KR100645897B1 - Sawing sorter system of bga package and method of the same thereby - Google Patents

Abstract

A sawing sorter system is provided to simplify a system and a fabricating process and finish the fabricating process within a short interval of time by performing the whole process without vertically inverting the solder ball surface of a BGA(ball grid array) semiconductor package. A supply part(110) supplies a group-molded BGA package material wherein a solder ball surface faces downward. A chuck picker(121) vacuums and transfers the molding surface of the package material supplied from the supply part. A sawing part(130) saws the package material absorbed to the chuck picker into unit packages by using a rotation blade positioned under the package material, including two rotation blades(132). The unit package is placed on a turntable(140) by the chuck picker such that the turntable is capable of moving horizontally. A mark vision(150) performs a marking test on the unit package, positioned over the turntable. A chip picker(160) vacuums and transfers the molding surface of the unit package after the marking test. A ball vision inspects the solder ball, positioned under the unit package absorbed to the chip picker. According to the result of the marking test and the solder ball inspection, good and bad products are classified and loaded into a tray(180).

Description

Sawing sorter system of BGA package and method of the same ever}

1 is a perspective view of a conventional sawing sorter system.

2 is a perspective view of a sawing sorter system according to the present invention.

3 is a perspective view of the alignment unit of FIG. 2.

4 is a perspective view of the turntable of FIG. 2.

** Description of the symbols for the main parts of the drawings **

110: package material supply unit 112: elevator

113: pusher 121: chuck picker

130: cutting unit 131: alignment vision

131 ': alignment table 132: rotating blade

140: turntable 141: first turntable

142: second turntable 150: Mark Vision

160: chip picker 180: tray

The present invention relates to a sawing sorter system and method for a ball grid array (BGA) semiconductor package, and more particularly, to simplify the system and the process by performing the entire process by lowering the solder ball surface of the BGA semiconductor package. TECHNICAL FIELD This invention relates to a sawing sorter system and method of a semiconductor package.

A manufacturing process of a semiconductor package will be described as a ball grid array package (BGA) using a tape wiring board as an example. Non-conductive epoxy resin adhesive is applied on top of the stripped tape wiring board in which a polyimide film has circuit circuit wiring, and semiconductor chips are attached to each package area and grouped into a plurality of package areas. Form a molding. Such a tape wiring board is manufactured as a semi-finished semiconductor chip package which is cut in a predetermined length unit and fixed to a carrier frame in order to facilitate handling. Subsequently, when the solder balls are attached to the bonding ball land portions exposed by the holes formed in the back surface of the tape wiring board, and the adhesion is completed by a reflow process at a high temperature, the semiconductor package grouped by the sawing sorter system is removed. After cutting in units, inspection, transfer and stacking operations are continuously performed to manufacture a semiconductor package.

Thus, a sawing sorter system for cutting, inspecting and classifying semiconductor packages will be described using Korean Patent Application No. 2003-37051. Referring to FIG. 1, the configuration and operation of the cutting machine 1 (Sawing machine) on which the chuck 2 is placed is disposed at the front end of the upper surface for performing the cutting process. The semiconductor package or wafer to be cut is placed on the chuck 2 of the cutting machine 1, and the chuck 2 is provided with a seat on which two semiconductor packages are placed. The two seats of the chuck 2 are used to exchange the semiconductor package to be cut at once, and both suction holes are formed and connected to the vacuum pump to perform adsorption and desorption.

In addition, the side of the cutting machine 1, the sorter 10 for performing the supply and exchange process of the semiconductor package or wafer to the chuck of the cutting machine 1, and the transfer and inspection classification process of the semiconductor package or wafer in which the cutting process is performed (Sorting machine) is arranged. The magazine 11 which loads the carrier 12 is arrange | positioned at the front left side of this sorter 10, The magazine loader 13 which removes the carrier 12 from the magazine 11 is located in the left side of the magazine 11. It is arranged. The carrier 12 is transported to the left by the magazine 11 and detached to the rear by the push rod 17 which is operated by the cylinder back and forth. Here, the carrier 12 is a punched plate to which a semiconductor package or wafer is attached by a film. The carrier 12 pushed backward and separated from the magazine 11 is fixed by the forceps 23 of the inlet rail 21 moving forward from the rear of the inlet rail 21. After the carrier 12 is fixed by the tongs 23, the blade attached to the lower portion of the inlet rail 21 cuts the film of the carrier 12 to separate the semiconductor package from the carrier 12.

The semiconductor package thus separated is adsorbed by the picker transferr 30 seated on the first guide 5, and the carrier 12 is moved forward to operate the cylinder attached to the tongs 23 to the magazine 11. Is returned. When the semiconductor package is adsorbed on one side of the picker transfer unit 30, the picker transfer unit 30 is transferred upward and left, and the semiconductor package is placed on one side of the chuck 2 by turning off the vacuum pump. When the semiconductor package is placed in this way, the chuck 2 is transferred into the cutting machine 1 and the semiconductor package is cut by the cutting machine 1. At this time, the other semiconductor package that has already been removed from the magazine 11 and transferred along the inlet rail 21 is absorbed by the picker transfer device 30, and waits for cutting to be completed. After cutting in the cutting machine 1, the chuck 2 is transferred to the first cleaner 3 installed at the inlet of the cutting space, washed and dried by the first cleaner 3, and then transferred to the outside of the cutting machine 1. At this time, the picker transfer device 30 approaches to the reverse table 40 when the washing and drying is completed, the semiconductor package is approached on the chuck, and the semiconductor package is sucked down and the semiconductor package cut to the other suction port is adsorbed. In the magazine 11, the magazine loader 13 and the inlet rail 21 are transferred to the chuck 2 by the picker transfer device 30 and exchanged with a new semiconductor package. It is coming true.

The cut semiconductor package adsorbed on the picker transfer device 30 is placed on the reverse table 40 in the off state of the vacuum pump and adsorbed. The reverse table 40 is placed on the rail to rotate 180 degrees and to move left and right. First, the semiconductor package on the reverse table 40 is moved to the left, rotated 180 degrees, and transported inward from the inlet of the second cleaner 45. At this time, the compressed air is injected from the second cleaner 45 installed on the left side to remove foreign substances generated in the cutting process of the semiconductor package. The semiconductor package of the reverse table 40 after removing the foreign matter is moved to the ball vision inspection 47 installed on the plate 9 so that the lens faces upward and undergoes ball inspection. During this ball inspection, the reverse table 40 moves along the rail to the left and right and the ball vision inspection 47 moves along the rail back and forth. Since the reverse table 40 and the ball vision inspection 47 are transferred at right angles to each other, all the semiconductor packages are inspected, and the status of the inspection of the semiconductor packages is stored in the main memory of the system and applied to the subsequent sorting process.

The semiconductor package of the reverse table 40 after the ball inspection is called a ball down state because the ball is directed downward. In this ball-down state, i.e., the reverse table 40 is rotated 180 degrees, the upper side of the buffer table 43 is approached and the vacuum pump is turned off to place the semiconductor package on the buffer table 43. . The vacuum pump of this buffer table 43 is turned on to maintain the arrangement state of the semiconductor package. At this time, the picker seated on the guide approaches the buffer table 43 to transport the semiconductor package. The buffer table 43 turns the vacuum pump off and the picker is turned on to transfer the semiconductor package onto the turntable. When the semiconductor package is placed on the turntable, the marking surface, which is the opposite surface of the ball-formed surface, is inspected by the marking vision 48 attached to the right side of the picker. As in the case of the ball inspection, the state of the marking surface is stored in the memory of the system and used during the sorting process. After the inspection of the marking surface is finished, the turntable is rotated 90 degrees and forwarded. The turntable is provided with two, the first turntable 60, the rail is installed in the front and rear and the cylinder is installed vertically can move back and forth and up and down, the second turn table 63 is installed only the rail back and forth on the outer upper surface Can only move back and forth. When the two turntables exchange positions forward and backward for the transfer of the semiconductor package, the first turntable 60 provided with the cylinder descends and moves backward so that interference between the turntables does not occur. At this time, the semiconductor package transferred forward by the turntable is absorbed by the chip picker 70 seated on the second guide (7). At this time, the state of the semiconductor package is still maintained in the ball-down state, so that the adsorption is made well by the chip picker 70 and fits well in the settle groove of the tray. The chip picker 70 is instructed to pick up both sides of the semiconductor package from the system controller, and after the chips have been absorbed and picked up, the semiconductor packages are laid down one line at a time on the tray placed on the left side transfer transformer.

When the semiconductor package is placed in one row of the tray placed on the tray transfer 81, the tray is forwarded at an interval between rows so that the semiconductor package is placed on the next row. In front of the tray transfer 81, a pull tray zone unit 83 for automatically loading a tray was provided.

In the above-described conventional sawing sorter system, the busy package is supplied with the solder ball face up in the ball-up state and is cut, and then switched back to the ball-down state by the rotation of the reverse table to perform the following processes. .

For this reason, the conventional sawing sorter system has to be provided with a reverse table and a buffer table for switching the solder ball surface, and the system and the work process are very complicated, and the correct position in the process of transferring and redirecting the packages is required. There was a problem that the work efficiency is significantly reduced, such as the need to correct if not seated on.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. The present invention provides a sawing sorter system and method for a BGA semiconductor package that simplifies the system and the process by allowing the entire process to be performed without changing the solder ball surface of the BSA semiconductor package. In providing.

In order to solve the above technical problem, the sawing sorter system according to the present invention comprises: a supply unit for supplying a group ball molded array (BGA, Ball Grid Array) package material to the solder ball surface downward; A chuck picker for vacuum suctioning and transporting a molding surface of the package material supplied from the supply unit; A cutting unit for cutting the package material adsorbed to the chuck picker into a unit package using a rotating blade positioned below the chuck picker; A turntable on which the chuck picker seats the unit package and is movable in a horizontal direction; Mark vision for performing a marking inspection of the unit package above the turntable; A chip picker for vacuum suctioning and transporting a molding surface of the unit package in which a marking test is performed; A ball vision inspecting solder ball under the unit package adsorbed to the chip picker; And a tray for classifying and loading the good and defective items according to the marking test and the solder ball test result. The alignment vision and the package material may be used to confirm the position of the package material adsorbed by the chuck picker. The alignment unit further includes an alignment table configured to temporarily lower the package material adsorbed on the chuck picker to correct the position.

In addition, the supply unit is a magazine for stacking a plurality of the package material; An elevator for raising the magazine; And a pusher for sequentially supplying the package material from the magazine lifted by the elevator.

In addition, the cutting unit is provided with two rotary blades, the turntable is separated into a first turntable capable of front and rear and rotational movement and a second turntable capable of forward, rearward, up and down and rotational movement, and the chuck picker is the unit package It is more preferable to alternately seat the first turntable and the second turntable.

The sawing sorter method of a BG package according to the present invention includes supplying a group of BGA (Ball Grid Array) package materials such that a solder ball surface faces downward; Vacuum suction the molding surface of the supplied package material with a chuck picker; Transferring the chuck picker upwardly of the rotating blade, and cutting the package material into a unit package by the rotating blade; Cutting the package material, spraying and washing the unit package with water, and drying the sprayed water; Mounting the unit package on a turntable; Checking the marking of the unit package seated on the turntable; Vacuum suction the molding surface of the unit package in which the marking test is completed by a chip picker; Performing a solder ball test under the unit package; And classifying and loading into good and bad goods according to the marking test and solder ball test results.

Hereinafter, with reference to the accompanying drawings will be described the configuration and operation of the sawing sorter system according to the present invention.

2, the sawing sorter system according to the present invention includes a package material supply unit 110, a chuck picker 121, a cutting unit 130, a turntable 140, a mark vision 150, a chip picker 160, It includes a ball vision (not shown) and the tray 180.

The supply unit 110 is a configuration for supplying a group of packaged materials for cutting and sorting, and comprises a magazine (not shown), an elevator 112 and a pusher 113. In more detail, a predetermined number of package materials are loaded into the magazine, lifted by the elevator 112, and the package material loaded on the raised magazine is pushed forward by the pusher 113. Supplying the package material. Here, the package material is loaded so that the solder ball surface is downward when the magazine is loaded.

The chuck picker 121 vacuum absorbs the package material supplied by the pusher 113 to a subsequent process. In particular, the chuck picker 121 vacuum absorbs the molding surface from the upper portion of the package material. In addition, it is obvious that the chuck picker 121 has a vacuum line provided with a vacuum force.

On the other hand, in the present embodiment is provided with an alignment portion consisting of an alignment vision 131 and the alignment table 131 'that can determine the position of the vacuum suction packaged material on the chuck picker 121. Looking at the configuration of the alignment unit with reference to Figure 3, the lens of the alignment vision 131 is formed to be upward, it can be confirmed the position of the package material conveyed by the chuck picker 121 upward. As a result of the positioning by the alignment vision 131, when the position correction of the package material is necessary, the position correction is temporarily placed on the alignment table 131 'and the position correction is performed. That is, the alignment table 131 'is horizontally moved along the LM device 131a by the motor 131b, and the position of the package material is corrected by the relative movement of the chuck picker 121.

The cutting unit 130 is configured to cut the package material adsorbed and transported by the chuck picker 121 into a unit package, and includes a rotating blade 132 and a cleaning unit (not shown) including an air jet nozzle and an air blower. (Not shown) is provided.

The turntable 140 is configured to be separated into first and second turntables 141 and 142 moving along the guide by the transfer device 143. It can be seen that the first and second turntables 141 and 142 are formed to accommodate the cut unit packages, respectively. The seating unit has a vacuum line for vacuum suctioning the cut unit package received from the chuck picker 121. In addition, the first turn table 141 is formed to enable the front and rear and rotational movement, the second turn table 142 is formed to enable the vertical movement as well as the front and rear and rotational movement.

The mark vision 150 is configured to recognize a character printed on the molding surface of the unit package seated on the turntable 140, and inspect the package outer surface.

The chip picker 160 is a component for vacuum suction of the unit package is completed in the marking vision in the mark vision 150 in the state seated on the turntable 140, and transported to the subsequent process, and vacuum the molding surface from above the unit package Adsorb and transport.

The ball vision is configured to inspect the solder balls of the unit package adsorbed on the chip picker 160. Therefore, the chip picker 160 absorbs the unit package and transfers the upper portion of the ball vision.

The tray 180 is configured to load and classify the unit package that completed the marking inspection and solder ball inspection as good or bad.

Hereinafter, the operation of the embodiment according to the present invention will be described with reference to FIG. 2.

A plurality of packaged material packaged in a magazine is stacked and received, the magazine is lifted by the elevator 112, and the package material loaded in the magazine is supplied by the pusher 113 one by one.

The supplied package material is vacuum-adsorbed by the chuck picker 121 and is transferred upward of the alignment vision 131 to check the position of the package material before being transferred to the cutting unit 130. When the position of the package material needs to be corrected, it is temporarily placed on the alignment table 131 ', and the alignment table 131' and the chuck picker 121 are moved to align to the correct position of the package material.

After confirming that the package material is placed in place, the chuck picker 121 is transferred to the cutting unit 130. The package material adsorbed on the chuck picker 121 is cut into a unit package by the lower rotating blade 132. The cut unit package is foreign matter is removed by the water sprayed by the water spray nozzle, and the water sprayed by the air blower is dried.

The unit package cut through the above process is seated on the turntable 140, and is sequentially mounted on the first and second turntables 141 and 142. First, when the unit package is seated on the first turn table 141, the first turn table 141 is moved horizontally under the mark vision 150, and the mark and the letter of the molding surface of the unit package by the mark vision 150 Check it.

After the marking test is performed, the first turntable 140 moves horizontally to the opposite side along the guide by the transfer device 143, and the unit package seated thereon is vacuum-adsorbed by the chip picker 160 located above. . The chip picker 160 which adsorbs the unit package is transferred above the ball vision, and the solder ball is inspected by the ball vision.

While the first turn table 141 is transported to the vicinity of the mark vision and the ball vision by the front and rear and rotational motion as described above, the cut unit package is also seated on the second turn table 142, Like the turntable 141, the mark vision 150 and the ball vision are sequentially transferred. However, the second turn table 142 may also move up and down in order to avoid collision with the first turn table 141 in addition to the front and rear and rotational movements.

When the cutting and inspection is completed as described above, all processes are completed by classifying good and defective goods according to the inspection result and loading them in the respective trays 180.

In other words, according to the present invention, it can be seen that the semiconductor package is performed in a state where the solder ball surface is downward.

According to the present invention, since the entire process is performed without changing the solder ball surface of the BG semiconductor package, the system and the process are very simple, and thus the work process can be completed in a short time.

It is also suitable for the production of new packages with small ball end values.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and modifications belong to the appended claims.

Claims (7)

A supply unit for supplying the grouped BGA package material such that the solder ball surface is downward; A chuck picker for vacuum suctioning and transporting a molding surface of the package material supplied from the supply unit; A cutting unit for cutting the package material adsorbed to the chuck picker into a unit package using a rotating blade positioned below the chuck picker; A turntable on which the chuck picker seats the unit package and is movable in a horizontal direction; Mark vision for performing a marking inspection of the unit package above the turntable; A chip picker for vacuum suctioning and transporting a molding surface of the unit package in which a marking test is performed; A ball vision inspecting solder ball under the unit package adsorbed to the chip picker; And A sawing sorter system of a BG package comprising: a tray for classifying and loading a good product and a bad product according to the marking test and the solder ball test result. The method of claim 1, The supply unit is a magazine for stacking a plurality of the package material; An elevator for raising the magazine; And a pusher for sequentially supplying the package material from the magazine lifted by the elevator. The method of claim 1, Including an alignment vision for confirming the position of the package material adsorbed by the chuck picker and an alignment table for temporarily placing the package material adsorbed on the chuck picker to correct the position of the package material The sawing sorter system of the Visage package, characterized in that the alignment portion further provided. The method of claim 1, The cutting unit is a sawing sorter system of the Visigage package, characterized in that two rotary blades are provided. The method of claim 1, The turntable is separated into a first turntable capable of forward and backward rotation and a second turntable capable of forward, backward, upside down and rotational movement, and the chuck picker alternates the unit package to the first turntable and the second turntable sequentially. The sawing sorter system of the Visigye package, characterized in that seating. Supplying a grouped BGA package material such that the solder ball surface is downward; Vacuum suction the molding surface of the supplied package material with a chuck picker; Transferring the chuck picker upwardly of the rotating blade, and cutting the package material into a unit package by the rotating blade; Mounting the unit package on a turntable; Checking the marking of the unit package seated on the turntable; Vacuum suction the molding surface of the unit package in which the marking test is completed by a chip picker; Performing a solder ball test under the unit package; And According to the marking inspection and solder ball inspection results, the step of classifying and loading the good and defective goods; the sawing sorter method of a Vissage package comprising a. The method of claim 1, After cutting the package material, the sawing sorter method of the Visage package further comprises the step of spraying and washing the water in the unit package and drying the sprayed water.

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