WO2008143471A1 - Semiconductor package inspecting system - Google Patents

Semiconductor package inspecting system Download PDF

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Publication number
WO2008143471A1
WO2008143471A1 PCT/KR2008/002866 KR2008002866W WO2008143471A1 WO 2008143471 A1 WO2008143471 A1 WO 2008143471A1 KR 2008002866 W KR2008002866 W KR 2008002866W WO 2008143471 A1 WO2008143471 A1 WO 2008143471A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor package
unit
disposed
rail
tray
Prior art date
Application number
PCT/KR2008/002866
Other languages
French (fr)
Inventor
Ssang-Gun Lim
Sang-Yun Lee
Ho-Keun Choi
Seung-Gyu Ko
Original Assignee
Intekplus Co., Ltd
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Publication date
Application filed by Intekplus Co., Ltd filed Critical Intekplus Co., Ltd
Publication of WO2008143471A1 publication Critical patent/WO2008143471A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
    • B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

A semiconductor package inspecting system includes a loading unit, a first vision inspection unit for visually inspecting a first surface of the semiconductor package, a second vision inspection unit for two-dimensionally inspecting a second surface of the semiconductor package using a color camera, a tray transfer device for transferring, a third vision inspection unit for two-dimensionally inspecting the second surface of the semiconductor package using a line scan camera, an unloading unit for allowing a tray having good-quality semiconductor devices received therein to be stacked therein, a fourth vision inspection unit for two-dimensionally inspecting the first surface of the semiconductor package using a line scan camera, a inverting device for transferring the tray, a reject unit for sorting and receiving defective semiconductor devices, and a sorting device for sorting the visually inspected semiconductor packages.

Description

Description
SEMICONDUCTOR PACKAGE INSPECTING SYSTEM
Technical Field
[1] The present invention relates to a semiconductor package inspecting system, and, more particularly, to a semiconductor package inspecting system that is capable of individually performing inspection with respect to different areas of a semiconductor package during the one rotation of the semiconductor package inspecting system, thereby improving equipment utilization efficiency and inspection throughput. Background Art
[2] A tendency in development of semiconductor packages has progressed in the direction to secure the operational reliability of the semiconductor packages while reducing the size of the semiconductor packages as small as possible. As a result, semiconductor packages have been changed from a lead frame surface mount semiconductor package type structure to a subminiature chip scale semiconductor package type structure. Ultimately, aim is being taken at a flip chip semiconductor package.
[3] The flip chip semiconductor package is a kind of semiconductor package fabricated by connecting an electrode of a die, which is a semiconductor chip, and a substrate for the semiconductor package using a bump, instead of a conventional wire bonding technology to connect a semiconductor chip and a lead frame using a gold wire in the semiconductor package.
[4] An example of a flip chip semiconductor package fabricating method uses a solder ball bump. The solder ball bump may be manufactured, for example, by transferring flux to a predetermined portion of a semiconductor wafer, locating solder balls using a nozzle, and simultaneously welding the solder balls to the semiconductor wafer through reflow.
[5] Meanwhile, the external connection of the flip chip package is achieved through the attachment of spherical solder balls for a ball grid array (BGA).
[6] External defectiveness of such a flip chip-ball grid array (FC-BGA) package is fatal to the performance of the FC-BGA package. Consequently, it is required to more accurately perform inspection of the external appearances of the package using a charge coupled device (CCD) camera as well as inspection of electrical defectiveness in the package.
[7] FIG. 11 is a construction view illustrating an example of a conventional external- appearance inspection apparatus for semiconductor packages.
[8] The conventional external- appearance inspection apparatus includes an apparatus body 100, a loading unit 210 for stacking trays having semiconductor packages to be inspected received therein, an inspection unit 300 for inspecting a semiconductor package, a buffer 220 for temporarily depositing a buffer tray having the inspected semiconductor package received therein, a first reject unit 230, a second reject unit 240, and a third reject unit 250 for sorting and stacking trays having semiconductor packages sorted as defective semiconductor packages as the result of the inspection received therein according to the types of defectiveness, an unloading unit 260 for stacking trays having semiconductor packages sorted as good-quality semiconductor packages as the result of the inspection received therein, a plurality of tray transfer rails 460 connected to the loading unit 210, the buffer 220, the first reject unit 230, the second reject unit 240, the third reject unit 250, and the unloading unit 260 for guiding the movement of trays in the frontward-and-backward direction of the apparatus body 100, a transfer device 500 for transferring a tray between the tray transfer rails of the loading unit 210, the buffer 220, the first reject unit 230, the second reject unit 240, the third reject unit 250, and the unloading unit 260, and a sorting device 600 mounted to reciprocate between the tray transfer rails of the buffer 220, the first reject unit 230, the second reject unit 240, the third reject unit 250, and the unloading unit 260 for picking up a defective semiconductor package, among semiconductor packages received in trays to be transferred to the unloading unit 260, and transferring the picked-up defective semiconductor package to any one of the first reject unit 230, the second reject unit 240, and the third reject unit 250 according to the types of defectiveness, and for picking up a good-quality semiconductor package, among semiconductor packages received in the buffer tray, and filling the empty space of the unloading unit 260, from which the defective semiconductor package has been removed, with the picked-up good-quality semiconductor package.
[9] The inspection unit 300 includes first and second vision cameras 310 and 320 for performing vision inspection. The first vision camera 310 inspects one surface of each semiconductor package received in the corresponding tray stacked in the loading unit, and the second vision camera 320 inspects the other surface of each semiconductor package. In order for the second vision camera 320 to inspect the other surface of the semiconductor package the one surface of which has been inspected by the first vision camera 310, a inverting device 700 is disposed between the first vision camera 310 and the second vision camera 320 for reversing the tray having the semiconductor package received therein.
[10] Unexplained reference numeral 270 indicates an empty tray, 410 indicates a loading stacker, 470 indicates a feeder placed on the empty tray unit, 430, 440, 450, and 460 indicate feeders placed on the first, second, and third reject units 230, 240, and 250 and the unloading unit 260, and 610 indicates a sorting device for sorting semiconductor packages. [11] According to the above-stated construction, one surface of a semiconductor package received in a tray supplied from the loading unit 210 and transferred along the tray transfer rails is inspected by the first vision camera 310, and the semiconductor package the one surface of which has been inspected is inverted by the inverting device 700.
[12] At this time, it is required for the inverting device 700 to have an empty tray such that the semiconductor package can be received again, while the other surface of the semiconductor is shown, when the opposite surfaces of the semiconductor package received in the tray are inverted.
[13] The inverted tray is transferred to an inspection area of the second vision camera 320 by the transfer device 500 for reciprocating the tray between the tray transfer rails, and the semiconductor package received in the tray transferred after the inverting is inspected by the second vision camera 320.
[14] In the conventional external-appearance inspection apparatus for semiconductor packages with the above-stated construction, however, one surface of the semiconductor package is photographed by the first vision camera 310, and the other surface of the semiconductor package is photographed by the second vision camera 320, irrespective of package types. After that, the determination as to whether the semiconductor package is good or defective is made through the analysis of the photographed images.
[15] As a result, the inspection reliability lowers when inspecting a FC-BGA type package having different reflexibilities based on areas.
[16] In other words, a controlled-collapse chip connection (C4) area where a semiconductor chip is bonded to a substrate by a bump, a substrate area including a plastic body, and a ball area for external connection has different reflexibilities. Consequently, when the same illumination is irradiated simultaneously to the respective areas without distinction of areas, the reflexibilities at some areas may be increased due to excessive illumination, whereas the illumination may be insufficient at some areas. As a result, the reliability of acquired images lowers.
[17] The above-mentioned problems may be solved by dividing the semiconductor package into a plurality of areas based on the difference of reflexibilities and acquiring images for the respective areas. To this end, however, it is required to increase the number of inspections using a single inspection apparatus to inspect the semiconductor packages, with the result that equipment utilization efficiency and inspection throughput lower. Disclosure of Invention Technical Problem [18] Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a semiconductor package inspecting system constructed in a structure in which different kinds of cameras are installed at the semiconductor package inspecting system, the respective cameras individually perform inspection with respect to different areas of a semiconductor package, during one rotation of the semiconductor package inspecting system, thereby achieving individual inspection with respect to all the areas of the semiconductor package during the one rotation of the semiconductor package inspecting system, and therefore, improving the reliability of inspection. Technical Solution
[19] In accordance with the present invention, the above and other objects can be accomplished by the provision of a semiconductor package inspecting system including a system body, a loading unit disposed at the front part of the system body for supplying a tray having a semiconductor package to be inspected received therein to a first transfer rail, a first vision inspection unit disposed on the first transfer rail for performing a vision inspection with respect to a first surface of the semiconductor package, a second transfer rail disposed at one side of the first transfer rail, a second vision inspection unit disposed on the second transfer rail for two-dimensionally inspecting a second surface of the semiconductor package using a color camera, a tray transfer device for transferring the tray visually inspected by the second vision inspection unit to a third transfer rail disposed at one side of the second transfer rail, a third vision inspection unit disposed on the third transfer rail for two-dimensionally inspecting the second surface of the semiconductor package using a line scan camera, an unloading unit disposed at one side of the third vision inspection unit for allowing a tray having good-quality semiconductor devices received therein to be stacked therein, an unloading rail disposed at the rear of the unloading unit, a buffer rail disposed at one side of the unloading rail, a fourth vision inspection unit disposed on the unloading rail and the buffer rail for two-dimensionally inspecting the first surface of the semiconductor package using a line scan camera, a inverting device for transferring the tray on the first transfer rail to the second transfer rail in a inverted state and transferring the tray on the third transfer rail to the unloading rail or the buffer rail in a inverted state, a reject unit including reject parts disposed at one side of the unloading unit for sorting and receiving defective semiconductor devices based on the type of de- fectiveness, and a sorting device configured to move between the reject parts of the reject unit and the unloading unit for sorting the visually inspected semiconductor packages.
[20] Preferably, the first vision inspection unit includes a three-dimensional (3D) vision inspection part for three-dimensionally inspecting the first surface of the semiconductor package, and a two-dimensional (2D) inspection part for two-dimensionally inspecting the first surface of the semiconductor package using a color camera.
[21] Preferably, the semiconductor package inspecting system further includes an empty tray supply rail disposed between the third transfer rail and the unloading rail, the empty tray supply rail having an empty tray unit being disposed at the front part thereof.
[22] Preferably, the semiconductor package inspecting system further includes cleaning units disposed in front of the first vision inspection unit and the second vision inspection unit. Each cleaning unit preferably includes a brush cleaning module for cleaning the surface of the semiconductor package while moving in tight contact with the surface of the semiconductor package and air cleaning modules disposed at opposite sides of the brush cleaning module for performing air spray and vacuum suction.
[23] Preferably, each air cleaning module includes an ionizer for supplying ions to remove static electricity.
[24] Preferably, each cleaning unit further includes a cleaning module body to which the brush cleaning module and the air cleaning modules are mounted, a guide part for guiding the side-to-side movement of the cleaning module body, a timing belt one side of which is fixed to the cleaning module body, pulleys fixed to opposite sides of the guide part for driving the timing belt to move the cleaning module body from side to side, and a lifter disposed below the cleaning module body for suctioning the semiconductor package received in the tray using a vacuum suction pad and then lifting the suctioned semiconductor package. Brief Description of the Drawings
[25] The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
[26] FIG. 1 is a perspective view illustrating the structure of a semiconductor package inspecting system according to a first embodiment of the present invention;
[27] FIG. 2 is a perspective view, partially omitted, of the semiconductor package inspecting system according to the first embodiment of the present invention shown in FIG. 1;
[28] FIG. 3 is a plan view of FIG. 2;
[29] FIG. 4 is a perspective view illustrating the structure of a semiconductor package inspecting system according to a second embodiment of the present invention;
[30] FIG. 5 is a perspective view, partially omitted, of the semiconductor package inspecting system according to the second embodiment of the present invention shown in FIG. 4;
[31] FIG. 6 is a plan view of FIG. 5 ;
[32] FIG. 7 is a front perspective view illustrating a cleaning unit of the semiconductor package inspecting system according to the present invention
[33] FIG. 8 is a rear view of FIG. 7;
[34] FIGS. 9 and 10 are explanatory views illustrating the operation of the cleaning unit of the semiconductor package inspecting system according to the present invention; and
[35] FIG. 11 is a construction view illustrating an example of a conventional external- appearance inspection apparatus for semiconductor packages. Best Mode for Carrying Out the Invention
[36] Now, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[37] FIG. 1 is a perspective view illustrating the structure of a semiconductor package inspecting system according to a first embodiment of the present invention, FIG. 2 is a perspective view, partially omitted, of the semiconductor package inspecting system according to the first embodiment of the present invention shown in FIG. 1, and FIG. 3 is a plan view of FIG. 2.
[38] The semiconductor package inspecting system according to the first embodiment of the present invention includes a system body 1, a loading unit 10, a first vision inspection unit 12, a second vision inspection unit 14, a tray transfer device 16, a third vision inspection unit 17, an unloading unit 20, a reject unit 40, a inverting device 50, a fourth vision inspection unit 22, and a sorting device 60.
[39] The loading unit 10 is constructed in a structure in which a tray having a semiconductor package to be inspected received therein is loaded in the loading unit 10. The loading unit 10 is disposed at the front part of the system body 1 for supplying the tray to a first transfer rail 11.
[40] The first vision inspection unit 12 is disposed on the first transfer rail 11 for performing a vision inspection with respect to a first surface of a semiconductor package transferred from the loading unit 10.
[41] The first vision inspection unit 12 includes a three-dimensional (3D) vision inspection part 12a for three-dimensionally inspecting the first surface of the semiconductor package and a two-dimensional (2D) inspection part 12b for two- dimensionally inspecting the first surface of the semiconductor package using a color camera.
[42] That is, a C4 area where a semiconductor chip is bonded to a substrate by a solder bump is preferably inspected by the 3D vision inspection part 12a, and a large area including a plastic body around the C4 area and the defectiveness of colors are preferably inspected by the 2D inspection part 12b using the color camera. [43] The second vision inspection unit 14 is disposed on a second transfer rail 13 for two- dimensionally inspecting a second surface of the semiconductor package using a color camera. [44] The second vision inspection unit 14 performs the 2D inspection with respect to the second surface of the semiconductor package, i.e., a ball land area. In other words, the second vision inspection unit 14 inspects a large area and the defectiveness of colors using the color camera. [45] The tray transfer device 16 serves to transfer the tray visually inspected by the second vision inspection unit 14 to a third transfer rail 15. That is, the tray transfer device 16 is a transfer device for transferring the tray between the rails. [46] The third vision inspection unit 17 disposed on the third transfer rail 15 for two- dimensionally inspecting the second surface of the semiconductor package using a line scan camera. [47] In other words, the third vision inspection unit 17 performs a detailed inspection with respect to the ball land area using the line scan camera. [48] The unloading unit 20 is disposed at the front part of the system body 1 for allowing a tray having good-quality semiconductor devices received therein to be stacked therein. At the rear of the unloading unit 20 is disposed an unloading rail 21 along which a good product tray is transferred. [49] At one side of the unloading rail 21 is disposed a buffer rail 31 along which a buffer tray is transferred. [50] The fourth vision inspection unit 22 is disposed on the unloading rail 21 and the buffer rail 31 for two-dimensionally inspecting the first surface of the semiconductor package using a line scan camera. [51] Specifically, the fourth vision inspection unit 22 serves to two-dimensionally inspect a plastic body area using the line scan camera. That is, the fourth vision inspection unit
22 two-dimensionally inspects a small area. [52] The inverting device 50 is disposed at the rear part of the system body 1 for transferring the tray on the first transfer rail 11 to the second transfer rail 13 in a inverted state and transferring the tray on the third transfer rail 15 to the unloading rail
21 or the buffer rail 31 in a inverted state. [53] The reject unit 40 is constructed in a structure in which defective semiconductor devices, among visually inspected semiconductor devices, are sorted and received in the reject unit 40 based on the type of defectiveness. The reject unit 40 includes reject parts 40a and 40b, which are disposed on reject rails 41. [54] Preferably, an empty tray supply rail 71, on which an empty tray unit 70 is disposed at the front part thereof, is mounted between the third transfer rail 15 and the unloading rail 21 such that an empty tray in which semiconductor devices will be received are supplied to the reject rails 41.
[55] The sorting device 60 moves between the reject rails 41 and the unloading rail 21 for sorting and distributing the visually inspected semiconductor package to the tray on the unloading rail 21.
[56] FIG. 4 is a perspective view illustrating the structure of a semiconductor package inspecting system according to a second embodiment of the present invention, FIG. 5 is a perspective view, partially omitted, of the semiconductor package inspecting system according to the second embodiment of the present invention shown in FIG. 4, and FIG. 6 is a plan view of FIG. 5. A detailed description of components of the second embodiment identical to those of the previous first embodiment will be omitted.
[57] The semiconductor package inspecting system according to the second embodiment of the present invention is characterized in that the semiconductor package inspecting system further includes cleaning units 80 disposed in front of the first vision inspection unit 12 and the second vision inspection unit 14.
[58] FIG. 7 is a front perspective view illustrating a cleaning unit of the semiconductor package inspecting system according to the present invention, and FIG. 8 is a rear view of FIG. 7. The cleaning unit 80 according to the second embodiment of the present invention includes a cleaning module body 80a, a brush cleaning module 81 disposed at the lower end of the cleaning module body 80a for cleaning the surface of a semiconductor package while moving in tight contact with the surface of the semiconductor package, and air cleaning modules 82 disposed at opposite sides of the brush cleaning module 81 for performing air spray and vacuum suction.
[59] The cleaning unit 80 further includes a guide part 80b for guiding the side-to-side movement of the cleaning module body 80a, a timing belt 80c one side of which is fixed to the cleaning module body 80a, and pulleys 80d fixed to opposite sides of the guide part 80b for driving the timing belt 80c according to the operation of a motor to move the cleaning module body 80a along the guide part 80b from side to side.
[60] The cleaning unit 80 further includes a lifter 84 disposed below the cleaning module body 80a for suctioning the semiconductor package received in the tray using a vacuum suction pad 83 and then lifting the suctioned semiconductor package.
[61] Although not shown in the drawings, each air cleaning module 82 of the cleaning unit 80 according to the second embodiment of the present invention may include an ionizer for supplying ions to remove static electricity and thus prevent the deterioration in properties of semiconductor devices due to the static electricity. [62] FIGS. 9 and 10 are explanatory views illustrating the operation of the cleaning unit of the semiconductor package inspecting system according to the present invention. First, when a tray having a semiconductor package received therein is transferred, the semiconductor package is suctioned by the vacuum suction pad 83 provided at the lifter 84. As a result, the semiconductor package is fixed to the vacuum suction pad 83.
[63] Subsequently, the lifter 84, provided with the vacuum suction pad 83, is moved upward to load the semiconductor package to a cleaning height, and then the motor is driven to rotate the pulleys 80d such that the timing belt 80c connected to the pulleys 80d is driven.
[64] As a result, the cleaning module body 80a is moved along the guide part 80b from side to side, and the brush cleaning module 81 slides in tight contact with the surface of the semiconductor package, to clean the surface of the semiconductor package.
[65] At this time, air spray and vacuum suction are also performed using the air cleaning modules82 to air-clean the surface of the semiconductor package, and, at the same time, to vacuum-suction micro dust or pollutant generated by the brush cleaning and the air cleaning such that the micro dust or pollutant is removed. Industrial Applicability
[66] As apparent from the above description, the semiconductor package inspecting system according to the present invention is constructed in a structure in which different kinds of cameras are installed at the semiconductor package inspecting system, the respective cameras perform 3D and 2D inspection with respect to the C4 area, the surrounding plastic body area, and the ball land array area of the semiconductor package, during one rotation of the semiconductor package inspecting system, thereby achieving individual inspection with respect to all the areas of the semiconductor package during the one rotation of the semiconductor package inspecting system. Consequently, the present invention has the effect of improving the reliability of inspection, equipment utilization efficiency, and inspection throughput.
[67] Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

Claims

Claims
[1] A semiconductor package inspecting system comprising: a system body; a loading unit disposed at the front part of the system body for supplying a tray having a semiconductor package to be inspected received therein to a first transfer rail; a first vision inspection unit disposed on the first transfer rail for performing a vision inspection with respect to a first surface of the semiconductor package; a second transfer rail disposed at one side of the first transfer rail; a second vision inspection unit disposed on the second transfer rail for two- dimensionally inspecting a second surface of the semiconductor package using a color camera; a tray transfer device for transferring the tray visually inspected by the second vision inspection unit to a third transfer rail disposed at one side of the second transfer rail; a third vision inspection unit disposed on the third transfer rail for two- dimensionally inspecting the second surface of the semiconductor package using a line scan camera; an unloading unit disposed at one side of the third vision inspection unit for allowing a tray having good-quality semiconductor devices received therein to be stacked therein; an unloading rail disposed at the rear of the unloading unit; a buffer rail disposed at one side of the unloading rail; a fourth vision inspection unit disposed on the unloading rail and the buffer rail for two-dimensionally inspecting the first surface of the semiconductor package using a line scan camera; a inverting device for transferring the tray on the first transfer rail to the second transfer rail in a inverted state and transferring the tray on the third transfer rail to the unloading rail or the buffer rail in a inverted state a reject unit including reject parts disposed at one side of the unloading unit for sorting and receiving defective semiconductor devices based on the type of de- fectiveness; and a sorting device configured to move between the reject parts of the reject unit and the unloading unit for sorting the visually inspected semiconductor packages.
[2] The semiconductor package inspecting system according to claim 1, wherein the first vision inspection unit includes a three-dimensional (3D) vision inspection part for three-dimensionally inspecting the first surface of the semiconductor package, and a two-dimensional (2D) inspection part for two-dimensionally inspecting the first surface of the semiconductor package using a color camera.
[3] The semiconductor package inspecting system according to claim 1, further comprising: an empty tray supply rail disposed between the third transfer rail and the unloading rail, the empty tray supply rail having an empty tray unit being disposed at the front part thereof.
[4] The semiconductor package inspecting system according to any one of claims 1 to 3, further comprising cleaning units disposed in front of the first vision inspection unit and the second vision inspection unit.
[5] The semiconductor package inspecting system according to claim 4, wherein each cleaning unit includes a brush cleaning module for cleaning the surface of the semiconductor package while moving in tight contact with the surface of the semiconductor package, and air cleaning modules disposed at opposite sides of the brush cleaning module for performing air spray and vacuum suction.
[6] The semiconductor package inspecting system according to claim 5, wherein each air cleaning module includes an ionizer for supplying ions to remove static electricity.
[7] The semiconductor package inspecting system according to claim 6, wherein each cleaning unit further includes a cleaning module body to which the brush cleaning module and the air cleaning modules are mounted, a guide part for guiding the side-to-side movement of the cleaning module body, a timing belt one side of which is fixed to the cleaning module body, pulleys fixed to opposite sides of the guide part for driving the timing belt to move the cleaning module body from side to side, and a lifter disposed below the cleaning module body for suctioning the semiconductor package received in the tray using a vacuum suction pad and then lifting the suctioned semiconductor package.
PCT/KR2008/002866 2007-05-23 2008-05-22 Semiconductor package inspecting system WO2008143471A1 (en)

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KR10-2007-0050524 2007-05-23
KR1020070050524A KR100873670B1 (en) 2007-05-23 2007-05-23 System for inspection of semiconductor package

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KR20080103353A (en) 2008-11-27
TW200905772A (en) 2009-02-01
KR100873670B1 (en) 2008-12-12

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