WO2014181984A3 - Heating element cooling apparatus - Google Patents

Heating element cooling apparatus Download PDF

Info

Publication number
WO2014181984A3
WO2014181984A3 PCT/KR2014/003633 KR2014003633W WO2014181984A3 WO 2014181984 A3 WO2014181984 A3 WO 2014181984A3 KR 2014003633 W KR2014003633 W KR 2014003633W WO 2014181984 A3 WO2014181984 A3 WO 2014181984A3
Authority
WO
WIPO (PCT)
Prior art keywords
impeller
heating element
cooling apparatus
cooling water
housing
Prior art date
Application number
PCT/KR2014/003633
Other languages
French (fr)
Korean (ko)
Other versions
WO2014181984A2 (en
Inventor
박동식
Original Assignee
박동식
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140013737A external-priority patent/KR101467375B1/en
Application filed by 박동식 filed Critical 박동식
Priority to CN201490000655.2U priority Critical patent/CN205281385U/en
Publication of WO2014181984A2 publication Critical patent/WO2014181984A2/en
Publication of WO2014181984A3 publication Critical patent/WO2014181984A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heating element cooling apparatus is disclosed. The heating element cooling apparatus according to one embodiment of the present invention comprises: a housing making contact with a heating element and in which cooling water flows; and an impeller provided and rotated in the housing, and the housing comprises: a main body unit coupled with the impeller; a first cover unit, which is a heat conductive member, coupled with the main body part at both sides of the impeller and making contact with the heating element; and a cooling water supply unit coupled with a center part of the impeller to be rotated together with the impeller and supplying the cooling water from the center part of the impeller in the first cover unit direction.
PCT/KR2014/003633 2013-05-10 2014-04-25 Heating element cooling apparatus WO2014181984A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201490000655.2U CN205281385U (en) 2013-05-10 2014-04-25 Heating element cooling arrangement

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20130003699 2013-05-10
KR20-2013-0003699 2013-05-10
KR20-2013-0004488 2013-06-04
KR20130004488 2013-06-04
KR1020140013737A KR101467375B1 (en) 2013-05-10 2014-02-06 Cooling apparatus for heating element
KR10-2014-0013737 2014-02-06

Publications (2)

Publication Number Publication Date
WO2014181984A2 WO2014181984A2 (en) 2014-11-13
WO2014181984A3 true WO2014181984A3 (en) 2015-04-09

Family

ID=51867830

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/003633 WO2014181984A2 (en) 2013-05-10 2014-04-25 Heating element cooling apparatus

Country Status (1)

Country Link
WO (1) WO2014181984A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016222376B3 (en) * 2016-11-15 2018-02-15 Zf Friedrichshafen Ag Electronic module and method for producing the same
US10928142B2 (en) * 2018-05-04 2021-02-23 Auras Technology Co., Ltd. Water-cooling head

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040047719A (en) * 2002-11-28 2004-06-05 가부시끼가이샤 도시바 Cooling pump, electric instrument and personal computer
KR100450326B1 (en) * 2002-01-22 2004-09-30 성이제 Heat sink construction of largest radiant heat area
KR100456342B1 (en) * 2002-02-08 2004-11-12 쿨랜스코리아 주식회사 A water cooling type cooling block for semiconductor chip
JP2006324647A (en) * 2005-04-21 2006-11-30 Nippon Light Metal Co Ltd Liquid-cooled jacket
KR20110032266A (en) * 2009-09-22 2011-03-30 재영솔루텍 주식회사 Injection mold

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100450326B1 (en) * 2002-01-22 2004-09-30 성이제 Heat sink construction of largest radiant heat area
KR100456342B1 (en) * 2002-02-08 2004-11-12 쿨랜스코리아 주식회사 A water cooling type cooling block for semiconductor chip
KR20040047719A (en) * 2002-11-28 2004-06-05 가부시끼가이샤 도시바 Cooling pump, electric instrument and personal computer
JP2006324647A (en) * 2005-04-21 2006-11-30 Nippon Light Metal Co Ltd Liquid-cooled jacket
KR20110032266A (en) * 2009-09-22 2011-03-30 재영솔루텍 주식회사 Injection mold

Also Published As

Publication number Publication date
WO2014181984A2 (en) 2014-11-13

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