WO2008139913A1 - Exposure method and flat plate for exposure - Google Patents

Exposure method and flat plate for exposure Download PDF

Info

Publication number
WO2008139913A1
WO2008139913A1 PCT/JP2008/058170 JP2008058170W WO2008139913A1 WO 2008139913 A1 WO2008139913 A1 WO 2008139913A1 JP 2008058170 W JP2008058170 W JP 2008058170W WO 2008139913 A1 WO2008139913 A1 WO 2008139913A1
Authority
WO
WIPO (PCT)
Prior art keywords
exposure
wafer
optical system
projection optical
exposure light
Prior art date
Application number
PCT/JP2008/058170
Other languages
French (fr)
Japanese (ja)
Inventor
Dai Arai
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2009514092A priority Critical patent/JPWO2008139913A1/en
Publication of WO2008139913A1 publication Critical patent/WO2008139913A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Provided is an exposure method wherein influence of fluctuation of a gas between a projection optical system and a photosensitive board, such as a wafer, is suppressed and planarity of the photosensitive board is maintained high during exposure as needed. In the exposure method for exposing a wafer (W) to exposure light through a projection optical system (PL), a glass substrate (29) which integrally moves with the wafer (W) and transmits exposure light is arranged between the projection optical system (PL) and the wafer (W), a liquid (LQ) which transmits exposure light is supplied between the projection optical system (PL) and the glass substrate (29), and the wafer (W) is exposed to exposure light through the projection optical system (PL), the liquid (LQ) and the glass substrate (29).
PCT/JP2008/058170 2007-05-10 2008-04-28 Exposure method and flat plate for exposure WO2008139913A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009514092A JPWO2008139913A1 (en) 2007-05-10 2008-04-28 Exposure method and exposure flat plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92437207P 2007-05-10 2007-05-10
US60/924,372 2007-05-10

Publications (1)

Publication Number Publication Date
WO2008139913A1 true WO2008139913A1 (en) 2008-11-20

Family

ID=40002127

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058170 WO2008139913A1 (en) 2007-05-10 2008-04-28 Exposure method and flat plate for exposure

Country Status (2)

Country Link
JP (1) JPWO2008139913A1 (en)
WO (1) WO2008139913A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004172621A (en) * 2002-11-18 2004-06-17 Asml Netherlands Bv Lithography apparatus and device manufacturing method
JP2004193252A (en) * 2002-12-10 2004-07-08 Nikon Corp Exposing method and device manufacturing method
JP2005033204A (en) * 2003-07-09 2005-02-03 Carl Zeiss Smt Ag Method and system of projection exposure
JP2006261606A (en) * 2005-03-18 2006-09-28 Canon Inc Exposure device, exposure method and device manufacturing method
JP2007027439A (en) * 2005-07-15 2007-02-01 Nikon Corp Projection optical system, exposure system, and manufacturing method of device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004172621A (en) * 2002-11-18 2004-06-17 Asml Netherlands Bv Lithography apparatus and device manufacturing method
JP2004193252A (en) * 2002-12-10 2004-07-08 Nikon Corp Exposing method and device manufacturing method
JP2005033204A (en) * 2003-07-09 2005-02-03 Carl Zeiss Smt Ag Method and system of projection exposure
JP2006261606A (en) * 2005-03-18 2006-09-28 Canon Inc Exposure device, exposure method and device manufacturing method
JP2007027439A (en) * 2005-07-15 2007-02-01 Nikon Corp Projection optical system, exposure system, and manufacturing method of device

Also Published As

Publication number Publication date
JPWO2008139913A1 (en) 2010-08-05

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