DE2805535A1 - METHOD FOR ESTABLISHING A CONDUCTIVE CONNECTION THROUGH AN ELECTRONIC CIRCUIT BOARD - Google Patents

Description

clocking the individual foils (63 to 66, 71 to 74) within the holes (75, 76) takes place.

8, the method according to any one of claims 1 to 7, characterized in that the foils in their holes lying contact areas are electrically welded.

8U9833 / 0940

-A-

description

The invention relates to a method for producing conductive connections through in electronic circuit boards provided openings.

There are already numerous methods of making conductive connections through the openings of electronic Circuit boards or boards known. Probably the best known method of through-hole plating or plating through the holes requires numerous process steps, with those in the individual process steps different chemical baths used must be carefully adjusted.

To produce a conductive contact from one side of the board to the other, it is also known to use soldering eyes or use pens.

In contrast, the object of the invention is to provide an improved and faster, non-chemical method for through-hole plating of creating printed circuit boards.

809833 / 094G

A method according to claim is used to solve this problem 1. Then holes are made in the circuit board and a conductive one on each side of the circuit board Metal foil laid. By opposing forces, the foils are brought into contact with one another through the holes brought. The forces applied are so great that the foils are cold-welded. In another Execution, the foils are made to vibrate to form an ultrasonic bond. According to another embodiment According to the invention, the films are thermally welded or glued using heat.

Further advantageous refinements of the invention emerge from the subclaims.

The invention is explained in more detail below with reference to the figures; show it:

Figure 1 is a side view of symmetrical contacting dies, from an insulating circuit board and from conductive foils;

FIG. 2 shows a side view of the printed circuit board according to FIG. 1 with through-plated conductive foils;

809833 / 094G

FIG. 3 shows a side view of an individual contacting die, a base plate, an insulating circuit board and conductive foils;

FIG. 4 shows a side view of the printed circuit board according to FIG. 3 with plated-through foils;

FIG. 5 shows a side view of symmetrical contacting dies, of multiple insulating circuit boards and multiple conductive foils; and

FIG. 6 shows a side view of the printed circuit boards according to FIG. 5 with through-plated multiple conductive ones Foils.

FIG. 1 shows holes 11 and 12 provided in an insulating circuit board 10. Conductive foils 13 and 14 lie on both sides of the circuit board 10 and cover the hole 11. The foils 15 and 16 lie on both sides of the circuit board 10 and cover the second hole 12 . a contact ierungsgesenk 20 has a first and second Kontaktierungsstempel 31 and 33, which are facing the first hole 11 and second hole 12. A second contacting die 21 faces the hole 11 with a third contact punch 32 and faces the hole 12 with a fourth contact punch 34.

809833/0940

280553b

According to Figure 2, the conductive foils 13 and 14 are on the opposite outer surfaces of the insulating circuit board 10 and are in the hole 11 with each other Contact. The foils 15 and 16 are in a similar manner each on one side of the circuit board 10 and are in contact with one another within the hole 12.

According to FIGS. 1 and 2, the holes 11 and 12 are previously formed in the circuit board 10. After shaping these holes will be the conductive foils, for example made of copper or aluminum, placed on each side of the circuit board 10 in such a way that that the previously formed holes are covered by the conductive foils. The contacting dies 20 and 21 are preferably made of hardened steel. Your first and third contacting stamps 31 and 32 are arranged so that that they are facing each other. The insulating circuit board 10 is conductive with the lying on it Foils 13, 14, 15 and 16 between the contacting dies and the holes are aligned with respect to the opposing dies. Be on it the dies are pressed together, the first die 31 having the first conductive foil 13 and the third Die 32 touches the third conductive foil 14. The two foils 13 and 14 are inwardly in the hole pressed until they touch each other. When the slides

809833 / 09AO

have touched each other, then they are mechanically connected to each other to establish an electrical connection. This is done either by applying a correspondingly large force to the contacting dies 20 and 21 for formation a cold welding of the foils 13 and 14, by vibrating the contacting dies 20 and 21 for Formation of an ultrasonic bond, or by heating for soft or hard soldering of the foils 13 and 14. On similar Way, the conductive foils 15 and 16 with the help of Contacting stamp 33 and 34 connected to one another. figure 2 shows the conductive connection formed in the process. The foils 13 and 14 are in the hole 11 and the foils 15 and 16 in the Hole 12 galvanically connected to one another. In the illustrated embodiment, the opposite Foils connected to one another in their entire contact area. If necessary, the contacting stamps can also be shaped so that they punch a hole through the mated surface and the foils are only on Touch the circumference of the hole.

In one embodiment of the invention, holes 41 and 42 according to FIG. 3 are formed in a circuit board 40 and are conductive Foils 43 and 44 placed on both sides of the circuit board 40 under cover of the hole 41. Another hole 42 is through also lying on both sides of the circuit board 40

809833/0940

conductive foils 45 and 46 covered. A contacting die 5O has a contacting stamp opposite the hole 4Ί 52 and a cantacting stamp 53 also opposite the hole 42. Under the Circuit board 4O is a base plate 51 with flat, the Contacting die 5O facing surface.

According to FIG. 4, the foils 43 and 44 lie on opposite sides of the printed circuit board 40, but they are connected in the hole 41, specifically in the same way as the foils 45 and 46 are connected to one another in the hole 42.

The exemplary embodiment illustrated with reference to FIGS. 3 and 4 shows a similar connection of the conductive foils to the exemplary embodiment according to FIGS. 1 and 2, but only one contacting die is used in the embodiment according to FIGS. 3 and 4. The galvanic connection of the conductive foils takes place in the embodiment according to FIGS. 3 and 4 due to the contacting stamps 52 and 53 pressed against the base plate 51. As a result, the contact zone is closer to the lower foils 44 and 46 and not halfway up the holes as in the embodiment. game according to Figures 1 and 2.

803833/0340

Figure 5 shows three insulating circuit boards 60, 61 and 62 aligned with respect to their through holes 75 and 76 are. Conductive foils 63 and 67 lie on top of the first printed circuit board 6O, between the first and On the second circuit board 60 and 61, foils 64 and 72 are provided between the second and third circuit boards 61 and 62 are foils 65 and 73 and the underside of the third circuit board 62 is covered by foils 66 and 74. All conductive foils 63, 64, 65 and 66 cover the hole 75, while the conductive foils 71, 72, 73 and 74 over the Hole 76 lie. A contacting die 32 arranged on the contacting die 8O is aligned with the hole 75 and lies opposite a contacting die 84 provided on the lower contacting die 81. In a similar way A contacting die 83 provided on the contacting die 8O is aligned with the hole 76 and an opposite one Contacting stamp 85 of the lower contacting die 81.

The insulating circuit boards 6O, 61 and 62 as well as the conductive ones In the exemplary embodiment according to FIG. 6, foils 63 to 66 and 71 to 74 are in the same way as in FIG 5 arranged.

803833/0040

Figures 5 and 6 show the galvanic connection of several conductive layers by several circuit boards through. The mechanical bonding of the multiple foils is achieved in the same way as before. The multiple layers of film can thus also by using only one die with an underlying base plate according to FIG. 3 and 4 can be connected.

Although mainly cold welding and ultrasonic welding of the conductive foils has been described, other connection methods are of course also conceivable. If the metal foils to be connected are selected in a certain way and welded in certain protective gas atomic spheres a fusion weld is achieved with considerably less effort than with cold forming. On the other hand, however, the metal foils can also be heated to near their melting point and then heated press against each other to form a thermal weld. There are also other known soldering devices Welding process can be used.

It should be noted that instead of the connection of foils, wires or metal strips in the inventive Way are connectable. The same goes for a combination of foils, wires and tapes.

809833/0940

Claims (7)

UEXKULL & STOLBERG PATENTA BESELERSn ->, \ 5SE 4 2O00 HAMBURG 52 DR. J.-D. FRHR by UEXKÜLL DR. ULRICH GRAF STOLBERG DIPL.-ING. JÜRGEN SUCHANTKE Robert Bogardus Lomerson (Prio: February 15, 1977 US 768 735 - 14721) Route 9, Box 196 Fort Worth, Texas, V.St.A. Hamburg, February 8, 1978 Method for producing a conductive connection through an electronic circuit board Claims 1. \ Method of making a conductive connection by an electronic circuit board, characterized in that holes (11, 12) in the circuit board (10) be formed that conductive foils (13, 14; 15, 16) placed over the holes (11, 12) of the circuit board (10) and that the conductive foils (13, 14; 15, 16) lying on the printed circuit board (10) through the holes (11, 12) are pressed into contact with each other. 2. The method according to claim 1, characterized in that in the holes (11, 12) touching conductive Foils (13, 14; 15, 16) are galvanically connected by vibration energy. 8U9833 / 094Q, ... ,,, «sPEC 3. The method according to claim 1 or 2, characterized in that the in the holes (11, 12) touching each other conductive foils (13, 14; 15, 16) are connected to one another with the application of pressure and heat, wherein the heating of the foils (13, 14; 15, 16) to below their melting point takes place. 4. The method according to claim 1, characterized in that the foils (13, 14; 15, 16) are connected to one another by fusion welding. 5. The method according to any one of claims 1 to 4, characterized in that that the foils (13, 14; 15, 16) with the help of contacting stamps (31, 33; 32, 34) of both Sides are pressed into the holes (11, 12). 6. The method according to any one of claims 1 to 5, characterized in that that the conductive foils (43, 45) from one side through the holes (41, 42) of the circuit board (4O) must be pressed. 7. The method according to any one of claims 1 to 6, characterized in that that several conductive foils (63 to 66; 71 to 74) and several circuit boards (60 to 62) alternately with alignment of their holes (75, 76) are placed on top of each other, and that a mutual contact