WO2003098655A1

WO2003098655A1 - Fluorescent material panel manufacturing method and intermediate film sheet for forming fluorescent material panel

Info

Publication number: WO2003098655A1
Application number: PCT/JP2003/006392
Authority: WO
Inventors: Koji Fujita; Katsutoshi Ohno; Michiaki Muraoka; Takeshi Hirai
Original assignee: Sony Corporation; Nippon Paper Industries Co., Ltd.
Priority date: 2002-05-22
Filing date: 2003-05-22
Publication date: 2003-11-27
Also published as: KR20040111646A; CN1656588A; JP2003346647A

Abstract

A fluorescent material panel manufacturing method for providing a fluorescent material panel having a high brightness, a high uniformity of brightness, and a high color purity by preventing a metal back layer from being raised and broken and an intermediate film sheet used for the manufacture of the fluorescent material panel, the method of manufacturing the fluorescent material panel having the metal back layer formed on a panel substrate with a fluorescent material pattern comprising the steps of transferring the film-shaped intermediate film formed of an organic material on the panel substrate in the state of covering the fluorescent material pattern to form the metal back layer on the intermediate film, removing the intermediate film by combustion, and transferring the intermediate film formed of an adhesive layer and a smooth layer with smooth surface on the panel substrate with the adhesive layer positioned on the panel substrate (4) side by pressing the intermediate film against the panel substrate (4) from the upper side of a cushion layer.

Description

Specification

Method of manufacturing phosphor panel and interlayer sheet for forming phosphor panel

The present invention relates to a phosphor panel used in a display device such as a cathode ray tube or an FED (field emission display), in particular, a method of manufacturing a phosphor panel provided with a metallic back layer, and an interlayer film suitably used in the manufacture. About. Background art

In the method of manufacturing a color cathode ray tube, in particular, in the manufacture of the phosphor panel, after forming the phosphor in the panel surface, it is practiced to form a metallic back layer made of aluminum. At this time, first, as shown in FIG. 5A, a phosphor pattern 3 consisting of red, green and blue granular phosphors 3 a is formed at predetermined positions on the transparent substrate 1 between the black matrix 2. Prepare a panel board 4 that has been Next, in order to smooth the panel substrate 4 on which the phosphor pattern 3 is formed, an intermediate film 5 is applied and formed. The intermediate film 5 is made of, for example, a resin emulsion such as acrylic, and is spin-coated on the panel substrate 4.

Thereafter, as shown in FIG. 5B, the metal back layer 6 is vapor deposited to cover the intermediate film 5. Next, as shown in Fig. 5C, the interlayer film (5) under the metal back layer 6 is burned off by baking treatment.

As described above, when interlayer film 5 is coated and formed on phosphor stripe 3, interlayer film 5 becomes a base of metallic back layer 6 and has a smooth surface on a smooth base surface. The metallic back layer 6 is made to be formed into a film. The metal bag formed in this way The black layer 6 prevents charge-up on the fluorescent surface, and reflects the light from the phosphor emitting on the side opposite to the transparent substrate 1 to the transparent substrate 1 side to increase the brightness. Play.

However, the method of manufacturing the above-mentioned phosphor panel has the following problems. That is, in order to improve the luminance as described above by the metallic back layer, the intermediate layer is formed in a state of integrally covering the unevenness due to the particulate fluorescent material constituting the fluorescent material pattern, and thus the metallic back layer is formed. It is essential to form a film. However, since the intermediate film is formed as a coated film, it penetrates into the gaps of the granular phosphor in the state of being coated and formed on the panel substrate. Therefore, in order to smooth the phosphor pattern, it is necessary to apply and form an intermediate film with a certain thickness.

However, when the intermediate film is formed thick, as shown in FIG. 5C, “floating A” occurs in the metallic layer 6 when burning and removing the intermediate film by the baking process. It becomes a factor of "peeling". In addition, the amount of gas generated when burning off the interlayer increases, and the gas pressure may cause “break B” in the metallic back layer 6. Such "peeling" and "breaking B" of the metallic back layer cause the partial reduction of the brightness of the phosphor panel. In addition, when “floating A” occurs in the metallic back layer 6 on the black matrix 3, light scatters in the direction of the adjacent phosphor pattern 3 due to the light scattering. Leakage causes deterioration of color purity.

Furthermore, it is known that the coating film represented by the spin coating has unevenness in the film thickness distribution. Such unevenness in the thickness of the intermediate film causes unevenness in the surface smoothness of the metal back layer 6, which causes uneven brightness. In particular, when spin coating is performed on a rectangular panel substrate, the thickness of the intermediate film becomes significantly thick at the corner of the panel substrate, and the above-described not only unevenness in brightness but also the above-described unevenness occurs. Lifting of the metal back layer is also likely to occur. Disclosure of the invention

According to the present invention, by forming an interlayer having a uniform film thickness, it is possible to prevent lifting and peeling of the metal back layer, and to provide a phosphor panel having high brightness and high uniformity of brightness and high color purity. It is an object of the present invention to provide a manufacturing method that can be obtained and an interlayer sheet that is suitably used in this manufacturing method.

The present invention for achieving such an object is a method of manufacturing a phosphor panel in which a metallic back layer is formed on a panel substrate provided with a phosphor pattern, and it is carried out as follows. It is characterized by First, a film-like interlayer made of an organic material is transferred onto the panel substrate in a state of covering the phosphor pattern. Next, a metal back layer made of a conductive material is formed on the intermediate film by vapor deposition, and the intermediate film is burnt and removed.

In such a manufacturing method, since the film-like intermediate film is transferred onto the panel substrate, the particulate phosphors constituting the phosphor pattern are integrally covered with the film-like intermediate film. At this time, the interlayer does not infiltrate into the gaps between the granular phosphors constituting the phosphor pattern. For this reason, on the panel substrate, the granular phosphor can be integrally covered by the intermediate film kept at a constant film thickness. Therefore, the metallic back layer formed on the intermediate film can be formed into a film having a smooth surface without thickening the intermediate film.

The present invention is also an interlayer film sheet for supplying the interlayer film described above, which comprises a substrate film and a film-shaped interlayer film made of an organic material provided on the upper side of the substrate film. In particular, it is characterized in that the interlayer is composed of a smooth surface smooth layer provided on the substrate film and an adhesive layer provided on the top. By using such an intermediate film sheet, the smooth layer held by the substrate film is transferred onto the panel substrate by the adhesive layer. Then, the surface of the panel substrate can be covered with the smooth layer by peeling off the substrate film after transferring onto the panel substrate. Therefore, it is possible to transfer a smooth intermediate film made of an organic material on the panel substrate.

According to the present invention, since the intermediate film to be the base in forming the metallic back layer is transferred onto the panel substrate as a film, the film thickness on the uneven panel substrate is constant. The interlayer film kept in place makes it possible to cover the surface smoothly. Therefore, the metallic back layer can be formed on the smooth surface of the intermediate film without thickening the intermediate film. As a result, the amount of gas generated during combustion and removal of the intermediate film after formation of the metallic back layer is suppressed, the floating and peeling of the metallic back layer, and breakage are further prevented, and the uniformity of luminance is high with high luminance. And, it becomes possible to obtain a phosphor panel with high color purity. Brief description of the drawings

FIG. 1 is a cross-sectional view showing an example of the construction of the interlayer sheet of the present invention. FIG. 2 is a cross-sectional view showing another example of the construction of the interlayer sheet of the present invention.

FIGS. 3A to 3D are sectional process drawings for explaining an example of the method for manufacturing a phosphor panel according to the present invention.

FIG. 4 is a block diagram of a bonding apparatus used for producing the phosphor panel of the present invention.

5A to 5C are cross-sectional process drawings for explaining a conventional method of manufacturing a phosphor panel. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail based on the drawings. Here, first, when forming a phosphor panel of a display device, the configuration of an interlayer film for supplying an interlayer serving as a base of a metallic back layer on a panel substrate provided with a phosphor pattern will be described. Then, a method of manufacturing a phosphor panel using this interlayer sheet will be described. Interlayer film sheet 1〉

Figure 1 shows an example of the configuration of interlayer film sheet 100. The intermediate film sheet 100 shown in this figure is formed on the base film 101 via the cushioning layer 102 and the releasing layer 103 as described above. An intermediate film 104 is provided to be a base of the layer. This intermediate film 104 is formed of an organic material which can be removed by burning and formed into a film, and the smooth layer 104 a on the side of the base film 101 and the adhesive layer on the upper side thereof. It consists of 1 0 4 b. A force film 105 is provided on such an intermediate film 104. Below, we explain the detailed composition of each film and layer.

The base material film 101 is for supporting each film and layer provided on the upper side, and is formed by molding a conventionally known plastic film into a sheet shape. It can be used. Specific materials include, for example, polyethylene terephthalate, polyethylene, polypropylene, polychlorinated Biel, polyethylene styrene, polycarbonate, triacetate, etc. can give. In particular, polyethylene terephthalate film (PET) film having high mechanical strength and excellent heat stability, or polypropylene film (OPP film) having low cost and excellent releasability is preferable. . This base film 101 can support each film and layer, and can be easily peeled off with the layers adhered on the panel substrate via the adhesive layer 104 b. It shall have a thickness. The specific film thickness is about 38 to 100 / m, preferably about 50 m, although it depends on the material constituting the base material film 101. It is assumed that

The cushioning layer 102 is made of an elastic material and is used as a buffer material to absorb the unevenness of the phosphor pattern formed on the panel substrate. As a material of the cushion layer 102, a thermoplastic resin is preferable. For example, acrylate ester copolymer, saponified ethylene and acrylate ester copolymer, Saponified product of styrene and acrylic acid ester copolymer, ethylene vinyl acetate copolymer, ethylene ethyl acetate copolymer, copolymer of styrene and isoprene, or butadiene, poly ester resin, Polyolefin resin etc. may be mentioned. In addition, these resins can be used alone, or mixed in appropriate formulations, or laminated in appropriate combinations. If necessary, a plasticizer may be added. In addition, the cushioning layer 102 has a film thickness capable of absorbing the unevenness of the phosphor pattern formed on the panel substrate by its elasticity. The specific film thickness is about 15 to 80 μπι, preferably about 50 / im, although it depends on the material constituting the cushion layer 102.

When forming the intermediate film 104 on the cushioning layer 102, the releasing layer 103 is formed by forming the intermediate film 104 via this releasing layer 103. By forming the cushioning layer 102 without permeating the intermediate film 104, the cushioning layer 102 and the intermediate film 104 can be formed by It is provided to be separable. The release layer 103 is formed by combining a base resin and a matting agent for making the surface uneven. Examples of base resins include urethane resins, melamine resins, silicone resins, or copolymers and mixtures thereof. A variety of organic and inorganic fine powder materials can be used as a mapping agent. In particular, in consideration of outgassing in the step of firing and removing the interlayer described in the following phosphor panel manufacturing method, 1 to A silica having an average particle diameter of Ομπι is preferred. In addition, when forming the intermediate film 104 on the cushion layer 102, the release layer 103 can prevent the permeation of the intermediate film 104 into the cushion layer 102. It shall have a thickness. The specific film thickness is about 0.5 to 5.0 / im, preferably about 2.0 / xm, although it depends on the material constituting the release layer 103. The release layer 103 may be made of only the above-mentioned base resin without adding a matting agent.

The smooth layer 104 a (intermediate film 104) is a layer for imparting smoothness to the surface of the intermediate film 104, and is made of an organic material which can be removed by combustion. . Specific examples of the organic material constituting such a smooth layer 104 a include, for example, acrylic resin, styrene resin, polyurethane, polybutyl cellulose, or copolymer with these. And mixtures. More preferably, an acrylic styrene copolymer or a styrene resin having a glass transition temperature of 30 ° C. or higher is preferable. In addition, an organic resin fine powder (about 1 m diameter) that burns at a lower temperature than other resins may be added to the above-described resin in a range of 1 to 10%. By this, the organic resin fine powder may be burnt first to make other resins easy to burn, and the degassing effect may be obtained. In addition, it is assumed that the smooth layer 104 a has a film thickness sufficient to obtain sufficient smoothness on its surface. The specific film thickness depends on the material of the smooth layer 104 a, but is about 0.3 to 2. 0 / z m, preferably about 1.0 m.

The adhesive layer 104 b (intermediate film 104) is a layer for giving adhesion to the intermediate film 104, and is made of an organic material which can be removed by combustion. As the organic material constituting such an adhesive layer 104 b, the same material and fine powder as the smooth layer 104 a can be used, but the solvent to be added to these resins may be used. By selecting It is important to have a fit. Specifically, the glass transition temperature

Preferred are acrylic / styrene copolymers at 30 ° C. or lower, and styrene resins. As the solvent, various alcohols such as methanol, ethanol and the like which do not gel or coagulate the resin material can be used. The adhesive layer 104 b has a thickness sufficient to obtain sufficient adhesion to the panel substrate. Although the specific film thickness depends on the material constituting the adhesive layer 104 b, it is about 0.5 to 3.0 / z m, preferably about 1.

The cover film 105 is for protecting the adhesive layer 104 b constituting the intermediate film 104, and may be a conventionally known plastic film similar to the substrate film 101 described above. It is possible to use a film formed into a film. The cover film 105 is capable of protecting the adhesion layer 104 b and having a film thickness that allows easy peeling of each layer laminated on the substrate film 101. I assume. Although the specific film thickness depends on the material constituting the cover film 105, it is assumed to be about 20 to 50 μπι, preferably about 25 jum. Although not shown here, the releasability of the cover film 105 with respect to the adhesive layer 104 b is more stable between the cover film 105 and the adhesive layer 104 b. It is preferable to provide a release layer in order to prevent this. Examples of the resin used for the release layer include urethane resin, melamine resin, silicone resin, and copolymers and mixtures with these. The film thickness of such a release layer is not particularly limited, but preferably about 0.5 to 5.0 μm. However, when the cover film 105 is made of a material having releasability such as polypropylene film (OPP film), such mold release is possible. There is no need to provide a layer.

The intermediate film sheet 100 having the above-described configuration is formed, for example, as follows, though the method of forming the intermediate film sheet 100 is not limited. Ahead Then, a cushion layer 102 and a mold release layer 103 are formed in this order on one main surface of the base film 101 by an arbitrary method such as a coating method or a vapor deposition method. On the other hand, an adhesion layer 104 b and a smooth layer 104 a are formed in this order on one main surface of the cover film 105 by an application method, an evaporation method or the like in this order. Then, in a state where the release layer 103 and the smooth layer 104 a which have been applied and formed are solidified, the base film 101 and the cover film 105 are combined with the release layer 103 and the cover layer 105. The smooth layer 104 a is disposed opposite to each other, and the release layer 103 and the smooth layer 104 a are adsorbed to be integrated to form an interlayer sheet 100.

Figure 2 shows another example of the configuration of interlayer film sheet 100. The difference between the interlayer sheet 100 0 ′ shown in this figure and the interlayer sheet 100 0 described with reference to FIG. 1 is the substrate film 101 and the cushion layer. It is assumed that the granular substance 1 0 7 is sandwiched between it and 10 2, and the other configurations are the same.

This granular substance 1 0 7 is a smooth layer constituting the intermediate film 1 0 4 via the cushion layer 1 0 2 when the intermediate film 1 0 4 is pressed from the side of the substrate film 1 0 1 It is for applying point stress to the surface of 104 a to cause cracks and pin holes. Examples of such particulate substances 107 include silica, calcium carbonate, zinc oxide, alumina, magnesium hydroxide, aluminum hydroxide and the like in the case of inorganic materials, and organic materials in the case of organic materials, such as Mention may be made of fluorine resins such as polystyrene, polystyrene, tetrafluorinated thiophene and the like, benzoguanamine and the like.

The particle size of such granular material 107 depends on the elasticity of cushion layer 107, but is about 1 to 8 / z m. Furthermore, the planar arrangement density of granular material 107 is assumed to be about 2 to 10% depending on the density that causes cracks and pinholes. This kind of granular material The grain size and arrangement density of quality 107 shall be selected appropriately according to the density and size that cause cracks and pinholes. In addition, the particulate substance 1 0 7 has an appropriate particle diameter, and has a shape capable of efficiently generating cracks and pinholes on the surface of the smooth layer 1 0 4 a in the process described above. If it is, it is not limited to the above-mentioned inorganic pigments.

The formation of the intermediate film sheet 1 0 0 formed by sandwiching such particulate substance 1 0 7 can be carried out by the method of forming the intermediate film sheet 1 0 0 shown in FIG. Before forming the cushion layer 102 on one main surface of the 101, the granular material 1 0 7 is spread on the main surface of the base film 100 to form a row. It will be.

The intermediate film 1 0 4 (smooth layer 1 0 4 a, adhesive layer 1 0 4 b) of the intermediate film sheet 1 0 0 0 1 0 0 2 of the configuration described using FIG. 1 and FIG. In the burning and removing of the intermediate film 104 performed in the subsequent production of the phosphor panel, an oxidizing agent may be added to prevent the unburned part of the intermediate film 104. As the oxidizing agent, for example, ammonium chloride, ammonium persulfate, potassium permanganate and the like can be used.

Next, a method of manufacturing a phosphor panel using the intermediate film sheet 100, 100 (hereinafter, representatively referred to as intermediate film sheet 100) having the above-mentioned configuration is shown in FIG. Description will be made with reference to the process drawing and FIG. The same components as those of the conventional manufacturing method described with reference to FIG. 5 are denoted by the same reference numerals.

First, as shown in FIG. 3A, a phosphor pattern 3 consisting of red, green and blue granular phosphors 3 a is placed at a predetermined position between the black matrix 2 on the transparent substrate 1. Prepare the provided panel board 4. Also, peel off the cover film 1 0 5 of the interlayer sheet 1 0 0 and bond the adhesive layer 1 0 4 Expose b face. In FIG. 3A, the illustration of the release layer 103 is omitted.

Then, with the adhesive layer 104 b facing the panel substrate 4, the intermediate film sheet 100 from which the cover film 105 has been peeled off is disposed, and the base film 101 Press the interlayer sheet 100 from the top to the panel substrate 4 side. As a result, the interlayer sheet 100 is bonded to the panel substrate 4 by the adhesive force of the adhesive layer 104 b.

At this time, a bonding apparatus 200 as shown in FIG. 4 may be used. This bonding apparatus 200 is provided with a stage 201 for mounting the panel substrate 4 and a roller 202 disposed opposite to the stage 201.

The roller 202 has a length equal to or greater than the width of the surface to which the interlayer sheet 100 is bonded, and the surface is made of an elastic material. For example, when the surface is made of silicone rubber, the thickness of the rubber is about 5 to 3 O mm, the hardness of the rubber is about 30 to 80, and the interlayer sheet 10 and the panel substrate 4 are bonded Depending on the condition, for example, if the thickness of the rubber is 10 mm, the hardness is set appropriately in combination as in the case of 40.

Further, it is assumed that the roller 202 can be heated to about 100 ° C. to 200 ° C.

The roller 201 is moved in the direction of movement along the rotation (indicated by the white arrow in the figure) by the operation of the rotary shaft support portion 203 that supports the roller 201 in a rotatable state. It is provided movably. The rotation shaft support portion 203 can press the roller 202 with a predetermined pressure against the panel substrate 4 placed on the stage side 201.

When performing bonding using such a bonding apparatus 200, the roller 2 heated via the intermediate film sheet 100 with respect to the panel substrate 4 placed on the stage 201. 0 2 Press and rotate while moving Let Then, the intermediate film sheet 100 is bonded to the panel substrate 4 by heating and pressure by the roller 202. At this time, for example, the moving speed of the roller 202 is 10 to 50 mm / sec, and the pressure at the time of contact between the roller 202 and the interlayer sheet 100 is 2 to 10 kg / cm ^2. Do it by degree.

Next, as shown in FIG. 3B, the interlayer sheet 100, the base film 101 and the cushion layer 102 attached to the panel substrate 4 are Peel off. At this time, the release layer 103 between the smooth layer 104a and the cushioning layer 102 is a part of the cushioning layer 102 and the base material film 101. Peeled off. Thus, the intermediate film 104 consisting of the adhesive layer 104 b and the smooth layer 104 a is transferred onto the panel substrate 4 in a state of covering the phosphor pattern 3.

Next, as shown in FIG. 3C, a metal back layer 6 made of a metal such as aluminum is formed on the smooth layer 104 a constituting the intermediate film 104 by vapor deposition. Do.

Thereafter, as shown in FIG. 3D, the baking process is performed to burn out the intermediate film 104 consisting of the adhesive layer 104 b and the smooth layer 104 a formed of the organic material. Do. As a result, a phosphor panel 10 in which the top of the panel substrate 4 on which the phosphor pattern 3 is formed is directly covered by the metallic back layer 6 is obtained.

In the method of manufacturing the phosphor panel 10 as described above, in order to transfer the film-like interlayer 14 onto the panel substrate 4, the interlayer is formed between the granular phosphors 3 a constituting the phosphor pattern 3. There is no penetration. For this reason, on the panel substrate 4, the granular phosphor 3 a constituting the phosphor pattern 3 can be integrally covered by the intermediate film 104 which is maintained at a constant film thickness. Therefore, the metallic back layer 6 formed on the intermediate film 104 can be formed into a smooth film shape without the intermediate film 104 being thickened like the coating film. Ru. Also, since there is no need to thicken the intermediate film 14 as in the case of a coated film, the gas resulting from the combustion of the intermediate film 14 can be eliminated in the combustion removal of the intermediate film 14. The amount of generation is reduced, and it is possible to prevent the metallic back layer 6 from being lifted or lifted off or to be torn off. Therefore, uneven brightness and deterioration due to breakage and peeling of the metal back layer 6, and deterioration of color purity due to floating are suppressed, high brightness and high uniformity of brightness, and high color purity It becomes possible to obtain a phosphor panel.

When the intermediate film 104 consisting of the smooth layer 104 a and the adhesive layer 104 b is transferred, the intermediate film 104 is attached to the surface of the panel substrate 4 by the adhesive layer 104 b. It is attached. Therefore, the intermediate film 104 covered with the smooth layer 104 a can be transferred with good adhesion to the surface of the panel substrate 4.

Furthermore, when transferring the intermediate film 104, the intermediate film 104 is pressed against the panel substrate 4 from above the cushion layer 102, whereby the phosphor pattern 3 is formed. The cushion layer 102 is deformed in accordance with the surface shape of the panel substrate 4 which it has. For this reason, on the surface of the panel substrate 4, the phosphor pattern 3 constituting the convex portion and the black matrix 2 positioned in the concave portion are in a state of firmly adhering to each other. It is possible to transfer the intermediate film 104 by

Then, when an interlayer film sheet 100 as shown in FIG. 2 is used, when transferring the interlayer film 104, a base film 10 holding a granular substance 1 0 7 is used. Due to the force on the cushion layer 12 and the cushion layer 12, the intermediate film 10 4 is pressed against the panel substrate 4. For this reason, the particulate matter 1 0 7 is pressed to the intermediate film 1 0 4 through the cushion layer 1 0 2 2, and the convex shape by the particulate matter 1 0 7 is transferred onto the surface of the intermediate film 1 0 4 Can form fine cracks and pinholes. Therefore, the metal back layer 6 deposited on this intermediate film 104 is It will have fine holes corresponding to the cracks and pinholes mentioned above. As a result, when burning and removing the intermediate film 104, the gas can be released from the holes, and the tearing of the metal back layer 6 can be reliably prevented, and the intermediate film 10 4 Thus, it is possible to prevent the floating of the vari- etalum layer 6 and the panel substrate 4 due to the residual gas from the combustion.

Since the particulate matter 107 is simultaneously removed from the intermediate film 104 when the base film 101 and the cushion layer 102 are peeled off, the intermediate film 104 may be removed. There is nothing left to the side.

In addition, when the intermediate film 104 contains an oxidizing agent, the intermediate film 104 is more reliably gasified and removed in the process of burning and removing the intermediate film 104. Becomes possible.

Claims

The scope of the claims

1. In a method of manufacturing a phosphor panel in which a metallic back layer is formed on a panel substrate provided with a phosphor pattern, a film-like interlayer made of an organic material is coated with the phosphor pattern in a state of covering the phosphor pattern. A transfer step on the substrate, a step of forming a metallic back layer made of a conductive material on the intermediate layer by vapor deposition, a step of burning and removing the intermediate layer under the metal back layer, and A method of manufacturing a phosphor panel characterized by performing

2. In the method of manufacturing a phosphor panel according to claim 1, the intermediate film formed by laminating an adhesive layer and a smooth surface smooth layer, the panel layer side with the adhesive layer facing the panel substrate A method of manufacturing a phosphor panel characterized by transferring onto the top.

3. In the method of manufacturing a phosphor panel according to claim 1, a cushion layer made of an elastic material is disposed on the panel substrate via the intermediate film, and the cushion layer A method of manufacturing a phosphor panel characterized in that the intermediate film is transferred onto the panel substrate by pressing the intermediate film against the panel substrate from the side.

4. In the method of manufacturing a phosphor panel according to claim 1, a film material formed by sandwiching a granular material on the panel substrate via the intermediate film is disposed, and the film material side And pressing the intermediate film against the panel substrate to transfer the intermediate film onto the panel substrate in a state in which a crack following the unevenness of the granular material is generated. Of producing a phosphor panel.

5. A method of manufacturing a phosphor panel according to claim 1, wherein an oxidizing agent is added to the intermediate film.

6. An intermediate film for supplying an intermediate film used as a base film of the metal back layer when forming the metal back layer of the phosphor panel And an intermediate film in the form of a film made of an organic material provided on the substrate film, and the intermediate film is provided on the substrate film. What is claimed is: 1. An interlayer sheet for forming a phosphor panel comprising: a smooth surface having a smooth surface; and an adhesive layer provided on the smooth layer.

7. The interlayer film for forming a phosphor panel according to claim 6, wherein the interlayer film is provided on the base film via a cushioning layer made of an elastic material. Intermediate film sheet for forming phosphor panel characterized by and. ..

8. In the interlayer sheet for forming a phosphor panel according to claim 7, a fluorescence characterized in that a granular material is sandwiched between the base film and the cushion layer. Intermediate film sheet for body panel formation.

9. An interlayer sheet for forming a phosphor panel according to claim 6, wherein an interlayer is added to the interlayer, and an interlayer sheet for forming a phosphor panel is characterized. .