WO2008133018A1 - Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods - Google Patents

Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods Download PDF

Info

Publication number
WO2008133018A1
WO2008133018A1 PCT/JP2008/057078 JP2008057078W WO2008133018A1 WO 2008133018 A1 WO2008133018 A1 WO 2008133018A1 JP 2008057078 W JP2008057078 W JP 2008057078W WO 2008133018 A1 WO2008133018 A1 WO 2008133018A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic field
field coupling
coupling type
type antenna
insulating layer
Prior art date
Application number
PCT/JP2008/057078
Other languages
French (fr)
Japanese (ja)
Inventor
Tsutomu Ieki
Hiroyuki Kubo
Masamichi Ando
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to CN200880011674.4A priority Critical patent/CN101657938B/en
Priority to GB0917865.8A priority patent/GB2461443B/en
Priority to JP2009511768A priority patent/JP5170087B2/en
Publication of WO2008133018A1 publication Critical patent/WO2008133018A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H01Q7/08—Ferrite rod or like elongated core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Near-Field Transmission Systems (AREA)
  • Soft Magnetic Materials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

Disclosed is a magnetic field coupling type antenna comprising an insulating layer (110) and a magnetic core (112) embedded in the insulating layer (110). A coil having a coil axis parallel to the upper surface of the insulating layer is formed by an upper conductor (116) formed on the upper surface of the insulating layer (110), a lower conductor (118) formed on the lower surface of the insulating layer (110), a lateral conductor (120) for electrically connecting the upper conductor (116) and the lower conductor (118), and a via (122). This magnetic field coupling type antenna can be manufactured by a simple process and has high antenna sensitivity without deteriorating impact resistance.
PCT/JP2008/057078 2007-04-13 2008-04-10 Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods WO2008133018A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880011674.4A CN101657938B (en) 2007-04-13 2008-04-10 Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods
GB0917865.8A GB2461443B (en) 2007-04-13 2008-04-10 Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods.
JP2009511768A JP5170087B2 (en) 2007-04-13 2008-04-10 Portable electronic devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007105513 2007-04-13
JP2007-105513 2007-04-13

Publications (1)

Publication Number Publication Date
WO2008133018A1 true WO2008133018A1 (en) 2008-11-06

Family

ID=39925477

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057078 WO2008133018A1 (en) 2007-04-13 2008-04-10 Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods

Country Status (4)

Country Link
JP (2) JP5170087B2 (en)
CN (1) CN101657938B (en)
GB (2) GB2485318B (en)
WO (1) WO2008133018A1 (en)

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WO2010122685A1 (en) * 2009-04-21 2010-10-28 株式会社村田製作所 Antenna apparatus and resonant frequency setting method of same
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