WO2009008375A1 - 基板収納容器用蓋体及び基板収納容器 - Google Patents

基板収納容器用蓋体及び基板収納容器 Download PDF

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Publication number
WO2009008375A1
WO2009008375A1 PCT/JP2008/062197 JP2008062197W WO2009008375A1 WO 2009008375 A1 WO2009008375 A1 WO 2009008375A1 JP 2008062197 W JP2008062197 W JP 2008062197W WO 2009008375 A1 WO2009008375 A1 WO 2009008375A1
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WO
WIPO (PCT)
Prior art keywords
lid body
front face
face section
container
locking mechanism
Prior art date
Application number
PCT/JP2008/062197
Other languages
English (en)
French (fr)
Inventor
Satoshi Odashima
Hidehiro Masuko
Original Assignee
Shin-Etsu Polymer Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007182510A external-priority patent/JP2009021371A/ja
Priority claimed from JP2007215906A external-priority patent/JP2009049289A/ja
Application filed by Shin-Etsu Polymer Co., Ltd. filed Critical Shin-Etsu Polymer Co., Ltd.
Priority to US12/667,894 priority Critical patent/US8322533B2/en
Publication of WO2009008375A1 publication Critical patent/WO2009008375A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T292/00—Closure fasteners
    • Y10T292/08—Bolts
    • Y10T292/096—Sliding
    • Y10T292/0969—Spring projected

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Closures For Containers (AREA)

Abstract

　蓋体の狭いスペースに施錠機構を設けることができ、しかも、蓋体開閉装置の複雑化防止を図ることのできる基板収納容器用蓋体及び基板収納容器を提供する。 　少数枚の半導体ウェーハを整列収納する容器本体と、容器本体の開口した正面部を開閉する正面視横長の蓋体３０とを備え、蓋体３０に、容器本体の正面部に嵌合された際に施錠する施錠機構６０を内蔵する。そして、施錠機構６０を、蓋体３０に支持され、容器本体の正面部に蓋体３０が嵌合された場合に容器本体の正面部内周両側に対向する一対の進退動係止体６１と、容器本体の正面部に蓋体３０が嵌合された場合に蓋体３０から容器本体の正面部内周両側に進退動係止体６１を進出させてその先端部を干渉接触させる一対のコイルバネ６２とから構成する。横長の蓋体３０に小型の施錠機構６０を横にして配置するので、蓋体３０の狭い内蔵スペースに施錠機構６０を適切に設けることができる。
PCT/JP2008/062197 2007-07-11 2008-07-04 基板収納容器用蓋体及び基板収納容器 WO2009008375A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/667,894 US8322533B2 (en) 2007-07-11 2008-07-04 Lid body for substrate storage container and substrate storage container

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-182510 2007-07-11
JP2007182510A JP2009021371A (ja) 2007-07-11 2007-07-11 基板収納容器
JP2007-215906 2007-08-22
JP2007215906A JP2009049289A (ja) 2007-08-22 2007-08-22 基板収納容器

Publications (1)

Publication Number Publication Date
WO2009008375A1 true WO2009008375A1 (ja) 2009-01-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062197 WO2009008375A1 (ja) 2007-07-11 2008-07-04 基板収納容器用蓋体及び基板収納容器

Country Status (2)

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US (1) US8322533B2 (ja)
WO (1) WO2009008375A1 (ja)

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CN113387062A (zh) * 2020-05-14 2021-09-14 台湾积体电路制造股份有限公司 光掩膜盒及其防尘方法
US11703754B2 (en) 2020-05-14 2023-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Particle prevention method in reticle pod

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