WO2006023753A3 - System for thinning a semiconductor workpiece - Google Patents

System for thinning a semiconductor workpiece Download PDF

Info

Publication number
WO2006023753A3
WO2006023753A3 PCT/US2005/029598 US2005029598W WO2006023753A3 WO 2006023753 A3 WO2006023753 A3 WO 2006023753A3 US 2005029598 W US2005029598 W US 2005029598W WO 2006023753 A3 WO2006023753 A3 WO 2006023753A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
workpieces
retainer
back side
thinning
Prior art date
Application number
PCT/US2005/029598
Other languages
French (fr)
Other versions
WO2006023753A2 (en
Inventor
Kert L Dolechek
Raymon F Thompson
Original Assignee
Semitool Inc
Kert L Dolechek
Raymon F Thompson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/923,363 external-priority patent/US7288489B2/en
Priority claimed from US10/923,436 external-priority patent/US20060046499A1/en
Priority claimed from US10/922,762 external-priority patent/US20060040111A1/en
Priority claimed from US10/923,132 external-priority patent/US7354649B2/en
Application filed by Semitool Inc, Kert L Dolechek, Raymon F Thompson filed Critical Semitool Inc
Priority to DE212005000047U priority Critical patent/DE212005000047U1/en
Priority to AT0900405U priority patent/AT10874U1/en
Priority to JP2007528050A priority patent/JP2008511141A/en
Priority to EP05789099A priority patent/EP1799446A4/en
Publication of WO2006023753A2 publication Critical patent/WO2006023753A2/en
Publication of WO2006023753A3 publication Critical patent/WO2006023753A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02035—Shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

The present invention provides a system for use in processing semiconductor workpieces. A new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. The present invention provides for single workpiece thinning or thinning a batch of workpieces. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.
PCT/US2005/029598 2004-08-20 2005-08-18 System for thinning a semiconductor workpiece WO2006023753A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE212005000047U DE212005000047U1 (en) 2004-08-20 2005-08-18 System for thinning a semiconductor workpiece
AT0900405U AT10874U1 (en) 2004-08-20 2005-08-18 SYSTEM FOR THINNING A SEMICONDUCTOR WORKPIECE
JP2007528050A JP2008511141A (en) 2004-08-20 2005-08-18 System for thinning semiconductor workpieces
EP05789099A EP1799446A4 (en) 2004-08-20 2005-08-18 System for thinning a semiconductor workpiece

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US10/923,436 2004-08-20
US10/923,363 US7288489B2 (en) 2004-08-20 2004-08-20 Process for thinning a semiconductor workpiece
US10/923,436 US20060046499A1 (en) 2004-08-20 2004-08-20 Apparatus for use in thinning a semiconductor workpiece
US10/922,762 US20060040111A1 (en) 2004-08-20 2004-08-20 Process chamber and system for thinning a semiconductor workpiece
US10/923,132 US7354649B2 (en) 2004-08-20 2004-08-20 Semiconductor workpiece
US10/923,363 2004-08-20
US10/922,762 2004-08-20
US10/923,132 2004-08-20

Publications (2)

Publication Number Publication Date
WO2006023753A2 WO2006023753A2 (en) 2006-03-02
WO2006023753A3 true WO2006023753A3 (en) 2009-06-25

Family

ID=35968220

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/029598 WO2006023753A2 (en) 2004-08-20 2005-08-18 System for thinning a semiconductor workpiece

Country Status (8)

Country Link
EP (1) EP1799446A4 (en)
JP (1) JP2008511141A (en)
KR (2) KR20070051337A (en)
CN (1) CN102790000B (en)
AT (1) AT10874U1 (en)
DE (1) DE212005000047U1 (en)
TW (2) TWI463527B (en)
WO (1) WO2006023753A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG147330A1 (en) 2007-04-19 2008-11-28 Micron Technology Inc Semiconductor workpiece carriers and methods for processing semiconductor workpieces
US7989318B2 (en) * 2008-12-08 2011-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method for stacking semiconductor dies
DE102009037281B4 (en) * 2009-08-12 2013-05-08 Siltronic Ag Process for producing a polished semiconductor wafer
NL2014625B1 (en) * 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.
DE102019110402A1 (en) 2018-05-25 2019-11-28 Infineon Technologies Ag A method of processing a semiconductor wafer, a semiconductor composite structure and a support structure for a semiconductor wafer
JP7136679B2 (en) * 2018-12-13 2022-09-13 株式会社荏原製作所 Seals used for substrate holders

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011782A (en) * 1989-03-31 1991-04-30 Electric Power Research Institute Method of making passivated antireflective coating for photovoltaic cell
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6334453B1 (en) * 2000-02-14 2002-01-01 Semitool, Inc. Seal configuration for use with a motor drive assembly in a microelectronic workpiece processing system
US20030038115A1 (en) * 2001-08-23 2003-02-27 Atusi Sakaida Method for wet etching and wet etching apparatus
US20030092261A1 (en) * 2000-12-04 2003-05-15 Fumio Kondo Substrate processing method
US20040074808A1 (en) * 2002-07-05 2004-04-22 Entegris, Inc. Fire retardant wafer carrier
US20040157462A1 (en) * 1998-08-28 2004-08-12 Larry Hillyer Method of removing etch residues
US6803294B2 (en) * 2002-05-15 2004-10-12 Renesas Technology Corporation Semiconductor wafer and manufacturing method of semiconductor device
US6940181B2 (en) * 2003-10-21 2005-09-06 Micron Technology, Inc. Thinned, strengthened semiconductor substrates and packages including same
US20050239295A1 (en) * 2004-04-27 2005-10-27 Wang Pei-L Chemical treatment of material surfaces

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Publication number Priority date Publication date Assignee Title
NL162254B (en) * 1968-11-29 1979-11-15 Philips Nv SEMI-CONDUCTOR DEVICE FOR CONVERSION OF MECHANICAL VOLTAGES INTO ELECTRICAL SIGNALS AND METHOD OF MANUFACTURING THIS.
US4266334A (en) * 1979-07-25 1981-05-12 Rca Corporation Manufacture of thinned substrate imagers
JPH0684731A (en) * 1992-09-07 1994-03-25 Nec Kyushu Ltd Semiconductor wafer
JP3161515B2 (en) * 1997-10-08 2001-04-25 三菱マテリアル株式会社 Method for manufacturing semiconductor device
US6162702A (en) * 1999-06-17 2000-12-19 Intersil Corporation Self-supported ultra thin silicon wafer process
US6402843B1 (en) * 1999-12-07 2002-06-11 Trusi Technologies, Llc Non-contact workpiece holder
DE10256985B4 (en) * 2001-12-12 2013-01-10 Denso Corporation Method for producing a power semiconductor component
JP3620528B2 (en) * 2001-12-12 2005-02-16 株式会社デンソー Manufacturing method of semiconductor device
DE10260233B4 (en) * 2002-12-20 2016-05-19 Infineon Technologies Ag Method of attaching a workpiece to a solid on a workpiece carrier and workpiece carrier

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011782A (en) * 1989-03-31 1991-04-30 Electric Power Research Institute Method of making passivated antireflective coating for photovoltaic cell
US20040157462A1 (en) * 1998-08-28 2004-08-12 Larry Hillyer Method of removing etch residues
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6334453B1 (en) * 2000-02-14 2002-01-01 Semitool, Inc. Seal configuration for use with a motor drive assembly in a microelectronic workpiece processing system
US20030092261A1 (en) * 2000-12-04 2003-05-15 Fumio Kondo Substrate processing method
US20030038115A1 (en) * 2001-08-23 2003-02-27 Atusi Sakaida Method for wet etching and wet etching apparatus
US6803294B2 (en) * 2002-05-15 2004-10-12 Renesas Technology Corporation Semiconductor wafer and manufacturing method of semiconductor device
US20040074808A1 (en) * 2002-07-05 2004-04-22 Entegris, Inc. Fire retardant wafer carrier
US6940181B2 (en) * 2003-10-21 2005-09-06 Micron Technology, Inc. Thinned, strengthened semiconductor substrates and packages including same
US20050239295A1 (en) * 2004-04-27 2005-10-27 Wang Pei-L Chemical treatment of material surfaces

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Process Technology", vol. 1, 1986, LATTICE PRESS, article WOLF ET AL.: "Silicon Processing for the VLSI Era", pages: 531 - 535 *
See also references of EP1799446A4 *

Also Published As

Publication number Publication date
TWI463527B (en) 2014-12-01
KR20070051337A (en) 2007-05-17
TW200614329A (en) 2006-05-01
WO2006023753A2 (en) 2006-03-02
KR20070048793A (en) 2007-05-09
EP1799446A4 (en) 2010-03-03
AT10874U1 (en) 2009-11-15
TWI502620B (en) 2015-10-01
EP1799446A2 (en) 2007-06-27
CN102790000B (en) 2016-06-29
CN102790000A (en) 2012-11-21
DE212005000047U1 (en) 2007-08-02
TW201230144A (en) 2012-07-16
JP2008511141A (en) 2008-04-10

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