa ≦ G ′ <1.0 × 10 4 Pa at a temperature of 100 ° C. and tan δ ≧ 1
(Iv) The storage elastic modulus G ′ is 1.0 × 10 4 Pa ≦ G ′ ≦ 1.0 × 10 6 Pa at a temperature of 200 ° C. and tan δ <1.
本発明の一つの特徴である蛍光体組成物は、蛍光体と、マトリックス樹脂と、金属化合物粒子を含有する蛍光体組成物であって、前記金属化合物粒子の屈折率が1.7以上であり、かつ、平均粒子径が1~50nmであり、前記金属化合物粒子と前記マトリックス樹脂の平均屈折率N1が、前記蛍光体の屈折率N2と以下の関係を満たし、前記金属化合物粒子がグラフト化されていることを特徴とする。
0.20≧|N1-N2|。 <Phosphor composition>
A phosphor composition that is one feature of the present invention is a phosphor composition containing a phosphor, a matrix resin, and metal compound particles, and the refractive index of the metal compound particles is 1.7 or more. And the average particle diameter is 1 to 50 nm, the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship with the refractive index N2 of the phosphor, and the metal compound particles are grafted: It is characterized by.
0.20 ≧ | N1-N2 |.
0.20≧|N1-N2|。 In the phosphor composition of the present invention, the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship with the refractive index N2 of the phosphor.
0.20 ≧ | N1-N2 |.
本発明に用いられる金属化合物粒子は、屈折率が1.7以上であり、平均粒子径が1~50nmである。以下、このような金属化合物粒子を「高屈折率ナノ粒子」と呼ぶ。 <Metal compound particles>
The metal compound particles used in the present invention have a refractive index of 1.7 or more and an average particle diameter of 1 to 50 nm. Hereinafter, such metal compound particles are referred to as “high refractive index nanoparticles”.
金属化合物粒子は、平均粒子径が1nmより小さいと粒子として存在することが難しく、50nmより大きいと光を散乱しやすくなり、光透過率が低下する。光散乱を抑制するという観点で、平均粒子径が1~30nmであることが好ましい。 (Particle size)
When the average particle diameter is smaller than 1 nm, the metal compound particles are difficult to exist as particles, and when the average particle diameter is larger than 50 nm, light is easily scattered and the light transmittance is lowered. From the viewpoint of suppressing light scattering, the average particle diameter is preferably 1 to 30 nm.
金属化合物粒子としては、チタニア、ジルコニア、アルミナ、セリア、酸化スズ、酸化インジウム、ジルコン、酸化鉄、酸化亜鉛、酸化ニオブ、窒化ケイ素、窒化ホウ素、窒化アルミ、炭化ケイ素、水酸化アルミニウム、チタン酸バリウムダイアモンド等が挙げられ、これらは単独で用いられても良く、2種類以上併用されても良い。高屈折率、入手のし易さという観点から、アルミニウム化合物粒子、スズ化合物粒子、チタン化合物粒子、ジルコニウム化合物粒子、ニオブ化合物粒子からなる群より選ばれる少なくとも1種が好ましく用いられる。具体的には、アルミニウム、スズ、チタンまたはジルコニウムの酸化物、硫化物、水酸化物などが挙げられるが、これらのうち、塗膜、硬化膜の屈折率調整の点から酸化ジルコニウム粒子および/または酸化チタン粒子が好ましく用いられる。 (composition)
Metal compound particles include titania, zirconia, alumina, ceria, tin oxide, indium oxide, zircon, iron oxide, zinc oxide, niobium oxide, silicon nitride, boron nitride, aluminum nitride, silicon carbide, aluminum hydroxide, barium titanate Diamond etc. are mentioned, These may be used independently and may be used together 2 or more types. From the viewpoint of high refractive index and easy availability, at least one selected from the group consisting of aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles, and niobium compound particles is preferably used. Specific examples include oxides, sulfides and hydroxides of aluminum, tin, titanium, or zirconium. Among these, from the viewpoint of adjusting the refractive index of the coating film and the cured film, zirconium oxide particles and / or Titanium oxide particles are preferably used.
本発明において、金属化合物粒子がグラフト化されているとは、粒子の表面に存在する水酸基を利用し、ポリマーが粒子表面に化学結合(グラフト)されていることを言う。金属化合物粒子がグラフト化されていることで、LEDチップ等との密着性に優れた蛍光体組成物や蛍光体シートが得られる。 (Grafting)
In the present invention, the fact that the metal compound particles are grafted means that the polymer is chemically bonded (grafted) to the particle surface using hydroxyl groups present on the particle surface. By the grafting of the metal compound particles, a phosphor composition or a phosphor sheet having excellent adhesion to an LED chip or the like can be obtained.
ポリシロキサンはアルコキシシランの縮合物であり、アルコキシシラン化合物を溶媒中、酸触媒により加水分解することによって、シラノール化合物を形成した後、該シラノール化合物を縮合反応させることによって得ることができる。アルコキシシラン化合物としては、下記一般式(1)~(3)で表されるアルコキシシラン化合物から選ばれた1種以上のアルコキシシラン化合物が好ましい。 (Polysiloxane)
Polysiloxane is a condensate of alkoxysilane, which can be obtained by hydrolyzing an alkoxysilane compound in a solvent with an acid catalyst to form a silanol compound and then subjecting the silanol compound to a condensation reaction. As the alkoxysilane compound, one or more alkoxysilane compounds selected from the alkoxysilane compounds represented by the following general formulas (1) to (3) are preferable.
R1は水素、アルキル基、アルケニル基、アリール基またはそれらの置換体を表す。耐クラック性の点から、R1としてメチル基またはフェニル基を有するアルコキシシラン化合物を用いることが好ましい。R4はメチル基、エチル基、プロピル基、イソプロピル基またはブチル基を表し、それぞれ同一でも異なっていても良い。R4はメチル基またはエチル基がより好ましい。 R 1 Si (OR 4 ) 3 (1)
R 1 represents hydrogen, an alkyl group, an alkenyl group, an aryl group, or a substituted product thereof. From the viewpoint of crack resistance, it is preferable to use an alkoxysilane compound having a methyl group or a phenyl group as R 1 . R 4 represents a methyl group, an ethyl group, a propyl group, an isopropyl group, or a butyl group, and may be the same or different. R 4 is more preferably a methyl group or an ethyl group.
R2およびR3は、それぞれ水素、アルキル基、アルケニル基、アリール基またはそれらの置換体を表す。R5はメチル基、エチル基、プロピル基、イソプロピル基またはブチル基を表し、それぞれ同一でも異なっていても良い。R5はメチル基またはエチル基がより好ましい。 R 2 R 3 Si (OR 5 ) 2 (2)
R 2 and R 3 each represent hydrogen, an alkyl group, an alkenyl group, an aryl group, or a substituted product thereof. R 5 represents a methyl group, an ethyl group, a propyl group, an isopropyl group, or a butyl group, and may be the same or different. R5 is more preferably a methyl group or an ethyl group.
R6はメチル基またはエチル基を表し、それぞれ同一でも異なっていても良い。 Si (OR 6 ) 4 (3)
R 6 represents a methyl group or an ethyl group, and may be the same or different.
蛍光体は、LEDチップから放出される光を吸収し、波長変換を行い、LEDチップの光と異なる波長の光を放出するものである。これにより、LEDチップから放出される光の一部と、蛍光体から放出される光の一部とが混合して、白色を含む多色系のLEDパッケージを作製することが可能である。具体的には、青色LEDチップに、LEDチップからの光によって黄色の発光色を発光する蛍光体を光学的に結合させることによって白色を発光させることができる。上述のような蛍光体には、緑色に発光する蛍光体、青色に発光する蛍光体、黄色に発光する蛍光体、赤色に発光する蛍光体等の種々の蛍光体がある。 <Phosphor>
The phosphor absorbs light emitted from the LED chip, performs wavelength conversion, and emits light having a wavelength different from that of the LED chip. Thereby, a part of the light emitted from the LED chip and a part of the light emitted from the phosphor can be mixed to produce a multicolor LED package containing white. Specifically, white light can be emitted by optically coupling a fluorescent material that emits a yellow light emission color with light from the LED chip to the blue LED chip. The phosphors as described above include various phosphors such as a phosphor that emits green light, a phosphor that emits blue light, a phosphor that emits yellow light, and a phosphor that emits red light.
マトリックス樹脂は、連続相を形成するものであり、成型加工性、透明性、耐熱性、接着性等に優れる材料であれば、エポキシ樹脂、シリコーン樹脂(シリコーンゴム、シリコーンゲル等のオルガノポリシロキサン硬化物(架橋物)を含む)、ウレア樹脂、フッ素樹脂、ポリカーボネート樹脂などの公知のものを用いることができる。これらの樹脂を適宜設計することで、本発明の蛍光体組成物に有用な樹脂が得られる。 <Matrix resin>
The matrix resin forms a continuous phase and is an epoxy resin, silicone resin (silicone rubber, silicone gel or other organopolysiloxane cured material as long as it is a material excellent in moldability, transparency, heat resistance, adhesiveness, etc. Products (including cross-linked products), urea resins, fluororesins, polycarbonate resins and the like can be used. By appropriately designing these resins, a resin useful for the phosphor composition of the present invention can be obtained.
(A)平均単位式:
(R1 2SiO2/2)a(R1SiO3/2)b(R2O1/2)c
(式中、R1はフェニル基、炭素原子数1~6のアルキル基もしくはシクロアルキル基、または炭素原子数2~6のアルケニル基であり、ただし、R1の65~75モル%はフェニルであり、R1の10~20モル%はアルケニル基であり、R2は水素原子または炭素原子数1~6のアルキル基であり、a、b、およびcは、0.5≦a≦0.6、0.4≦b≦0.5、0≦c≦0.1、かつa+b=1を満たす数である。)
で表されるオルガノポリシロキサン、
(B)一般式:
R3 3SiO(R3 2SiO)mSiR3 3
(式中、R3はフェニル基、炭素原子数1~6のアルキル基もしくはシクロアルキル基、または炭素原子数2~6のアルケニル基であり、ただし、R3の40~70モル%はフェニルであり、R3の少なくとも1個はアルケニル基であり、mは5~50の整数である。)で表されるオルガノポリシロキサン{(A)成分100重量部に対して5~15重量部}
(C)一般式:
(HR4 2SiO)2SiR4 2
(式中、R4はフェニル基、または炭素原子数1~6のアルキル基もしくはシクロアルキル基であり、ただし、R4の30~70モル%はフェニルである。)
で表されるオルガノトリシロキサン{(A)成分中と(B)成分中のアルケニル基の合計に対する本成分中のケイ素原子結合水素原子のモル比が0.5~2となる量}、および
(D)ヒドロシリル化反応用触媒{(A)成分と(B)成分中のアルケニル基と(C)成分中のケイ素原子結合水素原子とのヒドロシリル化反応を促進するに十分な量}。 The silicone resin will be described in more detail. An addition reaction curable silicone composition containing a silicone having an alkenyl group bonded to a silicon atom, a silicone having a hydrogen atom bonded to a silicon atom, and a platinum-based catalyst as a hydrosilylation reaction catalyst is preferable. For example, sealing materials “OE6630” and “OE6636” manufactured by Toray Dow Corning Co., Ltd., “SCR-1012” and “SCR1016” manufactured by Shin-Etsu Chemical Co., Ltd. can be used. In particular, the matrix resin of the phosphor composition of the present invention is particularly preferably a crosslinked product obtained by hydrosilylation reaction of a crosslinkable silicone composition containing the compositions (A) to (D). This crosslinked product can be preferably used as a matrix resin for a phosphor sheet that does not require an adhesive because the storage elastic modulus decreases at 60 ° C. to 250 ° C. and a high adhesive force is obtained by heating. Hereinafter, this cross-linked product is referred to as a heat sealing resin.
(A) Average unit formula:
(R 1 2 SiO 2/2 ) a (R 1 SiO 3/2 ) b (R 2 O 1/2 ) c
(Wherein R 1 is a phenyl group, an alkyl or cycloalkyl group having 1 to 6 carbon atoms, or an alkenyl group having 2 to 6 carbon atoms, provided that 65 to 75 mol% of R 1 is phenyl. 10 to 20 mol% of R 1 is an alkenyl group, R 2 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and a, b, and c are 0.5 ≦ a ≦ 0. (6, 0.4 ≦ b ≦ 0.5, 0 ≦ c ≦ 0.1, and a + b = 1)
An organopolysiloxane represented by
(B) General formula:
R 3 3 SiO (R 3 2 SiO) m SiR 3 3
(Wherein R 3 is a phenyl group, an alkyl or cycloalkyl group having 1 to 6 carbon atoms, or an alkenyl group having 2 to 6 carbon atoms, provided that 40 to 70 mol% of R 3 is phenyl. And at least one of R 3 is an alkenyl group, and m is an integer of 5 to 50.) {5 to 15 parts by weight relative to 100 parts by weight of component (A)}
(C) General formula:
(HR 4 2 SiO) 2 SiR 4 2
(In the formula, R 4 is a phenyl group, or an alkyl group or cycloalkyl group having 1 to 6 carbon atoms, provided that 30 to 70 mol% of R 4 is phenyl.)
{Amount such that the molar ratio of silicon-bonded hydrogen atoms in this component to the total of alkenyl groups in component (A) and component (B) is 0.5 to 2}, and ( D) Catalyst for hydrosilylation reaction {Amount sufficient to promote hydrosilylation reaction between alkenyl group in component (A), component (B) and silicon atom-bonded hydrogen atom in component (C)}.
本発明の蛍光体組成物はシリコーン微粒子を含有していてもよい。シリコーン微粒子を含有することで、接着性や加工性だけでなく、膜厚均一性も良好な蛍光体シートを得ることができる。特に、平均粒子径が0.1μm以上2.0μm以下であるシリコーン微粒子を用いることで、スリットダイコーターを用いた場合の吐出性に優れ、膜厚均一性に優れた蛍光体シートを得ることができる。 <Silicon fine particles>
The phosphor composition of the present invention may contain silicone fine particles. By containing the silicone fine particles, it is possible to obtain a phosphor sheet having not only adhesiveness and workability but also good film thickness uniformity. In particular, by using silicone fine particles having an average particle size of 0.1 μm or more and 2.0 μm or less, it is possible to obtain a phosphor sheet that is excellent in dischargeability and excellent in film thickness uniformity when a slit die coater is used. it can.
本発明の蛍光体組成物は溶媒を含んでいてもよい。溶媒は、流動状態の樹脂の粘度を調整できるものであれば、特に限定されない。例えば、トルエン、メチルエチルケトン、メチルイソブチルケトン、ヘキサン、アセトン、テルピネオール、テキサノール、メチルセルソルブ、ブチルカルビトール、ブチルカルビトールアセテート、プロピレングリコールモノメチルエーテルアセテート等が挙げられる。 <Solvent>
The phosphor composition of the present invention may contain a solvent. A solvent will not be specifically limited if the viscosity of resin of a fluid state can be adjusted. For example, toluene, methyl ethyl ketone, methyl isobutyl ketone, hexane, acetone, terpineol, texanol, methyl cellosolve, butyl carbitol, butyl carbitol acetate, propylene glycol monomethyl ether acetate and the like can be mentioned.
本発明の蛍光体組成物は、塗布膜安定化のための分散剤やレベリング剤、蛍光体シートとした場合のシート表面の改質剤としてシランカップリング剤等の接着補助剤等を含有していてもよい。 <Other ingredients>
The phosphor composition of the present invention contains a dispersing agent and a leveling agent for stabilizing the coating film, an adhesion assistant such as a silane coupling agent as a sheet surface modifier when the phosphor sheet is used. May be.
(E)一般式:(R5SiO3)d(PhSiO3)e(R5OHSiO2)f(PhOHSiO2)g(R6SiO2)h
式中、R5およびR6はそれぞれ炭素原子数1~6のアルキル基もしくはシクロアルキル基、Phはフェニル基であり、d、e、f、gおよびhは、20≦d≦40、20≦e≦40、5≦f≦15、5≦g≦15、20≦h≦40、かつd+e+f+g+h=100を満たす数である。 Moreover, in order to lower the storage elastic modulus (G ′) at 100 ° C., a silanol group-containing methylphenyl silicone resin may be contained as a heating adhesive. The structure of the silanol group-containing methylphenyl silicone resin is particularly preferably the following general formula (E).
(E) the general formula: (R 5 SiO 3) d (PhSiO 3) e (
In the formula, R 5 and R 6 are each an alkyl group or cycloalkyl group having 1 to 6 carbon atoms, Ph is a phenyl group, and d, e, f, g, and h are 20 ≦ d ≦ 40, 20 ≦ e ≦ 40, 5 ≦ f ≦ 15, 5 ≦ g ≦ 15, 20 ≦ h ≦ 40, and d + e + f + g + h = 100.
本発明において蛍光体シート積層体とは、基材と、蛍光体組成物を前記基材上に塗布することによって形成された蛍光体シートを含有する積層体をいう。 <Phosphor sheet laminate>
In the present invention, the phosphor sheet laminate refers to a laminate containing a substrate and a phosphor sheet formed by applying a phosphor composition onto the substrate.
基材としては、特に制限無く公知の金属、フィルム、ガラス、セラミック、紙等を使用することができる。具体的には、アルミニウム(アルミニウム合金も含む)、亜鉛、銅、鉄などの金属板や箔、セルロースアセテート、ポリエチレンテレフタレート(PET)、ポリエチレン、ポリエステル、ポリアミド、ポリイミド、ポリフェニレンスルフィド、ポリスチレン、ポリプロピレン、ポリカーボネート、ポリビニルアセタール、アラミド、シリコーン、ポリオレフィン、熱可塑性フッ素樹脂で、テトラフルオロエチレンとエチレンの共重合体(ETFE)などのプラスチックのフィルム、α-ポリオレフィン樹脂、ポリカプロラクトン樹脂、アクリル樹脂、シリコーン樹脂およびこれらとエチレンの共重合樹脂からなるプラスチックのフィルム、前記プラスチックがラミネートされた紙、または前記プラスチックによりコーティングされた紙、前記金属がラミネートまたは蒸着された紙、前記金属がラミネートまたは蒸着されたプラスチックフィルムなどが挙げられる。また、基材が金属板の場合、表面にクロム系やニッケル系などのメッキ処理やセラミック処理されていてもよい。 (Base material)
As a base material, a well-known metal, a film, glass, a ceramic, paper, etc. can be used without a restriction | limiting in particular. Specifically, metal plates and foils such as aluminum (including aluminum alloys), zinc, copper, iron, cellulose acetate, polyethylene terephthalate (PET), polyethylene, polyester, polyamide, polyimide, polyphenylene sulfide, polystyrene, polypropylene, polycarbonate , Polyvinyl acetal, aramid, silicone, polyolefin, thermoplastic fluororesin, plastic film such as tetrafluoroethylene and ethylene copolymer (ETFE), α-polyolefin resin, polycaprolactone resin, acrylic resin, silicone resin and these A plastic film made of a copolymer resin of ethylene and ethylene, paper laminated with the plastic, or paper coated with the plastic, front Paper metal is laminated or deposited, the metals and plastic film laminated or deposited. Moreover, when the base material is a metal plate, the surface may be subjected to plating treatment or ceramic treatment such as chromium or nickel.
本発明において蛍光体シートとは、内部に蛍光体を含むシートのことをいう。本発明の一つの特徴である蛍光体シートは、蛍光体と、マトリックス樹脂と、金属化合物粒子を含有する蛍光体シートであって、前記金属化合物粒子の屈折率が1.7以上であり、かつ、平均粒子径が1~50nmであり、前記金属化合物粒子がグラフト化されており、前記金属化合物粒子と前記マトリックス樹脂の平均屈折率N1が、前記蛍光体の屈折率N2と以下の関係(i)を満たし、シートの粘弾性挙動が以下の関係(ii)、(iii)および(iv)を満たすことを特徴とする。
<屈折率の関係>
(i)0.20≧|N1-N2|
<粘弾性挙動>
(ii)温度25℃において貯蔵弾性率G’が1.0×104Pa≦ G’≦1.0×106Paであり、かつtanδ<1
(iii)温度100℃において貯蔵弾性率G’が1.0×102Pa≦ G’<1.0×104Paであり、かつtanδ≧1
(iv)温度200℃において貯蔵弾性率G’が1.0×104Pa≦ G’≦1.0×106Paであり、かつtanδ<1。 (Phosphor sheet)
In the present invention, the phosphor sheet refers to a sheet containing a phosphor inside. A phosphor sheet which is one feature of the present invention is a phosphor sheet containing a phosphor, a matrix resin, and metal compound particles, wherein the metal compound particles have a refractive index of 1.7 or more, and The average particle diameter is 1 to 50 nm, the metal compound particles are grafted, and the average refractive index N1 of the metal compound particles and the matrix resin is related to the refractive index N2 of the phosphor as follows: And the viscoelastic behavior of the sheet satisfies the following relationships (ii), (iii) and (iv).
<Refractive index relationship>
(I) 0.20 ≧ | N1-N2 |
<Viscoelastic behavior>
(Ii) The storage elastic modulus G ′ is 1.0 × 10 4 Pa ≦ G ′ ≦ 1.0 × 10 6 Pa at a temperature of 25 ° C. and tan δ <1
(Iii) Storage modulus G ′ is 1.0 × 10 2 Pa ≦ G ′ <1.0 × 10 4 Pa at a temperature of 100 ° C. and tan δ ≧ 1
(Iv) The storage elastic modulus G ′ is 1.0 × 10 4 Pa ≦ G ′ ≦ 1.0 × 10 6 Pa at a temperature of 200 ° C. and tan δ <1.
(Thermo Fisher SCIENTIFIC 製)
測定条件 :OSC温度依存測定
ジオメトリー:平行円板型(20mm)
測定時間 :1980秒
角周波数 :1Hz
角速度 :6.2832rad/秒
温度範囲 :25~200℃(低温温度制御機能あり)
昇温速度 :0.08333℃/秒
サンプル形状:円形(直径18mm)。 Measuring device: Viscosity and viscoelasticity measuring device HAAKE MARSIII
(Thermo Fisher SCIENTIFIC made)
Measurement conditions: OSC temperature-dependent measurement Geometry: Parallel disk type (20mm)
Measurement time: 1980 seconds Angular frequency: 1 Hz
Angular velocity: 6.2832 rad / sec Temperature range: 25 to 200 ° C (with low temperature control function)
Temperature increase rate: 0.08333 ° C./sec Sample shape: Circular (
本発明の蛍光体シートは、前述した蛍光体組成物から得ることができる。その製造方法の詳細は後述する。 <Method for producing phosphor sheet>
The phosphor sheet of the present invention can be obtained from the phosphor composition described above. Details of the manufacturing method will be described later.
膜厚バラツキB(%)=(最大膜厚ズレ値*-平均膜厚)/平均膜厚×100
*最大膜厚ズレ値は膜厚の最大値または最小値のうち平均膜厚との差が大きい方を選択する。 More specifically, it is obtained by measuring the film thickness using a micrometer such as a commercially available contact-type thickness meter using the measurement conditions of the method A of measuring the thickness by mechanical scanning. The difference between the maximum value or the minimum value of the film thickness and the average film thickness is calculated, and this value is divided by the average film thickness, and the value expressed in 100 minutes is the film thickness variation B (%).
Film thickness variation B (%) = (maximum film thickness deviation value * −average film thickness) / average film thickness × 100
* For the maximum film thickness deviation value, the one with the larger difference from the average film thickness is selected from the maximum value or the minimum value.
以下に、本発明の蛍光体組成物の製造方法の一例を説明する。前述した金属化合物粒子、マトリックス樹脂、蛍光体、シリコーン微粒子、溶剤等を所定量混合する。上記の成分を所定の組成になるよう混合した後、ホモジナイザー、自公転型攪拌機、3本ローラー、ボールミル、遊星式ボールミル、ビーズミル等の撹拌・混練機で均質に混合分散することで、蛍光体組成物が得られる。混合分散後、もしくは混合分散の過程で、真空もしくは減圧条件下で脱泡することも好ましく行われる。また、ある特定の成分を事前に混合することや、エージング等の処理をしても構わない。エバポレーターによって溶剤を除去して所望の固形分濃度にすることも可能である。 <Method for producing phosphor composition>
Below, an example of the manufacturing method of the fluorescent substance composition of this invention is demonstrated. A predetermined amount of the aforementioned metal compound particles, matrix resin, phosphor, silicone fine particles, solvent and the like are mixed. After mixing the above components to a predetermined composition, the phosphor composition is uniformly mixed and dispersed with an agitator / kneader such as a homogenizer, a self-revolving stirrer, a 3-roller, a ball mill, a planetary ball mill, or a bead mill. Things are obtained. Defoaming is preferably carried out under vacuum or reduced pressure conditions after mixing or dispersing. Further, a specific component may be mixed in advance or a process such as aging may be performed. It is also possible to remove the solvent with an evaporator to obtain a desired solid content concentration.
以下に、本発明の蛍光体組成物の製造方法の一例を説明する。上述した方法で作製した蛍光体組成物を基材上に塗布し、乾燥させ、蛍光体シート積層体を作製する。塗布は、リバースロールコーター、ブレードコーター、スリットダイコーター、ダイレクトグラビアコーター、オフセットグラビアコーター、キスコーター、ナチュラルロールコーター、エアーナイフコーター、ロールブレードコーター、バリバーロールブレードコーター、トゥーストリームコーター、ロッドコーター、ワイヤーバーコーター、アプリケーター、ディップコーター、カーテンコーター、スピンコーター、ナイフコーター等により行うことができる。蛍光体シートの膜厚均一性を得るためにはスリットダイコーターで塗布することが好ましい。 <Method for producing phosphor sheet laminate>
Below, an example of the manufacturing method of the fluorescent substance composition of this invention is demonstrated. The phosphor composition produced by the method described above is applied onto a substrate and dried to produce a phosphor sheet laminate. Application is reverse roll coater, blade coater, slit die coater, direct gravure coater, offset gravure coater, kiss coater, natural roll coater, air knife coater, roll blade coater, varibar roll blade coater, two stream coater, rod coater, wire A bar coater, an applicator, a dip coater, a curtain coater, a spin coater, a knife coater or the like can be used. In order to obtain the film thickness uniformity of the phosphor sheet, it is preferably applied by a slit die coater.
本発明の蛍光体シート積層体は、好ましくは、ラテラル、バーティカル、フィリップチップなどの一般的な構造のLEDチップの発光面に貼り付けることで、LEDチップの表面に蛍光体シートが積層された蛍光体シート付きLEDチップを形成でき、特に発光面積が大きいバーティカル、フリップチップタイプのLEDチップに好適に用いることができる。なお、発光面とはLEDチップからの光が取り出される面をいう。 <Application example of phosphor sheet>
The phosphor sheet laminate of the present invention is preferably a fluorescent material in which a phosphor sheet is laminated on the surface of an LED chip by being attached to a light emitting surface of an LED chip having a general structure such as lateral, vertical, and Philip chip. An LED chip with a body sheet can be formed, and can be suitably used for a vertical or flip chip type LED chip having a large light emitting area. The light emitting surface is a surface from which light from the LED chip is extracted.
本発明の蛍光体組成物を用いたLEDパッケージの製造方法について説明する。図12に蛍光体組成物を使用したLEDチップの好適な製造方法例を示すが、この方法には限定されない。本発明の蛍光体組成物を用いた製造方法として、特に好ましくは、(A)蛍光体組成物をパッケージフレームに注入する工程、及び(B)その工程の後、封止材でパッケージを封止する工程を少なくとも含むLEDパッケージの製造方法である。 <Application example to LED package manufacturing method>
A method for producing an LED package using the phosphor composition of the present invention will be described. Although the suitable example of a manufacturing method of the LED chip which uses the fluorescent substance composition is shown in FIG. 12, it is not limited to this method. As a manufacturing method using the phosphor composition of the present invention, particularly preferably, (A) a step of injecting the phosphor composition into a package frame, and (B) a package is sealed with a sealing material after that step. It is a manufacturing method of the LED package including the process to perform.
ナノ粒子1:酸化チタン“オプトレイクTR-527”(触媒化成工業(株)製 組成:平均粒子径15nm、屈折率2.50、酸化チタン粒子20重量%)
ナノ粒子2:酸化チタン“オプトレイクTR-520”(触媒化成工業(株)製 組成:平均粒子径15nm、屈折率2.50、酸化チタン粒子30重量%)
ナノ粒子3:酸化チタン“オプトレイクTR-521”(触媒化成工業(株)製 組成:平均粒子径15nm、屈折率2.50、酸化チタン粒子30重量%)
ナノ粒子4:酸化スズ粒子“SN1”(平均粒子径19nm、屈折率2.38)
ナノ粒子5:酸化アルミニウム粒子“SA1”(平均粒子径34nm、屈折率1.76)
ナノ粒子6:酸化セリウム粒子“CS1”(平均粒子径34nm、屈折率2.20)
ナノ粒子7:酸化ジルコニア“ZS1”(平均粒子径15nm、屈折率2.40、酸化ジルコニア粒子20重量%)
ナノ粒子8:酸化マグネシウム粒子“MS1”(平均粒子径44nm、屈折率1.76)
ナノ粒子9:酸化亜鉛粒子“AS1”(平均粒子径94nm、屈折率1.95)
ナノ粒子10:酸化チタン粒子“TS1”(平均粒子径30nm、屈折率2.50、酸化チタン粒子20重量%)
ナノ粒子11:酸化チタン粒子“TS2”(平均粒子径50nm、屈折率2.50、酸化チタン粒子20重量%)
ナノ粒子12:酸化チタン粒子“TS3”(平均粒子径70nm、屈折率2.50、酸化チタン粒子20重量%)
ナノ粒子13:酸化チタン粒子“TS4”(平均粒子径80nm、屈折率2.50、酸化チタン粒子20重量%)
ナノ粒子14:酸化ジルコニア“ZS2”(平均粒子径20nm、屈折率2.40、酸化ジルコニア粒子20重量%)
ナノ粒子15:酸化ジルコニア粒子“ZS3”(平均粒子径30nm、屈折率2.40、酸化ジルコニア粒子20重量%)
ナノ粒子16:酸化ジルコニア粒子“ZS4”(平均粒子径50nm、屈折率2.40、酸化ジルコニア粒子20重量%)
ナノ粒子17:酸化ジルコニア粒子 “ZS5”(平均粒子径70nm、屈折率2.40、酸化ジルコニア粒子20重量%)
ナノ粒子18:酸化ジルコニア粒子“ZS6”(平均粒子径80nm、屈折率2.40、酸化ジルコニア粒子20重量%)
ナノ粒子19:酸化ニオブ粒子“NS1”(平均粒子径15nm、屈折率2.30、酸化ニオブ粒子20重量%)。 <Metal compound particles>
Nanoparticle 1: Titanium oxide “Optlake TR-527” (manufactured by Catalyst Kasei Kogyo Co., Ltd. Composition:
Nanoparticle 2: Titanium oxide “Optlake TR-520” (manufactured by Catalyst Kasei Kogyo Co., Ltd. Composition:
Nanoparticle 3: Titanium oxide “Optlake TR-521” (manufactured by Catalytic Chemical Industry Co., Ltd. Composition:
Nanoparticle 4: Tin oxide particle “SN1” (
Nanoparticle 5: Aluminum oxide particle “SA1” (
Nanoparticle 6: Cerium oxide particle “CS1” (
Nanoparticle 7: Zirconia oxide “ZS1” (
Nanoparticle 8: Magnesium oxide particle “MS1” (average particle diameter 44 nm, refractive index 1.76)
Nanoparticle 9: Zinc oxide particle “AS1” (average particle diameter 94 nm, refractive index 1.95)
Nanoparticle 10: Titanium oxide particles “TS1” (
Nanoparticle 11: Titanium oxide particles “TS2” (average particle diameter 50 nm, refractive index 2.50,
Nanoparticle 12: Titanium oxide particles “TS3” (average particle diameter 70 nm, refractive index 2.50,
Nanoparticle 13: Titanium oxide particles “TS4” (average particle diameter 80 nm, refractive index 2.50,
Nanoparticle 14: Zirconia oxide “ZS2” (
Nanoparticle 15: Zirconia oxide particles “ZS3” (
Nanoparticle 16: Zirconia oxide particles “ZS4” (average particle diameter 50 nm, refractive index 2.40,
Nanoparticle 17: Zirconia oxide particle “ZS5” (average particle size 70 nm, refractive index 2.40,
Nanoparticle 18: Zirconia oxide particles “ZS6” (average particle diameter 80 nm, refractive index 2.40,
Nanoparticle 19: Niobium oxide particles “NS1” (
<グラフト化例1>
メチルトリメトキシシラン 16.6g、フェニルトリメトキシシラン 56.2g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)194g、プロピレングリコールモノメチルエーテルアセテート126.9gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.36gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 (Grafting of metal compound particles)
<Grafting example 1>
16.6 g of methyltrimethoxysilane, 56.2 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 wt%) 194 g and propylene glycol monomethyl ether acetate 126.9 g were put into a reaction vessel, and 21.9 g of water and 0.36 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
メチルトリメトキシシラン 20.4g、フェニルトリメトキシシラン 69.4g、数平均粒子径15nmの”オプトレイクTR-520”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子30重量%、γ-ブチロラクトン70重量%)70.6g、γ-ブチロラクトン44.1gを反応容器に入れ、この溶液に、水30.6gおよびリン酸0.48gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温130℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 2>
20.4 g of methyltrimethoxysilane, 69.4 g of phenyltrimethoxysilane, “OPTRAIK TR-520” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Chemical Industry Co., Ltd., composition: 30% by weight of titanium oxide particles, γ 70.6 g of butyrolactone (70 wt%) and 44.1 g of γ-butyrolactone were placed in a reaction vessel, and 30.6 g of water and 0.48 g of phosphoric acid were added to this solution while stirring, and the reaction temperature did not exceed 40 ° C. Was dropped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 130 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
メチルトリメトキシシラン 8.2g、フェニルトリメトキシシラン 55.5g、ジメチルジメトキシシラン 7.2g、数平均粒子径15nmの”オプトレイクTR-521”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子30重量%、ジアセトンアルコール70重量%)71.1g、γ-ブチロラクトン23.9gを反応容器に入れ、この溶液に、水34.5gおよびリン酸1.0gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温130℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 3>
8.2 g of methyltrimethoxysilane, 55.5 g of phenyltrimethoxysilane, 7.2 g of dimethyldimethoxysilane, “OPTRAIK TR-521” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd., composition: oxidation 71.1 g of titanium particles (70 wt% of titanium particles, 70 wt% of diacetone alcohol) and 23.9 g of γ-butyrolactone were placed in a reaction vessel, and 34.5 g of water and 1.0 g of phosphoric acid were added to this solution while stirring. The solution was added dropwise so that the temperature did not exceed 40 ° C. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 130 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
3-グリシドキシプロピルトリメトキシシラン 28.78g、フェニルトリメトキシシラン 56.4g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)194g、プロピレングリコールモノメチルエーテルアセテート253.3gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.36gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 4>
3-Glycidoxypropyltrimethoxysilane 28.78 g, phenyltrimethoxysilane 56.4 g, number-
ビニルトリメトキシシラン 18.1g、3-グリシドキシプロピルトリメトキシシラン 67.2g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)194g、プロピレングリコールモノメチルエーテルアセテート253.6gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.36gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 5>
18.1 g of vinyltrimethoxysilane, 67.2 g of 3-glycidoxypropyltrimethoxysilane, “OPTRAIK TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Chemical Industries, Ltd. Composition: titanium oxide particles 194 g of 20 wt% methanol 80 wt%) and 253.6 g of propylene glycol monomethyl ether acetate were placed in a reaction vessel. To this solution, 21.9 g of water and 0.36 g of phosphoric acid were stirred while the reaction temperature was 40 ° C. It was dripped so that it might not exceed. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ビニルトリメトキシシラン 18.05g、フェニルトリメトキシシラン 56.36g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)205.7g、プロピレングリコールモノメチルエーテルアセテート131.3gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.36gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 6>
18.05 g of vinyltrimethoxysilane, 56.36 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 805.7%) 205.7 g and propylene glycol monomethyl ether acetate 131.3 g were put in a reaction vessel. To this solution, 21.9 g of water and 0.36 g of phosphoric acid were stirred and the reaction temperature did not exceed 40 ° C. Was dropped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
メチルトリメトキシシラン 16.6g、フェニルトリメトキシシラン 56.2g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)194g、プロピレングリコールモノメチルエーテルアセテート126.9gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.36gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で1時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに1時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 7>
16.6 g of methyltrimethoxysilane, 56.2 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 wt%) 194 g and propylene glycol monomethyl ether acetate 126.9 g were put into a reaction vessel, and 21.9 g of water and 0.36 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 1 hour, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 1 hour, and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
メチルトリメトキシシラン 16.6g、フェニルトリメトキシシラン 56.2g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)194g、プロピレングリコールモノメチルエーテルアセテート126.9gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.36gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で1時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに15分加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 8>
16.6 g of methyltrimethoxysilane, 56.2 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 wt%) 194 g and propylene glycol monomethyl ether acetate 126.9 g were put into a reaction vessel, and 21.9 g of water and 0.36 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 1 hour, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 15 minutes and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
酸素と水分の除去されたグローブボックス内において、ガラス製シャーレの上に粉末酸化チタン粒子”TKP-102”(商品名、テイカ(株)製)を薄く広げ、シャーレをプラズマエッチャー(メイワフォーシス、SEDE)内に設置し、15分間プラズマ処理を行なった。プラズマ処理した粒子をキャップ付試験管に移し、あらかじめ準備しておいた9.6mMの2,2,6,6-tetramethylpiperidine 1-oxyl (TEMPO)スチレン溶液を試験管中に入れ、キャップでシールした後、125℃に加熱しておいたアルミブロックヒーターに差込み、ラジカル重合を行なった。12時間経過後、試験管をヒーターならびにグローブボックスから取り出し、酸素バブリングしておいたクロロホルムを加え、重合を完全に停止した。遠心分離によって、酸化チタン粒子と溶媒を分離した後、酸化チタン粒子を取出した。酸化チタン粒子をアセトンで洗浄して、グラフト処理した酸化チタン粒子を得た。 <Grafting example 9>
In a glove box from which oxygen and moisture have been removed, powdered titanium oxide particles “TKP-102” (trade name, manufactured by Teika Co., Ltd.) are spread thinly on a glass petri dish, and the petri dish is made into a plasma etcher (Meiwa Forsys, SEDE). ) And plasma treatment was performed for 15 minutes. The plasma-treated particles were transferred to a capped test tube, and a 9.6
メチルトリメトキシシラン 5.59g、フェニルトリメトキシシラン 19.0g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)264.6g、プロピレングリコールモノメチルエーテルアセテート103.3gを反応容器に入れ、この溶液に、水7.39gおよびリン酸0.12gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting Example 10>
5.59 g of methyltrimethoxysilane, 19.0 g of phenyltrimethoxysilane, “OPTRAIK TR-527” (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) having a number average particle diameter of 15 nm, composition: 20% by weight of titanium oxide particles, methanol 804.6%) (264.6 g) and propylene glycol monomethyl ether acetate (103.3 g) were placed in a reaction vessel. To this solution, 7.39 g of water and 0.12 g of phosphoric acid were stirred and the reaction temperature did not exceed 40 ° C. Was dropped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 4.88g、フェニルトリメトキシシラン 72.46g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)213.4g、プロピレングリコールモノメチルエーテルアセテート139.6gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.37gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting Example 11>
4.88 g of dimethyldimethoxysilane, 72.46 g of phenyltrimethoxysilane, “OPTRAIK TR-527” (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) having a number average particle diameter of 15 nm, composition: 20% by weight of titanium oxide particles, methanol 80 (% By weight) 213.4 g and 139.6 g of propylene glycol monomethyl ether acetate were put into a reaction vessel, and 21.9 g of water and 0.37 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 9.76g、フェニルトリメトキシシラン 64.41g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)199.65g、プロピレングリコールモノメチルエーテルアセテート130.6gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.37gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 12>
9.76 g of dimethyldimethoxysilane, 64.41 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 (% By weight) 199.65 g and 130.6 g of propylene glycol monomethyl ether acetate were put in a reaction vessel, and 21.9 g of water and 0.37 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped in. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 14.64g、フェニルトリメトキシシラン 56.36g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)185.94g、プロピレングリコールモノメチルエーテルアセテート121.7gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.36gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 13>
14.64 g of dimethyldimethoxysilane, 56.36 g of phenyltrimethoxysilane, “OPTRAIK TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Chemical Industry Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 (Weight%) 185.94 g and 121.7 g of propylene glycol monomethyl ether acetate are put in a reaction vessel, and 21.9 g of water and 0.36 g of phosphoric acid are added to this solution while stirring so that the reaction temperature does not exceed 40 ° C. It was dripped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 19.52g、フェニルトリメトキシシラン 48.31g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)172.22g、プロピレングリコールモノメチルエーテルアセテート112.7gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.35gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting Example 14>
19.52 g of dimethyldimethoxysilane, 48.31 g of phenyltrimethoxysilane, “OPTRAIK TR-527” (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) having a number average particle diameter of 15 nm, composition: 20% by weight of titanium oxide particles, 80 of methanol (Weight%) 172.22 g and propylene glycol monomethyl ether acetate 112.7 g were put into a reaction vessel, and 21.9 g of water and 0.35 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 24.40g、フェニルトリメトキシシラン 40.25g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)158.50g、プロピレングリコールモノメチルエーテルアセテート103.7gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.33gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting Example 15>
24.40 g of dimethyldimethoxysilane, 40.25 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 (Weight%) 158.50 g and 103.7 g of propylene glycol monomethyl ether acetate are put in a reaction vessel, and 21.9 g of water and 0.33 g of phosphoric acid are added to this solution while stirring so that the reaction temperature does not exceed 40 ° C. It was dripped in. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 29.28g、フェニルトリメトキシシラン 32.20g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)144.79g、プロピレングリコールモノメチルエーテルアセテート94.73gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.31gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting Example 16>
29.28 g of dimethyldimethoxysilane, 32.20 g of phenyltrimethoxysilane, “OPTRAIK TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Chemical Industry Co., Ltd.) composition: 20% by weight of titanium oxide particles, methanol 80 (% By weight) 144.79 g and 94.73 g of propylene glycol monomethyl ether acetate were put in a reaction vessel, and 21.9 g of water and 0.31 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 34.16g、フェニルトリメトキシシラン 24.15g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)131.07g、プロピレングリコールモノメチルエーテルアセテート85.75gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.30gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting Example 17>
34.16 g of dimethyldimethoxysilane, 24.15 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 (% By weight) 131.07 g and propylene glycol monomethyl ether acetate 85.75 g were put into a reaction vessel, and 21.9 g of water and 0.30 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped in. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 39.04g、フェニルトリメトキシシラン 16.10g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)117.35g、プロピレングリコールモノメチルエーテルアセテート76.78gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.28gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting Example 18>
39.04 g of dimethyldimethoxysilane, 16.10 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 (% By weight) 117.35 g and propylene glycol monomethyl ether acetate 76.78 g were put in a reaction vessel, and 21.9 g of water and 0.28 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 43.92g、フェニルトリメトキシシラン 8.05g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)103.64g、プロピレングリコールモノメチルエーテルアセテート67.81gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.27gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。 <Grafting example 19>
43.92 g of dimethyldimethoxysilane, 8.05 g of phenyltrimethoxysilane, “Optlake TR-527” having a number average particle diameter of 15 nm (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd.) Composition: 20% by weight of titanium oxide particles, methanol 80 (% By weight) 103.64 g and 67.81 g of propylene glycol monomethyl ether acetate were put in a reaction vessel, and 21.9 g of water and 0.27 g of phosphoric acid were added to this solution while stirring so that the reaction temperature did not exceed 40 ° C. It was dripped in. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 115 ° C. for 2 hours and then cooled to room temperature to obtain titanium oxide particles grafted with polysiloxane.
ジメチルジメトキシシラン 14.64g、ジフェニルジメトキシシラン 35.24g、数平均粒子径15nmの”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)94.59g、プロピレングリコールモノメチルエーテルアセテート61.89gを反応容器に入れ、この溶液に、水21.9gおよびリン酸0.25gを、撹拌しながら、反応温度が40℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温115℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリシロキサンでグラフト化された酸化チタン粒子を得た。
(金属化合物粒子の表面処理)
<表面処理例1>
メチルトリメトキシシラン 24.5g、フェニルトリメトキシシラン 83.3g、γ-ブチロラクトン124.0gを反応容器に入れ、撹拌しながら、水38gおよびリン酸0.57gを反応温度が30℃を越えないように滴下した。滴下後、フラスコに蒸留装置を取り付け、得られた溶液をバス温105℃で2.5時間加熱撹拌して加水分解により生成したメタノールを留去しつつ反応させた。その後、溶液をバス温130℃でさらに2時間加熱撹拌した後、室温まで冷却し、ポリマー溶液を得た。得られたポリマー溶液を10.0gとり、これに”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)13.3gおよびプロピレングリコールモノメチルエーテルアセテートを添加して撹拌し、シロキサン組成物を得た。 <Grafting Example 20>
14.64 g of dimethyldimethoxysilane, 35.24 g of diphenyldimethoxysilane, “OPTRAIK TR-527” (trade name, manufactured by Catalyst Chemical Industry Co., Ltd.) having a number average particle diameter of 15 nm, composition:
(Surface treatment of metal compound particles)
<Surface treatment example 1>
Put 24.5 g of methyltrimethoxysilane, 83.3 g of phenyltrimethoxysilane, and 124.0 g of γ-butyrolactone in a reaction vessel and stir while stirring with 38 g of water and 0.57 g of phosphoric acid so that the reaction temperature does not exceed 30 ° C. It was dripped in. After the dropwise addition, a distillation apparatus was attached to the flask, and the resulting solution was heated and stirred at a bath temperature of 105 ° C. for 2.5 hours, and reacted while distilling off methanol produced by hydrolysis. Thereafter, the solution was further heated and stirred at a bath temperature of 130 ° C. for 2 hours, and then cooled to room temperature to obtain a polymer solution. 10.0 g of the obtained polymer solution was taken, and 13.3 g of “OPTRAIK TR-527” (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd .:
反応容器に”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)を400mL入れ、フェニルトリメトキシシラン5.2g(Gelest社製)を加え、60℃で2時間加熱したところ白色沈殿物が生成した。次に、上澄み液を取除き、この白色沈殿物にアセトン100mLを加えたところ、フェニル基の導入により溶媒への親和性向上し、沈殿物は殆ど溶解した。少量の不溶物をろ過により除去した後、このアセトン溶液から溶媒を留去し、80℃で10時間減圧乾燥させることにより、フェニルトリメトキシシランで表面修飾されたチタニア粒子を得た。 <Surface treatment example 2>
400 mL of “Optlake TR-527” (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd., composition:
PGMEA:プロピレングリコールモノメチルエーテルアセテート
γBL:γ-ブチロラクトン
DAA:ジアセトンアルコール
PGME:プロピレングリコールモノメチルエーテル
酢エチ:酢酸エチル
<基材>
BX9:離型処理済みポリエチレンテレフタレート(ポリエチレンテレフタレートフィルム)“セラピール”BX9(東レフィルム加工(株)製、平均膜厚50μm)
ガラス:ガラス(青板ガラス 板厚:0.3mm)
HP2:離型処理済みポリエチレンテレフタレート(ポリエチレンテレフタレートフィルム)“セラピールHP2” (東レフィルム加工(株)製、平均膜厚50μm)
PPS:ポリフェニレンサルファイド(ポリフェニレンサルファイドフィルム)
“トレリナ3000”(東レ(株)製、平均膜厚50μm)
PP:ポリプロピレン(ポリプロピレンフィルム)
“トレファン”(東レ(株)製、平均膜厚50μm)
PI: ポリイミド(ポリイミドフィルム)
“カプトン200H/V”(東レ・デュポン(株)製、平均膜厚50μm)
PO:ポリオレフィン(ポリオレフィンフィルム)
“オーピュランX-44B”(三井化学東セロ(株)製、平均膜厚50μm)
AL:アルミ(アルミ基板 板厚:0.24mm)。 <Solvent>
PGMEA: propylene glycol monomethyl ether acetate γBL: γ-butyrolactone DAA: diacetone alcohol PGME: propylene glycol monomethyl ether acetate: ethyl acetate <Substrate>
BX9: Release-treated polyethylene terephthalate (polyethylene terephthalate film) “Therapel” BX9 (manufactured by Toray Film Processing Co., Ltd., average film thickness 50 μm)
Glass: Glass (blue plate glass, plate thickness: 0.3 mm)
HP2: Release-treated polyethylene terephthalate (polyethylene terephthalate film) “Therapy HP2” (manufactured by Toray Film Processing Co., Ltd., average film thickness 50 μm)
PPS: Polyphenylene sulfide (polyphenylene sulfide film)
“Torelina 3000” (Toray Industries, Inc., average film thickness 50 μm)
PP: Polypropylene (polypropylene film)
“Trephan” (Toray Industries, Inc., average film thickness 50 μm)
PI: Polyimide (Polyimide film)
“Kapton 200H / V” (manufactured by Toray DuPont Co., Ltd., average film thickness 50 μm)
PO: Polyolefin (Polyolefin film)
"Opylan X-44B" (Mitsui Chemicals, Inc., manufactured by Tosero Co., Ltd., average film thickness 50μm)
AL: Aluminum (aluminum substrate plate thickness: 0.24 mm).
2L四つ口丸底フラスコに攪拌機、温度計、環流管、滴下ロートを取り付け、フラスコに、界面活性剤としてポリエーテル変性シロキサン“BYK333”を1ppm含む2.5%のアンモニア水2Lを入れ、300rpmで攪拌しつつ、オイルバスにて昇温した。内温50℃に到達したところで滴下ロートからメチルトリメトキシシランとフェニルトリメトキシシランの混合物(23/77mol%)200gを30分かけ滴下した。そのままの温度で、さらに60分間撹拌を続けた後、酢酸(試薬特級)約5gを添加、撹拌混合した後、濾過を行った。濾過器上の生成粒子に水600mLを2回、メタノール200mLを1回添加し、濾過、洗浄を行った。濾過器上のケークを取り出し、解砕後、10時間かけ凍結乾燥することにより、白色粉末60gを得た。得られた粒子は、SEMで観察したところ単分散球状微粒子であった。この微粒子を液浸法により屈折率測定した結果、1.54であった。この粒子を断面TEMで観察した結果、粒子内が単一構造の粒子であることが確認できた。 <Silicon fine particles>
Attach stirrer, thermometer, reflux tube and dropping funnel to 2L four-necked round bottom flask. Put 2L of 2.5% ammonia water containing 1ppm of polyether-modified siloxane "BYK333" as a surfactant into the flask. The temperature was raised in an oil bath while stirring at. When the internal temperature reached 50 ° C., 200 g of a mixture of methyltrimethoxysilane and phenyltrimethoxysilane (23/77 mol%) was dropped from the dropping funnel over 30 minutes. Stirring was continued for 60 minutes at the same temperature, then about 5 g of acetic acid (special grade reagent) was added, mixed with stirring, and then filtered. The product particles on the filter were added with 600 mL of water twice and 200 mL of methanol once, followed by filtration and washing. The cake on the filter was taken out, crushed, and freeze-dried over 10 hours to obtain 60 g of white powder. The obtained particles were monodisperse spherical fine particles as observed by SEM. As a result of measuring the refractive index of this fine particle by the immersion method, it was 1.54. As a result of observing the particles with a cross-sectional TEM, it was confirmed that the particles had a single structure.
蛍光体:(株)ネモト・ルミマテリアル社製“YAG81003”(YAG系蛍光体、メジアン径(D50):8.6μm、屈折率:1.8)。 <Phosphor>
Phosphor: “YAG81003” (YAG phosphor, median diameter (D 50 ): 8.6 μm, refractive index: 1.8) manufactured by Nemoto Lumi Material Co., Ltd.
シリコーン樹脂を配合するための成分
樹脂主成分 (MeViSiO2/2)0.25(Ph2SiO2/2)0.3(PhSiO3/2)0.45(HO1/2)0.03 (平均組成、(A)成分に該当する。)
硬度調整剤 ViMe2SiO(MePhSiO)17.5SiMe2Vi (平均組成、(B)成分に該当する。)
架橋剤 (HMe2SiO)2SiPh2 ((C)成分に該当する。)
※ただしMe:メチル基、Vi:ビニル基、Ph:フェニル基
反応抑制剤 1-エチニルヘキサノール
白金触媒 白金錯体 (1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン溶液) 白金含有量5重量%。 <Matrix resin>
Ingredients for compounding silicone resin Resin main component (MeViSiO 2/2 ) 0.25 (Ph 2 SiO 2/2 ) 0.3 (PhSiO 3/2 ) 0.45 (HO 1/2 ) 0.03 (average composition, (A) Applicable)
Hardness modifier ViMe 2 SiO (MePhSiO) 17.5 SiMe 2 Vi (average composition, corresponding to component (B))
Crosslinking agent (HMe 2 SiO) 2 SiPh 2 (corresponds to component (C).)
* However, Me: Methyl group, Vi: Vinyl group, Ph: Phenyl group Reaction inhibitor 1-Ethynylhexanol Platinum catalyst Platinum complex (1,3-divinyl-1,1,3,3-tetramethyldisiloxane solution) Contains
樹脂主成分16.7重量部、硬度調整剤16.7重量部、架橋剤66.7重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂2:“OE6630(A液、B液)”(東レ・ダウコーニング社製)
A/B比率 1/4
・シリコーン樹脂3:“OE6336(A液、B液)”(東レ・ダウコーニング社製)
A/B比率 1/1
・シリコーン樹脂4:“KER6075(A液、B液)”(信越化学工業製)
A/B比率 1/1
・シリコーン樹脂5:“KER6075(A液、B液)”(信越化学工業製)
A/B比率 1/1.14
・シリコーン樹脂6:“KER6075(A液、B液)”(信越化学工業製)
A/B比率 0.5/1
・シリコーン樹脂7:
樹脂主成分16.7重量部、硬度調整剤20.0重量部、架橋剤66.7重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂8:
樹脂主成分18.2重量部、硬度調整剤18.2重量部、架橋剤63.6重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂9:
樹脂主成分15.4重量部、硬度調整剤15.4重量部、架橋剤69.2重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂10:
樹脂主成分25.0重量部、硬度調整剤20.0重量部、架橋剤50.0重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂11:
樹脂主成分25.0重量部、硬度調整剤25.0重量部、架橋剤50.0重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂12:
樹脂主成分41.7重量部、硬度調整剤9.1重量部、架橋剤41.7重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂13:
樹脂主成分33.3重量部、硬度調整剤43.3重量部、架橋剤23.3重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂14:
樹脂主成分33.3重量部、硬度調整剤33.3重量部、架橋剤33.3重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂15:
樹脂主成分41.7重量部、硬度調整剤18.2重量部、架橋剤41.7重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂16:
樹脂主成分16.7重量部、硬度調整剤4.3重量部、架橋剤70.7重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂17:
樹脂主成分23.3重量部、硬度調整剤53.3重量部、架橋剤23.3重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂18:
樹脂主成分33.3重量部、硬度調整剤5.0重量部、架橋剤33.3重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部
・シリコーン樹脂19:
樹脂主成分18.9重量部、硬度調整剤5.6重量部、架橋剤75.5重量部、
反応抑制剤0.025重量部、白金触媒0.03重量部。 ・ Silicone resin 1:
Resin main component 16.7 parts by weight, hardness adjusting agent 16.7 parts by weight, cross-linking agent 66.7 parts by weight,
0.025 weight part of reaction inhibitor, 0.03 weight part of platinum catalyst Silicone resin 2: “OE6630 (A liquid, B liquid)” (manufactured by Dow Corning Toray)
A /
Silicone resin 3: “OE6336 (liquid A, liquid B)” (manufactured by Dow Corning Toray)
A /
Silicone resin 4: “KER6075 (A liquid, B liquid)” (manufactured by Shin-Etsu Chemical)
A /
Silicone resin 5: “KER6075 (A liquid, B liquid)” (manufactured by Shin-Etsu Chemical)
A /
Silicone resin 6: “KER6075 (A liquid, B liquid)” (manufactured by Shin-Etsu Chemical)
A / B ratio 0.5 / 1
-Silicone resin 7:
Resin main component 16.7 parts by weight, hardness adjusting agent 20.0 parts by weight, cross-linking agent 66.7 parts by weight,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 8:
Resin main component 18.2 parts by weight, hardness adjusting agent 18.2 parts by weight, cross-linking agent 63.6 parts by weight,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 9:
15.4 parts by weight of a resin main component, 15.4 parts by weight of a hardness adjusting agent, 69.2 parts by weight of a crosslinking agent,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 10:
25.0 parts by weight of resin main component, 20.0 parts by weight of hardness adjusting agent, 50.0 parts by weight of crosslinking agent,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 11:
25.0 parts by weight of resin main component, 25.0 parts by weight of hardness adjusting agent, 50.0 parts by weight of crosslinking agent,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 12:
Resin main component 41.7 parts by weight, hardness adjusting agent 9.1 parts by weight, cross-linking agent 41.7 parts by weight,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 13:
33.3 parts by weight of resin main component, 43.3 parts by weight of hardness adjusting agent, 23.3 parts by weight of crosslinking agent,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 14:
33.3 parts by weight of resin main component, 33.3 parts by weight of hardness adjusting agent, 33.3 parts by weight of crosslinking agent,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 15:
Resin main component 41.7 parts by weight, hardness adjusting agent 18.2 parts by weight, cross-linking agent 41.7 parts by weight,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 16:
Resin main component 16.7 parts by weight, hardness adjusting agent 4.3 parts by weight, cross-linking agent 70.7 parts by weight,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 17:
23.3 parts by weight of a resin main component, 53.3 parts by weight of a hardness adjusting agent, 23.3 parts by weight of a crosslinking agent,
0.025 part by weight of reaction inhibitor, 0.03 part by weight of platinum catalyst Silicone resin 18:
33.3 parts by weight of a resin main component, 5.0 parts by weight of a hardness adjusting agent, 33.3 parts by weight of a crosslinking agent,
Reaction inhibitor 0.025 parts by weight, platinum catalyst 0.03 parts by weight Silicone resin 19:
18.9 parts by weight of a resin main component, 5.6 parts by weight of a hardness adjusting agent, 75.5 parts by weight of a crosslinking agent,
0.025 weight part of reaction inhibitor, 0.03 weight part of platinum catalyst.
屈折率・膜厚測定装置“プリズムカプラMODEL2010/M”(メトリコン社製)を使用して、屈折率測定サンプルの屈折率を測定することで金属化合物粒子とマトリックス樹脂の平均屈折率N1を測定した。下記式に蛍光体の屈折率N2を導入し屈折率差を|N1-N2|算出した。 <Refractive index measurement>
Using the refractive index / film thickness measuring device “Prism Coupler Model 2010 / M” (made by Metricon), the refractive index of the refractive index measurement sample was measured to measure the average refractive index N1 of the metal compound particles and the matrix resin. . The refractive index N2 of the phosphor was introduced into the following formula, and the refractive index difference was calculated | N1-N2 |.
マトリックス樹脂中に金属化合物粒子を混合し、クラボウ社製遊星式攪拌脱泡装置“マゼルスターKK-400”を用い、1,000rpmで10分間攪拌、脱泡して分散液を作製した。フィルム基板に分散液を5cc滴下した後、オーブンにて150℃で1時間加熱して平均屈折率N1測定サンプルを作製した。なお、必要であれば、液作製後にエバポレーターによって溶剤を除去しても良い。 <Preparation of refractive index measurement sample>
Metal compound particles were mixed in the matrix resin, and the dispersion was prepared by stirring and defoaming for 10 minutes at 1,000 rpm using a planetary stirring deaerator “Mazerustar KK-400” manufactured by Kurabo Industries. After 5 cc of the dispersion was dropped onto the film substrate, the sample was heated in an oven at 150 ° C. for 1 hour to prepare an average refractive index N1 measurement sample. If necessary, the solvent may be removed by an evaporator after preparing the liquid.
マトリックス樹脂に金属化合物粒子を分散して透明性評価用サンプルを作製し、サンプルを光学顕微鏡で観察して透明性を評価した。
A:ナノ粒子の凝集による欠点が全くなく、透明な膜が形成されている。
B:ナノ粒子の凝集による欠点が存在しているが、比較的透明な膜が形成されている。
C:ナノ粒子の凝集によって白濁している(光が透過しない)。 <Transparency test>
A sample for transparency evaluation was prepared by dispersing metal compound particles in a matrix resin, and the transparency was evaluated by observing the sample with an optical microscope.
A: There is no defect due to aggregation of nanoparticles, and a transparent film is formed.
B: Although there is a defect due to aggregation of nanoparticles, a relatively transparent film is formed.
C: White turbidity due to aggregation of nanoparticles (light is not transmitted).
マトリックス樹脂中に金属化合物粒子を混合し、クラボウ社製遊星式攪拌脱泡装置“マゼルスターKK-400”を用い、1,000rpmで10分間攪拌、脱泡して分散液を作製した。ガラス基板にアプリケーターを用いて塗膜を作製した後、オーブンにて150℃で1時間加熱して透明性評価用サンプル(75μm)を作製した。なお、必要であれば、液作製後にエバポレーターによって溶剤を除去しても良い。 <Preparation of sample for transparency evaluation>
Metal compound particles were mixed in the matrix resin, and the dispersion was prepared by stirring and defoaming for 10 minutes at 1,000 rpm using a planetary stirring deaerator “Mazerustar KK-400” manufactured by Kurabo Industries. A coating film was prepared on a glass substrate using an applicator, and then heated in an oven at 150 ° C. for 1 hour to prepare a transparency evaluation sample (75 μm). If necessary, the solvent may be removed by an evaporator after preparing the liquid.
各実施例および比較例で作製した蛍光体組成物をスリットダイコーターによって塗布する際、吐出圧0.1Paとした時の口金からの樹脂の吐出しやすさを評価した。
非常に良好:吐出スタート後、3秒以内で樹脂が吐出される。
良好:吐出スタート後、3秒を超え10秒以内で樹脂が吐出される。
悪い:吐出スタート後、10秒を超えて樹脂が吐出される。 <Ejection evaluation>
When the phosphor compositions prepared in each Example and Comparative Example were applied by a slit die coater, the ease of discharging the resin from the die when the discharge pressure was 0.1 Pa was evaluated.
Very good: Resin is discharged within 3 seconds after starting discharge.
Good: Resin is discharged within 10 seconds over 3 seconds after the start of discharge.
Poor: Resin is discharged after 10 seconds from the start of discharge.
実施例に基づき作製した蛍光体シートの表面を光学顕微鏡で観察し、ハジキ等の欠点を確認してシート膜の形成しやすさを評価した。
A:ハジキなどの欠点が全くなく、均一な膜が形成されている。非常に良好な膜厚均一性である。
B:ハジキなど欠点の数が10個以内であり、比較的均一な膜が形成されている。実質的に問題ない膜厚均一性である。
C:ハジキの数が11個以上あり、均一な膜が形成されていない。膜厚均一性は悪い。 <Evaluation of film thickness uniformity>
The surface of the phosphor sheet produced based on the examples was observed with an optical microscope, and defects such as repelling were confirmed to evaluate the ease of forming a sheet film.
A: There is no defect such as repelling, and a uniform film is formed. Very good film thickness uniformity.
B: The number of defects such as repellency is within 10 and a relatively uniform film is formed. The film thickness uniformity is practically no problem.
C: There are 11 or more repellents, and a uniform film is not formed. The film thickness uniformity is poor.
実施例19~96、比較例11~36における蛍光体シートの照度測定は以下の要領でサンプルを作製し測定を行った。 <Illuminance measurement of phosphor sheet>
In Examples 19 to 96 and Comparative Examples 11 to 36, the phosphor sheets were measured for illuminance by preparing samples in the following manner.
(少数第1位を四捨五入)
A:相対値の値が116以上 輝度向上効果が非常に大きい
B:相対値の値が110以上115以下 輝度向上効果が大きい
C:相対値の値が104以上109以下 輝度向上効果がある
D:相対値の値が101以上103以下 若干輝度向上効果がある
E:相対値の値が100以下 輝度向上効果がない。 As shown in FIG. 11, a diffusion sheet 13 (Stock Co., Ltd.) cut so as to cover the
(Rounded to the first decimal place)
A: The value of the relative value is 116 or more The brightness improvement effect is very large B: The value of the relative value is 110 or more and 115 or less The brightness improvement effect is large C: The value of the relative value is 104 or more and 109 or less The brightness improvement effect D: Relative value is 101 or more and 103 or less Some effect of improving brightness E: Relative value is 100 or less There is no effect of improving brightness.
ホットプレート上にGaN基板(板厚0.5mm)を設置し、ホットプレートの温度を130℃に設定した後、GaN基板上に、蛍光体シート面がGaN基板面と接するように、蛍光体シート積層体を重ねた。その後、ゴムローラーを用いて、蛍光体シート積層体の基材(ベースフィルム)側を60秒間しごいて、蛍光体シートをGaN基板に貼り付けた。
ホットプレート上からGaN基板サンプルを移動させて、室温に戻した後、基材を剥がしてサンプル基板を作製した。 <Preparation of sample for illuminance measurement>
A GaN substrate (plate thickness 0.5 mm) is set on the hot plate, the temperature of the hot plate is set to 130 ° C., and then the phosphor sheet is placed on the GaN substrate so that the phosphor sheet surface is in contact with the GaN substrate surface. The laminate was stacked. Thereafter, the base material (base film) side of the phosphor sheet laminate was squeezed for 60 seconds using a rubber roller, and the phosphor sheet was attached to the GaN substrate.
After moving the GaN substrate sample from the hot plate and returning to room temperature, the base material was peeled off to produce a sample substrate.
サンプル基板の表面にNTカッターで縦横1mmの間隔で11本の平行な傷をつけて、100個のマス目を作製した。これにポリエステルフィルム粘着テープ(寺岡製作所製“サーキットテープNo.647”)を強く圧着させた後、テープの端を45°の角度で一挙に剥離し、蛍光体シートが剥離せず残存しているマス目数を目視で確認して密着性を評価した。
S:残存しているマス目数 100個
A: 残存しているマス目数 95~99個
B:残存しているマス目数 90~94個
C:残存しているマス目数 85~89個
D:残存しているマス目数 84個以下。 <Adhesion test>
Eleven parallel scratches were made on the surface of the sample substrate with an NT cutter at intervals of 1 mm in length and width to produce 100 squares. A polyester film adhesive tape (“Circuit Tape No. 647” manufactured by Teraoka Seisakusho) is strongly bonded to this, and then the end of the tape is peeled off at an angle of 45 °, and the phosphor sheet remains without peeling. The number of cells was visually confirmed to evaluate the adhesion.
S: Number of remaining cells 100 A: Number of remaining cells 95 to 99 B: Number of remaining cells 90 to 94 C: Number of remaining cells 85 to 89 D: The number of remaining squares is 84 or less.
ホットプレート上にGaN基板(板厚0.5mm)を設置し、ホットプレートの温度を130℃に設定した後、GaN基板上に、蛍光体シート面がGaN基板面と接するように、蛍光体シート積層体を重ねた。その後、ゴムローラーを用いて、蛍光体シート積層体の基材(ベースフィルム)側を60秒間しごいて、蛍光体シートをGaN基板に貼り付けた。
ホットプレート上からGaN基板サンプルを移動させて、室温に戻した後、基材を剥がしてサンプル基板を作製した。 <Sample preparation for adhesion test>
A GaN substrate (plate thickness 0.5 mm) is set on the hot plate, the temperature of the hot plate is set to 130 ° C., and then the phosphor sheet is placed on the GaN substrate so that the phosphor sheet surface is in contact with the GaN substrate surface. The laminate was stacked. Thereafter, the base material (base film) side of the phosphor sheet laminate was squeezed for 60 seconds using a rubber roller, and the phosphor sheet was attached to the GaN substrate.
After moving the GaN substrate sample from the hot plate and returning to room temperature, the base material was peeled off to produce a sample substrate.
測定装置 :粘度・粘弾性測定装置HAAKE MARS III
(Thermo Fisher SCIENTIFIC 製)
測定条件 :OSC温度依存測定
ジオメトリー:平行円板型(20mm)
測定時間 :1980秒
角周波数 :1Hz
角速度 :6.2832rad/秒
温度範囲 :25~200℃(低温温度制御機能あり)
昇温速度 :0.08333℃/秒
サンプル形状:円形(直径18mm)。 <Dynamic elastic modulus measurement>
Measuring device: Viscosity / viscoelasticity measuring device HAAKE MARS III
(Thermo Fisher SCIENTIFIC made)
Measurement conditions: OSC temperature-dependent measurement Geometry: Parallel disk type (20mm)
Measurement time: 1980 seconds Angular frequency: 1 Hz
Angular velocity: 6.2832 rad / sec Temperature range: 25 to 200 ° C (with low temperature control function)
Temperature increase rate: 0.08333 ° C./sec Sample shape: Circular (
実施例および比較例に基づき作製した蛍光体シート積層体を直径18mmの円形状に切り抜いた後、フィルムを剥離して蛍光体シートのみとして測定サンプルとした。各蛍光体シートの粘弾性挙動を表34、36、38、40に示した。 <Measurement sample preparation for dynamic viscoelasticity measurement>
After the phosphor sheet laminate produced based on the examples and comparative examples was cut out into a circular shape with a diameter of 18 mm, the film was peeled off to obtain a phosphor sheet alone as a measurement sample. Tables 34, 36, 38, and 40 show the viscoelastic behavior of each phosphor sheet.
蛍光体シートを用いたLEDパッケージに、パッケージの表面温度が室温(25℃)~170℃になるよう電流を流してLEDチップを点灯させ、瞬間マルチ測光システム(MCPD-3000、大塚電子社製)を用いて輝度を測定した。室温(25℃)と170℃の場合の輝度を測定し、下記式により輝度保持率を算出することで耐熱性を評価した。輝度保持率が高いほど、耐熱性に優れていることを示す。評価B以上であれば実用上問題なく、評価A以上であれば実用上優れている。
輝度保持率I(%)=(170℃の場合の輝度/室温(25℃)の場合の輝度)×100
(少数第1位を四捨五入)
S:保持率 90%以上 耐熱性が非常に良好
A:保持率 81~89% 耐熱性が良好
B:保持率 51~80% 耐熱性が実用上問題ない
C:保持率 50%以下 耐熱性が悪い。 <Heat resistance test>
The LED chip is turned on by applying an electric current to the LED package using the phosphor sheet so that the surface temperature of the package is from room temperature (25 ° C.) to 170 ° C. Was used to measure the luminance. The luminance at room temperature (25 ° C.) and 170 ° C. was measured, and the heat retention was evaluated by calculating the luminance retention rate according to the following formula. It shows that it is excellent in heat resistance, so that a luminance retention is high. If the rating is B or more, there is no practical problem, and if the rating is A or more, it is practically excellent.
Luminance retention ratio I (%) = (luminance at 170 ° C./luminance at room temperature (25 ° C.)) × 100
(Rounded to the first decimal place)
S: Retention rate 90% or more Heat resistance is very good A: Retention rate 81-89% Good heat resistance B: Retention rate 51-80% Heat resistance is practically no problem C: Retention rate 50% or less bad.
蛍光体シートを使用する場合の取り扱い性(取り扱い時に割れる、柔らかいため形がくずれるなど)の指標として、硬度測定を実施した。実施例に基づき作製したシートについて、JIS K6253(2012)プラスチックのデューロメータ硬さ試験法に基づき、ゴム・プラスチック軟質硬さ計“デューロメータタイプD”(品番:GSD-720J テクロック社製)を測定装置として用い、室温(25℃)でのシートの硬度を測定した。これまでの経験上、蛍光体シートの硬度と取り扱いやすさに相関があるので、硬度をもとに取り扱い性を評価した。評価B以上であれば実用上問題なく、評価A以上であれば実用上優れている。
S:硬度60~79 取り扱い性が非常に良好
A:硬度80~89あるいは50~59 取り扱い性が良好
B:硬度40~49 ピンセットの形はつくが、取り扱い性は
実用上問題ない
C:硬度90以上あるいは39以下 取り扱い性が悪い。 <Hardness measurement and handling evaluation>
Hardness measurement was carried out as an index of handleability when using a phosphor sheet (such as cracking during handling, soft shape breaking). Measurement of rubber / plastic soft hardness tester “Durometer Type D” (Product No .: GSD-720J manufactured by Teclock Co., Ltd.) based on JIS K6253 (2012) Durometer Hardness Test Method Used as an apparatus, the hardness of the sheet at room temperature (25 ° C.) was measured. Based on the experience so far, there is a correlation between the hardness of the phosphor sheet and the ease of handling. Therefore, the handleability was evaluated based on the hardness. If the rating is B or more, there is no practical problem, and if the rating is A or more, it is practically excellent.
S: Hardness 60-79 Very easy to handle A: Hardness 80-89 or 50-59 Good handleability B: Hardness 40-49 Tweezers are shaped but handleability is practically acceptable C: Hardness 90 More than or less than 39 Handling is poor.
実施例1~18、比較例1~10におけるLEDパッケージは以下の要領で作製した。得られた蛍光体組成物を、LEDチップ(昭和電工(株)製“GM2QT450G”、平均波長:453.4nm)が実装されたパッケージフレーム(エノモト社製フレーム“TOP LED BASE”)に、ディスペンサー(武蔵野エンジニアリング社製“MPP-1”)を用いて流し込み、80℃で1時間、150℃で2時間キュアすることによって、LEDパッケージを作製した。作製したLEDパッケージを、20mAの電流を流して点灯させ、瞬間マルチ測光システム(大塚電子社製“MCPD-7700”)を用いて、試験開始直後の輝度を測定し、10個の平均値を輝度とした。比較例1の照度を100とし、これに対する照度の相対値を示した。
(少数第1位を四捨五入)
A:相対値の値が116以上 輝度向上効果が非常に大きい
B:相対値の値が110以上115以下 輝度向上効果が大きい
C:相対値の値が104以上109以下 輝度向上効果がある
D:相対値の値が101以上103以下 若干輝度向上効果がある
E:相対値の値が100以下 輝度向上効果がない。 <Production of LED package and brightness evaluation>
The LED packages in Examples 1 to 18 and Comparative Examples 1 to 10 were produced as follows. The obtained phosphor composition was placed on a package frame (Enomoto's frame “TOP LED BASE”) on which an LED chip (“GM2QT450G” manufactured by Showa Denko KK, average wavelength: 453.4 nm) was mounted. An LED package was manufactured by casting using “MPP-1” manufactured by Musashino Engineering Co., Ltd. and curing at 80 ° C. for 1 hour and 150 ° C. for 2 hours. The manufactured LED package was turned on by passing a current of 20 mA, and the luminance immediately after the start of the test was measured using an instantaneous multi-metering system (“MCPD-7700” manufactured by Otsuka Electronics Co., Ltd.). It was. The illuminance of Comparative Example 1 was set to 100, and the relative value of illuminance relative to this was shown.
(Rounded to the first decimal place)
A: The value of the relative value is 116 or more The brightness improvement effect is very large B: The value of the relative value is 110 or more and 115 or less The brightness improvement effect is large C: The value of the relative value is 104 or more and 109 or less The brightness improvement effect D: Relative value is 101 or more and 103 or less Some effect of improving brightness E: Relative value is 100 or less There is no effect of improving brightness.
<蛍光体組成物の作製>
遊星式撹拌・脱泡装置“マゼルスターKK-400”(クラボウ製)を用い、グラフト化例1の方法で得られた酸化チタン粒子3.0gにシリコーン樹脂1を6.0g添加して混合し、1000rpmで10分間撹拌・脱泡した。所望の時間放置した後、エバポレーターによって溶剤を除去して固形分濃度80wt%のサンプルを作製した後、屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.60であった。また、透明性は非常に良好であった。 Example 1 (with silicone fine particles, effect of grafting)
<Preparation of phosphor composition>
Using a planetary stirring and degassing apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries), 6.0 g of
金属化合物粒子を添加しない以外は、実施例1と同様の操作で蛍光体組成物を作製した。その後、実施例1と同様の操作でのLEDパッケージを作製し評価を行った。結果を表3および4に示す。 Comparative Example 1 (with silicone fine particles, influence of graft)
A phosphor composition was produced in the same manner as in Example 1 except that no metal compound particles were added. Then, the LED package by the same operation as Example 1 was produced and evaluated. The results are shown in Tables 3 and 4.
金属化合物粒子として、粉末酸化チタン粒子”TKP-102”(商品名、テイカ(株)製)に変更した以外は、実施例1と同様の操作で蛍光体組成物を作製した。その後、実施例1と同様の操作でのLEDパッケージを作製し評価を行った。結果を表3および4に示す。マトリックス樹脂への分散性が悪く、凝集してしまったため、蛍光体組成物を作製することができなかった。 Comparative Example 2 (with silicone fine particles, graft effect)
A phosphor composition was produced in the same manner as in Example 1 except that the powder was changed to powdered titanium oxide particles “TKP-102” (trade name, manufactured by TEIKA CORPORATION) as the metal compound particles. Then, the LED package by the same operation as Example 1 was produced and evaluated. The results are shown in Tables 3 and 4. Since the dispersibility in the matrix resin was poor and agglomerated, the phosphor composition could not be produced.
金属化合物粒子として、”オプトレイクTR-527”(商品名、触媒化成工業(株)製 組成:酸化チタン粒子20重量%、メタノール80重量%)に変更した以外は、実施例1と同様の操作で蛍光体組成物を作製した。その後、実施例1と同様の操作でのLEDパッケージを作製し評価を行った。結果を表3および4に示す。比較例1に比較して輝度はさらに低下した。 Comparative Example 3 (with silicone fine particles, graft effect)
The same operation as in Example 1 except that the metal compound particles were changed to "Optlake TR-527" (trade name, manufactured by Catalyst Kasei Kogyo Co., Ltd., composition:
表1、3に記載の組成に変更した以外は実施例1と同様の操作で蛍光体組成物を作製した。その後、実施例1と同様の操作でのLEDパッケージを作製し、評価を行った。結果を表1~4に示す。これらの実施例から、本発明の蛍光体組成物であれば輝度が大きく向上することがわかった。比較例4、5では輝度は向上しなかった。 Examples 2 to 9, Comparative Examples 4 and 5 (with silicone fine particles, effect of grafting)
A phosphor composition was prepared in the same manner as in Example 1 except that the compositions shown in Tables 1 and 3 were changed. Then, the LED package by the same operation as Example 1 was produced, and evaluation was performed. The results are shown in Tables 1 to 4. From these examples, it was found that the brightness was greatly improved with the phosphor composition of the present invention. In Comparative Examples 4 and 5, the luminance was not improved.
シリコーン微粒子を添加せず、表5、7に記載の組成に変更した以外は実施例1と同様の操作で蛍光体組成物を作製した。その後、実施例1と同様の操作でのLEDパッケージを作製し、評価を行った。結果を表5~8に示す。これらの実施例から、本発明の蛍光体組成物であれば輝度が向上することがわかった。比較例6~10では輝度は向上しなかった。 Examples 10 to 18 and Comparative Examples 6 to 10 (no silicone fine particles, effect of grafting)
A phosphor composition was prepared in the same manner as in Example 1, except that the silicone fine particles were not added and the compositions shown in Tables 5 and 7 were changed. Then, the LED package by the same operation as Example 1 was produced, and evaluation was performed. The results are shown in Tables 5-8. From these examples, it was found that the luminance was improved with the phosphor composition of the present invention. In Comparative Examples 6 to 10, the luminance was not improved.
<蛍光体組成物の作製>
遊星式撹拌・脱泡装置“マゼルスターKK-400”(クラボウ製)を用い、グラフト化例1の方法で得られた酸化チタン粒子3.0gにシリコーン樹脂1を6.0g添加して混合し、1000rpmで3分間撹拌・脱泡した。所望の時間放置した後、エバポレーターによって溶剤を除去して固形分濃度80wt%のサンプルを作製した後、屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.60であった。また、透明性は非常に良好であった。 Example 19 (with silicone fine particles, graft effect, phosphor sheet)
<Preparation of phosphor composition>
Using a planetary stirring and degassing apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries), 6.0 g of
スリットダイコーターを用いて、蛍光体組成物1を基材として“セラピール”BX9
(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。その後、ドライフィルムラミネーターを使用して蛍光シートの貼り替えを実施し、基材フィルムをポリフェニレンサルファイドフィルム“トレリナ3000”(東レ(株)製、平均膜厚50μm)へ変更した。照度測定を行った結果、比較例11に対して、相対照度が110となり、輝度向上効果が得られた。 <Preparation of phosphor sheet laminate>
Using a slit die coater, “Therapy” BX9 with
It apply | coated on the mold release process surface (Toray Film Processing Co., Ltd. product, average film thickness of 50 micrometers), and it heated and dried at 120 degreeC for 30 minutes, and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 mm square. Then, the fluorescent sheet was replaced using a dry film laminator, and the base film was changed to a polyphenylene sulfide film “Torelina 3000” (manufactured by Toray Industries, Inc., average film thickness 50 μm). As a result of the illuminance measurement, relative illuminance was 110 compared to Comparative Example 11, and an effect of improving luminance was obtained.
表9、11に記載の組成に変更した以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、評価を行った。結果を表9~12に示す。これらの実施例から、本発明の蛍光体組成物をシート状に形成してなる蛍光体シートであれば膜厚均一性が良好であり、輝度も大きく向上することがわかった。比較例10~14では膜厚均一性は不良であり、輝度も向上しなかった。 Examples 20 to 27, Comparative Examples 11 to 15 (with silicone fine particles, graft effect, phosphor sheet)
A phosphor composition was prepared in the same manner as in Example 19 except that the compositions described in Tables 9 and 11 were changed. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 9-12. From these examples, it was found that a phosphor sheet obtained by forming the phosphor composition of the present invention into a sheet has good film thickness uniformity and greatly improved luminance. In Comparative Examples 10 to 14, the film thickness uniformity was poor and the luminance was not improved.
シリコーン微粒子を添加せず、表13、15に記載の組成に変更した以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、評価を行った。結果を表13~16に示す。これらの実施例から、本発明の蛍光体組成物をシート状に形成してなる蛍光体シートであれば膜厚均一性は実用範囲であり、輝度も向上することがわかった。比較例16~20では膜厚均一性は不良であり、輝度も向上しなかった。 Examples 28 to 36, Comparative Examples 16 to 20 (no silicone fine particles, graft effect, phosphor sheet)
A phosphor composition was prepared in the same manner as in Example 19 except that the silicone fine particles were not added and the compositions shown in Tables 13 and 15 were changed. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 13-16. From these examples, it was found that if the phosphor sheet is formed by forming the phosphor composition of the present invention into a sheet shape, the film thickness uniformity is within the practical range and the luminance is also improved. In Comparative Examples 16 to 20, the film thickness uniformity was poor and the luminance was not improved.
<蛍光体組成物の作製>
遊星式撹拌・脱泡装置“マゼルスターKK-400”(クラボウ製)を用い、グラフト化例1の方法で得られた酸化チタン粒子9.52gにシリコーン樹脂1を1.58g添加して混合し、1000rpmで3分間撹拌・脱泡した。所望の時間放置した後、エバポレーターによって溶剤を除去して固形分濃度80wt%のサンプルを作製した後、屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.63であった。また、透明性は非常に良好であった。 Example 37 (refractive index effect, phosphor sheet)
<Preparation of phosphor composition>
Using a planetary stirring and defoaming device “Mazerustar KK-400” (manufactured by Kurabo Industries), 1.58 g of
スリットダイコーターを用いて蛍光体組成物29を基材として“セラピール”BX9(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。その後、ドライフィルムラミネーターを使用して蛍光シートの貼り替えを実施し、基材フィルムをポリフェニレンサルファイドフィルム“トレリナ3000”(東レ(株)製、平均膜厚50μm)へ変更した。照度測定を行った結果、比較例11に対して、相対照度が111となり、大きな輝度向上効果が得られた。 <Preparation of phosphor sheet laminate>
Using a slit die coater, the
<蛍光体組成物の作製>
遊星式撹拌・脱泡装置“マゼルスターKK-400”(クラボウ製)を用い、グラフト化例1の方法で得られた酸化チタン粒子12.0gにシリコーン樹脂1を0.6g添加して混合し、1000rpmで3分間撹拌・脱泡した。所望の時間放置した後、エバポレーターによって溶剤を除去して固形分濃度80wt%のサンプルを作製した後、屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.70であった。また、透明性は非常に良好であった。 Example 38 (refractive index effect, phosphor sheet)
<Preparation of phosphor composition>
Using a planetary stirring and defoaming device “Mazerustar KK-400” (manufactured by Kurabo Industries Co., Ltd.), 0.6 g of
スリットダイコーターを用いて蛍光体組成物30を基材として“セラピール”BX9
(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。その後、ドライフィルムラミネーターを使用して蛍光シートの貼り替えを実施し、基材フィルムをポリフェニレンサルファイドフィルム“トレリナ3000”(東レ(株)製、平均膜厚50μm)へ変更した。照度測定を行った結果、比較例11に対して、相対照度が115となり、大きな輝度向上効果が得られた。 <Preparation of phosphor sheet laminate>
"Serapeel" BX9 using
It apply | coated on the mold release process surface (Toray Film Processing Co., Ltd. product, average film thickness of 50 micrometers), and it heated and dried at 120 degreeC for 30 minutes, and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 mm square. Then, the fluorescent sheet was replaced using a dry film laminator, and the base film was changed to a polyphenylene sulfide film “Torelina 3000” (manufactured by Toray Industries, Inc., average film thickness 50 μm). As a result of the illuminance measurement, relative illuminance was 115 with respect to Comparative Example 11, and a large luminance improvement effect was obtained.
<蛍光体組成物の作製>
遊星式撹拌・脱泡装置“マゼルスターKK-400”(クラボウ製)を用い、グラフト化例10の方法で得られた酸化チタン粒子7.94gにシリコーン樹脂1を2.26g添加して混合し、1000rpmで3分間撹拌・脱泡した。所望の時間放置した後、エバポレーターによって溶剤を除去して固形分濃度80wt%のサンプルを作製した後、屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.73であった。また、透明性は非常に良好であった。 Example 39 (refractive index effect, phosphor sheet)
<Preparation of phosphor composition>
Using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries), 2.26 g of
スリットダイコーターを用いて蛍光体組成物31を基材として“セラピール”BX9
(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。その後、ドライフィルムラミネーターを使用して蛍光シートの貼り替えを実施し、基材フィルムをポリフェニレンサルファイドフィルム“トレリナ3000”(東レ(株)製、平均膜厚50μm)へ変更した。照度測定を行った結果、比較例11に対して、相対照度が117となり、非常に大きな輝度向上効果が得られた。 <Preparation of phosphor sheet laminate>
"Serapeel" BX9 using
It apply | coated on the mold release process surface (Toray Film Processing Co., Ltd. product, average film thickness of 50 micrometers), and it heated and dried at 120 degreeC for 30 minutes, and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 mm square. Then, the fluorescent sheet was replaced using a dry film laminator, and the base film was changed to a polyphenylene sulfide film “Torelina 3000” (manufactured by Toray Industries, Inc., average film thickness 50 μm). As a result of the illuminance measurement, relative illuminance was 117 with respect to Comparative Example 11, and a very large luminance improvement effect was obtained.
<蛍光体組成物の作製>
遊星式撹拌・脱泡装置“マゼルスターKK-400”(クラボウ製)を用い、グラフト化例10の方法で得られた酸化チタン粒子8.32gにシリコーン樹脂1を2.08g添加して混合し、1000rpmで3分間撹拌・脱泡した。所望の時間放置した後、エバポレーターによって溶剤を除去して固形分濃度80wt%のサンプルを作製した後、屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.75であった。また、透明性は非常に良好であった。 Example 40 (refractive index effect, phosphor sheet)
<Preparation of phosphor composition>
Using a planetary stirring and defoaming device “Mazerustar KK-400” (manufactured by Kurabo Industries), 2.08 g of
スリットダイコーターを用いて蛍光体組成物32を基材として“セラピール”BX9
(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。その後、ドライフィルムラミネーターを使用して蛍光シートの貼り替えを実施し、基材フィルムをポリフェニレンサルファイドフィルム“トレリナ3000”(東レ(株)製、平均膜厚50μm)へ変更した。照度測定を行った結果、比較例11に対して、相対照度が119となり、非常に大きな輝度向上効果が得られた。 <Preparation of phosphor sheet laminate>
“Serapeel” BX9 using
It apply | coated on the mold release process surface (Toray Film Processing Co., Ltd. product, average film thickness of 50 micrometers), and it heated and dried at 120 degreeC for 30 minutes, and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 mm square. Then, the fluorescent sheet was replaced using a dry film laminator, and the base film was changed to a polyphenylene sulfide film “Torelina 3000” (manufactured by Toray Industries, Inc., average film thickness 50 μm). As a result of the illuminance measurement, relative illuminance was 119 with respect to Comparative Example 11, and a very large luminance improvement effect was obtained.
<蛍光体組成物の作製>
遊星式撹拌・脱泡装置“マゼルスターKK-400”(クラボウ製)を用い、グラフト化例10の方法で得られた酸化チタン粒子9.52gにシリコーン樹脂1を1.58g添加して混合し、1000rpmで3分間撹拌・脱泡した。所望の時間放置した後、エバポレーターによって溶剤を除去して固形分濃度80wt%のサンプルを作製した後、屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.78であった。また、透明性は非常に良好であった。 Example 41 (refractive index effect, phosphor sheet)
<Preparation of phosphor composition>
Using a planetary stirring and defoaming apparatus “Mazerustar KK-400” (manufactured by Kurabo Industries), 1.58 g of
スリットダイコーターを用いて蛍光体組成物33を基材として“セラピール”BX9
(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。その後、ドライフィルムラミネーターを使用して蛍光シートの貼り替えを実施し、基材フィルムをポリフェニレンサルファイドフィルム“トレリナ3000”(東レ(株)製、平均膜厚50μm)へ変更した。照度測定を行った結果、比較例11に対して、相対照度が122となり、非常に大きな輝度向上効果が得られた。 <Preparation of phosphor sheet laminate>
“Serapeel” BX9 using
It apply | coated on the mold release process surface (Toray Film Processing Co., Ltd. product, average film thickness of 50 micrometers), and it heated and dried at 120 degreeC for 30 minutes, and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 mm square. Then, the fluorescent sheet was replaced using a dry film laminator, and the base film was changed to a polyphenylene sulfide film “Torelina 3000” (manufactured by Toray Industries, Inc., average film thickness 50 μm). As a result of the illuminance measurement, relative illuminance was 122 with respect to Comparative Example 11, and a very large luminance improvement effect was obtained.
<蛍光体組成物の作製>
シリコーン樹脂2を用い、金属化合物粒子を用いずに屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.54であった。また、透明性は非常に良好であった。 Comparative Example 21 (refractive index effect, phosphor sheet)
<Preparation of phosphor composition>
Using
スリットダイコーターを用いて蛍光体組成物34を基材として“セラピール”BX9
(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。また照度測定を行った結果、比較例11に対して、相対照度が90となり、輝度向上効果が得られなかった。 <Preparation of phosphor sheet laminate>
"Serapeel" BX9 using
It apply | coated on the mold release process surface (Toray Film Processing Co., Ltd. product, average film thickness of 50 micrometers), and it heated and dried at 120 degreeC for 30 minutes, and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 mm square. As a result of the illuminance measurement, the relative illuminance was 90 with respect to Comparative Example 11, and the luminance improvement effect was not obtained.
<蛍光体組成物の作製>
遊星式撹拌・脱泡装置“マゼルスターKK-400”(クラボウ製)を用い、グラフト化例1の方法で得られた酸化チタン粒子3.88にシリコーン樹脂1を3.8g添加して混合し、1000rpmで3分間撹拌・脱泡した。所望の時間放置した後、エバポレーターによって溶剤を除去して固形分濃度80wt%のサンプルを作製した後、屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.58であった。また、透明性は非常に良好であった。 Comparative Example 22 (refractive index effect, phosphor sheet)
<Preparation of phosphor composition>
Using a planetary stirring and defoaming device “Mazerustar KK-400” (manufactured by Kurabo Industries), 3.8 g of
スリットダイコーターを用いて蛍光体組成物35を基材として“セラピール”BX9
(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。その後、ドライフィルムラミネーターを使用して蛍光シートの貼り替えを実施し、基材フィルムをポリフェニレンサルファイドフィルム“トレリナ3000”(東レ(株)製、平均膜厚50μm)へ変更した。照度測定を行った結果、比較例11に対して、相対照度が100となり、輝度向上効果が得られなかった。 <Preparation of phosphor sheet laminate>
"Serapeel" BX9 using
It apply | coated on the mold release process surface (Toray Film Processing Co., Ltd. product, average film thickness of 50 micrometers), and it heated and dried at 120 degreeC for 30 minutes, and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 mm square. Then, the fluorescent sheet was replaced using a dry film laminator, and the base film was changed to a polyphenylene sulfide film “Torelina 3000” (manufactured by Toray Industries, Inc., average film thickness 50 μm). As a result of the illuminance measurement, relative illuminance was 100 with respect to Comparative Example 11, and the luminance enhancement effect was not obtained.
<蛍光体組成物の作製>
シリコーン樹脂3を用い、金属化合物粒子を用いずに屈折率測定用サンプルおよび透明性評価用サンプルを作製した。屈折率評価を行った結果、平均屈折率N1は1.40であった。また、透明性は非常に良好であった。 Comparative Example 23 (refractive index effect, phosphor sheet)
<Preparation of phosphor composition>
Using
スリットダイコーターを用いて蛍光体組成物36を基材として“セラピール”BX9
(東レフィルム加工(株)製、平均膜厚50μm)の離型処理面上に塗布し、120℃で30分間加熱、乾燥し、80μm、100mm角の蛍光体シート積層体を得た。また照度測定を行った結果、比較例11に対して、相対照度が80となり、輝度向上効果が得られなかった。 <Preparation of phosphor sheet>
“Serapeel” BX9 using
It apply | coated on the mold release process surface (Toray Film Processing Co., Ltd. product, average film thickness of 50 micrometers), and it heated and dried at 120 degreeC for 30 minutes, and obtained the fluorescent substance sheet laminated body of 80 micrometers and a 100 mm square. As a result of the illuminance measurement, the relative illuminance was 80 with respect to Comparative Example 11, and the luminance enhancement effect was not obtained.
表19に記載の溶剤に変更した以外はグラフト化例1と同様にしてグラフト化された酸化チタン粒子を得た。これを用いた以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、評価を行った。結果を表19、20に示す。これらの実施例から、本発明の蛍光体組成物をシート状に形成してなる蛍光体シートであればペーストの透明性も良好であり、輝度も向上することがわかった。 Examples 42 to 47 (Solvent effect, phosphor sheet)
Grafted titanium oxide particles were obtained in the same manner as Grafting Example 1 except that the solvents listed in Table 19 were used. A phosphor composition was prepared in the same manner as in Example 19 except that this was used. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 19 and 20. From these examples, it was found that a phosphor sheet formed by forming the phosphor composition of the present invention into a sheet shape has good paste transparency and improved luminance.
表22に記載の金属化合物粒子に変更した以外はグラフト化例1と同様にしてグラフト化されたナノ粒子を得た。これを用いた以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、評価を行った。結果を表21、22に示す。これらの実施例から、本発明の蛍光体組成物をシート状に形成してなる蛍光体シートであれば輝度が向上することがわかった。比較例24では輝度は向上しなかった。 Examples 48 to 52, Comparative Example 24 (effect of high refractive index nanoparticles, phosphor sheet)
Grafted nanoparticles were obtained in the same manner as Grafting Example 1 except that the metal compound particles listed in Table 22 were used. A phosphor composition was prepared in the same manner as in Example 19 except that this was used. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 21 and 22. From these examples, it was found that the luminance was improved if the phosphor sheet was formed by forming the phosphor composition of the present invention into a sheet shape. In Comparative Example 24, the luminance was not improved.
表23に記載の金属化合物粒子に変更した以外はグラフト化例1と同様にしてグラフト化されたナノ粒子を得た。これを用いた以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、評価を行った。結果を表23、24に示す。これらの実施例から、本発明の蛍光体組成物をシート状に形成してなる蛍光体シートであれば輝度が向上することがわかった。比較例25~28では輝度は向上しなかった。 Examples 19, 53 to 57, Comparative Examples 25 to 28 (Effect of particle size of high refractive index nanoparticles, phosphor sheet)
Grafted nanoparticles were obtained in the same manner as Grafting Example 1, except that the metal compound particles listed in Table 23 were used. A phosphor composition was prepared in the same manner as in Example 19 except that this was used. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 23 and 24. From these examples, it was found that the luminance was improved if the phosphor sheet was formed by forming the phosphor composition of the present invention into a sheet shape. In Comparative Examples 25 to 28, the luminance was not improved.
実施例19と同様の操作で蛍光体組成物を作製した。その後、表25記載の基材に変更した以外は実施例19と同様の操作での蛍光体シート積層体を作製し、評価を行った。結果を表25に示す。実施例58~64は、比較例11に対して膜厚均一性が良好であった。また照度測定を行った結果、比較例11に対して、実施例58~64は輝度向上効果が得られた。これらの結果から、基材を変更しても輝度への効果は変わらないことがわかった。 Examples 58 to 64 (Effect of base material, phosphor sheet)
A phosphor composition was prepared in the same manner as in Example 19. Thereafter, a phosphor sheet laminate was prepared and evaluated in the same manner as in Example 19 except that the base material described in Table 25 was used. The results are shown in Table 25. In Examples 58 to 64, the film thickness uniformity was better than that of Comparative Example 11. In addition, as a result of the illuminance measurement, in comparison with Comparative Example 11, Examples 58 to 64 obtained an effect of improving luminance. From these results, it was found that changing the base material did not change the effect on luminance.
実施例19と同様の操作で蛍光体組成物を作製した。その後、表26に記載のシート膜厚に変更した以外は実施例19と同様の操作で蛍光体シート積層体を作製し、評価を行った。結果を表26に示す。耐熱性試験を行なった結果、膜厚が厚くなるにしたがって耐熱性が悪くなる傾向が確認できた。また照度測定を行った結果、比較例11に対して、実施例65~71は輝度が向上することがわかった。 Examples 65 to 71 (Effect of phosphor sheet thickness, phosphor sheet)
A phosphor composition was prepared in the same manner as in Example 19. Thereafter, a phosphor sheet laminate was produced and evaluated in the same manner as in Example 19 except that the sheet thickness was changed to that shown in Table 26. The results are shown in Table 26. As a result of the heat resistance test, it was confirmed that the heat resistance tends to deteriorate as the film thickness increases. Further, as a result of the illuminance measurement, it was found that the luminance was improved in Examples 65 to 71 as compared with Comparative Example 11.
表19に記載の金属化合物粒子に変更した以外はグラフト化例1と同様にしてグラフト化されたナノ粒子を得た。これを用いた以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、評価を行った。結果を表28に示す。実施例72から、本発明の蛍光体組成物をシート状に形成してなる蛍光体シートであれば輝度が向上することがわかった。 Example 72 (Effect of high refractive index nanoparticles, phosphor sheet)
Grafted nanoparticles were obtained in the same manner as Grafting Example 1, except that the metal compound particles listed in Table 19 were used. A phosphor composition was prepared in the same manner as in Example 19 except that this was used. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Table 28. From Example 72, it turned out that a brightness | luminance will improve if it is a fluorescent substance sheet formed by forming the fluorescent substance composition of this invention in a sheet form.
表29、31に記載のグラフト方法に変更した以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、評価を行った。結果を表29~32に示す。取り扱い性を評価した結果、比較例11に対して、実施例19、73~82は実用上問題ない結果が得られ、特に実施例19、73~75は、良好な取り扱い性であった。また照度測定を行った結果、比較例11に対して、実施例19、73~82は大きな輝度向上効果が得られた。 Examples 19, 73 to 82, Comparative Example 14 (Effect of molar ratio of alkoxysilane compound, phosphor sheet)
A phosphor composition was prepared in the same manner as in Example 19 except that the grafting method described in Tables 29 and 31 was used. Then, the fluorescent substance sheet laminated body by the operation similar to Example 19 was produced, and evaluation was performed. The results are shown in Tables 29-32. As a result of evaluating the handleability, Examples 19 and 73 to 82 obtained practically no problem with respect to Comparative Example 11, and Examples 19, 73 to 75 were particularly excellent in handleability. Further, as a result of the illuminance measurement, Examples 19, 73 to 82 showed a great brightness improvement effect as compared with Comparative Example 11.
表33、35、37に記載のマトリックス樹脂に変更した以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、粘弾性挙動及び各種評価を行った。結果を表33~38に示す。密着性試験を行なった結果、本発明の粘弾性挙動の範囲に入っている実施例19、83~91は、良好な密着性が得られたのに対し、比較例11、13、14、29~35は密着不良の結果であった。また照度測定を行った結果、比較例11に対して、実施例19、83~91は輝度向上効果が得られた。比較例11、13、14、29~35は輝度向上効果が得られなかった。これらの結果から、本発明の蛍光体シートであれば、輝度向上効果が得られることがわかった。 Examples 19, 83 to 91, Comparative Examples 11, 13, 14, 29 to 35 (with silicone fine particles, viscoelastic behavior, phosphor sheet)
A phosphor composition was prepared in the same manner as in Example 19 except that the matrix resin described in Tables 33, 35, and 37 was used. Then, the fluorescent substance sheet laminated body by the same operation as Example 19 was produced, and viscoelastic behavior and various evaluation were performed. The results are shown in Tables 33-38. As a result of the adhesion test, Examples 19, 83 to 91, which are within the range of the viscoelastic behavior of the present invention, showed good adhesion, whereas Comparative Examples 11, 13, 14, 29 ~ 35 was the result of poor adhesion. Further, as a result of the illuminance measurement, the luminance improvement effect was obtained in Examples 19 and 83 to 91 with respect to Comparative Example 11. In Comparative Examples 11, 13, 14, and 29 to 35, the luminance improvement effect was not obtained. From these results, it was found that the brightness enhancement effect can be obtained with the phosphor sheet of the present invention.
シリコーン微粒子を添加せず、表39に記載のマトリックス樹脂に変更した以外は実施例19と同様の操作で蛍光体組成物を作製した。その後、実施例19と同様の操作での蛍光体シート積層体を作製し、粘弾性挙動及び各種評価を行った。結果を表39、40に示す。密着性試験を行なった結果、本発明の粘弾性挙動の範囲に入っている実施例28、92~96は、良好な密着性が得られたのに対し、比較例16、18、19、36は密着不良の結果であった。また照度測定を行った結果、比較例11に対して、実施例28、92~96は輝度向上効果が得られた。比較例16、18、19、36は輝度向上効果が得られなかった。これらの結果から、本発明の蛍光体シートであれば、輝度向上効果が得られることがわかった。 Examples 28, 92 to 96, Comparative Examples 16, 18, 19, 36 (no silicone fine particles, viscoelastic behavior, phosphor sheet)
A phosphor composition was prepared in the same manner as in Example 19 except that the silicone fine particles were not added and the matrix resin described in Table 39 was used. Then, the fluorescent substance sheet laminated body by the same operation as Example 19 was produced, and viscoelastic behavior and various evaluation were performed. The results are shown in Tables 39 and 40. As a result of the adhesion test, Examples 28 and 92 to 96, which are within the range of the viscoelastic behavior of the present invention, showed good adhesion, whereas Comparative Examples 16, 18, 19, and 36. Was the result of poor adhesion. As a result of measuring the illuminance, the brightness improvement effect was obtained in Examples 28 and 92 to 96 with respect to Comparative Example 11. In Comparative Examples 16, 18, 19, and 36, the luminance improvement effect was not obtained. From these results, it was found that the brightness enhancement effect can be obtained with the phosphor sheet of the present invention.
2 蛍光体シート
3 電極
4 蛍光体組成物
5 リフレクター
6 透明封止材
7 実装基板
8 金バンプ
9 透明接着剤
10 基材
11 照度計
12 測定サンプル
13 拡散シート
14 スタンド
15 遮光円筒
16 遮光板
17 LED光源
18 パッケージフレーム
19 LEDパッケージ
20 基材
21 仮固定シート
22 加熱圧着ツール
23 LEDチップを表面に形成したウェハ
24 蛍光体シート付きLEDチップ
25 基材
26 蛍光体シート積層体
27 パッケージ基板
28 パッケージ電極
29 両面粘着テープ
30 台座
31 上部チャンバー
32 下部チャンバー
33 ダイアフラム
35 真空ダイアフラムラミネーター
34 吸気/排気口
36 切断部分
37 蛍光体シート付きLEDチップ
38,39 LEDパッケージ
101 マトリックス樹脂
102 金属化合物粒子
103 シリコーン微粒子
104 グラフト化された金属化合物粒子
105 蛍光体 DESCRIPTION OF
Claims (35)
- 蛍光体と、マトリックス樹脂と、金属化合物粒子を含有する蛍光体組成物であって、前記金属化合物粒子の屈折率が1.7以上であり、かつ、平均粒子径が1~50nmであり、前記金属化合物粒子と前記マトリックス樹脂の平均屈折率N1が、前記蛍光体の屈折率N2と以下の関係を満たし、前記金属化合物粒子がグラフト化されていることを特徴とする蛍光体組成物。
0.20≧|N1-N2| A phosphor composition containing a phosphor, a matrix resin, and metal compound particles, wherein the metal compound particles have a refractive index of 1.7 or more and an average particle diameter of 1 to 50 nm, The phosphor composition, wherein the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship with the refractive index N2 of the phosphor, and the metal compound particles are grafted.
0.20 ≧ | N1-N2 | - さらにシリコーン微粒子を含有する請求項1記載の蛍光体組成物。 The phosphor composition according to claim 1, further comprising silicone fine particles.
- 前記シリコーン微粒子の表面が前記グラフト化された金属化合物粒子で被覆されている請求項2記載の蛍光体組成物。 The phosphor composition according to claim 2, wherein the surface of the silicone fine particles is coated with the grafted metal compound particles.
- 前記金属化合物粒子がアルコキシシランの縮合物でグラフト化されている請求項1~3のいずれか記載の蛍光体組成物。 4. The phosphor composition according to claim 1, wherein the metal compound particles are grafted with an alkoxysilane condensate.
- 前記金属化合物粒子がアルコキシシランの縮合物でグラフト化されており、前記アルコキシシランがフェニル基含有アルコキシシランおよびメチル基含有アルコキシシランを含む請求項1~4のいずれか記載の蛍光体組成物。 The phosphor composition according to any one of claims 1 to 4, wherein the metal compound particles are grafted with a condensate of alkoxysilane, and the alkoxysilane includes a phenyl group-containing alkoxysilane and a methyl group-containing alkoxysilane.
- 前記金属化合物粒子が、金属化合物粒子の存在下で、アルコキシシラン化合物を溶媒中で酸触媒により加水分解した後、該加水分解物を縮合反応させることによってグラフト化されている請求項1~5のいずれか記載の蛍光体組成物。 The metal compound particles are grafted by hydrolyzing an alkoxysilane compound in a solvent with an acid catalyst in the presence of the metal compound particles, and then subjecting the hydrolyzate to a condensation reaction. The phosphor composition according to any one of the above.
- 前記アルコキシシラン化合物が、3官能性アルコキシシラン化合物を100~70モル%、2官能性アルコキシシラン化合物を0~30モル%含むことを特徴とする請求項6に記載の蛍光体組成物。 The phosphor composition according to claim 6, wherein the alkoxysilane compound contains 100 to 70 mol% of a trifunctional alkoxysilane compound and 0 to 30 mol% of a bifunctional alkoxysilane compound.
- 前記金属化合物粒子がアルミニウム化合物粒子、スズ化合物粒子、チタン化合物粒子、ジルコニウム化合物粒子およびニオブ化合物粒子からなる群より選ばれる少なくとも1種の金属化合物粒子である請求項1~7のいずれか記載の蛍光体組成物。 The fluorescence according to any one of claims 1 to 7, wherein the metal compound particles are at least one metal compound particle selected from the group consisting of aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles and niobium compound particles. Body composition.
- 前記マトリックス樹脂がシリコーン樹脂である請求項1~8のいずれか記載の蛍光体組成物。 The phosphor composition according to any one of claims 1 to 8, wherein the matrix resin is a silicone resin.
- 前記マトリックス樹脂が、シロキサン結合を有し、かつアリール基が直結したケイ素原子を含有するシリコーン樹脂である請求項9記載の蛍光体組成物。 The phosphor composition according to claim 9, wherein the matrix resin is a silicone resin having a siloxane bond and containing a silicon atom to which an aryl group is directly bonded.
- 前記マトリックス樹脂が、シロキサン結合を有し、かつナフチル基が直結したケイ素原子を含有する請求項10記載の蛍光体組成物。 The phosphor composition according to claim 10, wherein the matrix resin contains a silicon atom having a siloxane bond and having a naphthyl group directly bonded thereto.
- 請求項1~11のいずれか記載の蛍光体組成物をシート状に形成してなる蛍光体シート。 A phosphor sheet formed by forming the phosphor composition according to any one of claims 1 to 11 into a sheet shape.
- 蛍光体と、マトリックス樹脂と、金属化合物粒子を含有する蛍光体シートであって、前記金属化合物粒子の屈折率が1.7以上であり、かつ、平均粒子径が1~50nmであり、前記金属化合物粒子がグラフト化されており、前記金属化合物粒子と前記マトリックス樹脂の平均屈折率N1が、前記蛍光体の屈折率N2と以下の関係(i)を満たし、シートの粘弾性挙動が以下の関係(ii)、(iii)および(iv)を満たすことを特徴とする蛍光体シート。
<屈折率の関係>
(i)0.20≧|N1-N2|
<粘弾性挙動>
(ii)温度25℃において貯蔵弾性率G’が1.0×104Pa≦ G’≦1.0×106Paであり、かつtanδ<1
(iii)温度100℃において貯蔵弾性率G’が1.0×102Pa≦ G’<1.0×104Paであり、かつtanδ≧1
(iv)温度200℃において貯蔵弾性率G’が1.0×104Pa≦ G’≦1.0×106Paであり、かつtanδ<1 A phosphor sheet containing a phosphor, a matrix resin, and metal compound particles, wherein the metal compound particles have a refractive index of 1.7 or more and an average particle diameter of 1 to 50 nm. Compound particles are grafted, the average refractive index N1 of the metal compound particles and the matrix resin satisfies the following relationship (i) with the refractive index N2 of the phosphor, and the viscoelastic behavior of the sheet is A phosphor sheet characterized by satisfying (ii), (iii) and (iv).
<Refractive index relationship>
(I) 0.20 ≧ | N1-N2 |
<Viscoelastic behavior>
(Ii) The storage elastic modulus G ′ is 1.0 × 10 4 Pa ≦ G ′ ≦ 1.0 × 10 6 Pa at a temperature of 25 ° C. and tan δ <1
(Iii) Storage modulus G ′ is 1.0 × 10 2 Pa ≦ G ′ <1.0 × 10 4 Pa at a temperature of 100 ° C. and tan δ ≧ 1
(Iv) The storage elastic modulus G ′ is 1.0 × 10 4 Pa ≦ G ′ ≦ 1.0 × 10 6 Pa at a temperature of 200 ° C. and tan δ <1 - さらにシリコーン微粒子を含有する請求項13記載の蛍光体シート。 The phosphor sheet according to claim 13, further comprising silicone fine particles.
- 前記シリコーン微粒子の表面が前記グラフト化された金属化合物粒子で被覆されている請求項14記載の蛍光体シート。 The phosphor sheet according to claim 14, wherein the surface of the silicone fine particles is coated with the grafted metal compound particles.
- 前記金属化合物粒子がアルコキシシランの縮合物でグラフト化されている請求項13~15のいずれか記載の蛍光体シート。 The phosphor sheet according to any one of claims 13 to 15, wherein the metal compound particles are grafted with a condensate of alkoxysilane.
- 前記金属化合物粒子がアルコキシシランの縮合物でグラフト化されており、前記アルコキシシランがフェニル基含有アルコキシシランおよびメチル基含有アルコキシシランを含む請求項13~16のいずれか記載の蛍光体シート。 The phosphor sheet according to any one of claims 13 to 16, wherein the metal compound particles are grafted with a condensate of alkoxysilane, and the alkoxysilane includes a phenyl group-containing alkoxysilane and a methyl group-containing alkoxysilane.
- 前記金属化合物粒子が、金属化合物粒子の存在下で、アルコキシシラン化合物を溶媒中で酸触媒により加水分解した後、該加水分解物を縮合反応させることによってグラフト化されている請求項13~17のいずれか記載の蛍光体シート。 The metal compound particles are grafted by hydrolyzing an alkoxysilane compound in a solvent with an acid catalyst in the presence of the metal compound particles and then subjecting the hydrolyzate to a condensation reaction. The phosphor sheet according to any one of the above.
- 前記アルコキシシラン化合物が、3官能性アルコキシシラン化合物を100~70モル%、2官能性アルコキシシラン化合物を0~30モル%含むことを特徴とする請求項18に記載の蛍光体シート。 The phosphor sheet according to claim 18, wherein the alkoxysilane compound contains 100 to 70 mol% of a trifunctional alkoxysilane compound and 0 to 30 mol% of a bifunctional alkoxysilane compound.
- 前記金属化合物粒子がアルミニウム化合物粒子、スズ化合物粒子、チタン化合物粒子、ジルコニウム化合物粒子およびニオブ化合物粒子からなる群より選ばれる少なくとも1種の金属化合物粒子である請求項13~19のいずれか記載の蛍光体シート。 The fluorescence according to any one of claims 13 to 19, wherein the metal compound particles are at least one metal compound particle selected from the group consisting of aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles and niobium compound particles. Body sheet.
- 前記マトリックス樹脂がシリコーン樹脂である請求項13~20のいずれか記載の蛍光体シート。 The phosphor sheet according to any one of claims 13 to 20, wherein the matrix resin is a silicone resin.
- 前記マトリックス樹脂が、シロキサン結合を有し、かつアリール基が直結したケイ素原子を含有する請求項21記載の蛍光体シート。 The phosphor sheet according to claim 21, wherein the matrix resin contains a silicon atom having a siloxane bond and an aryl group directly bonded thereto.
- 前記マトリックス樹脂が、シロキサン結合を有し、かつナフチル基が直結したケイ素原子を含有する請求項22記載の蛍光体シート。 The phosphor sheet according to claim 22, wherein the matrix resin contains a silicon atom having a siloxane bond and having a naphthyl group directly bonded thereto.
- シートの膜厚が10~1000μmである請求項13~23のいずれかに記載の蛍光体シート。 The phosphor sheet according to any one of claims 13 to 23, wherein the thickness of the sheet is 10 to 1000 µm.
- 基材と、請求項12~24のいずれか記載の蛍光体シートを含有する蛍光体シート積層体。 A phosphor sheet laminate comprising a substrate and the phosphor sheet according to any one of claims 12 to 24.
- 前記基材がガラスである請求項25記載の蛍光体シート積層体。 The phosphor sheet laminate according to claim 25, wherein the substrate is glass.
- 前記基材がポリエチレンテレフタレート(PET)、ポリフェニレンサルファイド(PPS)、ポリプロピレン(PP)からなる群より選ばれるプラスチックフィルムである請求項25に記載の蛍光体シート積層体。 The phosphor sheet laminate according to claim 25, wherein the substrate is a plastic film selected from the group consisting of polyethylene terephthalate (PET), polyphenylene sulfide (PPS), and polypropylene (PP).
- LEDチップの発光面に請求項12~24のいずれかに記載の蛍光体シートを備えた蛍光体シート付きLEDチップ。 An LED chip with a phosphor sheet comprising the phosphor sheet according to any one of claims 12 to 24 on a light emitting surface of the LED chip.
- 請求項1~11のいずれかに記載の蛍光体組成物を用いたLEDパッケージ。 An LED package using the phosphor composition according to any one of claims 1 to 11.
- 請求項12~24のいずれかに記載の蛍光体シートを用いたLEDパッケージ。 An LED package using the phosphor sheet according to any one of claims 12 to 24.
- 請求項1~11のいずれかに記載の蛍光体組成物を用いたLEDパッケージの製造方法であって、(A)前記蛍光体組成物をパッケージフレームに注入する工程、及び(B)前記工程の後、封止材でLEDパッケージを封止する工程を少なくとも含むLEDパッケージの製造方法。 A method for manufacturing an LED package using the phosphor composition according to any one of claims 1 to 11, comprising: (A) injecting the phosphor composition into a package frame; and (B) Then, the manufacturing method of an LED package including the process of sealing an LED package with a sealing material at least.
- 請求項12~24のいずれかに記載の蛍光体シートを用いたLEDパッケージの製造方法であって、(A)前記蛍光体シートの一の区画を、一のLEDチップの発光面に対向させる位置合わせ工程、および(B)加熱圧着ツールにより加熱しながら加圧して前記シートの前記一の区画と前記一のLEDチップの発光面を接着させる接着工程を少なくとも含むLEDパッケージの製造方法。 25. A method of manufacturing an LED package using the phosphor sheet according to any one of claims 12 to 24, wherein (A) a position where one section of the phosphor sheet faces a light emitting surface of one LED chip. An LED package manufacturing method including at least a bonding step, and (B) an adhesion step in which the one section of the sheet and the light emitting surface of the one LED chip are bonded while being heated by a thermocompression bonding tool.
- 前記(A)の工程が、前記蛍光体シートの一の区画の上面および下面のうち高屈折率ナノ粒子の濃度の大きい側の面を前記一のLEDチップの発光面に対向させる位置合わせ工程である請求項32記載のLEDパッケージの製造方法。 The step (A) is an alignment step in which the surface on the higher concentration side of the high refractive index nanoparticles among the upper and lower surfaces of one section of the phosphor sheet is opposed to the light emitting surface of the one LED chip. 33. A method of manufacturing an LED package according to claim 32.
- 請求項12~24のいずれかに記載の蛍光体シートを用いたLEDパッケージの製造方法であって、LEDチップの発光面を前記蛍光体シートで被覆する工程を含むLEDパッケージの製造方法。 An LED package manufacturing method using the phosphor sheet according to any one of claims 12 to 24, comprising a step of covering a light emitting surface of an LED chip with the phosphor sheet.
- LEDチップの発光面が単一平面ではないことを特徴とする請求項32~34のいずれか記載のLEDパッケージの製造方法。 The method for manufacturing an LED package according to any one of claims 32 to 34, wherein the light emitting surface of the LED chip is not a single plane.
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