WO2009084489A1

WO2009084489A1 - Laser working apparatus, and laser working method

Info

Publication number: WO2009084489A1
Application number: PCT/JP2008/073250
Authority: WO
Inventors: Atsushi Imura; Akira Ejimatani
Original assignee: Mitsuboshi Diamond Industrial Co., Ltd.
Priority date: 2007-12-28
Filing date: 2008-12-19
Publication date: 2009-07-09
Also published as: TWI365114B; TW200936291A

Abstract

Provided is a laser working apparatus which can apply an auxiliary parting force to the parting plane of the crack in accordance with the progressing situations of a crack, thereby to perform a full-cut work reliably to the terminal end of the substrate. The laser working apparatus comprises substrate supporting mechanisms (15 and 16) for floating an edge side (1), a hook mechanism (17), a hook mechanism moving unit (19) for moving the hook mechanism horizontally, and an auxiliary parting force control unit for controlling the hook mechanism and the hook mechanism moving unit (19) thereby to apply the parting force for aiding the progress of the crack. The auxiliary parting force control unit performs controls to insert a protrusion into the opening of the crack, when the distance between the center substrate parting plane and the edge side parting plane of the opened crack is sufficient, to start the horizontal movement of the hook mechanism thereby to bring the parting plane of the crack and the protrusion close to each other, and to apply the parting force to the parting plane of the crack after the protrusion abuts on the parting plane of the crack.

Description

Laser processing apparatus and laser processing method

The present invention relates to a laser processing apparatus that heats a brittle material substrate by scanning a laser beam and then cools it to divide the substrate.

In the present invention, the “brittle material substrate” includes not only a glass substrate but also a substrate such as quartz, single crystal silicon, sapphire, semiconductor wafer, or ceramic. Further, a bonded substrate such as an LCD substrate is also included. The following description will be made mainly using a glass substrate, but the same applies to other brittle material substrates.

When a brittle material substrate such as glass (hereinafter referred to as “substrate”) is heated at a temperature lower than the temperature at which the substrate softens while scanning with a laser beam, compressive stress is generated in the heating region. Furthermore, a cooling medium is sprayed and cooled behind the laser beam irradiation, thereby generating a tensile stress in the cooling region. In this manner, a stress gradient is formed by forming a region where tensile stress is generated in the vicinity of a region where compressive stress is generated. In recent years, a processing technique for dividing a glass substrate using this stress gradient has been used.

There are two types of cutting using a laser: scribe processing and full cut processing. In the scribing process, a heating region (compressive stress region) is formed inside the substrate, and a cooling region (tensile stress region) is formed on the substrate surface by heating with a laser beam first and then cooling with refrigerant injection. This is a process for forming a crack (scribe line) having a depth that does not reach the back surface of the substrate (for example, a depth of about 10 to 20% of the plate thickness) by generating a stress difference in the depth direction.
In the case of scribe processing, after the scribe line is formed, the substrate can be divided by, for example, performing a break process that applies a bending moment by pressing a break bar along the scribe line.

On the other hand, full-cut processing is processing that forms a crack reaching the substrate back surface from the substrate surface, and is processing that can divide the substrate without performing a break treatment (see Patent Document 1 and Patent Document 2). In full cut processing, due to the difference in stress in the front-rear direction between the front heating region (compressive stress region) and the rear cooling region (tensile stress region), the force to tear the back of the substrate in the left-right direction compared to the front This is a process in which the substrate is completely divided by working.
Whether it is scribe processing or full cut processing depends on processing conditions such as heating conditions (irradiation time, irradiation power, scanning speed, etc.) and cooling conditions (refrigerant temperature, spray amount, spray position, etc.) It also depends on the contact state between the table surface on which the substrate to be processed is placed and the glass substrate.

That is, in general, in the case of full cut processing, the substrate is completely divided by a force (called a dividing force) that causes the rear of the substrate to tear in the left-right direction compared to the front. Is in direct contact with the glass substrate and the table surface, the frictional resistance against this breaking force acts, so that the breaking force is canceled out by the frictional resistance, resulting in a full-cut process and scribe. It becomes processing.
Therefore, when performing full cut processing, as disclosed in Patent Document 1 and Patent Document 2, the substrate is lifted from the table surface and processed so as to suppress frictional resistance. By breaking the substrate by such a full cut process, a break process is unnecessary.
Japanese Patent No. 3887394 Japanese Patent Laid-Open No. 2007-90860

FIG. 15 is a diagram showing a change when the edge material portion G1 of the substrate G is divided by full cut processing.
Here, the central portion G0 of the substrate G is fixed to a table (not shown), and the edge side portion G1 is floated from the table to be in a non-contact state.
In the full cut processing, the heating / cooling mechanism 10 having the laser beam spot BS (laser beam irradiation region) and the cooling spot CS (refrigerant injection region) is formed on the substrate G as shown in FIG. It moves relatively from the division start end toward the division end end on the opposite side.

For convenience of explanation, the moving direction of the beam spot BS and the cooling spot CS is defined as the Y direction. When the traveling distance d of the heating / cooling mechanism unit 10 is short, as shown in FIG. 15B, a crack is formed, and the edge material G1 is formed from the starting end of the division. The opening width in the X direction orthogonal to the direction widens, and the dividing surface of the edge member G1 moves in the X direction.

Subsequently, when the heating / cooling mechanism 10 advances and the traveling distance d becomes longer, as shown in FIG. 15C, the edge formed as the tip of the crack moves away from the dividing start end of the substrate G. The length from the division | segmentation start end of the material G1 becomes long, and the weight of the edge material G1 formed by it increases.
Therefore, as the tip of the crack moves away from the dividing start end of the substrate G, it becomes difficult to develop the crack only by the dividing force generated by the thermal stress difference, and the crack has progressed without difficulty in the vicinity of the dividing start end. When reaching the center of the substrate, the progress of cracks becomes difficult and the progress may stop. That is, although the substrate G is lifted to eliminate the frictional resistance, when the crack due to the full cut progresses to the vicinity of the center of the substrate, the edge material G1 moves in the X direction against the weight of the edge material G1. Is likely to occur little by little, and a greater breaking force is required, making it difficult for the crack to progress.

Further, as shown in FIG. 15 (d), when the beam spot BS deviates from the outside of the substrate, only the cooling spot CS remains on the substrate, and the thermal stress difference in the front-rear direction becomes small, and the left-right direction. As a result, the progress of cracks may be stopped as a result of a decrease in the force (breaking force) for breaking the cracks.

In order to solve such a problem, in Patent Document 2 described above, the substrate holding mechanism is provided with a stress applying mechanism. Specifically, an external force applying unit that applies an external force to the substrate by a fine movement stage is provided, and applied in the lateral direction (X direction) when the position of the split unit moves from the dividing start point, the center, and the dividing end point. I try to control the force.

However, in this method, a movement sensor (position detector) is provided to detect the movement of the fine movement stage that gives stress, and fine movement is applied so as to apply a preset lateral stress (breaking force) based on the detection result. The stage is controlled. Therefore, stress is applied regardless of the progress of the crack, and depending on the progress of the crack, unnecessary force may be forcibly applied to the tip of the crack, or the formed crack may deviate from the planned cutting line. .

Therefore, the present invention does not forcibly advance the progress of the crack by applying an external force at the beginning of the splitting, and the auxiliary splitting force is applied to the crack after it becomes necessary according to the progress of the crack. It is an object of the present invention to provide a laser processing apparatus which can be added to a sectional surface and can surely perform full cut processing to the end of the substrate.

In addition, in a bonded substrate such as an LCD substrate, in order to form a terminal portion, there is a case in which only the end material (end portion) of one side substrate is cut out and a dividing process is performed to expose the terminal electrode portion on the other side. . Even when such a dividing process is performed by a full-cut process, the problem of stopping the progress of cracks as described above occurs.
Accordingly, an object of the present invention is to provide a laser processing apparatus capable of reliably performing full-cut processing up to the end of the substrate even on a bonded substrate.

In addition, in order to perform full cut processing, when a coolant containing moisture is ejected while the substrate is levitated from the table surface (substrate support mechanism), the coolant wraps around between the substrate and the table surface and enters the table surface. Moisture may adhere. When the substrate comes down with moisture adhering to the table surface, the substrate and the table surface come into close contact with each other, making it difficult to move the substrate thereafter. Then, an object of this invention is to provide the laser processing apparatus which can perform a full cut process, suppressing the wraparound of the refrigerant | coolant to the table surface.

The laser processing apparatus of the present invention made to solve the above problems includes a substrate support mechanism that floats a portion of the brittle material substrate on the edge side from the planned dividing line and fixes the substrate on the center side of the planned dividing line, and one end An arm having a convex portion on the other end of the arm, and the convex portion of the arm enters a standby position where the convex portion of the arm is separated from the substrate and an opening of a crack formed in the substrate due to thermal stress. A hook mechanism for rotating the arm between the hook position and a hook for horizontally moving the hook mechanism in a direction in which the edge portion is pulled away from the center side when the convex portion enters the opening of the crack. A mechanism moving unit; and an auxiliary dividing force control unit that applies a dividing force for controlling the hook mechanism and the hook mechanism moving unit to assist the progress of the crack, and the auxiliary dividing When the distance between the sectional surface of the center substrate of the opened crack and the sectional surface of the edge portion becomes sufficient, the control unit inserts the convex portion into the opening of the crack, and then the hook mechanism The horizontal movement is started to reduce the distance between the dividing surface of the edge portion and the convex portion, and after the protruding portion comes into contact with the dividing surface of the edge portion, the dividing portion of the edge portion is Control is performed so as to apply a breaking force that assists the development of cracks via the convex portion.

The laser processing apparatus of the present case includes a heating / cooling mechanism having a laser beam irradiation mechanism and a cooling mechanism for injecting a refrigerant, and a scanning mechanism for moving the heating / cooling mechanism relative to a substrate made of a brittle material. The heating / cooling mechanism is relatively moved along the division line set for the substrate, heated at a temperature lower than the temperature at which the substrate is softened, and then the cooling spot is relatively moved along the trajectory through which the beam spot has passed. Then, by cooling the substrate and generating a crack penetrating the substrate due to thermal stress, the laser processing apparatus for the brittle material substrate that splits by proceeding with the crack along the planned cutting line.
Here, the scanning mechanism may move on the substrate side, or the heating / cooling mechanism (laser beam irradiation mechanism and cooling mechanism) may be moved.
According to the present invention, the laser beam irradiation mechanism is scanned along the scheduled cutting line, and then the cooling mechanism is scanned. As the heating / cooling mechanism (laser beam irradiation mechanism and cooling mechanism) is scanned, cracks penetrating from the upper surface to the lower surface of the substrate due to thermal stress (cracks that become full-cut processing) will occur on the dividing line on the dividing start side. Is formed, and progresses along the line to be divided. At a rear position a little away from the tip of the developing crack, the crack spreads and an opening is formed. The auxiliary dividing force control unit inserts the convex portion of the hook mechanism into the opening of the crack. The timing of inserting the convex portion is after the crack has spread to such an extent that the convex portion and the cross section of the crack do not contact each other. The timing may be set such that the heating / cooling mechanism (laser beam irradiation mechanism and cooling mechanism) is scanned at a constant speed, and is inserted after a certain time has elapsed from the start of scanning. That is, the convex portion is inserted when the beam spot and the cooling spot are scanned for a certain distance from the dividing start end. Alternatively, as will be described later, the opening of a crack actually formed in the substrate may be monitored, and the convex portion may be inserted when the opening is sufficiently opened. Then, the hook mechanism moving unit horizontally moves the hook mechanism in a direction perpendicular to the planned dividing line (a direction away from the center of the substrate).
The opening of the crack grows as the crack tip progresses (when the crack tip is close to the dividing start end) at the beginning (the width of the opening widens), but when the crack tip moves away from the dividing start end, Eventually the growth will decrease (the width of the opening will not change easily). Therefore, the timing for starting the horizontal movement may be started immediately after the convex portion is inserted into the crack, or may be started after the width of the opening is sufficiently widened.

When the hook mechanism is arranged on the lower surface side of the substrate and the distance between the crack section and the convex portion is made closer, the edge side portion (hereinafter referred to as edge material) can be moved on the arm of the hook mechanism. It is preferable to constitute such that it is supported. In such a configuration, when the tip of the formed crack does not advance a sufficient distance from the hook mechanism toward the end of cutting of the substrate, the edge member moves on the arm and moves in the X direction. If the tip of the crack is restrained and a sufficient distance has advanced from the hook mechanism toward the cutting end of the substrate, the edge material stays on the arm by the frictional force with the arm and moves in the X direction. It is preferable to set the frictional force between the material and the arm. As described above, since the edge member and the arm are connected with play, a factor that hinders the crack development according to the crack progress state such as the crack start position or the width of the formed opening (weight due to the extension of the edge member). Increase) can be easily removed.
Furthermore, the convex part horizontally moved by the hook mechanism moving part comes close to the crack section, and eventually the crack section and the convex part come into contact with each other and press it. The magnitude of this pressing force is sufficient to press the edge material in the X direction so that the progress of the crack is not hindered by the weight of the formed edge material or the like.
In this way, the actual crack propagation is reduced and an auxiliary breaking force is applied after it becomes necessary.

The auxiliary dividing force control unit is a step of inserting the convex portion into the opening of the crack at a predetermined timing, a step of starting the horizontal movement of the hook mechanism to reduce the distance between the crack sectional surface and the convex portion. In addition, a control program may be set in advance so as to start the step of applying a breaking force that assists the progress of cracks via the convex portion.
In this case, each timing may be set by detecting the elapsed time from the start of the division of the heating / cooling mechanism or the position of the heating / cooling mechanism.
Further, the crack may be observed with a camera, and each timing may be set based on the result.
The auxiliary dividing force control unit starts the horizontal movement of the hook mechanism to reduce the distance between the crack sectional surface and the convex part, and after the convex part comes into contact with the crack sectional surface, Alternatively, or immediately, a dividing force for assisting the progress of the crack may be applied to the convex portion with respect to the crack cross section.
The laser processing method of the present invention is a processing method in which a brittle material substrate is locally heated and a crack is formed in the substrate by the thermal stress to divide the substrate. A step of fixing the substrate to the substrate support mechanism at a center side of the line, a step of irradiating the laser beam while moving along the line to be divided, and an arm having a convex portion at one end is moved to the substrate. The step of inserting the convex portion into the opening of the formed crack, and a part of the arm is brought into contact with the main surface of the edge side portion, and in this state, the distance between the sectional surface of the edge side portion and the convex portion is reduced. And a step of horizontally moving the arm. Furthermore, after the convex part of the arm abuts against the dividing surface of the edge side part, the step of operating the dividing part of the edge side part so as to apply a dividing force that assists the progress of cracks via the convex part. It comprises.

According to the present invention, after the progress of the crack has slowed (or stopped), the convex portion of the locking portion comes into contact with the cross section of the crack, and then an auxiliary cutting force is applied. Therefore, an auxiliary cutting force can be applied without difficulty, and the cutting line is not formed outside the planned cutting line, and the full cut processing can be reliably performed up to the end of the substrate.

(Means and effects for solving other problems)
In the above invention, it is preferable that the hook mechanism is provided at least at a position near the substrate end on the dividing start side. The hook mechanism provided at the dividing start end can assist the progress of the crack to the vicinity of the substrate end.

In the above invention, the hook mechanism may be provided at two locations, at least a position near the substrate end on the dividing start side and a position separated by a predetermined distance inside the substrate end on the dividing end side.
According to this, the progress of the crack to the vicinity of the substrate end can be assisted by the hook mechanism provided at the dividing start end. Further, the hook mechanism provided in the vicinity of the substrate end can assist the dividing force in the vicinity of the substrate end by the laser irradiation mechanism, and the substrate can be reliably divided up to the end of the substrate. In addition, the predetermined distance here means the distance to the region where the convex portion of the locking portion can enter the tear (gap) without contacting the dividing surface.

In the above invention, when the hook mechanism is arranged on the lower surface side of the substrate and the distance between the crack cross section and the convex portion is made closer, the edge side portion is supported so as to be movable on the arm of the hook mechanism. It may be.
According to the present invention, it is possible to support the edge side portion that is being separated from the center side as the crack progresses in a state that it can move on the arm of the hook mechanism. As a result, a certain breaking force is applied while absorbing the displacement in the direction perpendicular to the direction of pulling the hook mechanism (X direction) (Y direction) and the rotational direction of the XY plane (θ direction). be able to.

In the above invention, the hook mechanism may move and / or turn the locking portion in the XYZ triaxial directions.
Thereby, the movement in the Y direction, the movement in the Z direction, and the θ rotation can be appropriately absorbed, and a reliable transmission of the dividing force to the edge material side substrate is possible.

In the above invention, the hook mechanism has a contact portion where the convex portion of the locking portion comes into contact with the crack cross section, and assists the progress of the crack via the convex portion with respect to the crack cross section. An adjustment mechanism that gives a degree of freedom other than the moving direction by the hook mechanism moving unit may be provided so that the contact portion is in close contact with and moves with respect to the divided cross section of the crack when the dividing force is applied.

In the above invention, the adjustment mechanism may be configured by a support shaft that rotates the locking portion with respect to the arm of the hook mechanism.
By providing a support shaft for rotating the locking portion, a degree of freedom other than the moving direction by the hook mechanism moving portion can be given.

In the above invention, an opening detection unit for detecting an opening of a crack may be further provided, and the auxiliary dividing force control unit may insert the convex portion of the hook mechanism into the opening according to the detected opening of the crack. .
According to the present invention, it is possible to determine the opening width by the crack opening detecting portion and insert the convex portion with the opening being reliably opened. Therefore, the convex portion is not inserted in a state where the opening is not opened by mistake, and the convex portion and the substrate do not collide to damage the substrate.

In the above invention, the substrate support mechanism may inject a curtain gas that prevents the coolant from entering the floating portion when the edge portion floats from the planned dividing line.
Thereby, even when moisture is contained in the refrigerant, it is possible to eliminate the problem that it becomes difficult for the substrate to move because the substrate support mechanism and the substrate are in close contact with each other due to the moisture.

In the above invention, the substrate support mechanism may include a suction mechanism that prevents the refrigerant from entering the floating portion when the edge side portion is lifted from the planned dividing line.
Thereby, even when moisture is contained in the refrigerant, it is possible to eliminate the problem that it becomes difficult for the substrate to move because the substrate support mechanism and the substrate are in close contact with each other due to the moisture.

The block diagram of the laser processing apparatus LM1 which is one Embodiment of this invention. The figure which shows the control system of the laser processing apparatus of FIG. The figure which shows the advancing state of the crack of the board | substrate G in each time in the parting process by the laser processing apparatus LM1. The figure which shows the operation | movement of each time of the hook mechanism by the laser processing apparatus LM1. The block diagram of the laser processing apparatus LM2 which is 2nd embodiment of this invention. The figure which shows the advancing state of the crack of the board | substrate G in each time in the parting process by the laser processing apparatus LM2. The figure which shows the operation | movement of each time of the hook mechanism by the laser processing apparatus LM2. The front view of laser processing apparatus LM3 which is 3rd embodiment of this invention. The front view of laser processing apparatus LM4 which is 4th embodiment of this invention. The front view of laser processing apparatus LM5 which is 5th embodiment of this invention. The perspective view of the laser processing apparatus LM6 which is 6th embodiment of this invention. The figure which shows the control system of the laser processing apparatus LM6 of FIG. The figure which shows the deformation | transformation embodiment of a hook mechanism. The figure which shows the deformation | transformation embodiment of a hook mechanism. The figure which shows a change when the edge material part of a board | substrate is parted by the conventional full cut process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Laser beam irradiation mechanism 12 Cooling mechanism 14

Conveyance mechanism

15, 16

Substrate support mechanism

17, 18 Hook mechanism 19 20 Hook mechanism moving part

Hereinafter, embodiments of the present invention will be described with reference to the drawings, taking a laser processing apparatus for processing a glass substrate as an example.

(Embodiment 1)
FIG. 1 is an overall configuration diagram of a laser processing apparatus LM1 according to an embodiment of the present invention. FIG. 1 (a) is a perspective view, FIG. 1 (b) is a front view, and FIG. 1 (c) is a plan view. .
Here, the substrate to be processed is a single glass plate, and the right edge material G1 of the substrate G is cut along the planned cutting line L on the lower surface of the substrate by full cut processing from the central substrate body G0. Here, laser beam irradiation and refrigerant injection are performed from the lower surface side of the substrate G.

The laser processing apparatus LM1 includes a heating / cooling mechanism unit 10 having a laser beam irradiation mechanism 11 and a cooling mechanism 12 for injecting a coolant, and a scanning mechanism 13 (not configured) that moves the heating / cooling mechanism unit 10 relative to the substrate G by driving a motor. ), A transport mechanism 14 for transporting the substrate,

substrate support mechanisms

15 and 16,

hook mechanisms

17 and 18, and hook

mechanism moving portions

19 and 20. The hook mechanism 18 and the hook mechanism moving unit 20, and the hook mechanism 17 and the hook mechanism moving unit 19 have the same structure, and are arranged on the back side of the drawing of the hook mechanism 17 and the hook mechanism moving unit 20 in FIG. Has been.

The laser beam irradiation mechanism 11 includes a CO ₂ laser light source and a lens optical system that irradiates the beam spot BS on the substrate by shaping the cross-sectional shape of the laser beam emitted from the laser light source into an ellipse. The cooling mechanism 12 includes a nozzle that injects a coolant containing moisture to form a cooling spot CS on the substrate. These are moved along the planned dividing line L by a scanning mechanism 10 (not shown) while keeping the distance between the laser beam irradiation mechanism 11 and the cooling mechanism 12 constant.

Below the substrate body G0 side of the substrate G, three rail-shaped

supports

15a, 15b, 15c arranged in parallel are installed as the substrate support mechanism 15. A large number of holes for suction chucks are provided in rows on the upper surfaces of the supports 15a to 15c. By operating the suction chucks, the substrate G (part of the substrate body G0) is adsorbed at a desired position. It can be fixed.
Further, between the

supports

15a and 15b and between 15b and 15c,

roller groups

14a and 14b are arranged as a transport mechanism 14 for transporting the substrate. The transport mechanism 14 is used when the substrate G is carried into or out of the processing area.

A float table 16a is installed as a substrate support mechanism 16 below the edge G1 side of the substrate G0. A large number of holes for blowing gas (dry air) onto the substrate are provided on the upper surface of the float table 16a so that the substrate (the portion of the edge material G1) can be floated. The entire substrate G is supported substantially horizontally by the cooperation of the substrate support mechanism 15 and the substrate support mechanism 16. As a vertical crack progresses from one end of the substrate G to the other end along the planned dividing line in one laser scanning, the substrate G is separated from the substrate G on the center side from the planned dividing line and separated into the center. The support by the side substrate G is gradually lost, causing a shift in the vertical direction. The edge member G1 in which the deviation occurs is supported on the arm 17c of the hook mechanism 17. The float table 16a is provided with an inclination mechanism 16b for inclining the upper surface thereof, and the edge member G1 cut off by the

hook mechanisms

17, 18 and the hook

mechanism moving parts

19, 20 described later can be dropped. I can do it.

The

hook mechanisms

17 and 18 include locking portions 17b and 18b having

convex portions

17a and 18a, and

arms

17c and 18c that can be swiveled by motor driving, and the locking portions 17b and 18b are separated from the substrate G. The arm 17c is rotated between the position and the locking position where the

protrusions

17a and 18a enter the vertical crack formed in the substrate G.
The hook

mechanism moving portions

19 and 20 are driven by the motor when the locking portions 17b and 18b are in contact with the edge material G1 that has started to be separated from the substrate G, and the substrate body G0 (center side). It can be moved so as to be separated in the horizontal direction (X direction).

In addition to the above, an elevating type cutter wheel for forming an initial crack (trigger crack) at the division start end of the substrate is provided together with the heating / cooling mechanism unit 10 so that an initial crack can be formed at the division start end of the line to be divided. It is. An initial crack is formed in advance by a cutter wheel in the substrate G carried into the processing region.
In the first embodiment, the laser beam irradiation mechanism 11 and the cooling mechanism 12 are provided on the lower surface side of the substrate G. However, these may be provided on the upper surface side.

Next, the control system of the laser processing apparatus LB1 will be described. FIG. 2 is a block diagram of the control system. In the laser scribing device LB1, the heating / cooling mechanism 10 (laser beam irradiation mechanism 11, cooling mechanism 12), scanning mechanism 13, transport mechanism 14, substrate support mechanism (support) 15, substrate support mechanism (float table) 16, hook Each unit of the

mechanisms

17 and 18 and the hook

mechanism moving units

19 and 20 is controlled by a control unit 21 configured by a computer (CPU). The control unit 21 is connected to an input unit 22 including a keyboard and a mouse, and a display unit 23 including a display screen for performing various displays. Necessary messages are displayed on the screen and necessary instructions and settings are made. It can be input. Then, the machining operation is executed based on the sequence program stored in advance.

Next, the cutting operation by the laser processing apparatus LM1 will be described. FIG. 3 is a view showing a progress state of a crack of the substrate G at each time point during the cutting process, and FIG. 4 is a view showing an operating state at each time point of the hook mechanisms 17 and 18 (corresponding to FIG. 1B). Figure).

FIG. 3A shows a state immediately after the scanning of the beam spot BS and the cooling spot CS is started from the division start end. As shown in FIG. 4A, the substrate G that has been transported by the transport mechanism 14 has the substrate body side G0 adsorbed and fixed by the supports 15a to 15c. On the other hand, the edge material G1 side is levitated by the gas blown from the float table 16a. Both

hook mechanisms

17 and 18 have moved to a standby position away from the substrate G.

FIG. 3 (b) shows a state when the beam spot BS and the cooling spot CS have slightly advanced from the dividing start end. A crack penetrating from the upper surface to the lower surface is generated on the planned dividing line on the dividing start end side, and an opening Gc is formed. When the opening Gc is formed, as shown in FIG. 4B, the hook mechanism 17 is operated, and the convex portion 17a of the hook mechanism 17 enters the opening Gc. At this time, when the distance between the divided cross section of the central substrate of the opened crack and the divided cross section of the edge side portion is sufficient, preferably the convex portion 17a is not in contact with the partial cross section Gf. The timing for inserting 17a is adjusted. Specifically, a delay time from the start of scanning to the operation of the hook mechanism 17 is set, the beam spot BS and the cooling spot CS wait until the beam spot BS and the cooling spot CS progress to some extent along the planned dividing line, and then the convex portion 17a is moved. Enter the opening Gc.

Thereafter, as the beam spot BS and the cooling spot CS proceed, the edge member G1 moves on the arm 17c as shown in FIG. 4C, and the crack opening Gc is slightly expanded. The other hook mechanism 18 (the back side of the paper) is still in the standby position and is not operating.

FIG. 3C shows a state in which the beam spot BS and the cooling spot CS have further advanced and have moved away from the division start end. At this time, the amount of movement of the edge member G1 on the arm 17c is reduced (or stopped). As shown in FIG. 4D, the hook mechanism moving unit 19 starts to pull the hook mechanism 17 in the lateral direction (X direction). Since the movement amount of the edge member G1 is reduced, the protrusion 17a gradually approaches the dividing surface Gf of the edge member G1, and eventually the protrusion 17a of the hook mechanism 17 as shown in FIG. 4 (e). Comes into contact with the dividing surface Gf of the edge member G1. After that, as the hook mechanism 17 moves in the X direction, the edge member G1 moves in the lateral direction (X direction), and the force to split right and left along the planned division line L (partitioning force) is assisted. Will be added.
That is, when the hook mechanism 17 is disposed on the lower surface side of the substrate G and the distance between the crack cross section and the convex portion 17a is reduced, the edge member G1 side can be moved on the arm 17c of the hook mechanism 17. To support. Here, when the tip of the crack formed before the convex portion 17a contacts the dividing surface Gf of the edge member G1, the edge does not advance from the hook mechanism 17 toward the cutting end of the substrate G by a sufficient distance. The material G1 moves on the arm 17c and is prevented from moving in the X direction. If the tip of the crack has advanced a sufficient distance from the hook mechanism 17 toward the cutting end of the substrate G before the projection 17a contacts the dividing surface Gf of the edge member G1, the edge member G1 is connected to the arm 17c. It stays on the arm 17c by the frictional force and moves in the X direction. Although the hook mechanism 17 supports the edge member G1 so as to be movable on the arm 17c, the edge member G1 contacts the arm 17c depending on the relationship between the air pressure that causes the substrate G to float and the weight of the edge member G1. In some cases, it will surface without any problems.
As described above, the edge member G1 has an appropriate play with the arm 17, that is, it is softly connected through the frictional force between the edge member G1 and the arm 17 (because it is not connected tightly). ) The force that presses the edge material in the X direction is automatically adjusted according to the crack progress state such as the leading position of the crack or the width of the formed opening.
At this time, the other hook mechanism 18 is not operated.

FIG. 3D shows a state in which the beam spot BS and the cooling spot CS have further progressed, and the beam spot BS has approached the end of the division line L of the substrate G. At this time, the hook mechanism 18 disposed on the side of the dividing end is newly activated, and the same operation state as that of the hook mechanism 17 shown in FIG. 4B, that is, the convex portion 18a of the locking portion 18b is opened. Gc enters the state. At this time, the timing at which the convex portion 18a is actuated is adjusted so that the convex portion 18a does not contact the dividing surface Gf (a delay time from the start of scanning until the hook mechanism 18 is actuated is set). After that, in the same operating state as the hook mechanism 17 shown in FIG. 4E, the edge member G1 moves in the lateral direction (X direction), and tries to split left and right along the planned dividing line L. Force (breaking force) is added as an auxiliary.
At this time, it is only necessary to apply an auxiliary force (breaking force) in the lateral direction (X direction) so that the cracking force due to thermal stress is not hindered by the weight of the edge material G1.

FIG. 3E shows a state at the time when the cooling spot CS is separated from the separation end of the substrate G. The hook mechanism 18 assists the progress of cracks by pulling the substrate G in the lateral direction (X direction). As a result, the crack progresses to the end of the substrate and is completely divided. After the division, the tilting mechanism 16b is operated, and the float table 16a is tilted, so that the edge member G1 falls from the table surface.
In this embodiment, the edge material G1 is illustrated as an end material that is separated from the substrate body side G0 and discarded. However, the edge material G1 is a unit substrate or a set of unit substrates that are individually separated from the substrate G that is a mother substrate. The present invention is similarly applied to a strip substrate that is a body and is separated into unit substrates.

(Embodiment 2)
FIG. 5 is an overall configuration diagram of a laser processing apparatus LM2 according to the second embodiment of the present invention, FIG. 5 (a) is a perspective view, FIG. 5 (b) is a front view, and FIG. 5 (c) is a plan view. is there.
In this embodiment,

hook mechanisms

23 and 24 are provided on the upper surface side of the substrate G in place of the

hook mechanisms

17 and 18 described in FIG. Further, the laser beam irradiation mechanism 11 and the cooling mechanism 12 are configured to scan along the planned division line L by a scanning mechanism (not shown) provided on the upper side of the substrate G. Other than that, since it has the same configuration as FIG. 1, the same reference numerals are given, and the description of the same parts is omitted.

The

hook mechanisms

23, 24 include locking

portions

23 b, 24 b having

convex portions

23 a, 24 a and

arms

23 c, 24 c that can be turned by motor drive, and the locking positions 23 b, 24 b are separated from the substrate G. And the arm 17 can be rotated between the position where it contacts the dividing line L of the substrate.
The hook

mechanism moving portions

19 and 20 are driven by a motor so that the edge member G1 is pulled away from the substrate main body G0 (center side) in the lateral direction when the locking

portions

23b and 24b are in a position in contact with the planned dividing line L. It can be moved.
The control system is the same as that in FIG. 2 in the first embodiment.

Next, the cutting operation by the laser processing apparatus LM2 will be described. FIG. 6 is a diagram showing the progress of cracks in the substrate G at each time during the cutting process, and FIG. 7 is a diagram showing the operating states at each time of the hook mechanisms 23 and 24 (corresponding to FIG. 5B). Figure). 6 and 7 correspond to FIGS. 3 and 4 in the first embodiment, respectively.

FIG. 6A shows a state immediately after the scanning of the beam spot BS and the cooling spot CS is started from the division start end. As shown in FIG. 7A, the substrate G that has been transported by the transport mechanism 14 has the substrate body side G0 adsorbed and fixed by the supports 15a to 15c. On the other hand, the edge material G1 side is levitated by the gas blown from the float table 16a. In the second embodiment, as will be described later, the gas blowing amount is set so that the upper surface side of the edge member G1 can be kept in contact with the lower surfaces of the

arms

23c and 24c of the hook mechanism 17. Both

hook mechanisms

23 and 24 have been moved to a standby position away from the substrate G.

FIG. 6B shows a state when the beam spot BS and the cooling spot CS have slightly advanced from the dividing start end. A crack is generated on the division planned line L on the division start end side, and an opening Gc is formed. When the opening Gc is formed, as shown in FIG. 7B, the hook mechanism 23 is operated, and the convex portion 23a of the hook mechanism 23 enters the opening Gc. In that case, the timing which inserts the convex part 23a is adjusted so that the convex part 23a may not contact the dividing surface Gf. Specifically, a delay time from the start of scanning until the hook mechanism 17 is activated is set, and the beam spot BS and the cooling spot CS wait until the beam spot BS and the cooling spot CS travel to some extent along the planned dividing line. Enter the opening Gc.

Thereafter, as the beam spot BS and the cooling spot CS progress, the edge member G1 moves while floating under the arm 23c as shown in FIG. 7C, and the crack opening Gc is slightly expanded. The other hook mechanism 24 is still in the standby position and is not operating.

FIG. 6C shows a state in which the beam spot BS and the cooling spot CS have further advanced and have moved away from the dividing start end. At this time, the moving amount of the edge material G1 is reduced (or stopped). As shown in FIG. 7D, the hook mechanism moving unit 19 starts to pull the hook mechanism 23 in the lateral direction (X direction). Since the amount of movement of the edge member G1 is reduced, the protrusion 23a gradually approaches the dividing surface Gf of the edge member G1, and eventually the protrusion 23a of the hook mechanism 23 as shown in FIG. Comes into contact with the dividing surface Gf of the edge member G1. After that, as the hook mechanism 23 moves in the X direction, the edge member G1 moves in the lateral direction (X direction), and the force to split right and left along the planned division line L (dividing force) is assisted. Will be added. That is, when the hook mechanism 23 is disposed on the upper surface side of the substrate G and the substrate G floated by a gas blown from below with an appropriate air pressure reduces the distance between the crack sectional surface Gf and the convex portion 23a. The upper surface side of the edge member G1 is movably supported by the arm 17c of the hook mechanism 17. Here, when the tip of the formed crack does not advance a sufficient distance from the hook mechanism 17 toward the end of the division of the substrate G, the upper surface of the edge member G1 comes into contact with the lower surfaces of the

arms

23c and 24c. Movement in the direction is suppressed. On the other hand, when the tip of the crack has advanced a sufficient distance from the hook mechanism 17 toward the end of the division of the substrate G, the upper surface of the edge member G1 is caused by the frictional force between the lower surfaces of the

arms

23c and 24c and the

arms

23c and 24c. Stay on and move in the X direction.
As described above, the edge member G1 has moderate play with the

arms

23c and 24c, that is, the edge member G1 is softly connected via the frictional force between the edge member G1 and the

arms

23c and 24c (is connected tightly). The force for pressing the edge material in the X direction is automatically adjusted according to the crack progress state such as the crack start position or the width of the formed opening.
At this time, the other hook mechanism 24 is not operated.

FIG. 6D shows a state in which the beam spot BS and the cooling spot CS have further progressed, and the beam spot BS has approached the end of the division line L of the substrate G. At this time, the hook mechanism 24 disposed on the dividing end end side is newly activated, and the same operation state as that of the hook mechanism 23 shown in FIG. 7B, that is, the convex portion 24a of the locking portion 24b is opened. Gc enters the state. At this time, the timing at which the convex portion 24a is actuated is adjusted so that the convex portion 24a does not contact the dividing surface Gf (a delay time from the start of scanning until the hook mechanism 24 is actuated is set). Thereafter, in the same operating state as the hook mechanism 23 shown in FIG. 7 (e), the edge member G1 moves in the lateral direction (X direction), and tries to split left and right along the planned dividing line L. Force (breaking force) is added as an auxiliary. That is, a forcible breaking force that promotes the progress of cracks is also applied from the hook mechanism 24.

FIG. 6E shows a state at the time when the cooling spot CS is separated from the separation end of the substrate G. The hook mechanism 24 assists the progress of cracks by pulling the substrate G in the lateral direction (X direction). Thereby, a crack progresses to the termination | terminus of the board | substrate G, and it divides | segments completely. After the division, the tilting mechanism 16b is operated, and the float table 16a is tilted, so that the edge member G1 falls from the table surface.

In the second embodiment, the laser beam irradiation mechanism 11 and the cooling mechanism 12 are provided on the upper surface side, and the

hook mechanisms

23 and 24 are also provided on the upper surface side, but one may be provided on the lower surface side and the other may be provided on the upper surface side. .

(Embodiment 3)
FIG. 8 is a front view of a laser processing apparatus LM3 according to the third embodiment of the present invention. In this embodiment, in order to form the terminal portion of the bonded substrate board HG, only the end material (end portion) of the lower substrate of the bonded substrate board is divided to expose the terminal electrode portion of the upper substrate. In order to sever the end material (end) of the lower substrate of the bonded substrate stack HG, the beam spot BS by the laser irradiation mechanism 11 and the cooling spot CS by the cooling mechanism 12 are separated from each other on the substrate HG in the same manner as the laser processing apparatus LM1. Scan from below to the lower substrate.
Also in this case, the board | substrate G can be parted by performing the same procedure as the operation | movement procedure demonstrated in FIG. 3, FIG.

Further, instead of providing a terminal exposed portion on the bonded substrate board HG, there are cases where the upper and lower substrates are divided at once along the same dividing line L. In such a case, the laser irradiation mechanism is arranged above and below. By providing 11 and the cooling mechanism 12, the substrate can be divided by the same operation procedure.

(Embodiment 4)
FIG. 9 is a front view of the LM 4 of the laser processing apparatus according to the fourth embodiment of the present invention. In this embodiment, in the configuration of the laser processing apparatus LM3 shown in FIG. 8, the curtain gas CG for preventing the refrigerant injected from the cooling mechanism 12 from flowing around the upper surface of the float table 16a at the end of the float table 16a. Is provided with a curtain gas nozzle 16c.

When cooling water is included in the coolant, the substrate HG comes into close contact with the float table 16a when entering between the upper surface of the float table 16a and the substrate HG, and the substrate cannot be divided. Therefore, the refrigerant including the cooling water can be used by preventing the wraparound by injecting the curtain gas CG to the end portion on the front end side of the float table 16a.

In the case of the bonded substrate HG, by spraying the curtain gas CG, it is possible to prevent the cooling water from entering between the upper substrate and the lower substrate of the bonded substrate HG from the formed cracks. It is also possible to prevent close contact between each other.

(Embodiment 5)
FIG. 10 is a front view of the LM 5 of the laser processing apparatus according to the fifth embodiment of the present invention. In this embodiment, instead of the curtain nozzle 16c of the laser processing apparatus LM4 shown in FIG. 9, a suction port 16d for removing unnecessary refrigerant including moisture is provided. By sucking and removing the injected refrigerant, a push-pull type air curtain is formed, and wraparound to the float table 16a can be prevented.

(Embodiment 6)
FIG. 11 is a perspective view showing an overall configuration of a laser processing apparatus LM6 according to the sixth embodiment of the present invention. FIG. 12 is a diagram showing a control system of the laser processing apparatus LM6. In this embodiment, a camera 25 for observing the state of the opening Gc of the crack formed in the substrate is mounted in the laser processing apparatus described with reference to FIG. The control system 21 is provided with an aperture detection unit 26 that detects the size of the aperture based on the image captured by the camera 25. The opening detection unit 26 detects from the image of the camera 25 whether the width of the crack (opening width) that can be placed at the dividing start end is equal to or larger than a preset threshold value, and when the opening width is equal to or larger than the threshold value, the hook mechanism 17. It is determined that a sufficient opening has been opened to operate. By incorporating this determination operation, the hook mechanism 17 is prevented from operating when a sufficient opening is not formed for some reason.
Further, the operation timing of the hook mechanism 17 based on the observation result by the camera 25, that is, the step of inserting the convex portion 17a into the opening of the crack, the horizontal movement of the hook mechanism 17 is started, the crack cross section and the convex portion 17a The operation of the hook mechanism 17 may be started or stopped by judging the timing of starting and ending the step of reducing the distance of the step, and the step of applying a dividing force for assisting the progress of cracks via the convex portion 17a.

(Embodiment 7)
FIG. 13 is a modified embodiment of the locking portion 17b (18b, 23b, 24b) of the hook mechanism 17 (18, 23, 24) in each of the above-described embodiments. Hereinafter, the hook mechanism 17 will be described. The hook mechanism 17 connects the arm 17c and the locking portion 17b via a support shaft 17d so as to have a degree of freedom in the rotational direction within the XY plane.
As the crack progresses, the edge side substrate G1 not only moves in the X direction, but also moves in the Y direction or rotates in the XY plane (referred to as θ rotation). If the substrate of the convex portion 17a of the hook mechanism 17 and the contact surface are fixed, the movement in the Y direction or the θ rotation cannot be absorbed, so that the displacement of the contact portion occurs and the edge portion is pulled. However, by providing a degree of freedom in the direction of rotation by the support shaft 17d, it is possible to absorb movement in the Y direction and θ rotation, and to the edge material side substrate G1. It is possible to reliably transmit the breaking force.

Although FIG. 13 shows an example in which the convex portion of the locking portion of the hook mechanism 17 (18, 23, 24) is in surface contact with the crack cross section, the hook mechanism 17 (18, 23, 24) is locked. The convex portion 17a of the portion 17 may be in line contact or point contact with the crack cross section. For example, as shown in FIG. 14, a pin 17e is provided on the base 17f of the locking portion 17b. The pins 17e are supported so as to be slidable along the grooves 17g provided in the base 17f, and the number of pins 17e and the interval between them can be changed. For the material of the pin 17e, for example, a resin such as Teflon (registered trademark) having a low frictional resistance is preferably used.

In the seventh embodiment, the arm 17c and the locking portion 17b of the hook mechanism 17 are movable in the X direction and have a degree of freedom in the rotational direction within the XY plane. The locking portion 17b may be configured to perform movement in the XYZ triaxial directions and θ rotation (turning).
The movement in the Y direction can be achieved by moving the arm 17c and the locking portion 17b of the hook mechanism 17 in the Y direction. By adding the movement in the Y direction, the movement in an arbitrary direction can be performed in the XY plane. A precise auxiliary breaking force is transmitted to the marginal part.
The movement in the Z direction can be achieved by moving the arm 17c and the locking portion 17b of the hook mechanism 17 in the Z direction perpendicular to the XY plane. It is possible to prevent the edge side portion from drooping from the XY plane and to develop the crack more accurately.
The θ rotation is possible by configuring the arm 17c and the locking portion 17b of the hook mechanism 17 to pivot about the fulcrum O (FIG. 13). By adding the θ rotation, any rotation in the XY plane is possible. The auxiliary breaking force is transmitted to the marginal part more precisely in the direction.

In the above-described embodiment, the two hook mechanisms 17 and 18 (23, 24) are disposed. However, one or more hook mechanisms may be provided, for example, only on the dividing start end side of the substrate G. Depending on the dividing length of the substrate G, the two hook mechanisms 17, 18 (23, 24) may be additionally provided.
In the embodiment, the auxiliary cutting force control unit starts the horizontal movement of the hook mechanism 17 to place the convex portion 17a in the opening of the crack, and reduces the distance between the crack sectional surface and the convex portion 17a. The step of applying and the step of applying a breaking force for assisting the progress of cracks via the convex portion 17a were operated at a preset timing. However, the above-described series of steps were continuously performed, that is, the convex portion 17a was formed into the opening Gc. Immediately after the insertion, the horizontal movement may be started, and the convex portion 17a may be further moved horizontally as it is after coming into contact with the sectional surface of the edge member G1.
In the above-described embodiment, the edge on one end side of the substrate G is levitated to perform full-cut processing. However, the edge portions on both ends of the substrate G or the other edge on the other side of the substrate G are almost simultaneously. The same full cut processing can be performed.
In the said embodiment, although the 1st hook mechanism 17 and the 2nd hook mechanism 18 were fixed and installed along the division | segmentation planned line L, it installed so that it could move to the arbitrary positions along the division | segmentation planned line L. Also good.
In the above embodiment, a processing example in which the edge material of the substrate is removed or the terminal electrode is exposed has been described. However, the purpose of the processing is not limited to this, and the mother substrate of a single plate or a bonded substrate is formed in a strip shape. In addition, the present apparatus is applied to divide the strip into individual product substrates.

The present invention can be used for a laser processing apparatus using full cut processing by laser irradiation.

Claims

A substrate support mechanism for levitating a portion of the brittle material substrate on the edge side from the division line and fixing the substrate on the center side from the division line;
An arm having a convex portion at one end, and the convex portion at the other end of the arm, the convex portion of the arm being in a standby position where the convex portion of the arm is separated from the substrate and an opening of a crack formed in the substrate by thermal stress. A hook mechanism for rotating the arm between the locking position to enter;
A hook mechanism moving portion that horizontally moves the hook mechanism in a direction to separate the edge portion from the center side when the convex portion enters the opening of the crack;
An auxiliary cutting force control unit for controlling a hook mechanism and a hook mechanism moving unit to add a dividing force for assisting the progress of the crack,
The auxiliary dividing force control unit inserts the convex portion into the opening of the crack when the distance between the dividing surface of the central substrate of the opened crack and the dividing surface of the edge portion becomes sufficient, and then The horizontal movement of the hook mechanism is started to reduce the distance between the dividing surface of the edge portion and the convex portion, and after the protruding portion abuts the dividing surface of the edge portion, the dividing surface of the edge portion A laser processing apparatus for a brittle material substrate, wherein control is performed so as to apply a dividing force that assists the development of cracks through the convex portion.
The laser processing apparatus according to claim 1, wherein the hook mechanism is provided at least at a position near a substrate end on a division start side.
2. The laser processing apparatus according to claim 1, wherein the hook mechanism is provided at two locations, at least a position in the vicinity of a substrate end on a dividing start side and a position spaced a predetermined distance inward from a substrate end on a dividing end side.
The auxiliary dividing force control unit starts the horizontal movement of the hook mechanism by bringing the protrusion into the opening of the crack at a preset timing, and closes the distance between the crack section and the protrusion. The laser processing apparatus according to claim 1, wherein a starting step and a step of applying a breaking force for assisting the progress of a crack through the convex portion are started.
2. The hook mechanism is disposed on the lower surface side of the substrate, and when the distance between the crack section and the convex portion is made closer, the edge side portion is supported so as to be movable on the arm of the hook mechanism. The laser processing apparatus as described in.
2. The laser processing apparatus according to claim 1, wherein the hook mechanism performs movement and / or turning of the locking portion in three XYZ directions.
The hook mechanism has a contact portion where the convex portion of the locking portion contacts the crack cross section, and has a dividing force that assists the progress of the crack through the convex portion with respect to the crack cross section. 2. The laser according to claim 1, further comprising an adjusting mechanism that gives a degree of freedom other than a moving direction by the hook mechanism moving unit so that the contact unit is in close contact with and moves with respect to the cross section of the crack. Processing equipment.
The laser processing apparatus according to claim 1, wherein the adjustment mechanism is configured by a support shaft that rotates the locking portion with respect to the arm of the hook mechanism.
An opening detection unit for detecting the opening of the crack is further provided,
The laser processing apparatus according to claim 1, wherein the auxiliary dividing force control unit inserts the convex portion of the hook mechanism into the opening in accordance with the detected opening of the crack.
2. The laser processing apparatus according to claim 1, wherein the substrate support mechanism includes an injection mechanism that injects a curtain gas that prevents a coolant from entering the floating portion when the edge portion floats from the line to be divided.
The laser processing apparatus according to claim 1, wherein the substrate support mechanism includes a suction mechanism that prevents a coolant from entering the floating portion when the edge side portion is lifted from the planned dividing line.
In a processing method of a brittle material substrate in which a brittle material substrate is locally heated and a crack is formed in the substrate by the thermal stress, and the portion on the edge side of the substrate is scheduled to be lifted and is centered from the planned division line. A step of fixing the substrate to the substrate support mechanism on the side, a step of irradiating while moving the laser beam along the planned dividing line, and a crack formed on the substrate by moving an arm having a convex portion at one end. The step of placing the convex portion in the opening, and a part of the arm is brought into contact with the main surface of the edge side portion, and in this state, the arm is moved so that the distance between the sectional surface of the edge side portion and the convex portion is reduced. A method of laser processing a brittle material substrate comprising a step of horizontally moving the substrate.
Furthermore, after the convex part of the arm abuts against the sectional surface of the edge side part, the step of operating to apply a dividing force to assist the progress of cracks via the convex part to the sectional surface of the edge side part. The method for laser processing a brittle material substrate according to claim 12, comprising: