WO1998038598A2 - Plastic card for an electronic combination card module - Google Patents

Plastic card for an electronic combination card module Download PDF

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Publication number
WO1998038598A2
WO1998038598A2 PCT/DE1998/000572 DE9800572W WO9838598A2 WO 1998038598 A2 WO1998038598 A2 WO 1998038598A2 DE 9800572 W DE9800572 W DE 9800572W WO 9838598 A2 WO9838598 A2 WO 9838598A2
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WO
WIPO (PCT)
Prior art keywords
antenna
wire
plastic card
card
plastic
Prior art date
Application number
PCT/DE1998/000572
Other languages
German (de)
French (fr)
Other versions
WO1998038598A3 (en
Inventor
Manfred Michalk
Original Assignee
Cubit Electronics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cubit Electronics Gmbh filed Critical Cubit Electronics Gmbh
Publication of WO1998038598A2 publication Critical patent/WO1998038598A2/en
Publication of WO1998038598A3 publication Critical patent/WO1998038598A3/en

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna

Definitions

  • the invention relates to a laminated plastic card which contains a plurality of cover foils and an antenna foil and in which an antenna coil consisting of wire has been arranged on the antenna foil prior to lamination, the antenna coil being located in the middle of the layer in the plastic card and one being laminated into the plastic card Cavity was incorporated to accommodate a Combi Card module, which has internal contacts and external contacts arranged at different heights
  • a step-shaped cavity is milled into such plastic cards and the electronic module is glued into it.
  • the electronic Combi Card module used can be directly connected via its contact surfaces pointing outwards via electrical contacting and connecting devices and also via its internal contacting surfaces facing the inside of the card an antenna coil are connected, communicate with data processing devices via electromagnetic fields and via corresponding receiving devices
  • a secure contact must be made between the module and the antenna coil inside the card.
  • the antenna coils are arranged in the laminate or almost in the middle of the laminate the internal connections of the electronic Combi Card module are in the edge layer of the plastic card after gluing.
  • the relatively large position tolerance of the antenna connections caused by the lamination process relative to the position of the cavity means that the antenna connection area must have such a large area, that sufficiently large flat elements of the internal connections of the electronic Combi Card module with the flat elements of the antenna connections are to be contacted with one another with certainty.
  • the invention is based on the object of specifying a laminated plastic card with a wire-shaped antenna coil in which connection areas for the antenna coil in a suitable size and depth in the plastic card are made possible with simple means for contacting the antenna coil with the inner connections of the electronic combi card module
  • the object is achieved in that the thickness of the antenna film and the cover films lying thereover are designed such that the underside of the antenna film layer is removed from the plastic card surface after lamination at a distance equal to the height of the internal contacts of the Combi Card module, and that the antenna coil in some areas is printed flush to the underside of the antenna film
  • the invention enables large-area antenna connection areas to be produced in defined layers of the plastic card with simple means
  • connection area By widening the connection area with loop-shaped antenna wire returns and by designing the The wire feed from the antenna to the connection area, starting from the cavity, remains in the connection areas, even if parts of the wire layers are damaged when milling the cavity, the feed and a sufficiently wide connection area are retained
  • connection area It is advantageous to only print the wire loops in the connection area to the underside of the antenna film in a web-like manner. This ensures that the wire loops are optimally anchored in the antenna film without the plastic card being adversely affected by the design, in that the antenna side of the antenna film is damaged by the printing tools the free milling of the cavities, even when milling into the antenna wire, there are connection areas that are fully functional.
  • This can be supported by the fact that silver-plated wires are used for the antenna wire and that after milling the cavity, the antenna connection areas are cleaned of any plastic residues by laser radiation it is also advantageous to deform the antenna wire at the same time in the case of web-like printing of connection areas in such a way that its width is increased.
  • Printing through can be by thermal, by ultrasound or by combination energy input into the printing tool
  • the wire antenna is expediently produced by means of a wire-laying process by directly inserting the wire into the antenna side of the antenna foil and it is advantageous to use bare metal, preferably surface-coated wire.
  • the wire-laying process enables the antenna to be produced in an environmentally friendly, cost-effective and precise manner, which is very good when using surface-coated wire
  • the wire loops in the connection area can also be easily produced with this method.
  • the contacting of the internal contacts of the electronic Combi Card module with the free-milled and preferably through intensive electromagnetic Radiation-cleaned connection areas of the antenna are expediently carried out by means of electrically conductive, thermoplastic adhesive with a processing temperature and time during bonding which is the same or similar to the temperature of the heat seal adhesive used for the electrically insulating gluing of the further surfaces of the electronic combi card module into the cavity of the plastic card.
  • the wire placed on the antenna layer side is not to be partially immersed in the antenna film during lamination, it is advantageous to fix the antenna wire. This can be done by printing on the special surfaces formed by the wire windings after the wire laying or with an adhesive layer that is fixed at the lamination temperature.
  • the antenna wire can thus be kept at an eccentric layer level in the region of the center of the cavity.
  • Figure 2 shows the web-wise antenna wire lowering in cross section
  • Figure 3 shows a plastic chip card cutout with Combi Card module.
  • a silver-plated copper wire with a diameter of 100 m is laid in five turns along the periphery of the plastic card 1 on the antenna side 7 of the antenna film layer 6 as the antenna wire 3.
  • the antenna wire is located in the layer or almost layer-middle position in the plastic card 1 Bei Laying the antenna wire 3 is pressed thermally or by ultrasonic energy about 80 m deep into the thermoplastic antenna film 6
  • the antenna wire 3 was moved back and forth in tight meandering loops 13 to create a wide connection area 4.
  • the wire feed 14 to the loop-shaped antenna connection area 4 was carried out from the periphery of the intended position of the Combi Card Module 2
  • the loop-shaped antenna connection area 4 is partially lowered in short webs 15 and in parts is located flush with the underside 8 of the antenna film 6
  • the central antenna windings 20 run in the area of the future center of the Combi Card module 2.
  • the central antenna windings 20 are placed on the special surface 16 and their height was fixed in the future laminated plastic card 1 as a special surface 16 with an adhesive layer 17 that was rigid during lamination
  • FIG. 3 shows the height stratifications of the antenna wires 3 in the area of the web-like depressions 15 of the antenna connections 4, in the area of the center step height 11 and in the chip card 1.
  • the step-by-step process results adjacent antenna connection areas 4 in the form of metallic bare wire pieces. This creates a reliable possibility of contacting, even in the cases in which the antenna wires 3 have been milled.
  • FIG. 3 shows a simplified illustration of a Combi Card module 2 with a coating of the inner contact surface 18 with electrically conductive, thermoplastic adhesive 22 and with a heat seal adhesive film 23 before it is inserted and sealed into the cavity 9 of the plastic card 1.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a laminated plastic card containing several covering films and an antenna film, wherein a wire antenna coil is so arranged before lamination occurs. The antenna coil is located in the middle of the plastic card layering and embedded into a cavity of the plastic card after lamination. Said cavity accommodates the plastic card module which comprises inner and outer contacts of varying heights arranged therein.

Description

Plastikkarte für elektronisches Combi-Card-Modul Plastic card for electronic combi card module
Die Erfindung betrifft eine laminierte Plastikkarte, die mehrere Deckfolien und eine Antennenfolie enthalt und bei der eine aus Draht bestehende Antennenspule vor dem Laminieren auf der Antennenfolie angeordnet wurde, wobei sich die Antennenspule schichtmittig in der Plastikkarte befindet und bei der nach dem Laminieren in die Plastikkarte eine Kavitat eingearbeitet wurde, die zur Aufnahme eines Combi Card Moduls, welches in unterschiedlichen Hohen angeordnete innere Kontakte und äußere Kontakte aufweistThe invention relates to a laminated plastic card which contains a plurality of cover foils and an antenna foil and in which an antenna coil consisting of wire has been arranged on the antenna foil prior to lamination, the antenna coil being located in the middle of the layer in the plastic card and one being laminated into the plastic card Cavity was incorporated to accommodate a Combi Card module, which has internal contacts and external contacts arranged at different heights
In derartigen Plastikkarten wird nach dem Laminieren eine stufenförmige Kavitat eingefrast und in diese das elektronische Modul eingeklebt Das eingesetzte elektronische Combi Card Modul kann über seine nach außen weisenden Kontaktflachen direkt über elektrische Kontaktierungs- und Verbindungseinrichtungen und außerdem über seine zum Karteninneren weisenden inneren Kontaktierungsflachen, die mit einer Antennenspule verbunden sind, über elektromagnetische Felder und über entsprechende Empfangseinrichtungen mit Datenverarbeitungseinrichtungen kommunizieren Bei der Herstellung dieser Kombikarten muß eine sichere Kontaktierung des Moduls mit der sich im Karteninneren befindenden Antennenspule erzeugt werden Um eine dauerhafte Planlage der Plastikkarte sowie ein gutes Design zu gewahrleisten werden, insbesondere bei drahtformigen Antennenspulen, die Antennenspulen schichtmittig oder nahezu schichtmittig im Laminat angeordnet, wahrend sich die inneren Anschlüsse des elektronischen Combi Card Moduls nach dem Einkleben in der Randschicht der Plastikkarte befinden Außerdem erfordert die durch den Laminiervorgang verursachte relativ große Lagetoleranz der Antennenan- Schlüsse gegenüber der Lage der Kavitat, daß der Antennenanschlußbe- reich eine so große Flache aufweisen muß, daß genügend große Flachenelemente der inneren Anschlüsse der elektronischen Combi Card Moduls mit den Flachenelementen der Antennenanschlusse mit Sicherheit miteinander zu kontaktieren sind.After laminating, a step-shaped cavity is milled into such plastic cards and the electronic module is glued into it. The electronic Combi Card module used can be directly connected via its contact surfaces pointing outwards via electrical contacting and connecting devices and also via its internal contacting surfaces facing the inside of the card an antenna coil are connected, communicate with data processing devices via electromagnetic fields and via corresponding receiving devices When producing these combination cards, a secure contact must be made between the module and the antenna coil inside the card.To ensure a permanent flatness of the plastic card and a good design, especially in the case of wire-shaped antenna coils, the antenna coils are arranged in the laminate or almost in the middle of the laminate the internal connections of the electronic Combi Card module are in the edge layer of the plastic card after gluing. Furthermore, the relatively large position tolerance of the antenna connections caused by the lamination process relative to the position of the cavity means that the antenna connection area must have such a large area, that sufficiently large flat elements of the internal connections of the electronic Combi Card module with the flat elements of the antenna connections are to be contacted with one another with certainty.
Von der Firma Ama Tech GmbH & Co KG, Pfronten/BRD, wurde hierzu vorgeschlagen, einen biegesteifen, geschlossenen Stutzring, der an mindestens zwei Bereichen metallisiert ist, entlang der Combi Card Modulperipherie in die Plastikkarte einzulaminieren Dabei ist auf einer Stutzπngseite an dem metallisierten Bereich der Antennenanschluß befestigt und an dem metallisierten Bereich auf der anderen Stutzringseite wird nach Freifrasen der Kavitat der innere Anschluß des elektronischen Combi Card Moduls kontaktiert Nachteilig ist bei dieser Losung der relativ hohe Aufwand für das Herstel- len, Einbringen und Kontaktieren des Stutzringes, sowie die Beeinträchtigung des Kartendesigns im Bereich des StutzringesThe company Ama Tech GmbH & Co KG, Pfronten / FRG, proposed for this purpose to laminate a rigid, closed support ring, which is metallized on at least two areas, along the Combi Card module periphery into the plastic card. On one side of the support on the metallized area the antenna connection is fastened and the inner connection of the electronic Combi Card module is contacted after the cavity has been cut free on the metallized area on the other side of the support ring. The disadvantage of this solution is the relatively high outlay for producing, inserting and contacting the support ring, and the impairment of the card design in the area of the support ring
In Stand der Technik ist es weiterhin bekannt, Chipkarteninlays mit atztechnisch hergestellten Spulen zu verwenden, bei denen die Leiterbah- nen in relativ großflächige Antennenanschlußbereiche übergehen Nachteilig sind hierbei jedoch die hohen Kosten für die Herstellung der Spulen, sowie die gegenüber Drahtspulen schlechteren Gutewerte der geatzten SpulenIt is also known in the prior art to use chip card inlays with coils produced by etching technology, in which the conductor tracks merge into antenna connection areas of relatively large area However, the high costs for the production of the coils and the poorer values of the etched coils compared to wire coils are disadvantageous here
Der Erfindung liegt die Aufgabe zugrunde, eine laminierte Plastikkarten mit einer drahtformigen Antennenspule anzugeben, bei der zur Kontaktierung der Antennenspule mit den inneren Anschlüssen des elektronischen Combi Card Modul Anschlußbereiche für die Antennenspule in geeigneter Große und Tiefenlage in der Plastikkarte mit einfachen Mitteln ermöglicht werdenThe invention is based on the object of specifying a laminated plastic card with a wire-shaped antenna coil in which connection areas for the antenna coil in a suitable size and depth in the plastic card are made possible with simple means for contacting the antenna coil with the inner connections of the electronic combi card module
Erfindungsgemaß wird die Aufgabe dadurch gelost, daß die Dicke der Antennenfolie und der daruberliegenden Deckfolien so ausgeführt ist, daß die Unterseite der Antennenfolienschicht nach dem Laminieren im Abstand der Hohe der inneren Kontakte des Combi Card Moduls von der Plastik- kartenoberflache entfernt ist und daß die Antennenspule in Teilbereichen durch die Antennenfolie bundig zur deren Unterseite gedruckt istAccording to the invention, the object is achieved in that the thickness of the antenna film and the cover films lying thereover are designed such that the underside of the antenna film layer is removed from the plastic card surface after lamination at a distance equal to the height of the internal contacts of the Combi Card module, and that the antenna coil in some areas is printed flush to the underside of the antenna film
Vorteilhafte Ausgestaltungen der erfmdungsgemaßen Plastikkarte sind in den Unteranspruchen angegebenAdvantageous embodiments of the plastic card according to the invention are specified in the subclaims
Die Erfindung ermöglicht mit einfachen Mitteln großflächige Antennenan- schlußbereiche in definierten Schichtenlagen der Plastikkarte zu erzeugenThe invention enables large-area antenna connection areas to be produced in defined layers of the plastic card with simple means
Durch die Verbreiterung des Anschlußbereiches mit schleifenfbrmigen Antennendrahtruckfuhrungen sowie durch die Gestaltung der Drahtzuführung von der Antenne zum Anschlußbereich jeweils von der Kavitat ausgehend bleiben selbst dann, wenn beim Einfrasen der Kavitat Teile der Drahtlagen beschädigt werden, in den Anschlußbereichen die Zuführung sowie ein genügend breiter Anschlußbereich erhaltenBy widening the connection area with loop-shaped antenna wire returns and by designing the The wire feed from the antenna to the connection area, starting from the cavity, remains in the connection areas, even if parts of the wire layers are damaged when milling the cavity, the feed and a sufficiently wide connection area are retained
Es ist vorteilhaft, die Drahtschleifen im Anschlußbereich nur stegweise an die Unterseite der Antennenfolie zu drucken Damit wird eine optimale Verankerung der Drahtschleifen in der Antennenfolie erreicht, ohne daß Designbeeintrachtigungen der Plastikkarte dadurch auftreten, daß die Antennenseite der Antennenfolie durch die Druckwerkzeuge beschädigt werden Außerdem stehen nach dem Freifrasen der Kavitat auch bei Einfrasen in den Antennendraht Anschlußbereiche zur Verfügung, die voll funktionsfähig sind Dies kann noch dadurch unterstutzt werden, daß für den Antennendraht versilberte Drahte verwendet werden und daß nach dem Fräsen der Kavitat die Antennenanschlußbereiche durch Laserstrahlung von eventuellen Plastikresten gereinigt werden Es ist weiterhin vorteilhaft, beim stegweisen Durchdrucken von Anschlußbereichen den Antennendraht gleichzeitig so zu deformieren, daß seine Breite vergrößert wird Das Durchdrucken kann durch thermischen, durch Ultraschall- oder kombinierten Energieeintrag in das Druckwerkzeug erfolgenIt is advantageous to only print the wire loops in the connection area to the underside of the antenna film in a web-like manner.This ensures that the wire loops are optimally anchored in the antenna film without the plastic card being adversely affected by the design, in that the antenna side of the antenna film is damaged by the printing tools the free milling of the cavities, even when milling into the antenna wire, there are connection areas that are fully functional.This can be supported by the fact that silver-plated wires are used for the antenna wire and that after milling the cavity, the antenna connection areas are cleaned of any plastic residues by laser radiation it is also advantageous to deform the antenna wire at the same time in the case of web-like printing of connection areas in such a way that its width is increased. Printing through can be by thermal, by ultrasound or by combination energy input into the printing tool
Die Drahtantenne wird zweckmäßig mittels Drahtlegeverfahren durch direktes Einlegen des Drahtes in die Antennenseite der Antennenfolie hergestellt und es ist vorteilhaft dabei metallisch blanken, vorzugsweise oberflachenveredelten Draht zu verwenden Das Drahtlegeverfahren ermöglicht eine umweltschonende, kostengünstige und lageprazise Erzeugung der Antenne, die bei Verwendung von oberflachenveredeltem Draht sehr hohe Gutewerte aufweist Mit diesem Verfahren lassen sich auch die Drahtschleifen im Anschlußbereich einfach erzeugen Die Kontaktierung der inneren Kontakte des elektronischen Combi Card Moduls mit den freigefrasten und vorzugsweise durch intensive elektromagnetische Strahlung gereinigten Anschlußbereichen der Antenne erfolgt zweckmäßig durch elektrisch leitfähigen, thermoplastischen Kleber mit einer Verarbeitungstemperatur und -zeit beim Verkleben, die gleich oder ähnliche der verwendeten Temperatur des Heißsiegelklebers zum elektrisch isolierenden Einkleben der weiteren Flächen des elektronischen Combi Card Moduls in die Kavitat der Plastikkarte ist.The wire antenna is expediently produced by means of a wire-laying process by directly inserting the wire into the antenna side of the antenna foil and it is advantageous to use bare metal, preferably surface-coated wire.The wire-laying process enables the antenna to be produced in an environmentally friendly, cost-effective and precise manner, which is very good when using surface-coated wire The wire loops in the connection area can also be easily produced with this method. The contacting of the internal contacts of the electronic Combi Card module with the free-milled and preferably through intensive electromagnetic Radiation-cleaned connection areas of the antenna are expediently carried out by means of electrically conductive, thermoplastic adhesive with a processing temperature and time during bonding which is the same or similar to the temperature of the heat seal adhesive used for the electrically insulating gluing of the further surfaces of the electronic combi card module into the cavity of the plastic card.
Soll der auf die Antennenschichtseite gelegte Draht beim Laminieren nicht teilweise in die Antennenfolie abtauchen, so ist es vorteilhaft, den Antennendraht zu fixieren. Dies kann durch Bedrucken der durch die Drahtwindungen gebildeten Sonderflächen nach dem Drahtverlegen oder mit einer bei Laminiertemperatur festen Kleberschicht erfolgen. Damit kann der Antennendraht im Bereich des Zentrums der Kavitat auf einem außermittigen Schichtniveau gehalten werden.If the wire placed on the antenna layer side is not to be partially immersed in the antenna film during lamination, it is advantageous to fix the antenna wire. This can be done by printing on the special surfaces formed by the wire windings after the wire laying or with an adhesive layer that is fixed at the lamination temperature. The antenna wire can thus be kept at an eccentric layer level in the region of the center of the cavity.
Die Erfindung wird im folgenden anhand eines Ausführungsbeispiels näher erläutert. In den zugehörigen Zeichnungen zeigen:The invention is explained in more detail below using an exemplary embodiment. In the accompanying drawings:
Figur 1 die Anordnung der Antennenlage auf der Antennenfolienschicht mit schleifenförmiger Drahtrückfuhrung und stegweiser Absenkung,1 shows the arrangement of the antenna layer on the antenna film layer with loop-shaped wire return and web-like lowering,
Figur 2 die stegweise Antennendrahtabsenkung im Querschnitt undFigure 2 shows the web-wise antenna wire lowering in cross section and
Figur 3 einen Plastikchipkartenausschnitt mit Combi Card Modul. In Figur 1 ist als Antennendraht 3 ein versilberter Kupferdraht mit eine Durchmesser von 100 m in fünf Windungen entlang der Peripherie der Plastikkarte 1 auf der Antennenseite 7 der Antennenfolienschicht 6 verlegt Der Antennendraht befindet sich in schichtmittiger bzw nahezu schichtmit- ttger Lage in der Plastikkarte 1 Beim Verlegen wird der Antennendraht 3 thermisch oder durch Ultraschallenergie etwa 80 m tief in die thermoplastische Antennenfolie 6 eingedrücktFigure 3 shows a plastic chip card cutout with Combi Card module. In FIG. 1, a silver-plated copper wire with a diameter of 100 m is laid in five turns along the periphery of the plastic card 1 on the antenna side 7 of the antenna film layer 6 as the antenna wire 3. The antenna wire is located in the layer or almost layer-middle position in the plastic card 1 Bei Laying the antenna wire 3 is pressed thermally or by ultrasonic energy about 80 m deep into the thermoplastic antenna film 6
Im Bereich der künftigen inneren Kontakte 18 des Combi Card Moduls 2 wurde der Antennendraht 3 in engen maanderfbrmigen Schleifen 13 hin- und hergeführt um einen breiten Anschlußbereich 4 zu schaffen Die Drahtzuführung 14 zum schleifenformigen Antennenanschlußbereich 4 erfolgte dabei von der Peripherie der vorgesehenen Lage des Combi Card Moduls 2 Der schleifenformige Antennenanschlußbereich 4 ist in kurzen Stegen 15 teilweise abgesenkt und liegt in Teilbereichen bundig zur Unterseite 8 der Antennenfolie 6In the area of the future internal contacts 18 of the Combi Card module 2, the antenna wire 3 was moved back and forth in tight meandering loops 13 to create a wide connection area 4. The wire feed 14 to the loop-shaped antenna connection area 4 was carried out from the periphery of the intended position of the Combi Card Module 2 The loop-shaped antenna connection area 4 is partially lowered in short webs 15 and in parts is located flush with the underside 8 of the antenna film 6
In dem in Figur 2 dargestellten Querschnitt ist die stegweise Drahtabsenkung 15 des Antennendrahtes 3 mittels Druckwerkzeug 21 dargestelltIn the cross section shown in FIG. 2, the web-like wire lowering 15 of the antenna wire 3 is shown by means of a pressure tool 21
Wie aus Figur 1 weiter ersichtlich ist, verlaufen die mittleren Antennenwindungen 20 im Bereich des künftigen Zentrums des Combi Card Moduls 2 Um zu gewahrleisten, daß diese Antennenwindungen 3 beim Ausfrasen der Zentrumsstufenhohe 11 nicht zerstört werden, sind die mittleren Antennenwindungen 20 auf die Sonderflache 16 aufgelegt worden und ihre Höhenlage wurde in der künftigen laminierten Plastikkarte 1 als Sonderflache 16 mit einer beim Laminieren starren Klebeschicht 17 fixiertAs can also be seen from FIG. 1, the central antenna windings 20 run in the area of the future center of the Combi Card module 2. In order to ensure that these antenna windings 3 are not destroyed when the center step height 11 is milled out, the central antenna windings 20 are placed on the special surface 16 and their height was fixed in the future laminated plastic card 1 as a special surface 16 with an adhesive layer 17 that was rigid during lamination
Figur 3 zeigt die Hohenschichtungen der Antennendrahte 3 im Bereich der stegweisen Absenkungen 15 der Antennenanschlusse 4, im Bereich der Zentrumsstufenhohe 11 und in der Chipkarte 1 Nach dem Ausfrasen der Kavitat 9 mit ihrer Peripheriestufe 10 und ihrer Zentrumsstufe 11 ergeben sich die stegweise nebeneinander liegenden Antennenanschlußbereiche 4 in Form von metallisch blank vorliegenden Drahtstücken. Damit wird eine sichere Kontaktierungsmög- lichkeit, selbst in den Fällen, in denen die Antennendrähte 3 angefräst wurden, geschaffen. Weiterhin zeigt Figur 3 eine vereinfachte Darstellung eines Combi Card Moduls 2 mit einer Beschichtung der inneren Kontaktfläche 18 mit elektrisch leitfähigen, thermoplastischen Kleber 22 und mit Heißsiegelklebefolie 23 vor dem Einsetzen und Einsiegeln in die Kavitat 9 der Plastikkarte 1. FIG. 3 shows the height stratifications of the antenna wires 3 in the area of the web-like depressions 15 of the antenna connections 4, in the area of the center step height 11 and in the chip card 1. After milling out the cavity 9 with its peripheral step 10 and its center step 11, the step-by-step process results adjacent antenna connection areas 4 in the form of metallic bare wire pieces. This creates a reliable possibility of contacting, even in the cases in which the antenna wires 3 have been milled. Furthermore, FIG. 3 shows a simplified illustration of a Combi Card module 2 with a coating of the inner contact surface 18 with electrically conductive, thermoplastic adhesive 22 and with a heat seal adhesive film 23 before it is inserted and sealed into the cavity 9 of the plastic card 1.
BEZUGSZEICHENLISTEREFERENCE SIGN LIST
1 Plastikkarte1 plastic card
2 elektronisches Combi Card Modul2 electronic Combi Card module
3 Antennenspule 4 Anschlußbereich3 antenna coil 4 connection area
5 Deckfolie5 cover film
6 Antennenfolie6 antenna foil
7 Antennenseite der Antennenfolie7 Antenna side of the antenna foil
8 Unterseite der Antennenfolie 9 Kavitat8 underside of the antenna foil 9 cavitation
10 Peripheriestufenhöhe des Combi Card Moduls10 peripheral level of the Combi Card module
11 Zentrumstufenhöhe des Combi Card Moduls11 center step height of the Combi Card module
12 Chipkartenoberfläche12 chip card surface
13 schleifenförmige Antennendrahtrückführung 14 Drahtzuführung13 loop-shaped antenna wire return 14 wire feed
15 stegweise Drahtabsenkung15 web-lowering wire
16 Sonderfläche16 special area
17 starrer Kleber17 rigid adhesive
18 innere Kontakte 19 äußere Kontakte 0 mittlere Antennenwindungen 1 Drückwerkzeug 2 thermoplastischer, elektrisch leitfähiger Kleber 3 Heißsiegelklebefolie 18 inner contacts 19 outer contacts 0 medium antenna windings 1 pressing tool 2 thermoplastic, electrically conductive adhesive 3 heat seal adhesive film

Claims

P A T E N T A N S P R Ü C H E PATENT CLAIMS
1. Laminierte Plastikkarte (1), die mehrere Deckfolien (5) und eine Antennenfolie (6) enthält und bei der eine aus Draht bestehende Antennenspule (3) vor dem Laminieren auf der Antennenfolie (6) angeordnet wurde, wobei sich die Antennen- spule (3) schichtmittig bzw. nahezu schichtmittig in der Plastikkarte (1) befindet und bei der nach dem Laminieren in die Plastikkarte (1) eine Kavitat (9) eingearbeitet wurde, die zur Aufnahme eines Combi Card Moduls (2), welches in unterschiedlichen Höhen angeordnete innere Kontakte (18) und äußere Kontakte (19) aufweist, dadurch gekennzeichnet, daß die Dicken der Antennenfolie (6) und der darüber- und/oder darunterliegenden Deckfolien (5) so ausgeführt sind, daß die Unterseite (8) der Antennenfolie (6) nach dem Laminieren im Abstand der Höhe der inneren Kontakte (18) des Combi Card Moduls (2) von der Plastikkartenoberfläche (12) entfernt ist und daß die Antennenspulenanschlüsse (4) in Teilbereichen mit stegweiser Drahtabsenkung (15) durch die Antennenfolie (6) bündig zur Unterseite (8) gedrückt ist.1. Laminated plastic card (1) which contains a plurality of cover foils (5) and an antenna foil (6) and in which an antenna coil (3) made of wire was arranged on the antenna foil (6) before lamination, the antenna coil (3) in the middle of the layer or almost in the middle of the plastic card (1) and in which after the lamination into the plastic card (1) a cavity (9) has been incorporated to accommodate a Combi Card module (2) which is at different heights arranged inner contacts (18) and outer contacts (19), characterized in that the thicknesses of the antenna film (6) and the overlying and / or underlying cover films (5) are designed such that the underside (8) of the antenna film ( 6) after lamination at a distance from the height of the inner contacts (18) of the Combi Card module (2) from the plastic card surface (12) and that the antenna coil connections (4) in sections with web-like wire sinking (15) durc h The antenna film (6) is pressed flush to the underside (8).
2. Plastikkarte nach Anspruch 1, dadurch gekennzeichnet, daß die Antennenspule (3) mit Antennenanschlüssen (4) versehen ist, die mindestens eine schleifen- förmige Drahtrückführung (13) aufweisen.2. Plastic card according to claim 1, characterized in that the antenna coil (3) is provided with antenna connections (4) which have at least one loop-shaped wire return (13).
3. Plastikkarte nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß eine Drahtzuführung (14) zum Antennenanschluß (4) von der Peripherie der Kavitat (9) aus verlegt ist. 3. Plastic card according to claim 1 or 2, characterized in that a wire feed (14) for antenna connection (4) is laid from the periphery of the cavity (9).
PCT/DE1998/000572 1997-02-27 1998-02-27 Plastic card for an electronic combination card module WO1998038598A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29703548U DE29703548U1 (en) 1997-02-27 1997-02-27 Plastic card for an electronic combi card module
DE29703548.7 1997-02-27

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WO1998038598A2 true WO1998038598A2 (en) 1998-09-03
WO1998038598A3 WO1998038598A3 (en) 1998-11-05

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WO (1) WO1998038598A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002084585A1 (en) * 2001-04-10 2002-10-24 Orga Kartensysteme Gmbh Carrier foil for electronic components, for laminating inside chip cards

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
DE19831565C1 (en) * 1998-07-14 1999-10-28 Muehlbauer Ag Connection surface area exposure for antenna embedded in chip card
DE10109030C2 (en) * 2001-02-24 2003-11-13 Cubit Electronics Gmbh Contactless transponder

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Publication number Priority date Publication date Assignee Title
EP0671705A2 (en) * 1994-02-14 1995-09-13 Gemplus Card International Manufacturing process for a contactless card and contactless card
DE19500925A1 (en) * 1995-01-16 1996-07-18 Orga Kartensysteme Gmbh Integrated circuit (I.C) card or "chip" card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (en) * 1994-02-14 1995-09-13 Gemplus Card International Manufacturing process for a contactless card and contactless card
DE19500925A1 (en) * 1995-01-16 1996-07-18 Orga Kartensysteme Gmbh Integrated circuit (I.C) card or "chip" card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002084585A1 (en) * 2001-04-10 2002-10-24 Orga Kartensysteme Gmbh Carrier foil for electronic components, for laminating inside chip cards

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DE29703548U1 (en) 1997-04-10

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