JPH04346011A - Visual inspection apparatus for soldered state - Google Patents

Abstract

PURPOSE:To ensure the inspection of the soldered state of an electronic part especially having the lead terminal (e.g. a J lead) which is bent in the direction of the rear surface of the part after the part is mounted on a board with respect to a visual inspection apparatus for the soldered state. CONSTITUTION:Lighting parts 11-17 are arranged at the upper part of a soldered mounting bound and sequentially irradiate a soldered part 2 with light at the different angles. Image sensing cameras 31-34 are the image sensing parts which capture the reflected light from the soldered part 2 caused by irradiation with the light from the lighting parts. This apparatus is constituted of these parts. The image sensing cameras are arranged at the slant upper part of the mounting board 1. Image processing parts 4 and 5 organize the distribution data of the required extracted images based on the outputs of the image sensing cameras as the shape data. An image operating part 6 operates each identified item. The image operating part 6 obtains the size and the shape of the solder as the individual identifying items. A recognition judging part 7 performs fuzzy inference processing, extracts the characteristics at the same time and judges the soldered state.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering state visual inspection apparatus, and more particularly to a soldering state visual inspection apparatus for inspecting the soldered state of electronic components after they are mounted on a board.

0002

2. Description of the Related Art A conventional device of this type, as described in Japanese Patent Application Laid-open No. 60-154143, includes an annular lamp that irradiates a soldering part to be inspected at different angles. Image information of a plurality of inclined surfaces of the soldering surface is obtained using a light-receiving element and a camera, and the change in value of the reflective surface obtained each time with respect to the soldering surface. and,
Judgment criteria are created using this various image information, and the condition of the solder is determined, such as (1) good soldering, (2) insufficient soldering, (
Judgments are made based on classifications such as 3) insufficient wetting, (4) excessive wetting, (5) none, (6) lead deviation, and (7) missing items.

0003

[Problems to be Solved by the Invention] However, the above-mentioned conventional technology uses various electronic components to determine the solder surface condition because the solder shape is relatively large and simple.
The recognition rate for classifying and determining soldering conditions was not always sufficiently considered and was insufficient.

Furthermore, in recent years, as electronic components mounted on mounting boards have become smaller and more highly integrated, the leads of electronic components have been bent into a J shape, the pitch has become even higher density, and the soldering technology has improved. As technology advances, the solder surface conditions of various electronic components are becoming different.

Naturally, the standard level for determining whether soldering is good or bad changes slightly. In particular, it is extremely important to be able to accurately grasp and manage the shape and condition of soldering in terms of quality. At this time, it is necessary to analyze the shape more accurately, understand the classification accurately, and then optimize the recognition in order to improve the recognition rate, that is, the defective indication rate, and the false positive defect detection rate. will arise.

[0006] Therefore, the present invention has been made based on these circumstances, and its object is to accurately and optimally determine the shape of the soldered state. An object of the present invention is to provide a soldering condition inspection device capable of determining a soldering condition by a method.

[0007]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention particularly relates to a J-lead electronic component, which is arranged above a soldered mounting board, An illumination section that sequentially irradiates light at different angles to the soldering section, an imaging camera that is an imaging section that captures light reflected from the surface of the soldering section by the illumination section from diagonally above, and this imaging camera. An image processing unit organizes the necessary extracted image distribution data from the output from the camera as shape data, and the shape data from this image processing unit is divided into rows or columns, and further, the shape data is used to calculate the soldering length and height. The present invention is characterized in that it comprises an image calculation processing section that performs calculations on area, cross-sectional area, capacity, and shape, and a recognition determination section that determines the soldering state.

[0008]

[Operation] With this configuration, illumination is performed at different angles, the reflected light on the soldering surface is imaged from diagonally above, and image information of each inclination angle of the soldering surface is obtained. The detailed image information of the soldering state is converted into data, and shape inclination angle data of the row direction component of the soldered part, shape height data, capacitance data, and shape inclination angle data of the column direction component parallel to the lead tip are generated. It is further divided into shape and height data columns. Based on these, as identification items, first, as a size comparison, ・Solder height, ・Solder cross-sectional area, ・Solder length, ・Solder area, ・Solder amount, ・Solder inclination angle, etc. are calculated and compared. In addition, as a shape comparison, ・Comparison of numerical array shapes in the row direction component and column direction component of the shape inclination angle and height data, ・Comparison of the presence or absence of a relatively flat part at the center of soldering and its size,・Create data by comparing numerical symmetry and symmetry shift amount in the entire row and column direction components of shape inclination angle and height data, ・Comparing patterns of equal angle lines, etc. . These values correspond to subtle changes in soldering conditions and variations, and can be classified into judgment classification items for each solder condition, such as (1) good soldering, (2)
This method makes an optimal judgment by classifying into insufficient, (3) poor wetting, (4) excessive, (5) lead misalignment, (6) missing solder, and (7) no solder. The content can be enriched, the level of inspection and measurement of soldering conditions can be made more accurate, and the efficiency of inspection and measurement can be greatly improved.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the soldering condition inspection according to the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing one embodiment of the present invention.

In the figure, above the mounting board 1 to which electronic components are soldered, there are a lighting section 11, a lighting section 13, a lighting section 14, and a lighting section 17 in order from the top of the mounting board 1 side.
are arranged in four stages. Each lighting section 11, 13, 15,
Reference numerals 17 each have annular shapes arranged concentrically, and their diameters gradually increase as they are arranged closer to the mounting board 1. Note that these lighting sections 11, 13, 15
, 17 are sequentially switched by means not shown to illuminate the mounting board 1 in this embodiment.

Further, from above the illumination section 11, there is one imaging camera 2 of a photographing section on the central axis of the illumination section, and from diagonally above, imaging cameras 31, 32, 33, 34 (34 is not shown). 4) are arranged in four directions. camera 33
is located behind the camera 2 (on the drawing), and these cameras 31, 32, 33, and 34, including the camera 34 not shown, are arranged around the camera 2 so as to surround it. Any one of the imaging cameras 31, 32, 33, and 34 can capture an image by reflected light from the mounting board 1 illuminated by sequential switching of the illumination units 11, 13, 15, and 17. There is.

[0013] Then, the imaging cameras 31, 32, 33, 3
4 is input to an image processing section 4, and this image processing section 4 extracts an area on the surface of the mounting board where the reflectance of the irradiation light is relatively high. It has become.

Furthermore, the output from the image processing section 4 is input to an image processing section 5. The image processing section 5 compares the magnitude of illuminance for each imaging pixel of the imaging data corresponding to the illumination from the illumination sections 11, 13, 15, and 17, selects and classifies the imaging data as a screen of the imaging image. death,
The number code of the image indicating the angle of the selected reflective surface is organized as shape inclination angle data.

Further, the output from the image processing section 5 is input to an image calculation processing section 6, and this image calculation processing section 6 calculates the shape, height, and cross-sectional area of the soldered state. , the length, area, capacitance, inclination angle, flat part at the center of the solder, etc. are calculated.

Furthermore, the output from the image processing section 6 is input to a recognition determining section 7, which recognizes the soldered portion formed on the surface of the mounting board 1. It is now possible to accurately determine whether or not it is formed in a desired state.

FIG. 2 is a cross-sectional view showing details of the soldered portion 21 of the mounting board 1, which is the object of shape state determination. In the figure, a copper foil pattern 22 is formed on the main surface of the mounting board 1.
Lead part 23 (lead part of electronic component) to be connected to
is fixed via a soldered portion 21.

In the mounting board 1 having such a configuration, after the light from the illumination section 11 is reflected on the soldering section 21 surface, the light from the illumination section 13 is reflected on the soldering section 21 surface in the direction of ■ in the figure. After being reflected by the soldering part 21 surface, the light from the illumination part 15 is reflected in the direction of ■ in the figure, after being reflected by the soldering part 21 surface, the light from the illumination part 17 is reflected by the soldering part 21 surface, in the direction of ■ in the figure. Proceeding in the direction of middle ■, the imaging camera 31,
32, 33, or 34.

In FIG. 2, the irradiation range on the soldering portion 21 is from 0° to 90° in the first quadrant and from 0° to 90° in the second quadrant on the opposite side. In reality, by avoiding the influence of components on the mounting board, the effective range is approximately 5° to 7°.
It is 5°.

Furthermore, the image processing section 5 codes each image data corresponding to each illumination by image processing, and the image processing section 5 organizes the code data. From this, the data number of the shape inclination angle code■,■
, ■, ■, ■, ■, ■, ■, ■ are shown from the soldering top surface, and are detailed data state diagrams for each distribution of imaging data with relatively high illuminance. Here, it is arranged as shape slope angle code data. Memory. record. display. It is being output.

[0021] Here, the data numbers of the code ■, ■,
About how to create ■,■,■,■,■,■,■,
This will be explained below.

First, in order to accurately determine the angle, data on a known hard sphere similar to the reflectance of the soldered portion 21 is obtained, resulting in an analog data distribution state of illuminance. Illuminance 256
When taken as gradations, it has been experimentally confirmed that if the brightness stable region is set to 100 or more gradations and the angles of each illumination are spaced apart, each illumination will be approximately 9 degrees for one irradiation. When simply classified, the direction can be determined at approximately 9 degrees around the angular direction of the four stages of illumination. This is numbered as the data of the reflection code on the surface of the soldering part 21 that illuminates each stage, and is numbered as ``■'' by the illuminating part 11, ``■'' by the illuminating part 13, ``■'' by the illuminating part 15, and ``■'' by the illuminating part 17. Ru.

Furthermore, since the curvature of the surface of the soldering part 21 is continuous, the distance between the illuminating part 11 and the illuminating part 13 of each stage is
, ■ between the lighting section 13 and the lighting section 15, ■ between the lighting section 15 and the lighting section 17, ■ above the lighting section excluding the lighting section 17, and ■ below the lighting section excluding the lighting section 11. become able to.

A specific method of such interpolation is as follows:
For example, if the level is set to an illuminance of 100 gradations or less, the overlapping area of the illuminance of ■ and the area of do.

[0025] Therefore, the observable range of the solder surface can be classified into nine angle levels depending on the board components on the solder surface.

[0026] By doing this, the angle division by illumination becomes approximately 9 degrees x 9 = 81 degrees.

FIG. 3 is a plan view of the mounting board 1 on which the soldering portions 21 are formed, and each illumination portion 11, 13 with four steps is shown.
, 15, 17, the imaging cameras 31, 32, which capture the reflected light from the soldering part 21,
The captured images from either of 33 and 34 are processed by the image processing unit 4.
, the areas of relatively high reflectance from the surface of the soldering part 21 are
FIG. 7 is an explanatory diagram showing a state in which the appropriate values are calculated in accordance with No. 7. The rectangular frame indicates the area to be inspected after being photographed by any of the imaging cameras 31, 32, 33, and 34, and the area marked with ■ in FIG. The area marked with a relatively high illuminance of the light is the part marked with a relatively high illumination of the reflected light from the illumination section 13, and the area marked with ■ is the section of the reflected light from the illumination section 15. The area with relatively high illuminance, the area marked with ■, is the lighting section 1.
It shows a portion of the reflected light from 7 that has relatively high illuminance. Further, the areas marked with ■, ■, ■, ■, ■ are calculated and set by the above-mentioned interpolation method.

The position of the end of the lead 23 in FIG. 3 is set in advance by taking an image with the imaging camera 2 located above.

The result shown in FIG. 3 is the row data n of the pixel correspondence of the detailed data state diagram of the shape information data (after thinning out as necessary if there is a large degree of redundancy).
x column data m=nm are organized and stored in the image processing section 5.

In addition, in such a distribution, a change in the inclination angle of the surface of the soldering portion 21 can be recognized depending on the distribution state. In other words, if the angle of the incident illumination unit with respect to the vertical line is α, and the angle of the oblique camera with respect to the vertical line is β, then the inclination angle θ of the part (area) where the intensity of the reflected light is strong = α + (β - α) / This is because there is a relationship of 2.

[0031] Therefore, the illumination parts 11, 13, 15,
This means that the inclination angle of the area in which the reflected light from one of the illumination parts 17 is relatively strong can be determined.

Here, α of the illumination unit 11 is 8°, α of the illumination unit 13 is 28°, α of the illumination unit 15 is 50°, α of the illumination unit 17 is 75°, and the angle of the diagonal camera with respect to the vertical line is β. = 30°, each inclination angle is ■
θ=19°, θ=29°, θ=40°, and 53°.

In this embodiment, data is converted into data using the code as described above, and the height of each part on the soldering surface is also calculated.

FIG. 4 is an explanatory diagram showing a side view of the soldering part, and a method for determining the height of each part of the soldering surface will be explained based on this diagram.

As can be seen from the shape inclination angle data of the solder shape code, the image calculation processing section 6 in FIG. The length x tan (shape inclination angle) is obtained.

[0036] Here, the coefficient is a correction coefficient between the actually measured height value and the numerical value obtained by this method.

From the above relational expression, the height of each pixel, h
1, h2, h3, . . . hn are obtained.

Furthermore, as cumulative shape height data, H1=h1
,H2=H1+h2,H3=H2+h3,...,HN
=Hm+hn.

Furthermore, the resulting numerical value compared with the actual measured value is adjusted by a correction coefficient and then used as the height value of the data to be used.

At this time, the obtained numerical values can be used as parameters for feature extraction, divided into relative numerical values and obtained as data, and the arrangement of the data can be utilized.

In this way, by obtaining the height corresponding to each pixel, it is also possible to calculate the cross-sectional area of the solder on a certain side.

That is, the length and width of each pixel are determined based on the imaging range and resolution of the imaging camera. Here, it is set to 33 μm. From this, the cross-sectional area for the pixel can be determined by calculating the product of the height and the length or width of each pixel as described above. For example, when it is desired to find the cross-sectional area of solder on a certain side, the cross-sectional areas for the pixels may be summed over the area.

In other words, solder amount≒coefficient×solder shape height×pixel length (or width) For each row, S1≒H1×L, S2≒H2×L, S3≒H
3×L, ..., SN≒HN×LS The solder cross-sectional area of the Mth row is SM≒ΣSN≒ΣSN×L.

Furthermore, by obtaining the height corresponding to each pixel, it is also possible to calculate the cross-sectional area of the solder on a certain side.

That is, the volume of the pixel can be determined by calculating the product of the height and the area of each pixel as described above. For example, if you want to find the total amount of solder, you can sum up the volumes for the pixels over the entire area.

That is, for each row, V1≒H1×S, V2≒H2×S, V3≒H
3×S, ..., VN≒HN×S The amount of solder in the Mth row is VM≒ΣVN≒ΣHN×S The total amount of solder is the sum of each row in the column direction, V≒ΣVM
It is.

[0047] Furthermore, for the entire soldering area, it is easy to find the area occupied by the solder shape at a height or angle above a certain level as follows: area = number of pixels x area for pixels.

In addition, as for the entire soldering area, the height or angle above a certain level, the steepness of the soldering state, that is, the overall inclination angle: Inclination angle = Cumulative shape height / Total length of row seek.

Furthermore, as a soldering condition, an area that can be considered relatively flat in terms of height or angle above a certain level, for example, ■, ■ (or (Shape height data area at the level) The area of the occupied portion is calculated as follows: area = number of pixels x area for pixels for feature extraction, which will be described later.

The recognition determination unit 7 compares each identification item obtained by each calculation described above with a reference value to make a determination.

Next, as judgment classification items, various soldering conditions are classified as (1) non-defective. (2) Insufficient (3) Insufficient wetting. (
4) Excess. (5) Read deviation. (6) Out of stock. (7) None. The classification N is set in advance in detail. For each of these classifications, FIG. 5 is an example of an iso-angle diagram of a non-defective product as an example of each shape of the soldered state in the automatic classification of the soldered state. FIG. 6 is an isometric diagram of an example of a shortage. FIG. 7 is an isometric diagram of an example of insufficient wetting. FIG. 8 is an isometric diagram of an example of excess. FIG. 9 is an iso-angle diagram of an example of lead deviation. FIG. 10 shows an iso-angle diagram of an example of a missing item.

[0052] In the shape information data of the soldering state, the height, cross-sectional area, length, amount, actual area, steepness (angle of inclination), symmetry, and central flatness (discontinuity) of the special shape of the solder are included. Contains shape data such as. These are stacked up based on the shape of the solder surface.

By combining the identification items in the shape state for each classification, features can be extracted and classification can be performed.

First, in the recognition determination section 7, in order to determine the characteristics of the soldering state, the absolute values of the respective identification items of height, cross-sectional area, length, area, amount, inclination angle, and central flat area are determined. Or create and classify relative values.

[0055] From this, when comparing the shapes of soldered states, - In the case of non-defective products: Standard values for solder height, cross-sectional area, length, area, amount, and inclination angle, no central flat area area. If is extracted → In this case, it is a good product. - In case of shortage: the solder height is very low, the cross-sectional area is very small, the length is very short, the area is very small,
If the following features are extracted: the amount is very small, the slope angle is slightly small, and there is no central flat area → Insufficient in this case. - Insufficient wetting: the solder height is very low, the cross-sectional area is small, the length is normal, the area is normal, the amount is small, the slope angle is very small, the central flat area is slightly large, If the characteristics of solder are extracted → In this case, insufficient wetting, and excessive wetting: the solder height is very high, the cross-sectional area is large, the length is very long, the area is very large, and the amount is very large. If the characteristics of large amount of solder and no central flat area are extracted, → In this case, there is excess solder.・In the case of lead deviation: Solder height is normal, cross-sectional area is normal, length is normal, area is very small, quantity is small, slope angle is normal, the tip shape is asymmetrical and uneven, and the center is flat. If the feature with no part area is extracted → In this case, lead deviation.・In the case of missing parts: The solder height is normal, the cross-sectional area is large, the length is very long, the area is very large, the amount is very large, the matrix ratio is very large, and the slope angle is very large. a small value,
Furthermore, if the following characteristics are extracted: the tip shape has no convexity, the central flat area is slightly large, and the matrix ratio is large. → In this case, the item is missing.・In the case of no solder: All values are null.

By combining these identification items, it is possible to determine and classify the soldering condition.

Note that the criteria for determining the soldering state vary from manufacturer to manufacturer and from process to process, and are set based on quality standards.

Furthermore, depending on the process, some identification items may not be clearly classified according to the judgment classification, and it is natural to select items that have an effect of identification.

[0059] In addition, it is natural that these identification items should be clearly prioritized for identification and have a high degree of importance, so that features can be extracted and classified according to the judgment flowchart. That's a thing.

[0060] Also, for the soldering area, for the standard isometric diagram pattern for each judgment classification item (
For example, by clustering and comparing the pixel difference with the soldering state pattern to be inspected (Figs. 5 to 10),
It is also possible to select judgment classification items with relatively few differences and perform identification judgment and inspection.

As described above, this system responds to subtle changes in soldering conditions and makes optimal and accurate judgments, and the content of judgments can be easily enriched, making it easy to inspect soldering conditions. Accurate measurement level and inspect. Measurement efficiency can be greatly improved.

Furthermore, in the present invention, in the recognition determination, an embodiment has been described for the entire area of the soldered state, but the recognition determination is performed based on the shape information data of several lines in the center direction of the soldering lead. It is also possible to implement

Furthermore, although the present invention has been described mainly using the difference in illumination angles in four stages, the direction of inclination angle can be identified by illuminating the front and rear of the solder by dividing the annular illumination around the solder into two halves in the angular direction. Furthermore, by dividing the solder into four equal parts, it is possible to improve the accuracy of identifying the inclination angle by illuminating the solder in the left and right directions, and it is also possible to identify the effect on adjacent components.

Furthermore, the present invention is not limited to four-stage illumination, and it goes without saying that the same effect can be obtained even with three or four or more stages.

It goes without saying that, as a single stage illumination, this lighting device may be moved in multiple stages to provide the same effect as when the lighting devices are provided in multiple stages. In short, it is sufficient that the object to be irradiated can be irradiated by changing the incident angle in multiple stages.

Furthermore, in this embodiment, the light emitted from the irradiation device is a single light beam. but,
The light may be irradiated with a different color for each stage.

[0067] The present invention replaces the means of sequentially switching illumination using multi-stage multi-illumination, by imaging a soldering surface to be inspected illuminated using light sources of different hues from a plurality of angles,
It is also possible to obtain image information of each angle of this soldering surface. As a specific example, in the case of multiple stages, each stage,
In the case of multi-directional illumination, extraction of image distribution data can be made faster by emitting unique light corresponding to each angle of illumination, that is, each irradiation angle of light. . For example, if the illumination means has multiple hues such as red, green, and yellow, each irradiation angle can be specified by the difference or change in the hue of the reflected light, so there is no need to switch or move the light source over time.

[0068] In the present invention, the appearance inspection method is particularly described based on discrimination and judgment regarding the soldering condition of electronic components of J-type leads. It is also very easy to take an image of the soldering condition using one of the imaging cameras 31, 32, 33, and 34 located diagonally above and perform an appearance inspection by identifying and determining the soldering condition using the method described above.

Furthermore, the soldering state of the electronic components of the leads of the flat package that was transported was also imaged by the upper imaging camera 2, and the soldering state was captured using almost the same method as described above. It is made easy to perform a visual inspection based on identification and determination.

Therefore, depending on the shape of the leads and the shape of the soldered state, the imaging cameras 2, 31, 32,
If an image is captured by either 33 or 34, and a comprehensive discrimination judgment is made using a combination of these images, that is, the shape data seen from above and the shape data seen diagonally from above, more detailed and accurate judgment can be made. It becomes possible to make identification judgments suitable for each soldering state.

[0071]

As explained above, according to the present invention, in particular, with respect to J-lead electronic components, the illumination unit sequentially illuminates the electronic components at different angles with respect to the soldering portion after mounting on the board. irradiation, each image is taken with an imaging camera diagonally above, the image processing unit creates the necessary image distribution data as shape information data, and the image processing unit generates the relative soldering state relative to the standard as an identification item. The height, cross-sectional area, length, area, amount, inclination angle ratio, and central flat area of the target solder are calculated, and the recognition judgment unit
This is an appearance inspection device that performs identification and inspection based on the classification items and shape data. In addition, the soldering area is clustered based on the standard contour map and isometric map patterns for each judgment classification item, and by comparing the size of the difference with the soldering state to be inspected. This is an appearance inspection device that can also perform identification and inspection according to the judgment classification items.

[Brief explanation of drawings]

FIG. 1 is a simplified configuration diagram of the main parts of an embodiment of a soldering condition inspection device according to the present invention.

FIG. 2 is a sectional view showing the relationship between the side surface of the soldering part and light irradiation from the irradiation part of the soldering state inspection apparatus according to the present invention.

FIG. 3 is a plan view illustrating the relationship of organization data based on the inclination of each part of the soldering part.

FIG. 4 is an explanatory side view of setting shape height data from shape inclination angle data of solder shape information data.

FIG. 5 is an isometric diagram of a non-defective product.

FIG. 6 is an isometric diagram of an example of shortage.

FIG. 7 is an isometric diagram of an example of insufficient wetting.

FIG. 8 is an isometric diagram of an example of excess;

FIG. 9 is an isodegree diagram of an example of read deviation.

FIG. 10 is an isometric diagram of an example of missing items.

[Explanation of symbols]

2, 31, 32, 33, 34 Imaging camera 4, 5
Image processing unit 6 Image calculation processing unit 7 Recognition determination unit 11 to 17 Illumination device 21 Soldering unit

Claims (15)

[Claims] [Claim 1] Disposed above a soldered mounting board, irradiating the soldered portion with light sequentially at different angles, and reflecting light from the surface of the soldered portion due to the light irradiation of the illumination. Image the light from diagonally above,
From this image, necessary extracted image distribution data is organized as shape data, each identification item is arithmetic processed, the size and shape of the solder are determined, features are extracted from these together, and the state of the soldered part is recognized and determined. An appearance inspection device for a soldered state, which is characterized by: 2. A lighting unit disposed above a soldered mounting board and sequentially irradiating light at different angles to the soldered part; and a lighting unit that sequentially irradiates the soldered part with light at different angles; An imaging unit that captures light reflected from the surface diagonally from above, an image processing unit that organizes the necessary extracted image distribution data as shape data from the output from this imaging unit, and an image processing unit that processes the size and shape of the solder. and a recognition/judgment unit that extracts features from these features and determines the state of the soldered part. 3. In the invention according to claim 1 or claim 2, the number of imaging units that capture the reflected light from the surface of the soldering part from diagonally above is four imaging units in four directions, and further captures the reflected light from above. A soldering condition inspection device comprising one imaging section. 4. In the invention according to claim 1 or 2, the illumination unit that sequentially irradiates light at different angles with respect to the soldering part is a plurality of illumination units sequentially provided in multiple stages above the mounting board. A soldering condition inspection device comprising: 5. Each identification item according to claim 1 or claim 2 includes height, cross-sectional area, length, area, amount, inclination angle,
1. An appearance inspection device for a soldered state, characterized in that the shape of the solder is selected preferentially from items having a discriminating effect, and the discriminative judgment is made. 6. In the invention according to claim 1 or claim 2, the soldering area is clustered based on the pattern of each iso-angle diagram that is a standard for each judgment classification item, and the Appearance inspection equipment that performs identification and inspection according to judgment classification items by comparing the size of the difference with the soldering state. 7. In the invention according to claim 1 or claim 2, the illumination unit that sequentially irradiates light at different angles to the soldering part has a structure that irradiates light in a combination of multiple colors and sequentially. A soldering condition inspection device characterized by illuminating in multiple stages and in multiple directions. 8. In the invention according to claim 1 or claim 2, the illumination unit that sequentially irradiates light at different angles to the soldering part is arranged such that the illumination part provided in one step above the mounting board is connected to the soldering part. A soldering condition inspection device characterized by moving intermittently in a direction perpendicular to a board and illuminating it in multiple stages at that time. 9. An apparatus for inspecting the appearance of a soldered state, wherein the shape of each identification item according to claim 1 or 2 is defined as shape angle data. 10. An apparatus for visually inspecting a soldered state, wherein the shape of each identification item according to claim 1 or 2 is shape height data. 11. The invention according to claim 1 or 2, wherein a lead is fixed to the soldered portion, and the value of the soldered state is at least equal to several lines of the central direction component portion of the shape data. Appearance inspection equipment. 12. In the invention according to claim 1 or 2, the lead is fixed to the soldering part, and the shape data is
After dividing the central direction row component of the data row into values for several rows, shape data for the row components on both sides, and several rows parallel to the lead tip, the soldering condition is determined for each combination. Appearance inspection equipment for soldering conditions. 13. The soldering condition inspection device according to claim 3 or 4, wherein the plurality of illumination units includes four illumination units. 14. An illumination section disposed above the soldered mounting board and sequentially irradiating the soldered portion with light at different angles; It has an imaging section that captures the reflected light from the surface from above and an imaging section that captures it diagonally from above, and an image processing section that organizes the necessary extracted image distribution data as shape data from the output from these imaging sections, and an image calculation processing unit that calculates size and shape;
A soldering condition visual inspection device comprising a recognition determination unit that extracts features of these identification items and comprehensively determines the soldering condition. 15. An illumination section disposed above the soldered mounting board and sequentially irradiating the soldered portion with light at different angles; It has both an imaging section that captures the reflected light from the surface from above and an imaging section that captures it from diagonally above, and organizes the necessary extracted image distribution data as shape data from the output from the imaging section that is suitable for the shape of the soldering state. An image processing unit, an image calculation processing unit that calculates the size and shape of the solder, and a recognition judgment unit that extracts features from these identification items and makes a judgment based on data suitable for the shape of the soldering state. An appearance inspection device for a soldered state.