WO2014045370A1

WO2014045370A1 - Work machine for printed circuit boards and mounting method

Info

Publication number: WO2014045370A1
Application number: PCT/JP2012/074056
Authority: WO
Inventors: 範明岩城; 児玉　誠吾; 公彦安田
Original assignee: 富士機械製造株式会社
Priority date: 2012-09-20
Filing date: 2012-09-20
Publication date: 2014-03-27
Also published as: JPWO2014045370A1; JP6062444B2

Abstract

A work machine for printed circuit boards includes a mounting head (24) for holding an electronic component (82) having leads (84) and for inserting the leads into through holes (110) formed in a printed circuit board (34), and a solder jetting device (28) for jetting molten solder (112) to the leads inserted into the through holes. In other words, one work machine performs mounting work for an electronic component having leads and also performs soldering work for the electronic component mounted in the mounting work. As a result, the number of work machines can be reduced, reducing the cost and also reducing the space required for the work machines. In addition, there is no need to transfer the printed circuit board among the work machines, so that the positional shift of the electronic component caused by transfer can be prevented and the work time can also be reduced.

Description

Anti-substrate working machine and mounting method

The present invention relates to a substrate working machine for mounting an electronic component having a lead wire on a circuit board, and a mounting method for mounting the electronic component having a lead wire on a circuit board.

When an electronic component having a lead wire is mounted on a circuit board, the lead wire is inserted into a through hole formed in the circuit board, and molten solder is applied to the lead wire. Specifically, as described in the following patent document, in a mounting work machine equipped with a holding device capable of holding an electronic component, the lead wire of the electronic component held by the holding device is a through hole in the circuit board. Inserted into. Subsequently, the circuit board is unloaded from the mounting work machine and transferred into the solder coating work machine. And a molten solder is apply | coated to a lead wire with a solder application | coating machine. That is, an electronic component is mounted on the circuit board by the mounting work machine and the solder application work machine, and the mounted electronic component is soldered to the circuit board.

JP 2003-188517 A

In the system described in the above-mentioned patent document, mounting work and soldering work are performed by the mounting work machine and the solder application work machine. As described above, when the mounting work and the soldering work are performed in the plurality of work machines, the circuit board on which the mounting work is performed is transferred from the mounting work machine to the solder application work machine. For this reason, there is a possibility that the electronic component mounted on the circuit board may be displaced during conveyance. Moreover, in order to arrange a plurality of work machines, a relatively large arrangement space is required. Furthermore, if the transport time is relatively long, the productivity efficiency is lowered. As described above, there is a lot of room for improvement in the execution of the mounting operation and the soldering operation, and it is possible to improve the practicality of the substrate working machine by making various improvements. This invention is made | formed in view of such a situation, and makes it a subject to provide an anti-substrate working machine and mounting method with high practicality.

In order to solve the above-described problem, a substrate working machine according to claim 1 of the present application holds an electronic component having a lead wire and inserts the lead wire into a through hole formed in a circuit board. And a solder application device that applies molten solder to the lead wires inserted into the through holes.

Further, the substrate work machine according to claim 2, further comprising a pressing device that presses the electronic component in a state where the lead wire is inserted into the through hole. A solder application device applies molten solder to the lead wires of the electronic component pressed by the pressing device.

Further, in the anti-substrate work machine according to claim 3, in the anti-substrate work machine according to claim 2, the holding device presses the electronic component in a state where the lead wire is inserted into the through hole. Thus, it functions as the pressing device.

Further, in the anti-substrate working machine according to claim 4, in the anti-substrate working machine according to any one of claims 1 to 3, the solder application device is configured such that the lead wire is formed by the holding device. Apply the molten solder in accordance with the timing of insertion into the through hole.

According to a fifth aspect of the present invention, there is provided a mounting method for mounting an electronic component having a lead wire on a circuit board, wherein the holding device for holding the electronic component causes the through hole formed in the circuit board to pass through the through hole. An insertion step of inserting a lead wire, and an application step of applying molten solder to the lead wire inserted into the through hole by a solder application device provided in a counter substrate working machine together with the holding device.

The on-board working machine according to claim 1, a holding device that performs mounting work of an electronic component having a lead wire on one working machine, and solder that performs soldering work on the electronic component mounted by the mounting work. And a coating device. Further, in the mounting method according to the fifth aspect, in one work machine, the mounting operation of the electronic component having the lead wire and the soldering operation to the electronic component mounted by the mounting operation are performed. As a result, the number of work implements can be reduced, the cost can be reduced, and the installation space for the work implements can be reduced. In addition, since it is not necessary to transfer the circuit board between the work machines, it is possible to suppress the displacement of the electronic components due to the transfer and to shorten the work time.

Further, in the substrate work machine according to the second aspect, the soldering operation is performed on the electronic component in a state of being pressed by the pressing device. In the conventional working machine, as described above, the mounting work and the soldering work are performed by a plurality of working machines. For this reason, in a working machine for performing a soldering operation, there is a concern that an electronic component mounted on a circuit board may float when solder is applied by a jet of molten solder or the like. In view of this, in order to suppress the floating of the electronic component, the lead wire is bent after the lead wire of the electronic component is inserted into the through hole. As described above, in the conventional working machine, it is necessary to perform an operation for bending the lead wire between the mounting operation and the soldering operation. However, in the substrate work machine according to the second aspect, since the electronic device is prevented from being lifted by the pressing device, it is not necessary to perform the bending work of the lead wire. As a result, the working time can be further shortened.

Further, in the on-board working machine according to the third aspect, the soldering work is performed on the electronic component held by the holding device. That is, the holding device functions as a pressing device. As a result, it is not necessary to provide a pressing device on the substrate working machine, and the cost can be reduced.

Also, in the counter-board working machine according to claim 4, the molten solder is applied in accordance with the timing at which the lead wire is inserted into the through hole of the circuit board. For this reason, when the lead wire enters the inside of the through hole, the molten solder enters the inside of the through hole. This makes it possible to fill the inside of the through hole, that is, the clearance between the inner peripheral surface of the through hole and the outer peripheral surface of the lead wire with molten solder, and to improve the solder joint state. It becomes possible.

It is a figure which shows the electronic component mounting machine which is an Example of this invention. It is a figure which shows the mounting head and solder jet apparatus with which an electronic component mounting machine is provided. It is a block diagram which shows the control apparatus with which an electronic component mounting machine is provided. It is a figure which shows the mounting head and solder jet apparatus when molten solder is jetted according to the timing at which a lead wire is inserted into the through hole of the circuit board. It is a figure which shows a mounting head and a solder jet apparatus when molten solder is jetted toward the lead wire inserted in the through hole of the circuit board. It is a figure which shows a pressing apparatus and a solder jet apparatus when a soldering operation | work is performed with respect to the electronic component of the state pressed by the pressing apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of electronic component mounting machine>
FIG. 1 shows an electronic component mounting machine 10 according to an embodiment of the present invention. The electronic component mounting machine 10 is a working machine for mounting electronic components on a circuit board. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter sometimes abbreviated as “moving device”) 22, a mounting head 24, a supply device 26, and a solder jet device 28. Yes.

The conveyance device 20 includes a pair of conveyor belts 30 extending in the X-axis direction and an electromagnetic motor (see FIG. 3) 32 that rotates the conveyor belt 30. The circuit board 34 is supported by the pair of conveyor belts 30 and is conveyed in the X-axis direction by driving the electromagnetic motor 32. Further, the transfer device 20 includes a substrate holding device (see FIG. 3) 36. The substrate holding device 36 fixedly holds the circuit board 34 supported by the conveyor belt 30 at a predetermined position (a position where the circuit board 34 in FIG. 1 is illustrated).

The moving device 22 includes an X-axis direction slide mechanism 50 and a Y-axis direction slide mechanism 52. The X-axis direction slide mechanism 50 has an X-axis slider 56 provided on the base 54 so as to be movable in the X-axis direction. The X-axis slider 56 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 3) 58. The Y-axis direction slide mechanism 52 has a Y-axis slider 60 provided on the side surface of the X-axis slider 56 so as to be movable in the Y-axis direction. The Y-axis slider 60 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 3) 62. The mounting head 24 is attached to the Y-axis slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the moving device 22.

The mounting head 24 mounts electronic components on the circuit board. A component holder 70 is attached to the lower end surface of the mounting head 24. As shown in FIG. 2, the component holder 70 has a pair of arms 72, and the pair of arms 72 approaches and separates by the operation of the positive / negative pressure supply device (see FIG. 3) 76. Specifically, when the negative pressure is supplied by the positive / negative pressure supply device 76, the pair of arms 72 approaches, and when the positive pressure is supplied by the positive / negative pressure supply device 76, the pair of arms 72 separates. . As a result, the component holder 70 grips the electronic component by the pair of arms 72 and detaches the gripped electronic component. Further, the mounting head 24 includes a lifting device (see FIG. 3) 78 that lifts and lowers the component holder 70. The mounting head 24 changes the vertical position of the electronic component to be gripped by the lifting device 78.

The supply device 26 is a feeder-type supply device, and has a plurality of tape feeders 80. The tape feeder 80 accommodates the taped component in a wound state. The taped component is obtained by taping the electronic component 82 shown in FIG. 2, specifically, the electronic component 82 having the lead wire 84. Then, the tape feeder 80 sends out the taped parts by a feeding device 86 (see FIG. 3). Thus, the tape feeder 80 supplies the electronic component 82 at the supply position by feeding out the taped component. A lead wire cutting mechanism (see FIG. 3) 88 is disposed at the supply position of the tape feeder 80, and when the electronic component 82 is gripped by the mounting head 24, the lead wire 84 of the electronic component 82 is The lead wire cutting mechanism 88 cuts it to a predetermined length.

The solder jet device 28 is disposed between the pair of conveyor belts 30 and is located on the lower surface side of the circuit board 34 held by the board holding device 36. As shown in FIG. 2, the solder jet device 28 has a generally cylindrical solder tank 90 and a jet nozzle 92. Molten solder is stored in the solder tank 90, and a jet nozzle 92 is disposed in the center of the solder tank 90 in a standing manner. The molten solder stored in the solder bath 90 is jetted upward from the tip of the jet nozzle 92 by the operation of a pump (see FIG. 3) 96. Further, the solder jet device 28 has a moving mechanism (see FIG. 3) 98, and the solder tank 90 is moved to an arbitrary position between the pair of conveyor belts 30 by the operation of the moving mechanism 98. It is possible. That is, the solder jet device 28 can jet the molten solder toward an arbitrary position on the lower surface side of the circuit board 34.

Also, the electronic component mounting machine 10 includes a control device 100 as shown in FIG. The control device 100 includes a controller 102 and a plurality of drive circuits 104. The plurality of drive circuits 104 are connected to the

electromagnetic motors

32, 58, 62, the substrate holding device 36, the positive / negative pressure supply device 76, the lifting / lowering device 78, the feeding device 86, the lead wire cutting mechanism 88, the pump 96, and the moving mechanism 98. ing. The controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. Thereby, the operations of the transport device 20 and the moving device 22 are controlled by the controller 102.

<Mounting work and soldering work with electronic component placement machine>
With the configuration described above, in the electronic component mounting machine 10, the electronic component 82 is mounted on the circuit board 34, and the mounted electronic component 82 is soldered to the circuit board 34. Specifically, the circuit board 34 is transported to the work position according to a command from the controller 102 of the control device 100, and the circuit board 34 is fixedly held at the position. Further, the supply device 26 supplies electronic components at the supply position of the tape feeder 80. Then, the controller 102 moves the mounting head 24 above the supply position and grips the electronic component 82 by the component holder 70.

Subsequently, the controller 102 moves the mounting head 24 to a predetermined position on the circuit board 34. Specifically, as shown in FIG. 2, a through hole 110 for inserting the lead wire 84 of the electronic component 82 is formed in the circuit board 34. The mounting head 24 is moved onto the circuit board 34 so that the through hole 110 and the lead wire 84 coincide with each other in the vertical direction. In addition, the controller 102 moves the solder jet device 28 below the through hole 110 of the circuit board 34. Thereby, as shown in FIG. 3, the component holder 70 that holds the electronic component 82 and the jet device 28 face each other with the through hole 110 of the circuit board 34 interposed therebetween.

Next, the controller 102 moves the component holder 70 downward. As a result, as shown in FIG. 4, the leading end portion of the lead wire 84 of the electronic component 82 held by the component holder 70 is inserted into the through hole 110 of the circuit board 34. Then, the controller 102 operates the pump 96 of the solder jet device 28 in accordance with the timing at which the leading end portion of the lead wire 84 is inserted into the through hole 110. As a result, the molten solder 112 jets toward the lead wire 84, the tip end portion of the lead wire 84 enters the through hole 110 from above, and the molten solder 112 enters from below. That is, the molten solder 112 is applied to the substrate surface opposite to the direction in which the lead wire 84 enters. Note that at the timing when the tip end portion of the lead wire 84 is inserted into the through hole 110, the operation of the pump 96 is controlled so that the molten solder that has flowed into the through hole 110 reaches the inside.

Then, the controller 102 moves the component holder 70 further downward. As a result, as shown in FIG. 5, the lead wire 84 of the electronic component 82 held by the component holder 70 passes through the through hole 110 of the circuit board 34 and extends below the circuit board 34. Also at this time, the pump 96 is in operation and the molten solder is jetted. Thereby, the electronic component 82 is soldered by the solder jet device 28 while being pressed by the component holder 70. At the timing when the lead wire 84 extends below the circuit board 34, the operation of the pump 96 is controlled so that the molten solder that has flowed through reaches the lead wire 84 that extends below the circuit board 34.

Then, when soldering in a state of being pressed by the component holder 70 is performed for a predetermined time, the jet of molten solder is stopped, and the gripping of the electronic component 82 by the component holder 70 is released. Through the above operation, the electronic component 82 is mounted on the circuit board 34, and the mounted electronic component 82 is soldered to the circuit board 34. That is, the lead wire 84 inserted into the through hole 110 and the location where the lead wire 84 of the circuit board 34 is inserted are applied with molten solder, whereby the lead wire 84 and the circuit board 34 are connected, and the electric circuit Is formed.

Thus, the electronic component mounting machine 10 is provided with the mounting head 24 for performing the mounting operation and the solder jet device 28 for performing the soldering operation. Therefore, in one electronic component mounting machine 10, it is possible to mount the electronic component 82 on the circuit board 34 and solder the electronic component 82 to the circuit board 34.

On the other hand, in the conventional working machine, the mounting work and the soldering work are performed by the mounting work machine provided with the mounting head 24 and the soldering work machine provided with the solder jet device 28. For this reason, in order to mount the electronic component 82 on the circuit board 34 and to solder the mounted electronic component 82 to the circuit board 34, at least two working machines are required. Further, when the soldering operation is performed by the solder jet device 28 in the soldering machine, the electronic component 82 mounted on the circuit board 34 may be lifted by the jet of molten solder. For this reason, in order to suppress the floating of the electronic component 82, it is necessary to bend the lead wire 84 after the electronic component 82 is mounted on the circuit board 34. That is, an operation for bending the lead wire 84 is performed between the mounting operation and the soldering operation.

However, in the electronic component mounting machine 10, as described above, it is possible to mount the electronic component 82 on the circuit board 34 and solder the electronic component 82 to the circuit board 34 in one working machine. As a result, the number of work implements can be reduced, the cost can be reduced, and the installation space for the work implements can be reduced. In addition, since it is not necessary to transfer the circuit board between the working machines, the working time can be shortened.

Furthermore, in the electronic component mounting machine 10, a soldering operation is performed on the electronic component 82 that is pressed by the component holder 70. For this reason, there is no possibility that the electronic component 82 mounted on the circuit board 34 is lifted by the jet of molten solder, and it is not necessary to bend the lead wire 84 after the electronic component 82 is mounted on the circuit board 34. As a result, the working time can be further shortened.

Also, in the electronic component mounting machine 10, the molten solder jet is started in accordance with the timing when the lead wire 84 is inserted into the through hole 110. For this reason, the lead wire 84 enters the through hole 110 from above, and the molten solder enters from below. As a result, it is possible to fill the inside of the through hole 110, that is, the clearance between the inner peripheral surface of the through hole 110 and the outer peripheral surface of the lead wire 84 with the molten solder, and the soldering state is improved. It becomes possible to do.

Furthermore, in the electronic component mounting machine 10, the amount of molten solder ejected and the height ejected are controlled by controlling the operation of the pump 96. Specifically, as described above, the operation of the pump 96 is controlled so that the molten solder enters the through hole 110 at the initial stage of the ejection of the molten solder. Then, the operation of the pump 96 is controlled so that the amount of molten solder ejected, the height of ejection, and the like gradually decrease in accordance with the amount of protrusion of the lead wire 84 downward from the circuit board 34. Thereby, it is possible to suitably adjust the finish of the solder.

Note that the controller 102 includes a lead wire insertion portion 120 and a solder jet portion 122 as shown in FIG. The lead wire insertion portion 120 is a functional portion for inserting the lead wire 84 of the electronic component 82 into the through hole 110 of the circuit board 34. The solder jet portion 122 is a functional portion for jetting molten solder toward the lead wire 84 inserted into the through hole 110.

Incidentally, in the above-described embodiment, the electronic component mounting machine 10 is an example of a substrate working machine. The mounting head 24 is an example of a holding device and a pressing device. The solder jet device 28 is an example of a solder application device. Moreover, the process processed by the lead wire insertion part 120 is an example of an insertion process. The process processed by the solder jet part 122 is an example of an application | coating process.

In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, molten solder is jetted toward the lead wire 84 during the soldering operation, but the molten solder may be applied to the lead wire 84. That is, the lead wire 84 may be immersed in the solder bath.

In the above embodiment, the electronic component 82 is inserted from above the circuit board 34 and molten solder is applied from below the circuit board 34. However, the electronic component 82 is inserted from below the circuit board 34, and the circuit board Molten solder may be applied from above 34. Incidentally, when the molten solder is applied from above the circuit board 34, the molten solder may be dropped onto the circuit board.

In the above embodiment, the soldering operation is performed in a state where the electronic component 82 is suppressed by the mounting head 24, but the solder is performed in a state where the electronic component 82 is suppressed by a device different from the mounting head 24. It is possible to perform attachment work. Specifically, the electronic component mounting machine 10 may be provided with a pressing device 130 shown in FIG. The pressing device 130 is disposed above the circuit board 34 and is movable in the vertical direction. The pressing device 130 can move downward and simultaneously press a plurality of electronic components 82 mounted on the circuit board 34. That is, after mounting the plurality of electronic components 82 by the mounting head 24, the plurality of electronic components 82 are simultaneously pressed by the pressing device 130. And it is possible to perform a soldering operation | work with respect to the some electronic component 82 of the state hold | suppressed by the pressing apparatus 130. FIG. Thereby, it becomes possible to perform a soldering operation | work with respect to the some electronic component 82 continuously.

10: Electronic component mounting machine (to board work machine) 24: Mounting head (holding device) (pressing device) 28: Solder jet device (solder application device) 130: Pressing device

Claims

A holding device that holds an electronic component having a lead wire and inserts the lead wire into a through hole formed in a circuit board;
And a solder application device that applies molten solder to the lead wire inserted into the through hole.
The board work machine is
A pressing device that holds the electronic component in a state where the lead wire is inserted into the through hole;
The solder application device is
The to-substrate working machine according to claim 1, wherein molten solder is applied to the lead wires of the electronic component pressed by the pressing device.
The holding device is
3. The work apparatus for a substrate according to claim 2, wherein the work apparatus functions as the pressing device by pressing the electronic component in a state where the lead wire is inserted into the through hole.
The solder application device is
The on-board working machine according to any one of claims 1 to 3, wherein molten solder is applied in accordance with a timing at which the lead wire is inserted into the through hole by the holding device.
In a mounting method for mounting an electronic component having a lead wire on a circuit board,
An insertion step of inserting the lead wire into a through hole formed in a circuit board by a holding device that holds the electronic component;
A mounting method comprising: applying a molten solder to the lead wire inserted into the through-hole by a solder application device provided on a substrate working machine together with the holding device.