US20190267308A1 - Heat dissipation fin structure and cooling structure for electric substrate using the same - Google Patents
Heat dissipation fin structure and cooling structure for electric substrate using the same Download PDFInfo
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- US20190267308A1 US20190267308A1 US16/274,415 US201916274415A US2019267308A1 US 20190267308 A1 US20190267308 A1 US 20190267308A1 US 201916274415 A US201916274415 A US 201916274415A US 2019267308 A1 US2019267308 A1 US 2019267308A1
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- flow passage
- fins
- fin
- heat dissipation
- fin structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Definitions
- the disclosure relates to a heat dissipation fin structure and a cooling structure for an electronic substrate using the heat dissipation fin structure.
- JP 10-190268 A describes a cooling device for electronic equipment.
- the cooling device cools down heat of a heat source by using a heat sink and a fan.
- plate-shaped fins are provided in a housing that houses a large-sized electronic component such as a DC/DC converter, there is room for improvement on shapes of the fins so that the housing with a large heat-generating area is cooled efficiently by using cooling air from a fan.
- the disclosure provides a heat dissipation fin structure in which plate-shaped fins are possible to lead cooling air from a fan to a wide area, thus dissipating heat efficiently.
- the disclosure also provides a cooling structure for an electronic substrate in which the heat dissipation fin structure is used.
- a first aspect of the disclosure provides a heat dissipation fin structure including: a fin base plate of which a first surface is thermally connected with a heat source; and a plurality of plate-shaped fins provided on a second surface of the fin base plate.
- the fins configure a plurality of flow passages in which cooling air that enters from an inlet passes when the cooling air flows towards an outlet, the fins include a first fin, an end portion of the first fin on an inlet side is arranged in an intermediate part of a first flow passage that is formed between a pair of the fins adjacent to the first fin, the first flow passage is divided by the first fin into a second flow passage and a third flow passage in a width direction of the first flow passage, an interval between the pair of fins is wider on an outlet side than the inlet side, and a sectional area of the first flow passage is substantially equal to a sum of sectional areas of the second flow passage and the third flow passage.
- a projecting portion may be formed on the second surface of the fin base plate at a position inside the first flow passage, and the interval between the pair of fins that forms the first flow passage may increase as a projecting amount of the projecting portion from the fin base plate increases.
- the end portion of the first fin on the inlet side may be arranged so as to be continuous with the projecting portion.
- the end portion of the fin on the inlet side, the fin branching the flow passage is arranged so as to be continuous with the projecting portion inside the flow passage without any gap. Therefore, a change of the sectional area near the projecting portion is restrained, thereby further restraining an increase in pressure loss.
- a portion of the first fin in a predetermined range from the end portion on the inlet side may become thinner towards the inlet.
- a second aspect of the disclosure provides a cooling structure for an electronic substrate, including: the electronic substrate on which a heater element is implemented; the heat dissipation fin structure according to the first aspect, the heat dissipation fin structure being arranged so as to be superimposed on the electronic substrate with the first surface facing the heater element; and a fan that sends air to the inlet of the heat dissipation fin structure.
- an increase in pressure loss at the branching place in the flow passage is restrained. Therefore, it is possible to realize the cooling structure for the electronic substrate, the cooling structure being able to lead cooling air to a wide area, thereby dissipating heat efficiently.
- a third aspect of the disclosure provides a heat dissipation fin structure, including: a fin base plate of which a first surface is thermally connected with a heat source; and a plurality of plate-shaped fins provided on a second surface of the fin base plate.
- the fins configure a plurality of flow passages in which cooling air that enters from an inlet passes when the cooling air flows towards an outlet, an end portion of at least one of the fins on an inlet side is arranged in an intermediate part of a first flow passage that is formed between a pair of the fins, the first flow passage is divided by the at least one of the fins into two or more flow passages in a width direction of the first flow passage, an interval between the pair of fins is wider on an outlet side than the inlet side, and a sectional area of the first flow passage is substantially equal to a sum of sectional areas of the two or more flow passages.
- FIG. 1 is a perspective view of a schematic configuration of a heat dissipation fin structure according to a first embodiment
- FIG. 2 is a plan view of the heat dissipation fin structure shown in FIG. 1 ;
- FIG. 3A is a schematic view of an arrangement example of fins, the example being applicable to the heat dissipation fin structure according to the first embodiment;
- FIG. 3B a schematic view of an arrangement example of the fins, the example being applicable to the heat dissipation fin structure according to the first embodiment
- FIG. 3C is a schematic view of an arrangement example of the fins, the example being applicable to the heat dissipation fin structure according to the first embodiment;
- FIG. 4A is a schematic view of a heat dissipation fin structure according to a second embodiment
- FIG. 4B is a schematic sectional view taken along the line IVB-IVB in FIG. 4A ;
- FIG. 4C is a schematic sectional view taken along the line IVC-IVC in FIG. 4A ;
- FIG. 4D is a schematic sectional view taken along the line IVD-IVD in FIG. 4A ;
- FIG. 4E is a schematic sectional view taken along the line IVE-IVE in FIG. 4A ;
- FIG. 4F is a schematic sectional view taken along the line IVF-IVF in FIG. 4A .
- a width of a flow passage formed between a pair of plate-shaped fins is increased towards an air outlet side from an air inlet side.
- another plate-shaped fin is provided between the plate-shaped fins so that the flow passage is branched.
- an area of a region where the plate-shaped fin is provided is increased.
- a sectional area of the flow passage before the branching is substantially equal to the sum of sectional areas of two flow passages formed after the branching.
- FIG. 1 is a perspective view of a schematic configuration of a heat dissipation fin structure according to a first embodiment
- FIG. 2 is a plan view of the heat dissipation fin structure shown in FIG. 1 .
- a heat dissipation fin structure 100 is a member that is used to dissipate heat from a heater element (not shown) implemented in an electronic substrate. The heat is dissipated through cooling air that is sent from a fan (not shown).
- the embodiment describes an example where the heat dissipation fin structure 100 is a part of a housing of the electronic substrate. However, the heat dissipation fin structure 100 may be separated from the housing.
- the heat dissipation fin structure 100 includes a fin base plate 2 and a plurality of plate-shaped fins 3 a , 3 b , 3 c , 3 d , 3 e .
- the fin base plate 2 is an substantially flat plate-shaped member that configures the housing of the electronic substrate.
- the fins 3 a , 3 b , 3 c , 3 d , 3 e are provided on a surface (an upper surface in FIG. 1 ) of the fin base plate 2 .
- a heat source of the heater element and so on is thermally connected with a back surface (a lower surface in FIG. 1 ) of the fin base plate 2 .
- the fin base plate 2 and the fins 3 a , 3 b , 3 c , 3 d , 3 e are formed integrally with each other by using, for example, resin with high heat dissipation.
- either or both the fin base plate 2 or/and the fins 3 a , 3 b , 3 c , 3 d , 3 e may be formed by using a material other than resin, such as metal.
- the fins 3 a , 3 b , 3 c , 3 d , 3 e are arranged at given intervals between their surfaces facing each other. As the fins 3 a , 3 b , 3 c , 3 d , 3 e are arranged at given intervals, a plurality of flow passages is configured so that air supplied by a fan (not shown) from inlets 4 a , 4 b is led to outlets 5 a , 5 b , 5 c , 5 d.
- the fin 3 b is arranged between the fins 3 a , 3 c , and an end portion 8 a of the fin 3 b on an inlet side is positioned in the middle of a flow passage 6 a that is formed between the fins 3 a , 3 c that are adjacent to the fin 3 b .
- the flow passage 6 a formed between the fins 3 a , 3 c is branched into two flow passages 7 a , 7 b .
- the fin 3 d is arranged between the fins 3 c , 3 e , and an end portion 8 b of the fin 3 d on the inlet side is positioned in the middle of a flow passage 6 b that is formed between the fins 3 c , 3 e that are adjacent to the fin 3 d .
- the flow passage 6 b formed between the fins 3 c , 3 e is branched into two flow passages 7 c , 7 d.
- each of the flow passages 6 a , 6 b formed by the fins 3 a , 3 c , 3 e is branched.
- a width of the flow passage 6 a between the fins 3 a , 3 c and a width of the flow passage 6 b between the fins 3 c , 3 e are made wider on the outlet side compared to the inlet side so as to expand an area where the fins 3 a , 3 b , 3 c , 3 d , 3 e are arranged.
- a sectional area of the flow passage before being branched by the fin is substantially equal to the sum of sectional areas of the two flow passages after being branched by the fin.
- a difference is as small as possible between the sectional area of the flow passage before being branched and the sum of the sectional areas of the two flow passages after being branched, and it is most preferred that there is no difference between them.
- a sectional area 51 of the flow passage 6 a before being branched by the fin 3 b is substantially the same as the sum of a sectional area S 2 of the flow passage 7 a and a sectional area S 3 of the flow passage 7 b .
- a sectional area 51 of the flow passage 6 a at a region adjacent to an end of the fin 3 b on the inlet side is substantially the same as the sum of a sectional area S 2 of the flow passage 7 a and a sectional area S 3 of the flow passage 7 b at a region adjacent to the end of the fin 3 b on the inlet side.
- the flow passages 7 a , 7 b are obtained as the flow passage 6 a is branched by the fin 3 b .
- the sectional area 51 can become substantially equal to the sum of the sectional areas S 2 , S 3 by expanding the interval between the fins 3 a , 3 c at a position of the end portion 8 a of the fin 3 b on the inlet side.
- a projecting portion 10 is present, projecting from a flat surface portion of the fin base plate 2 .
- the projecting portion 10 is formed corresponding to a projecting shape of a component that is implemented on the electronic substrate arranged on a back surface side of the fin base plate 2 .
- an interval between the fins 3 c , 3 e is expanded at a position of the projecting portion 10 .
- a sectional area S 4 on the inlet side of the projecting portion 10 becomes substantially equal to a sectional area S 5 on the projecting portion 10 .
- the end portion 8 b of the fin 3 d on the inlet side is arranged so as to be continuous with the projecting portion 10 .
- the state where the end portion 8 b of the fin 3 b is continuous with the projecting portion 10 means a state where the end portion 8 b of the fin 3 b and the projecting portion 10 are in contact with each other without any gap between them in the direction along the flow passage 6 b .
- the sectional area of the flow passage 6 b increases and decreases, causing a possible increase in pressure loss.
- the end portion 8 b of the fin 3 d on the inlet side is continuous with the projecting portion 10 , an increase and a decrease in the sectional area of the flow passage 6 b is restrained, thereby restraining an increase in pressure loss.
- sectional area S 5 of the flow passage 6 b before being branched by the fin 3 d is substantially the same as the sum of a sectional area S 6 of the flow passage 7 c and a sectional area S 7 of the flow passage 7 d .
- the flow passages 7 c , 7 d are formed as the flow passage 6 b is branched by the fin 3 d .
- the sectional area S 5 can become substantially equal to the sum of the sectional areas S 6 , S 7 by expanding the interval between the fins 3 c , 3 e at the position of the end portion 8 d of the fin 3 d on the inlet side, or on the outlet side of the position.
- flow passages (secondary flow passages) that are formed as the first flow passage is branched in a width direction by a fin provided inside the first flow passage correspond to second and third flow passages, respectively.
- the flow passages 7 a , 7 b correspond to the second and third flow passages, respectively.
- the flow passages 7 c , 7 d correspond to the second and third flow passages, respectively.
- the flow passage to be branched further is regarded as the first flow passage (the primary flow passage), and it is preferred that, before and after the branching, a sectional area of the first flow passage becomes substantially equal to the sum of sectional areas of the second and third flow passages (the secondary flow passages) that are made by the further branching.
- FIG. 3A to FIG. 3C are schematic views of arrangement examples of fins applicable to the heat dissipation fin structure according to the first embodiment.
- FIG. 3A shows an arrangement example in which a plurality of plate-shaped fins 11 a , 11 b , 11 c , 11 d , 11 e is arranged around a fan 20 .
- a flow passage between the fins 11 a , 11 e is divided by the fin 11 c .
- a flow passage between the fins 11 a , 11 c is divided by the fin 11 b
- a flow passage between the fins 11 c , 11 e is divided by the fin 11 d .
- a sectional area of a flow passage before being divided by a fin is substantially equal to the sum of sectional areas of two flow passages after the division by the fin.
- an increase in pressure loss at a branching place is restrained.
- FIG. 3B shows an example in which end portions of fins 12 b , 12 c , 12 d on an inlet side (a fan 20 side) have a wedge shape.
- the fins 12 b , 12 c , 12 d branch flow passages between fins 12 a , 12 e .
- a portion in a given range from the end portion on the inlet side becomes thinner towards the outlet side.
- turbulence is restrained from happening, thereby restraining an increase in pressure loss at the branching places.
- FIG. 3C shows an arrangement example in which fins 13 a , 13 b , 13 c , 13 d , 13 e are arranged so that widths of flow passages increase at branching places of the flow passages.
- an interval between the fins 13 a , 13 e is increased at a place where a flow passage is branched by the fin 13 c .
- a width between the fins 13 a , 13 c is increased at the place where the flow passage is branched by the fin 13 b
- a width between the fins 13 c , 13 e is increased at the place where the flow passage is branched by the fin 13 d .
- a sectional area of a flow passage before being divided by a fin is substantially equal to the sum of sectional areas of two flow passages formed after the division by the fin.
- a configuration can be employed where a plurality of pin fins is provided on a housing surface, and heat dissipation from the fin pins is promoted by using an axial fan that expels cooling air in a rotation axis direction of the fan.
- a cooling device in which the pin fins and the axial fan are combined, it is necessary to use a large-sized fan that generates a large volume of air.
- a sectional area of a flow passage before being divided by a fin is substantially the same as the sum of sectional areas of two flow passages that are formed with division by the fin. Therefore, an increase in pressure loss at the branching place is reduced.
- the end portion 8 b of the fin 3 d on the inlet side is arranged so as to be continuous with the projecting portion 10 .
- the fin 3 d branches the flow passage 6 b .
- portions in given ranges from their end portions on the inlet side become thinner towards the inlet side.
- turbulence is restrained from happening near the end portions of the fins 12 b , 12 c , 12 d . Therefore, an increase in pressure loss is also reduced.
- FIG. 4A to FIG. 4F are schematic views showing parts of a heat dissipation fin structure according to a second embodiment. More specifically, FIG. 4A is a plan view of a part of the heat dissipation fin structure, FIG. 4B is a sectional view taken along the line IVB-IVB, FIG. 4C is a sectional view at a position along the line IVC-IVC, FIG. 4D is a sectional view at a position along the line IVD-IVD, FIG. 4E is a sectional view at a position along the line IVE-IVE, and FIG. 4F is a sectional view at a position along the line IVF-IVF.
- a lower side corresponds to an inlet side
- an upper side corresponds to an outlet side.
- a heat dissipation fin structure 200 includes a fin base plate 18 and fins 14 a , 14 b , 14 c provided on the fin base plate 18 .
- a projecting portion 17 is present at a position on the fin base plate 18 between the fins 14 a , 14 c .
- the projecting portion 17 is formed corresponding to a heater element 22 implemented on a substrate 21 .
- a projecting amount of the projecting portion 17 from the fin base plate 18 changes depending on a position on a flow passage 15 .
- the projecting amount first increases monotonously from an inlet towards an outlet (a section X). Then, the projecting amount remains substantially the same (a section Y), and then decreases monotonously (a section Z).
- a width of the flow passage 15 is changed in accordance with changes of the projecting amount of the projecting portion 17 on the flow passage 15 .
- a change of a sectional area near the projecting portion 17 is reduced, thereby restraining an increase in pressure loss.
- the width of the flow passage 15 between the fins 14 a , 14 c is increased monotonously as well.
- the sectional area is restrained from changing.
- an end portion 19 of the fin 14 b on the inlet side is arranged so as to be continuous with the projecting portion 17 , and, similarly to the embodiment described above, a sectional area S 8 of the flow passage 15 before being divided by the fin 14 b is the same as the sum of a sectional area S 9 of a flow passage 16 a and a sectional area S 10 of a flow passage 16 b , the flow passages 16 a , 16 b being formed after the division by the fin 14 b . Therefore, in the heat dissipation fin structure 200 according to the embodiment, an increase in pressure loss at a branching place of the flow passage 15 is restrained.
- the width of the flow passage 15 is changed in accordance with the shape (the projecting amount) of the projecting portion 17 so that a change of the sectional area of the flow passage 15 becomes small.
- the arrangements and shapes of the fins, the changes of the width of the flow passage between the neighboring fins, and so on described in the embodiments above may be combined arbitrarily. As the foregoing arrangements and shapes of the fins, the changes of the width of the flow passage between the neighboring fins, and so on are combined, it is possible to configure a heat dissipation fin structure that is able to cool a wide area more efficiently.
- Each of the embodiments shows an example of a part of the heat dissipation fin structure where a flow passage between two fins is branched once or twice.
- another fin may be arranged in an already branched flow passage so that a flow passage is branched three times or more.
- a flow passage between a pair of fins may be divided into more than three flow passages at the same time by arranging two or more fins between the pair of fins.
- planar shape of a flow passage formed by a plurality of fins is specified.
- the planar shape of the flow passage may be designed as appropriate corresponding to arrangement of a heater element to be cooled, a size of a housing, a shape of a fan to be used, and so on.
- the heat dissipation fin structure described in the foregoing embodiments may be combined with an electronic substrate on which a heater element is implemented, and a fan.
- a cooling structure for the electronic substrate is configured.
- a back surface (a surface where no fins are provided) of a fin base plate is faced with the heater element on the electronic substrate, the heat dissipation fin structure and the electronic substrate are superimposed on each other, and the fan is arranged so that cooling air from the fan is sent to an inlet made of a plurality of fins.
- the back surface of the fin base plate and the heater element only need to be thermally connected with each other, and may be in contact with each other through thermal grease and so on in order to improve thermal conductivity.
- the disclosure can be used as a heat dissipation structure that uses cooling air from a fan in order to dissipate heat from a heater element implemented on an electronic substrate.
Abstract
Description
- The disclosure of Japanese Patent Application No. 2018-031997 filed on Feb. 26, 2018 including the specification, drawings and abstract is incorporated herein by reference in its entirety.
- The disclosure relates to a heat dissipation fin structure and a cooling structure for an electronic substrate using the heat dissipation fin structure.
- Japanese Unexamined Patent Application Publication No. 10-190268 (JP 10-190268 A) describes a cooling device for electronic equipment. The cooling device cools down heat of a heat source by using a heat sink and a fan.
- When plate-shaped fins are provided in a housing that houses a large-sized electronic component such as a DC/DC converter, there is room for improvement on shapes of the fins so that the housing with a large heat-generating area is cooled efficiently by using cooling air from a fan.
- The disclosure provides a heat dissipation fin structure in which plate-shaped fins are possible to lead cooling air from a fan to a wide area, thus dissipating heat efficiently. The disclosure also provides a cooling structure for an electronic substrate in which the heat dissipation fin structure is used.
- A first aspect of the disclosure provides a heat dissipation fin structure including: a fin base plate of which a first surface is thermally connected with a heat source; and a plurality of plate-shaped fins provided on a second surface of the fin base plate. The fins configure a plurality of flow passages in which cooling air that enters from an inlet passes when the cooling air flows towards an outlet, the fins include a first fin, an end portion of the first fin on an inlet side is arranged in an intermediate part of a first flow passage that is formed between a pair of the fins adjacent to the first fin, the first flow passage is divided by the first fin into a second flow passage and a third flow passage in a width direction of the first flow passage, an interval between the pair of fins is wider on an outlet side than the inlet side, and a sectional area of the first flow passage is substantially equal to a sum of sectional areas of the second flow passage and the third flow passage.
- According to the first aspect, since an increase in pressure loss at a branching place of the flow passage is restrained, it is possible to lead cooling air to a wide area, and heat is thus dissipated efficiently.
- In the first aspect, a projecting portion may be formed on the second surface of the fin base plate at a position inside the first flow passage, and the interval between the pair of fins that forms the first flow passage may increase as a projecting amount of the projecting portion from the fin base plate increases.
- With the above configuration, when there is the projecting portion inside the flow passage, a change of a sectional area due to the projecting amount of the projecting portion is reduced. Therefore, an increase in pressure loss is restrained further.
- In the above configuration, the end portion of the first fin on the inlet side may be arranged so as to be continuous with the projecting portion.
- With the foregoing configuration, the end portion of the fin on the inlet side, the fin branching the flow passage, is arranged so as to be continuous with the projecting portion inside the flow passage without any gap. Therefore, a change of the sectional area near the projecting portion is restrained, thereby further restraining an increase in pressure loss.
- In the first aspect, a portion of the first fin in a predetermined range from the end portion on the inlet side may become thinner towards the inlet.
- With the configuration, turbulence is restrained from happening in the end portion of the fin on the inlet side, the fin branching the flow passage. Therefore, it is possible to reduce an increase in pressure loss further.
- A second aspect of the disclosure provides a cooling structure for an electronic substrate, including: the electronic substrate on which a heater element is implemented; the heat dissipation fin structure according to the first aspect, the heat dissipation fin structure being arranged so as to be superimposed on the electronic substrate with the first surface facing the heater element; and a fan that sends air to the inlet of the heat dissipation fin structure.
- According to the second aspect, an increase in pressure loss at the branching place in the flow passage is restrained. Therefore, it is possible to realize the cooling structure for the electronic substrate, the cooling structure being able to lead cooling air to a wide area, thereby dissipating heat efficiently.
- A third aspect of the disclosure provides a heat dissipation fin structure, including: a fin base plate of which a first surface is thermally connected with a heat source; and a plurality of plate-shaped fins provided on a second surface of the fin base plate. The fins configure a plurality of flow passages in which cooling air that enters from an inlet passes when the cooling air flows towards an outlet, an end portion of at least one of the fins on an inlet side is arranged in an intermediate part of a first flow passage that is formed between a pair of the fins, the first flow passage is divided by the at least one of the fins into two or more flow passages in a width direction of the first flow passage, an interval between the pair of fins is wider on an outlet side than the inlet side, and a sectional area of the first flow passage is substantially equal to a sum of sectional areas of the two or more flow passages.
- Features, advantages, and technical and industrial significance of exemplary embodiments of the disclosure will be described below with reference to the accompanying drawings, in which like numerals denote like elements, and wherein:
-
FIG. 1 is a perspective view of a schematic configuration of a heat dissipation fin structure according to a first embodiment; -
FIG. 2 is a plan view of the heat dissipation fin structure shown inFIG. 1 ; -
FIG. 3A is a schematic view of an arrangement example of fins, the example being applicable to the heat dissipation fin structure according to the first embodiment; -
FIG. 3B a schematic view of an arrangement example of the fins, the example being applicable to the heat dissipation fin structure according to the first embodiment; -
FIG. 3C is a schematic view of an arrangement example of the fins, the example being applicable to the heat dissipation fin structure according to the first embodiment; -
FIG. 4A is a schematic view of a heat dissipation fin structure according to a second embodiment; -
FIG. 4B is a schematic sectional view taken along the line IVB-IVB inFIG. 4A ; -
FIG. 4C is a schematic sectional view taken along the line IVC-IVC inFIG. 4A ; -
FIG. 4D is a schematic sectional view taken along the line IVD-IVD inFIG. 4A ; -
FIG. 4E is a schematic sectional view taken along the line IVE-IVE inFIG. 4A ; and -
FIG. 4F is a schematic sectional view taken along the line IVF-IVF inFIG. 4A . - Outline
- In a heat dissipation fin structure according to the disclosure, a width of a flow passage formed between a pair of plate-shaped fins is increased towards an air outlet side from an air inlet side. At the same time, another plate-shaped fin is provided between the plate-shaped fins so that the flow passage is branched. Thus, an area of a region where the plate-shaped fin is provided is increased. A sectional area of the flow passage before the branching is substantially equal to the sum of sectional areas of two flow passages formed after the branching. Thus, it is possible to restrain an increase in pressure loss at a branching place.
-
FIG. 1 is a perspective view of a schematic configuration of a heat dissipation fin structure according to a first embodiment, andFIG. 2 is a plan view of the heat dissipation fin structure shown inFIG. 1 . - A heat
dissipation fin structure 100 is a member that is used to dissipate heat from a heater element (not shown) implemented in an electronic substrate. The heat is dissipated through cooling air that is sent from a fan (not shown). The embodiment describes an example where the heatdissipation fin structure 100 is a part of a housing of the electronic substrate. However, the heatdissipation fin structure 100 may be separated from the housing. - The heat
dissipation fin structure 100 includes afin base plate 2 and a plurality of plate-shapedfins fin base plate 2 is an substantially flat plate-shaped member that configures the housing of the electronic substrate. On a surface (an upper surface inFIG. 1 ) of thefin base plate 2, thefins FIG. 1 ) of thefin base plate 2. Thefin base plate 2 and thefins fin base plate 2 or/and thefins - The
fins fins inlets outlets - The
fin 3 b is arranged between thefins end portion 8 a of thefin 3 b on an inlet side is positioned in the middle of aflow passage 6 a that is formed between thefins fin 3 b. With this arrangement of thefin 3 b, theflow passage 6 a formed between thefins flow passages fin 3 d is arranged between thefins end portion 8 b of thefin 3 d on the inlet side is positioned in the middle of aflow passage 6 b that is formed between thefins fin 3 d. As thefin 3 d is arranged as such, theflow passage 6 b formed between thefins flow passages - In the heat
dissipation fin structure 100 according to the embodiment, each of theflow passages fins flow passage 6 a between thefins flow passage 6 b between thefins fins fins fin base plate 2. - In places where the
flow passages dissipation fin structure 100 according to the embodiment, a sectional area of the flow passage before being branched by the fin is substantially equal to the sum of sectional areas of the two flow passages after being branched by the fin. Thus, an increase in pressure loss is restrained. It is preferred that a difference is as small as possible between the sectional area of the flow passage before being branched and the sum of the sectional areas of the two flow passages after being branched, and it is most preferred that there is no difference between them. - Specifically, as shown in
FIG. 2 , a sectional area 51 of theflow passage 6 a before being branched by thefin 3 b is substantially the same as the sum of a sectional area S2 of theflow passage 7 a and a sectional area S3 of theflow passage 7 b. In other words, a sectional area 51 of theflow passage 6 a at a region adjacent to an end of thefin 3 b on the inlet side, is substantially the same as the sum of a sectional area S2 of theflow passage 7 a and a sectional area S3 of theflow passage 7 b at a region adjacent to the end of thefin 3 b on the inlet side. Theflow passages flow passage 6 a is branched by thefin 3 b. The sectional area 51 can become substantially equal to the sum of the sectional areas S2, S3 by expanding the interval between thefins end portion 8 a of thefin 3 b on the inlet side. - Further, as shown in
FIG. 1 andFIG. 2 , inside theflow passage 6 b between thefins portion 10 is present, projecting from a flat surface portion of thefin base plate 2. The projectingportion 10 is formed corresponding to a projecting shape of a component that is implemented on the electronic substrate arranged on a back surface side of thefin base plate 2. In the heatdissipation fin structure 100 according to the embodiment, when the projectingportion 10 is present inside theflow passage 6 b, an interval between thefins portion 10. Thus, a sectional area S4 on the inlet side of the projectingportion 10 becomes substantially equal to a sectional area S5 on the projectingportion 10. Thus, an increase in pressure loss at the position of the projectingportion 10 is restrained. Theend portion 8 b of thefin 3 d on the inlet side is arranged so as to be continuous with the projectingportion 10. The state where theend portion 8 b of thefin 3 b is continuous with the projectingportion 10 means a state where theend portion 8 b of thefin 3 b and the projectingportion 10 are in contact with each other without any gap between them in the direction along theflow passage 6 b. If there is a gap between theend portion 8 b of thefin 3 b and the projectingportion 10 in the direction along theflow passage 6 b, the sectional area of theflow passage 6 b increases and decreases, causing a possible increase in pressure loss. In the embodiment, because theend portion 8 b of thefin 3 d on the inlet side is continuous with the projectingportion 10, an increase and a decrease in the sectional area of theflow passage 6 b is restrained, thereby restraining an increase in pressure loss. Further, the sectional area S5 of theflow passage 6 b before being branched by thefin 3 d is substantially the same as the sum of a sectional area S6 of theflow passage 7 c and a sectional area S7 of theflow passage 7 d. Theflow passages flow passage 6 b is branched by thefin 3 d. The sectional area S5 can become substantially equal to the sum of the sectional areas S6, S7 by expanding the interval between thefins fin 3 d on the inlet side, or on the outlet side of the position. - In the specification, when a flow passage (a primary flow passage) formed by a pair of fins is regarded as a first flow passage, flow passages (secondary flow passages) that are formed as the first flow passage is branched in a width direction by a fin provided inside the first flow passage correspond to second and third flow passages, respectively. In the embodiment, when the
flow passage 6 a is the first flow passage, theflow passages flow passage 6 b is the first flow passage, theflow passages -
FIG. 3A toFIG. 3C are schematic views of arrangement examples of fins applicable to the heat dissipation fin structure according to the first embodiment. -
FIG. 3A shows an arrangement example in which a plurality of plate-shapedfins 11 a, 11 b, 11 c, 11 d, 11 e is arranged around afan 20. In the example ofFIG. 3A , a flow passage between the fins 11 a, 11 e is divided by the fin 11 c. A flow passage between the fins 11 a, 11 c is divided by thefin 11 b, and a flow passage between the fins 11 c, 11 e is divided by the fin 11 d. In the arrangement example of thefins 11 a, 11 b, 11 c, 11 d, 11 e shown inFIG. 3A , a sectional area of a flow passage before being divided by a fin is substantially equal to the sum of sectional areas of two flow passages after the division by the fin. Thus, an increase in pressure loss at a branching place is restrained. -
FIG. 3B shows an example in which end portions offins fan 20 side) have a wedge shape. Thefins fins fins fins -
FIG. 3C shows an arrangement example in which fins 13 a, 13 b, 13 c, 13 d, 13 e are arranged so that widths of flow passages increase at branching places of the flow passages. In the example inFIG. 3C , an interval between the fins 13 a, 13 e is increased at a place where a flow passage is branched by the fin 13 c. Also, a width between the fins 13 a, 13 c is increased at the place where the flow passage is branched by the fin 13 b, and a width between the fins 13 c, 13 e is increased at the place where the flow passage is branched by the fin 13 d. As the widths of the flow passages are increased at the places where the flow passages are branched as described above, it is possible to restrain an increase in sectional areas of the flow passages from the inlet to the outlet in comparison to the arrangement example shown inFIG. 3A . Therefore, it is possible to further restrain an increase in pressure loss - In the arrangement example shown in
FIG. 3B andFIG. 3C , a sectional area of a flow passage before being divided by a fin is substantially equal to the sum of sectional areas of two flow passages formed after the division by the fin. Thus, an increase in pressure loss at the branching places is restrained. - With the arrangement examples shown in
FIG. 3A to 3C , it is possible to lead cooling air from thefan 20 to a wide range while restraining an increase in pressure loss. Therefore, it is possible to achieve efficient cooling. - Effects Etc.
- When a housing that houses a large-sized electronic component such as a DC/DC converter is cooled, a configuration can be employed where a plurality of pin fins is provided on a housing surface, and heat dissipation from the fin pins is promoted by using an axial fan that expels cooling air in a rotation axis direction of the fan. However, in a cooling device in which the pin fins and the axial fan are combined, it is necessary to use a large-sized fan that generates a large volume of air.
- Meanwhile, there is also known a configuration in which a plurality of plate-shaped fins is arranged on a housing surface, and a blower fan that expels cooling air in a centrifugal direction is used to send air into a flow passage formed between the plate-shaped fins so that heat dissipation from the plate-shaped fins is promoted.
- However, in the configuration where the general plate-shaped fins and the blower fan are combined, it is difficult to cool a wide area. Therefore, there is room for improvement on shapes of the plate-shaped fins in order to cool a wide area efficiently.
- In the heat
dissipation fin structure 100 according to the embodiment, a sectional area of a flow passage before being divided by a fin is substantially the same as the sum of sectional areas of two flow passages that are formed with division by the fin. Therefore, an increase in pressure loss at the branching place is reduced. With the heatdissipation fin structure 100 according to the embodiment, it is possible to lead cooling air from a fan to a wide area as the flow passage formed by the plate-shaped fins is branched, while restraining a decrease in cooling efficiency due to pressure loss. - Further, in the heat
dissipation fin structure 100 according to the embodiment, when the projectingportion 10 is present inside theflow passage 6 b on thefin base plate 2 as shown inFIG. 1 andFIG. 2 , theend portion 8 b of thefin 3 d on the inlet side is arranged so as to be continuous with the projectingportion 10. Thefin 3 d branches theflow passage 6 b. With this arrangement, it is possible to restrain changes of the sectional area of theflow passage 6 b near theend portion 8 b of thefin 3 d. Therefore, it is possible to restrain an increase in pressure loss even when thefin 3 d is arranged near the projectingportion 10. - Further, as shown in
FIG. 3B , in thefins fins -
FIG. 4A toFIG. 4F are schematic views showing parts of a heat dissipation fin structure according to a second embodiment. More specifically,FIG. 4A is a plan view of a part of the heat dissipation fin structure,FIG. 4B is a sectional view taken along the line IVB-IVB,FIG. 4C is a sectional view at a position along the line IVC-IVC,FIG. 4D is a sectional view at a position along the line IVD-IVD,FIG. 4E is a sectional view at a position along the line IVE-IVE, andFIG. 4F is a sectional view at a position along the line IVF-IVF. InFIG. 4A , a lower side corresponds to an inlet side, and an upper side corresponds to an outlet side. - As shown in
FIG. 4A andFIG. 4B , a heatdissipation fin structure 200 according to the second embodiment includes afin base plate 18 andfins fin base plate 18. In the heatdissipation fin structure 200 according to the embodiment, a projectingportion 17 is present at a position on thefin base plate 18 between thefins FIG. 4B , the projectingportion 17 is formed corresponding to aheater element 22 implemented on asubstrate 21. - A projecting amount of the projecting
portion 17 from thefin base plate 18 changes depending on a position on aflow passage 15. As shown inFIG. 4A andFIG. 4B , the projecting amount first increases monotonously from an inlet towards an outlet (a section X). Then, the projecting amount remains substantially the same (a section Y), and then decreases monotonously (a section Z). In the second embodiment, a width of theflow passage 15 is changed in accordance with changes of the projecting amount of the projectingportion 17 on theflow passage 15. Thus, a change of a sectional area near the projectingportion 17 is reduced, thereby restraining an increase in pressure loss. Specifically, since the projecting amount of the projectingportion 17 increases monotonously in the section X, the width of theflow passage 15 between thefins - Further, an
end portion 19 of thefin 14 b on the inlet side is arranged so as to be continuous with the projectingportion 17, and, similarly to the embodiment described above, a sectional area S8 of theflow passage 15 before being divided by thefin 14 b is the same as the sum of a sectional area S9 of aflow passage 16 a and a sectional area S10 of aflow passage 16 b, theflow passages fin 14 b. Therefore, in the heatdissipation fin structure 200 according to the embodiment, an increase in pressure loss at a branching place of theflow passage 15 is restrained. - With the heat
dissipation fin structure 200 according to the embodiment, when there is the projectingportion 17 in theflow passage 15 between thefins flow passage 15 is changed in accordance with the shape (the projecting amount) of the projectingportion 17 so that a change of the sectional area of theflow passage 15 becomes small. Thus, it is possible to restrain an increase in pressure loss near the projectingportion 17, thereby further improving cooling efficiency. - Other Modifications
- The arrangements and shapes of the fins, the changes of the width of the flow passage between the neighboring fins, and so on described in the embodiments above may be combined arbitrarily. As the foregoing arrangements and shapes of the fins, the changes of the width of the flow passage between the neighboring fins, and so on are combined, it is possible to configure a heat dissipation fin structure that is able to cool a wide area more efficiently.
- Each of the embodiments shows an example of a part of the heat dissipation fin structure where a flow passage between two fins is branched once or twice. However, another fin may be arranged in an already branched flow passage so that a flow passage is branched three times or more. Thus, a heat dissipation fin structure is obtained that is able to cool a wider area. A flow passage between a pair of fins may be divided into more than three flow passages at the same time by arranging two or more fins between the pair of fins.
- In each of the foregoing embodiments, a planar shape of a flow passage formed by a plurality of fins is specified. However, the planar shape of the flow passage may be designed as appropriate corresponding to arrangement of a heater element to be cooled, a size of a housing, a shape of a fan to be used, and so on.
- The heat dissipation fin structure described in the foregoing embodiments may be combined with an electronic substrate on which a heater element is implemented, and a fan. Thus, a cooling structure for the electronic substrate is configured. In this case, a back surface (a surface where no fins are provided) of a fin base plate is faced with the heater element on the electronic substrate, the heat dissipation fin structure and the electronic substrate are superimposed on each other, and the fan is arranged so that cooling air from the fan is sent to an inlet made of a plurality of fins. The back surface of the fin base plate and the heater element only need to be thermally connected with each other, and may be in contact with each other through thermal grease and so on in order to improve thermal conductivity.
- The disclosure can be used as a heat dissipation structure that uses cooling air from a fan in order to dissipate heat from a heater element implemented on an electronic substrate.
Claims (6)
Applications Claiming Priority (3)
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JP2018031997A JP7081203B2 (en) | 2018-02-26 | 2018-02-26 | Radiation fin structure and cooling structure of electronic board using this |
JP2018-031997 | 2018-02-26 | ||
JPJP2018-031997 | 2018-02-26 |
Publications (2)
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US20190267308A1 true US20190267308A1 (en) | 2019-08-29 |
US11107749B2 US11107749B2 (en) | 2021-08-31 |
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US16/274,415 Active 2039-05-16 US11107749B2 (en) | 2018-02-26 | 2019-02-13 | Heat dissipation fin structure and cooling structure for electric substrate using the same |
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US (1) | US11107749B2 (en) |
JP (1) | JP7081203B2 (en) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113301778A (en) * | 2021-05-12 | 2021-08-24 | 美达电器(重庆)有限公司 | Wall-hanging direct current fills electric pile's forced air cooling heat abstractor |
CN114375147A (en) * | 2022-03-22 | 2022-04-19 | 西安中科西光航天科技有限公司 | Remote sensing image fusion device |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190215984A1 (en) * | 2018-01-09 | 2019-07-11 | Aptiv Technologies Limited | Wireless device charger with cooling device |
CN112954946B (en) * | 2019-11-26 | 2022-08-26 | 杭州海康威视数字技术股份有限公司 | Heat radiation member and electronic device |
CN112823575B (en) * | 2020-04-27 | 2022-07-12 | 深圳市大疆创新科技有限公司 | Radiator, heat radiation structure and unmanned aerial vehicle |
TWI778875B (en) * | 2021-11-24 | 2022-09-21 | 和碩聯合科技股份有限公司 | Heat dissipation member |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3592260A (en) * | 1969-12-05 | 1971-07-13 | Espey Mfg & Electronics Corp | Heat exchanger with inner guide strip |
US4715438A (en) * | 1986-06-30 | 1987-12-29 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
US4753290A (en) * | 1986-07-18 | 1988-06-28 | Unisys Corporation | Reduced-stress heat sink device |
US5597034A (en) * | 1994-07-01 | 1997-01-28 | Digital Equipment Corporation | High performance fan heatsink assembly |
US5828551A (en) * | 1997-03-04 | 1998-10-27 | Hoshino Kinzoku Koygo Kabushiki Kaisha | Heat sink apparatus for an electronic component |
US20040244947A1 (en) * | 2003-05-14 | 2004-12-09 | Inventor Precision Co., Ltd. | Heat sinks for a cooler |
US6847525B1 (en) * | 2002-05-24 | 2005-01-25 | Unisys Corporation | Forced convection heat sink system with fluid vector control |
US20070201211A1 (en) * | 2006-02-24 | 2007-08-30 | Nvdia Corporation | System for cooling a heat-generating electronic device with increased air flow |
US20100108292A1 (en) * | 2008-10-31 | 2010-05-06 | Teledyne Scientific & Imaging, Llc | Heat sink system with fin structure |
US20100170657A1 (en) * | 2009-01-06 | 2010-07-08 | United Technologies Corporation | Integrated blower diffuser-fin heat sink |
US20120014064A1 (en) * | 2010-07-19 | 2012-01-19 | Hamilton Sundstrand Corporation | Non-circular radial heat sink |
US20140298846A1 (en) * | 2011-05-17 | 2014-10-09 | Carrier Corporation | Variable Frequency Drive Heat Sink Assembly |
US20140321054A1 (en) * | 2011-07-15 | 2014-10-30 | Stefan Kaefer | Carrier for a display module and display apparatus having such a carrier |
US9382914B1 (en) * | 2012-07-24 | 2016-07-05 | Benjamin K. Sharfi | Sealed integrated low profile cooling array |
US10104808B2 (en) * | 2014-05-23 | 2018-10-16 | Fronius International Gmbh | Heat sink and housing for an inverter with such a heat sink |
US20190335621A1 (en) * | 2016-12-12 | 2019-10-31 | Aptiv Technologies Limited | Heat dissipation device for a multimedia control unit |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2718301B2 (en) * | 1991-10-04 | 1998-02-25 | 松下電器産業株式会社 | Oil burning equipment |
JPH10190268A (en) | 1996-12-25 | 1998-07-21 | Yaskawa Electric Corp | Electronic device cooler |
JP3569451B2 (en) | 1998-09-07 | 2004-09-22 | 株式会社Pfu | Electronic equipment with heat dissipation device |
US6434002B1 (en) * | 2000-07-31 | 2002-08-13 | Wen-Chen Wei | Structure computer heat dissipater |
JP2003023281A (en) | 2001-07-05 | 2003-01-24 | Toshiba Corp | Electric device incorporating heater and air-cooling type cooling device |
US7151667B2 (en) | 2004-04-12 | 2006-12-19 | Nvidia Corporation | Modular, scalable thermal solution |
JP2005327795A (en) | 2004-05-12 | 2005-11-24 | Sumitomo Electric Ind Ltd | Heat radiator |
US20090321046A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Flow diverters to enhance heat sink performance |
DE102009038806A1 (en) * | 2009-08-25 | 2011-03-03 | Ziehl-Abegg Ag | Electronic unit with cooling fins |
CN107664903B (en) | 2016-07-27 | 2020-04-28 | 深圳光峰科技股份有限公司 | Color wheel device and projector |
CN205921886U (en) | 2016-08-24 | 2017-02-01 | 格至控智能动力科技(上海)有限公司 | Vehicle control heat abstractor |
-
2018
- 2018-02-26 JP JP2018031997A patent/JP7081203B2/en active Active
-
2019
- 2019-02-13 US US16/274,415 patent/US11107749B2/en active Active
- 2019-02-22 CN CN201910133367.3A patent/CN110198615B/en not_active Expired - Fee Related
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3592260A (en) * | 1969-12-05 | 1971-07-13 | Espey Mfg & Electronics Corp | Heat exchanger with inner guide strip |
US4715438A (en) * | 1986-06-30 | 1987-12-29 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
US4753290A (en) * | 1986-07-18 | 1988-06-28 | Unisys Corporation | Reduced-stress heat sink device |
US5597034A (en) * | 1994-07-01 | 1997-01-28 | Digital Equipment Corporation | High performance fan heatsink assembly |
US5828551A (en) * | 1997-03-04 | 1998-10-27 | Hoshino Kinzoku Koygo Kabushiki Kaisha | Heat sink apparatus for an electronic component |
US6847525B1 (en) * | 2002-05-24 | 2005-01-25 | Unisys Corporation | Forced convection heat sink system with fluid vector control |
US20040244947A1 (en) * | 2003-05-14 | 2004-12-09 | Inventor Precision Co., Ltd. | Heat sinks for a cooler |
US20070201211A1 (en) * | 2006-02-24 | 2007-08-30 | Nvdia Corporation | System for cooling a heat-generating electronic device with increased air flow |
US20100108292A1 (en) * | 2008-10-31 | 2010-05-06 | Teledyne Scientific & Imaging, Llc | Heat sink system with fin structure |
US20100170657A1 (en) * | 2009-01-06 | 2010-07-08 | United Technologies Corporation | Integrated blower diffuser-fin heat sink |
US20120014064A1 (en) * | 2010-07-19 | 2012-01-19 | Hamilton Sundstrand Corporation | Non-circular radial heat sink |
US20140298846A1 (en) * | 2011-05-17 | 2014-10-09 | Carrier Corporation | Variable Frequency Drive Heat Sink Assembly |
US20140321054A1 (en) * | 2011-07-15 | 2014-10-30 | Stefan Kaefer | Carrier for a display module and display apparatus having such a carrier |
US9382914B1 (en) * | 2012-07-24 | 2016-07-05 | Benjamin K. Sharfi | Sealed integrated low profile cooling array |
US10104808B2 (en) * | 2014-05-23 | 2018-10-16 | Fronius International Gmbh | Heat sink and housing for an inverter with such a heat sink |
US20190335621A1 (en) * | 2016-12-12 | 2019-10-31 | Aptiv Technologies Limited | Heat dissipation device for a multimedia control unit |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113301778A (en) * | 2021-05-12 | 2021-08-24 | 美达电器(重庆)有限公司 | Wall-hanging direct current fills electric pile's forced air cooling heat abstractor |
CN114375147A (en) * | 2022-03-22 | 2022-04-19 | 西安中科西光航天科技有限公司 | Remote sensing image fusion device |
Also Published As
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US11107749B2 (en) | 2021-08-31 |
CN110198615A (en) | 2019-09-03 |
JP7081203B2 (en) | 2022-06-07 |
JP2019149404A (en) | 2019-09-05 |
CN110198615B (en) | 2020-08-25 |
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