EP1799446A4 - System for thinning a semiconductor workpiece - Google Patents
System for thinning a semiconductor workpieceInfo
- Publication number
- EP1799446A4 EP1799446A4 EP05789099A EP05789099A EP1799446A4 EP 1799446 A4 EP1799446 A4 EP 1799446A4 EP 05789099 A EP05789099 A EP 05789099A EP 05789099 A EP05789099 A EP 05789099A EP 1799446 A4 EP1799446 A4 EP 1799446A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- thinning
- semiconductor workpiece
- workpiece
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02035—Shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/923,363 US7288489B2 (en) | 2004-08-20 | 2004-08-20 | Process for thinning a semiconductor workpiece |
US10/923,436 US20060046499A1 (en) | 2004-08-20 | 2004-08-20 | Apparatus for use in thinning a semiconductor workpiece |
US10/922,762 US20060040111A1 (en) | 2004-08-20 | 2004-08-20 | Process chamber and system for thinning a semiconductor workpiece |
US10/923,132 US7354649B2 (en) | 2004-08-20 | 2004-08-20 | Semiconductor workpiece |
PCT/US2005/029598 WO2006023753A2 (en) | 2004-08-20 | 2005-08-18 | System for thinning a semiconductor workpiece |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1799446A2 EP1799446A2 (en) | 2007-06-27 |
EP1799446A4 true EP1799446A4 (en) | 2010-03-03 |
Family
ID=35968220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05789099A Ceased EP1799446A4 (en) | 2004-08-20 | 2005-08-18 | System for thinning a semiconductor workpiece |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1799446A4 (en) |
JP (1) | JP2008511141A (en) |
KR (2) | KR20070051337A (en) |
CN (1) | CN102790000B (en) |
AT (1) | AT10874U1 (en) |
DE (1) | DE212005000047U1 (en) |
TW (2) | TWI463527B (en) |
WO (1) | WO2006023753A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG147330A1 (en) | 2007-04-19 | 2008-11-28 | Micron Technology Inc | Semiconductor workpiece carriers and methods for processing semiconductor workpieces |
US7989318B2 (en) * | 2008-12-08 | 2011-08-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for stacking semiconductor dies |
DE102009037281B4 (en) * | 2009-08-12 | 2013-05-08 | Siltronic Ag | Process for producing a polished semiconductor wafer |
NL2014625B1 (en) * | 2015-04-13 | 2017-01-06 | Suss Microtec Lithography Gmbh | Wafer treating device and sealing ring for a wafer treating device. |
DE102019110402A1 (en) | 2018-05-25 | 2019-11-28 | Infineon Technologies Ag | A method of processing a semiconductor wafer, a semiconductor composite structure and a support structure for a semiconductor wafer |
JP7136679B2 (en) * | 2018-12-13 | 2022-09-13 | 株式会社荏原製作所 | Seals used for substrate holders |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2024961A1 (en) * | 1968-11-29 | 1970-09-04 | Philips Nv | |
US4266334A (en) * | 1979-07-25 | 1981-05-12 | Rca Corporation | Manufacture of thinned substrate imagers |
JPH0684731A (en) * | 1992-09-07 | 1994-03-25 | Nec Kyushu Ltd | Semiconductor wafer |
EP1061584A2 (en) * | 1999-06-17 | 2000-12-20 | Intersil Corporation | Self-supported ultra thin silicon wafer process |
US20030119281A1 (en) * | 2001-12-12 | 2003-06-26 | Mikimasa Suzuki | Method for manufacturing semiconductor power device |
US20030215985A1 (en) * | 2002-05-15 | 2003-11-20 | Hitachi, Ltd. | Semiconductor wafer and manufacturing method of semiconductor device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5011782A (en) * | 1989-03-31 | 1991-04-30 | Electric Power Research Institute | Method of making passivated antireflective coating for photovoltaic cell |
JP3161515B2 (en) * | 1997-10-08 | 2001-04-25 | 三菱マテリアル株式会社 | Method for manufacturing semiconductor device |
US6613681B1 (en) * | 1998-08-28 | 2003-09-02 | Micron Technology, Inc. | Method of removing etch residues |
US6248222B1 (en) * | 1998-09-08 | 2001-06-19 | Acm Research, Inc. | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
US6402843B1 (en) * | 1999-12-07 | 2002-06-11 | Trusi Technologies, Llc | Non-contact workpiece holder |
US6334453B1 (en) * | 2000-02-14 | 2002-01-01 | Semitool, Inc. | Seal configuration for use with a motor drive assembly in a microelectronic workpiece processing system |
JP2004515918A (en) * | 2000-12-04 | 2004-05-27 | 株式会社荏原製作所 | Substrate processing apparatus and method |
JP3899871B2 (en) * | 2001-08-23 | 2007-03-28 | 株式会社デンソー | Etching method, etching apparatus, and thin film sensor manufacturing method |
JP3620528B2 (en) * | 2001-12-12 | 2005-02-16 | 株式会社デンソー | Manufacturing method of semiconductor device |
US20040074808A1 (en) * | 2002-07-05 | 2004-04-22 | Entegris, Inc. | Fire retardant wafer carrier |
DE10260233B4 (en) * | 2002-12-20 | 2016-05-19 | Infineon Technologies Ag | Method of attaching a workpiece to a solid on a workpiece carrier and workpiece carrier |
US6940181B2 (en) * | 2003-10-21 | 2005-09-06 | Micron Technology, Inc. | Thinned, strengthened semiconductor substrates and packages including same |
US20050239295A1 (en) * | 2004-04-27 | 2005-10-27 | Wang Pei-L | Chemical treatment of material surfaces |
-
2005
- 2005-08-18 DE DE212005000047U patent/DE212005000047U1/en not_active Expired - Lifetime
- 2005-08-18 EP EP05789099A patent/EP1799446A4/en not_active Ceased
- 2005-08-18 CN CN201210101297.1A patent/CN102790000B/en not_active Expired - Fee Related
- 2005-08-18 JP JP2007528050A patent/JP2008511141A/en active Pending
- 2005-08-18 KR KR1020077006237A patent/KR20070051337A/en not_active Application Discontinuation
- 2005-08-18 KR KR1020077006971A patent/KR20070048793A/en not_active Application Discontinuation
- 2005-08-18 WO PCT/US2005/029598 patent/WO2006023753A2/en active Application Filing
- 2005-08-18 AT AT0900405U patent/AT10874U1/en not_active IP Right Cessation
- 2005-08-19 TW TW094128423A patent/TWI463527B/en not_active IP Right Cessation
- 2005-08-19 TW TW101109367A patent/TWI502620B/en not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2024961A1 (en) * | 1968-11-29 | 1970-09-04 | Philips Nv | |
US4266334A (en) * | 1979-07-25 | 1981-05-12 | Rca Corporation | Manufacture of thinned substrate imagers |
JPH0684731A (en) * | 1992-09-07 | 1994-03-25 | Nec Kyushu Ltd | Semiconductor wafer |
EP1061584A2 (en) * | 1999-06-17 | 2000-12-20 | Intersil Corporation | Self-supported ultra thin silicon wafer process |
US20030119281A1 (en) * | 2001-12-12 | 2003-06-26 | Mikimasa Suzuki | Method for manufacturing semiconductor power device |
US20030215985A1 (en) * | 2002-05-15 | 2003-11-20 | Hitachi, Ltd. | Semiconductor wafer and manufacturing method of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TWI463527B (en) | 2014-12-01 |
KR20070051337A (en) | 2007-05-17 |
TW200614329A (en) | 2006-05-01 |
WO2006023753A2 (en) | 2006-03-02 |
KR20070048793A (en) | 2007-05-09 |
AT10874U1 (en) | 2009-11-15 |
TWI502620B (en) | 2015-10-01 |
EP1799446A2 (en) | 2007-06-27 |
CN102790000B (en) | 2016-06-29 |
CN102790000A (en) | 2012-11-21 |
WO2006023753A3 (en) | 2009-06-25 |
DE212005000047U1 (en) | 2007-08-02 |
TW201230144A (en) | 2012-07-16 |
JP2008511141A (en) | 2008-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20070316 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK YU |
|
DAX | Request for extension of the european patent (deleted) | ||
R17D | Deferred search report published (corrected) |
Effective date: 20090625 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B32B 13/04 20060101ALI20090702BHEP Ipc: B32B 9/04 20060101ALI20090702BHEP Ipc: H01L 21/461 20060101ALI20090702BHEP Ipc: H01L 21/302 20060101ALI20090702BHEP Ipc: H01L 21/36 20060101ALI20090702BHEP Ipc: C23F 1/00 20060101AFI20090702BHEP |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20100122 |
|
RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20100129 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: APPLIED MATERIALS, INC. |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R003 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
18R | Application refused |
Effective date: 20140227 |