TW200719095A - Exposure apparatus, exposure method and device manufacturing method - Google Patents

Exposure apparatus, exposure method and device manufacturing method

Info

Publication number
TW200719095A
TW200719095A TW095141236A TW95141236A TW200719095A TW 200719095 A TW200719095 A TW 200719095A TW 095141236 A TW095141236 A TW 095141236A TW 95141236 A TW95141236 A TW 95141236A TW 200719095 A TW200719095 A TW 200719095A
Authority
TW
Taiwan
Prior art keywords
exposure
station
substrate
exposure apparatus
device manufacturing
Prior art date
Application number
TW095141236A
Other languages
Chinese (zh)
Inventor
Hiroyuki Nagasaka
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200719095A publication Critical patent/TW200719095A/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

An exposure apparatus (EX) performs multiple exposure of a substrate (P). The exposure apparatus is provided with a first station (ST1) for exposing the substrate (P); a second station (ST2) for exposing the substrate (P) exposed by the first station (ST1); movable members (4, 5) which can move between the first station (ST1) and the second station (ST2) by holding the substrate (P); and a first detecting system (9) arranged on the first station (ST1) for obtaining alignment information of the substrate (P).
TW095141236A 2005-11-09 2006-11-08 Exposure apparatus, exposure method and device manufacturing method TW200719095A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005324619 2005-11-09

Publications (1)

Publication Number Publication Date
TW200719095A true TW200719095A (en) 2007-05-16

Family

ID=38023239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141236A TW200719095A (en) 2005-11-09 2006-11-08 Exposure apparatus, exposure method and device manufacturing method

Country Status (6)

Country Link
US (1) US20080239256A1 (en)
EP (1) EP1947683A4 (en)
JP (1) JPWO2007055237A1 (en)
KR (1) KR20080066836A (en)
TW (1) TW200719095A (en)
WO (1) WO2007055237A1 (en)

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KR101503992B1 (en) 2003-04-09 2015-03-18 가부시키가이샤 니콘 Exposure method and apparatus, and device manufacturing method
TWI628698B (en) 2003-10-28 2018-07-01 尼康股份有限公司 Optical illumination device, exposure device, exposure method and device manufacturing method
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KR102126726B1 (en) 2018-12-26 2020-06-25 주식회사 에스에프에이 Unmanned store system
KR102164361B1 (en) 2018-12-26 2020-10-12 주식회사 에스에프에이 Unmanned store system
KR102099622B1 (en) 2018-12-26 2020-04-10 주식회사 에스에프에이 Unmanned store system
KR102184336B1 (en) 2018-12-26 2020-11-30 주식회사 에스에프에이 Unmanned store system
KR102252628B1 (en) 2018-12-26 2021-05-17 주식회사 에스에프에이 Unmanned store system
KR102252627B1 (en) 2019-03-18 2021-05-17 주식회사 에스에프에이 Unmanned sell and store system
KR20210011677A (en) 2019-07-23 2021-02-02 주식회사 에스에프에이 Automatic Driving Shuttle and Auto Storage Retrieval System Having The Same
KR102269764B1 (en) 2019-07-23 2021-06-28 주식회사 에스에프에이 Carriage Device and Auto Storage Retrieval System Having Carriage Device
CN112631087B (en) * 2021-01-25 2022-04-22 苏州源卓光电科技有限公司 Double-face processing system and processing method

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Also Published As

Publication number Publication date
JPWO2007055237A1 (en) 2009-04-30
KR20080066836A (en) 2008-07-16
US20080239256A1 (en) 2008-10-02
WO2007055237A1 (en) 2007-05-18
EP1947683A4 (en) 2010-08-25
EP1947683A1 (en) 2008-07-23

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