WO2009157080A1 - Power supply unit - Google Patents

Power supply unit Download PDF

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Publication number
WO2009157080A1
WO2009157080A1 PCT/JP2008/061666 JP2008061666W WO2009157080A1 WO 2009157080 A1 WO2009157080 A1 WO 2009157080A1 JP 2008061666 W JP2008061666 W JP 2008061666W WO 2009157080 A1 WO2009157080 A1 WO 2009157080A1
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WO
WIPO (PCT)
Prior art keywords
water
power supply
supply unit
mounting board
heat sink
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Application number
PCT/JP2008/061666
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French (fr)
Japanese (ja)
Inventor
宏 久留島
松原　真人
城所　仁志
Original Assignee
三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2008/061666 priority Critical patent/WO2009157080A1/en
Publication of WO2009157080A1 publication Critical patent/WO2009157080A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans

Definitions

  • the present invention relates to a power supply unit for machine tools and vehicles.
  • a high power generation electronic component such as a power element and a low heat generation electronic circuit component are mixedly mounted on a mounting board and cannot be cooled only by air cooling. In some cases, water cooling and air cooling are used together.
  • a high heat generating electronic component that requires water cooling is mounted on one surface of a first mounting board in a planar shape, and a second heat generating electronic component that requires air cooling is mounted on the other surface of the first mounting board.
  • an information processing apparatus mounting structure in which a plurality of mounting boards are mounted vertically so as to form a ventilation path (see, for example, Patent Document 1).
  • a highly heat-generating electronic component that requires water cooling is mounted on one surface of the first mounting board in a planar shape, and a plurality of second mounting boards are mounted vertically on the other surface of the first mounting board.
  • a structure in which a plurality of third mounting boards each mounting a low heat generation electronic component that is sufficient for air cooling are mounted on one surface of each of the plurality of second mounting boards vertically so as to form a ventilation path.
  • a high heat generating electronic component that requires water cooling is mounted on one surface of the first mounting board in a planar shape, and air cooling is sufficient on the other surface of the first mounting board.
  • a plurality of second mounting boards on which heat generating electronic components are mounted are vertically mounted so as to form a ventilation path. Therefore, since the first mounting board and the second mounting board are vertically combined, there is a problem that the outer shape of the apparatus becomes large.
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a power supply unit having a small external shape of the apparatus and good cooling efficiency.
  • the present invention provides a water-cooled heat sink to which a power element that is a highly heat-generating electronic component is attached, and the water-cooled heat sink is installed and connected to the power element. And a mounting board on which the low heat generation electronic circuit component is mounted, and the water-cooled heat sink and the mounting board form a duct for air-cooling the low heat generation electronic circuit component.
  • one wall surface of the duct is configured by the water-cooled heat sink having a width (height) smaller than that of the mounting board, the outer shape of the power supply unit becomes flat, and the outer shape of the power supply unit can be reduced.
  • the power element is water-cooled and air-cooled in the duct, there is an effect that a power supply unit with good cooling efficiency can be obtained.
  • FIG. 1 is a perspective view schematically showing a first embodiment of a power supply unit according to the present invention.
  • FIG. 2 is a front view schematically showing the power supply unit of the first embodiment.
  • FIG. 3 is a front view schematically showing the power supply unit of the second embodiment.
  • FIG. 1 is a perspective view schematically showing a first embodiment of a power supply unit according to the present invention
  • FIG. 2 is a front view schematically showing the power supply unit of the first embodiment.
  • the power supply unit 91 of the first embodiment includes a water-cooled heat sink 14 in which a plurality of power elements 11 (power MOSFET, thyristor, power diode, etc.) that are high heat generation electronic components are attached on both sides.
  • a water-cooled heat sink 14 is installed, and a low heat generation electronic circuit component 18 connected to the power element 11 (a power MOSFET gate circuit component and a power supply component for the gate circuit, and a plurality of power elements 11 are connected in parallel.
  • a rectangular mounting board 16 mounted with a shunting reactor or the like), and the water-cooled heat sink 14 and the mounting board 16 form a duct 20 for air-cooling the low heat-generating electronic circuit component 18.
  • the metal water-cooled heat sink 14 provided with the water passage holes 14 a is formed in a square beam shape having a length extending over substantially the entire length of the mounting board 16.
  • the power supply unit 91 includes two mounting boards 16 on which three water-cooled heat sinks 14 are installed substantially in parallel so that the surfaces of the respective mounting boards 16 on which the water-cooled heat sinks 14 are installed face each other.
  • the two mounting boards 16 are arranged in the unit outer frame 21 to form the duct 20.
  • the two mounting boards 16 are arranged so that the water-cooled heat sinks 14 of the respective mounting boards 16 are brought into contact with each other to form a duct 20.
  • another mounting board 19 on which another low heat generation electronic circuit component 18b (for example, an interlock circuit component or the like) connected to the power element 11 is mounted is installed.
  • the other mounting board 19 is formed in a rectangular shape smaller than the mounting board 16, and is installed on the outside of the mounting board 16 forming the duct 20 via four support columns 15.
  • the other mounting board 19 on which the other low heat generation electronic circuit component 18b is mounted is installed, but the other low heat generation electronic circuit component 18b is mounted on the mounting board 16. In this case, the other mounting board 19 is not always necessary.
  • the two mounting boards 16 have the four corners connected to the middle part of the four frame pillars 21a of the rectangular unit outer frame 21 so that the cold water heat sinks 14 are brought into contact with each other.
  • the outer dimensions of the unit outer frame 21 are about 30 cm in height, about 50 cm in width, and about 40 cm in depth.
  • Three rectangular beam-shaped water-cooled heat sinks 14 installed substantially parallel to one surface of the mounting board 16 are connected in series by a water supply pipe 12 and a nipple 12a to pass water.
  • a total of six water-cooled heat sinks 14 of the two mounting boards 16 may be connected in series to pass water.
  • the water supply pipe 12 is arranged outside the duct 20 by being bent in a semicircular shape via the nipple 12 a so as not to obstruct the ventilation of the duct 20.
  • a low heat generation electronic circuit component 18 is mounted on one surface of the mounting board 16 on which the water-cooled heat sink 14 is installed, and the low heat generation electronic circuit component 18 is disposed in the duct 20 and is installed in front of the power supply unit 91.
  • the low-heat-generating electronic circuit component 18 can be efficiently cooled by the cooling air 17 blown into the duct 20 by the blown fan 13.
  • the mounting board 16 includes a low heat generation electronic circuit component 18 to be mounted near the power element 11 such as a power MOSFET, a thyristor, and a power diode, for example, a power MOSFET gate circuit component and a power circuit component for the gate circuit. Since the shunt reactor for connecting the power elements in parallel is mounted, the impedance and noise of the circuit can be reduced. In addition, other low heat generation electronic circuit components 18 b that do not have a problem even if mounted away from the power element 11 on the circuit, such as an interlock circuit, are mounted on another mounting board 19.
  • a low heat generation electronic circuit component 18 to be mounted near the power element 11 such as a power MOSFET, a thyristor, and a power diode, for example, a power MOSFET gate circuit component and a power circuit component for the gate circuit. Since the shunt reactor for connecting the power elements in parallel is mounted, the impedance and noise of the circuit can be reduced. In addition, other low heat generation electronic circuit components 18
  • the power supply unit 91 of the first embodiment described above it is not necessary to mount the high heat generation electronic component 11 and the low heat generation electronic circuit component 18 on different boards. Further, among the low heat generation electronic circuit components, those having a relatively large amount of heat generation can be mounted in the duct 20, and those having a relatively small amount of heat generation can be mounted outside the duct 20, thereby improving the cooling efficiency and blowing fan The number of installations of 13 can be reduced.
  • the duct 20 is formed by the water-cooled heat sink 14 to which the high heat generating electronic component 11 is attached and the mounting board 16 on which the low heat generating electronic circuit component 18 is mounted, the high heat generating electronic circuit component 11 is cooled with water.
  • the cooling efficiency of the high heat generating electronic circuit component 11 is improved by air cooling.
  • FIG. FIG. 3 is a front view schematically showing the power supply unit of the second embodiment.
  • the power supply unit 92 of the second embodiment includes a high-temperature water-cooled heat sink 24 in which a plurality of power elements 11 that are highly heat-generating electronic components are attached in two rows on both sides, and a water-cooled heat sink 24. And a rectangular mounting board 16 on which a low heat generation electronic circuit component 18 connected to the power element 11 is mounted. The water cooling heat sink 24 and the mounting board 16 are used to air-cool the low heat generation electronic circuit component 18.
  • a duct 22 is formed.
  • the high-temperature metal water-cooled heat sink 24 provided with the two water passage holes 24 a is formed in a square beam shape having a length extending over substantially the entire length of the mounting board 16.
  • the power supply unit 92 of the second embodiment includes two mounting boards 16 on which one water-cooled heat sink 24 is installed, and the surfaces of the respective mounting boards 16 on which the water-cooled heat sink 24 is installed face each other.
  • a single mounting board 16 is arranged in the unit outer frame 21 to form a duct 22.
  • the two mounting boards 16 are arranged so that the end surface of the water-cooled heat sink 24 installed on one mounting board 16 is in contact with the other mounting board 16 to form a duct 22.
  • another mounting board 19 on which another low heat generating electronic circuit component 18b connected to the power element 11 is mounted is installed.
  • the other mounting board 19 is formed in a rectangular shape smaller than the mounting board 16, and is installed on the outside of the mounting board 16 forming the duct 22 via the four support columns 15.
  • the two mounting boards 16 have four corners in the middle part of the four frame pillars 21a of the rectangular unit outer frame 21 so that the end face of the cold water heat sink 24 installed is in contact with the other mounting board 16. Connected.
  • the water cooling heat sink 24 having a high square beam shape is provided with two water passage holes 24a, and the two water passage holes 24a communicate with each other by a pipe (not shown) on the rear side. Water is supplied to the water passage hole 24a on the side and drained through the water hole 24a on the upper side in FIG.
  • the low heat generation electronic circuit component 18 is mounted on one surface of the mounting board 16 on which the water-cooled heat sink 24 is installed, and the low heat generation electronic circuit component 18 is disposed in the duct 22 and is installed in front of the power supply unit 92.
  • the low-heat-generating electronic circuit component 18 can be efficiently cooled by the cooling air blown into the duct 22 by the blown fan 13.
  • the mounting board 16 has low heat generation to be mounted near the power element 11 such as a power MOSFET, a thyristor, and a power diode due to problems such as circuit impedance and noise.
  • An electronic circuit component 18, for example, a power MOSFET gate circuit component and a power supply component for the gate circuit, a shunting reactor for connecting a plurality of power elements in parallel, and the like are mounted on the circuit and away from the power element 11.
  • Other low heat generation electronic circuit components 18 b that do not have any problem even if mounted, for example, an interlock circuit, may be mounted on another mounting board 19.
  • the duct 22 is formed by the two mounting boards 16 and the two water-cooled heat sinks 24, but one of the two mounting boards 16 is, for example, You may comprise by another members, such as a housing
  • FIG. 1 A block diagram illustrating an exemplary computing environment in accordance with the present disclosure.
  • the power supply unit according to the present invention is particularly suitable for a power supply unit for a laser oscillator power supply panel.

Abstract

A power supply unit comprises a water-cooled heat sink to which a high heat generation electronic component, i.e., a power element, is fixed, and a board mounting a low heat generation electronic circuit component connected with the power element and on which the water-cooled heat sink is installed. In this power supply unit, a duct for air cooling the low heat generation electronic circuit component is formed of the water-cooled heat sink and the mounting board. At least two mounting boards on which the water-cooled heat sink is installed are provided and the duct is formed by arranging the two mounting boards so that the surfaces of the mounting boards on which the water-cooled heat sink is installed face each other.

Description

電源ユニットPower supply unit
　本発明は、工作機械や車両用の電源ユニットに関するものである。 The present invention relates to a power supply unit for machine tools and vehicles.
　近年、パワーＭＯＳＦＥＴ、サイリスタ等のパワー素子の性能が著しく向上し、これに伴い、これらのパワー素子を駆動する電子回路部品の発熱量も大きくなってきている。これら発熱量の大きいパワー素子及び電子回路部品を冷却するために、パワー素子に放熱フィンを取付けて空冷を行ない、特に発熱量が大きいパワー素子の場合は、水冷が行なわれている。また、空冷による冷却効率を向上させるために、送風ファンの冷却風を導くダクトが用いられている。 In recent years, the performance of power elements such as power MOSFETs and thyristors has been remarkably improved, and accordingly, the amount of heat generated by electronic circuit components that drive these power elements has also increased. In order to cool these power elements and electronic circuit components having a large amount of heat generation, heat radiation fins are attached to the power elements and air cooling is performed. In particular, in the case of a power element having a large amount of heat generation, water cooling is performed. Moreover, in order to improve the cooling efficiency by air cooling, the duct which guides the cooling air of a ventilation fan is used.
　例えば、工作機械や車両用の電源ユニットにおいては、パワー素子のような高発熱電子部品と低発熱電子回路部品が実装ボードに混載され、空冷のみで冷却を行うことができず、一つの電源ユニットで、水冷と空冷を併用することがある。 For example, in a power supply unit for machine tools and vehicles, a high power generation electronic component such as a power element and a low heat generation electronic circuit component are mixedly mounted on a mounting board and cannot be cooled only by air cooling. In some cases, water cooling and air cooling are used together.
　従来、第１の実装ボードの一方の面に、水冷を要する高発熱電子部品を平面状に実装し、第１の実装ボードの他方の面に、空冷で足りる低発熱電子部品を実装した第２の実装ボードを、通風路を形成するように垂直に複数枚実装する構造とした情報処理装置の実装構造がある（例えば、特許文献１参照）。 Conventionally, a high heat generating electronic component that requires water cooling is mounted on one surface of a first mounting board in a planar shape, and a second heat generating electronic component that requires air cooling is mounted on the other surface of the first mounting board. There is an information processing apparatus mounting structure in which a plurality of mounting boards are mounted vertically so as to form a ventilation path (see, for example, Patent Document 1).
　また、第１の実装ボードの一方の面に、水冷を要する高発熱電子部品を平面状に実装し、第１の実装ボードの他方の面に、第２の実装ボードを、垂直に複数枚実装し、前記複数枚の第２の実装ボードの各々の一方の面に、空冷で足りる低発熱電子部品を実装した第３の実装ボードを、通風路を形成するように垂直に複数枚実装する構造とした情報処理装置の実装構造がある（例えば、特許文献１参照）。 Also, a highly heat-generating electronic component that requires water cooling is mounted on one surface of the first mounting board in a planar shape, and a plurality of second mounting boards are mounted vertically on the other surface of the first mounting board. And a structure in which a plurality of third mounting boards each mounting a low heat generation electronic component that is sufficient for air cooling are mounted on one surface of each of the plurality of second mounting boards vertically so as to form a ventilation path. There is a mounting structure of the information processing apparatus described above (for example, see Patent Document 1).
特開昭６３－２８９９９９号公報JP-A-63-289999
　しかしながら、上記従来の技術によれば、第１の実装ボードの一方の面に、水冷を要する高発熱電子部品を平面状に実装し、第１の実装ボードの他方の面に、空冷で足りる低発熱電子部品を実装した第２の実装ボードを、通風路を形成するように垂直に複数枚実装している。そのため、第１の実装ボードと第２の実装ボードとを垂直に組合わせているので、装置の外形が大きくなってしまう、という問題があった。 However, according to the above-described conventional technology, a high heat generating electronic component that requires water cooling is mounted on one surface of the first mounting board in a planar shape, and air cooling is sufficient on the other surface of the first mounting board. A plurality of second mounting boards on which heat generating electronic components are mounted are vertically mounted so as to form a ventilation path. Therefore, since the first mounting board and the second mounting board are vertically combined, there is a problem that the outer shape of the apparatus becomes large.
　本発明は、上記に鑑みてなされたものであって、装置の外形が小さく冷却効率のよい電源ユニットを得ることを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to obtain a power supply unit having a small external shape of the apparatus and good cooling efficiency.
　上述した課題を解決し、目的を達成するために、本発明は、高発熱電子部品であるパワー素子が取付けられた水冷ヒートシンクと、前記水冷ヒートシンクが設置されるとともに、前記パワー素子に接続される低発熱電子回路部品が実装された実装ボードと、を備え、前記水冷ヒートシンクと前記実装ボードとにより、前記低発熱電子回路部品を空冷するダクトを形成したことを特徴とする。 In order to solve the above-described problems and achieve the object, the present invention provides a water-cooled heat sink to which a power element that is a highly heat-generating electronic component is attached, and the water-cooled heat sink is installed and connected to the power element. And a mounting board on which the low heat generation electronic circuit component is mounted, and the water-cooled heat sink and the mounting board form a duct for air-cooling the low heat generation electronic circuit component.
　この発明によれば、実装ボードより幅（高さ）の小さい水冷ヒートシンクによりダクトの一壁面を構成したので、電源ユニットの外形が扁平なものとなり、電源ユニットの外形を小さなものにすることができる。また、パワー素子は、水冷されるとともにダクト内で空冷されるので冷却効率のよい電源ユニットが得られる、という効果を奏する。 According to the present invention, since one wall surface of the duct is configured by the water-cooled heat sink having a width (height) smaller than that of the mounting board, the outer shape of the power supply unit becomes flat, and the outer shape of the power supply unit can be reduced. . In addition, since the power element is water-cooled and air-cooled in the duct, there is an effect that a power supply unit with good cooling efficiency can be obtained.
図１は、本発明にかかる電源ユニットの実施の形態１を模式的に示す斜視図である。FIG. 1 is a perspective view schematically showing a first embodiment of a power supply unit according to the present invention. 図２は、実施の形態１の電源ユニットを模式的に示す正面図である。FIG. 2 is a front view schematically showing the power supply unit of the first embodiment. 図３は、実施の形態２の電源ユニットを模式的に示す正面図である。FIG. 3 is a front view schematically showing the power supply unit of the second embodiment.
符号の説明Explanation of symbols
　１１　パワー素子（高発熱電子部品）
　１２　給水パイプ
　１２ａ　ニップル
　１３　送風ファン
　１４，２４　水冷ヒートシンク
　１４ａ，２４ａ　通水孔
　１５　支柱
　１６　実装ボード
　１７　冷却風
　１８　低発熱電子回路部品
　１８ｂ　他の低発熱電子回路部品
　１９　他の実装ボード
　２０，２２　ダクト
　２１　ユニット外枠
　２１ａ　枠柱
　９１，９２　電源ユニット 11 Power elements (high heat generation electronic components)
DESCRIPTION OF SYMBOLS 12 Water supply pipe 12a Nipple 13 Blower fan 14,24 Water cooling heat sink 14a, 24a Water flow hole 15 Support | pillar 16 Mounting board 17 Cooling air 18 Low heat generation electronic circuit component 18b Other low heat generation electronic circuit components 19 Other mounting boards 20, 22 Duct 21 Unit outer frame 21a Frame pillar 91, 92 Power supply unit
　以下に、本発明にかかる電源ユニットの実施の形態を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。 Hereinafter, embodiments of a power supply unit according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.
実施の形態１．
　図１は、本発明にかかる電源ユニットの実施の形態１を模式的に示す斜視図であり、図２は、実施の形態１の電源ユニットを模式的に示す正面図である。 Embodiment 1 FIG.
FIG. 1 is a perspective view schematically showing a first embodiment of a power supply unit according to the present invention, and FIG. 2 is a front view schematically showing the power supply unit of the first embodiment.
　図１及び図２に示すように、実施の形態１の電源ユニット９１は、高発熱電子部品である複数のパワー素子１１（パワーＭＯＳＦＥＴ、サイリスタ、パワーダイオード等）が両側に取付けられた水冷ヒートシンク１４と、水冷ヒートシンク１４が設置されるとともに、パワー素子１１に接続される低発熱電子回路部品１８（パワーＭＯＳＦＥＴのゲート回路部品及びゲート回路用の電源部品、複数個のパワー素子１１を並列に接続する場合の分流用リアクトル等）が実装された矩形の実装ボード１６と、を備え、水冷ヒートシンク１４と実装ボード１６とにより、低発熱電子回路部品１８を空冷するダクト２０を形成している。 As shown in FIGS. 1 and 2, the power supply unit 91 of the first embodiment includes a water-cooled heat sink 14 in which a plurality of power elements 11 (power MOSFET, thyristor, power diode, etc.) that are high heat generation electronic components are attached on both sides. In addition, a water-cooled heat sink 14 is installed, and a low heat generation electronic circuit component 18 connected to the power element 11 (a power MOSFET gate circuit component and a power supply component for the gate circuit, and a plurality of power elements 11 are connected in parallel. A rectangular mounting board 16 mounted with a shunting reactor or the like), and the water-cooled heat sink 14 and the mounting board 16 form a duct 20 for air-cooling the low heat-generating electronic circuit component 18.
　通水孔１４ａが設けられた金属製の水冷ヒートシンク１４は、実装ボード１６の略全長に亘る長さの四角梁状に形成されている。実施の形態１の電源ユニット９１は、３本の水冷ヒートシンク１４が略平行に設置された実装ボード１６を２枚備え、夫々の実装ボード１６の水冷ヒートシンク１４が設置された面同士を対向させるようにして２枚の実装ボード１６をユニット外枠２１内に配置し、ダクト２０を形成している。 The metal water-cooled heat sink 14 provided with the water passage holes 14 a is formed in a square beam shape having a length extending over substantially the entire length of the mounting board 16. The power supply unit 91 according to the first embodiment includes two mounting boards 16 on which three water-cooled heat sinks 14 are installed substantially in parallel so that the surfaces of the respective mounting boards 16 on which the water-cooled heat sinks 14 are installed face each other. Thus, the two mounting boards 16 are arranged in the unit outer frame 21 to form the duct 20.
　また、夫々の実装ボード１６の水冷ヒートシンク１４同士を当接させるようにして２枚の実装ボード１６を配置し、ダクト２０を形成している。ダクト２０を形成する実装ボード１６の外側には、パワー素子１１に接続される他の低発熱電子回路部品１８ｂ（例えば、インターロック回路部品等）を実装した他の実装ボード１９を設置している。 Further, the two mounting boards 16 are arranged so that the water-cooled heat sinks 14 of the respective mounting boards 16 are brought into contact with each other to form a duct 20. On the outside of the mounting board 16 forming the duct 20, another mounting board 19 on which another low heat generation electronic circuit component 18b (for example, an interlock circuit component or the like) connected to the power element 11 is mounted is installed. .
　他の実装ボード１９は、実装ボード１６よりも小さい矩形に形成され、ダクト２０を形成する実装ボード１６の外側に４本の支柱１５を介して設置されている。実施の形態１の電源ユニット９１では、他の低発熱電子回路部品１８ｂを実装した他の実装ボード１９を設置しているが、他の低発熱電子回路部品１８ｂを実装ボード１６に実装するようにすれば、他の実装ボード１９は、必ずしも必要ではない。 The other mounting board 19 is formed in a rectangular shape smaller than the mounting board 16, and is installed on the outside of the mounting board 16 forming the duct 20 via four support columns 15. In the power supply unit 91 of the first embodiment, the other mounting board 19 on which the other low heat generation electronic circuit component 18b is mounted is installed, but the other low heat generation electronic circuit component 18b is mounted on the mounting board 16. In this case, the other mounting board 19 is not always necessary.
　２枚の実装ボード１６は、冷水ヒートシンク１４同士を当接させるようにして方形のユニット外枠２１の４本の枠柱２１ａの中間部に四隅部を接続させている。ユニット外枠２１の外形寸法は、高さ約３０ｃｍ、幅約５０ｃｍ、奥行き約４０ｃｍである。実装ボード１６の一方の面に略平行に設置された３本の四角梁状の水冷ヒートシンク１４は、給水パイプ１２及びニップル１２ａにより直列に接続されて通水される。２枚の実装ボード１６の合計６本の水冷ヒートシンク１４を直列に接続して通水してもよい。給水パイプ１２は、ダクト２０の通風の邪魔にならないように、ニップル１２ａを介して半円状に湾曲させてダクト２０の外側に配置されている。 The two mounting boards 16 have the four corners connected to the middle part of the four frame pillars 21a of the rectangular unit outer frame 21 so that the cold water heat sinks 14 are brought into contact with each other. The outer dimensions of the unit outer frame 21 are about 30 cm in height, about 50 cm in width, and about 40 cm in depth. Three rectangular beam-shaped water-cooled heat sinks 14 installed substantially parallel to one surface of the mounting board 16 are connected in series by a water supply pipe 12 and a nipple 12a to pass water. A total of six water-cooled heat sinks 14 of the two mounting boards 16 may be connected in series to pass water. The water supply pipe 12 is arranged outside the duct 20 by being bent in a semicircular shape via the nipple 12 a so as not to obstruct the ventilation of the duct 20.
　実装ボード１６の水冷ヒートシンク１４が設置された一方の面に低発熱電子回路部品１８を実装し、低発熱電子回路部品１８がダクト２０の中に配置されるようにし、電源ユニット９１の正面に設置された送風ファン１３により、ダクト２０内に送風された冷却風１７により、低発熱電子回路部品１８が効率よく冷却できるようにする。 A low heat generation electronic circuit component 18 is mounted on one surface of the mounting board 16 on which the water-cooled heat sink 14 is installed, and the low heat generation electronic circuit component 18 is disposed in the duct 20 and is installed in front of the power supply unit 91. The low-heat-generating electronic circuit component 18 can be efficiently cooled by the cooling air 17 blown into the duct 20 by the blown fan 13.
　また、実装ボード１６には、パワーＭＯＳＦＥＴ、サイリスタ、パワーダイオード等のパワー素子１１の近くに実装すべき低発熱電子回路部品１８、例えば、パワーＭＯＳＦＥＴのゲート回路部品及びゲート回路用の電源部品、複数個のパワー素子を並列に接続する場合の分流用リアクトル等を実装しているので、回路のインピーダンスやノイズ等を低減することができる。また、回路上、パワー素子１１から離れて実装しても問題の無い他の低発熱電子回路部品１８ｂ、例えば、インターロック回路等は、他の実装ボード１９に実装している。 The mounting board 16 includes a low heat generation electronic circuit component 18 to be mounted near the power element 11 such as a power MOSFET, a thyristor, and a power diode, for example, a power MOSFET gate circuit component and a power circuit component for the gate circuit. Since the shunt reactor for connecting the power elements in parallel is mounted, the impedance and noise of the circuit can be reduced. In addition, other low heat generation electronic circuit components 18 b that do not have a problem even if mounted away from the power element 11 on the circuit, such as an interlock circuit, are mounted on another mounting board 19.
　以上説明した実施の形態１の電源ユニット９１によれば、高発熱電子部品１１と低発熱電子回路部品１８とを別ボードに実装する必要はない。また、低発熱電子回路部品のうち、比較的発熱量の大きなものをダクト２０内に実装し、比較的発熱量の小さなものをダクト２０外に実装することができ、冷却効率の向上、送風ファン１３の設置数を削減することができる。 According to the power supply unit 91 of the first embodiment described above, it is not necessary to mount the high heat generation electronic component 11 and the low heat generation electronic circuit component 18 on different boards. Further, among the low heat generation electronic circuit components, those having a relatively large amount of heat generation can be mounted in the duct 20, and those having a relatively small amount of heat generation can be mounted outside the duct 20, thereby improving the cooling efficiency and blowing fan The number of installations of 13 can be reduced.
　また、高発熱電子部品１１が取付けられた水冷ヒートシンク１４と低発熱電子回路部品１８が実装された実装ボード１６とにより、ダクト２０を形成したので、高発熱電子回路部品１１は、水冷されるとともに空冷され、高発熱電子回路部品１１の冷却効率が向上している。 Further, since the duct 20 is formed by the water-cooled heat sink 14 to which the high heat generating electronic component 11 is attached and the mounting board 16 on which the low heat generating electronic circuit component 18 is mounted, the high heat generating electronic circuit component 11 is cooled with water. The cooling efficiency of the high heat generating electronic circuit component 11 is improved by air cooling.
実施の形態２．
　図３は、実施の形態２の電源ユニットを模式的に示す正面図である。図３に示すように、実施の形態２の電源ユニット９２は、高発熱電子部品である複数のパワー素子１１が両側に２列に取付けられた高さの高い水冷ヒートシンク２４と、水冷ヒートシンク２４が設置されるとともに、パワー素子１１に接続される低発熱電子回路部品１８が実装された矩形の実装ボード１６と、を備え、水冷ヒートシンク２４と実装ボード１６とにより、低発熱電子回路部品１８を空冷するダクト２２を形成している。 Embodiment 2. FIG.
FIG. 3 is a front view schematically showing the power supply unit of the second embodiment. As shown in FIG. 3, the power supply unit 92 of the second embodiment includes a high-temperature water-cooled heat sink 24 in which a plurality of power elements 11 that are highly heat-generating electronic components are attached in two rows on both sides, and a water-cooled heat sink 24. And a rectangular mounting board 16 on which a low heat generation electronic circuit component 18 connected to the power element 11 is mounted. The water cooling heat sink 24 and the mounting board 16 are used to air-cool the low heat generation electronic circuit component 18. A duct 22 is formed.
　２本の通水孔２４ａが設けられた高さの高い金属製の水冷ヒートシンク２４は、実装ボード１６の略全長に亘る長さの四角梁状に形成されている。実施の形態２の電源ユニット９２は、１本の水冷ヒートシンク２４が設置された実装ボード１６を２枚備え、夫々の実装ボード１６の水冷ヒートシンク２４が設置された面同士を対向させるようにして２枚の実装ボード１６をユニット外枠２１内に配置し、ダクト２２を形成している。 The high-temperature metal water-cooled heat sink 24 provided with the two water passage holes 24 a is formed in a square beam shape having a length extending over substantially the entire length of the mounting board 16. The power supply unit 92 of the second embodiment includes two mounting boards 16 on which one water-cooled heat sink 24 is installed, and the surfaces of the respective mounting boards 16 on which the water-cooled heat sink 24 is installed face each other. A single mounting board 16 is arranged in the unit outer frame 21 to form a duct 22.
　また、一方の実装ボード１６に設置された水冷ヒートシンク２４の端面を他方の実装ボード１６に当接させるようにして２枚の実装ボード１６を配置し、ダクト２２を形成している。ダクト２２を形成する実装ボード１６の外側には、パワー素子１１に接続される他の低発熱電子回路部品１８ｂを実装した他の実装ボード１９を設置している。 Further, the two mounting boards 16 are arranged so that the end surface of the water-cooled heat sink 24 installed on one mounting board 16 is in contact with the other mounting board 16 to form a duct 22. On the outside of the mounting board 16 forming the duct 22, another mounting board 19 on which another low heat generating electronic circuit component 18b connected to the power element 11 is mounted is installed.
　他の実装ボード１９は、実装ボード１６よりも小さい矩形に形成され、ダクト２２を形成する実装ボード１６の外側に４本の支柱１５を介して設置されている。２枚の実装ボード１６は、夫々設置された冷水ヒートシンク２４の端面を他方の実装ボード１６に当接させるようにして方形のユニット外枠２１の４本の枠柱２１ａの中間部に四隅部を接続させている。 The other mounting board 19 is formed in a rectangular shape smaller than the mounting board 16, and is installed on the outside of the mounting board 16 forming the duct 22 via the four support columns 15. The two mounting boards 16 have four corners in the middle part of the four frame pillars 21a of the rectangular unit outer frame 21 so that the end face of the cold water heat sink 24 installed is in contact with the other mounting board 16. Connected.
　高さの高い四角梁状の水冷ヒートシンク２４には、２本の通水孔２４ａが設けられていて、２本の通水孔２４ａは、後側で図示しないパイプにより連通され、図３の下側の通水孔２４ａに給水され、図３の上側の通水孔２４ａを通して排水される。 The water cooling heat sink 24 having a high square beam shape is provided with two water passage holes 24a, and the two water passage holes 24a communicate with each other by a pipe (not shown) on the rear side. Water is supplied to the water passage hole 24a on the side and drained through the water hole 24a on the upper side in FIG.
　実装ボード１６の水冷ヒートシンク２４が設置された一方の面に低発熱電子回路部品１８を実装し、低発熱電子回路部品１８がダクト２２の中に配置されるようにし、電源ユニット９２の正面に設置された送風ファン１３により、ダクト２２内に送風された冷却風により、低発熱電子回路部品１８が効率よく冷却できるようにする。 The low heat generation electronic circuit component 18 is mounted on one surface of the mounting board 16 on which the water-cooled heat sink 24 is installed, and the low heat generation electronic circuit component 18 is disposed in the duct 22 and is installed in front of the power supply unit 92. The low-heat-generating electronic circuit component 18 can be efficiently cooled by the cooling air blown into the duct 22 by the blown fan 13.
　また、実施の形態１の電源ユニット９１と同様に、実装ボード１６には、回路のインピーダンスやノイズ等の問題から、パワーＭＯＳＦＥＴ、サイリスタ、パワーダイオード等のパワー素子１１の近くに実装すべき低発熱電子回路部品１８、例えば、パワーＭＯＳＦＥＴのゲート回路部品及びゲート回路用の電源部品、複数個のパワー素子を並列に接続する場合の分流用リアクトル等を実装し、回路上、パワー素子１１から離れて実装しても問題の無い他の低発熱電子回路部品１８ｂ、例えば、インターロック回路等は、他の実装ボード１９に実装してもよい。また、実施の形態２の電源ユニット９２は、２枚の実装ボード１６と、２本の水冷ヒートシンク２４とにより、ダクト２２を形成しているが、２枚の実装ボード１６の一方を、例えば、電源ユニット９２の筐体等の別部材で構成してもよい。 Similarly to the power supply unit 91 of the first embodiment, the mounting board 16 has low heat generation to be mounted near the power element 11 such as a power MOSFET, a thyristor, and a power diode due to problems such as circuit impedance and noise. An electronic circuit component 18, for example, a power MOSFET gate circuit component and a power supply component for the gate circuit, a shunting reactor for connecting a plurality of power elements in parallel, and the like are mounted on the circuit and away from the power element 11. Other low heat generation electronic circuit components 18 b that do not have any problem even if mounted, for example, an interlock circuit, may be mounted on another mounting board 19. Further, in the power supply unit 92 of the second embodiment, the duct 22 is formed by the two mounting boards 16 and the two water-cooled heat sinks 24, but one of the two mounting boards 16 is, for example, You may comprise by another members, such as a housing | casing of the power supply unit 92. FIG.
　以上説明した実施の形態２の電源ユニット９２においても、実施の形態１の電源ユニット９１と同様の効果が得られる。 In the power supply unit 92 of the second embodiment described above, the same effect as that of the power supply unit 91 of the first embodiment can be obtained.
　以上のように、本発明にかかる電源ユニットは、特に、レーザー発振器の電源盤用の電源ユニットに適している。 As described above, the power supply unit according to the present invention is particularly suitable for a power supply unit for a laser oscillator power supply panel.

Claims (5)

  1. 　高発熱電子部品であるパワー素子が取付けられた水冷ヒートシンクと、
    　前記水冷ヒートシンクが設置されるとともに、前記パワー素子に接続される低発熱電子回路部品が実装された実装ボードと、
    　を備え、前記水冷ヒートシンクと前記実装ボードとにより、前記低発熱電子回路部品を空冷するダクトを形成したことを特徴とする電源ユニット。     A water-cooled heat sink with a power element that is a highly heat-generating electronic component,
    A mounting board on which the water-cooled heat sink is installed and a low heat generation electronic circuit component connected to the power element is mounted;
    And a water-cooling heat sink and the mounting board form a duct for air-cooling the low heat generation electronic circuit component.
  2. 　前記水冷ヒートシンクは、前記実装ボードの略全長に亘る長さの四角梁状に形成されていることを特徴とする請求項１に記載の電源ユニット。 2. The power supply unit according to claim 1, wherein the water-cooled heat sink is formed in a square beam shape having a length covering substantially the entire length of the mounting board.
  3. 　前記水冷ヒートシンクが設置された実装ボードを少なくとも２枚備え、夫々の実装ボードの水冷ヒートシンクが設置された面同士を対向させるようにして２枚の実装ボードを配置し、前記ダクトを形成したことを特徴とする請求項１に記載の電源ユニット。 It is provided with at least two mounting boards on which the water-cooled heat sinks are installed, and the two mounting boards are arranged so that the surfaces on which the water-cooled heat sinks are installed face each other, and the duct is formed. The power supply unit according to claim 1, wherein:
  4. 　前記水冷ヒートシンクが設置された実装ボードを少なくとも２枚備え、夫々の実装ボードの水冷ヒートシンク同士を当接させるようにして２枚の実装ボードを配置し、前記ダクトを形成したことを特徴とする請求項１に記載の電源ユニット。 The at least two mounting boards provided with the water-cooled heat sink are provided, the two mounting boards are arranged so that the water-cooled heat sinks of the respective mounting boards are in contact with each other, and the duct is formed. Item 2. The power supply unit according to Item 1.
  5. 　前記ダクトを形成した実装ボードの外側に、前記パワー素子に接続される他の低発熱電子回路部品を実装した他の実装ボードを設置したことを特徴とする請求項１に記載の電源ユニット。 2. The power supply unit according to claim 1, wherein another mounting board on which another low heat generation electronic circuit component connected to the power element is mounted is installed outside the mounting board on which the duct is formed.
PCT/JP2008/061666 2008-06-26 2008-06-26 Power supply unit WO2009157080A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101795055A (en) * 2010-04-08 2010-08-04 三一电气有限责任公司 Cooling device and cooling method for convertor and convertor
US20100309630A1 (en) * 2009-06-05 2010-12-09 Rodney Jones Integrated heat exchanger
EP3099153A1 (en) * 2015-05-26 2016-11-30 Hitachi, Ltd. Power supply apparatus
WO2023078397A1 (en) * 2021-11-05 2023-05-11 北京比特大陆科技有限公司 Liquid cooling server

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JPH01191917A (en) * 1988-01-27 1989-08-02 Nec Corp Cooling structure for electronic equipment
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JPH0837387A (en) * 1994-07-22 1996-02-06 Nec Corp Heat radiating and mounting structure for power amplifier
JPH08186388A (en) * 1994-12-28 1996-07-16 Fuji Electric Co Ltd Cooling device of electronic equipment

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JPH01191917A (en) * 1988-01-27 1989-08-02 Nec Corp Cooling structure for electronic equipment
JPH0832262A (en) * 1994-07-13 1996-02-02 Nec Corp Cooling module for lsi
JPH0837387A (en) * 1994-07-22 1996-02-06 Nec Corp Heat radiating and mounting structure for power amplifier
JPH08186388A (en) * 1994-12-28 1996-07-16 Fuji Electric Co Ltd Cooling device of electronic equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100309630A1 (en) * 2009-06-05 2010-12-09 Rodney Jones Integrated heat exchanger
CN101795055A (en) * 2010-04-08 2010-08-04 三一电气有限责任公司 Cooling device and cooling method for convertor and convertor
EP3099153A1 (en) * 2015-05-26 2016-11-30 Hitachi, Ltd. Power supply apparatus
US9750125B2 (en) 2015-05-26 2017-08-29 Hitachi, Ltd. Power supply apparatus
WO2023078397A1 (en) * 2021-11-05 2023-05-11 北京比特大陆科技有限公司 Liquid cooling server

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