WO2013035717A1 - Module, and manufacturing method for module - Google Patents

Module, and manufacturing method for module Download PDF

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Publication number
WO2013035717A1
WO2013035717A1 PCT/JP2012/072552 JP2012072552W WO2013035717A1 WO 2013035717 A1 WO2013035717 A1 WO 2013035717A1 JP 2012072552 W JP2012072552 W JP 2012072552W WO 2013035717 A1 WO2013035717 A1 WO 2013035717A1
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WO
WIPO (PCT)
Prior art keywords
connection terminal
wiring board
connection
module
terminal
Prior art date
Application number
PCT/JP2012/072552
Other languages
French (fr)
Japanese (ja)
Inventor
伸明 小川
陽一 高木
水白　雅章
福田　寛
Original Assignee
株式会社村田製作所
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Publication of WO2013035717A1 publication Critical patent/WO2013035717A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer

Definitions

  • the present invention relates to a module using a plurality of connection terminals forming an interlayer connection conductor and a method for manufacturing the module.
  • a module 500 in which various electronic components 502 mounted on both surfaces of a wiring board 501 are sealed with a resin layer 503 is known (for example, Patent Documents). 1). Further, a metal shield layer 504 is provided on one main surface of the module 500, and a mounting terminal 505 for external connection is provided on the other main surface. The metal shield layer 504 and the mounting terminal 505 are electrically connected to the wiring layer of the wiring board 501 through interlayer connection via conductors 506, respectively.
  • the via conductor 506 is filled with a conductor paste containing Ag, Cu, or the like after a desmear treatment is performed on a via hole formed by laser processing on the resin layer 503 provided on the wiring substrate 501 or via fill plating is performed. Is formed.
  • a via hole is formed in the resin layer 503 using laser processing, there is a problem that laser output adjustment is complicated and variations in the formation accuracy of the via hole occur.
  • the via conductor 506 is formed in the resin layer 503 through a plurality of steps, it causes an increase in the manufacturing cost of the module and hinders a reduction in the manufacturing time of the module.
  • a terminal assembly 600 in which a plurality of columnar connection terminals 601 forming an interlayer connection conductor are integrally formed with a coupling body 602 is formed by using a normal surface mounting technique. Attempts have been made to reduce the manufacturing cost of the module and reduce the manufacturing time of the module by mounting it on 501 and forming the interlayer connection conductor of the module by the connection terminal 601 instead of the via conductor 506 ( For example, see Patent Document 2).
  • FIG. 14 shows an example of a conventional terminal assembly.
  • JP 2008-16729 A paragraphs 0015 to 0017, FIG. 4, etc.
  • the terminal assembly 600 shown in FIG. 14 includes a plurality of columnar connection terminals 601 and a connection body 602 that connects the connection terminals 601 by etching, cutting, or pressing a material made of Cu. Are manufactured integrally.
  • the connection terminal 601 is integrally formed with the connecting body 602 by etching, the progress of the etching differs between the base portion and the tip portion of the connection terminal 601, so that the shape of each connection terminal 601 varies.
  • the terminal assembly 600 is mounted on the wiring substrate 501 formed of LTCC or a printed circuit board and sealed with a resin layer, the terminal assembly 600 is exposed until the tip of the connection terminal 601 is exposed on the surface of the resin layer.
  • the connecting layer 602 of the module is formed by the connection terminals 601 by grinding and polishing the resin layer for sealing the body 600 and the connection body 602 of the terminal assembly 600 and removing the connection body 602 from the terminal assembly 600. Is done.
  • the terminal for external connection of a module is formed of the front end surface of the connection terminal 601 exposed on the surface of the resin layer.
  • connection terminal 601 since Cu forming the connection terminal 601 is highly ductile and easily stretched, each connection terminal 601 exposed on the surface of the resin layer when the connecting body 602 is removed from the terminal assembly 600 by grinding or polishing. A flash is likely to be formed at the tip portion of the. Therefore, the tip of each connection terminal 601 is exposed on the surface of the resin layer and functions as a terminal for external connection of the module. However, a flash is formed at the tip of the connection terminal 601, so that Each connection terminal 601 may be short-circuited. Therefore, there is a possibility that a flash is formed at the tip of the connection terminal 601.
  • connection terminals 601 mounted on the wiring board 501 must be increased, and the plurality of connection terminals 601 are connected to the wiring board 501.
  • the distance between the terminals of each connection terminal 601 (interlayer connection conductor) is shortened, which hinders miniaturization of the module.
  • the magnitude of the linear expansion coefficient (about 17 ppm / ° C.) of Cu forming the connection terminal 601 is compared with the magnitude of the linear expansion coefficient of the ceramic material forming the wiring substrate 501 or the resin material of the FR-4 standard, for example. And very big. Therefore, in a module in which an interlayer connection conductor is formed by the connection terminal 601 made of Cu, the stress generated between the wiring board 501 and the connection terminal 601 is caused by thermal expansion of the wiring board 501 and the connection terminal 601 when heated. The connection portion between the wiring board 501 and the connection terminal 601 is likely to be damaged, resulting in a decrease in module reliability.
  • the present invention has been made in view of the above-described problems, and provides a highly reliable module by forming an interlayer connection conductor by mounting columnar connection terminals formed of a Cu-Fe alloy on a wiring board.
  • the purpose is to do.
  • the module of the present invention is a module in which an electronic component is mounted on at least one main surface of a wiring board, and is formed in a columnar shape that is mounted on one main surface of the wiring board to form an interlayer connection conductor. And a first resin layer provided so as to cover the electronic component and the connection terminal on one main surface of the wiring board, the connection terminal being formed of a Cu—Fe alloy, An end portion is connected to the wiring board (claim 1).
  • connection terminal is mounted by bonding the other end to a land electrode formed on the wiring board with a conductive bonding material, and the conductive bonding material includes an end surface of the other end and It is preferable that the outer peripheral surface be formed in a bowl shape (claim 2).
  • connection terminal is formed such that the diameter of the other end is larger than the diameter of the one end.
  • connection terminal may be formed such that a diameter of the one end is larger than a diameter of the other end (Claim 4).
  • an electronic component is further mounted on the other main surface of the wiring board (Claim 5).
  • the second main surface of the wiring board may further include a second resin layer provided so as to cover an electronic component (Claim 6).
  • connection terminal is further mounted on the other main surface of the wiring board, and an electronic component is further mounted on the second resin layer so as to be connected to the connection terminal mounted on the other main surface. (Claim 7).
  • the module manufacturing method of the present invention is a module manufacturing method in which a columnar connection terminal and an electronic component for forming an interlayer connection conductor are mounted on a wiring board and sealed with a resin.
  • a preparation step of preparing the connection terminal, and mounting the connection terminal so that an electronic component is mounted on one main surface of the wiring board and the other end of the connection terminal is connected to the wiring board.
  • the other end of the columnar connection terminal that is mounted together with the electronic component on one main surface of the wiring board and forms the interlayer connection conductor is connected to the wiring board.
  • the connection terminal is formed of a Cu—Fe alloy.
  • Fe having a linear expansion coefficient of about 12 ppm / ° C. is added to Cu having a linear expansion coefficient of about 17 ppm / ° C.
  • the linear expansion coefficient of the interlayer connection conductor formed by the connection terminal made of a Cu—Fe alloy is lower than that of Cu, and the wiring board formed of a ceramic material or a resin material of FR-4 standard The difference from the linear expansion coefficient can be reduced. Therefore, the columnar connection terminals formed of Cu—Fe alloy are mounted on the wiring board to form the interlayer connection conductor, so that the wiring board and the connection terminals are thermally expanded when heated, thereby being connected to the wiring board. Since the stress generated between the terminal and the terminal can be suppressed, for example, the connection portion between the wiring board and the connection terminal can be prevented from being damaged, and a highly reliable module can be provided.
  • connection terminal has, for example, a predetermined diameter and a cross-sectional shape, and is formed with a desired diameter and length by cutting a wire material made of a Cu—Fe alloy with a predetermined length.
  • the Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu, and is excellent in machinability and grindability. Therefore, when the connection terminal is formed by cutting the wire, The formation of flash at the cut end is suppressed. Therefore, even if a plurality of connection terminals are mounted close to each other on the wiring board, each connection terminal can be prevented from being short-circuited by the flash formed at the cut end, so that each connection terminal can reduce the distance between the terminals.
  • a module that is reduced in size by being contracted and mounted on a wiring board can be provided.
  • connection terminal is mounted by being bonded to the land electrode formed at the other end on the wiring board by the conductive bonding material.
  • the end surface and the outer peripheral surface of the other end portion are formed in a bowl shape. Accordingly, since the conductive bonding material spreading like a bowl on the outside of the other end of the connection terminal is caught by the first resin layer, the connection terminal can be prevented from falling off from the first resin layer.
  • connection terminal is formed in a wedge shape in the first resin layer such that the diameter of the other end connected to the wiring board is larger than the diameter of the one end. Since the large-diameter portion of the other end of the connection terminal connected to the wiring board is caught by the first resin layer, it is possible to reliably prevent the connection terminal from falling off the first resin layer.
  • the connecting terminal is formed on the surface of the first resin layer so that the diameter of one end part forming the terminal for external connection is larger than the diameter of the other end part. Therefore, a large area terminal for external connection can be formed on the surface of the first resin layer. Therefore, electrical connectivity and bonding strength when the module is mounted on a mother board or the like can be improved.
  • the external connection terminal and the interlayer connection conductor having a large area are integrally formed by the connection terminal, one end of the connection terminal exposed on the surface of the first resin layer is large by screen printing or photolithography. Compared with a configuration in which a terminal for external connection having an area is formed, the connection strength between the terminal for external connection and the interlayer connection conductor can be improved.
  • the second resin layer is provided by covering the other main surface of the wiring board with the electronic component, the electronic component mounted on the other main surface of the wiring board is replaced with the second resin layer. Can be protected.
  • connection terminal is further mounted on the other main surface of the wiring board, and the electronic component is connected to the second resin layer so as to be connected to the connection terminal mounted on the other main surface. Further, by mounting, it is possible to provide a practical module in which the mounting density of electronic components is further increased.
  • connection terminal formed of a Cu—Fe alloy is prepared.
  • the connection terminal has, for example, a predetermined diameter and a cross-sectional shape, and a wire made of a Cu—Fe alloy is predetermined.
  • the Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu, and is excellent in machinability and grindability. Therefore, when the connection terminal is formed by cutting the wire, Since it is suppressed that the flash is formed at the cut end, it is possible to prepare a columnar connection terminal having a very high precision shape.
  • connection terminals are sealed with the first resin layer. Then, by polishing or grinding one end of the first resin layer and the connection terminal, one end of the connection terminal is exposed on the surface of the first resin layer, but the Cu—Fe alloy forming the connection terminal is Since the hardness is high and the machinability and grindability are excellent, it is possible to suppress the formation of flash at one end of the connection terminal when the one end is polished or ground.
  • each connection terminal is exposed on the surface of the first resin layer and functions as a terminal for external connection of the module, but is formed on one end of the connection terminal exposed on the surface of the first resin layer. Since each connection terminal is prevented from being short-circuited by the emitted flash, a column-shaped connection terminal formed of a Cu—Fe alloy is mounted on a wiring board to form an interlayer connection conductor, thereby providing a highly reliable module Can be provided.
  • the Cu—Fe alloy forming the connection terminal has a lower linear expansion coefficient than Cu, and the linear expansion coefficient of the interlayer connection conductor formed by the connection terminal made of the Cu—Fe alloy, and the linear expansion coefficient of the wiring board Can be reduced. Therefore, the columnar connection terminals formed of Cu—Fe alloy are mounted on the wiring board to form the interlayer connection conductor, so that the wiring board and the connection terminals are thermally expanded when heated, thereby being connected to the wiring board. Since the stress generated between the terminal and the terminal can be suppressed, for example, the connection portion between the wiring board and the connection terminal can be prevented from being damaged, and a highly reliable module can be provided.
  • connection terminal is formed of a Cu—Fe alloy, it is possible to suppress the formation of a flash at one end of the connection terminal in the polishing or grinding process. Since short-circuiting is prevented, the distance between the multiple connection terminals mounted on the wiring board can be reduced, and each connection terminal is mounted close to the wiring board and the distance between the terminals is reduced. Thus, a module with a reduced size can be provided.
  • FIG. 1 is a diagram showing a terminal assembly used in a module according to the first embodiment of the present invention.
  • FIG. 2 is a bottom view of the terminal assembly used in the module according to the first embodiment of the present invention.
  • FIG. 3 is a diagram showing a module manufacturing method according to the first embodiment of the present invention, and (a) to (d) show different processes.
  • FIG. 4 is an enlarged view of a main part of the module according to the first embodiment of the present invention.
  • Bluetooth (registered trademark) is mounted on a mother board of a communication portable terminal by mounting various electronic components 102 on at least one main surface of the wiring board 101.
  • Various communication modules such as modules and wireless LAN modules, high-frequency circuit modules such as antenna switch modules and power supply modules are manufactured.
  • a terminal assembly 10 that includes a plurality of columnar connection terminals 11 that form interlayer connection conductors of the module 100 shown in FIG. As shown in FIG. 1 and FIG. 2, the terminal assembly 10 includes a columnar connection terminal 11 and a plate-like support 12 that form an interlayer connection conductor of the module 100 by being mounted on a wiring board 101.
  • the connection terminal 11 is supported at a predetermined position on one surface of the support 12 via a support layer 13.
  • connection terminal 11 is formed of a Cu—Fe alloy in which Fe is added to Cu at a ratio of 0.1% to 20%.
  • connection terminal 11 by forming the connection terminal 11 from a Cu—Fe alloy in which Fe is mixed with Cu and the hardness is increased, it is possible to suppress the occurrence of flash or the like when the connection terminal 11 is cut, ground, polished, or the like. Therefore, the processing accuracy when the connection terminal 11 is cut, ground, polished, or the like can be improved.
  • connection terminal 11 can be formed as follows, for example. That is, the connection terminal 11 is formed with a predetermined length by shearing a wire made of a Cu—Fe alloy having a predetermined diameter and a circular or polygonal cross-sectional shape with a predetermined length. It is formed in a cylindrical shape or a polygonal column shape.
  • connection terminal 11 While improving the machinability, grindability, and polishing accuracy of the connection terminal 11, the wet state of the conductive bonding material such as solder or metal brazing to the connection terminal 11, or when the connection terminal 11 is plated. In order not to deteriorate the plating state, it is more preferable to employ a Cu—Fe alloy in which 1 to 10% Fe is added to Cu.
  • the material of the plate-like member that forms the support 12 may be any material.
  • the support 12 may be formed of a plate-like member made of a material that does not deform due to heating.
  • the support layer 13 of the support 12 may be formed by applying a liquid adhesive or pressure-sensitive adhesive to one surface of the plate-shaped member, or a sheet-shaped adhesive sheet or pressure-sensitive adhesive sheet may be formed on one side of the plate-shaped member. You may stick to the direction and form. Further, the thickness of the support layer 13 prevents an error from occurring in the height of the connection terminal 11 when the connection terminal 11 is mounted on the wiring substrate 101 of the module 100, and prevents the connection terminal 11 from tilting. In order to achieve this, it is preferable that the support layer 13 is as thin as possible.
  • the adhesive or pressure-sensitive adhesive forming the support layer 13 an epoxy type or acrylic type can be used as the adhesive or pressure-sensitive adhesive forming the support layer 13.
  • the adhesive layer softens when heated to a predetermined temperature or more and hardens when cooled. It is preferable to form the support layer 13 with an adhesive.
  • the terminal assembly 10 in the storage state is in a state where the support layer 13 of the support 12 is cured in the state in which the terminal assembly 10 is stored. It is possible to prevent dust and dirt from adhering to the support layer 13 of the 10 support bodies 12.
  • the terminal aggregates 10 may be individually manufactured so as to correspond to the respective modules 100. However, after forming the aggregates of the plurality of terminal aggregates 10, the individual terminal aggregates 10 are The terminal assembly 10 may be manufactured by dividing into pieces.
  • Module manufacturing method A method of manufacturing the module 100 in which the columnar connection terminals 11 and the electronic components 102 forming the interlayer connection conductor are mounted on the wiring substrate 101 and sealed with resin will be described.
  • a terminal assembly 10 is prepared in which a plurality of columnar connection terminals 11 forming interlayer connection conductors of the module 100 are supported by a support 12 (preparation step). Then, as shown in FIG. 3A, the terminal assembly 10 and various electronic components 102 such as chip components and ICs are solder reflowed and ultrasonic vibration bonded at a predetermined position on one main surface of the wiring board 101. It is mounted by a general surface mounting technique such as (mounting process). The terminal assembly 10 is mounted on the wiring board 101 so that the other end of the connection terminal 11 is connected to the wiring board 101. Further, the connection terminal 11 and the electronic component 102 may be mounted on the wiring board 101 using a conductive adhesive.
  • land electrodes 101 a are provided on one main surface of the wiring board 101 with substantially the same area as the cross-sectional area of the connection terminals 11. Then, the connection terminal 11 is covered with a conductive bonding material S such as solder so that the end surface and the outer peripheral surface of the other end of the connection terminal 11 are spread out on the outside of the mounting electrode 101a. has been implemented.
  • the wiring substrate 101 is a multilayer ceramic substrate formed by laminating and firing a plurality of ceramic green sheets.
  • a ceramic green sheet is a sheet in which a mixed powder of alumina and glass is mixed with an organic binder and solvent.
  • a via hole is formed at a predetermined position of the ceramic green sheet by laser processing or the like. The formed via hole is filled with a conductor paste containing Ag, Cu or the like to form a via conductor for interlayer connection, and various electrode patterns are formed by printing with the conductor paste.
  • the ceramic green sheets are laminated and pressure-bonded to form a ceramic laminate, and the wiring substrate 101 is formed by so-called low-temperature firing at a low temperature of about 1000 ° C.
  • the wiring board 101 is provided with various electrode patterns such as an internal wiring pattern, a mounting electrode on which the terminal assembly 10 and the electronic component 102 are mounted, and an external connection electrode.
  • an internal wiring pattern a mounting electrode on which the terminal assembly 10 and the electronic component 102 are mounted
  • an external connection electrode can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc., using a resin or a polymer material.
  • the wiring board 101 may be formed by selecting an optimal material as appropriate.
  • connection terminal 11 the support 12 of the terminal assembly 10 mounted on one main surface of the wiring board 101 is removed from the connection terminal 11.
  • one end of the connection terminal 11 is supported on the support layer 13 of the support 12 by adhesion or adhesion, and the adhesive force or adhesion of the support layer 13 of the support 12 is reduced.
  • the support 12 is removed from the connection terminal 11.
  • the adhesive strength of the support layer 13 is increased by heating the support layer 13 to a glass transition temperature (Tg) or higher.
  • Tg glass transition temperature
  • the support 12 may be removed from the connection terminal 11 by reducing the adhesive strength.
  • the glass transition of the support layer 13 is prevented so that the solder that joins the terminal assembly 10 and the electronic component 102 to the wiring board 101 does not melt when heating to reduce the adhesive force or adhesive strength of the support layer 13.
  • the temperature is desirably about 200 ° C. or less, which is the melting temperature of the solder.
  • the adhesive force or pressure-sensitive adhesive force of the support layer 13 is reduced by using an alkaline surfactant or ethyl acetate.
  • the support 12 may be removed from the connection terminal 11.
  • the first resin layer 103 is formed of a composite resin formed by mixing an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide with a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. can do.
  • the first resin layer 103 is formed using a resin sheet obtained by molding and semi-curing a composite resin on a PET film, a spacer (mold) having a desired thickness is arranged around After covering the wiring board 101 with a resin sheet and heat-pressing the resin sheet so that the thickness of the resin becomes the thickness of the spacer, the wiring board 101 is heated in an oven to cure the resin.
  • One resin layer 103 can be formed.
  • the first resin layer 103 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique.
  • the first resin layer 103 is used.
  • the height of the connection terminal 11 from the wiring board 101 can be made uniform by cutting one end of the connection terminal 11 together. Further, for example, Ni / Au plating may be applied to one end portion of the connection terminal 11 exposed on the surface of the first resin layer 103.
  • the step of polishing or grinding the surface of the first resin layer 103 includes: It does not necessarily have to be executed.
  • the first resin layer 103 may be formed by filling one main surface of the wiring substrate 101 without removing the support 12 of the terminal assembly 10 from the connection terminal 11.
  • the support 12 of the terminal assembly 10 may be removed together with the first resin layer 103 by grinding or polishing.
  • the modules 100 may be manufactured individually. However, after the assembly of a plurality of modules 100 is formed, the modules 100 may be manufactured by dividing them into individual modules 100. . In this case, when mounting the plurality of terminal assemblies 10 on the assembly of the wiring boards 101, the assembly of the terminal assemblies 10 before being separated may be mounted on the assembly of the wiring boards 101. In this way, the time for mounting the terminal assembly 10 on the wiring board 101 can be shortened, so that the manufacturing time of the module 100 can be shortened.
  • the plurality of individual terminal assemblies 10 individually correspond to the individual modules 100 of the assembly of the wiring boards 101. It may be mounted at a position. In this way, the terminal assembly 10 can be mounted on the wiring board 101 with higher positional accuracy than when the terminal assembly 10 is mounted on the wiring board 101.
  • the columnar connection terminal 11 that is mounted together with the electronic component 102 on one main surface of the wiring board 101 and forms an interlayer connection conductor has the other end connected to the wiring board 101.
  • the one end of the connection terminal 11 is exposed on the surface of the first resin layer 103 that covers the electronic component 102 and the connection terminal 11 and is provided on one main surface of the wiring board 101.
  • a terminal (land) for external connection is formed.
  • connection terminal 11 is made of a Cu—Fe alloy, and the Cu—Fe alloy has a coefficient of linear expansion of about 17 ppm / ° C. and a coefficient of linear expansion of about 12 ppm / ° C. lower than that of Cu.
  • the coefficient of linear expansion is lower than that of Cu, and the coefficient of linear expansion of the interlayer connection conductor formed by the connection terminal 11 made of a Cu—Fe alloy and the ceramic material or FR-4 standard resin material are used. The difference from the linear expansion coefficient of the wiring board 101 can be reduced.
  • the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring board 101 to form an interlayer connection conductor, whereby the wiring board 101 and the connection terminals 11 are thermally expanded when heated. Since the stress generated between the wiring board 101 and the connection terminal 11 can be suppressed, for example, the connection portion between the wiring board 101 and the connection terminal 11 can be prevented from being damaged, and the highly reliable module 101 can be prevented. Can be provided.
  • connection terminal 11 formed of a Cu—Fe alloy is prepared.
  • the connection terminal 11 has a predetermined diameter and a cross-sectional shape, and a wire made of a Cu—Fe alloy has a predetermined length. By being cut at, it is prepared with a desired diameter and length. Since the Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu and is excellent in machinability and grindability, the connection terminal 11 is formed when the connection material 11 is formed by cutting the wire. Since it is suppressed that a flash is formed at the cut end of 11, the columnar connection terminal 11 having a very high precision shape can be prepared.
  • the electronic component 102 is mounted on one main surface of the wiring board 101 and the connection terminal 11 is mounted so that the other end of the connection terminal 11 is connected to the wiring board 101.
  • the electronic component 102 and the connection terminal 11 mounted on are sealed with the first resin layer 103. Then, by polishing or grinding one end of the first resin layer 103 and the connection terminal 11, the one end of the connection terminal 11 is exposed on the surface of the first resin layer 103, but the connection terminal 11 is formed. Since the Cu—Fe alloy has high hardness and is excellent in machinability and grindability, it is possible to suppress the formation of a flash at one end of the connection terminal 11 when the one end is polished or ground. .
  • each connection terminal 11 is exposed on the surface of the first resin layer 103 and functions as a terminal for external connection of the module 100, but the connection terminal 11 exposed on the surface of the first resin layer 103 is exposed. Since the connection terminals 11 are prevented from being short-circuited by the flash formed at one end, the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring substrate 101 to form an interlayer connection conductor. Thus, the module 100 with high reliability can be provided.
  • connection terminal 11 is formed of a Cu—Fe alloy, it is possible to suppress the formation of a flash at one end of the connection terminal 11 in the polishing or grinding process. 11 is prevented from being short-circuited, the distance between the plurality of connection terminals 11 mounted on the wiring board 101 can be reduced, and each connection terminal 11 is mounted close to the wiring board 101 and mounted between the terminals. Thus, the module 100 can be provided with a reduced size. In addition, since the plurality of connection terminals 11 can be mounted close to the wiring substrate 101, the degree of freedom in designing the module 100 can be increased.
  • a terminal assembly 10 is prepared in which a plurality of columnar connection terminals 11 forming interlayer connection conductors are supported by a support body 12, and a conventional terminal assembly in which the support body and connection terminals are integrally formed;
  • each connection terminal 11 supported by the support is formed separately from the support 12. Therefore, when compared with the conventional connection terminals integrally formed on the support, each connection terminal 11 is formed separately from the support 12, so that the terminal assembly 10 prepared in the preparation process is very
  • a plurality of columnar connection terminals 11 having a highly accurate shape are supported and formed by a support 12.
  • the terminal assembly 10 has a simple configuration in which a plurality of connection terminals 11 are supported by a support 12 and is etched or scraped when preparing the terminal assembly 10 as in the prior art. Since there is no material to be discarded, the cost for preparing the terminal assembly 10 is reduced. Therefore, the simple structure in which the plurality of connection terminals 11 are supported by the support body 12 is highly accurate and inexpensive, and the terminal assembly 10 and the electronic component 102 having a new structure are mounted on one main surface of the wiring board 101.
  • the module 100 can be accurately manufactured by sealing the electronic component 102 and the terminal assembly 10 mounted on one main surface of the wiring board 101 with the first resin layer 103.
  • connection terminals 11 are only supported by the support body 12, and the connection terminals 11 and the support body 12 are formed separately. Therefore, as compared with the conventional terminal assembly having an integral structure, the support 12 can be easily removed from the plurality of connection terminals 11, and the interlayer connection conductor of the module 100 can be formed by the connection terminals 11. The manufacturing time can be shortened.
  • the resin is filled in the one main surface of the wiring substrate 101 in a state where the support 12 of the terminal assembly 10 on the one main surface of the wiring substrate 101 is removed from the connection terminal 11, the first resin layer 103 is formed. Therefore, the filling property of the resin filling one main surface of the wiring board 101 is improved. Further, when the resin is filled into the one main surface of the wiring substrate 101, the support 12 of the terminal assembly 10 mounted on the one main surface is removed, so that the air can easily escape and the first resin layer The generation of voids in 103 can be suppressed.
  • the first resin layer 103 can be easily formed by various generally known methods.
  • each connection terminal 11 is supported on the support 12 by adhesion or adhesion, and the support 12 is connected by reducing the adhesion or adhesion by the support 12 by heating or the like. It can be easily removed from the terminal 11.
  • the surface of the first resin layer 103 can be flattened by grinding or polishing after the sealing step, and the height of the module 100 can be reduced.
  • the external connection is formed on the surface of the first resin layer 103 by the one end of the connection terminal 11.
  • the terminal can be easily formed.
  • the terminal assembly 10 in which a plurality of columnar connection terminals 11 having a highly accurate shape is supported by a support 12 has a simple configuration in which the plurality of connection terminals 11 are supported by the support 12.
  • the support 12 made of a plate-like member that is highly accurate and inexpensive and has a support layer 13 formed of an adhesive layer or an adhesive layer on one surface, It has a practical configuration.
  • FIG. 6 is a diagram showing a module according to the second embodiment of the present invention.
  • the module according to this embodiment is different from the first embodiment described above in that an electronic component 102 is further mounted on the other main surface of the wiring board 101 of the module 100a as shown in FIG. Since other configurations are the same as those in the first embodiment described above, description of the configurations is omitted by giving the same reference numerals.
  • a terminal for external connection of the module 100 a is formed by the end face of one end of the connection terminal 11.
  • the mounting density of the electronic component 102 mounted on the module 100a can be increased, and the mounting density of the electronic component 102 is increased.
  • a module 100a having a typical configuration can be provided.
  • FIG. 7 is a diagram showing a module according to the third embodiment of the present invention.
  • the module according to this embodiment differs from the second embodiment described above in that the electronic component 102 mounted on the other main surface of the wiring board 101 of the module 100b covers the electronic component 102 as shown in FIG.
  • the second resin layer 104 is sealed by the second resin layer 104. Since other configurations are the same as those in the first and second embodiments described above, the description of the configurations is omitted by giving the same reference numerals.
  • the electronic component 102 is mounted on the other main surface of the wiring board 101, and the electronic component 102 mounted on the other main surface of the wiring board 101 is the second resin layer 104.
  • the mounting density of the electronic components 102 mounted on the module 100b can be increased, which is practical.
  • the second resin layer 104 is provided so as to cover the other main surface of the wiring substrate 101 with the electronic component 102, the electronic component 102 mounted on the other main surface of the wiring substrate 101 is formed by the second resin layer 104. Can be protected.
  • FIG. 8 is a diagram showing a module according to the fourth embodiment of the present invention.
  • the module according to this embodiment differs from the third embodiment described above in that the metal shield layer 105 is formed on the second resin layer 104 provided on the other main surface of the wiring substrate 101 of the module 100c as shown in FIG. Is a point provided. Since other configurations are the same as those in the first to third embodiments, description thereof will be omitted by assigning the same reference numerals. Note that the metal shield layer 105 is preferably electrically connected to the GND wiring provided on the wiring board 101.
  • the metal shield layer 105 is provided in the 2nd resin layer 104, it is prevented especially that a noise propagates from the exterior to the electronic component 102 sealed by the 2nd resin layer 104. At the same time, electromagnetic waves and the like are prevented from radiating from the electronic component 102 sealed in the second resin layer 104.
  • FIG. 9 is a diagram showing a module according to the fifth embodiment of the present invention.
  • the module according to this embodiment differs from the third embodiment described with reference to FIG. 7 in that the terminal assembly 10 is mounted on the other main surface of the wiring board 101 of the module 100d as shown in FIG.
  • an interlayer connection conductor by the connection terminal 11 is provided on the second resin layer 104.
  • the second resin layer 104 is formed by filling the resin after the support 12 of the terminal assembly 10 mounted on the other main surface of the wiring substrate 101 is removed from the connection terminal 11.
  • an electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the interlayer connection conductor formed by the connection terminals 11 provided on the second resin layer 104. Since other configurations are the same as those in the first to fourth embodiments described above, description of the configurations is omitted by giving the same reference numerals.
  • the terminal assembly 10 is further mounted on the other main surface of the wiring board 101, an interlayer connection conductor using the connection terminals 11 can be formed on the second resin layer 104. Further, before the electronic component 102 and the terminal assembly 10 mounted on the other main surface of the wiring board 101 are sealed by the second resin layer 104, the support body for the terminal assembly 10 on the other main surface of the wiring board 101. Since 12 is removed from the connection terminal 11, the resin for forming the second resin layer 104 can be efficiently filled into the other main surface of the wiring substrate 101.
  • the electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the connection terminal 11 provided on the second resin layer 104, the mounting density of the electronic component 102 mounted on the module 100d This is practical because it can be further increased.
  • FIG. 10 is an enlarged view of a main part showing a modified example of the connection terminal, and (a) to (c) show modified examples of different connection terminals.
  • FIGS. 10 (a) to 10 (c) are enlarged views of main parts, and the same components as those in the first to fifth embodiments are denoted by the same reference numerals, and the description of the components is omitted.
  • the modification example of the connection terminal described below can achieve the same effect regardless of whether it is mounted on one of the main surface and the other main surface of the wiring board 101. Only the case where it is mounted on one main surface of the wiring board 101 will be described.
  • a land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11 is provided on one main surface of the wiring board 101.
  • the connection terminal 11 is made of a bonding material S such as solder. Is mounted on the land electrode 101b. With this configuration, the bonding material S is spread over the entire land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11, and the end surface of the other end of the connection terminal 11 is spread over the entire mounting electrode 101a. Further, since the bonding material S formed so as to cover the outer peripheral surface in a bowl shape is caught by the first resin layer 103, it is possible to prevent the connection terminal 11 from falling off from the first resin layer 103.
  • a bonding agent S such as solder may be disposed between the connection terminal 11 and the mounting electrode 101b.
  • connection terminal 11b is formed in a tapered shape by forming the other end portion with a diameter larger than the diameter of the one end portion. Further, a land electrode 101b having a larger area than the cross-sectional area on the large diameter side of the connection terminal 11b is provided on one main surface of the wiring board 101. Then, the other end portion on the large diameter side of the connection terminal 11b is mounted on the land electrode 101b with a bonding material S such as solder.
  • connection terminal 11b is provided in wedge shape in the 1st resin layer 103, while the large diameter part of the connection terminal 11b is hooked on the 1st resin layer 103, sectional area of the large diameter side of the connection terminal 11b Since the bonding material S formed so as to cover the end surface and the outer peripheral surface of the other end portion of the connection terminal 11b in a hook shape is caught by the resin layer 103 by spreading over the entire land electrode 101b having a larger area than the land electrode 101b. It is possible to reliably prevent the resin layer 103 from falling off.
  • a bonding agent S such as solder may be disposed between the connection terminal 11b and the mounting electrode 101b.
  • the area of the mounting electrode 101b may be equal to the cross-sectional area on the large diameter side of the connection terminal 11b.
  • connection terminal 11b is formed in a tapered shape by forming the diameter of one end portion larger than the diameter of the other end portion.
  • a land electrode 101b having a larger area than the cross-sectional area of the other end portion on the small diameter side of the connection terminal 11b is provided on one main surface of the wiring board 101.
  • the small diameter side of the connection terminal 11b is mounted on the land electrode 101b by a bonding material S such as solder. If comprised in this way, the junction formed so that the end surface and outer peripheral surface of the other end part of the connection terminal 11b may be covered with a bowl shape by spreading over the land electrode 101b of a larger area than the cross-sectional area of the small diameter side of the connection terminal 11b. Since the material S is caught by the resin layer 103, the connection terminal 11b is prevented from coming off from the resin layer 103.
  • a bonding agent S such as solder may be disposed between the connection terminal 11b and the mounting electrode 101b.
  • connection terminal 11b since one end portion on the large-diameter side of the connection terminal 11b is exposed to the first resin layer 103, a land-shaped external connection terminal having a large area can be easily formed in the module. Electrical connectivity and bonding strength when mounted on a substrate or the like can be improved.
  • FIGS. 11 and 12 are diagrams showing modifications of the terminal assembly. Note that the same components as those in the first to fifth embodiments described above are denoted by the same reference numerals, and the description of the components is omitted.
  • a terminal assembly 10a shown in FIG. 11B is a support 12a in which holes 12a1 for inserting the connection terminals 11 at predetermined intervals are formed in a lattice shape in a resin plate.
  • the columnar connection terminal 11 is provided at one end of the hole 12a1 at a required position according to the design of the module. It is formed by being inserted from the part side.
  • the terminal assembly 10a can be easily manufactured at low cost simply by inserting the columnar connection terminals 11 into the holes 12a1 provided in the plate-like support 12a.
  • the terminal aggregate 10a according to the kind of module can be formed by inserting the connection terminal 11 in the required hole 12a1 among the plurality of holes 12a1 provided in the support 12a. Therefore, since it is not necessary to design the support body 12a for each type of module, the manufacturing cost of the terminal assembly 10a can be reduced.
  • the support body 12a may form the support body 12a by forming the hole 12a1 only in the required position of a resin board according to the design aspect of a module.
  • the support 12a can be formed by, for example, injection molding using a resin or by forming a hole in a resin plate.
  • the terminal assembly 10b shown in FIG. 12B is formed by punching or etching a metal plate made of a Cu—Fe alloy, so that one end of the plurality of connection terminals 11c.
  • a member is formed by bending the connecting terminals 11c on both sides of the connecting portion 12b.
  • the metal plate will be punched or etched to form an assembly in which a plurality of connecting terminals 11c are connected via the connecting part 12b, and the connecting part between the connecting terminal 11c and the connecting part 12b
  • the terminal assembly 10b can be easily formed at low cost simply by bending the wire.
  • connection layer 11 is supported by providing the support layer 13 on the support 12 of the terminal assembly 10.
  • the support layer 13 is provided on the support 12.
  • the support 12 may be formed of a plate member made of a magnetic material. If it does in this way, the connection terminal 11 can be supported by the support body 12 by adsorb
  • the support body 12 can be easily removed from the connection terminal 11.
  • the terminal assembly 10, 10a, 10b is mounted on the wiring board 101, and the interlayer connection conductor by the connection terminals 11, 11b, 11c is formed in the module.
  • the interlayer connection conductors may be formed in the module by individually mounting the connection terminals formed individually on the wiring board 101.
  • the present invention can be widely applied to a technique for forming an interlayer connection conductor of a module by mounting columnar connection terminals on the circuit board of the module using surface mounting technology, and various electronic components can be applied to the wiring board. By mounting, modules having various functions can be configured.

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Abstract

　Provided is a highly reliable module composed by mounting columnar connection terminals formed from a Cu-Fe alloy on a wiring board and forming interlayer connection conductors.　The connection terminals (11) are formed from a Cu-Fe alloy having a lower linear expansion coefficient than Cu, and the difference between the linear expansion coefficient of the interlayer connection conductors formed by the connection terminals (11) and the linear expansion coefficient of the wiring board (101) formed using a ceramic material and an FR-4 standard resin material can be reduced. Thus, by mounting the columnar connection terminals (11) formed from a Cu-Fe alloy on a wiring board (101) and forming interlayer connection conductors, the stress generated between the wiring board (101) and the connection terminals (11) by the thermal expansion of the wiring board (101) and the connection terminals (11) when heated can be inhibited, enabling the provision of a highly reliable module (100).

Description

モジュールおよびモジュールの製造方法Module and module manufacturing method
　本発明は、層間接続導体を形成する複数の接続端子を用いたモジュールおよびこのモジュールの製造方法に関する。 The present invention relates to a module using a plurality of connection terminals forming an interlayer connection conductor and a method for manufacturing the module.
　従来、図１３の従来のモジュールの一例に示すように、配線基板５０１の両面に実装された各種の電子部品５０２が、樹脂層５０３により封止されたモジュール５００が知られている（例えば特許文献１参照）。また、モジュール５００の一方の主面には金属シールド層５０４が設けられ、他方の主面には外部接続用の実装用端子５０５が設けられている。そして、金属シールド層５０４および実装用端子５０５は、それぞれ層間接続用のビア導体５０６により配線基板５０１の配線層と電気的に接続される。 Conventionally, as shown in an example of a conventional module in FIG. 13, a module 500 in which various electronic components 502 mounted on both surfaces of a wiring board 501 are sealed with a resin layer 503 is known (for example, Patent Documents). 1). Further, a metal shield layer 504 is provided on one main surface of the module 500, and a mounting terminal 505 for external connection is provided on the other main surface. The metal shield layer 504 and the mounting terminal 505 are electrically connected to the wiring layer of the wiring board 501 through interlayer connection via conductors 506, respectively.
　ビア導体５０６は、配線基板５０１に設けられた樹脂層５０３にレーザー加工により形成されたビアホールに、デスミア処理が施された後、ＡｇやＣｕなどを含む導体ペーストが充填されたり、ビアフィルめっきが施されることにより形成される。このように、レーザー加工を用いて樹脂層５０３にビアホールが形成される場合、レーザーの出力調整が煩雑であり、ビアホールの形成精度にばらつきが生じることが問題となっている。また、ビア導体５０６は、複数の工程を経て樹脂層５０３に形成されるため、モジュールの製造コストの増大を招くと共に、モジュールの製造時間の短縮化を図る上で妨げとなっていた。また、レーザー加工により樹脂層５０３に形成されたビアホールにデスミア処理が施される際の薬液や、ビアフィルめっきが施される際の薬液が、樹脂層５０３や配線基板５０１を浸食するという問題があった。 The via conductor 506 is filled with a conductor paste containing Ag, Cu, or the like after a desmear treatment is performed on a via hole formed by laser processing on the resin layer 503 provided on the wiring substrate 501 or via fill plating is performed. Is formed. Thus, when a via hole is formed in the resin layer 503 using laser processing, there is a problem that laser output adjustment is complicated and variations in the formation accuracy of the via hole occur. Further, since the via conductor 506 is formed in the resin layer 503 through a plurality of steps, it causes an increase in the manufacturing cost of the module and hinders a reduction in the manufacturing time of the module. In addition, there is a problem that the chemical solution when the desmear treatment is performed on the via hole formed in the resin layer 503 by laser processing or the chemical solution when the via fill plating is performed erodes the resin layer 503 and the wiring substrate 501. It was.
　そこで、近年、図１４に示すように、層間接続導体を形成する柱状の複数の接続端子６０１が連結体６０２に一体形成されて成る端子集合体６００を、通常の表面実装技術を用いて配線基板５０１に実装し、ビア導体５０６に換えて接続端子６０１によりモジュールの層間接続導体を形成することにより、モジュールの製造コストの低減を図ると共に、モジュールの製造時間の短縮を図る試みがなされている（例えば特許文献２参照）。すなわち、レーザー加工を含む複数の工程を経て樹脂層５０３にビア導体５０６を形成するときに実行されていた、レーザーの出力調整や、デスミア処理やめっき処理などの薬液を用いた処理が不要となり、通常の表面実装技術を用いて層間接続導体を備えるモジュールを製造することができる。なお、図１４は従来の端子集合体の一例を示す図である。 Therefore, in recent years, as shown in FIG. 14, a terminal assembly 600 in which a plurality of columnar connection terminals 601 forming an interlayer connection conductor are integrally formed with a coupling body 602 is formed by using a normal surface mounting technique. Attempts have been made to reduce the manufacturing cost of the module and reduce the manufacturing time of the module by mounting it on 501 and forming the interlayer connection conductor of the module by the connection terminal 601 instead of the via conductor 506 ( For example, see Patent Document 2). That is, there is no need for laser output adjustment, treatment using a chemical solution such as desmear treatment or plating treatment, which has been performed when forming the via conductor 506 in the resin layer 503 through a plurality of steps including laser processing, A module having an interlayer connection conductor can be manufactured by using a normal surface mounting technique. FIG. 14 shows an example of a conventional terminal assembly.
国際公開２００５／０７８７９６号（段落００１７～００２５，００３５、図１、要約書など）International Publication No. 2005/078796 (paragraphs 0017-0025,0035, FIG. 1, abstract, etc.) 特開２００８－１６７２９号公報（段落００１５～００１７、図４など）JP 2008-16729 A (paragraphs 0015 to 0017, FIG. 4, etc.)
　ところで、図１４に示す端子集合体６００は、Ｃｕから成る材料がエッチング加工、削り出し加工、またはプレス加工されることにより、柱状の複数の接続端子６０１および各接続端子６０１を連結する連結体６０２が一体形成されて製造される。接続端子６０１がエッチング加工により連結体６０２に一体形成される場合には、接続端子６０１の根元部分と先端部分とでエッチングの進み具合が異なるため、各接続端子６０１の形状にばらつきが生じる。 By the way, the terminal assembly 600 shown in FIG. 14 includes a plurality of columnar connection terminals 601 and a connection body 602 that connects the connection terminals 601 by etching, cutting, or pressing a material made of Cu. Are manufactured integrally. When the connection terminal 601 is integrally formed with the connecting body 602 by etching, the progress of the etching differs between the base portion and the tip portion of the connection terminal 601, so that the shape of each connection terminal 601 varies.
　また、近年、携帯電話や携帯情報端末などの通信携帯端末の小型化が進むのに伴い、通信携帯端末に搭載されるモジュールの小型化が進み、モジュールに直径が数十μｍ～数百μｍの層間接続導体を形成することが要求されている。ところが、Ｃｕは延性が大きく伸びやすいため、切削や研削されるときにばりが発生しやすく、数μｍ～数μｍの加工精度で、切削加工や研削加工により複数の接続端子６０１を連結体６０２に精度よく一体形成するのは困難である。 In recent years, with the progress of miniaturization of mobile communication terminals such as mobile phones and portable information terminals, the miniaturization of modules mounted on communication mobile terminals has progressed, and the modules have diameters of several tens to several hundreds of micrometers. It is required to form an interlayer connection conductor. However, since Cu is highly ductile and easily stretched, burrs are easily generated when it is cut or ground, and a plurality of connection terminals 601 are connected to the coupling body 602 by cutting or grinding with a processing accuracy of several μm to several μm. It is difficult to integrally form with high accuracy.
　また、端子集合体６００が、ＬＴＣＣやプリント基板などにより形成される配線基板５０１に実装されて樹脂層により封止された後、接続端子６０１の先端が樹脂層の表面に露出するまで、端子集合体６００を封止する樹脂層および端子集合体６００の連結体６０２が研削や研磨されて、端子集合体６００から連結体６０２が除去されることにより、モジュールの層間接続導体が接続端子６０１により形成される。そして、樹脂層の表面に露出する接続端子６０１の先端面により、モジュールの外部接続用の端子が形成される。 Further, after the terminal assembly 600 is mounted on the wiring substrate 501 formed of LTCC or a printed circuit board and sealed with a resin layer, the terminal assembly 600 is exposed until the tip of the connection terminal 601 is exposed on the surface of the resin layer. The connecting layer 602 of the module is formed by the connection terminals 601 by grinding and polishing the resin layer for sealing the body 600 and the connection body 602 of the terminal assembly 600 and removing the connection body 602 from the terminal assembly 600. Is done. And the terminal for external connection of a module is formed of the front end surface of the connection terminal 601 exposed on the surface of the resin layer.
　ところが、接続端子６０１を形成するＣｕは延性が大きく伸びやすいため、端子集合体６００から連結体６０２が研削または研磨されることで除去されるときに、樹脂層の表面に露出する各接続端子６０１の先端部分にばりが形成されやすい。そのため、各接続端子６０１の先端は、樹脂層の表面に露出してモジュールの外部接続用の端子として機能するが、接続端子６０１の先端部分にばりが形成されることにより、形成されたばりにより各接続端子６０１が短絡するおそれがある。したがって、接続端子６０１の先端部分にばりが形成されるおそれがあるため、配線基板５０１に実装される複数の接続端子６０１間の距離を広げなければならず、複数の接続端子６０１を配線基板５０１に近接配置することにより、各接続端子６０１（層間接続導体）の端子間距離を縮めてモジュールの小型化を図る上で妨げとなっている。 However, since Cu forming the connection terminal 601 is highly ductile and easily stretched, each connection terminal 601 exposed on the surface of the resin layer when the connecting body 602 is removed from the terminal assembly 600 by grinding or polishing. A flash is likely to be formed at the tip portion of the. Therefore, the tip of each connection terminal 601 is exposed on the surface of the resin layer and functions as a terminal for external connection of the module. However, a flash is formed at the tip of the connection terminal 601, so that Each connection terminal 601 may be short-circuited. Therefore, there is a possibility that a flash is formed at the tip of the connection terminal 601. Therefore, the distance between the plurality of connection terminals 601 mounted on the wiring board 501 must be increased, and the plurality of connection terminals 601 are connected to the wiring board 501. By disposing them close to each other, the distance between the terminals of each connection terminal 601 (interlayer connection conductor) is shortened, which hinders miniaturization of the module.
　また、接続端子６０１を形成するＣｕの線膨張係数（約１７ｐｐｍ／℃）の大きさは、配線基板５０１を形成するセラミック材料や、例えばＦＲ－４規格の樹脂材料の線膨張係数の大きさと比較して非常に大きい。したがって、Ｃｕから成る接続端子６０１により層間接続導体が形成されたモジュールは、加熱されたときに配線基板５０１および接続端子６０１が熱膨脹することにより配線基板５０１と接続端子６０１との間に生じる応力が大きく、配線基板５０１および接続端子６０１の接続部分が破損するおそれがあり、モジュールの信頼性の低下を招いている。 Further, the magnitude of the linear expansion coefficient (about 17 ppm / ° C.) of Cu forming the connection terminal 601 is compared with the magnitude of the linear expansion coefficient of the ceramic material forming the wiring substrate 501 or the resin material of the FR-4 standard, for example. And very big. Therefore, in a module in which an interlayer connection conductor is formed by the connection terminal 601 made of Cu, the stress generated between the wiring board 501 and the connection terminal 601 is caused by thermal expansion of the wiring board 501 and the connection terminal 601 when heated. The connection portion between the wiring board 501 and the connection terminal 601 is likely to be damaged, resulting in a decrease in module reliability.
　この発明は、上記した課題に鑑みてなされたものであり、Ｃｕ－Ｆｅ合金により形成された柱状の接続端子を配線基板に実装して層間接続導体を形成することにより信頼性の高いモジュールを提供することを目的とする。 The present invention has been made in view of the above-described problems, and provides a highly reliable module by forming an interlayer connection conductor by mounting columnar connection terminals formed of a Cu-Fe alloy on a wiring board. The purpose is to do.
　上記した目的を達成するために、本発明のモジュールは、配線基板の少なくとも一方主面に電子部品が実装されたモジュールにおいて、前記配線基板の一方主面に実装されて層間接続導体を形成する柱状の接続端子と、前記配線基板の一方主面に電子部品および前記接続端子を被覆して設けられた第１樹脂層とを備え、前記接続端子はＣｕ－Ｆｅ合金により形成されており、その他方端部が前記配線基板に接続されていることを特徴としている（請求項１）。 In order to achieve the above object, the module of the present invention is a module in which an electronic component is mounted on at least one main surface of a wiring board, and is formed in a columnar shape that is mounted on one main surface of the wiring board to form an interlayer connection conductor. And a first resin layer provided so as to cover the electronic component and the connection terminal on one main surface of the wiring board, the connection terminal being formed of a Cu—Fe alloy, An end portion is connected to the wiring board (claim 1).
　また、前記接続端子は、前記他方端部が前記配線基板上に形成されたランド電極に導電性接合材により接合されて実装されており、前記導電性接合材は、前記他方端部の端面および外周面を鍔状に覆って形成されているとよい（請求項２）。 In addition, the connection terminal is mounted by bonding the other end to a land electrode formed on the wiring board with a conductive bonding material, and the conductive bonding material includes an end surface of the other end and It is preferable that the outer peripheral surface be formed in a bowl shape (claim 2).
　また、前記接続端子は、前記他方端部の径が前記一方端部の径よりも大径に形成されているのがよい（請求項３)。 Further, it is preferable that the connection terminal is formed such that the diameter of the other end is larger than the diameter of the one end.
　また、前記接続端子は、前記一方端部の径が前記他方端部の径よりも大径に形成されていてもよい（請求項４）。 Further, the connection terminal may be formed such that a diameter of the one end is larger than a diameter of the other end (Claim 4).
　また、前記配線基板の他方主面に電子部品がさらに実装されているとよい（請求項５)。 Further, it is preferable that an electronic component is further mounted on the other main surface of the wiring board (Claim 5).
　また、前記配線基板の他方主面に電子部品を被覆して設けられた第２樹脂層をさらに備えていてもよい（請求項６）。 Further, the second main surface of the wiring board may further include a second resin layer provided so as to cover an electronic component (Claim 6).
　また、前記配線基板の他方主面に前記接続端子がさらに実装されており、前記第２樹脂層に、前記他方主面に実装された前記接続端子に接続されるように、電子部品がさらに実装されているとよい（請求項７）。 The connection terminal is further mounted on the other main surface of the wiring board, and an electronic component is further mounted on the second resin layer so as to be connected to the connection terminal mounted on the other main surface. (Claim 7).
　また、本発明のモジュールの製造方法は、層間接続導体を形成する柱状の接続端子および電子部品を配線基板上に実装し樹脂封止してなるモジュールの製造方法において、Ｃｕ－Ｆｅ合金により形成された前記接続端子を準備する準備工程と、前記配線基板の一方主面に、電子部品を実装すると共に前記接続端子の他方端部が前記配線基板に接続されるように前記接続端子を実装する実装工程と、前記配線基板の一方主面に実装された電子部品および前記接続端子を樹脂層により封止する封止工程と、前記第１樹脂層および前記接続端子の一方端部を研磨または研削する工程とを備えることを特徴としている（請求項８）。 The module manufacturing method of the present invention is a module manufacturing method in which a columnar connection terminal and an electronic component for forming an interlayer connection conductor are mounted on a wiring board and sealed with a resin. A preparation step of preparing the connection terminal, and mounting the connection terminal so that an electronic component is mounted on one main surface of the wiring board and the other end of the connection terminal is connected to the wiring board. A process, a sealing step of sealing the electronic component mounted on one main surface of the wiring board and the connection terminal with a resin layer, and polishing or grinding one end of the first resin layer and the connection terminal. And a process. (Claim 8).
　請求項１の発明によれば、配線基板の一方主面に電子部品と共に実装されて、層間接続導体を形成する柱状の接続端子は、その他方端部が配線基板に接続されている。 According to the first aspect of the present invention, the other end of the columnar connection terminal that is mounted together with the electronic component on one main surface of the wiring board and forms the interlayer connection conductor is connected to the wiring board.
　そして、接続端子はＣｕ－Ｆｅ合金により形成されており、Ｃｕ－Ｆｅ合金は、線膨張係数が約１７ｐｐｍ／℃のＣｕに、線膨張係数がＣｕよりも低い約１２ｐｐｍ／℃であるＦｅが添加されることにより線膨張係数がＣｕよりも低く、Ｃｕ－Ｆｅ合金から成る接続端子により形成される層間接続導体の線膨張係数と、セラミック材料やＦＲ－４規格の樹脂材料で形成される配線基板の線膨張係数との差を小さくすることができる。したがって、Ｃｕ－Ｆｅ合金により形成された柱状の接続端子が配線基板に実装されて層間接続導体が形成されることにより、加熱されたときに配線基板および接続端子が熱膨脹することにより配線基板と接続端子との間に生じる応力を抑制することができるので、例えば、配線基板および接続端子の接続部分が破損するのを防止することができ、信頼性の高いモジュールを提供することができる。 The connection terminal is formed of a Cu—Fe alloy. In the Cu—Fe alloy, Fe having a linear expansion coefficient of about 12 ppm / ° C. is added to Cu having a linear expansion coefficient of about 17 ppm / ° C. As a result, the linear expansion coefficient of the interlayer connection conductor formed by the connection terminal made of a Cu—Fe alloy is lower than that of Cu, and the wiring board formed of a ceramic material or a resin material of FR-4 standard The difference from the linear expansion coefficient can be reduced. Therefore, the columnar connection terminals formed of Cu—Fe alloy are mounted on the wiring board to form the interlayer connection conductor, so that the wiring board and the connection terminals are thermally expanded when heated, thereby being connected to the wiring board. Since the stress generated between the terminal and the terminal can be suppressed, for example, the connection portion between the wiring board and the connection terminal can be prevented from being damaged, and a highly reliable module can be provided.
　また、接続端子は、例えば、所定の径および断面形状を有し、Ｃｕ－Ｆｅ合金から成る線材が所定の長さで切断されることにより、所望の径および長さで形成される。Ｃｕ－Ｆｅ合金は、ＣｕにＦｅが添加されることによりＣｕよりも硬度が高く、切削性や研削性に優れているため、線材が切断されて接続端子が形成される際に、接続端子の切断端にばりが形成されるのが抑制される。したがって、配線基板に複数の接続端子が近接配置されて実装されても、各接続端子が切断端に形成されたばりにより短絡するのを防止することができるので、各接続端子が端子間距離を縮めて配線基板に実装されることにより小型化が図られたモジュールを提供することができる。 Further, the connection terminal has, for example, a predetermined diameter and a cross-sectional shape, and is formed with a desired diameter and length by cutting a wire material made of a Cu—Fe alloy with a predetermined length. The Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu, and is excellent in machinability and grindability. Therefore, when the connection terminal is formed by cutting the wire, The formation of flash at the cut end is suppressed. Therefore, even if a plurality of connection terminals are mounted close to each other on the wiring board, each connection terminal can be prevented from being short-circuited by the flash formed at the cut end, so that each connection terminal can reduce the distance between the terminals. A module that is reduced in size by being contracted and mounted on a wiring board can be provided.
　請求項２の発明によれば、接続端子は、その他方端部が配線基板上に形成されたランド電極に導電性接合材により接合されて実装されており、導電性接合材は、接続端子の他方端部の端面および外周面を鍔状に覆って形成されている。したがって、接続端子の他方端部の外側に鍔状に広がった導電性接合材が第１樹脂層に引っ掛かるので、接続端子が第１樹脂層からの抜け落ちるのを防止することができる。 According to the second aspect of the present invention, the connection terminal is mounted by being bonded to the land electrode formed at the other end on the wiring board by the conductive bonding material. The end surface and the outer peripheral surface of the other end portion are formed in a bowl shape. Accordingly, since the conductive bonding material spreading like a bowl on the outside of the other end of the connection terminal is caught by the first resin layer, the connection terminal can be prevented from falling off from the first resin layer.
　請求項３の発明によれば、接続端子は、配線基板に接続される他方端部の径が一方端部の径よりも大径に形成されて、第１樹脂層に楔状に設けられており、配線基板に接続されている接続端子の他方端部の大径部分が第１樹脂層に引っ掛かるので、接続端子が第１樹脂層から抜け落ちるのを確実に防止することができる。 According to the invention of claim 3, the connection terminal is formed in a wedge shape in the first resin layer such that the diameter of the other end connected to the wiring board is larger than the diameter of the one end. Since the large-diameter portion of the other end of the connection terminal connected to the wiring board is caught by the first resin layer, it is possible to reliably prevent the connection terminal from falling off the first resin layer.
　請求項４の発明によれば、接続端子は、第１樹脂層の表面に露出して外部接続用の端子を形成する一方端部の径が他方端部の径よりも大径に形成されているため、第１樹脂層の表面に大面積の外部接続用の端子を形成することができる。したがって、モジュールがマザー基板などに実装される際の電気的接続性および接合強度を向上することができる。また、大面積の外部接続用の端子および層間接続導体が接続端子により一体形成されているため、第１樹脂層の表面に露出する接続端子の一方端部に、スクリーン印刷やフォトリソグラフィなどにより大面積の外部接続用の端子を形成する構成と比較すると、外部接続用の端子と層間接続導体との間の接続強度を向上することができる。 According to the invention of claim 4, the connecting terminal is formed on the surface of the first resin layer so that the diameter of one end part forming the terminal for external connection is larger than the diameter of the other end part. Therefore, a large area terminal for external connection can be formed on the surface of the first resin layer. Therefore, electrical connectivity and bonding strength when the module is mounted on a mother board or the like can be improved. In addition, since the external connection terminal and the interlayer connection conductor having a large area are integrally formed by the connection terminal, one end of the connection terminal exposed on the surface of the first resin layer is large by screen printing or photolithography. Compared with a configuration in which a terminal for external connection having an area is formed, the connection strength between the terminal for external connection and the interlayer connection conductor can be improved.
　請求項５の発明によれば、配線基板の他方主面に電子部品がさらに実装されることにより、電子部品の実装密度が高められたモジュールを提供することができる。 According to the invention of claim 5, it is possible to provide a module in which the mounting density of electronic components is increased by further mounting electronic components on the other main surface of the wiring board.
　請求項６の発明によれば、配線基板の他方主面に電子部品を被覆して第２樹脂層が設けられているため、配線基板の他方主面に実装された電子部品を第２樹脂層により保護する
ことができる。 According to the invention of claim 6, since the second resin layer is provided by covering the other main surface of the wiring board with the electronic component, the electronic component mounted on the other main surface of the wiring board is replaced with the second resin layer. Can be protected.
　請求項７の発明によれば、配線基板の他方主面に接続端子がさらに実装されており、第２樹脂層に、他方主面に実装された接続端子に接続されるように、電子部品がさらに実装されることにより、電子部品の実装密度がさらに高められた実用的なモジュールを提供することができる。 According to the invention of claim 7, the connection terminal is further mounted on the other main surface of the wiring board, and the electronic component is connected to the second resin layer so as to be connected to the connection terminal mounted on the other main surface. Further, by mounting, it is possible to provide a practical module in which the mounting density of electronic components is further increased.
　請求項８の発明によれば、Ｃｕ－Ｆｅ合金により形成された接続端子が準備されるが、接続端子は、例えば、所定の径および断面形状を有し、Ｃｕ－Ｆｅ合金から成る線材が所定の長さで切断されることにより、所望の径および長さで準備される。Ｃｕ－Ｆｅ合金は、ＣｕにＦｅが添加されることによりＣｕよりも硬度が高く、切削性や研削性に優れているため、線材が切断されて接続端子が形成される際に、接続端子の切断端にばりが形成されるのが抑制されるので、非常に高精度な形状を有する柱状の接続端子を準備することができる。 According to the invention of claim 8, a connection terminal formed of a Cu—Fe alloy is prepared. The connection terminal has, for example, a predetermined diameter and a cross-sectional shape, and a wire made of a Cu—Fe alloy is predetermined. Are prepared with a desired diameter and length. The Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu, and is excellent in machinability and grindability. Therefore, when the connection terminal is formed by cutting the wire, Since it is suppressed that the flash is formed at the cut end, it is possible to prepare a columnar connection terminal having a very high precision shape.
　また、配線基板の一方主面に、電子部品が実装されると共に接続端子の他方端部が配線基板に接続されるように接続端子が実装され、配線基板の一方主面に実装された電子部品および接続端子が第１樹脂層により封止される。そして、第１樹脂層および接続端子の一方端部が研磨または研削されることにより、第１樹脂層の表面に接続端子の一方端部が露出するが、接続端子を形成するＣｕ－Ｆｅ合金は硬度が高く、切削性や研削性に優れているため、接続端子の一方端部が研磨または研削される際に該一方端部にばりが形成されるのが抑制される。したがって、各接続端子の一方端部は、第１樹脂層の表面に露出してモジュールの外部接続用の端子として機能するが、第１樹脂層の表面に露出する接続端子の一方端部に形成されたばりにより各接続端子が短絡するのが防止されるため、Ｃｕ－Ｆｅ合金により形成された柱状の接続端子が配線基板に実装されて層間接続導体が形成されることにより信頼性の高いモジュールを提供することができる。 In addition, an electronic component is mounted on one main surface of the wiring board, and an electronic component is mounted on the one main surface of the wiring board so that the other end of the connection terminal is connected to the wiring board. The connection terminals are sealed with the first resin layer. Then, by polishing or grinding one end of the first resin layer and the connection terminal, one end of the connection terminal is exposed on the surface of the first resin layer, but the Cu—Fe alloy forming the connection terminal is Since the hardness is high and the machinability and grindability are excellent, it is possible to suppress the formation of flash at one end of the connection terminal when the one end is polished or ground. Accordingly, one end of each connection terminal is exposed on the surface of the first resin layer and functions as a terminal for external connection of the module, but is formed on one end of the connection terminal exposed on the surface of the first resin layer. Since each connection terminal is prevented from being short-circuited by the emitted flash, a column-shaped connection terminal formed of a Cu—Fe alloy is mounted on a wiring board to form an interlayer connection conductor, thereby providing a highly reliable module Can be provided.
　また、接続端子を形成するＣｕ－Ｆｅ合金は、線膨張係数がＣｕよりも低く、Ｃｕ－Ｆｅ合金から成る接続端子により形成される層間接続導体の線膨張係数と、配線基板の線膨張係数との差を小さくすることができる。したがって、Ｃｕ－Ｆｅ合金により形成された柱状の接続端子が配線基板に実装されて層間接続導体が形成されることにより、加熱されたときに配線基板および接続端子が熱膨脹することにより配線基板と接続端子との間に生じる応力を抑制することができるので、例えば、配線基板および接続端子の接続部分が破損するのを防止することができ、信頼性の高いモジュールを提供することができる。 Further, the Cu—Fe alloy forming the connection terminal has a lower linear expansion coefficient than Cu, and the linear expansion coefficient of the interlayer connection conductor formed by the connection terminal made of the Cu—Fe alloy, and the linear expansion coefficient of the wiring board Can be reduced. Therefore, the columnar connection terminals formed of Cu—Fe alloy are mounted on the wiring board to form the interlayer connection conductor, so that the wiring board and the connection terminals are thermally expanded when heated, thereby being connected to the wiring board. Since the stress generated between the terminal and the terminal can be suppressed, for example, the connection portion between the wiring board and the connection terminal can be prevented from being damaged, and a highly reliable module can be provided.
　また、接続端子がＣｕ－Ｆｅ合金により形成されることにより、研磨または研削する工程において、接続端子の一方端部にばりが形成されるのが抑制されて、形成されたばりにより各接続端子が短絡するのが防止されるので、配線基板に実装される複数の接続端子間の距離を縮めることができ、各接続端子が配線基板に近接配置されて実装され、端子間の距離が縮められることにより、小型化が図られたモジュールを提供することができる。 Further, since the connection terminal is formed of a Cu—Fe alloy, it is possible to suppress the formation of a flash at one end of the connection terminal in the polishing or grinding process. Since short-circuiting is prevented, the distance between the multiple connection terminals mounted on the wiring board can be reduced, and each connection terminal is mounted close to the wiring board and the distance between the terminals is reduced. Thus, a module with a reduced size can be provided.
本発明の第１実施形態にかかるモジュールに用いる端子集合体を示す図である。It is a figure which shows the terminal assembly used for the module concerning 1st Embodiment of this invention. 本発明の第１実施形態にかかるモジュールに用いる端子集合体の底面図である。It is a bottom view of the terminal assembly used for the module concerning a 1st embodiment of the present invention. 本発明の第１実施形態にかかるモジュールの製造方法を示す図である。It is a figure which shows the manufacturing method of the module concerning 1st Embodiment of this invention. 本発明の第１実施形態にかかるモジュールの要部拡大図である。It is a principal part enlarged view of the module concerning 1st Embodiment of this invention. 本発明の第２実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 2nd Embodiment of this invention. 本発明の第３実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 3rd Embodiment of this invention. 本発明の第４実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 4th Embodiment of this invention. 本発明の第５実施形態にかかるモジュールを示す図である。It is a figure which shows the module concerning 5th Embodiment of this invention. 接続端子の変形例を示す要部拡大図である。It is a principal part enlarged view which shows the modification of a connection terminal. 端子集合体の変形例を示す図である。It is a figure which shows the modification of a terminal assembly. 端子集合体の変形例を示す図である。It is a figure which shows the modification of a terminal assembly. 従来のモジュールの一例を示す図である。It is a figure which shows an example of the conventional module. 従来の端子集合体の一例を示す図である。It is a figure which shows an example of the conventional terminal assembly.
　＜第１実施形態＞
　本発明の第１実施形態にかかるモジュールについて、図１～図４を参照して説明する。図１は本発明の第１実施形態にかかるモジュールに用いる端子集合体を示す図である。図２は本発明の第１実施形態にかかるモジュールに用いる端子集合体の底面図である。図３は本発明の第１実施形態にかかるモジュールの製造方法を示す図であり、（ａ）～（ｄ）はそれぞれ異なる工程を示す。図４は本発明の第１実施形態にかかるモジュールの要部拡大図である。 <First Embodiment>
The module according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing a terminal assembly used in a module according to the first embodiment of the present invention. FIG. 2 is a bottom view of the terminal assembly used in the module according to the first embodiment of the present invention. FIG. 3 is a diagram showing a module manufacturing method according to the first embodiment of the present invention, and (a) to (d) show different processes. FIG. 4 is an enlarged view of a main part of the module according to the first embodiment of the present invention.
　この実施形態で説明するモジュールの製造方法では、配線基板１０１の少なくとも一方主面に各種の電子部品１０２が実装されることにより、通信携帯端末のマザー基板などに実装される、Ｂｌｕｅｔｏｏｔｈ（登録商標）モジュールおよび無線ＬＡＮモジュールなどの各種の通信モジュール、アンテナスイッチモジュール、電源モジュールなどの高周波用回路モジュールが製造される。 In the module manufacturing method described in this embodiment, Bluetooth (registered trademark) is mounted on a mother board of a communication portable terminal by mounting various electronic components 102 on at least one main surface of the wiring board 101. Various communication modules such as modules and wireless LAN modules, high-frequency circuit modules such as antenna switch modules and power supply modules are manufactured.
　（端子集合体の製造方法および端子集合体）
　図３（ｄ）に示すモジュール１００の層間接続導体を形成する柱状の複数の接続端子１１を備え、モジュール１００の配線基板１０１の少なくとも一方主面に実装される端子集合体１０について説明する。図１および図２に示すように、端子集合体１０は、配線基板１０１に実装されることによりモジュール１００の層間接続導体を形成する柱状の接続端子１１および板状の支持体１２から成り、複数の接続端子１１が支持体１２の一方面の所定位置に支持層１３を介して支持されている。 (Manufacturing method of terminal assembly and terminal assembly)
A terminal assembly 10 that includes a plurality of columnar connection terminals 11 that form interlayer connection conductors of the module 100 shown in FIG. As shown in FIG. 1 and FIG. 2, the terminal assembly 10 includes a columnar connection terminal 11 and a plate-like support 12 that form an interlayer connection conductor of the module 100 by being mounted on a wiring board 101. The connection terminal 11 is supported at a predetermined position on one surface of the support 12 via a support layer 13.
　接続端子１１は、Ｃｕに０．１％～２０％の割合でＦｅが添加されたＣｕ－Ｆｅ合金により形成される。なお、ＣｕにＦｅが混合されて硬度が増したＣｕ－Ｆｅ合金により接続端子１１を形成することで、接続端子１１が切削加工や研削加工、研磨等されるときにばり等が生じることを抑制することができるので、接続端子１１が切削や研削、研磨等されたときの加工精度を向上することができる。 The connection terminal 11 is formed of a Cu—Fe alloy in which Fe is added to Cu at a ratio of 0.1% to 20%. In addition, by forming the connection terminal 11 from a Cu—Fe alloy in which Fe is mixed with Cu and the hardness is increased, it is possible to suppress the occurrence of flash or the like when the connection terminal 11 is cut, ground, polished, or the like. Therefore, the processing accuracy when the connection terminal 11 is cut, ground, polished, or the like can be improved.
　また、接続端子１１は、例えば次のようにして形成することができる。すなわち、所定の直径を有し、円形状または多角形状の断面形状を有するＣｕ－Ｆｅ合金から成る線材が、所定の長さでせん断加工されることで、接続端子１１は、所定の長さで円柱状または多角柱状に形成される。 Further, the connection terminal 11 can be formed as follows, for example. That is, the connection terminal 11 is formed with a predetermined length by shearing a wire made of a Cu—Fe alloy having a predetermined diameter and a circular or polygonal cross-sectional shape with a predetermined length. It is formed in a cylindrical shape or a polygonal column shape.
　なお、接続端子１１の切削性や研削性、研磨精度の向上を図ると共に、接続端子１１に対するはんだや金属ろうなどの導電性接合材の濡れ状態や、接続端子１１にめっきが施されたときのめっき状態を劣化させないために、Ｃｕに１～１０％のＦｅが添加されたＣｕ－Ｆｅ合金を採用するのがより好ましい。 In addition, while improving the machinability, grindability, and polishing accuracy of the connection terminal 11, the wet state of the conductive bonding material such as solder or metal brazing to the connection terminal 11, or when the connection terminal 11 is plated. In order not to deteriorate the plating state, it is more preferable to employ a Cu—Fe alloy in which 1 to 10% Fe is added to Cu.
　また、支持体１２を形成する板状部材の材質はどのようなものであってもよいが、例えば、端子集合体１０がモジュール１００の配線基板１０１にはんだにより実装される場合には、リフローの際の加熱により変形が生じない材質の板状部材により支持体１２を形成するとよい。 The material of the plate-like member that forms the support 12 may be any material. For example, when the terminal assembly 10 is mounted on the wiring board 101 of the module 100 by soldering, The support 12 may be formed of a plate-like member made of a material that does not deform due to heating.
　また、支持体１２の支持層１３は、液状の接着剤や粘着剤を板状部材の一方面に塗布して形成してもよいし、シート状の接着シートや粘着シートを板状部材の一方面に張り付けて形成してもよい。また、支持層１３の厚みは、モジュール１００の配線基板１０１に接続端子１１が実装されたときの接続端子１１の高さに誤差が生じるのを防止し、接続端子１１が傾いたりするのを防止するために、できるだけ薄い方がよく、支持層１３は、１００μｍ以下、望ましくは５０μｍ以下の厚みで形成するとよい。 Further, the support layer 13 of the support 12 may be formed by applying a liquid adhesive or pressure-sensitive adhesive to one surface of the plate-shaped member, or a sheet-shaped adhesive sheet or pressure-sensitive adhesive sheet may be formed on one side of the plate-shaped member. You may stick to the direction and form. Further, the thickness of the support layer 13 prevents an error from occurring in the height of the connection terminal 11 when the connection terminal 11 is mounted on the wiring substrate 101 of the module 100, and prevents the connection terminal 11 from tilting. In order to achieve this, it is preferable that the support layer 13 is as thin as possible.
　また、支持層１３を形成する接着剤または粘着剤として、エポキシ系やアクリル系のものを用いることができるが、例えば、所定温度以上に加熱されると軟化し、冷却されると硬化する性質を有する粘着剤により支持層１３を形成するとよい。このような性質を有する粘着剤により支持層１３を形成することにより、端子集合体１０が保管された状態では、支持体１２の支持層１３が硬化した状態であるため、保管状態の端子集合体１０の支持体１２の支持層１３にごみや埃が付着するのを防止することができる。 In addition, as the adhesive or pressure-sensitive adhesive forming the support layer 13, an epoxy type or acrylic type can be used. For example, the adhesive layer softens when heated to a predetermined temperature or more and hardens when cooled. It is preferable to form the support layer 13 with an adhesive. By forming the support layer 13 with an adhesive having such properties, the terminal assembly 10 in the storage state is in a state where the support layer 13 of the support 12 is cured in the state in which the terminal assembly 10 is stored. It is possible to prevent dust and dirt from adhering to the support layer 13 of the 10 support bodies 12.
　また、上記したように、端子集合体１０を各モジュール１００に対応するように個別に製造してもよいが、複数の端子集合体１０の集合体を形成した後に、個々の端子集合体１０に個片化することにより端子集合体１０を製造してもよい。 Further, as described above, the terminal aggregates 10 may be individually manufactured so as to correspond to the respective modules 100. However, after forming the aggregates of the plurality of terminal aggregates 10, the individual terminal aggregates 10 are The terminal assembly 10 may be manufactured by dividing into pieces.
　（モジュールの製造方法）
　層間接続導体を形成する柱状の接続端子１１および電子部品１０２が配線基板１０１に実装され樹脂封止されて成るモジュール１００の製造方法について説明する。 (Module manufacturing method)
A method of manufacturing the module 100 in which the columnar connection terminals 11 and the electronic components 102 forming the interlayer connection conductor are mounted on the wiring substrate 101 and sealed with resin will be described.
　まず、モジュール１００の層間接続導体を形成する柱状の複数の接続端子１１が支持体１２に支持されて成る端子集合体１０が準備される（準備工程）。そして、図３（ａ）に示すように、端子集合体１０と、各種のチップ部品やＩＣなどの電子部品１０２とが、配線基板１０１の一方主面の所定位置にはんだリフローや超音波振動接合などの一般的な表面実装技術により実装される（実装工程）。なお、端子集合体１０は、接続端子１１の他方端部が配線基板１０１に接続されるように配線基板１０１に実装される。また、接続端子１１および電子部品１０２を導電性接着剤を用いて配線基板１０１に実装してもよい。 First, a terminal assembly 10 is prepared in which a plurality of columnar connection terminals 11 forming interlayer connection conductors of the module 100 are supported by a support 12 (preparation step). Then, as shown in FIG. 3A, the terminal assembly 10 and various electronic components 102 such as chip components and ICs are solder reflowed and ultrasonic vibration bonded at a predetermined position on one main surface of the wiring board 101. It is mounted by a general surface mounting technique such as (mounting process). The terminal assembly 10 is mounted on the wiring board 101 so that the other end of the connection terminal 11 is connected to the wiring board 101. Further, the connection terminal 11 and the electronic component 102 may be mounted on the wiring board 101 using a conductive adhesive.
　また、この実施形態では、図４に示すように、配線基板１０１の一方主面に、接続端子１１の断面積とほぼ同じ面積でランド電極１０１ａが設けられている。そして、接続端子１１は、はんだなどの導電性接合材Ｓが、接続端子１１の他方端部の端面および外周面を実装用電極１０１ａの外側に広がった状態で鍔状に覆ってランド電極１０１ａに実装されている。 Further, in this embodiment, as shown in FIG. 4, land electrodes 101 a are provided on one main surface of the wiring board 101 with substantially the same area as the cross-sectional area of the connection terminals 11. Then, the connection terminal 11 is covered with a conductive bonding material S such as solder so that the end surface and the outer peripheral surface of the other end of the connection terminal 11 are spread out on the outside of the mounting electrode 101a. Has been implemented.
　また、配線基板１０１は、この実施形態では、複数のセラミックグリーンシートが積層されて焼成されて成る多層セラミック基板である。セラミックグリーンシートは、アルミナおよびガラスなどの混合粉末が有機バインダおよび溶剤などと一緒に混合されたスラリーがシート化されたものであり、セラミックグリーンシートの所定位置に、レーザー加工などによりビアホールが形成され、形成されたビアホールにＡｇやＣｕなどを含む導体ペーストが充填されて層間接続用のビア導体が形成され、導体ペーストによる印刷により種々の電極パターンが形成される。その後、各セラミックグリーンシートを積層、圧着されることによりセラミック積層体が形成されて、約１０００℃前後の低い温度で、所謂、低温焼成されることにより配線基板１０１が形成される。 Further, in this embodiment, the wiring substrate 101 is a multilayer ceramic substrate formed by laminating and firing a plurality of ceramic green sheets. A ceramic green sheet is a sheet in which a mixed powder of alumina and glass is mixed with an organic binder and solvent. A via hole is formed at a predetermined position of the ceramic green sheet by laser processing or the like. The formed via hole is filled with a conductor paste containing Ag, Cu or the like to form a via conductor for interlayer connection, and various electrode patterns are formed by printing with the conductor paste. Thereafter, the ceramic green sheets are laminated and pressure-bonded to form a ceramic laminate, and the wiring substrate 101 is formed by so-called low-temperature firing at a low temperature of about 1000 ° C.
　このように、配線基板１０１には、内部配線パターン、端子集合体１０および電子部品１０２が実装される実装用電極および外部接続用電極などの種々の電極パターンが設けられているが、配線基板１０１は、樹脂やポリマー材料などを用いた、プリント基板、ＬＴＣＣ、アルミナ系基板、ガラス基板、複合材料基板、単層基板、多層基板などで形成することができ、モジュール１００の使用目的に応じて、適宜最適な材質を選択して配線基板１０１を形成すればよい。 As described above, the wiring board 101 is provided with various electrode patterns such as an internal wiring pattern, a mounting electrode on which the terminal assembly 10 and the electronic component 102 are mounted, and an external connection electrode. Can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc., using a resin or a polymer material. The wiring board 101 may be formed by selecting an optimal material as appropriate.
　次に、図３（ｂ）に示すように、配線基板１０１の一方主面に実装された端子集合体１０の支持体１２が接続端子１１から除去される。この実施形態では、接続端子１１は、その一方端部が接着または粘着により支持体１２の支持層１３に支持されており、支持体１２の支持層１３の接着力または粘着力を低下させることにより、支持体１２が接続端子１１から除去される。 Next, as shown in FIG. 3B, the support 12 of the terminal assembly 10 mounted on one main surface of the wiring board 101 is removed from the connection terminal 11. In this embodiment, one end of the connection terminal 11 is supported on the support layer 13 of the support 12 by adhesion or adhesion, and the adhesive force or adhesion of the support layer 13 of the support 12 is reduced. The support 12 is removed from the connection terminal 11.
　例えば、エポキシ系の熱硬化型の接着剤や粘着剤により支持層１３が形成されている場合には、支持層１３をガラス転移温度（Ｔｇ）以上に加熱することにより、支持層１３の接着力や粘着力を低下させて支持体１２を接続端子１１から除去するとよい。この場合、支持層１３の接着力や粘着力を低下させるために加熱する際に、端子集合体１０および電子部品１０２を配線基板１０１に接合するはんだが溶融しないように、支持層１３のガラス転移温度が、はんだの溶融温度である約２００℃以下であるのが望ましい。 For example, when the support layer 13 is formed of an epoxy-based thermosetting adhesive or pressure-sensitive adhesive, the adhesive strength of the support layer 13 is increased by heating the support layer 13 to a glass transition temperature (Tg) or higher. Alternatively, the support 12 may be removed from the connection terminal 11 by reducing the adhesive strength. In this case, the glass transition of the support layer 13 is prevented so that the solder that joins the terminal assembly 10 and the electronic component 102 to the wiring board 101 does not melt when heating to reduce the adhesive force or adhesive strength of the support layer 13. The temperature is desirably about 200 ° C. or less, which is the melting temperature of the solder.
　また、例えば、アクリル系の接着剤や粘着剤により支持層１３が形成されている場合には、アルカリ性界面活性剤や酢酸エチルなどを用いることで、支持層１３の接着力や粘着力を低下させて支持体１２を接続端子１１から除去するとよい。 Further, for example, when the support layer 13 is formed of an acrylic adhesive or pressure-sensitive adhesive, the adhesive force or pressure-sensitive adhesive force of the support layer 13 is reduced by using an alkaline surfactant or ethyl acetate. The support 12 may be removed from the connection terminal 11.
　続いて、図３（ｃ）に示すように、配線基板１０１の一方主面に樹脂が充填されることにより、配線基板１０１の一方主面に実装された電子部品１０２および端子集合体１０（接続端子１１）が第１樹脂層１０３により被覆されて封止される（封止工程）。第１樹脂層１０３は、エポキシ樹脂やフェノール樹脂、シアネート樹脂などの熱硬化性の樹脂に、酸化アルミニウムやシリカ（二酸化ケイ素）、二酸化チタンなどの無機フィラーが混合されて形成された複合樹脂により形成することができる。 Subsequently, as shown in FIG. 3C, the one main surface of the wiring board 101 is filled with resin, whereby the electronic component 102 and the terminal assembly 10 (connections) mounted on the one main surface of the wiring board 101 are connected. The terminal 11) is covered with the first resin layer 103 and sealed (sealing step). The first resin layer 103 is formed of a composite resin formed by mixing an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide with a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. can do.
　例えば、ＰＥＴフィルム上に複合樹脂を成型して半硬化させた樹脂シートを用いて第１樹脂層１０３を形成する場合には、所望の厚みを有するスペーサ（型）が周囲に配置された状態の配線基板１０１に樹脂シートを被せ、樹脂の厚みがスペーサの厚みになるように樹脂シートを加熱プレスした後、配線基板１０１をオーブンにより加熱して樹脂を硬化させることにより、所望の厚みを有する第１樹脂層１０３を形成することができる。なお、第１樹脂層１０３は、液状の樹脂を用いたポッティング技術やトランスファーモールド技術、コンプレッションモールド技術など、樹脂層を形成する一般的な成型技術を用いて形成すればよい。 For example, when the first resin layer 103 is formed using a resin sheet obtained by molding and semi-curing a composite resin on a PET film, a spacer (mold) having a desired thickness is arranged around After covering the wiring board 101 with a resin sheet and heat-pressing the resin sheet so that the thickness of the resin becomes the thickness of the spacer, the wiring board 101 is heated in an oven to cure the resin. One resin layer 103 can be formed. The first resin layer 103 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique.
　次に、図３（ｄ）に示すように、ローラブレード等により第１樹脂層１０３の表面および接続端子１１の一方端部が研削されたり研磨されることにより、不要な樹脂が除去されて、第１樹脂層１０３の表面が平坦化されると共に、接続端子１１の一方端部が第１樹脂層１０３の表面に露出する（研磨または研削工程）。これにより、第１樹脂層１０３の表面に露出する接続端子１１の一方端部により外部接続用の端子（ランド）が形成されたモジュール１００が完成する。 Next, as shown in FIG. 3D, unnecessary resin is removed by grinding or polishing the surface of the first resin layer 103 and one end of the connection terminal 11 with a roller blade or the like. The surface of the first resin layer 103 is flattened, and one end of the connection terminal 11 is exposed on the surface of the first resin layer 103 (polishing or grinding process). Thereby, the module 100 in which the terminal (land) for external connection is formed by one end of the connection terminal 11 exposed on the surface of the first resin layer 103 is completed.
　なお、接続端子１１の他方端部を配線基板１０１に接続するはんだの厚みなどの影響で、接続端子１１の配線基板１０１からの高さにばらつきが生じている場合には、第１樹脂層１０３と一緒に接続端子１１の一方端部を削ることにより、接続端子１１の配線基板１０１からの高さを揃えることができる。また、第１樹脂層１０３の表面に露出した接続端子１１の一方端部に例えばＮｉ／Ａｕめっきを施してもよい。 If the height of the connection terminal 11 from the wiring substrate 101 varies due to the influence of the thickness of the solder that connects the other end of the connection terminal 11 to the wiring substrate 101, the first resin layer 103 is used. The height of the connection terminal 11 from the wiring board 101 can be made uniform by cutting one end of the connection terminal 11 together. Further, for example, Ni / Au plating may be applied to one end portion of the connection terminal 11 exposed on the surface of the first resin layer 103.
　また、第１封止工程において、各接続端子１１の一方端部が露出するように第１樹脂層１０３が形成される場合には、第１樹脂層１０３の表面を研磨または研削する工程は、必ずしも実行しなくともよい。 In the first sealing step, when the first resin layer 103 is formed so that one end of each connection terminal 11 is exposed, the step of polishing or grinding the surface of the first resin layer 103 includes: It does not necessarily have to be executed.
　また、端子集合体１０の支持体１２を接続端子１１から除去せずに、配線基板１０１の一方主面に樹脂を充填して第１樹脂層１０３を形成してもよい。この場合、研磨または研削工程において、第１樹脂層１０３と一緒に端子集合体１０の支持体１２を研削や研磨により除去すればよい。 Alternatively, the first resin layer 103 may be formed by filling one main surface of the wiring substrate 101 without removing the support 12 of the terminal assembly 10 from the connection terminal 11. In this case, in the polishing or grinding step, the support 12 of the terminal assembly 10 may be removed together with the first resin layer 103 by grinding or polishing.
　また、上記したように、モジュール１００を個別に製造してもよいが、複数のモジュール１００の集合体を形成した後に、個々のモジュール１００に個片化することによりモジュール１００を製造してもよい。この場合、配線基板１０１の集合体に複数の端子集合体１０を実装する際に、個片化される前の端子集合体１０の集合体を配線基板１０１の集合体に実装してもよい。このようにすると、配線基板１０１への端子集合体１０の実装時間の短縮を図ることができるので、モジュール１００の製造時間の短縮を図ることができる。 Further, as described above, the modules 100 may be manufactured individually. However, after the assembly of a plurality of modules 100 is formed, the modules 100 may be manufactured by dividing them into individual modules 100. . In this case, when mounting the plurality of terminal assemblies 10 on the assembly of the wiring boards 101, the assembly of the terminal assemblies 10 before being separated may be mounted on the assembly of the wiring boards 101. In this way, the time for mounting the terminal assembly 10 on the wiring board 101 can be shortened, so that the manufacturing time of the module 100 can be shortened.
　また、配線基板１０１の集合体に複数の端子集合体１１を実装する際に、個片化された複数の端子集合体１０をそれぞれ個別に配線基板１０１の集合体の個々のモジュール１００に対応する位置に実装してもよい。このようにすると、配線基板１０１の集合体に端子集合体１０の集合体を実装する場合よりも、端子集合体１０を位置精度よく配線基板１０１に実装することができる。 Further, when mounting the plurality of terminal assemblies 11 on the assembly of the wiring boards 101, the plurality of individual terminal assemblies 10 individually correspond to the individual modules 100 of the assembly of the wiring boards 101. It may be mounted at a position. In this way, the terminal assembly 10 can be mounted on the wiring board 101 with higher positional accuracy than when the terminal assembly 10 is mounted on the wiring board 101.
　以上のように、この実施形態では、配線基板１０１の一方主面に電子部品１０２と共に実装されて、層間接続導体を形成する柱状の接続端子１１は、その他方端部が配線基板１０１に接続され、一方端部が、電子部品１０２および接続端子１１を被覆して配線基板１０１の一方主面に設けられた第１樹脂層１０３の表面に露出しており、露出した接続端子１１の一方端部により外部接続用の端子（ランド)が形成される。 As described above, in this embodiment, the columnar connection terminal 11 that is mounted together with the electronic component 102 on one main surface of the wiring board 101 and forms an interlayer connection conductor has the other end connected to the wiring board 101. The one end of the connection terminal 11 is exposed on the surface of the first resin layer 103 that covers the electronic component 102 and the connection terminal 11 and is provided on one main surface of the wiring board 101. Thus, a terminal (land) for external connection is formed.
　そして、接続端子１１はＣｕ－Ｆｅ合金により形成されており、Ｃｕ－Ｆｅ合金は、線膨張係数が約１７ｐｐｍ／℃のＣｕに、線膨張係数がＣｕよりも低い約１２ｐｐｍ／℃であるＦｅが添加されることにより線膨張係数がＣｕよりも低く、Ｃｕ－Ｆｅ合金から成る接続端子１１により形成される層間接続導体の線膨張係数と、セラミック材料やＦＲ－４規格の樹脂材料で形成される配線基板１０１の線膨張係数との差を小さくすることができる。したがって、Ｃｕ－Ｆｅ合金により形成された柱状の接続端子１１が配線基板１０１に実装されて層間接続導体が形成されることにより、加熱されたときに配線基板１０１および接続端子１１が熱膨脹することにより配線基板１０１と接続端子１１との間に生じる応力を抑制することができるので、例えば、配線基板１０１および接続端子１１の接続部分が破損するのを防止することができ、信頼性の高いモジュール１０１を提供することができる。 The connection terminal 11 is made of a Cu—Fe alloy, and the Cu—Fe alloy has a coefficient of linear expansion of about 17 ppm / ° C. and a coefficient of linear expansion of about 12 ppm / ° C. lower than that of Cu. When added, the coefficient of linear expansion is lower than that of Cu, and the coefficient of linear expansion of the interlayer connection conductor formed by the connection terminal 11 made of a Cu—Fe alloy and the ceramic material or FR-4 standard resin material are used. The difference from the linear expansion coefficient of the wiring board 101 can be reduced. Accordingly, the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring board 101 to form an interlayer connection conductor, whereby the wiring board 101 and the connection terminals 11 are thermally expanded when heated. Since the stress generated between the wiring board 101 and the connection terminal 11 can be suppressed, for example, the connection portion between the wiring board 101 and the connection terminal 11 can be prevented from being damaged, and the highly reliable module 101 can be prevented. Can be provided.
　また、準備工程において、Ｃｕ－Ｆｅ合金により形成された接続端子１１が準備されるが、接続端子１１は、所定の径および断面形状を有し、Ｃｕ－Ｆｅ合金から成る線材が所定の長さで切断されることにより、所望の径および長さで準備される。Ｃｕ－Ｆｅ合金は、ＣｕにＦｅが添加されることによりＣｕよりも硬度が高く、切削性や研削性に優れているため、線材が切断されて接続端子１１が形成される際に、接続端子１１の切断端にばりが形成されるのが抑制されるので、非常に高精度な形状を有する柱状の接続端子１１を準備することができる。 In the preparation step, a connection terminal 11 formed of a Cu—Fe alloy is prepared. The connection terminal 11 has a predetermined diameter and a cross-sectional shape, and a wire made of a Cu—Fe alloy has a predetermined length. By being cut at, it is prepared with a desired diameter and length. Since the Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu and is excellent in machinability and grindability, the connection terminal 11 is formed when the connection material 11 is formed by cutting the wire. Since it is suppressed that a flash is formed at the cut end of 11, the columnar connection terminal 11 having a very high precision shape can be prepared.
　また、配線基板１０１の一方主面に、電子部品１０２が実装されると共に接続端子１１の他方端部が配線基板１０１に接続されるように接続端子１１が実装され、配線基板１０１の一方主面に実装された電子部品１０２および接続端子１１が第１樹脂層１０３により封止される。そして、第１樹脂層１０３および接続端子１１の一方端部が研磨または研削されることにより、第１樹脂層１０３の表面に接続端子１１の一方端部が露出するが、接続端子１１を形成するＣｕ－Ｆｅ合金は硬度が高く、切削性や研削性に優れているため、接続端子１１の一方端部が研磨または研削される際に該一方端部にばりが形成されるのが抑制される。 In addition, the electronic component 102 is mounted on one main surface of the wiring board 101 and the connection terminal 11 is mounted so that the other end of the connection terminal 11 is connected to the wiring board 101. The electronic component 102 and the connection terminal 11 mounted on are sealed with the first resin layer 103. Then, by polishing or grinding one end of the first resin layer 103 and the connection terminal 11, the one end of the connection terminal 11 is exposed on the surface of the first resin layer 103, but the connection terminal 11 is formed. Since the Cu—Fe alloy has high hardness and is excellent in machinability and grindability, it is possible to suppress the formation of a flash at one end of the connection terminal 11 when the one end is polished or ground. .
　したがって、各接続端子１１の一方端部は、第１樹脂層１０３の表面に露出してモジュール１００の外部接続用の端子として機能するが、第１樹脂層１０３の表面に露出する接続端子１１の一方端部に形成されたばりにより各接続端子１１が短絡するのが防止されるため、Ｃｕ－Ｆｅ合金により形成された柱状の接続端子１１が配線基板１０１に実装されて層間接続導体が形成されることにより信頼性の高いモジュール１００を提供することができる。 Therefore, one end of each connection terminal 11 is exposed on the surface of the first resin layer 103 and functions as a terminal for external connection of the module 100, but the connection terminal 11 exposed on the surface of the first resin layer 103 is exposed. Since the connection terminals 11 are prevented from being short-circuited by the flash formed at one end, the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring substrate 101 to form an interlayer connection conductor. Thus, the module 100 with high reliability can be provided.
　また、接続端子１１がＣｕ－Ｆｅ合金により形成されることにより、研磨または研削工程において、接続端子１１の一方端部にばりが形成されるのが抑制されて、形成されたばりにより各接続端子１１が短絡するのが防止されるので、配線基板１０１に実装される複数の接続端子１１間の距離を縮めることができ、各接続端子１１が配線基板１０１に近接配置されて実装され、端子間の距離が縮められることにより、小型化が図られたモジュール１００を提供することができる。また、複数の接続端子１１を配線基板１０１に近接配置して実装することができるので、モジュール１００の設計の自由度を高めることができる。 Further, since the connection terminal 11 is formed of a Cu—Fe alloy, it is possible to suppress the formation of a flash at one end of the connection terminal 11 in the polishing or grinding process. 11 is prevented from being short-circuited, the distance between the plurality of connection terminals 11 mounted on the wiring board 101 can be reduced, and each connection terminal 11 is mounted close to the wiring board 101 and mounted between the terminals. Thus, the module 100 can be provided with a reduced size. In addition, since the plurality of connection terminals 11 can be mounted close to the wiring substrate 101, the degree of freedom in designing the module 100 can be increased.
　また、層間接続導体を形成する柱状の複数の接続端子１１が支持体１２に支持されて成る端子集合体１０が準備されるが、支持体および接続端子が一体形成された従来の端子集合体と異なり、支持体に支持される各接続端子１１は、支持体１２とは別個に形成される。したがって、支持体に一体形成される従来の接続端子と比較すると、各々の接続端子１１が支持体１２とは別個に形成されることで、準備工程において準備される端子集合体１０は、非常に高精度な形状を有する柱状の複数の接続端子１１が支持体１２により支持されて形成されている。 Further, a terminal assembly 10 is prepared in which a plurality of columnar connection terminals 11 forming interlayer connection conductors are supported by a support body 12, and a conventional terminal assembly in which the support body and connection terminals are integrally formed; In contrast, each connection terminal 11 supported by the support is formed separately from the support 12. Therefore, when compared with the conventional connection terminals integrally formed on the support, each connection terminal 11 is formed separately from the support 12, so that the terminal assembly 10 prepared in the preparation process is very A plurality of columnar connection terminals 11 having a highly accurate shape are supported and formed by a support 12.
　また、端子集合体１０は、複数の接続端子１１が支持体１２に支持されて成る簡易な構成であり、従来のように、端子集合体１０を準備する際にエッチングされたり削られたりして廃棄される材料がないため、端子集合体１０を準備するためのコストが低減される。したがって、複数の接続端子１１が支持体１２に支持されるという簡易な構成で、高精度、安価であり、新規な構成の端子集合体１０および電子部品１０２を配線基板１０１の一方主面に実装し、配線基板１０１の一方主面に実装された電子部品１０２および端子集合体１０を第１樹脂層１０３により封止することにより、モジュール１００を精度よく製造することができる。 Further, the terminal assembly 10 has a simple configuration in which a plurality of connection terminals 11 are supported by a support 12 and is etched or scraped when preparing the terminal assembly 10 as in the prior art. Since there is no material to be discarded, the cost for preparing the terminal assembly 10 is reduced. Therefore, the simple structure in which the plurality of connection terminals 11 are supported by the support body 12 is highly accurate and inexpensive, and the terminal assembly 10 and the electronic component 102 having a new structure are mounted on one main surface of the wiring board 101. The module 100 can be accurately manufactured by sealing the electronic component 102 and the terminal assembly 10 mounted on one main surface of the wiring board 101 with the first resin layer 103.
　また、複数の接続端子１１は支持体１２に支持されているだけであり、接続端子１１および支持体１２はそれぞれ別個に形成されている。したがって、従来の一体構造の端子集合体と比較すると、支持体１２を複数の接続端子１１から容易に除去して、モジュール１００の層間接続導体を接続端子１１により形成することができるので、モジュール１００の製造時間の短縮を図ることができる。 Further, the plurality of connection terminals 11 are only supported by the support body 12, and the connection terminals 11 and the support body 12 are formed separately. Therefore, as compared with the conventional terminal assembly having an integral structure, the support 12 can be easily removed from the plurality of connection terminals 11, and the interlayer connection conductor of the module 100 can be formed by the connection terminals 11. The manufacturing time can be shortened.
　また、配線基板１０１の一方主面の端子集合体１０の支持体１２が接続端子１１から除去された状態で樹脂が配線基板１０１の一方主面に充填されるので、第１樹脂層１０３を形成するために配線基板１０１の一方主面に充填される樹脂の充填性が向上する。また、樹脂が配線基板１０１の一方主面に充填される際に、当該一方主面に実装された端子集合体１０の支持体１２が除去されているため、空気が抜けやすく、第１樹脂層１０３にボイドが発生するのを抑制することができる。 Further, since the resin is filled in the one main surface of the wiring substrate 101 in a state where the support 12 of the terminal assembly 10 on the one main surface of the wiring substrate 101 is removed from the connection terminal 11, the first resin layer 103 is formed. Therefore, the filling property of the resin filling one main surface of the wiring board 101 is improved. Further, when the resin is filled into the one main surface of the wiring substrate 101, the support 12 of the terminal assembly 10 mounted on the one main surface is removed, so that the air can easily escape and the first resin layer The generation of voids in 103 can be suppressed.
　また、配線基板１０１の一方主面に実装された端子集合体１０の支持体１２が除去されているため、第１樹脂層１０３を形成するために、液状の樹脂や樹脂シートなどの種々の態様の樹脂を使用することができ、一般的に知られている種々の方法により第１樹脂層１０３を容易に形成することができる。 Further, since the support 12 of the terminal assembly 10 mounted on one main surface of the wiring board 101 is removed, various modes such as a liquid resin and a resin sheet are used to form the first resin layer 103. The first resin layer 103 can be easily formed by various generally known methods.
　また、各接続端子１１の一方端部は、接着または粘着により支持体１２に支持されており、支持体１２による接着力または粘着力を加熱するなどして低下させることにより、支持体１２を接続端子１１から容易に除去することができる。 Further, one end of each connection terminal 11 is supported on the support 12 by adhesion or adhesion, and the support 12 is connected by reducing the adhesion or adhesion by the support 12 by heating or the like. It can be easily removed from the terminal 11.
　また、封止工程の後に第１樹脂層１０３の表面を研削や研磨により、第１樹脂層１０３の表面を平坦化することができると共に、モジュール１００の低背化を図ることができる。 Further, the surface of the first resin layer 103 can be flattened by grinding or polishing after the sealing step, and the height of the module 100 can be reduced.
　また、研磨または研削工程により、第１樹脂層１０３の表面と共に接続端子１１の一方端部を削ることで、第１樹脂層１０３の表面に接続端子１１の一方端部により形成される外部接続用の端子を容易に形成することができる。 Further, by polishing or grinding the surface of the first resin layer 103 and one end of the connection terminal 11, the external connection is formed on the surface of the first resin layer 103 by the one end of the connection terminal 11. The terminal can be easily formed.
　また、非常に高精度な形状を有する柱状の複数の接続端子１１が支持体１２により支持されて成る端子集合体１０は、複数の接続端子１１が支持体１２に支持されて成る簡易な構成でありながら、高精度、安価であり、一方面に接着層または粘着層から成る支持層１３が形成された板状部材から成る支持体１２により接続端子１１の一方端部が支持されるため、非常に実用的な構成を備えている。 In addition, the terminal assembly 10 in which a plurality of columnar connection terminals 11 having a highly accurate shape is supported by a support 12 has a simple configuration in which the plurality of connection terminals 11 are supported by the support 12. However, since one end of the connection terminal 11 is supported by the support 12 made of a plate-like member that is highly accurate and inexpensive and has a support layer 13 formed of an adhesive layer or an adhesive layer on one surface, It has a practical configuration.
　＜第２実施形態＞
　本発明の第２実施形態にかかるモジュールについて、図６を参照して説明する。図６は本発明の第２実施形態にかかるモジュールを示す図である。 <Second Embodiment>
A module according to a second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a diagram showing a module according to the second embodiment of the present invention.
　この実施形態にかかるモジュールが、上記した第１実施形態と異なるのは、図６に示すように、モジュール１００ａの配線基板１０１の他方主面に電子部品１０２がさらに実装されている点である。その他の構成は上記した第１実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。この実施形態では、接続端子１１の一方端部の端面によりモジュール１００ａの外部接続用の端子が形成されている。 The module according to this embodiment is different from the first embodiment described above in that an electronic component 102 is further mounted on the other main surface of the wiring board 101 of the module 100a as shown in FIG. Since other configurations are the same as those in the first embodiment described above, description of the configurations is omitted by giving the same reference numerals. In this embodiment, a terminal for external connection of the module 100 a is formed by the end face of one end of the connection terminal 11.
　したがって、配線基板１０１の他方主面に電子部品１０２がさらに実装されることにより、モジュール１００ａに実装される電子部品１０２の実装密度を高めることができ、電子部品１０２の実装密度が高められた実用的な構成のモジュール１００ａを提供することができる。 Therefore, by further mounting the electronic component 102 on the other main surface of the wiring board 101, the mounting density of the electronic component 102 mounted on the module 100a can be increased, and the mounting density of the electronic component 102 is increased. A module 100a having a typical configuration can be provided.
　＜第３実施形態＞
　本発明の第３実施形態にかかるモジュールについて、図７を参照して説明する。図７は本発明の第３実施形態にかかるモジュールを示す図である。 <Third Embodiment>
A module according to a third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a diagram showing a module according to the third embodiment of the present invention.
　この実施形態にかかるモジュールが、上記した第２実施形態と異なるのは、図７に示すように、モジュール１００ｂの配線基板１０１の他方主面に実装された電子部品１０２が、電子部品１０２を被覆して設けられた第２樹脂層１０４により封止される点である。その他の構成は上記した第１および第２実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。 The module according to this embodiment differs from the second embodiment described above in that the electronic component 102 mounted on the other main surface of the wiring board 101 of the module 100b covers the electronic component 102 as shown in FIG. The second resin layer 104 is sealed by the second resin layer 104. Since other configurations are the same as those in the first and second embodiments described above, the description of the configurations is omitted by giving the same reference numerals.
　以上のように、上記した第２実施形態と同様に、配線基板１０１の他方主面に電子部品１０２が実装され、配線基板１０１の他方主面に実装された電子部品１０２が第２樹脂層１０４により封止されることにより、モジュール１００ｂに実装される電子部品１０２の実装密度を高めることができるので実用的である。 As described above, similarly to the second embodiment described above, the electronic component 102 is mounted on the other main surface of the wiring board 101, and the electronic component 102 mounted on the other main surface of the wiring board 101 is the second resin layer 104. By being sealed, the mounting density of the electronic components 102 mounted on the module 100b can be increased, which is practical.
　また、配線基板１０１の他方主面に電子部品１０２を被覆して第２樹脂層１０４が設けられているため、配線基板１０１の他方主面に実装された電子部品１０２を第２樹脂層１０４により保護することができる。 In addition, since the second resin layer 104 is provided so as to cover the other main surface of the wiring substrate 101 with the electronic component 102, the electronic component 102 mounted on the other main surface of the wiring substrate 101 is formed by the second resin layer 104. Can be protected.
　＜第４実施形態＞
　本発明の第４実施形態にかかるモジュールについて、図８を参照して説明する。図８は本発明の第４実施形態にかかるモジュールを示す図である。 <Fourth embodiment>
A module according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a diagram showing a module according to the fourth embodiment of the present invention.
　この実施形態にかかるモジュールが、上記した第３実施形態と異なるのは、図８に示すように、モジュール１００ｃの配線基板１０１の他方主面に設けられた第２樹脂層１０４に金属シールド層１０５が設けられている点である。その他の構成は上記した第１～第３実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。なお、金属シールド層１０５は、配線基板１０１に設けられたＧＮＤ用配線と電気的に接続されるのが望ましい。 The module according to this embodiment differs from the third embodiment described above in that the metal shield layer 105 is formed on the second resin layer 104 provided on the other main surface of the wiring substrate 101 of the module 100c as shown in FIG. Is a point provided. Since other configurations are the same as those in the first to third embodiments, description thereof will be omitted by assigning the same reference numerals. Note that the metal shield layer 105 is preferably electrically connected to the GND wiring provided on the wiring board 101.
　このように構成すると、第２樹脂層１０４に金属シールド層１０５が設けられているため、特に、第２樹脂層１０４に封止される電子部品１０２に外部からノイズが伝搬するのが防止されると共に、第２樹脂層１０４に封止される電子部品１０２から電磁波などが輻射するのが防止される。 If comprised in this way, since the metal shield layer 105 is provided in the 2nd resin layer 104, it is prevented especially that a noise propagates from the exterior to the electronic component 102 sealed by the 2nd resin layer 104. At the same time, electromagnetic waves and the like are prevented from radiating from the electronic component 102 sealed in the second resin layer 104.
　＜第５実施形態＞
　本発明の第５実施形態にかかるモジュールについて、図９を参照して説明する。図９は本発明の第５実施形態にかかるモジュールを示す図である。 <Fifth Embodiment>
A module according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a diagram showing a module according to the fifth embodiment of the present invention.
　この実施形態にかかるモジュールが、図７を参照して説明した第３実施形態と異なるのは、図９に示すように、モジュール１００ｄの配線基板１０１の他方主面に端子集合体１０が実装されることにより、第２樹脂層１０４に接続端子１１による層間接続導体が設けられている点である。また、第２樹脂層１０４は、配線基板１０１の他方主面に実装された端子集合体１０の支持体１２が接続端子１１から除去された後に樹脂が充填されることにより形成される。 The module according to this embodiment differs from the third embodiment described with reference to FIG. 7 in that the terminal assembly 10 is mounted on the other main surface of the wiring board 101 of the module 100d as shown in FIG. Thus, an interlayer connection conductor by the connection terminal 11 is provided on the second resin layer 104. The second resin layer 104 is formed by filling the resin after the support 12 of the terminal assembly 10 mounted on the other main surface of the wiring substrate 101 is removed from the connection terminal 11.
　また、この実施形態では、第２樹脂層１０４に設けられた接続端子１１により形成された層間接続導体に接続されるように、第２樹脂層１０４にさらに電子部品１０２が実装されている。その他の構成は上記した第１～第４実施形態と同様の構成であるため、同一符号を付すことによりその構成の説明は省略する。 In this embodiment, an electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the interlayer connection conductor formed by the connection terminals 11 provided on the second resin layer 104. Since other configurations are the same as those in the first to fourth embodiments described above, description of the configurations is omitted by giving the same reference numerals.
　このように構成すると、配線基板１０１の他方主面に端子集合体１０がさらに実装されるので、第２樹脂層１０４に接続端子１１による層間接続導体を形成することができる。また、配線基板１０１の他方主面に実装された電子部品１０２および端子集合体１０が第２樹脂層１０４により封止される前に、配線基板１０１の他方主面の端子集合体１０の支持体１２が接続端子１１から除去さるため、第２樹脂層１０４を形成するための樹脂を配線基板１０１の他方主面に効率よく充填することができる。 With this configuration, since the terminal assembly 10 is further mounted on the other main surface of the wiring board 101, an interlayer connection conductor using the connection terminals 11 can be formed on the second resin layer 104. Further, before the electronic component 102 and the terminal assembly 10 mounted on the other main surface of the wiring board 101 are sealed by the second resin layer 104, the support body for the terminal assembly 10 on the other main surface of the wiring board 101. Since 12 is removed from the connection terminal 11, the resin for forming the second resin layer 104 can be efficiently filled into the other main surface of the wiring substrate 101.
　また、第２樹脂層１０４に、第２樹脂層１０４に設けられた接続端子１１に接続されるように電子部品１０２がさらに実装されているため、モジュール１００ｄに実装される電子部品１０２の実装密度をさらに高めることができるので実用的である。 Further, since the electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the connection terminal 11 provided on the second resin layer 104, the mounting density of the electronic component 102 mounted on the module 100d This is practical because it can be further increased.
　＜接続端子の変形例＞
　接続端子の変形例について図１０を参照して説明する。図１０は接続端子の変形例を示す要部拡大図であり、（ａ）～（ｃ）はそれぞれ異なる接続端子の変形例を示す。なお、図１０（ａ）～（ｃ）はそれぞれ要部拡大図であり、上記した第１～第５実施形態と同様の構成については、同一符号を付すことによりその構成の説明は省略する。また、以下で説明する接続端子の変形例は、配線基板１０１の一方主面および他方主面のいずれに実装されても同様の効果を奏することができるが、以下では、接続端子の変形例が配線基板１０１の一方主面に実装された場合についてのみ説明する。 <Modification of connection terminal>
A modification of the connection terminal will be described with reference to FIG. FIG. 10 is an enlarged view of a main part showing a modified example of the connection terminal, and (a) to (c) show modified examples of different connection terminals. FIGS. 10 (a) to 10 (c) are enlarged views of main parts, and the same components as those in the first to fifth embodiments are denoted by the same reference numerals, and the description of the components is omitted. In addition, the modification example of the connection terminal described below can achieve the same effect regardless of whether it is mounted on one of the main surface and the other main surface of the wiring board 101. Only the case where it is mounted on one main surface of the wiring board 101 will be described.
　図１０（ａ）に示す例では、配線基板１０１の一方主面に、接続端子１１の断面積よりも大面積のランド電極１０１ｂが設けられており、接続端子１１は、はんだなどの接合材Ｓによりランド電極１０１ｂに実装される。このように構成すると、接合材Ｓは、接続端子１１の断面積よりも大面積のランド電極１０１ｂ全体に広っており、実装用電極１０１ａ全体に広がることにより接続端子１１の他方端部の端面および外周面を鍔状に覆って形成されている接合材Ｓが第１樹脂層１０３に引っ掛かるため、接続端子１１の第１樹脂層１０３から抜け落ちるのを防止することができる。なお、接続端子１１と実装用電極１０１ｂとの間にもはんだなどの接合剤Ｓが配置されていてもよい。 In the example shown in FIG. 10A, a land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11 is provided on one main surface of the wiring board 101. The connection terminal 11 is made of a bonding material S such as solder. Is mounted on the land electrode 101b. With this configuration, the bonding material S is spread over the entire land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11, and the end surface of the other end of the connection terminal 11 is spread over the entire mounting electrode 101a. Further, since the bonding material S formed so as to cover the outer peripheral surface in a bowl shape is caught by the first resin layer 103, it is possible to prevent the connection terminal 11 from falling off from the first resin layer 103. A bonding agent S such as solder may be disposed between the connection terminal 11 and the mounting electrode 101b.
　図１０（ｂ）に示す例では、接続端子１１ｂは、他方端部の径が一方端部の径よりも大径に形成されることによりテーパ状に形成されている。また、配線基板１０１の一方主面に、接続端子１１ｂの大径側の断面積よりも大面積のランド電極１０１ｂが設けられている。そして、接続端子１１ｂの大径側の他方端部がはんだなどの接合材Ｓによりランド電極１０１ｂに実装される。このように構成すると、接続端子１１ｂは、第１樹脂層１０３に楔状に設けられるため、接続端子１１ｂの大径部分が第１樹脂層１０３に引っ掛かると共に、接続端子１１ｂの大径側の断面積よりも大面積のランド電極１０１ｂ全体に広がることにより接続端子１１ｂの他方端部の端面および外周面を鍔状に覆って形成された接合材Ｓが樹脂層１０３に引っ掛かるため、接続端子１１ｂの第１樹脂層１０３からの抜け落ちるのを確実に防止することができる。なお、接続端子１１ｂと実装用電極１０１ｂとの間にもはんだなどの接合剤Ｓが配置されていてもよい。実装用電極１０１ｂの面積は接続端子１１ｂの大径側の断面積と同等であってもよい。 In the example shown in FIG. 10B, the connection terminal 11b is formed in a tapered shape by forming the other end portion with a diameter larger than the diameter of the one end portion. Further, a land electrode 101b having a larger area than the cross-sectional area on the large diameter side of the connection terminal 11b is provided on one main surface of the wiring board 101. Then, the other end portion on the large diameter side of the connection terminal 11b is mounted on the land electrode 101b with a bonding material S such as solder. If comprised in this way, since the connection terminal 11b is provided in wedge shape in the 1st resin layer 103, while the large diameter part of the connection terminal 11b is hooked on the 1st resin layer 103, sectional area of the large diameter side of the connection terminal 11b Since the bonding material S formed so as to cover the end surface and the outer peripheral surface of the other end portion of the connection terminal 11b in a hook shape is caught by the resin layer 103 by spreading over the entire land electrode 101b having a larger area than the land electrode 101b. It is possible to reliably prevent the resin layer 103 from falling off. A bonding agent S such as solder may be disposed between the connection terminal 11b and the mounting electrode 101b. The area of the mounting electrode 101b may be equal to the cross-sectional area on the large diameter side of the connection terminal 11b.
　図１０（ｃ）に示す例では、接続端子１１ｂは、一方端部の径が他方端部の径よりも大径に形成されることによりテーパ状に形成されている。また、配線基板１０１の一方主面に、接続端子１１ｂの小径側の他方端部の断面積よりも大面積のランド電極１０１ｂが設けられている。そして、接続端子１１ｂの小径側がはんだなどの接合材Ｓによりランド電極１０１ｂに実装される。このように構成すると、接続端子１１ｂの小径側の断面積よりも大面積のランド電極１０１ｂ全体に広がることにより接続端子１１ｂの他方端部の端面および外周面を鍔状に覆って形成された接合材Ｓが樹脂層１０３に引っ掛かるため、接続端子１１ｂの樹脂層１０３からの抜けが防止される。なお、接続端子１１ｂと実装用電極１０１ｂとの間にもはんだなどの接合剤Ｓが配置されていてもよい。 In the example shown in FIG. 10C, the connection terminal 11b is formed in a tapered shape by forming the diameter of one end portion larger than the diameter of the other end portion. A land electrode 101b having a larger area than the cross-sectional area of the other end portion on the small diameter side of the connection terminal 11b is provided on one main surface of the wiring board 101. Then, the small diameter side of the connection terminal 11b is mounted on the land electrode 101b by a bonding material S such as solder. If comprised in this way, the junction formed so that the end surface and outer peripheral surface of the other end part of the connection terminal 11b may be covered with a bowl shape by spreading over the land electrode 101b of a larger area than the cross-sectional area of the small diameter side of the connection terminal 11b. Since the material S is caught by the resin layer 103, the connection terminal 11b is prevented from coming off from the resin layer 103. A bonding agent S such as solder may be disposed between the connection terminal 11b and the mounting electrode 101b.
　また、接続端子１１ｂの大径側の一方端部が第１樹脂層１０３に露出することにより、大面積のランド状の外部接続用の端子を容易にモジュールに形成することができる、モジュールがマザー基板などに実装されるときの電気的接続性および接合強度の向上を図ることができる。 In addition, since one end portion on the large-diameter side of the connection terminal 11b is exposed to the first resin layer 103, a land-shaped external connection terminal having a large area can be easily formed in the module. Electrical connectivity and bonding strength when mounted on a substrate or the like can be improved.
　＜端子集合体の変形例＞
　端子集合体の変形例について図１１および図１２を参照して説明する。図１１および図１２は、それぞれ端子集合体の変形例を示す図である。なお、上記した第１～第５実施形態と同様の構成については、同一符号を付すことによりその構成の説明は省略する。 <Modification of terminal assembly>
A modification of the terminal assembly will be described with reference to FIGS. 11 and 12. FIG. 11 and FIG. 12 are diagrams showing modifications of the terminal assembly. Note that the same components as those in the first to fifth embodiments described above are denoted by the same reference numerals, and the description of the components is omitted.
　図１１（ｂ）に示す端子集合体１０ａは、図１１（ａ）に示すように、樹脂板に所定間隔で接続端子１１を挿入するための孔１２ａ１が格子状に形成されて成る支持体１２ａが準備され、図１１（ｂ）に示すように、支持体１２ａに形成された複数の孔１２ａ１のうち、モジュールの設計態様に応じて必要な位置の孔１２ａ１に柱状の接続端子１１が一方端部側から挿入されることにより形成される。 As shown in FIG. 11A, a terminal assembly 10a shown in FIG. 11B is a support 12a in which holes 12a1 for inserting the connection terminals 11 at predetermined intervals are formed in a lattice shape in a resin plate. As shown in FIG. 11 (b), among the plurality of holes 12a1 formed in the support 12a, the columnar connection terminal 11 is provided at one end of the hole 12a1 at a required position according to the design of the module. It is formed by being inserted from the part side.
　このように構成すると、板状の支持体１２ａに設けられた孔１２ａ１に柱状の接続端子１１を挿入するだけで、端子集合体１０ａを低コストで容易に製造することができる。また、支持体１２ａに設けられた複数の孔１２ａ１のうち、必要な孔１２ａ１に接続端子１１を挿入することにより、モジュールの種類に応じた端子集合体１０ａを形成することができる。したがって、モジュールの種類ごとに支持体１２ａを設計する必要がないため、端子集合体１０ａの製造コストの低減を図ることができる。 With this configuration, the terminal assembly 10a can be easily manufactured at low cost simply by inserting the columnar connection terminals 11 into the holes 12a1 provided in the plate-like support 12a. Moreover, the terminal aggregate 10a according to the kind of module can be formed by inserting the connection terminal 11 in the required hole 12a1 among the plurality of holes 12a1 provided in the support 12a. Therefore, since it is not necessary to design the support body 12a for each type of module, the manufacturing cost of the terminal assembly 10a can be reduced.
　なお、モジュールの設計態様に応じて樹脂板の必要な位置にのみ孔１２ａ１を形成することにより支持体１２ａを形成してもよい。また、支持体１２ａは、例えば、樹脂を用いた射出成型や、樹脂板に孔を形成することにより形成することができる。 In addition, you may form the support body 12a by forming the hole 12a1 only in the required position of a resin board according to the design aspect of a module. The support 12a can be formed by, for example, injection molding using a resin or by forming a hole in a resin plate.
　図１２（ｂ）に示す端子集合体１０ｂは、図１２（ａ）に示すように、Ｃｕ－Ｆｅ合金から成る金属板が打抜き加工やエッチング加工されることにより、複数の接続端子１１ｃの一方端部が連結部１２ｂの両側に連結された部材が形成され、図１２（ｂ）に示すように、連結部１２ｂの両側の接続端子１１ｃが折り曲げ加工されることにより形成される。 As shown in FIG. 12A, the terminal assembly 10b shown in FIG. 12B is formed by punching or etching a metal plate made of a Cu—Fe alloy, so that one end of the plurality of connection terminals 11c. As shown in FIG. 12B, a member is formed by bending the connecting terminals 11c on both sides of the connecting portion 12b.
　このように構成すると、金属板を打抜き加工やエッチング加工することにより、複数の接続端子１１ｃが連結部１２ｂを介して連結された集合体を形成し、接続端子１１ｃと連結部１２ｂとの連結部分を折り曲げ加工するだけで、低コストで容易に端子集合体１０ｂを形成することができる。 If comprised in this way, the metal plate will be punched or etched to form an assembly in which a plurality of connecting terminals 11c are connected via the connecting part 12b, and the connecting part between the connecting terminal 11c and the connecting part 12b The terminal assembly 10b can be easily formed at low cost simply by bending the wire.
　なお、本発明は上記した各実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、上記したもの以外に種々の変更を行なうことが可能であり、上記した構成をどのように組合わせてもよい。 The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the present invention. You may combine them.
　また、上記した第１実施形態では、端子集合体１０の支持体１２に支持層１３を設けることにより、接続端子１１を支持するように構成されているが、支持体１２に支持層１３を設ける代わりに、磁性を有する材質の板状部材により支持体１２を形成してもよい。このようにすると、板状部材の磁力により接続端子１１の一方端部を吸着することで、支持体１２により接続端子１１を支持することができる。また、端子集合体１０が配線基板１０１に実装された後に、支持体１２を接続端子１１から容易に除去することができる。 Further, in the first embodiment described above, the connection layer 11 is supported by providing the support layer 13 on the support 12 of the terminal assembly 10. However, the support layer 13 is provided on the support 12. Instead, the support 12 may be formed of a plate member made of a magnetic material. If it does in this way, the connection terminal 11 can be supported by the support body 12 by adsorb | sucking the one end part of the connection terminal 11 with the magnetic force of a plate-shaped member. In addition, after the terminal assembly 10 is mounted on the wiring board 101, the support body 12 can be easily removed from the connection terminal 11.
　また、上記した実施形態では、端子集合体１０，１０ａ，１０ｂを配線基板１０１に実装することにより、接続端子１１，１１ｂ，１１ｃによる層間接続導体をモジュールに形成する例を挙げて説明したが、個別に形成された接続端子を配線基板１０１にそれぞれ個別に実装することにより層間接続導体をモジュールに形成してもよい。 In the above-described embodiment, the terminal assembly 10, 10a, 10b is mounted on the wiring board 101, and the interlayer connection conductor by the connection terminals 11, 11b, 11c is formed in the module. The interlayer connection conductors may be formed in the module by individually mounting the connection terminals formed individually on the wiring board 101.
　本発明は、モジュールの配線基板に柱状の接続端子を表面実装技術を用いて実装することにより、モジュールの層間接続導体を形成する技術に広く適用することができ、種々の電子部品を配線基板に搭載することにより、種々の機能を有するモジュールを構成することができる。 The present invention can be widely applied to a technique for forming an interlayer connection conductor of a module by mounting columnar connection terminals on the circuit board of the module using surface mounting technology, and various electronic components can be applied to the wiring board. By mounting, modules having various functions can be configured.
　１１，１１ｂ，１１ｃ　　接続端子
　１００，１００ａ，１００ｂ，１００ｃ，１００ｄ　　モジュール
　１０１　　配線基板
　１０１ａ　　ランド電極
　１０２　　電子部品
　１０３　　第１樹脂層
　１０４　　第２樹脂層
　Ｓ　　導電性接合材 11, 11b, 11c Connection terminal 100, 100a, 100b, 100c, 100d Module 101 Wiring board 101a Land electrode 102 Electronic component 103 First resin layer 104 Second resin layer S Conductive bonding material

Claims (8)

  1. 　配線基板の少なくとも一方主面に電子部品が実装されたモジュールにおいて、
    　前記配線基板の一方主面に実装されて層間接続導体を形成する柱状の接続端子と、
    　前記配線基板の一方主面に電子部品および前記接続端子を被覆して設けられた第１樹脂層とを備え、
    　前記接続端子はＣｕ－Ｆｅ合金により形成されており、その他方端部が前記配線基板に接続されていることを特徴とするモジュール。     In a module in which electronic components are mounted on at least one main surface of the wiring board,
    Columnar connection terminals that are mounted on one main surface of the wiring board to form interlayer connection conductors;
    A first resin layer provided on one main surface of the wiring board so as to cover the electronic component and the connection terminal;
    The module, wherein the connection terminal is made of a Cu—Fe alloy, and the other end is connected to the wiring board.
  2. 　前記接続端子は、前記他方端部が前記配線基板上に形成されたランド電極に導電性接合材により接合されて実装されており、
    　前記導電性接合材は、前記他方端部の端面および外周面を鍔状に覆って形成されていることを特徴とする請求項１に記載のモジュール。     The connection terminal is mounted with the other end bonded to a land electrode formed on the wiring board by a conductive bonding material,
    The module according to claim 1, wherein the conductive bonding material is formed so as to cover an end surface and an outer peripheral surface of the other end portion in a bowl shape.
  3. 　前記接続端子は、前記他方端部の径が前記一方端部の径よりも大径に形成されていることを特徴とする請求項１または２に記載のモジュール。 3. The module according to claim 1, wherein the connection terminal is formed such that a diameter of the other end is larger than a diameter of the one end.
  4. 　前記接続端子は、前記一方端部の径が前記他方端部の径よりも大径に形成されていることを特徴とする請求項１または２に記載のモジュール。 3. The module according to claim 1, wherein the connection terminal is formed such that a diameter of the one end is larger than a diameter of the other end.
  5. 　前記配線基板の他方主面に電子部品がさらに実装されていることを特徴とする請求項１ないし４のいずれかに記載のモジュール。 5. The module according to claim 1, wherein an electronic component is further mounted on the other main surface of the wiring board.
  6. 　前記配線基板の他方主面に電子部品を被覆して設けられた第２樹脂層をさらに備えることを特徴とする請求項５に記載のモジュール。 The module according to claim 5, further comprising a second resin layer provided on the other main surface of the wiring board so as to cover an electronic component.
  7. 　前記配線基板の他方主面に前記接続端子がさらに実装されており、前記第２樹脂層に、前記他方主面に実装された前記接続端子に接続されるように、電子部品がさらに実装されていることを特徴とする請求項６に記載のモジュール。 The connection terminal is further mounted on the other main surface of the wiring board, and an electronic component is further mounted on the second resin layer so as to be connected to the connection terminal mounted on the other main surface. The module according to claim 6.
  8. 　層間接続導体を形成する柱状の接続端子および電子部品を配線基板上に実装し樹脂封止してなるモジュールの製造方法において、
    　Ｃｕ－Ｆｅ合金により形成された前記接続端子を準備する準備工程と、
    　前記配線基板の一方主面に、電子部品を実装すると共に前記接続端子の他方端部が前記配線基板に接続されるように前記接続端子を実装する実装工程と、
    　前記配線基板の一方主面に実装された電子部品および前記接続端子を樹脂層により封止する封止工程と、
    　前記第１樹脂層および前記接続端子の一方端部を研磨または研削する工程と
    　を備えることを特徴とするモジュールの製造方法。     In the method of manufacturing a module formed by mounting resin-sealed columnar connection terminals and electronic components that form interlayer connection conductors on a wiring board,
    A preparation step of preparing the connection terminal formed of a Cu-Fe alloy;
    A mounting step of mounting the connection terminal so that the electronic component is mounted on one main surface of the wiring board and the other end of the connection terminal is connected to the wiring board;
    A sealing step of sealing the electronic component mounted on one main surface of the wiring board and the connection terminal with a resin layer;
    Polishing or grinding one end of the first resin layer and the connection terminal. A method of manufacturing a module, comprising:
PCT/JP2012/072552 2011-09-07 2012-09-05 Module, and manufacturing method for module WO2013035717A1 (en)

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