WO2006054468A1 - Id card manufacturing method and test card used therein - Google Patents

Abstract

There is provided an ID card manufacturing method employing an IC card capable of pre-adjusting an ID card issuing device using an IC card at a reasonable cost and performing reproducible adjustment. A test card is also provided. The ID card manufacturing method employs an IC card (600) holding an electronic part having and IC chip and an antenna via adhesive between a first sheet member and a second sheet member. An ID card (602) is manufactured by an ID card issuing device (601) having a convey step and a print step. The convey characteristic and/or printing characteristic are evaluated by using a test card (610) and the ID card issuing device is adjusted in advance. The test card is preferably such that the first sheet member is attached to the second sheet member via adhesive and the electronic part is not held, and an identification surface recording layer is present.

Description

 Specification

 ID card manufacturing method and test card used therefor

 Technical field

 [0001] The present invention relates to a method of issuing an ID card by adjusting an ID card issuing device and a test card used therefor.

 Background art

 [0002] In recent years, in the service sector such as government offices, banks, companies, medical institutions and schools, licenses such as identification cards, passports, alien registration cards, library cards, cash cards, credit cards, automobile licenses, etc. ID cards such as ID cards, employee ID cards, employee ID cards, membership ID cards, medical cards, and student ID cards are widespread. This type of ID card contains a face image for identity verification and character information images such as characters and symbols related to the owner. For this reason, printing for the purpose of preventing falsification of ID cards is often performed. In recent years, many contact-type or non-contact-type electronic cards or magnetic cards that store personal information or the like have been widely used.

 [0003] This face image is usually a full-color image having multiple gradations, and is formed by, for example, a sublimation thermal transfer recording method, a silver halide color photographic method, or the like. The character information image is composed of a binary image, and is formed by, for example, a melt type thermal transfer recording method, a sublimation type thermal transfer recording method, a silver halide color photographic method, an electrophotographic method, an ink jet method or the like.

 When recording face images and text information images on the surface of an ID card using the thermal transfer recording method or ink jet method, the ID card issuing device uses a card as described in Patent Document 1 to obtain recording quality that satisfies the customer. The transportability and image quality were checked and adjusted in advance. In particular, in issuing machines that use IC force, it is important to check card transportability and image quality in advance and make pre-adjustments in order to reduce costs, improve adjustment accuracy, and prevent erroneous issuance.

However, when an IC card is used, it is formed with expensive electronic components, so it is expensive to use with a test card for pre-checking, and there is a problem that it cannot be confirmed sufficiently because it is saved and used. It was. Patent Document 1: Japanese Patent Laid-Open No. 2003-317065

 Disclosure of the invention

 Problems to be solved by the invention

[0004] The present invention has been made in view of power, and uses an IC card that can be adjusted in a reproducible manner at a low cost by pre-adjusting an ID card issuing device using the IC card. The purpose is to provide an ID card manufacturing method and a test card.

 Means for solving the problem

[0005] The object is achieved by the following configuration.

 1. Holding an electronic component with an IC chip and antenna between the first sheet member and the second sheet member via an adhesive 1 Issuing an ID card using a C card and carrying and printing processes When preparing an ID card using a device, a test card is used to evaluate the transportability and / or printability and adjust the ID card issuing device in advance.

2. The ID card manufacturing method according to 1, wherein in the printing process, identification information and bibliographic information are formed by at least one method selected from a sublimation thermal transfer method, a melt thermal transfer method, and an inkjet method.

 3. The method for producing an ID card according to 1 or 2, wherein the test card is one in which the first sheet member and the second sheet member are bonded via an adhesive and do not hold the electronic component. .

 4. A method for producing an ID card of 3 comprising at least a first sheet member, a second sheet member, and an IC card made of the same material as the IC card.

 5. A method for producing an ID card according to any one of 1 to 4 that satisfies the following general formula (1).

[0006] General Formula (1) Test Card Thickness / IC Card Thickness = 0.81 ~: 1. 24

 6. The following general formula (2) is satisfied: A method for producing an ID card according to any one of!

[0007] General formula (2) IC card surface unevenness—Test card surface unevenness

 =-80. 0 x m to 80. Ο μ ηι

 7. The method for producing an ID card according to any one of 3 to 6, wherein the first sheet member of the test card has an image receiving layer.

8. The ID card of any of 3 to 7, wherein the second sheet member of the test card has a writing layer Manufacturing method.

 9. The method for producing an ID card according to any one of 1 to 8, wherein the test card has an identification surface recording layer.

 10. Use an 1C card that holds an electronic component with an IC chip and an antenna via an adhesive between the first sheet member and the second sheet member. This is a test card that has an identification surface recording layer that is used for preconditioning of the ID card issuing device.

 The invention's effect

 [0008] With the above configuration of the present invention, an ID card issuing device using an IC card can be pre-adjusted at a low cost and a reproducible adjustment can be performed. Can be provided.

 Brief Description of Drawings

FIG. 1 is a diagram showing a schematic configuration of an ID card manufacturing method.

 FIG. 2 is a diagram showing a schematic configuration of a test card.

 FIG. 3 (a) and FIG. 3 (b) are diagrams showing a schematic configuration of a test card and an IC card.

 [FIG. 4] FIGS. 4 (a) to 4 (f) show examples of patterns on the surface of a card used for production.

 [FIG. 5] FIG. 5 (a) to FIG. 5 (c) show examples of symbols on the back side of a card used for production.

 FIG. 6 (a) and FIG. 6 (b) are schematic views of an IC module.

 FIG. 7 (a) and FIG. 7 (b) are schematic configuration diagrams of a card manufacturing apparatus.

 FIG. 8 (a) and FIG. 8 (b) are diagrams showing a card substrate.

 FIG. 9 is a schematic configuration diagram of an ID card issuing device.

 FIG. 10 (a) and FIG. 10 (b) are schematic configuration diagrams of a card punching machine.

 FIG. 11 (a) and FIG. 11 (b) are diagrams showing a card thickness measuring unit.

 FIG. 12 (a) and FIG. 12 (b) are diagrams illustrating a method for measuring surface irregularities.

 FIG. 13 shows a finished test card.

 FIG. 14 is a view showing a finished IC card.

 BEST MODE FOR CARRYING OUT THE INVENTION

[0010] Hereinafter, an ID card manufacturing method using the IC card of the present invention and implementation of a test card will be described. A form is demonstrated. This embodiment shows the most preferable form of the invention, and the invention is not limited to this.

 First, a method for producing an ID card using an IC card will be described. FIG. 1 is a diagram showing a schematic configuration of an ID card manufacturing method. In this embodiment, an ID card issuing device 601 prints at least an ID card issuing device 601 on an IC card 600 produced via an adhesive between the first sheet member and the second sheet member, and the ID card Issue card 602. In order to carry out at least the conveyance or printing test with the ID card issuing device 601, the test card 620 is issued by using at least the conveyance or printing using the test card 610.

 [0012] Based on the transport state of the test card 610, adjustments such as the transport speed of the ID card issuing device 601 and the smooth transportation of the place where the transport is not smooth are performed for the issuance. Based on the print state, print density adjustment, color adjustment, and the like are performed. The ID force issuing device 601 forms and issues a character information image and a face image by at least a thermal transfer recording method or an ink jet method.

 As described above, when the ID card issuing device 601 issues the ID card 602, the test card 610 is used to adjust at least the transportability and printability of the ID card issuing device 601 in advance. The adjustment can be made and the test card 610 can be saved and not used, and the adjustment can be performed with a sufficient amount of the test card, so that the adjustment accuracy can be improved.

 Next, the test card will be described. FIG. 2 is a diagram showing a schematic configuration of the test card. The test card 610 of this embodiment is manufactured using an adhesive 613 between a first sheet member 611 and a second sheet member 612, and excludes an electronic component having an IC chip and an antenna. At least the first sheet member 611, the second sheet member 612, and the adhesive 613 are the same as the material of the IC card 600.

[0015] The first sheet member 611 has at least an image receiving layer 611a, and the second sheet member 612 has at least a writing layer 612a. Since the test card 610 is made of the same material as the IC card 600 for producing the ID card, the performance such as the transportability and printability of the ID card issuing device 601 can be reproduced by using the test card 610. Can be confirmed at low cost [0016] The test card 610 has an identification surface recording layer 614. The test card 610 before issuance for adjusting the ID card issuing device 601 by the identification surface recording layer 614 and an IC card 600 Identify. In this way, it is preferable that the shape can be easily identified without using a jig such as a card tester. By identifying the test card 610 and the IC card 600, the trouble that the test card 610 is used as a card for an ID card is also solved. That is, if the system describes an identification image that shows a test card at the time of issuance, there is a risk of handling errors and problems such as erroneous issuance, so the surface recording layer 614 for identification is provided before issuance. It is preferable.

 FIG. 3 is a diagram showing a schematic configuration of a test card and an IC card. Fig. 3 (a) shows the test card 610 before issuance, and Fig. 3 (b) shows the IC card 600 before issuance. The thickness of the test card 610 before issuance and the thickness of the IC card 600 before issuance Satisfaction force The following general formula (1) is satisfied.

 [0018] General formula (1)

 “Test card thickness (μm)” / “IC card thickness (/ im)”

 = 0. 81 ~: 1. 24

 The relationship between the surface irregularities of the test card 610 before issuing and the surface irregularities of the IC card 600 before issuing satisfies the relationship of the following general formula (2).

[0019] General formula (2)

 "IC card surface unevenness (/ m)"-"Test card surface unevenness (μm)"

 =-80.0 to 80.0

Thickness force of test card 610 Thickness of IC card 600 and force to satisfy general formula (1), surface unevenness of test card 610 Satisfies surface roughness of IC card 600 for production material and general formula (2) Therefore, it is possible to confirm the reproducibility at low cost by using the performance test card 610 such as transportability and printability of the ID card issuing device 601. If the relationship of general formula (1) is less than 0.81 or greater than 1.24, or if the relationship of general formula (2) is less than -80.0 or greater than 80.0, IC card issuing device Although the 601 transportability and printability are good with the test card 610, there may be a problem in reproducibility when an actual ID card is issued. [0020] If the difference between the thickness of the test card and the IC card or the unevenness of the card surface is large, even if the ID card issuing device can be adjusted with the test card, the frictional force with the transfer member of the device and the transfer with the transfer member Due to differences in force, it may cause poor conveyance or printing position accuracy when issuing an IC card. In addition, when the thermal transfer method is used for image formation, a gap with the print head and a pressure difference may occur, resulting in poor print quality, uneven print density, and poor print position accuracy.

 As shown in Fig. 11, the thickness of the test card and IC card was measured at five points, and the maximum film thickness was taken as the card film thickness. The thickness was measured using a contact-type film thickness meter (Electric Micrometer Minicom M manufactured by Tokyo Seimitsu Co., Ltd.). The relationship of general formula (1) was determined from the obtained data.

 Also, the card surface irregularities of test cards and IC cards are measured at lmm intervals using “Mitaka Kogyo Co., Ltd .: Non-contact 3D measuring device NH_ 3N”, and the maximum and minimum heights are obtained from the obtained data. The difference Δ さ was calculated, and the relationship of general formula (2) was obtained. That is, measurement was performed as shown in FIG. 12 (a), and the difference Δ 最小 between the maximum height and the minimum height from the end portion on the long side of the card to the end portion on the opposite side was calculated to obtain surface irregularity. Fig. 12 (b) is an enlarged view of one point from the long side edge of the card to the opposite edge measured in Fig. 12 (a). FIG. According to this, since the maximum height is 842 μΐη and the minimum height is 826 μm, the card surface irregularity ΔH is 16 / im.

 Furthermore, it is more preferable that the maximum height and the minimum height from the average value calculated from ΔH at each measurement point are in a specific range. Specifically, it is preferable that the card surface irregularities have a maximum height from the average value of 40 μ 30η or less, more preferably 30 / im or less. The minimum height is preferably 1-40 zm or less, more preferably _30 x m or less. It is preferable that the IC card has the same surface irregularity.

[0022] The test card of the present invention is preferably used in the ID card issuing device for carrying out at least the conveyance or printing test. Further, in the case where a protective layer is provided in the ID card issuing device, etc. It can also be used when post-processing is performed. Moreover, it may be used as a test card for shipping inspection such as card surface quality and card appearance inspection. It is used for applications that are necessary for quality management, and is useful for reducing the cost of quality control and improving adjustment accuracy. It is for.

 In the present invention, the test card refers to a card form before forming identification information such as a character information image such as bibliographic information and a face image by a thermal transfer recording method or an ink jet method. It is preferable in terms of cost that the test card does not contain an operable IC chip and antenna.

 [0024] Hereinafter, an outline of the technology adopted for the test card and the IC card will be described.

 Card sheet members include, for example, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, and polyvinylidene fluoride. , Polytetrafluoroethylene, ethylene tetrafluoroethylene copolymer, etc., polyamides such as nylon 6, nylon 6.6, etc., polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, Ethylene Z vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, butyl polymer such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol Life Degradable cellulose acetate, biodegradable poly force Biodegradable resins such as prolatatone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, polyethyl acrylate, polyethyl acrylate, polyacrylic acid Acrylic resin such as butyl, synthetic resin sheet such as polystyrene, polycarbonate, polyarylate, polyimide, or paper such as fine paper, thin paper, dalasin paper, sulfate paper, single layer such as metal foil, or two or more layers of these A laminated body is mentioned.

 [0025] The thickness of the sheet member is 30 to 300 μm, desirably 50 to 200 μm.

 When making a card, different materials or sheets with different thicknesses may be combined, which may be the same material or the same material with the same orientation angle. In addition, annealing may be performed in order to reduce heat shrinkage that may be caused by easy contact processing on the sheet member. Furthermore, a magnetic recording layer, a falsification preventing printing layer (pearl pigment layer, watermark printing layer, micro-character, etc.), an embossed printing layer, an IC chip concealing layer, etc. can be provided.

[0026] The sheet member can be provided with an image receiving layer, a cushion layer, a writing layer, a format printing layer, and the like, if necessary. Here, the image receiving layer refers to a layer in which bibliographic information and identification information can be formed by the thermal transfer recording method (a) or the ink jet method (b). Examples of the thermal transfer recording method (a) include a generally known sublimation type thermal transfer method and a melt type thermal transfer method. As the ink jet system (b), a generally known method can be used.

 [0028] According to the present invention, (a) a method for forming a character information image by a sublimation thermal transfer method or a melt thermal transfer method while forming a gradation information-containing image such as a face image by a sublimation thermal transfer method, b) A method of recording a gradation information-containing image and a character information image by an inkjet method is preferably used.

 [0029] As the binder for the image-receiving layer, a conventionally known binder for a sublimation type thermal transfer recording image-receiving layer can be appropriately used, and preferably a polychlorinated bur resin, a salted bulb and other monomers. Copolymer, polyester resin, polybutylacetal resin, polyvinyl butyral resin, copolymer of styrene and other monomers, epoxy resin, photocurable resin, thermosetting resin, and the like.

 [0030] Further, in addition to the binder for the image receiving layer, a metal ion-containing compound may be contained, in which a chelate is formed by reacting the heat-transfer compound with the metal ion-containing compound to form an image. Is preferred.

As metal ion-containing compounds, inorganic or organic salts of metals and metal complexes are preferred, Ni ²⁺ , Cu ²⁺ ,

A complex represented by the following general formula containing Cr ²⁺ and Zn ²⁺ is preferably used.

 [M (Ql) k (Q2) m (Q3) n] p + p (L_)

 In the formula, M represents a metal ion, Ql, Q2, and Q3 each represent a coordination compound capable of coordinating with the metal ion represented by M, L is a counter-anion that can form a complex, and k is It represents an integer of 1, 2 or 3, m represents 1, 2 or 0, and n represents 1 or 0. p represents 1, 2 or 3.

Examples of this type of metal ion-containing compound include those exemplified in US Pat. No. 4,987,049. When adding metal ion-containing compound, the added pressure amount for the image-receiving layer, 0. 5 to 20 g / m ² is preferred instrument:! ~ 15g / m ² is more preferable.

In addition, a release agent may be added to the image receiving layer. [0033] When forming an image receiving layer for ink jet recording, a hardening agent, a cationic mordant, or the like may be used in order to improve film strength that can be in any of the commonly known swelling type or void type. Various known additives such as anti-fading agent, various anionic, cationic or nonionic surfactants, lubricants, preservatives, thickeners, antistatic agents and matting agents may be contained. The image receiving layer may be formed of two or more layers.

 [0034] The image-receiving layer is a coating method in which an image-receiving layer coating solution prepared by dispersing or dissolving the formation component in a solvent is prepared, the image-receiving layer coating solution is coated on a sheet member, and dried. Can be manufactured by S. The thickness of the image receiving layer is generally from 0.01 to 30 111, preferably from 0.01 to 20 zm, more preferably from 0.03 to 20 μπι.

 [0035] If necessary, the card can be provided with a cushion layer in order to improve the printability. As the material constituting the cushion layer, a resin having flexibility and low thermal conductivity is suitable. The thickness of the cushion layer is usually 1 to 50 μπι, preferably 3 to 30 × m. The cushion layer may be any one of a) between the image receiving layer and the sheet member, and b) between the writing layer and the sheet member, and a plurality of layers may not be used.

 [0036] If necessary, a writing layer may be provided on the card. The writing layer is a layer that allows writing on the back side of the ID card, and can be formed of a binder and various additives. For example, an inorganic fine powder, a porous material, or the like can be used. Other additives may contain wax, surfactant, solvent and water, and are not particularly limited. The thickness of the writing layer is preferably 5 to 40 μΐη, more preferably 5 to 30 μΐη. In the case of forming the writing layer, an adhesive layer may be provided to improve the adhesion to the sheet member, and a cushion layer may be provided to improve the writing property. The surface Ra of the writing layer is not more than 2.0 μ μη. Force S is preferable, more preferably 0.2 to 2. μμπι, still more preferably 0.3 to 1.8 × m.

[0037] Format printing can be provided on the image receiving layer or the writing layer, and the test card has a surface recording layer for identification. Since test cards are not handled as IC cards by mistake, an identification mark that is a test card is required. As shown in Fig. 4 (a) to Fig. 4 (e), it is understood that the identification mark is a test card, test, test, test, etc. There is no particular limitation as long as the mark can be made. [0038] For format printing, specifically, the shoreline, company name, card name, precautions, issuer telephone number, etc. are written. For example, the back of the test card is shown in Fig. 5 (a) or Fig. 5 (b It is configured as shown in the figure. Fig. 5 (a) is the same as the back side of the IC card shown in Fig. 5 (c).

 [0039] The test card should have a notation that can be understood as the test as described above. Other notations may be the same as or different from the IC card. The format printing layer may employ watermark printing, fine prints, etc. to prevent forgery by visual inspection.

 [0040] As shown in Fig. 6, the IC card is provided with electronic components. The electronic component is an IC module that functions as an information recording member, and specifically includes an IC chip that electrically stores information of the IC card user and a coiled antenna connected to the IC chip. The IC chip is only a memory or a microcomputer in addition to it, and may include a capacitor. As the antenna, a coil made of copper wire, a conductor paste such as silver paste printed in a spiral on an insulating base, or a coil etched with a metal foil such as copper foil is used. .

 [0041] In the present invention, it is preferable to use a coil made of copper wire with communicability. In some cases, it may be covered with a resin or an insulating layer. The number of turns of the antenna coil is preferably 2 to 10 turns.

 [0042] Fig. 6 is a schematic diagram of an IC module, in which an IC chip is joined to an antenna coil obtained by winding a copper wire four times. Fig. 6 (a) shows a non-woven fabric type, where the non-woven fabric with the antenna pattern inserted is bonded to the IC chip by bonding, etc., and the IC chip has at least 50% of the reinforcing plate to cover the IC chip. FIG. IC card sheet “FT series” manufactured by Hitachi Maxell Co., Ltd. Fig. 6 (b) shows the printed circuit board type. The printed circuit board on which the printed pattern is formed and the IC chip are joined together by bonding or the like, and the reinforcing plate covers at least one of the IC chips at least 50% of the IC chip. It is the schematic diagram which interposes.

[0043] When the card is manufactured, in order to fill the resin after the IC module is placed in a predetermined position in advance, the joint is disconnected due to the shearing force due to the flow of the resin, or the resin flows and cools. Therefore, in order to eliminate the lack of stability, such as the loss of surface smoothness, a resin layer is formed on the sheet member in advance, and the module can be encased in the resin layer. It is preferable to use it in the form of a porous resin sheet, a porous resin sheet or a non-woven fabric sheet. Also, since the IC chip has a weak point pressure strength, it is preferable to have a reinforcing plate in the vicinity of the IC chip. The total thickness of the electronic component is preferably 10 to 500 xm, more preferably 10 to 450 zm, and still more preferably 10 to 350 μπι.

 In the test card, it is preferable that the electronic component described above is not included in the card.

 In order to improve both cost and adjustment accuracy, it is preferable that the card thickness and surface irregularity satisfy the relational expressions (1) and (2), and that the test card should have similar card rigidity. Masle. Therefore, it is okay to enclose electronic components that do not work inside the card. Specifically, since the IC chip substrate, the antenna, the substrate sheet, the reinforcing plate, and the like take a form that does not operate, one or more of them may be enclosed to create the same surface form as the IC card.

 [0045] The test card manufacturing method of the present invention is not particularly limited, but is preferably the same manufacturing method as the IC card in order to satisfy the relations of the general formulas (1) and (2). The test card production apparatus is shown in FIG. 7 (a), the IC card production apparatus is shown in FIG. 7 (b), and the sheet member is shown in FIG.

 [0046] A specific method for producing a test card includes a method in which at least two of the sheet members are bonded together with an adhesive. The heat bonding method, the adhesive bonding method and the injection molding method are known. In addition, the first sheet member and the second sheet member may be subjected to format printing or information recording before and after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, It can also be formed by a printing method such as letterpress printing, an ink jet method, a sublimation heat transfer method, an electrophotographic method, a melt heat transfer method, or the like.

In the case of an IC card, it can be formed by providing means for inserting a predetermined electronic component between the first sheet member and the second sheet member. The IC card manufacturing method does not insert electronic parts into the force test card disclosed in Japanese Patent Laid-Open No. 2000-0336026, 2000-219855, 2000-211278, Japanese Patent Laid-Open No. 10-316959, 11-11964, etc. In this case, any method can be used without providing the insertion portion. [0047] Even when a non-operating part or the like is inserted, it is possible to manufacture using a similar manufacturing method and manufacturing apparatus.

 As a specific manufacturing method, at least a step of forming an adhesive on the first or second sheet member that is a solid or viscous body at normal temperature and a viscous body when applied to the sheet member; A step of bonding under a predetermined pressure and heating condition so as to bond the adhesive.

[0048] It is preferable to use a low-temperature adhesive to reduce thermal deformation of the sheet member, and when bonding, the card surface smoothness, adhesion between the first sheet member and the second sheet member In order to improve the properties, it is preferable to manufacture by an up-and-down press method, a laminate method, a flyer method, etc., in which heating and pressurization are preferred. The heating is preferably 10 to 120 ° C, more preferably 30 to 100. C. The caloric pressure is preferably 0.05 to 300 kgf / cm ² force S, more preferably 0.05 to 100 kgf / cm ² . The caloric heat and the caloric pressure time are preferably 0.01 to 180 seconds, more preferably 0.01 to 120 seconds.

 [0049] The sheet or long sheet roll bonded by the adhesive bonding method or the resin injection method is allowed to stand for a predetermined time in accordance with a predetermined curing time of the adhesive, and then records an authentication identification image and bibliographic items. After that, it may be formed into a predetermined card size. Examples of the method for forming a predetermined card size include a punching method and a cutting method. As the adhesive, a light curable adhesive, a moisture curable adhesive, an elastic epoxy adhesive, or the like is used. In the present invention, it is preferable to use a moisture curable adhesive. Moisture hard type materials as reactive hot melt adhesives are disclosed in JP-A-2000-36026, JP-A-2000-219855, JP-A-2000 211278, and JP-A-2002-175510. Photocurable adhesives are disclosed in JP-A-10-316959 and JP-A-11-5964. Any of these adhesives may be used. The thickness of the adhesive layer depends on the finishing force card, but is preferably 800 to 300 × m, more preferably f to 800 to 400 μπι, more preferably f to 700 to 400 μπι.

 [0050] The thickness of the card for both the test card and the IC card is from 400 to 1200 111, more preferably from ί to 500 to 1000 μm, and even more preferably from f to 500 to 950 μm.

In the present invention, at least one selected from authentication identification images such as face images and bibliographic information such as attribute information can be provided on the image receiving layers of the test card and the IC card. Face image Usually, a full color image having gradation is produced by, for example, a sublimation type thermal transfer recording method, an inkjet method or the like. The character information image such as bibliographic information is a binary image, and is preferably produced by, for example, a melt type thermal transfer recording method, a sublimation type thermal transfer recording method, an ink jet method or the like. More preferably, an authentication identification image such as a face image is recorded by a sublimation type thermal transfer recording method, and bibliographic information is recorded by a melting type thermal transfer recording method. Bibliographic information specifically refers to attribute information such as name, address, date of birth, and qualifications.

In order to form an authentication identification image by sublimation type thermal transfer recording, the heat diffusible dye-containing ink layer of the sublimation type thermal transfer recording ink sheet and the image receiving layer are overlapped to give imagewise thermal energy. As a heat source, a thermal head is generally used, but other known devices such as a single laser beam, an infrared flash, and a thermal pen can be used.

After the image is formed, heat treatment may be performed for the purpose of improving image storage stability. When the image-receiving layer and the sublimation thermal transfer recording sheet are overlapped to form an image, the recording signal is

^{TO. 3~0. 01kg / cm 2} , pressure Caro preferably ί or 0. 25~0. 01kg / cm ^2, more preferably ί or from 0.25 to 0. Range of 02kg / cm ^2, temperature 50 of the head 500. It is preferable to form an image containing gradation information at C, preferably 100 to 500 ° C., more preferably 100 to 400 ° C.

When bibliographic information is formed by the melt-type thermal transfer method, the heat-meltable ink layer and the image-receiving layer surface of the melt-type thermal transfer recording ink sheet are brought into close contact with each other, and a thermal pulse is applied by a thermal head to support the desired print or transfer pattern The hot-melt ink layer to be transferred is locally heated for transfer. It should be noted that the formation of an image that does not require gradation such as characters, figures, symbols, or lines may be performed prior to or after the formation of the authentication identification image. This character information-containing image can also be formed by a sublimation thermal transfer recording method. When a character information image is formed by overlaying the image-receiving layer and the melt-type thermal transfer recording sheet, a recording signal (corresponding to 0.3 to 0.01 kg / cm ² , preferably f or 0.25 to 0.01 kg). / cm ² , more preferably 0.25 to 0.02 kg / cm ² and pressurizing at a head temperature of 50 to 500 ° C., preferably 100 to 500. C, formed at 100 to 400 ° C. The power to do S preferred.

When the ink jet method is adopted, for example, the bubble jet (registered trademark) method is used with a resolution of about 400 dpi. For face images, it is possible to use multi-tones in the shear mode. it can. There are no particular restrictions on the type of ink and the image forming method, in which post-heating, post-exposure, etc. may be performed after writing character information, a face image, etc. by inkjet.

[0053] For the purpose of improving the surface strength of the card, it is possible to protect the surface using a general transfer foil.

[0054] For the purpose of preventing falsification, the optical change element layer can be provided by transfer, and a hologram is preferable.

 Hereinafter, embodiments of the ID card issuing device will be described with reference to the drawings, but the present invention is not limited thereto.

 In FIG. 9, the card supply unit 10 and the information recording unit 20 are arranged at an upper position of the ID card issuing device 601, and a transparent protective layer and / or an optical change element transfer layer applying unit / or a resin are arranged at a lower position. The layer applying unit 70 is disposed, and thereafter, the transparent protective layer and the Z or optical change element transfer layer applying unit / or the resin layer applying unit 70 are further disposed.

 [0057] In the card supply unit 10, a plurality of IC cards 600 that have been cut into a single sheet in advance are stocked with the face recording face up, and one by one from the card supply unit 10 to a predetermined timing. Automatically supplied.

 [0058] In the information recording unit 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged corresponding to each of them. . An image area that has a gradation such as a photograph of the face of the card user in a predetermined area of the image receiving layer while the IC card 600 is being conveyed by thermal transfer using a thermal transfer sheet such as a yellow ribbon, a magenta ribbon, or a cyan ribbon. Is recorded.

 In addition, a character ribbon cassette 31 and a recording head 32 are arranged, and bibliographic information such as the name and card issue date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, thereby forming an image recording layer.

[0060] Further, since the surface protective layer is provided on the image receiving layer on which the face image and bibliographic information are recorded, the transparent protective layer and / or the optical change element transfer layer applying unit / or the resin layer applying unit 70 includes a transfer foil cassette 71. The heat roller 72 is arranged corresponding to the transfer foil cassette 71. Optical change element transfer foil 43 and Z or transparent protective layer transfer foil 64, curable transfer foil 66 are transferred, and an optical change element layer and / or a transparent protective layer and a cured protective layer are provided. [0061] In the present invention, an example of an apparatus in which two surface protective layers are provided is shown as one example in which there is no particular limitation on an ID card issuing apparatus that records bibliographic information and identification information on a card.

 [0062] Normally, when issuing an ID card, adjustments are required to obtain the desired print quality (density, information recording unit position accuracy) and issuance yield. In adjusting the ID card issuing device using the test card of the present invention, the adjusting member and method will be described with reference to FIG.

 [0063] At the adjustment location 1, when the IC card 600 is unloaded from the card supply unit 10, if the height of the card unloading unit is not appropriate, a card conveyance failure occurs and adjustment is required. In the adjustment location 2, when the IC card 600 is conveyed to the information recording unit 20 by the roll 10a, if the height of the card unloading unit is not appropriate, a card conveyance defect occurs and adjustment is required. In adjustment point 3, when recording information on the IC card 600 by the recording heads 25 to 28, adjustment is necessary because it affects the print density unless the print height and pressure are appropriate. In adjustment location 4, when the IC card 600 is transported by rolls 21a to 24a, if the card transport section is not properly positioned, card transport failure may occur or the pressure on the IC card 600 and the recording heads 25 to 28 may fluctuate. Adjustment is necessary because it easily affects the print density. At the adjustment point 5, when the IC card 600 is transported to the card surface protective layer applying process by the roll 20a, if the height of the card unloading part is not appropriate, the card transport is defective and adjustment is required. At the adjustment point 6, when the surface protection layer or the like is applied to the IC card 600 by the conveyance belt 70a and the thermal transfer head 72, the card conveyance failure occurs if the height is not appropriate, and adjustment is required.

 Example

 [0064] The following test cards 1 to 7 were used to make adjustments using the ID card issuing device shown in Fig. 9, and then the ID card was issued.

 [Preparation of test card 1]

 A first sheet member having the following image receiving layer and a second sheet member having a writing layer were prepared, and test card 1 was prepared by the following method.

 <First sheet member manufacturing method>

U2L98W made by Teijin DuPont Films, Ltd. as the surface side sheet member-188 μm low A photocurable cushion layer having the following composition is formed on the heat-absorbing grade, and the first image-receiving layer-forming coating solution and the second image-receiving-layer-forming coating solution are applied and dried in this order. The first sheet member was formed by laminating the layer 10.0 μ 10.η, the first image receiving layer 2.5 μΐη, and the second image receiving layer 0.5 / m.

 (a) Formation of light-curing cushion layer

 Urethane acrylate oligomer 6.5 parts

 (New Nakamura Chemical Co., Ltd .: NK Oligo UA512)

 Polyester acrylate

 (Toagosei Co., Ltd .: ALONIX M6200)

 Urethane acrylate oligomer 2 parts

 (New Nakamura Chemical Co., Ltd .: NK Oligo UA4000)

 Hydroxycyclohexenolevenoleketone 0.5 part

 (Ciba · Specialty · Chemicals: Irgacure 184)

 90 parts of methyl ethyl ketone

A powerful actinic ray curable composition was applied, dried at 90 ° C / 30 sec, and then photocured with a mercury lamp (300 mj / cm ² ).

 (b) Formation of image receiving layer

<First image-receiving layer forming coating solution>

 Polyvinyl petital resin 6 parts

[Sekisui Chemical Co., Ltd .: ESREC BX-1]

 Metal ion-containing compound (compound MS) 4 parts

 80 copies

 Butyl acetate 10 parts

<Second image-receiving layer forming coating solution>

 Polyethylene wax 2 parts

 [Toho Chemical Industries, Ltd .: Hitech E1000]

Urethane-modified ethylene acrylic acid copolymer

[Toho Chemical Industries, Ltd .: Hitech S6254] Methylcellulose [Shin-Etsu Chemical Co., Ltd .: SM15]

 water

[0065] [Chemical 1] Compound MS.

[0066] (c) Formation of format print layer on image receiving layer

 Format printing (employee ID, name) was performed on the image receiving layer by the resin convex printing method to produce a first sheet member that had been formatted. The printing ink used was UV ink, and the UV irradiation equivalent to 200mj was performed with a high-pressure mercury lamp, and the patterns shown in Table 1 were produced.

 <Method for producing second sheet member>

 U2L98W manufactured by Teijin DuPont Films, Ltd. as the back side sheet material: 188 μm low Heat-absorbing grade coating liquid for forming the first writing layer, coating liquid for forming the second writing layer, and coating for forming the third writing layer The liquids were applied and dried in this order, and the writing layers were formed by laminating each of the first writing layer so that the thickness was 5 μm, 15 zm, and 0.2 xm. Ra of the outermost surface after the writing layer was applied was 1.56 × m.

 <First writing layer forming coating solution>

Polyester resin [Toyobo Co., Ltd .: Byron 200]

 Isocyanate

 [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]

 Carbon black

 Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80]

 80 parts of methyl ethyl ketone

 Butyl acetate 10 parts

 <Second writing layer forming coating solution>

 Polyester resin 4 parts

[Toyobo Co., Ltd .: Bironal MD1200] Silica 6 parts

 Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 2 parts

 90 parts of water

 <Third writing layer forming coating solution>

 Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts

 METANONORE 95 咅 B

 (Form format print layer on writing layer)

 On the writing layer, the second sheet member was produced by performing the format printing with the pattern shown in Table 1 in the same manner as the image receiving layer side by the resin convex printing method.

[0067] Using the first sheet member and the second sheet member manufactured as described above, a test card 1 was manufactured using the test card manufacturing apparatus shown in Fig. 7 (a).

[0068] The test card manufacturing apparatus is provided with a long sheet-like second sheet member (back surface sheet) and a sheet-fed sheet-like first sheet member (front sheet), and the first sheet member The moisture supply type hot melt adhesive MK2013 made by Sekisui Chemical Co., Ltd. was melted at 120 ° C under nitrogen from the adhesive supply section, and the adhesive was supplied from the adhesive supply section by the T-die coating method. Then, 180 μΐη was applied to the first sheet member.

[0069] The second sheet member is similarly coated with an adhesive by a T-die coating method from the adhesive supply section.

180 / im applied.

[0070] The first sheet member and the second sheet member coated with the adhesive are bonded to each other by a heating / pressurizing roll (pressure 3 kg / cm ² , roll surface temperature 65 ° C) to form a film. An original plate controlled to 760 / m by a thickness control roll was prepared. It is preferable to cut to card size after the adhesive has been fully cured and closely attached to the support. After the 14-day curing was accelerated in a 23 ° C / 55% RH environment, A test card 1 having a size of 55 mm X 85 mm and a thickness of 760 zm was obtained using the card punching machine shown in FIG. The value of general formula (1) was 1.0, and the value of general formula (2) was 5.0.

[0071] The card punching machine shown in FIG. 10 is composed of a punching die device, FIG. 10 (a) is a schematic perspective view of the entire punching die device, and FIG. 10 (b) is a punching die device. It is front sectional drawing of the principal part of a die-die apparatus. This punching die apparatus has an upper die set 110 and a lower die set 120. The upper die set 110 includes a punching die. The upper die set 110 includes a punching punch 111 provided with a relief 141 inside the extension. The lower die set 120 includes a punching die 121. By dropping the punching punch 111 into the die hole 122 provided in the center of the punching die 121, an IC card having the same size as the die hole 122 is punched out. For this reason, the size of the punch for punch 111 is slightly smaller than the size of the die hole 122.

[Preparation of test card 2]

 Apply 100 xm of adhesive to the first sheet member, 100 μm of adhesive to the second sheet member, set the thickness control roll to 600 μm, and a 600 μm thick test card. Test card 2 was prepared in the same manner as test card 1 except that. The value of general formula (1) was 0.79, and the value of general formula (2) was 8.0.

[Preparation of test card 3]

 Apply a 200 μm adhesive to the first sheet member, apply a 250 μm adhesive to the second sheet member, set the thickness control roll to 950 μm, and a test card with a thickness of 950 μm Test card 3 was prepared in the same manner as test card 1 except that. The value of general formula (1) was 1 · 25, and the value of general formula (2) was −18 · 0.

[Preparation of test card 4]

 Test card 3 was prepared in the same way as test card 1 except that the thickness control roll was set to 1000 μm and the test card was 860 μm thick. The value of general formula (1) was 1. 13 and the value of general formula (2) was −87 · 0.

[Preparation of test card ⁵ ]

 The base material constituting the first sheet member and the second sheet member was changed to U2L98W (100 am) made by Teijin DuPont Film Co., Ltd., and 280 μm of adhesive was applied to the first sheet member. Test card in the same way as test card 1 except that 280 xm of adhesive is applied to the second sheet member, the thickness control roll is set to 760 μm, and the test card is 760 μm thick. 5 was produced. The value of general formula (1) was 1.0, and the value of general formula (2) was 0.0.

[Preparation of test card 6]

Test card 6 was produced in the same manner except that the third writing layer of the second sheet member was not formed in the production of test card 1. The value of general formula (1) is 1.0, the value of general formula (2) is 4 It was 0.

 [Preparation of test card 7]

 The base material constituting the first sheet member and the second sheet member was changed to U2L98W (100 am) made by Teijin DuPont Film Co., Ltd., and the photocurable cushion layer of the first sheet member, the second Without forming the image receiving layer and the third writing layer of the second sheet member, apply 190 zm of adhesive to the first sheet member, and apply 180 xm of adhesive to the second sheet member. Test card 7 was made in the same way as test card 1, except that the thickness of the control roll was set to 760 am and the test card was 760 μm thick. The value of general formula (1) was 1.0, and the value of general formula (2) was -3.0.

 [Production of IC card]

 Using the materials used in test card 1 and the IC module shown in Fig. 6 (a), an IC card was manufactured by the following manufacturing method.

[0072] Using the first sheet member and the second sheet member, an IC card was manufactured using the IC card manufacturing apparatus shown in Fig. 7 (b).

 FIG. 8 shows the external appearance of the first sheet member (FIG. 8 (a)) and the second sheet member (FIG. 8 (b)). The IC card manufacturing apparatus shown in FIG. 7 (b) is provided with a long sheet-like second sheet member (back sheet) and a single-wafer sheet-like first sheet member (front sheet). , Moisture-curing type hot melt adhesive M K2013 made by Sekisui Chemical Co., Ltd. from the adhesive supply section to the first sheet material was melted under nitrogen at 120 ° C and supplied by T-die coating method. The IC module shown in Fig. 6 (a), which is an IC / fixing member with a thickness of 300 µm, is placed on the coating part from the IC / fixing member supply part. In the same manner, the adhesive was supplied to the second sheet member from the adhesive supply section by the T-die coating method.

[0073] The first sheet member and the second sheet member coated with the adhesive are bonded to each other by a heating / pressurizing roll (pressure 3 kg / cm ² , roll surface temperature 65 ° C) to form a film. An IC card master controlled to 760 zm by a thickness control roll is prepared. In this invention, it is preferable to cut into a card after the adhesive has been sufficiently cured and closely adhered to the sheet member. In this invention, after curing is accelerated in a 23 ° C / 55% RH environment for 14 days, IC An IC card of 55 mm X 85 mm size and 760 m thickness was obtained by using the force punching machine shown in Fig. 10. surface The uneven life was 5 μΐη.

 <Production of bibliographic information and identification information formation material>

 The following thermal transfer ink sheet was used, and bibliographic information and identification information were recorded with an ID card issuing device. The thermal transfer ink sheet was installed in the information recording section 20 of the IC card issuing device shown in FIG.

 [Preparation and recording method of ink sheet for sublimation thermal transfer recording]

 A 6 μm-thick polyethylene terephthalate sheet with anti-fusing processing on the back side was coated with a yellow ink layer forming coating solution, a magenta ink layer forming coating solution, and a cyan ink layer forming coating solution having the following composition. Was set to 1 μm, and yellow, magenta, and cyan ink sheets were obtained. Overlay the ink side of the ink sheet on the surface with the image receiving layer of the card, and use the thermal head to output from the ink sheet side 0.23 WZ dots, width of 0.3-4.5 ms, dot density 16 dots Zmm A person image with gradation was formed on the image by heating under the above conditions.

<Yellow ink layer forming coating solution>

 Yellow Dye (Mitsui Toatsu Dye Co., Ltd. MSYellow) 3 parts

 Polybulassal 5.5 5¾

[Electric Chemical Industry Co., Ltd .: Denkabutyral KY-24]

 Polymethylmethacrylate modified polystyrene

[Toa Gosei Chemical Co., Ltd .: Rededa GP-200]

 Urethane modified silicone oil 0.5 咅

[Manufactured by Dainichi Seika Kogyo Co., Ltd .: Diaroma SP-2105]

 70 copies

 Toluene 20 parts

 <Coating liquid for magenta ink layer formation>

 Magenta dye 2 parts

 (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.)

 Polybulassal 5.5

[Electrical Chemical Industry Co., Ltd .: Denkabutyral KY_ 24] Polymethylmethacrylate modified polystyrene 2 parts

 [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]

 Urethane modified silicone oil 0.5 咅

[Dairoma Seika Kogyo Co., Ltd .: Diaroma SP-2105]

 70 copies

 Tonolen 20 copies

 <Cyan ink layer forming coating solution>

 Cyan dye (Nippon Kayaku Co., Ltd. Kasetet Blue 136) 3 parts

 Polyvinylenorea Setanole 5. 6 咅 B

 [Electric Chemical Industry Co., Ltd .: Denkabutyral KY-24]

Polymethylmethacrylate modified polystyrene

[Toa Gosei Chemical Co., Ltd .: Rededa GP-200]

 Urethane modified silicone oil 0.5 咅

[Manufactured by Dainichi Seika Kogyo Co., Ltd .: Diaroma SP-2105]

 Methyl ethyl ketone 70 parts

 Toluene 20 parts

 [Production and recording method of ink sheet for melt type thermal transfer recording]

 A 6 μm thick polyethylene terephthalate sheet with anti-fusing processing on the back side was coated with an ink layer forming coating solution having the following composition to a thickness of 2 μm and dried to obtain an ink sheet.

. Overlay the ink side of the ink sheet on the surface of the card with the image receiving layer and use the thermal head from the ink sheet side to output 0.5 W / dot, pulse width 1 Om second, dot density 16 dots / mm Character information was formed by heating with.

 <Ink layer forming coating solution>

 Carnauba wax 1 part

 Ethylene vinyl acetate copolymer 1 part

 [Mitsui DuPont Chemical: EV40Y]

 Carbon black 3 parts

Phenolic resin [Ara J11 Chemical Industries, Ltd .: Tamanol ⁵² 1] 5 parts 90 parts of methyl ethyl ketone

 <Preparation of surface protective layer material>

 Using the following surface protection transfer foils 1-3, surface protection was performed on the IC card with an ID card issuing device. The surface protective transfer foils 1 to 3 were installed in the transparent protective layer and / or the optical change element transfer layer applying part / or the resin layer applying part 70 of FIG.

[Preparation of surface protection transfer foil 1]

 A transparent resin transfer foil 1 was formed by coating and drying the following prescription with a wire bar coating on one side of Daifoil Hequist Co., Ltd. polyethylene terephthalate (S — 25). <Releasing layer (film thickness 0.5 z m) forming coating solution>

Acrylic resin (Mitsubishi Rayon Co., Ltd., Dianal BR-87) 5 parts

Polybouracetocetal (SP value: 9.4)

(Sekisui Chemical Co., Ltd., KS-1) 5 parts

Methyl ethyl ketone 40 parts

Toluene 50 parts

 <Intermediate layer (film thickness 0 · 3 ^ m) forming coating solution>

Polyvinyl petital resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 5 parts

Tuftex M— 1913 (Asahi Kasei) 3.5 parts

Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane]

 1. 5 parts

Methyl ethyl ketone 20 parts

70 parts of toluene

 After application, the curing agent was cured at 50 ° C. for 24 hours.

<Barrier layer (film thickness 0.5 x m) coating solution>

 BX-1 (polybulutyl resin) 4 parts

 [Sekisui Chemical Co., Ltd .: ESREC B Series]

Tuftex M_ 1913 (Asahi Kasei) 4 parts

Hardener Polyisocyanate [Coronate HX Made of Nippon Polyurethane] 2 parts

Tonoreen 50 copies Methyl ethyl ketone 40 parts

<Adhesive layer (film thickness 0/3 / m) forming coating solution>

 Urethane-modified ethylene ethyl acrylate copolymer 8 parts

 [Toho Chemical Industries, Ltd .: Hitech S6254B]

 Polyacrylate copolymer 2 parts

 [Nippon Pure Chemicals Co., Ltd .: Jurimar AT510]

 45 parts of water

 Ethanore 45 parts

A pressure of 150 kgZcm ² using a heat roller having a diameter of 5 cm rubber hardness 85 heated to a surface temperature of 200 ° C. using the transparent resin transfer foil 1 having the above structure on the image receiving layer on which a face image and characters are recorded. 1. Transfer was performed by heating for 2 seconds.

[Preparation of surface protection transfer foil 2 (photocured transfer foil)]

<Release layer (film thickness 0 · 2 / m) forming coating solution>

Polyvinyl alcohol (GL— 05) (manufactured by Nippon Synthetic Chemical) 10 parts

90 parts of water

 The release layer was dried at 90 ° C / 30 sec after coating.

<Composition for actinic ray curable layer (film thickness 7.0 / m)>

Shin-Nakamura Chemical Co., Ltd. A— 9300 / Shin-Nakamura Chemical Co., Ltd. EA— 1020 = 35/1

 1.75 copies

Initiator Irgacure 184 Nippon Ciba-Gigi Company 5 parts

Resin 1 48 parts

Dai Nippon Ink Surfactant F_ 179 0. 25 parts

500 parts of toluene

The actinic ray curable layer composition after coating was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mj / cm ² ). Resin 1 was synthesized by the following method.

In a nitrogen flask, put 73 parts of methyl methacrylate, 15 parts of styrene, 12 parts of methacrylic acid and 500 parts of ethanol, 3 parts of azobisisobutyronitrile, and in a nitrogen stream 80 The reaction was carried out in an oil bath at ° C for 6 hours. Then Trietil Ammonium 3 parts of chloride and 1.0 part of glycidyl methacrylate were added and reacted for 3 hours to obtain an acrylic copolymer resin 1.

 <Intermediate layer (film thickness 1 · O / im) forming coating solution>

Polybulutyl resin (Sekisui Chemical Co., Ltd .: ESREC BX_ 1) 3.5 parts

Tuftex M_ 1913 (Asahi Kasei) 5 parts

Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane]

 1. 5 parts

90 parts of methyl ethyl ketone

 After application, the curing agent was cured at 50 ° C. for 24 hours.

<Adhesion layer (film thickness 0.5 z m) forming coating solution>

 Urethane-modified ethylene ethyl acrylate copolymer 8 parts

 [Toho Chemical Industries, Ltd .: Hitech S6254B]

 Polyacrylate copolymer 2 parts

 [Nippon Pure Chemicals Co., Ltd .: Jurimar AT510]

 45 parts of water

 Ethanol 45 parts

 After coating, drying was performed at 70 ° C / 30 sec.

On the transparent protective layer, the actinic ray curable transfer foil 2 prepared above was calorically heated to a surface temperature of 200 ° C., using a heat roller having a diameter of 5 cm and a rubber hardness of 85 at a pressure of 150 kg / cm ² . Transfer was performed by heating for 2 seconds.

[Preparation of surface protection transfer foil 3 (optical change element transfer foil)]

 (Release layer forming coating solution) Film thickness 0.2 z m

Polyvinyl alcohol (GL— 05) (manufactured by Nippon Synthetic Chemical) 10 parts

Water 90¾

 After coating, drying was performed at 90 ° CZ30sec.

(Optical conversion element layer) Film thickness 2 _M m

<Intermediate layer forming coating solution> Film thickness 1.0 z m

Polybulutyl resin (Sekisui Chemical Co., Ltd .: ESREC BX_ 1) 3. 5 parts

 Tuftex M— 1913 (Asahi Kasei) 5 parts

 Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane]

 1. 5 parts

 90 parts of methyl ethyl ketone

 After application, dry at 90 ° CZ30sec. After application, the curing agent is cured at 50 ° C for 24 hours.

<Adhesive layer forming coating solution> Film thickness 0.5 z m

 Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitech S6254B] 8 parts

 Polyacrylate copolymer [Nippon Pure Chemicals Co., Ltd .: Jurimer AT510]

 2 parts

 45 parts of water

 Ethanol 45 parts

 After coating, drying was performed at 70 ° C / 30 sec.

[0076] [Evaluation Method]

 <Cost reduction effect>

 Fig. 13 shows the surface of the test card produced by the card issuing device, and Fig. 14 shows the surface of the IC card produced by the card issuing device. When adjustment is made using an IC card as a test card, the cost can be reduced by using the test card of the present invention, which is expensive because the IC card has electronic components.

 <Adjustment accuracy>

 a) Adjustability of transportability

 After the card issuer adjusted the card issuing device with a test card, 100 ID cards were prepared, and the evaluation was made based on whether or not there was a transportation trouble.

[0077] b) Printability adjustment accuracy

After the card issuer adjusted the card issuing device with a test card, 500 ID cards were prepared, and the difference in density of the same ID card image as the test card image was taken as the adjustment accuracy. yellow A gradation pattern image with a black density of 0.5 was formed on a test card using sublimation thermal transfer ribbons of magenta, magenta, and cyan, and the percent change was evaluated according to the following criteria when printed on an ID card under the same conditions. Concentration was measured by reflection density with X-rite densitometer (X-rite)

[0078] Fluctuations lower than 10%: Yes

 15% ~: 10% fluctuation: △

 15% or more: X

 <Prevention of wrong issue>

 Ten card issuers adjusted each card issuing device with a test card and made an ID card. At that time, how many people wrongly issued a test card was counted and evaluated.

 [0079] The above results are shown in the table.

[0080] [Table 1]

Here, in Example 10, there was no identification mark on the surface recording layer for identification. In Example 11, there was an identification mark, but the card surface printed on the back of the test card was not confirmed. An error was issued. In Comparative Examples 2 and 3, the IC card had no identification mark, so an error was issued.

Industrial applicability

According to this invention, when issuing an ID card in the ID card issuing device, it is possible to adjust at least the transportability and printability of the ID force issuing device in advance with a sufficient amount of test cards, which is inexpensive and highly accurate. Adjustment is possible.

Claims

The scope of the claims

 [1] Holds an electronic component having an IC chip and an antenna via an adhesive between the first sheet member and the second sheet member. 1 Uses a C card, has a conveying process, and a printing process A method for producing an ID card, characterized in that, when an ID card is produced by an ID card issuing device, a test card is used to evaluate transportability and / or printability and to adjust the ID card issuing device in advance.

 [2] In the printing process, the identification information and the bibliographic information are formed by at least one method selected from a sublimation type thermal transfer method, a melt type thermal transfer method, and an ink jet method. A method for producing the described ID card.

[3] The first or second claim, wherein the test card is one in which the first sheet member and the second sheet member are bonded via an adhesive and do not hold the electronic component. The method for producing the ID card described in Item 2.

[4] At least the first sheet member, the second sheet member, and the adhesive used in the test card I

4. The method for producing an ID card according to claim 3, wherein the card is made of the same material as the C card.

 [5] The method for producing an ID card according to any one of claims 1 to 4, wherein the following general formula (1) is satisfied.

 General formula (1) Test card thickness / IC card thickness = 0.81 ~: 1.24

[6] The method for producing an ID card according to any one of claims 1 to 5, wherein the following general formula (2) is satisfied.

 General formula (2) IC card surface unevenness—Test card surface unevenness

 =-80. 0 x m to 80. Ο μ ηι

[7] The method for producing an ID card according to any one of [3] to [6], wherein the first sheet member of the test card has an image receiving layer.

[8] The method for producing an ID card according to any one of [3] to [7], wherein the second sheet member of the test card has a writing layer.

9. The test card according to claim 1, wherein the test card has a surface recording layer for identification.

9. The method for producing an ID card according to any one of items 8. [10] An electronic component having an IC chip and an antenna is held between the first sheet member and the second sheet member via an adhesive. 1C card ID, having a transport process and a printing process A test card characterized by having a surface recording layer for identification and identification in advance for preparation of the ID card issuing device when the ID card is produced by the card issuing device.