US20140290841A1 - Method for manufacturing display panel - Google Patents
Method for manufacturing display panel Download PDFInfo
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- US20140290841A1 US20140290841A1 US14/197,159 US201414197159A US2014290841A1 US 20140290841 A1 US20140290841 A1 US 20140290841A1 US 201414197159 A US201414197159 A US 201414197159A US 2014290841 A1 US2014290841 A1 US 2014290841A1
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- group
- separation layer
- carrier
- glass substrate
- unsubstituted
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- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000000926 separation method Methods 0.000 claims abstract description 102
- 239000011521 glass Substances 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 230000005661 hydrophobic surface Effects 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 125000001165 hydrophobic group Chemical group 0.000 claims description 34
- 229910010272 inorganic material Inorganic materials 0.000 claims description 16
- 239000011147 inorganic material Substances 0.000 claims description 16
- 125000003700 epoxy group Chemical group 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 10
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims description 8
- 125000003358 C2-C20 alkenyl group Chemical group 0.000 claims description 8
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 6
- WXWYJCSIHQKADM-ZNAKCYKMSA-N (e)-n-[bis[[(e)-butan-2-ylideneamino]oxy]-ethenylsilyl]oxybutan-2-imine Chemical compound CC\C(C)=N\O[Si](O\N=C(/C)CC)(O\N=C(/C)CC)C=C WXWYJCSIHQKADM-ZNAKCYKMSA-N 0.000 claims description 3
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 claims description 3
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 claims description 3
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 claims description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 3
- 125000004423 acyloxy group Chemical group 0.000 claims description 3
- ZDOBWJOCPDIBRZ-UHFFFAOYSA-N chloromethyl(triethoxy)silane Chemical compound CCO[Si](CCl)(OCC)OCC ZDOBWJOCPDIBRZ-UHFFFAOYSA-N 0.000 claims description 3
- FPOSCXQHGOVVPD-UHFFFAOYSA-N chloromethyl(trimethoxy)silane Chemical compound CO[Si](CCl)(OC)OC FPOSCXQHGOVVPD-UHFFFAOYSA-N 0.000 claims description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 claims description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000006722 reduction reaction Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 96
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010790 dilution Methods 0.000 description 7
- 239000012895 dilution Substances 0.000 description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000011550 stock solution Substances 0.000 description 4
- -1 Fe and Cl Chemical class 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 2
- 125000006374 C2-C10 alkenyl group Chemical group 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- UTOOYTSPNREBCV-UHFFFAOYSA-N ethenyl-dimethoxy-prop-2-enoxysilane Chemical compound CO[Si](OC)(C=C)OCC=C UTOOYTSPNREBCV-UHFFFAOYSA-N 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Definitions
- the present invention relates to a method for manufacturing a display panel and, more particularly, to a method for manufacturing a display panel with a thin glass substrate.
- the thicknesses of glass substrates used for preparing display panels are reduced from 0.4 mm to 0.3 mm.
- the thin glass substrate with a thickness of 0.3 mm or less does not have enough rigidity. If display units are directly formed on the thin glass substrate to manufacture a display panel, the bending level of the thin glass substrate may exceed the enduring level of the current process for manufacturing the display panel, so that the thin glass substrate cannot be used in the current process.
- the thin glass substrate In order to apply the thin glass substrate into the current process, the thin glass substrate is laminated on a glass carrier having large thickness to increase the rigidity thereof, and it is separated from the glass carrier until the process is finished.
- —Si—O—Si— bonding may be generated between the glass carrier and the thin glass substrate under a high temperature process (>250° C.), and therefore it is hard to separate the thin glass substrate from the glass carrier when the process is completed.
- An object of the present invention is to provide a method for manufacturing a display panel, in order to fabricate a thin and lightweight display panel.
- the method for manufacturing the display panel comprises the following steps: (A) providing a carrier with a separation layer formed thereon, wherein the separation layer has a hydrophobic surface; (B) laminating a glass substrate on the hydrophobic surface of the separation layer to dispose the separation layer between the carrier and the glass substrate, wherein a thickness of the glass substrate is in a range from 0.1 mm to 0.3 mm; (C) forming a display unit on the glass substrate; and (D) separating the glass substrate from the hydrophobic surface of the separation layer.
- the hydrophobic surface of the separation layer has a water contacting angle in a range from 25° to 180°.
- a separation layer with a hydrophobic surface is used.
- a glass substrate with a thickness of 0.3 mm or less herein, also called as a thin glass substrate
- the bonding between the thin glass substrate and the carrier, which is formed during the high temperature process, can be prevented due to the disposition of the separation layer.
- the thin glass substrate is laminated on the separation layer through a vacuum pressing machine or a roller, so that the air therebetween can be removed and a pressure difference is thus formed between two sides of the thin glass substrate.
- the thin glass substrate can be firmly laminated on the carrier having the separation layer formed thereon due to atmospheric pressure and static electricity between the thin glass substrate and the separation layer. Since the thin glass substrate is laminated on the separation layer of the carrier through the atmospheric pressure and the electricity therebetween, it is easy to remove the obtained display panel from the carrier only by breaking the vacuum state between the thin glass substrate and the separation layer after the display units are respectively formed on the thin glass substrate, and there are no damages to the thin glass substrate as well as the there are no residues of the separation layer remained on the thin glass substrate.
- the material of the separation layer can be any material generally used in the art, as long as the material has good resistance to high temperature (>250° C.) and the obtained separation layer has hydrophobic functional groups modified thereon or exposed therefrom a surface thereof.
- the material for forming the separation layer has a resistance to a temperature of 600° C. or more.
- each of the hydrophobic group can be selected from a group consisting of a substituted or unsubstituted C 1-20 alkyl group, a substituted or unsubstituted C 2-20 alkenyl group, a substituted or unsubstituted C 1-20 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C 1-20 alkyl-acrylic group.
- each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C 1-10 alkyl group, a substituted or unsubstituted C 2-10 alkenyl group, a substituted or unsubstituted C 1-10 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C 1-10 alkyl-acrylic group.
- each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C 1-6 alkyl group, a substituted or unsubstituted C 2-6 alkenyl group, a substituted or unsubstituted C 1-6 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C 1-6 alkyl-acrylic group.
- each of the hydrophobic group is selected from a group consisting of a C 1-6 alkyl group, a C 2-6 alkenyl group, a C 1-6 alkyl-epoxy group, an epoxy group, and a C 1-6 alkyl-acrylic group.
- the hydrophobic group can be “substituted or unsubstituted”, which means that the alkyl group or the alkenyl group is substituted or unsubstituted with a functional group.
- the functional group for substituting hydrogen of the alkyl group or the alkenyl group preferably is a group to provide hydrophobicity, and the examples thereof comprise an epoxy group, a halogen such as Fe and Cl, a thiol group, a mercapto group, and an acyloxy group.
- the hydrophobic surface of the separation layer is the surface of a polymer layer modified with hydrophobic groups.
- the step (A) comprises the following steps: (A11) providing the carrier; (Al2) forming the polymer layer on the carrier; and (A13) modifying the surface of the polymer layer with the hydrophobic groups to form the hydrophobic surface.
- the exposed hydroxyl groups (—OH) of the carrier can be covered with the polymer layer, so that the bonding between the carrier and the sequential laminated thin glass substrate is not formed.
- the material of the polymer layer is not particularly limited, as long as it has the property of good resistance to the high temperature (>250 ° C.), and the example thereof comprises polyimide (PI).
- the separation layer is an organic-inorganic material layer with hydrophobic groups exposed from a surface thereof.
- the step (A) comprises the following steps: (A21) providing the carrier; (A22) forming the organic-inorganic material layer on the carrier, wherein the organic-inorganic material layer has hydrophobic groups and reacting groups, and the hydrophobic groups of the organic-inorganic material layer exposed from the surface of the organic-inorganic material layer to form the hydrophobic surface; and (A23) performing a reduction reaction to react the reacting groups in the organic-inorganic material layer with hydroxyl groups (—OH) of the carrier.
- the reacting groups of the organic-inorganic material layer can react with the exposed hydroxyl group of the carrier to form bonding (i.e. —Si—O—X—, wherein X can be Si, Ti or Al), and therefore no bonding is formed between the sequential laminated thin glass substrate and the carrier.
- the organic-inorganic material layer is made of a compound represented by the following formula (I):
- each of R 1 , R 2 and R 3 is independently a substituted or unsubstituted C 1-6 alkyl group;
- Y is selected from a group consisting of a substituted or unsubstituted C 1-20 alkyl group, a substituted or unsubstituted C 2-20 alkenyl group, a substituted or unsubstituted C 1-20 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C 1-20 alkyl-acrylic group; and
- X is Si, Ti or Al.
- Y is the aforementioned hydrophobic group.
- X preferably is Si.
- the organic-inorganic material layer can be made of a material selected from a group consisting of (3-glycidoxypropyl)trimethoxysilane, 3-chloropropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, chloromethyltriethoxysilane, chloromethyltrimethoxysilane, methacryloxypropyltrimethoxysilane, trifluoropropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris(2-methoxyethoxy)silane, and vinyltris(methylethylketoximino)silane.
- the glass substrate is laminated on the hydrophobic surface of the separation layer through a vacuum pressing machine or a roller (i.e. a rolling machine) in the step (B).
- a vacuum pressing machine or a roller i.e. a rolling machine
- the vacuum state between the separation layer of the carrier and the thin glass substrate with the display units formed thereon can be broken by using a steel pin and optionally along with an auxiliary plate.
- the step (D) may comprise the following steps: (D1) attaching an auxiliary plate on a side of the carrier opposite to a side thereof with the separation layer formed thereon; and (D2) separating the glass substrate from the carrier and the separation layer through the auxiliary plate to obtain the display panel.
- the auxiliary plate can be adhered to the side of the carrier opposite to a side thereof with the separation layer formed thereon through an adhesive layer. More specifically, the auxiliary plate can be a plate having an adhesive layer formed on one side thereof, and it can be directly adhered onto the carrier through the adhesive layer.
- the auxiliary plate is a thin plate, and an adhesive layer and the auxiliary plate are sequentially laminated on the carrier.
- the area of the auxiliary plate is larger than that of the carrier, so the glass substrate and the display units can be separated from the carrier and the separation layer more easily.
- the hydrophobic surface of the separation layer may have a water contacting angle in a range from 25° to 180°.
- the water contacting angle thereof is in a range from 45° to 90°.
- the thickness of the separation layer is not particularly limited, as long as it can prevent the reaction between the hydroxyl groups of the carrier and those of the glass substrate.
- the thickness of the separation layer can be in a range from 100 ⁇ to 2000 ⁇ .
- the thickness of the glass substrate used in the method of the present invention can be 0.3 mm or less.
- the thickness thereof is in a range from 0.1 mm to 0.3 mm.
- FIG. 1 is a perspective view showing a carrier, a separation layer and a glass substrate according to Embodiment 1 of the present invention
- FIG. 2 is a perspective view showing a reaction between a carrier and a separation layer according to Embodiment 1 of the present invention
- FIG. 3 is a perspective view showing a carrier, a separation layer and a glass substrate according to Embodiment 2 of the present invention.
- FIG. 4 is a perspective view showing a reaction of hydrophobic groups of a separation layer according Embodiment 2 of the present invention.
- FIGS. 5A-5I are cross-sectional views showing a process for manufacturing a display panel according to Embodiment 3 of the present invention.
- FIG. 1 is a perspective view showing a carrier, a separation layer and a glass substrate of the present embodiment
- FIG. 2 is a perspective view showing a reaction between a carrier and a separation layer.
- an ozone ashing process is performed to wash a carrier and a glass substrate before manufacturing a display panel.
- hydroxyl groups (—OH) are formed on surfaces of the carrier and the glass substrate. If the glass substrate with the hydroxyl groups is laminated on the carrier with the hydroxyl groups directly, the sequential high temperature process (>250° C.) may cause the hydroxyl groups of the carrier and the glass substrate to react with each other to form —Si—O—Si— bonding, and this bonding may cause the situation that the glass substrate cannot be separated from the carrier easily.
- a separation layer 12 is firstly formed on a carrier 11 after the carrier 11 is washed, and then a glass substrate 13 is laminated on the carrier 11 .
- the separation layer 12 has a hydrophobic surface 121 , which has a water contacting angle in a range from 25° to 180°.
- a cleaned carrier 11 is provided, wherein the carrier 11 is a glass carrier or a silicon substrate, and hydroxyl groups are exposed from a surface thereof, as shown in the left side of the reaction scheme of FIG. 2 .
- a separation layer 12 is formed on the carrier, which can be formed by any coating process generally used in the art, such as a dip coating process, a roll coating process, a printing process and a spin coating process.
- the compound represented by the following formula (I) can be used to form the separation layer 12 :
- each of R 1 , R 2 and R 3 is independently a substituted or unsubstituted C 1-6 alkyl group;
- X is Si, Ti or Al; and
- Y is a hydrophobic group such as a substituted or unsubstituted C 1-20 alkyl group, a substituted or unsubstituted C 2-20 alkenyl group, a substituted or unsubstituted C 1-20 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C 1-20 alkyl-acrylic group.
- each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C 1-10 alkyl group, a substituted or unsubstituted C 2-10 alkenyl group, a substituted or unsubstituted C 1-10 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C 1-10 alkyl-acrylic group.
- each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C 1-6 alkyl group, a substituted or unsubstituted C 2-6 alkenyl group, a substituted or unsubstituted C 1-6 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C 1-6 alkyl-acrylic group.
- each of the hydrophobic group is selected from a group consisting of a C 1-6 alkyl group, a C 2-6 alkenyl group, a C 1-6 alkyl-epoxy group, an epoxy group, and a C 1-6 alkyl-acrylic group.
- the hydrophobic group can be “substituted or unsubstituted”, which means that the alkyl group or the alkenyl group is substituted or unsubstituted with a functional group.
- the functional group for substituting hydrogen on the alkyl group or the alkenyl group preferably is preferably a group to provide hydrophobicity, and the examples thereof comprise an epoxy group, a halogen such as Fe and Cl, a thiol group, a mercapto group, and an acyloxy group.
- the compound of the formula (I) is a silane-based compound, such as (3-glycidoxypropyl)trimethoxysilane, 3-chloropropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, chloromethyltriethoxysilane, chloromethyltrimethoxysilane, methacryloxypropyltrimethoxysilane, trifluoropropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris(2-methoxyethoxy)silane, vinyltris(methylethylketoximino)silane.
- silane-based compound such as (3-glycidoxypropyl)trimethoxysilane, 3-chloropropyltriethoxysilane, 3-chloropropyltrimethoxy
- the compound of the formula (I) may undergo a hydrolysis process under an water-containing environment to form a compound represented by the following formula (II), which further self-condenses into a compound represented by the following formula (III):
- the hydroxyl groups formed from the compound of the formula (I) can be used as reactive functional groups to react with those of the carrier 11 after the hydrolysis and the self-condensation reaction thereof, as shown in the formula (III) as well as the middle and the left side of the reaction scheme of FIG. 2 . Then, parts or all of the hydroxyl groups are hydrolyzed and condensed to form —O— bonding, as shown in the right side of the reaction scheme of FIG. 2 .
- hydrophobic groups Y of the formula (I) cannot react with the carrier 11 , they are exposed from the surface of the separation layer 12 to form a hydrophobic surface 121 , as shown in FIG. 1 .
- the ratio of the exposed hydrophobic groups Y can be adjusted by modulating the dilution ratio of the compound of the formula (I) and the used solvent or selectively performing an irradiation process on the separation layer 12 to break the bonding between the groups X and the hydrophobic groups Y, to control the hydrophobicity (i.e. water contacting angle) of the hydrophobic surface 121 and facilitate the sequential separation process between the separation layer 12 and the glass substrate 13 .
- the carrier 11 with the separation layer 12 formed thereon can be obtained, wherein the separation layer 12 has a hydrophobic surface 121 formed by the hydrophobic groups Y exposed therefrom, as shown in FIG. 1 .
- FIG. 3 is a perspective view showing a carrier, a separation layer and a glass substrate of the present embodiment
- FIG. 4 is a perspective view showing a reaction of hydrophobic groups of a separation layer.
- Embodiment 1 The structure and the process of the present embodiment are the same as those described in Embodiment 1, except that the compound of the formula (I) in Embodiment 1 is replaced with a polymer to form the separation layer 12 of the present embodiment.
- the material of the separation layer 12 of the present embodiment and the process for preparing the same are described in detail.
- a separation layer 12 is formed on a carrier 11 through the same process used in Embodiment 1 to cover the exposed hydroxyl groups of the carrier 11 , as shown in FIG. 3 and the left side of the reaction scheme of FIG. 4 .
- the separation layer 12 is a polymer layer.
- any surface treatment generally used in the art is performed on the separation layer 12 to modify a surface thereof, wherein specific examples of the surface treatment comprises ionized gas treatment, UV irradiation, or wet chemical treatment.
- the surface of the separation layer 12 is modified with amino groups (—NH 2 ) through the wet chemical treatment.
- the amino group-containing surface of the separation layer 12 is further modified with hydrophobic groups (such as a substituted or unsubstituted C 1-20 alkyl group, a substituted or unsubstituted C 2-20 alkenyl group, a substituted or unsubstituted C 1-20 alkyl-epoxy group, an epoxy group, or a substituted or unsubstituted C 1-20 alkyl-acrylic group) through a further wet chemical treatment, and therefore the separation layer 12 has a hydrophobic surface 121 formed by the hydrophobic groups Y exposed therefrom, as shown in FIG. 3 .
- the separation layer 12 is modified with C 8 -alkyl groups as the hydrophobic groups Y, as shown in FIG. 3 and the right side of the reaction scheme of FIG. 4 .
- the carrier 11 with the separation layer 12 formed thereon can be obtained, wherein the separation layer 12 has a hydrophobic surface 121 formed by the hydrophobic groups Y exposed therefrom, as shown in FIG. 3 .
- FIGS. 5A-5I are cross-sectional views showing a process for manufacturing a display panel in the present embodiment.
- a carrier 11 with a separation layer 12 formed thereon wherein the separation layer 12 has a hydrophobic surface with a water contacting angle in a range from 25° to 180°, and the carrier 11 is a glass carrier or a silicon substrate.
- the thickness of the separation layer 12 is not particularly limited, as long as it can completely cover the hydroxyl groups of the carrier 11 . Preferably, it is in a range from 100 ⁇ to 2000 ⁇ .
- the separation 12 can be one of the separation layer described in Embodiment 1 or Embodiment 2, so the structure and the material thereof are not described in detail herein.
- a glass substrate 13 is laminated on the hydrophobic surface 121 (as shown in FIG. 5A ) of the separation layer 12 to allow the separation layer 12 to be disposed between the carrier 11 and the glass substrate 13 .
- the thickness of the glass substrate 13 is 0.3 mm or less.
- the thickness thereof is in a range from 0.1 mm to 0.3 mm.
- the glass substrate 13 can be laminated on the separation layer 12 with a pressing unit 22 in a vacuum chamber 21 , and this process is the so-called vacuum pressing process.
- the glass substrate 13 is laminated on the separation layer 12 with a roller 3 to remove air therebetween, and this process is the so-called roll laminating process.
- the air between the glass substrate 13 and the separation layer 12 is removed to form a pressure difference between two sides of the glass substrate 13 . Therefore, the glass substrate 13 can be firmly laminated on the carrier 12 via atmospheric pressure and static electricity between the glass substrate 13 and the separation layer 12 .
- a display unit 14 is formed on the glass substrate 13 through the conventional process used in the art.
- the display unit 14 may comprise any active unit or passive unit generally used in the display field of the related art, such as a thin-film transistor, a color filter, an organic light emitting diode and a touch panel.
- the structure of each display unit is known by persons skilled in the art and not described in detail herein.
- the glass substrate 13 with the display unit 14 formed thereon is assembled with a module 15 , which may be another glass substrate or comprise any active unit or passive unit generally used in the display field of the related art, such as a thin-film transistor, a color filter, an organic light emitting diode and a touch panel.
- a module 15 which may be another glass substrate or comprise any active unit or passive unit generally used in the display field of the related art, such as a thin-film transistor, a color filter, an organic light emitting diode and a touch panel.
- the types of the module 15 and the display unit 14 can be selected based on the designs and the manufacturing processes, as long as a display panel can be obtained after assembly.
- an auxiliary plate 41 is attached on a side of the carrier 11 opposite to a side thereof with the separation layer 12 formed thereon.
- the auxiliary plate 41 can be a plate having an adhesive layer (not shown in the figure) formed on one side thereof, and it can be directly adhered onto the another of the carrier 11 opposite to the side thereof with the separation layer 12 formed thereon through the adhesive layer.
- the auxiliary plate 41 is a thin plate, and an adhesive layer 42 and the auxiliary plate 41 are sequentially laminated onto another side of the carrier 11 opposite to the side thereof with the separation layer 12 formed thereon.
- the auxiliary plate 41 is not particularly limited, and can be a metal plate, a plastic plate or a plate made of other material.
- the material of the adhesive layer 42 is also not particularly limited, as long as it can provide the adhesive property.
- the material of the adhesive layer 42 can be UV gel or foaming gel.
- the area of the auxiliary plate 41 is larger than that of the carrier 11 , to facilitate the separation of the display panel from the carrier 11 .
- FIG. 5E the sequential process is demonstrated according to the aspect shown in FIG. 5E .
- a scraper 5 such as a steel pin is inserted between the glass substrate 13 and the separation layer 12 to break the vacuum state therebetween.
- FIG. 5G the glass substrate 13 and the display unit 14 are separated from the carrier 11 and the separation layer 12 with the auxiliary plate 14 , to obtain the display panel of the present embodiment, as shown in FIG. 5H .
- the display panel is separated from the carrier 11 with the auxiliary plate 41 .
- the vacuum state between the glass substrate 13 and the separation layer 12 is broken, the pressure difference therebetween is eliminated; and therefore the display panel can be directly separated from the carrier without using the auxiliary plate 41 .
- an UV irradiation or a heating process may be selectively performed on the auxiliary plate 41 to separate the same from the carrier 11 to recycle the carrier 11 .
- the method for manufacturing the display panel of the present embodiment can be applied to various display panels, such as liquid crystal display panels (LCDs) or organic light emitting diode display panels (OLEDs).
- the obtained display panels can further be applied to various electronic devices, such as cell phones, notebooks, video cameras, cameras, music players, navigation devices, and televisions.
- the separation layer has a hydrophobic surface having a water contacting angle in a range from 25° to 180° when the silane compounds having hydrophobic groups are used to prepare the separation layer. If an ideal hydrophobicity is required, the material, which can form a separation layer with a hydrophobic surface having a water contacting angle in a range from 45° to 90°, can be selected.
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Abstract
The present invention provides a method for manufacturing a display panel, comprising the following steps: (A) providing a carrier with a separation layer formed thereon; (B) laminating a glass substrate on the hydrophobic surface of the separation layer to make the separation layer between the carrier and the glass substrate; (C) forming a display unit on the glass substrate; and (D) separating the glass substrate from the carrier and the separation layer to obtain a display panel; wherein the separation layer has a hydrophobic surface with a water contacting angle in a range from 25° to 180°.
Description
- This application claims the benefits of the Taiwan Patent Application Serial Number 102110627, filed on Mar. 26, 2013, the subject matter of which is incorporated herein by reference.
- 1. Field of the Invention
- The present invention relates to a method for manufacturing a display panel and, more particularly, to a method for manufacturing a display panel with a thin glass substrate.
- 2. Description of Related Art
- With the rapid development of electronic industry, electronic products are trending towards miniaturization and lightweight. Hence, the thicknesses of glass substrates used for preparing display panels are reduced from 0.4 mm to 0.3 mm.
- However, the thin glass substrate with a thickness of 0.3 mm or less does not have enough rigidity. If display units are directly formed on the thin glass substrate to manufacture a display panel, the bending level of the thin glass substrate may exceed the enduring level of the current process for manufacturing the display panel, so that the thin glass substrate cannot be used in the current process.
- In order to apply the thin glass substrate into the current process, the thin glass substrate is laminated on a glass carrier having large thickness to increase the rigidity thereof, and it is separated from the glass carrier until the process is finished. However, —Si—O—Si— bonding may be generated between the glass carrier and the thin glass substrate under a high temperature process (>250° C.), and therefore it is hard to separate the thin glass substrate from the glass carrier when the process is completed.
- In order to solve the problem of forming the —Si—O—Si— bonding between the glass carrier and the thin glass substrate, another means is to adhere the glass carrier and the thin glass substrate with an adhesive. However, conventional adhesive has poor heat resistance, and the problems of excessive glue and bubbles may also be occurred in the adhesive. Additionally, the adhesive property of the adhesive may cause the problems that it is hardly to separate the thin glass substrate from the glass carrier, or the residue adhesive may remain on the glass carrier after separation; so that the recycle of the glass carrier is not ideal enough.
- Therefore, it is desirable to provide a novel method for manufacturing a display panel, which can solve the aforementioned problems and allow thin glass substrates suitable for the current process.
- An object of the present invention is to provide a method for manufacturing a display panel, in order to fabricate a thin and lightweight display panel.
- To achieve the object, the method for manufacturing the display panel comprises the following steps: (A) providing a carrier with a separation layer formed thereon, wherein the separation layer has a hydrophobic surface; (B) laminating a glass substrate on the hydrophobic surface of the separation layer to dispose the separation layer between the carrier and the glass substrate, wherein a thickness of the glass substrate is in a range from 0.1 mm to 0.3 mm; (C) forming a display unit on the glass substrate; and (D) separating the glass substrate from the hydrophobic surface of the separation layer. Herein, the hydrophobic surface of the separation layer has a water contacting angle in a range from 25° to 180°.
- In the method for manufacturing the display panel of the present invention, a separation layer with a hydrophobic surface is used. In the case that a glass substrate with a thickness of 0.3 mm or less (herein, also called as a thin glass substrate) is laminated on the carrier, the bonding between the thin glass substrate and the carrier, which is formed during the high temperature process, can be prevented due to the disposition of the separation layer. Meanwhile, in the method for manufacturing the display panel of the present invention, the thin glass substrate is laminated on the separation layer through a vacuum pressing machine or a roller, so that the air therebetween can be removed and a pressure difference is thus formed between two sides of the thin glass substrate. Hence, the thin glass substrate can be firmly laminated on the carrier having the separation layer formed thereon due to atmospheric pressure and static electricity between the thin glass substrate and the separation layer. Since the thin glass substrate is laminated on the separation layer of the carrier through the atmospheric pressure and the electricity therebetween, it is easy to remove the obtained display panel from the carrier only by breaking the vacuum state between the thin glass substrate and the separation layer after the display units are respectively formed on the thin glass substrate, and there are no damages to the thin glass substrate as well as the there are no residues of the separation layer remained on the thin glass substrate.
- In the method for manufacturing the display panel of the present invention, the material of the separation layer can be any material generally used in the art, as long as the material has good resistance to high temperature (>250° C.) and the obtained separation layer has hydrophobic functional groups modified thereon or exposed therefrom a surface thereof. Preferably, the material for forming the separation layer has a resistance to a temperature of 600° C. or more. In addition, each of the hydrophobic group can be selected from a group consisting of a substituted or unsubstituted C1-20 alkyl group, a substituted or unsubstituted C2-20 alkenyl group, a substituted or unsubstituted C1-20 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-20 alkyl-acrylic group. Preferably, each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C1-10 alkyl group, a substituted or unsubstituted C2-10 alkenyl group, a substituted or unsubstituted C1-10 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-10 alkyl-acrylic group. More preferably, each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C1-6 alkyl group, a substituted or unsubstituted C2-6 alkenyl group, a substituted or unsubstituted C1-6 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-6 alkyl-acrylic group. Most preferably, each of the hydrophobic group is selected from a group consisting of a C1-6 alkyl group, a C2-6 alkenyl group, a C1-6 alkyl-epoxy group, an epoxy group, and a C1-6 alkyl-acrylic group. Herein, the hydrophobic group can be “substituted or unsubstituted”, which means that the alkyl group or the alkenyl group is substituted or unsubstituted with a functional group. Herein, the functional group for substituting hydrogen of the alkyl group or the alkenyl group preferably is a group to provide hydrophobicity, and the examples thereof comprise an epoxy group, a halogen such as Fe and Cl, a thiol group, a mercapto group, and an acyloxy group.
- In one aspect of the present invention, the hydrophobic surface of the separation layer is the surface of a polymer layer modified with hydrophobic groups. In this case, the step (A) comprises the following steps: (A11) providing the carrier; (Al2) forming the polymer layer on the carrier; and (A13) modifying the surface of the polymer layer with the hydrophobic groups to form the hydrophobic surface. After the aforementioned steps, the exposed hydroxyl groups (—OH) of the carrier can be covered with the polymer layer, so that the bonding between the carrier and the sequential laminated thin glass substrate is not formed. Herein, the material of the polymer layer is not particularly limited, as long as it has the property of good resistance to the high temperature (>250 ° C.), and the example thereof comprises polyimide (PI).
- In another aspect of the present invention, the separation layer is an organic-inorganic material layer with hydrophobic groups exposed from a surface thereof. In this case, the step (A) comprises the following steps: (A21) providing the carrier; (A22) forming the organic-inorganic material layer on the carrier, wherein the organic-inorganic material layer has hydrophobic groups and reacting groups, and the hydrophobic groups of the organic-inorganic material layer exposed from the surface of the organic-inorganic material layer to form the hydrophobic surface; and (A23) performing a reduction reaction to react the reacting groups in the organic-inorganic material layer with hydroxyl groups (—OH) of the carrier. After the aforementioned steps, the reacting groups of the organic-inorganic material layer can react with the exposed hydroxyl group of the carrier to form bonding (i.e. —Si—O—X—, wherein X can be Si, Ti or Al), and therefore no bonding is formed between the sequential laminated thin glass substrate and the carrier.
- Herein, the organic-inorganic material layer is made of a compound represented by the following formula (I):
- wherein each of R1, R2 and R3 is independently a substituted or unsubstituted C1-6 alkyl group; Y is selected from a group consisting of a substituted or unsubstituted C1-20 alkyl group, a substituted or unsubstituted C2-20 alkenyl group, a substituted or unsubstituted C1-20 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-20 alkyl-acrylic group; and X is Si, Ti or Al. Herein, Y is the aforementioned hydrophobic group. In addition, X preferably is Si.
- In this aspect, the organic-inorganic material layer can be made of a material selected from a group consisting of (3-glycidoxypropyl)trimethoxysilane, 3-chloropropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, chloromethyltriethoxysilane, chloromethyltrimethoxysilane, methacryloxypropyltrimethoxysilane, trifluoropropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris(2-methoxyethoxy)silane, and vinyltris(methylethylketoximino)silane.
- In the method for manufacturing the display panel of the present invention, the glass substrate is laminated on the hydrophobic surface of the separation layer through a vacuum pressing machine or a roller (i.e. a rolling machine) in the step (B). In addition, in the step (D), the vacuum state between the separation layer of the carrier and the thin glass substrate with the display units formed thereon can be broken by using a steel pin and optionally along with an auxiliary plate. More specifically, when the thin glass substrate with the display units formed thereon is separated from the carrier and the separation layer, the step (D) may comprise the following steps: (D1) attaching an auxiliary plate on a side of the carrier opposite to a side thereof with the separation layer formed thereon; and (D2) separating the glass substrate from the carrier and the separation layer through the auxiliary plate to obtain the display panel. Herein, the auxiliary plate can be adhered to the side of the carrier opposite to a side thereof with the separation layer formed thereon through an adhesive layer. More specifically, the auxiliary plate can be a plate having an adhesive layer formed on one side thereof, and it can be directly adhered onto the carrier through the adhesive layer. Alternatively, the auxiliary plate is a thin plate, and an adhesive layer and the auxiliary plate are sequentially laminated on the carrier. Preferably, the area of the auxiliary plate is larger than that of the carrier, so the glass substrate and the display units can be separated from the carrier and the separation layer more easily.
- In the method for manufacturing the display panel of the present invention, the hydrophobic surface of the separation layer may have a water contacting angle in a range from 25° to 180°. Preferably, the water contacting angle thereof is in a range from 45° to 90°.
- In addition, in the method for manufacturing the display panel of the present invention, the thickness of the separation layer is not particularly limited, as long as it can prevent the reaction between the hydroxyl groups of the carrier and those of the glass substrate. For example, the thickness of the separation layer can be in a range from 100 Å to 2000 Å.
- Furthermore, the thickness of the glass substrate used in the method of the present invention can be 0.3 mm or less. Preferably, the thickness thereof is in a range from 0.1 mm to 0.3 mm.
- Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
-
FIG. 1 is a perspective view showing a carrier, a separation layer and a glass substrate according to Embodiment 1 of the present invention; -
FIG. 2 is a perspective view showing a reaction between a carrier and a separation layer according to Embodiment 1 of the present invention; -
FIG. 3 is a perspective view showing a carrier, a separation layer and a glass substrate according toEmbodiment 2 of the present invention; -
FIG. 4 is a perspective view showing a reaction of hydrophobic groups of a separationlayer according Embodiment 2 of the present invention; and -
FIGS. 5A-5I are cross-sectional views showing a process for manufacturing a display panel according toEmbodiment 3 of the present invention. - The present invention has been described in an illustrative manner, and it is to be understood that the terminology used is intended to be in the nature of description rather than of limitation. Many modifications and variations of the present invention are possible in light of the above teachings. Therefore, it is to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described.
- Please refer to
FIG. 1 andFIG. 2 , whereinFIG. 1 is a perspective view showing a carrier, a separation layer and a glass substrate of the present embodiment, andFIG. 2 is a perspective view showing a reaction between a carrier and a separation layer. - In the conventional process for manufacturing a display panel, an ozone ashing process is performed to wash a carrier and a glass substrate before manufacturing a display panel. After the ozone ashing process, hydroxyl groups (—OH) are formed on surfaces of the carrier and the glass substrate. If the glass substrate with the hydroxyl groups is laminated on the carrier with the hydroxyl groups directly, the sequential high temperature process (>250° C.) may cause the hydroxyl groups of the carrier and the glass substrate to react with each other to form —Si—O—Si— bonding, and this bonding may cause the situation that the glass substrate cannot be separated from the carrier easily.
- In order to solve the aforementioned problem, as shown in
FIG. 1 , aseparation layer 12 is firstly formed on acarrier 11 after thecarrier 11 is washed, and then aglass substrate 13 is laminated on thecarrier 11. Herein, theseparation layer 12 has ahydrophobic surface 121, which has a water contacting angle in a range from 25° to 180°. - Hereinafter, the material of the
separation layer 12 and the process for preparing the same are described in detail. - Please refer to
FIG. 1 andFIG. 2 . First, a cleanedcarrier 11 is provided, wherein thecarrier 11 is a glass carrier or a silicon substrate, and hydroxyl groups are exposed from a surface thereof, as shown in the left side of the reaction scheme ofFIG. 2 . Next, aseparation layer 12 is formed on the carrier, which can be formed by any coating process generally used in the art, such as a dip coating process, a roll coating process, a printing process and a spin coating process. - In the present embodiment, the compound represented by the following formula (I) can be used to form the separation layer 12:
- wherein each of R1, R2 and R3 is independently a substituted or unsubstituted C1-6 alkyl group; X is Si, Ti or Al; and Y is a hydrophobic group such as a substituted or unsubstituted C1-20 alkyl group, a substituted or unsubstituted C2-20 alkenyl group, a substituted or unsubstituted C1-20 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-20 alkyl-acrylic group. Preferably, each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C1-10 alkyl group, a substituted or unsubstituted C2-10 alkenyl group, a substituted or unsubstituted C1-10 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-10 alkyl-acrylic group. More preferably, each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C1-6 alkyl group, a substituted or unsubstituted C2-6 alkenyl group, a substituted or unsubstituted C1-6 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-6 alkyl-acrylic group. Most preferably, each of the hydrophobic group is selected from a group consisting of a C1-6 alkyl group, a C2-6 alkenyl group, a C1-6 alkyl-epoxy group, an epoxy group, and a C1-6 alkyl-acrylic group. Herein, the hydrophobic group can be “substituted or unsubstituted”, which means that the alkyl group or the alkenyl group is substituted or unsubstituted with a functional group. Herein, the functional group for substituting hydrogen on the alkyl group or the alkenyl group preferably is preferably a group to provide hydrophobicity, and the examples thereof comprise an epoxy group, a halogen such as Fe and Cl, a thiol group, a mercapto group, and an acyloxy group.
- Preferably, the compound of the formula (I) is a silane-based compound, such as (3-glycidoxypropyl)trimethoxysilane, 3-chloropropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, chloromethyltriethoxysilane, chloromethyltrimethoxysilane, methacryloxypropyltrimethoxysilane, trifluoropropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris(2-methoxyethoxy)silane, vinyltris(methylethylketoximino)silane.
- The compound of the formula (I) may undergo a hydrolysis process under an water-containing environment to form a compound represented by the following formula (II), which further self-condenses into a compound represented by the following formula (III):
- Hence, when the
carrier 11 is coated with the compound of the formula (I), the hydroxyl groups formed from the compound of the formula (I) can be used as reactive functional groups to react with those of thecarrier 11 after the hydrolysis and the self-condensation reaction thereof, as shown in the formula (III) as well as the middle and the left side of the reaction scheme ofFIG. 2 . Then, parts or all of the hydroxyl groups are hydrolyzed and condensed to form —O— bonding, as shown in the right side of the reaction scheme ofFIG. 2 . - Since the hydrophobic groups Y of the formula (I) cannot react with the
carrier 11, they are exposed from the surface of theseparation layer 12 to form ahydrophobic surface 121, as shown inFIG. 1 . - In addition, since the hydrophobicity is related to the adhesion between the
separation layer 12 and theglass substrate 13, the ratio of the exposed hydrophobic groups Y can be adjusted by modulating the dilution ratio of the compound of the formula (I) and the used solvent or selectively performing an irradiation process on theseparation layer 12 to break the bonding between the groups X and the hydrophobic groups Y, to control the hydrophobicity (i.e. water contacting angle) of thehydrophobic surface 121 and facilitate the sequential separation process between theseparation layer 12 and theglass substrate 13. - After the aforementioned process, the
carrier 11 with theseparation layer 12 formed thereon can be obtained, wherein theseparation layer 12 has ahydrophobic surface 121 formed by the hydrophobic groups Y exposed therefrom, as shown inFIG. 1 . - Please refer to
FIG. 3 andFIG. 4 , whereinFIG. 3 is a perspective view showing a carrier, a separation layer and a glass substrate of the present embodiment, andFIG. 4 is a perspective view showing a reaction of hydrophobic groups of a separation layer. - The structure and the process of the present embodiment are the same as those described in Embodiment 1, except that the compound of the formula (I) in Embodiment 1 is replaced with a polymer to form the
separation layer 12 of the present embodiment. Hereinafter, the material of theseparation layer 12 of the present embodiment and the process for preparing the same are described in detail. - First, a
separation layer 12 is formed on acarrier 11 through the same process used in Embodiment 1 to cover the exposed hydroxyl groups of thecarrier 11, as shown inFIG. 3 and the left side of the reaction scheme ofFIG. 4 . Herein, theseparation layer 12 is a polymer layer. Next, any surface treatment generally used in the art is performed on theseparation layer 12 to modify a surface thereof, wherein specific examples of the surface treatment comprises ionized gas treatment, UV irradiation, or wet chemical treatment. In the present embodiment, the surface of theseparation layer 12 is modified with amino groups (—NH2) through the wet chemical treatment. Then, the amino group-containing surface of theseparation layer 12 is further modified with hydrophobic groups (such as a substituted or unsubstituted C1-20 alkyl group, a substituted or unsubstituted C2-20 alkenyl group, a substituted or unsubstituted C1-20 alkyl-epoxy group, an epoxy group, or a substituted or unsubstituted C1-20 alkyl-acrylic group) through a further wet chemical treatment, and therefore theseparation layer 12 has ahydrophobic surface 121 formed by the hydrophobic groups Y exposed therefrom, as shown inFIG. 3 . In the present embodiment, theseparation layer 12 is modified with C8-alkyl groups as the hydrophobic groups Y, as shown inFIG. 3 and the right side of the reaction scheme ofFIG. 4 . - After the aforementioned process, the
carrier 11 with theseparation layer 12 formed thereon can be obtained, wherein theseparation layer 12 has ahydrophobic surface 121 formed by the hydrophobic groups Y exposed therefrom, as shown inFIG. 3 . -
FIGS. 5A-5I are cross-sectional views showing a process for manufacturing a display panel in the present embodiment. - First, as shown in
FIG. 5A , acarrier 11 with aseparation layer 12 formed thereon is provided, wherein theseparation layer 12 has a hydrophobic surface with a water contacting angle in a range from 25° to 180°, and thecarrier 11 is a glass carrier or a silicon substrate. The thickness of theseparation layer 12 is not particularly limited, as long as it can completely cover the hydroxyl groups of thecarrier 11. Preferably, it is in a range from 100 Å to 2000 Å. In the present embodiment, theseparation 12 can be one of the separation layer described in Embodiment 1 orEmbodiment 2, so the structure and the material thereof are not described in detail herein. - Next, as shown in FIGS. 5B and 5B′, a
glass substrate 13 is laminated on the hydrophobic surface 121 (as shown inFIG. 5A ) of theseparation layer 12 to allow theseparation layer 12 to be disposed between thecarrier 11 and theglass substrate 13. Herein, the thickness of theglass substrate 13 is 0.3 mm or less. Preferably, the thickness thereof is in a range from 0.1 mm to 0.3 mm. - As shown in
FIG. 5B , theglass substrate 13 can be laminated on theseparation layer 12 with apressing unit 22 in avacuum chamber 21, and this process is the so-called vacuum pressing process. Alternatively, as shown in FIG. 5B′, theglass substrate 13 is laminated on theseparation layer 12 with aroller 3 to remove air therebetween, and this process is the so-called roll laminating process. However, in either the vacuum pressing process or the roll lamination process, the air between theglass substrate 13 and theseparation layer 12 is removed to form a pressure difference between two sides of theglass substrate 13. Therefore, theglass substrate 13 can be firmly laminated on thecarrier 12 via atmospheric pressure and static electricity between theglass substrate 13 and theseparation layer 12. - Next, as shown in
FIG. 5C , adisplay unit 14 is formed on theglass substrate 13 through the conventional process used in the art. Herein, thedisplay unit 14 may comprise any active unit or passive unit generally used in the display field of the related art, such as a thin-film transistor, a color filter, an organic light emitting diode and a touch panel. The structure of each display unit is known by persons skilled in the art and not described in detail herein. - As shown in
FIG. 5D , theglass substrate 13 with thedisplay unit 14 formed thereon is assembled with amodule 15, which may be another glass substrate or comprise any active unit or passive unit generally used in the display field of the related art, such as a thin-film transistor, a color filter, an organic light emitting diode and a touch panel. Herein, the types of themodule 15 and thedisplay unit 14 can be selected based on the designs and the manufacturing processes, as long as a display panel can be obtained after assembly. - Next, as shown in FIGS. 5E and 5E′, an
auxiliary plate 41 is attached on a side of thecarrier 11 opposite to a side thereof with theseparation layer 12 formed thereon. Herein, as shown inFIG. 5E , theauxiliary plate 41 can be a plate having an adhesive layer (not shown in the figure) formed on one side thereof, and it can be directly adhered onto the another of thecarrier 11 opposite to the side thereof with theseparation layer 12 formed thereon through the adhesive layer. Alternatively, theauxiliary plate 41 is a thin plate, and anadhesive layer 42 and theauxiliary plate 41 are sequentially laminated onto another side of thecarrier 11 opposite to the side thereof with theseparation layer 12 formed thereon. - Herein, the
auxiliary plate 41 is not particularly limited, and can be a metal plate, a plastic plate or a plate made of other material. The material of theadhesive layer 42 is also not particularly limited, as long as it can provide the adhesive property. Herein, the material of theadhesive layer 42 can be UV gel or foaming gel. In addition, the area of theauxiliary plate 41 is larger than that of thecarrier 11, to facilitate the separation of the display panel from thecarrier 11. - Hereinafter, the sequential process is demonstrated according to the aspect shown in
FIG. 5E . As shown inFIG. 5F , a scraper 5 such as a steel pin is inserted between theglass substrate 13 and theseparation layer 12 to break the vacuum state therebetween. Then, as shown inFIG. 5G , theglass substrate 13 and thedisplay unit 14 are separated from thecarrier 11 and theseparation layer 12 with theauxiliary plate 14, to obtain the display panel of the present embodiment, as shown inFIG. 5H . In the present embodiment, the display panel is separated from thecarrier 11 with theauxiliary plate 41. However, in other embodiments, since the vacuum state between theglass substrate 13 and theseparation layer 12 is broken, the pressure difference therebetween is eliminated; and therefore the display panel can be directly separated from the carrier without using theauxiliary plate 41. - Finally, as shown in
FIG. 5I , an UV irradiation or a heating process may be selectively performed on theauxiliary plate 41 to separate the same from thecarrier 11 to recycle thecarrier 11. - The method for manufacturing the display panel of the present embodiment can be applied to various display panels, such as liquid crystal display panels (LCDs) or organic light emitting diode display panels (OLEDs). In addition, the obtained display panels can further be applied to various electronic devices, such as cell phones, notebooks, video cameras, cameras, music players, navigation devices, and televisions.
- Water contacting angles of separation layers made of different material are examined to understand the hydrophobicity thereof. In the present testing example, glass substrates are coated with silane compounds through a spin coating process to form separation layers. The types of the used silane compounds and the dilution ratio in solvents are listed in the following Table 1.
- After examination, the water contacting angles of the obtained separation layers made of different silane compound are listed in the following Table 1, which are examined by JIS R3257.
-
TABLE 1 Type of Water the silane Name of the silane Dilution ratio contacting compound compound (solvent) angle (°) Alkyl Methyltri-methoxysilane Stock solution 78 (without dilution) Vinyl Vinyltrimethoxysilane Stock solution 41.5 (without dilution) Epoxy Glycidylpropyl- Stock solution 57 trimethoxysilane (without dilution) 1:20 (H2O) 40.9 1:40 (H2O) 34.9 1:60 (H2O) 28.1 Methacryl Methacryloxy- Stock solution 67.65 propyltrimethoxysilane (without dilution) 1:20 (NMP) 55.52 1:40 (NMP) 50.7 1:60 (NMP) 44.55 NMP: N-methyl pyrrolidinone - From the results shown in Table 1, the separation layer has a hydrophobic surface having a water contacting angle in a range from 25° to 180° when the silane compounds having hydrophobic groups are used to prepare the separation layer. If an ideal hydrophobicity is required, the material, which can form a separation layer with a hydrophobic surface having a water contacting angle in a range from 45° to 90°, can be selected.
- Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.
Claims (10)
1. A method for manufacturing a display panel, comprising the following steps:
(A) providing a carrier with a separation layer formed thereon, wherein the separation layer has a hydrophobic surface;
(B) laminating a glass substrate on the hydrophobic surface of the separation layer to dispose the separation layer between the carrier and the glass substrate, wherein a thickness of the glass substrate is in a range from 0.1 mm to 0.3 mm;
(C) forming a display unit on the glass substrate; and
(D) separating the glass substrate from the hydrophobic surface of the separation layer,
wherein the hydrophobic surface of the separation layer has a water contacting angle in a range from 25° to 180°.
2. The method as claimed in claim 1 , wherein the hydrophobic surface of the separation layer is the surface of a polymer layer modified with hydrophobic groups, and each of the hydrophobic group is selected from a group consisting of a substituted or unsubstituted C1-20 alkyl group, a substituted or unsubstituted C2-20 alkenyl group, a substituted or unsubstituted C1-20 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-20 alkyl-acrylic group.
3. The method as claimed in claim 2 , wherein the step (A) comprises the following steps:
(A11) providing the carrier;
(Al2) forming the polymer layer on the carrier; and
(A13) modifying the surface of the polymer layer with the hydrophobic groups to form the hydrophobic surface.
4. The method as claimed in claim 1 , wherein the separation layer is an organic-inorganic material layer with hydrophobic groups exposed from the surface thereof, and each of the hydrophobic group is a substituted or unsubstituted C1-20 alkyl group or a substituted or unsubstituted C2-20 alkenyl group.
5. The method as claimed in claim 4 , wherein the step (A) comprises the following steps:
(A21) providing the carrier;
(A22) forming the organic-inorganic material layer on the carrier, wherein the organic-inorganic material layer has hydrophobic groups and reacting groups, and the hydrophobic groups exposed from the surface of the organic-inorganic material layer to form the hydrophobic surface; and
(A23) performing a reduction reaction to react the reacting groups in the organic-inorganic material layer with hydroxyl groups (—OH) of the carrier.
6. The method as claimed in claim 4 , wherein the organic-inorganic material layer is made of a compound represented by the following formula (I):
wherein each of R1, R2 and R3 is independently a substituted or unsubstituted C1-6 alkyl group; Y is selected from a group consisting of a substituted or unsubstituted C1-20 alkyl group, a substituted or unsubstituted C2-20 alkenyl group, a substituted or unsubstituted C1-20 alkyl-epoxy group, an epoxy group, and a substituted or unsubstituted C1-20 alkyl-acrylic group; and X is Si, Ti or Al.
7. The method as claimed in claim 6 , wherein a functional group for substituting the C1-20 alkyl group or the C2-20 alkenyl group is selected from a group consisting of an epoxy group, a halogen, a thiol group, a mercapto group, and an acyloxy group.
8. The method as claimed in claim 4 , wherein the organic-inorganic material layer is made of a material selected from a group consisting of (3-glycidoxypropyl)trimethoxysilane, 3-chloropropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, chloromethyltriethoxysilane, chloromethyltrimethoxysilane, methacryloxypropyltrimethoxysilane, trifluoropropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris(2-methoxyethoxy)silane, and vinyltris(methylethylketoximino)silane.
9. The method as claimed in claim 1 , wherein the hydrophobic surface of the separation layer has a water contacting angle in a range from 45° to 90°.
10. The method as claimed in claim 1 , wherein the glass substrate is laminated on the hydrophobic surface of the separation layer through a vacuum pressing machine or a roller in the step (B); and the step (D) comprises the following steps:
(D1) attaching an auxiliary plate on a side of the carrier opposite to a side thereof with the separation layer formed thereon; and
(D2) separating the glass substrate from the carrier and the separation layer through the auxiliary plate to obtain the display panel.
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TW102110627 | 2013-03-26 | ||
TW102110627A TWI516567B (en) | 2013-03-26 | 2013-03-26 | Method for manufacturing display panel |
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US20140290841A1 true US20140290841A1 (en) | 2014-10-02 |
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US14/197,159 Abandoned US20140290841A1 (en) | 2013-03-26 | 2014-03-04 | Method for manufacturing display panel |
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TW (1) | TWI516567B (en) |
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CN106356375A (en) * | 2015-07-17 | 2017-01-25 | 群创光电股份有限公司 | Substrate unit, component substrate, display device and manufacturing method of display device |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20160341999A1 (en) * | 2014-12-26 | 2016-11-24 | Shenzhen China Star Optoelectronis Technology Co., Ltd. | Touch display devices |
US9645432B2 (en) * | 2014-12-26 | 2017-05-09 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Touch display devices |
CN106356375A (en) * | 2015-07-17 | 2017-01-25 | 群创光电股份有限公司 | Substrate unit, component substrate, display device and manufacturing method of display device |
US10177346B2 (en) | 2015-07-17 | 2019-01-08 | Innolux Corporation | Substrate unit, display device and method for manufacturing display device |
US20190043396A1 (en) * | 2016-11-08 | 2019-02-07 | Boe Technology Group Co., Ltd. | Backlight detection apparatus and backlight detection method thereof |
US10657858B2 (en) * | 2016-11-08 | 2020-05-19 | Boe Technology Group Co., Ltd. | Backlight detection apparatus and backlight detection method thereof |
Also Published As
Publication number | Publication date |
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TWI516567B (en) | 2016-01-11 |
TW201437313A (en) | 2014-10-01 |
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