USD989831S1 - Apparatus for evaluating semiconductor substrate - Google Patents

Apparatus for evaluating semiconductor substrate Download PDF

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Publication number
USD989831S1
USD989831S1 US29/789,677 US202129789677F USD989831S US D989831 S1 USD989831 S1 US D989831S1 US 202129789677 F US202129789677 F US 202129789677F US D989831 S USD989831 S US D989831S
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United States
Prior art keywords
semiconductor substrate
evaluating semiconductor
evaluating
view
design
Prior art date
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Active
Application number
US29/789,677
Inventor
Masayuki Arakawa
Junpei Hokari
Akira Kojima
Masaki Mizuochi
Tomokazu Kobayashi
Takaaki Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
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Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIKUCHI, TAKAAKI, KOBAYASHI, TOMOKAZU, KOJIMA, AKIRA, ARAKAWA, MASAYUKI, HOKARI, JUNPEI, MIZUOCHI, MASAKI
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FIG. 1 is a front, top, and right side perspective view of an apparatus for evaluating semiconductor substrate according to the design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2 ; and,
FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 2 .
The broken lines illustrate portions of the apparatus for evaluating semiconductor substrate that form no part of the claimed design. The hatching shown in FIG. 8 and FIG. 9 represents unclaimed subject matter and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an apparatus for evaluating semiconductor substrate, as shown and described.
US29/789,677 2021-05-14 2021-10-13 Apparatus for evaluating semiconductor substrate Active USD989831S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2021-0023149 2021-05-14
KR20210023149 2021-05-14

Publications (1)

Publication Number Publication Date
USD989831S1 true USD989831S1 (en) 2023-06-20

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US29/789,677 Active USD989831S1 (en) 2021-05-14 2021-10-13 Apparatus for evaluating semiconductor substrate

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1018613S1 (en) * 2022-06-30 2024-03-19 Hangzhou Sizone Electronic Technology Inc. Polishing machine for metal

Citations (24)

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US5281320A (en) * 1979-12-21 1994-01-25 Varian Associates Inc. Wafer coating system
USD350490S (en) * 1992-10-08 1994-09-13 Tokyo Electron Kabushiki Kaisha Semiconductor wafer testing apparatus
USD352911S (en) * 1992-11-27 1994-11-29 Hitachi, Ltd. Processing machine for electron beam lithography system
USD365584S (en) * 1993-12-15 1995-12-26 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing device
USD415184S (en) * 1998-01-30 1999-10-12 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD415776S (en) * 1998-01-30 1999-10-26 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD426785S (en) * 1999-07-09 2000-06-20 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD427088S (en) * 1999-07-09 2000-06-27 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD447967S1 (en) * 2000-11-08 2001-09-18 Sysmex Corporation Measuring apparatus for measuring a particle size distribution
US6454472B1 (en) * 1999-12-06 2002-09-24 Dns Korea Co., Ltd. Semiconductor manufacturing apparatus for photolithographic process
US20020150449A1 (en) * 1996-03-26 2002-10-17 Semitool, Inc. Automated semiconductor processing system
US20030136513A1 (en) * 2001-01-22 2003-07-24 Lee Soon Ho Semiconductor manufacturing apparatus
US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US20060057799A1 (en) * 2002-09-24 2006-03-16 Tokyo Electron Limited Substrate processing apparatus
USD546354S1 (en) * 2005-07-15 2007-07-10 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus
US20100189880A1 (en) * 2007-04-10 2010-07-29 Fas Holdings Group, Llc Method and Apparatus for Extruding a Liquid Onto a Substrate and Inspecting the Same
USD637098S1 (en) * 2009-10-30 2011-05-03 Hitachi High-Technologies Corporation Semiconductor testing machine
USD657068S1 (en) * 2010-06-29 2012-04-03 Sysmex Corporation Specimen analyzer
USD730894S1 (en) * 2012-10-18 2015-06-02 Hitachi, Ltd. Magnetic disc storage unit for electronic computer
USD733135S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD733134S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD858590S1 (en) * 2017-02-28 2019-09-03 Mitsubishi Heavy Industries Machine Tool Co., Ltd. Machine tool
USD905139S1 (en) * 2019-02-13 2020-12-15 Agie Charmilles Sa Electrical discharge machine
US20220254665A1 (en) * 2021-02-05 2022-08-11 Syskey Technology Co., Ltd. Miniaturized semiconductor manufacturing system

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281320A (en) * 1979-12-21 1994-01-25 Varian Associates Inc. Wafer coating system
USD350490S (en) * 1992-10-08 1994-09-13 Tokyo Electron Kabushiki Kaisha Semiconductor wafer testing apparatus
USD352911S (en) * 1992-11-27 1994-11-29 Hitachi, Ltd. Processing machine for electron beam lithography system
USD365584S (en) * 1993-12-15 1995-12-26 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing device
US20020150449A1 (en) * 1996-03-26 2002-10-17 Semitool, Inc. Automated semiconductor processing system
US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
USD415184S (en) * 1998-01-30 1999-10-12 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD415776S (en) * 1998-01-30 1999-10-26 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD426785S (en) * 1999-07-09 2000-06-20 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD427088S (en) * 1999-07-09 2000-06-27 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
US6454472B1 (en) * 1999-12-06 2002-09-24 Dns Korea Co., Ltd. Semiconductor manufacturing apparatus for photolithographic process
USD447967S1 (en) * 2000-11-08 2001-09-18 Sysmex Corporation Measuring apparatus for measuring a particle size distribution
US20030136513A1 (en) * 2001-01-22 2003-07-24 Lee Soon Ho Semiconductor manufacturing apparatus
US20060057799A1 (en) * 2002-09-24 2006-03-16 Tokyo Electron Limited Substrate processing apparatus
USD546354S1 (en) * 2005-07-15 2007-07-10 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus
US20100189880A1 (en) * 2007-04-10 2010-07-29 Fas Holdings Group, Llc Method and Apparatus for Extruding a Liquid Onto a Substrate and Inspecting the Same
USD637098S1 (en) * 2009-10-30 2011-05-03 Hitachi High-Technologies Corporation Semiconductor testing machine
USD657068S1 (en) * 2010-06-29 2012-04-03 Sysmex Corporation Specimen analyzer
USD730894S1 (en) * 2012-10-18 2015-06-02 Hitachi, Ltd. Magnetic disc storage unit for electronic computer
USD733135S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD733134S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD858590S1 (en) * 2017-02-28 2019-09-03 Mitsubishi Heavy Industries Machine Tool Co., Ltd. Machine tool
USD905139S1 (en) * 2019-02-13 2020-12-15 Agie Charmilles Sa Electrical discharge machine
US20220254665A1 (en) * 2021-02-05 2022-08-11 Syskey Technology Co., Ltd. Miniaturized semiconductor manufacturing system

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/789,674, filed Oct. 13, 2021.
U.S. Appl. No. 29/789,675, filed Oct. 13, 2021.
United States Notice of Allowance issued in U.S. Appl. No. 29/789,674 dated Mar. 8, 2023 (nine (9) pages).
United States Notice of Allowance issued in U.S. Appl. No. 29/789,675 dated Mar. 8, 2023 (nine (9) pages).

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1018613S1 (en) * 2022-06-30 2024-03-19 Hangzhou Sizone Electronic Technology Inc. Polishing machine for metal

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