WO1997044634A1

WO1997044634A1 - Device for inspecting terminals of semiconductor package

Info

Publication number: WO1997044634A1
Application number: PCT/JP1997/001561
Authority: WO
Inventors: Tomikazu Tanuki; Takashi Kurihara; Takahiro Ueda; Hisashi Hamachi
Original assignee: Komatsu Ltd.
Priority date: 1996-05-20
Filing date: 1997-05-09
Publication date: 1997-11-27
Also published as: JPH09304030A; TW325517B

Abstract

An inspecting device comprising an image pickup means which picks up the image of the package surface of a semiconductor package from above obliquely at a predetermined angle of elevation and an inspecting means which inspects the terminals of the semiconductor package based on the pickup data obtained by the image pickup means. The inspecting speed is increased and accurate measurement is achieved irrespective of the surface condition of an object to be inspected.

Description

Specification

Semiconductor package terminal inspection equipment

Technical field

The present invention relates to a semiconductor package terminal inspection device for inspecting various inspection items such as terminal displacement, pitch, flatness, and uneven tip of various semiconductor packages such as PGA, BGA, QFP, and QFJ.

Background art

A BGA (Ball Grid Array) is a two-dimensional array of ball-shaped solder bumps on the back surface of a semiconductor package. These solder bumps are mounted directly on the printed wiring board by soldering.

Conventionally, when inspecting the misalignment, pitch, flatness, etc. of terminals of a semiconductor package such as BGA in which terminals are formed on the back surface of the package, the conventional method is based on the principle of triangulation. A laser displacement meter that measures the distance to the object to be inspected was used.

That is, in this prior art, a laser displacement meter is arranged on the semiconductor package arranged with the back side up, and the laser displacement meter measures the vicinity of the top of each solder bump of the semiconductor package by one. By scanning one by one, the height of each solder bump is measured.

As described above, in the prior art, the height of each solder bump is measured one by one by the laser displacement meter, so that it takes a lot of time for the inspection, and when the surface of the solder bump has a scratch, etc., an accurate There is a problem that inspection measurement cannot be performed. SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and improves the inspection speed thereof and enables a semiconductor package terminal inspection device capable of performing accurate measurement without being affected by the surface condition of an inspection object. The purpose is to provide.

Disclosure of the invention

According to the present invention, in a terminal inspection device for a semiconductor package for inspecting a terminal of a semiconductor package, an imaging means for imaging a package surface of the semiconductor package from an oblique direction at a predetermined elevation angle; Inspection means for inspecting the terminals of the semiconductor package based on the information. That is, the package surface of the semiconductor package is imaged from obliquely above, so that each terminal row is obtained as a separate image, and information on their height is also obtained. In addition, since information about the terminal is captured as an image of the entire terminal, accurate height measurement can be performed even if the terminal is damaged.

Also, in the present invention, the imaging surface of the imaging unit is inclined at a predetermined angle with respect to the optical axis of the imaging unit, so that the imaging unit is focused on a wide area and a range of the package surface, and the imaging surface can be adjusted once. To expand the inspection range.

Further, in the present invention, an object-side telecentric lens is used as a lens of the image pickup means, and even if a position shift of the semiconductor package itself occurs, a shadow on an image forming position, size, and shape of each terminal. Try to keep the feast small.

Further, in the present invention, a double-sided telecentric lens is used as the lens of the image pickup means, so that the image forming position, size, and shape of each terminal are not changed even if the semiconductor package itself is misaligned. In addition, terminals at each position on the package surface are imaged in the same size and shape.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2: A perspective view showing a first embodiment of the present invention.

Figure 3: Diagram showing the principle of measurement by the camera according to the first embodiment.

Figure 4: Explanatory drawing of the ball height measurement formula according to the first embodiment.

FIG. 5: A diagram showing a first embodiment of the present invention.

FIG. 6: A diagram showing a second embodiment of the present invention.

FIG. 7 is an explanatory diagram of the inclination angle of the imaging surface of the second embodiment.

FIG. 8: A diagram showing a specific example of tilting the imaging surface according to the second embodiment.

FIG. 9: A diagram showing a second embodiment of the present invention.

FIG. 10: A diagram for explaining the operation of the second embodiment.

Figure 11: Diagram showing captured images of BGA.

FIG. 12: A diagram showing a third embodiment of the present invention.

Fig. 13: Diagram for explaining the operation of the third embodiment.

FIG. 14: A diagram showing a fourth embodiment of the present invention. Fig. 15: Diagram for explaining the operation of the fourth embodiment.

FIG. 16 is an explanatory diagram of the inclination angle of the imaging surface of the fourth embodiment.

Figure 17: Diagram for explaining ball inspection of the fourth embodiment.

FIG. 18: A diagram for explaining a method of calculating the height displacement of the ball according to the fourth embodiment.

FIG. 19: A diagram showing a modification of the present invention.

FIG. 20: A diagram showing a modification of the present invention.

FIG. 21: A diagram showing a modification of the present invention.

FIG. 22: A diagram showing a modification of the present invention.

FIG. 23: A diagram showing a modification of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First embodiment]

FIG. 1 shows a first embodiment of the present invention.

In the embodiment of FIG. 1, the inspection target is BGA 1. As is well known, BGA1 is a land grid arrey (LGA) type chip carrier using a printed circuit board, which molds the upper surface of the chip and has a plurality of solder bumps 2 (hereinafter referred to as balls) on the lower surface. ) Are formed in a lattice pattern.

The BGA 1 is turned upside down and placed on the BGA tray 3. In this case, the BGA tray 3 can be moved only in the X direction.

Above the BGA 1, a half mirror 4 is provided, and further above that, a lighting 5 is provided. The camera A is for capturing an image of the back surface of the BGA 1 on which the ball 2 is disposed straight from above. In this case, the back surface image of the BGA 1 is captured via the half mirror 4 as a plan view image. Lighting 5 is for Camera A.

On the other hand, the illumination 6 is also provided on the side of the BGA1, and is turned on when the other camera B performs imaging. The camera B is for obliquely capturing an image of the back surface of the BGA 1 on which the ball 2 is disposed from above, and its elevation angle 0 is set to, for example, about 20 degrees. In this case, the illumination 6 is a planar illumination so that the back surface of the BGA 1 is uniformly illuminated. In addition, the illumination 6 needs to have a certain height from the upper surface of the BGA tray 3 so that the substrate surface of the BGA 1 does not emit light. It is to be noted that it is advantageous to use a flat plate as the illuminations 5 and 6 in terms of uniformly illuminating the substrate surface. However, the flat plate illumination includes an arrangement of a plurality of LEDs and a fiber bundle. Lighting and the like can be used.

The cameras A and B, the lights 5 and 6 and the half mirror 14 are housed in an inspection unit 7 as shown in FIG. 2, and the inspection unit 7 itself can be moved in the y-z direction. It is configured. However, camera B can be moved in the X direction by camera B alone.

That is, in this case, the cameras A and B are assumed to have a field of view that cannot image the entire back surface of the BGA 1 at a time, so that the movement of the BGA tray 1 in the X direction and the y of the inspection unit 7 — Combined with movement in the z-direction, imaging scanning for BGA 1 is performed. Of course, the inspection unit 7 may be movable in the X-y-z directions so that the BGA tray 3 may be fixed, and vice versa. Further, as cameras A and B, cameras having a field of view that can image the entire back surface of BGA1 at one time may be adopted.

However, in this case, BGA 1 is imaged obliquely from above for camera B, so it is not possible to focus on the entire field of view of the camera by one image, so it was imaged in one image One to several rows of images of ball 2 are captured as inspection targets. In other words, in this case, one to several rows of ball images are captured while moving camera B in the X direction. The imaging data of these cameras A and B are taken into the control unit 8 of FIG. The control unit 8 performs image processing on the imaging data of the cameras A and B and performs the calculation described below, thereby displacing the position of the ball 2 on the plane (X-y plane) and the true height of each ball. Inspect the flatness of each ball in the height direction (z direction).

In the configuration shown in FIGS. 1 and 2, when performing the BGA inspection, first, the BGA tray 3 is transported in the X direction, and the BGA 1 to be inspected this time is positioned at a predetermined inspection position and stopped. On the other hand, the inspection unit 7 is appropriately moved in the y-z directions to position the inspection unit 7 at a predetermined imaging position above BGA1.

In this state, light 5 is turned on and camera A takes a planar image of the back of BGA 1 Image. At this time, the other light 6 is turned off. The imaging data of camera A, etc. obtain the X-y position of ball 2 of each BGA 1. In addition, if necessary, information such as the diameter of each pole and the presence or absence of deformation is obtained.

Next, the light 5 is turned off and the other light 6 is turned on, and the height of each ball in the oblique direction is obtained by capturing the back surface of BGA 1 obliquely from above with the camera B. That is, as shown in FIG. 3, the height d of the ball 2 in the direction z perpendicular to the optical axis of the camera B is obtained from the image data of the camera B. As described above, in order to capture the backside image of BGA1 from diagonally above, camera B alternately captures a ball image in units of one to several rows and moves in the X direction. When using a camera with a large depth of focus, all ball images captured in the camera's field of view can be captured at once. When a CCD camera is used as the camera, it is possible to use the CCD shutter function to trigger the camera at appropriate intervals to capture the captured image, and capture the image without stopping the camera. is there.

The control unit 8 obtains the height d of each ball in the oblique direction by performing processing such as pattern matching on the imaging data of the camera B. Then, when this height data d is obtained, as shown in FIG. 4, the height z of each ball is calculated using the height data d, the previously known ideal radius r of the ball, and the elevation angle の of the camera B. The height H in the direction is calculated according to the following equation (1).

H = (d / cos θ) one (r / cos Θ) + r… (!

As described above, according to this embodiment, ball images for a plurality of rows are captured at once by two cameras, and based on the captured data, inspection of various items of the BGA ball is performed. As a result, the inspection speed is improved, and an accurate inspection can be performed without being affected by surface conditions such as scratches on the ball surface. Further, in this embodiment, the ball 2 on the back surface of the BGA 1 is imaged from obliquely above the BGA 1, so that each ball row can be obtained as a separated image and information on their height can also be obtained. it can. In addition, since the height information is measured from the entire ball image, accurate height measurement can be performed even if the ball has a scratch or the like.

[Second embodiment]

By the way, in the first embodiment, in order to obtain an image from obliquely above the BGA 1, As shown in FIG. 5, the camera B uses an ordinary camera in which the lens 11 and the imaging surface 12 are arranged at right angles to the optical axis 10 of the camera B.

Therefore, in this case, the position (plane) 13 where camera B is in focus is limited to only a small portion near the focal position of lens 11, and otherwise the focus is not achieved. In other words, this is because the object plane (the back side of BGA 1) is tilted with respect to the optical axis 10 and the image plane 12 Is perpendicular to the optical axis 12, so the distance to the lens 11 is long.In the left part of BGA, an image is formed on the lens 11 side from the image plane 12, and the distance to the lens 11 is small. In the right part of the short BGA, the image is formed on the side farther than the image plane 12. Therefore, in the first embodiment, it is necessary to move the camera B (or the BGA tray 3) in the X direction to sequentially move the focus position.

As described above, in the first embodiment, since the normal camera B is used, the position where the camera B is in focus is limited to only a part.

In order to improve this, in the second embodiment, the image plane 12 of the camera B is inclined with respect to the optical axis 10 as shown in FIG. That is, the imaging surface 12 is inclined by a predetermined angle φ2 with respect to the optical axis 10 so that the imaging surface 12 has a conjugate relationship with the object surface (in this case, the back surface of the BGA 1).

Here, as shown in Fig. 7, the focal length of lens 11 is f, the distance from lens 11 to object plane 1 is Ll, the distance from lens 11 to imaging plane 12 is L2, and the distance of object plane 1 is L2. When the inclination angle with respect to the optical axis 10 is φ1 and the inclination angle of the imaging surface 12 is φ2, the inclination angle Φ2 is determined so that the following equation (2 3 is satisfied. That is, the value Ll, d) l Can be set arbitrarily, but this is determined in advance, and L2 and 2 are determined by solving the following equation.

(1 / L1) one (1 / L2) = one (1 / f)…

LI tan 1 = L2 ■ tan φ 2-ft)

As described above, in the second embodiment, the imaging plane 12 is inclined so as to have a conjugate relationship with the object plane 1, so that it is possible to focus at all positions on the object plane. This eliminates the need to move camera B (or BGA tray 3) in the X direction during BGA inspection, thereby improving inspection speed and simplifying equipment configuration. Can be realized.

In the second embodiment, for the camera A, a plane image of the back surface of the BGA is taken from above the BGA 1 as in the first embodiment.

As a method for inclining the imaging surface 12 of the camera B, a method of inclining the imaging surface (CCD) 12 itself with respect to the housing 19 of the camera B as shown in FIG. As shown in FIG. 8 (^), an attachment 14 is arranged between the lens 11 of the camera B and the imaging surface 12 to incline the camera housing 19 itself with respect to the optical axis 10. However, there is a method of preventing the imaging surface 12 itself from being inclined with respect to the housing 13 of the camera B.

When the method of Fig. 8 (is used, there is an advantage that the camera B can be made compact, and when the method of Fig. 8 is used, there is an advantage that a commercially available camera can be used and the equipment cost can be reduced. .

By the way, in the second embodiment, the imaging surface 12 of the camera B employs a special one with an inclined angle, but the lens 11 uses a normal lens.

In such a normal lens 11, as shown in FIG. 9, both the incoming light and the outgoing light of the lens 11 have an angle of view. Therefore, as shown in FIG. 10, when a plurality of works 20 of the same size q are imaged using such a normal lens 11, the work on the imaging surface 12 depends on the position of the work 20. Changes the size of (see ql, q2). Further, if the position of the object 1 itself changes as shown in FIG. 10 (in this case, it is assumed that the position is shifted in the direction along the optical axis 10), the object 1 Shape and size will change.

By the way, when the BGA 1 in which the balls 2 as shown in FIG. 11 are two-dimensionally arrayed is imaged by the configuration according to the second embodiment, the image is obtained by the perspective projection as shown in FIG. The size and shape of the imaging ball change depending on the position of the ball 2.

[Third embodiment]

Therefore, in the third embodiment, in order to improve the problem that the size and shape of the captured image change when the imaging object itself shifts in the optical axis direction, as shown in FIG. Instead of the normal lens 11 of the second embodiment, an object side telecentric lens 30 is employed.

As is well known, a telecentric lens is a lens having an angle of view of 0 °, that is, a principal ray is parallel to an optical axis, and an object-side telecentric lens is a lens that realizes a telecentric lens only on the object side.

FIG. 12 shows the third embodiment, in which the imaging surface 12 of the camera B is inclined with respect to the optical axis 10 and the object-side telecentric lens 30 is adopted as the lens of the camera B. I have. As for the camera A, a plane image of the back surface of the BGA is taken from above the BGA 1 as in the previous embodiment. Note that the inclination angle φ 2 of the imaging surface 12 is set using the above-mentioned formula (23), as in the case of the normal lens.

As described above, in this embodiment, since the object side telecentric lens 30 is used for the lens of the camera B, the light (principal ray) from the object to the lens 30 is a light as shown in FIG. Becomes parallel to axis 10.

Therefore, in the case of the third embodiment, the angle of view at each position on the surface of the BGA 1 is constant, and the image is blurred even when the BGA 1 itself is shifted in the optical axis direction as shown in FIG. However, there is no change in the position where each ball forms an image on the imaging surface. That is, even if BGA1 moves in the optical axis direction, the size and relative position of the captured image do not change. If the object is shifted in a direction other than the optical axis, the shift causes a change in the size of the image.

Also, regarding the image blur caused by the movement of the BGA 1 in the optical axis direction, since the object side telecentric lens 30 has a deeper depth of field than the normal lens 11, the blur amount can be reduced. it can. That is, when the object 1 is displaced by the same distance in the optical axis direction, the object-side telecentric lens 30 is less blurred than the normal lens.

Even when the object-side telecentric lens 30 is used, the size and shape of each ball 2 on the BGA 1 imaged are the same as those of the normal lens 11 described above, as shown in FIG. It changes depending on the position.

[Fourth embodiment]

In this fourth embodiment, the normal lens 11 or the object side telecentric lens 3 In order to eliminate the phenomenon shown in Fig. 11 that occurs when 0 is used, that is, the phenomenon that the size and shape of the captured image changes according to the position of the target object to be imaged, Instead of the side telecentric lens 30, a bilateral telecentric lens 40 is adopted. A double-sided telecentric lens is one that implements a telecentric optical system on the object side and the imaging surface side.

FIG. 14 shows this fourth embodiment, in which the imaging surface 12 of the camera B is obliquely inclined with respect to the optical axis 10, and both-side telecentric lenses and a kick lens 40 are employed as lenses of the camera. . For camera Α, as in the previous embodiment, a plane image of the back surface of BGA is taken from above BGA1.

As described above, in the fourth embodiment, since the double-sided telecentric lens 40 is used as the lens of the camera B, the light from the object with respect to the lens 40 becomes parallel to the optical axis 1 °, and the imaging surface from the lens 40 The light emitted to 12 is also parallel to the optical axis 10.

Therefore, in the case of the fourth embodiment, as shown in FIG. 15f, the size and shape of each imaged ball 2 are constant regardless of the position of the ball on BGA 1 (q3 = q3). . Therefore, in the captured image of the BGA 1 according to the fourth embodiment, as shown in FIG. 11 fe), the size of all balls is constant. In the case of FIG. 15, the ball 2 is shown as a square for convenience.

Further, in the case of the fourth embodiment, as shown in FIG. 15 (でも), even when the position of the BGA 1 itself shifts, the size (relative position) and shape of the captured image do not change. In the case of the fourth embodiment, since the double-sided telecentric lens 40 is used, the expression relating to the inclination angle φ2 of the imaging surface 12 is slightly different from the above expressions 2) and 2.

That is, as shown in FIG. 16, a case is considered in which the both-side telecentric lens 40 is composed of a lens 40a having a focal length f1 and a lens 40b having a focal length f2. If object 1 is located at a distance (fl + ul) from lens 40a and imaging surface 12 is located at a distance (f2-u2) from lens 40b, Φ2 is determined by solving 5. Note that ^Λ 2 is a substitute symbol indicating the square. ul (f 2 / f 1) ^A 2 = u2--()

f 1 · ηαηφ 1 = f 2 · ηαη 2

Next, the details of the inspection of the BGA 1 according to the fourth embodiment will be described.

First, a plane image of the back surface of BG A 1 is captured by camera A. This imaging data is shown in FIG. 17 (). From the imaging data, for example, the following three items are inspected.

lMeasurement of the center position of each ball 2

2 Size of each ball (area or diameter)

(3 Make sure that there is no extra ball (foreign matter)

Next, the back surface of BGA1 is imaged from obliquely above by camera B.

In this case, it is assumed that there are three high, normal, and low balls 2 on the BGA1 as shown in FIG. 17 (camera A captures these three balls). However, as shown in Fig. 17 (その), there is no difference between the images.However, when these three balls are imaged by the camera B, as shown in Fig. 17, The position of each ball changes with respect to the direction w of the imaging surface in one axis direction.Therefore, by measuring the displacements Awl and Aw2 on the imaging surface 12, the relative height displacement Δ1ι1, Δh2 can be obtained.

FIG. 18 is a drawing for explaining the calculation for calculating the displacement h from the standard height of each ball based on the ball images picked up by the cameras A and B. It is assumed that not only the direction but also the X direction is shifted. That is, xl is the position in the X direction on the imaging surface 15 of the camera A when the ball 2 is at the ideal X position, and is xl on the imaging surface 15 of the camera A when the ball 2 is at the ideal z position. Assuming that the position in the w direction of wl is wl, the position x2, w2 of the ball image in each direction x, w of each of the cameras A, B is detected, and this is substituted into the following equation 6) to obtain the displacement h Can be requested.

H = {(wl— w2) δί φ 2— (χ 1— χ 2) sin θ} / cos θ

… ^

Then, by correcting the Ah thus obtained in consideration of the magnification of the lens, The true height displacement of the ball can be determined.

The details of the inspection of BGA1 are the same as those in the second and third embodiments. As described above, in the fourth embodiment, since the imaging surface of the camera B is tilted so as to have a conjugate relationship with the object surface, and the telecentric lens is used as the lens of the camera B, the BGA 1 This makes it possible to secure a backside ball image at one time, and to capture balls at different positions on the BGA 1 as images of the same size and the same shape.

In the above embodiment, the present invention is applied to the BGA, but any other semiconductor such as PGA (Pin Grid Array), QFP (Quad flat package), The present invention may be applied to inspection of package terminals. Further, the present invention may be applied to an electrode array inspection of a connector or the like. For example, in the case where the pitch ρ of the electrode 50 of the connector as shown in FIG. 19 is measured, when this is imaged from above with a normal camera, as shown in FIG. A sharp image of only the electrode 50 cannot be captured due to the influence of the image of the portion.

Therefore, as shown in FIG. 1 9 _C), when to image the electrode array obliquely from above a camera is tilted imaging surface 1 2, it is possible Conform the focus of the camera at the top of all the electrodes In addition, it is possible to prevent the image of the electrode mounting portion 51 from being captured.

In addition, the present invention is applied to an IC terminal flatness inspection (detection of vertical displacement of an IC terminal) as shown in FIG. 20 and a bonding wire 52 height inspection as shown in FIG. You can do it.

In addition, as shown in FIG. 22, if the object light for camera B is made to enter through mirror 53, the positions of camera B and camera A can be made closer, which allows the camera part The configuration can be compact.

In the first embodiment, the two lights 5 and 6 are alternately turned on, a force ^s , and one of the lights is a red light and the other is a green light. If the emission spectrum is made different and each camera A and B is provided with a filter that allows only one of the illumination light to pass, the two illuminations 5 and 6 can be always turned on. The troublesome control of alternate lighting can be omitted.

Further, as shown in FIG. 23, a ring-shaped illumination 70 made of LED or the like may be used as illumination for camera A. That is, in the configuration of FIG. 23, when driving camera A, ring-shaped illumination 70 is turned on (flat illumination 71 is turned off), and when driving camera B, flat illumination 71 is turned on. Lights up (ring light 70 is off). Industrial applicability

As described above, according to the present invention, the terminals of the semiconductor package are inspected by imaging the package surface of the semiconductor package from a diagonal direction with a predetermined elevation angle. And information on the height of each terminal can be obtained. In addition, since the information about the terminal is captured as a whole image of the terminal, accurate height measurement can be performed even if the terminal is damaged.

Further, in the present invention, the imaging surface of the imaging means is inclined at a predetermined angle with respect to the optical axis of the imaging means, so that the imaging means can be focused on a wide area of the package surface, thereby enabling one inspection. The range can be expanded, and the inspection speed can be improved.

Further, in the present invention, the object side telecentric lens is used as the lens of the imaging means, so that even if the semiconductor package itself is misaligned, the imaging position, size, and shape of each terminal are not changed. This makes it possible to simplify image processing and arithmetic processing for terminal inspection.

Further, according to the present invention, since a double-sided telecentric lens is employed as a lens of the image pickup means, the image forming position, size, and shape of each terminal are not changed even if the semiconductor package itself is misaligned. In addition, the terminals at each position on the package surface are imaged in the same size and shape. As a result, it becomes possible to further simplify image processing and arithmetic processing for terminal inspection.

Claims

The scope of the claims

1. In a semiconductor package terminal inspection device that inspects semiconductor package terminals,

Imaging means for imaging the package surface of the semiconductor package from a diagonal direction with a predetermined elevation angle;

Inspection means for inspecting the terminals of the semiconductor package based on the imaging data of the imaging means;

A semiconductor package terminal inspection device equipped with:

2. The imaging means has a lens means and an imaging surface on which a package surface image is incident via the lens means,

2. The semiconductor package terminal inspection device according to claim 1, wherein the imaging surface is inclined at a predetermined angle with respect to an optical axis of the imaging means.

3. The semiconductor package terminal inspection device according to claim 2, wherein said lens means is an object-side telecentric lens.

4. The terminal inspection apparatus for a semiconductor package according to claim 2, wherein said lens means is a double-sided telecentric lens.

5. The semiconductor package terminal inspection device according to claim 2, wherein the imaging means has an imaging surface inclined with respect to a main body of the imaging means.

6. The imaging means according to claim 2, wherein the imaging means has an attachment disposed between the lens means and an imaging surface housing for housing the imaging surface, the attachment being configured to incline the imaging surface housing with respect to the optical axis of the lens means. 5. The semiconductor package terminal inspecting apparatus according to claim 4.

7. The image forming apparatus further includes a plane image capturing unit configured to capture a planar image of a package surface of the semiconductor package,

2. The semiconductor package terminal inspecting device according to claim 1, wherein the inspecting unit inspects a terminal of the semiconductor package based on imaging data of the imaging unit and the plane image imaging unit. .

8. First illuminating means for illuminating the package surface of the semiconductor package from above, and second illuminating means for illuminating the package surface of the semiconductor package from an oblique side. The first and second lighting means are illuminated in an exhaustive manner. When the first lighting means is turned on, the plane image capturing means is operated. When the second lighting means is turned on, the above-mentioned light is emitted. Control means for controlling the imaging means to operate;

9. The semiconductor package terminal inspection device according to claim 7, further comprising: