USD954769S1 - Enclosure system shelf - Google Patents
Enclosure system shelf Download PDFInfo
- Publication number
- USD954769S1 USD954769S1 US29/736,743 US202029736743F USD954769S US D954769 S1 USD954769 S1 US D954769S1 US 202029736743 F US202029736743 F US 202029736743F US D954769 S USD954769 S US D954769S
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- US
- United States
- Prior art keywords
- enclosure system
- system shelf
- shelf
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Description
The broken lines in the drawings depict unclaimed environmental subject matter.
Claims (1)
- The ornamental design for an enclosure system shelf, as substantially shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/736,743 USD954769S1 (en) | 2020-06-02 | 2020-06-02 | Enclosure system shelf |
JPD2020-26008F JP1700378S (en) | 2020-06-02 | 2020-12-02 | |
TW109306791F TWD217060S (en) | 2020-06-02 | 2020-12-02 | Enclosure system shelf of a substrate processing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/736,743 USD954769S1 (en) | 2020-06-02 | 2020-06-02 | Enclosure system shelf |
Publications (1)
Publication Number | Publication Date |
---|---|
USD954769S1 true USD954769S1 (en) | 2022-06-14 |
Family
ID=78604440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/736,743 Active USD954769S1 (en) | 2020-06-02 | 2020-06-02 | Enclosure system shelf |
Country Status (3)
Country | Link |
---|---|
US (1) | USD954769S1 (en) |
JP (1) | JP1700378S (en) |
TW (1) | TWD217060S (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD980176S1 (en) * | 2020-06-02 | 2023-03-07 | Applied Materials, Inc. | Substrate processing system carrier |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD228654S (en) | 2022-08-04 | 2023-11-21 | 美商應用材料股份有限公司 | Deposition ring of a process kit for semiconductor substrate processing |
TWD227852S (en) | 2022-08-04 | 2023-10-01 | 美商應用材料股份有限公司 | Grounding ring of a process kit for semiconductor substrate processing |
Citations (76)
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US20150041353A1 (en) * | 2011-08-12 | 2015-02-12 | Entegris, Inc. | Wafer carrier |
US20150279711A1 (en) * | 2012-10-12 | 2015-10-01 | Miraial Co., Ltd. | Substrate Storing Container |
KR20160016409A (en) | 2014-08-05 | 2016-02-15 | 주식회사 엘지실트론 | Apparatus and Method for Aligning Wafer |
US20160141194A1 (en) * | 2013-06-18 | 2016-05-19 | Entegris, Inc. | Front opening wafer container with weight ballast |
US20160211166A1 (en) | 2015-01-16 | 2016-07-21 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
US20160211165A1 (en) | 2015-01-16 | 2016-07-21 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
US20160216185A1 (en) | 2015-01-28 | 2016-07-28 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
US20170053819A1 (en) | 2015-08-21 | 2017-02-23 | Lam Research Corporation | Wear detection of consumable part in semiconductor manufacturing equipment |
US9579788B2 (en) | 2012-02-10 | 2017-02-28 | Ascent Ventures, Llc | Automated testing and verification of a robotic system |
US20170115657A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
US20170117172A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Automated Replacement of Consumable Parts Using Interfacing Chambers |
US20170113355A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Automated Replacement of Consumable Parts Using End Effectors Interfacing with Plasma Processing System |
US20170119339A1 (en) | 2012-06-21 | 2017-05-04 | Globus Medical, Inc. | Systems and methods of checking registrations for surgical systems |
US20170133283A1 (en) | 2015-11-06 | 2017-05-11 | Lam Research Corporation | Sensor and adjuster for a consumable |
USD792389S1 (en) * | 2016-02-29 | 2017-07-18 | Inertech Ip Llc | Enclosure system for server racks |
US20170213758A1 (en) | 2016-01-26 | 2017-07-27 | Applied Materials, Inc. | Wafer edge ring lifting solution |
US20170236743A1 (en) | 2016-02-16 | 2017-08-17 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
US20170236741A1 (en) | 2016-02-12 | 2017-08-17 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
US20170236688A1 (en) | 2016-02-12 | 2017-08-17 | Lam Research Corporation | Chamber memeber of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring |
US20170263478A1 (en) | 2015-01-16 | 2017-09-14 | Lam Research Corporation | Detection System for Tunable/Replaceable Edge Coupling Ring |
US20170287753A1 (en) | 2016-03-29 | 2017-10-05 | Lam Research Corporation | Systems and methods for aligning measurement device in substrate processing systems |
US20170287682A1 (en) | 2016-03-29 | 2017-10-05 | Lam Research Corporation | Systems and methods for performing edge ring characterization |
WO2017186172A1 (en) * | 2016-04-29 | 2017-11-02 | 上海微电子装备(集团)股份有限公司 | Robot arm for holding cassette and automatic cassette transfer device |
USD802582S1 (en) * | 2016-08-08 | 2017-11-14 | General Electric Company | Electronics enclosure |
US20170372930A1 (en) * | 2016-06-28 | 2017-12-28 | Tec-Sem Ag | Substrate Storage and Processing |
US20180019142A1 (en) | 2015-10-22 | 2018-01-18 | Lam Research Corporation | Front Opening Ring Pod |
US20180019107A1 (en) | 2016-07-14 | 2018-01-18 | Tokyo Electron Limited | Focus ring replacement method and plasma processing system |
US20180090354A1 (en) | 2016-09-29 | 2018-03-29 | Tokyo Electron Limited | Position detection system and processing apparatus |
US9947517B1 (en) | 2016-12-16 | 2018-04-17 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US20180122674A1 (en) * | 2016-10-24 | 2018-05-03 | Tec-Sem Ag | High Density Tec-Cell Carrier |
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US20180218933A1 (en) | 2017-02-01 | 2018-08-02 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
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US20180233328A1 (en) | 2017-02-16 | 2018-08-16 | Tokyo Electron Limited | Vacuum processing apparatus and maintenance apparatus |
US20180277416A1 (en) | 2017-03-22 | 2018-09-27 | Tokyo Electron Limited | Substrate processing apparatus |
US20180301322A1 (en) | 2017-04-12 | 2018-10-18 | Tokyo Electron Limited | Position detecting system and processing apparatus |
US20180315640A1 (en) | 2017-04-26 | 2018-11-01 | Tokyo Electron Limited | Plasma processing apparatus |
WO2018226800A1 (en) * | 2017-06-09 | 2018-12-13 | Entegris, Inc. | Substrate container with particle mitigation feature |
US20190088531A1 (en) | 2017-09-21 | 2019-03-21 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
WO2019097832A1 (en) * | 2017-11-15 | 2019-05-23 | 信越ポリマー株式会社 | Substrate storage container |
US20190244845A1 (en) * | 2018-02-06 | 2019-08-08 | Applied Materials, Inc. | Bridging front opening unified pod (foup) |
US20200122320A1 (en) | 2018-10-19 | 2020-04-23 | Asm Ip Holding B.V. | Method for teaching a transportation position and alignment jig |
-
2020
- 2020-06-02 US US29/736,743 patent/USD954769S1/en active Active
- 2020-12-02 JP JPD2020-26008F patent/JP1700378S/ja active Active
- 2020-12-02 TW TW109306791F patent/TWD217060S/en unknown
Patent Citations (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD311177S (en) * | 1989-06-27 | 1990-10-09 | PMST Ltd. | Computer enclosure |
US5749469A (en) * | 1992-05-15 | 1998-05-12 | Fluoroware, Inc. | Wafer carrier |
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JPH10165884A (en) | 1996-12-06 | 1998-06-23 | Hitachi Electron Eng Co Ltd | Rotational driving device for substrate |
US5957292A (en) * | 1997-08-01 | 1999-09-28 | Fluoroware, Inc. | Wafer enclosure with door |
US6199291B1 (en) | 1998-07-29 | 2001-03-13 | Sony Corporation | Alignment fixture |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD980176S1 (en) * | 2020-06-02 | 2023-03-07 | Applied Materials, Inc. | Substrate processing system carrier |
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JP1700378S (en) | 2021-11-22 |
TWD217060S (en) | 2022-02-11 |
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