CN112739156A - Heat dissipation module, radiator and power equipment - Google Patents
Heat dissipation module, radiator and power equipment Download PDFInfo
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- CN112739156A CN112739156A CN202011450509.8A CN202011450509A CN112739156A CN 112739156 A CN112739156 A CN 112739156A CN 202011450509 A CN202011450509 A CN 202011450509A CN 112739156 A CN112739156 A CN 112739156A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation module, a radiator and power equipment, wherein the heat dissipation module comprises a heat dissipation substrate and a fin assembly. The fin component comprises a radiating fin and a sealing plate, the radiating fin comprises a first radiating fin arranged on the radiating base plate and the sealing plate which is connected to the first radiating fin in a sealing mode and is far away from one end of the radiating base plate, and a radiating air channel is formed among the sealing plate, the first radiating fin and the surface of the radiating base plate opposite to the sealing plate. In the heat dissipation module that this application provided, the tip through at first radiating fin sets up the shrouding for heat dissipation module is from taking the wind channel, makes gaseous flow according to predetermineeing the route in the heat dissipation wind channel, reduces gaseous at the heat dissipation module cohesion, and consequently, the heat dissipation module's that this application provided radiating efficiency improves.
Description
Technical Field
The invention relates to the technical field of equipment heat dissipation, in particular to a heat dissipation module. The invention also relates to a radiator comprising the radiating module. The invention further relates to a power device comprising the heat sink.
Background
For a heating device, heat is usually dissipated through a heat dissipation module with heat dissipation fins, and a heat dissipation film block is air cooling equipment, and specifically, through arranging an air duct, the flow direction of air is restricted.
As shown in fig. 1 to 4, the heat sink includes a box body and a heat dissipation module mounted on the box body, where the heat dissipation module includes a heat dissipation substrate 01, heat dissipation fins 02, and an air guide cover 03 covering the heat dissipation substrate 01 and the heat dissipation fins 02. A heat dissipation air duct is formed among the air guiding cover 03, the heat dissipation fins 02 and the heat dissipation substrate 01.
However, since the heat dissipation substrate 01 and the air guide cover 03 are both mounted on the box body, and the inner side of the air guide cover 03 abuts against the heat dissipation fins 02, a gap exists due to a machining error, and thus the gas between the end faces of the air guide cover 03 and the heat dissipation fins 02 cannot be smoothly discharged, and further the heat dissipation efficiency of the heat dissipation module is reduced.
Therefore, how to improve the heat dissipation efficiency of the heat dissipation module is a technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
The invention aims to provide a heat dissipation module to improve the heat dissipation efficiency of the heat dissipation module. Another object of the present invention is to provide a heat sink including the heat dissipation module. It is a further object of the present invention to provide a power device comprising the heat sink described above.
To achieve the above object, the present invention provides a heat dissipation module, including:
a heat-dissipating substrate;
and the fin assembly comprises a radiating fin and a sealing plate, the radiating fin comprises a first radiating fin arranged on the radiating base plate and the sealing plate which is connected to the first radiating fin at one end far away from the radiating base plate, and a radiating air channel is formed between the sealing plate, the first radiating fin and the surface of the radiating base plate right opposite to the sealing plate.
Preferably, the heat dissipation module is of an integrally formed structure.
Preferably, the heat dissipation module is profile extrusion molded.
Preferably, the sealing plate is welded or bonded to the fin.
Preferably, the front end and the rear end of the sealing plate extend to the front end and the rear end of the first heat dissipation fin along the airflow direction.
Preferably, the left and right ends of the sealing plate extend to the first heat dissipation fins on the left and right side edges of the fin assembly;
or the number of the sealing plates is multiple, the sealing plates are sequentially arranged along the direction perpendicular to the thickness direction of the first radiating fins, and the lengths of all the sealing plates along the direction perpendicular to the thickness direction of the first radiating fins are equal or unequal.
Preferably, the heat dissipation fins further comprise at least one second heat dissipation fin arranged on the heat dissipation substrate, the second heat dissipation fin is located in the heat dissipation air duct, and the free end of the second heat dissipation fin is isolated from the sealing plate.
Preferably, the heat dissipation fins further include at least one third heat dissipation fin mounted on the heat dissipation substrate and located outside the heat dissipation air duct.
Preferably, the heat dissipation air duct is a strip-shaped channel arranged from the air inlet to the air outlet.
Preferably, the heat dissipation substrate is provided with a heating device mounting position;
the heating device mounting position and the fin component are positioned on the same surface of the heat dissipation substrate;
or the heating device mounting position and the fin component are positioned on two surfaces of the heat dissipation substrate which are arranged in a back direction.
Preferably, the heat dissipation substrate is provided with a heating device installation position, two surfaces of the heat dissipation substrate, which are arranged back to back, are a first surface and a second surface respectively, the fin assemblies are a first fin assembly arranged on the first surface and a second fin assembly arranged on the second surface respectively, the first fin assembly and the second fin assembly are at least one, and the heating device installation positions are a first heating device installation position arranged on the first surface and a second heating device installation position arranged on the second surface respectively.
Preferably:
the first fin assembly and the second fin assembly are arranged in a back-to-back manner, and the first heating device mounting position and the second heating device mounting position are arranged in a back-to-back manner;
or the first fin component and the second heating device are arranged in a back direction, and the second fin component and the mounting position of the first heating device are arranged in a back direction;
or at least one first fin component and the second fin component are arranged in a back-to-back mode, and at least one first fin component and the second heating device are arranged in a back-to-back mode.
A radiator comprises a box body and a radiating module arranged on the box body, wherein the radiating module is any one of the radiating modules.
Preferably, the air inlet of the heat dissipation air duct is located at the bottom end of the heat dissipation module, and the air outlet of the heat dissipation air duct is located at the top end of the heat dissipation module.
Preferably, a heat radiation fan is further included.
Preferably, the number of the heat dissipation fans is multiple, and the heat dissipation fans are sequentially arranged along the arrangement direction of the heat dissipation fins.
Preferably, the heat dissipation fan is located at an air inlet end of the heat dissipation air duct or at an air outlet end of the heat dissipation air duct.
Preferably, the number of the heat dissipation fans is multiple, and the air inlet end of the heat dissipation air duct and the air outlet end of the heat dissipation air duct are both provided with the heat dissipation fans.
A power device comprises a heating module and a radiator used for radiating heat of the heating module, wherein the radiator is the radiator in any one of the above.
In the above technical solution, the heat dissipation module provided by the present invention includes a heat dissipation substrate and a fin assembly. The fin component comprises a radiating fin and a sealing plate, the radiating fin comprises a first radiating fin arranged on the radiating base plate and the sealing plate which is connected to the first radiating fin in a sealing mode and is far away from one end of the radiating base plate, and a radiating air channel is formed among the sealing plate, the first radiating fin and the surface of the radiating base plate opposite to the sealing plate.
It can be known through the above description that in the heat dissipation module that this application provided, through set up the shrouding at first radiating fin's tip for heat dissipation module is from taking the wind channel, makes gaseous flow according to predetermineeing the route in the wind channel of dispelling the heat, reduces gaseous at the heat dissipation module cohesion, and consequently, the heat dissipation module's that this application provided radiating efficiency improves.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural view of a conventional heat sink;
fig. 2 is a three-dimensional structural view of a conventional heat dissipation module;
fig. 3 is a schematic structural diagram of a conventional heat dissipation module;
fig. 4 is a top view of the heat dissipation module shown in fig. 3;
fig. 5 is a three-dimensional structural diagram of a first heat dissipation module according to an embodiment of the present invention;
fig. 6 is a side view of a first heat dissipation module according to an embodiment of the invention;
fig. 7 is a top view of a first heat dissipation module according to an embodiment of the invention;
FIG. 8 is a schematic structural diagram of a case provided in the embodiment of the present invention;
figure 9 is a view of the mounting location of a first thermic module provided in accordance with an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a heat sink according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of another heat sink according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of another heat sink according to an embodiment of the present invention;
fig. 13 is a side view of a second heat dissipation module according to an embodiment of the invention;
fig. 14 is a side view of a third heat dissipation module according to an embodiment of the invention;
fig. 15 is a side view of a fourth thermal module according to an embodiment of the present invention;
fig. 16 is a side view of a fifth heat dissipation module according to an embodiment of the invention;
fig. 17 is a side view of a sixth thermal module according to an embodiment of the present invention.
Wherein in FIGS. 1-17:
01. a heat-dissipating substrate; 02. a heat dissipating fin; 03. a wind scooper;
1. a heat dissipation module; 1-1, sealing plates; 1-2, first radiating fins; 1-3, a heat dissipation substrate; 1-3-1, a first heating device mounting position; 1-3-2, a second heating device mounting position; 1-4, a heat dissipation air duct; 1-5, a first fin assembly; 1-6, a second fin assembly; 1-7, second radiating fins; 1-8, third radiating fins;
2. a box body; 2-1, module installation positions;
3. a heat dissipation fan.
Detailed Description
The core of the invention is to provide a heat radiation module to improve the heat radiation efficiency of the heat radiation module. Another core of the present invention is to provide a heat sink including the heat dissipation module. It is a further core of the present invention to provide a power device comprising the above heat sink.
In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.
Please refer to fig. 5 to 17.
In one embodiment, a heat dissipation module according to an embodiment of the present invention includes a heat dissipation substrate 1-3 and a fin assembly. Specifically, the shape and thickness of the heat dissipation substrate 1-3 are determined according to actual needs, and the present application is not particularly limited.
The fin component comprises a radiating fin and a sealing plate, wherein the radiating fin comprises a first radiating fin 1-2 arranged on a radiating base plate 1-3 and a sealing plate 1-1 connected to one end, far away from the radiating base plate 1-3, of the first radiating fin 1-2 in a sealing mode, and a radiating air duct 1-4 is formed among the sealing plate 1-1, the first radiating fin 1-2 and the surface, facing the sealing plate 1-1, of the radiating base plate 1-3. Specifically, the sealing plate 1-1 may be connected to at least three first heat dissipation fins 1-2 at the same time.
In order to facilitate the assembly and disassembly of the heat dissipation module 1, preferably, the edges of the heat dissipation substrates 1 to 3 are provided with mounting holes, the number and size of the mounting holes are determined according to actual needs, and the present application is not particularly limited. Specifically, the heat dissipation substrates 1 to 3 perform heat dissipation, fastening and supporting functions.
Specific heat dissipation fins are mounted on the first surface of the heat dissipation substrate 1-3. The heat radiation fins function to increase the heat radiation surface area of the heat radiation module 1. In a specific embodiment, the heat dissipation air duct 1-4 is a strip-shaped channel arranged from the air inlet to the air outlet, that is, the heat dissipation fins are plate-shaped structures. Specifically, the heat dissipation fins may be of a flat plate type structure or a corrugated structure, and preferably, the front and rear front ends of the first heat dissipation fins 1-2 are connected to the air inlet and the air outlet of the heat dissipation module 1.
The sealing plate 1-1 is connected to one end, far away from the first surface, of the first radiating fin 1-2 in a sealing mode, a radiating air duct 1-4 is formed among the sealing plate 1-1, the first radiating fin 1-2 and the first surface, the sealing plate 1-1 mainly plays a role in restraining the flow direction of air, and meanwhile the sealing plate 1-1 has a function of increasing the radiating surface area of the radiating module 1. Wherein, shrouding 1-1 can be connected with the fin through modes such as bonding or welding.
As can be seen from the above description, in the heat dissipation module provided in the embodiment of the present application, the sealing plate 1-1 is disposed at the end of the first heat dissipation fin 1-2, so that the air flows in the heat dissipation air duct 1-4 according to the predetermined path, and the accumulation of the air in the heat dissipation module 1 is reduced, so that the heat dissipation efficiency of the heat dissipation module 1 provided in the present application is improved.
In order to reduce the assembly efficiency of the heat dissipation module 1, the heat dissipation module 1 is preferably an integrally molded structure. Preferably, the heat dissipation module 1 is processed by a profile extrusion molding process. As shown in fig. 5. The integrated into one piece need not the fastener, simple structure. And because the heat dissipation module 1 is integrated into a part, the cost is low, and the heat exchange area of the radiator is increased through the sealing plate 1-1.
The integrally formed heat dissipation module 1 is provided with the air duct, so that the integral integration level is high, and the manufacturing cost is reduced; on the other hand, because an additional air duct does not need to be assembled, the assembly efficiency of the heat dissipation module 1 is improved.
Meanwhile, as the heat dissipation module 1 is integrally formed, that is, the material of the sealing plate 1-1 is the same as that of the heat dissipation fins, the sealing plate 1-1 also has a heat conduction function, so that the heat exchange area of the heat dissipation module 1 is increased, and the heat dissipation efficiency of the heat dissipation module 1 is further improved.
In order to further improve the heat dissipation effect, preferably, the front and rear ends of the sealing plate 1-1 extend to the front and rear ends of the heat dissipation fins 1-2 along the airflow direction, the left and right ends of the sealing plate 1-1 extend to the first heat dissipation fins 1-2 on the left and right edges of the fin assembly, that is, the left and right ends of the sealing plate 1-1 are respectively connected with the first heat dissipation fins 1-2 on the edges. Specifically, as shown in fig. 7, 16 and 17, the downward projection of the sealing plate 1-1 coincides with the projection of the first edge heat dissipation fin 1-2.
As shown in fig. 14 and 15, in another embodiment, there may be a plurality of sealing plates 1-1, and the sealing plates 1-1 are arranged in sequence along the direction perpendicular to the thickness direction of the first heat dissipating fins 1-2, and all the sealing plates 1-1 have equal or unequal lengths along the direction perpendicular to the thickness direction of the first heat dissipating fins 1-2. Specifically, the same sealing plate 1-1 can be connected with three, four or at least five first heat dissipation fins 1-2 of the sealing plate 1-1.
As shown in fig. 15, in one embodiment, the heat dissipating fins further include at least one second heat dissipating fin 1-7 mounted on the heat dissipating base plate 1-3, the second heat dissipating fin 1-7 is located in the heat dissipating air duct 1-4, and the free end is isolated from the sealing plate 1-1. The free ends of the second radiating fins 1-7 are isolated from the sealing plate 1-1, so that the cross-sectional area of the radiating air duct 1-4 is increased. Specifically, the number of the second heat dissipation fins 1-7 arranged in the heat dissipation air duct 1-4 formed by each sealing plate 1-1 may be the same or different.
As shown in fig. 13 to 15, the heat dissipation fins further include at least one third heat dissipation fin 1-8 mounted on the heat dissipation substrate 1-3 and located outside the heat dissipation air duct. Specifically, the first radiating fins 1-2, the second radiating fins 1-7 and the third radiating fins 1-8 are arranged along the direction perpendicular to the thickness direction of the first radiating fins 1-2. The thicknesses of the first radiating fins 1-2, the second radiating fins 1-7 and the third radiating fins 1-8 may be the same or different.
On the basis of the above schemes, the heat dissipation substrate 1-3 is provided with a heating device mounting position, specifically, the heating device mounting position may be a flat plate or a groove structure arranged on the heat dissipation substrate 1-3, and the shape of the heating device mounting position is determined according to the mounting of the heating device, which is not specifically limited in the present application.
Specifically, the heating device mounting position and the fin assembly are located on the same surface of the heat dissipation substrate 1-3. For example, the heat generating device mounting position and the fin assembly are both located on the upper surface or the lower surface of the heat dissipating substrates 1 to 3.
Or the heating device mounting position and the fin component are positioned on two surfaces of the heat dissipation base plates 1-3 which are arranged oppositely. As shown in fig. 6, the lower surface of the heat dissipation substrate 1-3 may be provided with a heat generating device mounting location, specifically, the heat generating device mounting location is arranged opposite to the fin assembly.
In another embodiment, two surfaces of the heat dissipation substrate 1-3, which are arranged opposite to each other, are a first surface and a second surface, the multiple fin assemblies are a first fin assembly 1-5 arranged on the first surface and a second fin assembly 1-6 arranged on the second surface, respectively, at least one of the first fin assembly 1-5 and the second fin assembly 1-6 is provided, and the multiple heat generating device mounting locations are a first heat generating device mounting location 1-3-1 arranged on the first surface and a second heat generating device mounting location 1-3-2 arranged on the second surface, respectively.
Specifically, the number of the first fin assemblies 1 to 5 and the number of the second fin assemblies may be one or at least two, and when the number of the first fin assemblies 1 to 5 is plural, the first fin assemblies 1 to 5 may be arranged in an array. When the second fin assembly 1-6 is plural, the second fin assembly 1-6 may be arranged in an array.
The number of the first heating device mounting positions 1-3-1 and the number of the second heating device mounting positions 1-3-2 may be one or at least two, and the first heating device mounting positions 1-3-1 and the second heating device mounting positions 1-3-2 are not specifically determined according to the specific and unknown needs of the heating devices, and the application is not specifically limited.
As shown in fig. 16, the first fin assembly 1-5 and the second fin assembly 1-6 are arranged in a back-to-back manner, and the first heat generating device mounting location 1-3-1 and the second heat generating device mounting location 1-3-2 are arranged in a back-to-back manner. When the heat dissipation device works, the heat of the first heating device installation position 1-3-1 and the heat of the second heating device installation position 1-3-2 are transferred to the first fin component 1-5 and the second fin component 1-6 for heat dissipation.
As shown in fig. 17, the first fin assembly 1-5 and the second heat generating device are arranged in a back-to-back manner, and the second fin assembly 1-6 and the first heat generating device mounting site 1-3-1 are arranged in a back-to-back manner. When the heat dissipation device works, the heat of the second heating device is mainly dissipated through the first fin assemblies 1-5, and the heat of the first heating device installation positions 1-3-1 is mainly dissipated through the second fin assemblies 1-6.
In another embodiment, at least one first fin assembly 1-5 is disposed opposite to a second fin assembly 1-6, while at least one first fin assembly 1-5 is disposed opposite to a second heat generating device. Namely, the first fin assemblies 1-5 are respectively arranged back to back with the second fin assemblies 1-6 and the second heating device, so that the selectivity of the installation position of the heating device is improved. The shape of each group of the first fin assemblies 1-5 and each group of the second fin assemblies 1-6 is determined according to actual needs, and the application is not particularly limited.
The application provides a radiator, including box 2 and install heat dissipation module 1 on box 2, wherein heat dissipation module 1 is any kind of heat dissipation module 1 above-mentioned. The foregoing describes a specific structure of the heat dissipation module 1, and the present application includes the heat dissipation module 1, which also has the above technical effects. Wherein, the second surface of the heat dissipation substrate 1-3, which is arranged opposite to the first surface, is attached to the box body 2.
As shown in fig. 10, the bottom end of the heat-dissipating air duct 1-4 enters the heat-dissipating module 1, and the air outlet of the heat-dissipating air duct 1-4 is located at the top end of the heat-dissipating module 1. When the radiator heats, the radiating air duct 1-4 between the two radiating fins 1-2 forms a pipeline with a closed side part, so that a chimney effect is formed, air is sucked from the bottom end and exhausted from the top end, and the radiating fan 3 does not need to be arranged at the moment.
In a specific embodiment, the heat sink further comprises a heat dissipation fan 3. The heat dissipation fan 3 may be fixed on the case 2 or the heat dissipation module 1, and specifically may be fixed on the case 2 or the substrate or the sealing plate 1-1 through an adaptor. Specifically, the box body 2 is provided with a module mounting position 2-1 for mounting the heat dissipation module 1, and the specific module mounting position 2-1 can be a groove body structure matched with the outer wall of the heat dissipation module 1.
In order to improve the heat dissipation efficiency, it is preferable that the heat dissipation fans 3 are plural and arranged in sequence along the arrangement direction of the heat dissipation fins 1-2. Specifically, two, at least three, or the like may be provided for the radiator fan 3.
Specifically, the heat dissipation fan 3 is located at an air inlet end of the heat dissipation air duct 1-4, as shown in fig. 12, the heat dissipation fan 3 sucks air and blows the air to the heat dissipation module.
When the heat dissipation fan 3 is located at the air outlet end of the heat dissipation air duct 1-4. As shown in fig. 11, the heat radiation fan 3 sucks hot air of the heat radiation module (the surface temperature of the heat radiation module is higher than the air temperature) and blows the hot air to the air.
In order to further improve the heat dissipation efficiency, preferably, a plurality of heat dissipation fans 3 are provided, and the air inlet ends of the heat dissipation air ducts 1 to 4 and the air outlet ends of the heat dissipation air ducts 1 to 4 are both provided with the heat dissipation fans 3.
The power equipment provided by the application comprises a heating module and a radiator used for radiating heat of the heating module, wherein the radiator is any one of the radiators. The foregoing describes a specific structure of the heat sink, and the present application includes the heat sink, which also has the above technical effects.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (19)
1. A heat dissipation module, comprising:
a heat dissipating substrate (1-3);
and the fin component comprises a heat radiating fin and a sealing plate, the heat radiating fin comprises a first heat radiating fin (1-2) arranged on the heat radiating base plate (1-3) and the sealing plate (1-1) which is connected to the first heat radiating fin (1-2) in a sealing manner and is far away from one end of the heat radiating base plate (1-3), and a heat radiating air duct (1-4) is formed among the sealing plate (1-1), the first heat radiating fin (1-2) and the surface of the heat radiating base plate (1-3) opposite to the sealing plate (1-1).
2. The heat dissipation module according to claim 1, characterized in that the heat dissipation module (1) is of an integrally formed structure.
3. The heat dissipation module of claim 2, wherein the heat dissipation module is profile extrusion.
4. The heat dissipating module according to claim 1, wherein the cover plate (1-1) is welded or bonded to the fins.
5. The heat dissipation module according to claim 1, wherein the front and rear ends of the sealing plate (1-1) extend to the front and rear ends of the first heat dissipation fin (1-2) in the air flow direction.
6. The heat dissipation module according to claim 1, wherein the left and right ends of the sealing plate (1-1) extend to the first heat dissipation fins (1-2) at the left and right side edges of the fin assembly;
or the sealing plates (1-1) are arranged in sequence along the direction perpendicular to the thickness direction of the first radiating fins (1-2), and the lengths of all the sealing plates (1-1) along the direction perpendicular to the thickness direction of the first radiating fins (1-2) are equal or unequal.
7. The heat dissipation module according to claim 6, wherein the heat dissipation fins further comprise at least one second heat dissipation fin (1-7) mounted on the heat dissipation substrate (1-3), the second heat dissipation fin (1-7) is located in the heat dissipation air duct (1-4), and the free end is isolated from the sealing plate (1-1).
8. The heat dissipation module according to claim 1, wherein the heat dissipation fins further comprise at least one third heat dissipation fin (1-8) mounted on the heat dissipation substrate (1-3) and located outside the heat dissipation air duct.
9. The heat dissipation module according to claim 1, wherein the heat dissipation air channels (1-4) are strip-shaped channels arranged from the air inlet to the air outlet.
10. The heat dissipation module according to any one of claims 1 to 9, wherein the heat dissipation substrate (1-3) is provided with a heat generating device mounting location;
the heating device mounting position and the fin component are positioned on the same surface of the heat dissipation substrate (1-3);
or the heating device mounting position and the fin assembly are positioned on two surfaces of the heat dissipation base plate (1-3) which are arranged oppositely.
11. The heat dissipation module of any of claims 1-9, the heat dissipation substrate (1-3) is provided with a heating device installation position, two surfaces of the heat dissipation substrate (1-3) which are arranged back to back are respectively a first surface and a second surface, the fin components are respectively a first fin component (1-5) arranged on the first surface and a second fin component (1-6) arranged on the second surface, the number of the first fin assemblies (1-5) and the number of the second fin assemblies (1-6) are at least one, and the plurality of heating device mounting positions are respectively a first heating device mounting position (1-3-1) arranged on the first surface and a second heating device mounting position (1-3-2) arranged on the second surface.
12. The heat dissipation module of claim 11, wherein:
the first fin assembly (1-5) and the second fin assembly (1-6) are arranged in a back-to-back manner, and the first heating device mounting position (1-3-1) and the second heating device mounting position (1-3-2) are arranged in a back-to-back manner;
or the first fin assembly (1-5) and the second heating device are arranged in a back way, and the second fin assembly (1-6) and the first heating device mounting position (1-3-1) are arranged in a back way;
or at least one first fin component (1-5) and the second fin component (1-6) are arranged oppositely, and at least one first fin component (1-5) and the second heat generating device are arranged oppositely.
13. A radiator comprising a tank and a radiator module (1) mounted on the tank, characterized in that the radiator module (1) is a radiator module (1) according to any one of claims 1 to 12.
14. A heat sink according to claim 13, wherein the air inlet of the heat dissipation air duct (1-4) is located at the bottom end of the heat dissipation module (1), and the air outlet of the heat dissipation air duct (1-4) is located at the top end of the heat dissipation module (1).
15. A heat sink according to claim 13, further comprising a heat dissipation fan (3).
16. The heat sink according to claim 15, wherein the heat dissipating fan (3) is plural and arranged in sequence along the arrangement direction of the heat dissipating fins (1-2).
17. A heat sink according to claim 15, wherein the heat dissipation fan (3) is located at the air inlet end of the heat dissipation air duct (1-4) or at the air outlet end of the heat dissipation air duct (1-4).
18. The heat sink as claimed in claim 15, wherein the number of the heat dissipation fans (3) is plural, and the heat dissipation fans (3) are disposed at the air inlet ends of the heat dissipation air ducts (1-4) and the air outlet ends of the heat dissipation air ducts (1-4).
19. A power device comprising a heat generating module and a heat sink for dissipating heat from the heat generating module, wherein the heat sink is the heat sink of any one of claims 13-18.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011450509.8A CN112739156A (en) | 2020-12-09 | 2020-12-09 | Heat dissipation module, radiator and power equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011450509.8A CN112739156A (en) | 2020-12-09 | 2020-12-09 | Heat dissipation module, radiator and power equipment |
Publications (1)
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| CN202011450509.8A Pending CN112739156A (en) | 2020-12-09 | 2020-12-09 | Heat dissipation module, radiator and power equipment |
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Cited By (1)
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|---|---|---|---|---|
| CN114980709A (en) * | 2022-07-28 | 2022-08-30 | 深圳市德兰明海科技有限公司 | Double-air-duct heat dissipation assembly and inverter using same |
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