US20140083652A1 - Sealed casing - Google Patents
Sealed casing Download PDFInfo
- Publication number
- US20140083652A1 US20140083652A1 US14/118,556 US201214118556A US2014083652A1 US 20140083652 A1 US20140083652 A1 US 20140083652A1 US 201214118556 A US201214118556 A US 201214118556A US 2014083652 A1 US2014083652 A1 US 2014083652A1
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- US
- United States
- Prior art keywords
- heat
- evaporator
- condensing unit
- sealed casing
- top board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a sealed casing provided with a cooling device for a heat-generating body which is housed inside a container which forms a sealed space.
- a device such as a server which needs to operate in various environments needs to be made a structure which is provided with sealability.
- a heat-generating body which generates high heat such as a CPU (Central Processing Unit) installed inside the device. Therefore, there was a problem that a temperature inside the device rises and an erroneous operation is caused.
- CPU Central Processing Unit
- the cooling device described in patent document 1 installs various parts inside the casing, and in case they are replaced due to a failure or an inspection, the casing of the entire device needs to be removed. Also, a condensing unit is installed adjacent to the outer surface of the casing, and in order to maintain sealability between the condensing unit and an ebullient unit, a connection between the heat-generating part and the ebullient unit needed to be removed.
- An object of the present invention is to provide a sealed casing which solves the problem mentioned above.
- a sealed casing includes a container provided with a plurality of openings and housing at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.
- FIG. 1 A sectional view of a sealed casing according to the first exemplary embodiment of the present invention.
- FIG. 2A A sectional view of a sealed casing according to the second exemplary embodiment of the present invention.
- FIG. 2B A sectional view of a sealed casing according to the second exemplary embodiment of the present invention.
- FIG. 3 An oblique drawing of a sealed casing according to the second exemplary embodiment of the present invention.
- FIG. 4 A sectional view of a sealed casing according to the third exemplary embodiment of the present invention.
- FIG. 5 A sectional view of a sealed casing according to the fourth exemplary embodiment of the present invention.
- FIG. 6 A sectional view of a sealed casing according to the fifth exemplary embodiment of the present invention.
- FIG. 7 An oblique drawing of a sealed casing according to the fifth exemplary embodiment of the present invention.
- FIG. 1 is a sectional view of a sealed casing 1 according to this exemplary embodiment.
- the sealed casing 1 includes a container 2 , a top board 3 and a cooling unit 10 as shown in FIG. 1 .
- the container 2 is provided with a plurality of openings and houses at least one heat-generating body 5 in the inside. And the plurality of openings is sealed by the plurality of top boards 3 respectively.
- At least one of the openings is installed above a heat-generating area where the heat-generating body 5 is disposed.
- the top board 3 which seals the opening of the heat-generating area is connected with the cooling unit 10 which cools the heat-generating body 5 .
- the sealed casing 1 according to this exemplary embodiment is provided with the top board 3 which seals the plurality of openings respectively. Therefore, without removing the top board 3 which seals the opening of the heat-generating area and by removing other top board 3 , it becomes possible to check or replace parts inside the container 2 . As a result, maintenance can be performed without deteriorating cooling capability of the sealed casing 1 .
- FIG. 2( a ) and FIG. 2( b ) are sectional views of a sealed casing l according to this exemplary embodiment, and FIG. 3 is an oblique drawing of the sealed casing 1 .
- the sealed casing 1 includes a container 2 , a first top board 3 , a second top board 4 and a cooling unit 10 .
- the cooling unit 10 includes an evaporator 6 , a connecting pipe 7 and a condensing unit 8 .
- the container 2 is a box type shape, and installs a frame shaped component 9 on an upper surface part.
- the frame shaped component 9 installed on the upper surface part forms a plurality of openings.
- the frame shaped component 9 is composed of materials with high sealability such as silicone rubber and foamed material, and is stuck by an adhesive material such as a seal on the upper surface part of the container 2 and is connected with it.
- a top board 3 being distinguished between the first top board 3 and the second top board 4 .
- the first top board 3 and the second top board 4 are disposed so that the openings of the frame shaped component 9 may be covered respectively.
- the first top board 3 and the second top board 4 compose a sealed structure of the container 2 by being connected with resin material such as silicone rubber which is the frame shaped component 9 by contact bonding using adhesives so that water and dust do not enter from outside.
- the container 2 houses inside a heat-generating body 5 which becomes a cooling object and the evaporator 6 .
- the first top board 3 is connected with the evaporator 6 , and the first top board 3 is installed on a frame shaped component 9 above a heat-generating area where the heat-generating body 5 is disposed.
- the second top board 4 is installed on the frame shaped component 9 above an area except for the heat-generating area where the heat-generating body 5 is disposed. Further, if sealability of the container 2 can be maintained by being connected with the frame shaped component 9 , the first top board 3 and the second top board 4 may be divided into plural.
- first top board 3 and the second top board 4 connection of the container 2 , the first top board 3 and the second top board 4 will be explained in detail.
- first top board 3 and the second top board 4 which compose the top boards of the container 2 are made a structure such that they can be removed independently of each other, since the first top board 3 and the second top board 4 cannot be connected fittingly, the container 2 cannot be made a sealed structure.
- the container 2 installs the frame shaped component 9 including at least no smaller than two openings on the upper surface part. (In FIG. 3 , in the oblique drawing of the sealed casing 1 , the openings are three.) And the first top board 3 and the second top board 4 are connected via the frame shaped component 9 without being connected each other.
- the first top board 3 and the second top board 4 can make the container 2 a sealed structure by contact bonding and by being connected with the container 2 via the frame shaped component 9 via adhesives.
- the first top board 3 and the second top board 4 are connected via the frame shaped component 9 , they are not connected each other. Therefore, the second top board 4 can be removed from the frame shaped component 9 independently.
- the container 2 may be formed by thin plate working of a metal plate or metal plates created separately may be assembled together. However, in case the container 2 is composed by assembling the metal plates created separately together, connections such as a joint of metal plates are made a sealed structure sealed with resin such as silicone rubber so that water and dust do not enter from outside. Although materials of the container 2 are composed of metal, iron and stainless steel, they are not limited to the above and may be other materials.
- the heat-generating body 5 is not limited in particular as far as it is one which generates heat along with operation, for example, such as a CPU. Further, in this exemplary embodiment, although the heat-generating body 5 is mounted on a substrate 11 , it may be disposed directly on a bottom part of the container 2 . The heat-generating body 5 is connected with the evaporator 6 thermally via adhesives with high thermal conductivity such as heat conductive grease on an upper surface part which is a surface of opposite side from a surface connected with the substrate 11 .
- the evaporator 6 is a box type shape and provided with a refrigerant inside.
- HFC hydrogen fluorocarbon: hydrofluorocarbon
- HFE hydrogen fluoro ether: hydrofluoroether
- the material is not limited to them.
- the evaporator 6 contacts with the heat-generating body 5 thermally on a lower surface part, the refrigerant receives heat which the heat-generating body 5 generates and boils.
- the evaporator 6 is connected with the first top board 3 installed above and is fixed. In case there exists a plurality of heat-generating bodies 5 , there is a case when heights are different depending on the kinds of the heat-generating bodies 5 . Accordingly, the evaporator 6 and the first top board 3 may be connected via a spring 12 .
- a screw 15 passes through a center of the spring 12 and is connected with the frame shaped component 9 from upward. Further, the spring 12 is installed, between the screw 15 and the first top board 3 . When the screw 15 is screwed into a frame shaped material 9 , and distance between the screw 15 and the first top board 3 is decreased, the spring 12 presses the first top board 3 installed downward.
- the screw 15 may be connected, not with the frame shaped component 9 , by with a bottom surface of the container 2 or the substrate 11 .
- the evaporator 6 is connected with at least two of the connecting pipes 7 and 7 , and the respective connecting pipes 7 and 7 are connected with the condensing unit 8 .
- Materials of the evaporator 6 are not limited in particular as far as they are the materials with high thermal conductivity such as copper and aluminum. Further, locations where the evaporator 6 is connected with the connecting pipes 7 and 7 ′ may be outside the container 2 , in other words, above the first top board 3 or may be inside the container 2 as far as scalability of the container 2 can be kept.
- the connecting pipes 7 and 7 ′ are composed by a two layer structure where an inner layer is composed by a metal layer and an outer layer is composed by a resin layer, or an inner layer and an outer layer both being metal layers.
- the condensing unit 8 is installed on the first top board 3 . Further, the condensing unit 8 is connected, at a top end part, with at least one connecting pipe 7 , and also at a bottom end part, with at least one connecting pipe 7 ′. Further, the connecting pipe 7 carries vapor of the refrigerant which evaporated in the evaporator 6 to the condensing unit 8 , and the connecting pipe 7 ′ carries the refrigerant which is condensed and liquefied in the condensing unit 8 to the evaporator 6 again. Further, materials of the condensing unit 8 are not limited in particular as far as they are ones with high thermal conductivity such as copper and aluminum.
- the first top boards 3 installed above the heat-generating areas respectively may preferably be provided with different coolers having cooling performance corresponding to the heat-generating values.
- the cooling performance of the plurality of condensing units 8 corresponds to the heat-generating values of the heat-generating bodies 5
- the condensing unit 8 when vapor of the refrigerant pours into the condensing unit 8 from the connecting pipe 7 which is connected with the top end part, the vapor flows to the bottom end part through a central part of the condensing unit 8 .
- the condensing unit 8 When the condensing unit 8 is cooled by such as an outside air, it condenses and liquefies the vapor poured into. The liquefied refrigerant flows to the evaporator 6 via the connecting pipe 7 ′ which is connected with the bottom end part.
- the vapor which is generated by the refrigerant inside the evaporator 6 boiling is carried, by buoyancy due to a difference in density of vapor-liquid, and via the connecting pipe 7 which is connected with the evaporator 6 , to the condensing unit 8 which is installed outside the container 2 .
- the vapor of the refrigerant carried to the condensing unit 8 performs heat exchange with the outside air while it flows through the condensing unit 8 from the top end part to the bottom end part.
- the evaporated refrigerant is condensed from gas to liquid, and radiates the heat generated in the heat-generating body 5 to the outside air
- the refrigerant which liquefied in the bottom end part of the condensing unit 8 is carried to the evaporator 6 via the connecting pipe 7 ′ connected with the bottom end part.
- the heat generated by the heat-generating body 5 is radiated to the outside air by, in the evaporator 6 and the condensing unit 8 , changing the phases of the refrigerant from liquid to gas and also from gas to liquid.
- the refrigerant which absorbed the heat in the evaporator 6 becomes gas and moves to the condensing unit 8 , it is necessary to maintain high scalability between the evaporator 6 and the condensing unit 8 .
- the sealed casing 1 installs the container 2 provided with a plurality of the openings, the first top board 3 and the second top board 4 sealing the openings respectively.
- the first top board 3 which is installed above the heat-generating area where the heat-generating body 5 and the evaporator 6 are disposed installs the condensing unit 8 .
- the evaporator 6 is connected with the first top board 3 , it is not connect with the second top board 4 .
- first top board 3 and the second top board 4 are not connected directly, they can be removed independently. As a result, even if the second top board 4 is removed, since it is not necessary to remove the connection between the heat-generating body 5 and the evaporator 6 , maintenance such as a checking and replacing the parts inside the container 2 can be performed without deteriorating the cooling performance,
- the sealed casing 1 is provided with the container 2 a the box type shape provided with a plurality of openings and installs the first top board 3 and the second top board 4 which seal the respective openings. And the first top board 3 and the second top board 4 are connected with the container 2 via the frame shaped component 9 respectively, and they can be removed independently of each other.
- the first top board 3 is installed above the heat-generating area where the heat-generating body 5 and the evaporator 6 are disposed, and is connected fixedly with the evaporator 6 via the spring 12 and the screw 15 .
- the second top board 4 is installed in the area other than that.
- FIG. 4 is a sectional view of a sealed casing 1 according to this exemplary embodiment.
- a point different from the second exemplary embodiment is that a connecting pipe 7 is connected to a side surface part of an evaporator 6 as shown in FIG. 4 .
- Structure and connection relationship other than that are the same as that of the first exemplary embodiment and the sealed casing 1 includes a container 2 , a first top board 3 , a second top board 4 and a condensing unit 8 .
- the evaporator 6 of the sealed casing 1 is installed inside the container 2 .
- the evaporator 6 is a box type shape and is provided with a refrigerant inside. And the evaporator 6 contacts with a heat-generating body 5 thermally on a lower surface part, performs boiling of the refrigerant by heat which the heat-generating body 5 generates, and is connected with the first top board 3 on an upper surface part and is fixed.
- the evaporator 6 is connected with at least two connecting pipes 7 and 7 ′, and the respective connecting pipes 7 and 7 ′ are connected with the condensing unit 8 .
- Materials of the connecting pipes 7 and 7 are composed by metal layers or a two layer structure where an inner layer is a metal layer and an outer layer is a resin layer.
- the evaporator 6 and the connecting pipe 7 are connected on the upper surface part of the evaporator 6 . Locations where the evaporator 6 and the connecting pipe 7 are connected may be outside the container 2 , in other words, above the first top board 3 or may be inside the container 2 .
- the evaporator 6 and the connecting pipe 7 ′ are connected on the side surface part of the evaporator 6 which is inside the container 2 .
- the connecting pipe 7 ′ is connected at a sufficiently low location than a liquid surface of the refrigerant on the side surface part of the evaporator 6 .
- the connecting pipe 7 connected with the upper surface part of the evaporator 6 is connected with a top end part of the condensing unit 8 . Also, the connecting pipe 7 ′ connected with the side surface part of the evaporator 6 is connected with a bottom end part of the condensing unit 8 .
- the sealed casing 1 installs the connecting pipe 7 which connects the upper surface part of the evaporator 6 and the top end part of the condensing unit 8 , and the connecting pipe 7 ′ which connects the side surface part of the evaporator 6 and the bottom end part of the condensing unit 8 .
- the refrigerant installed inside the evaporator 6 boils by receiving the heat which the heat-generating body 5 connected thermally on the lower surface part generates. And the vapor which the refrigerant boiled is carried, to the condensing unit 8 via the connecting pipe 7 which is connected with the upper surface of the evaporator 6 by buoyancy due to a difference in density of vapor-liquid.
- the vapor of the refrigerant carried to the condensing unit 8 performs heat exchange with the outside air.
- the evaporated refrigerant is condensed from gas to liquid and radiates the heat generated in the heat-generating body 5 to the outside air.
- the refrigerant which liquefied at the bottom end part of the condensing unit 8 is carried to the evaporator 6 through the side surface part via the connecting pipe 7 ′ which is connected with the bottom end part of the condensing unit 8 .
- the evaporator 6 can, by changing the connecting locations of the connecting pipes 7 and 7 ′ respectively, distinguish the connecting pipe 7 which carries the vapor of the refrigerant which boiled to the condensing unit 8 and the connecting pipe 7 which carries the refrigerant which is cooled and liquefied in the condensing unit 8 to the evaporator again.
- FIG. 5 is a sectional view of a sealed casing 1 according to this exemplary embodiment.
- a point different from the second exemplary embodiment is, as shown in FIG. 5 , the point that heat radiators 13 and 13 ′ are installed, on a second top board 4 .
- Structure and connection relationship other than that are the same as that of the first exemplary embodiment and the sealed casing 1 includes a container 2 , a first top board 3 , the second top board 4 , an evaporator 6 , connecting pipes 7 , 7 ′ and a condensing unit 8 .
- the sealed casing 1 installs the heat radiators 13 and 13 ′ which are cooling units 10 whose cooling performance is different from the condensing unit 8 on at least one of an inner surface part and an outer surface part of the second top board 4 .
- the heat radiators 13 and 13 are fin shaped and their surface area is large.
- materials of the heat radiators 13 and 13 ′ are not limited in particular as far as they are the materials whose thermal conductivity is high such as copper and aluminum.
- the heat radiators 13 and 13 ′ are installed on both sides of the second top board 4 , it is desirable that the heat radiator 13 ′ installed on the inner surface part and the heat radiator 13 installed on the outer surface part are disposed in opposite locations via the second top board 4 . Further, the heat radiator 13 ′ installed on the inner surface part of the second top board 4 and the heat radiator 13 installed on the outer surface part may be connected directly by similar components or materials of high thermal conductivity which penetrate the container 2 .
- the sealed casing 1 can, by installing the heat radiator 13 on the outer surface part of the second top board 4 , conduct heat from a device other than the heat-generating body 5 inside the container 2 to the heat radiator 13 via the container 2 , and radiate the heat efficiently outside the container 2 .
- the heat radiator 13 can conduct the heat which the heat-generating body 5 in the container 2 generates efficiently to the container 2 via the heat radiator 13 ′ and radiate the heat outside via the heat radiator 13 .
- the condensing unit 8 and the heat radiators 13 and 13 ′ which are the cooling units 10 having the cooling performance corresponding to the heat-generating values of such as the heat-generating body which becomes a cooling object are disposed on the opposing top board respectively. It becomes possible, not to deteriorate the cooling performance but to improve it, and to perform maintenance such as to check and replace parts inside the container 2 .
- FIG. 6 is a sectional view of a sealed casing 1 according to this exemplary embodiment
- FIG. 7 is an oblique drawing of the sealed casing 1 .
- a point different from the second exemplary embodiment is, as shown in FIGS. 6 and 7 , the point that, by installing a step part 14 , distance between a first top board 3 and a bottom surface of a container 2 is made smaller than that between a second top board 4 and the bottom surface of the container 2 .
- Structure and connection relationship other than that are the same as that of the first exemplary embodiment and the sealed casing 1 includes the container 2 , the first top board 3 , the second top board 4 , a heat-generating body 5 , an evaporator 6 , a connecting pipe 7 and a condensing unit 8 .
- the container 2 is a box type shape, and installs a frame shaped component 9 including at least two openings on an upper surface part.
- the first top board 3 is disposed on the frame shaped component 9 so that the opening located above the heat-generating body 5 and the evaporator 6 may be covered.
- the second top board 4 is disposed on the frame shaped component 9 so that other openings may be covered. Further, all of the openings are covered with the first top board 3 or the second top board 4 , and the sealed casing 1 is made a sealed structure.
- the first top board 3 and the second top board 4 are connected with the container 2 via the frame shaped component 9 without being connected each other. Therefore, the first top board 3 and the second top board 4 can maintain the sealability of the container 2 , and also, since they are not connected with each other, can be removed independently of each other respectively.
- the distance between the first top board 3 installed above the heat-generating body 5 and the evaporator 6 and the bottom surface of the container 2 is smaller than the distance between the second top board 4 and the bottom surface of the container 2 .
- the height of the first top board 3 is lower than the height of the second top board 4 against the bottom surface of the container 2 .
- the frame shaped component 9 installs the step part 14 in a part which forms the opening above the heat-generating body 5 and the evaporator 6 .
- the first top board 3 is installed on a low part of the step part 14 , in other words, the part where the distance between the step part 14 and the bottom surface of the container 2 is closer.
- the second top board 4 is installed on a high part of the step part 14 , in other words, the part where the distance between the step part 14 and the bottom surface of the container 2 is farther.
- the condensing unit 8 is disposed on the first top board 3 which is outside the container 2 . Therefore, when the condensing unit 8 is made larger while trying to improve the cooling performance, the height became larger as an entire device, and there was a problem in terms of downsizing of the device.
- the sealed casing 1 is made a structure which made the height of the first top board 3 on which the condensing unit 8 is installed lower than the height of the second top board 4 .
- the distance between the first top board 3 and the bottom surface of the container 2 is smaller than the distance between the second top board 4 and the bottom surface of the container 2 . Therefore, a new space can be installed on the first top board 3 .
- Heat radiation characteristics of the sealed casing 1 result from a surface area of the condensing unit 8 . Therefore, in proportion to the amount by which the height of the first top board 3 is lower, the surface area of the condensing unit 8 can be made larger. As a result, since the height of the condensing unit 8 can be made higher without increasing the sealed casing 1 in size, it becomes possible to raise the heat radiation characteristics and improve the cooling performance. Further, the present invention is not limited only to the exemplary embodiments mentioned above, and it goes without saying that various changes are possible within the range which do not deviate from the points of the present invention already described.
- the present invention relates to a sealed casing provided with a cooling device for a heat-generating body housed inside a container which forms a sealed space.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.
Description
- The present invention relates to a sealed casing provided with a cooling device for a heat-generating body which is housed inside a container which forms a sealed space.
- A device such as a server which needs to operate in various environments needs to be made a structure which is provided with sealability. However, when the device itself is made a sealed structure, it becomes impossible to radiate heat of a heat-generating body which generates high heat such as a CPU (Central Processing Unit) installed inside the device. Therefore, there was a problem that a temperature inside the device rises and an erroneous operation is caused.
- Accordingly, in patent document 1 (Japanese Unexamined Patent Application Publication No. 2002-181437), a cooling device which cools heat which a heat-generating part installed inside the cooling device generates by a heat radiator which is installed on an outer surface of a casing is disclosed. This related cooling device is made a structure which, by using ebullient cooling utilizing phase change, conducts the heat generated by the heat-generating part installed inside the device to the heat radiator installed outside the casing.
- The cooling device described in
patent document 1 installs various parts inside the casing, and in case they are replaced due to a failure or an inspection, the casing of the entire device needs to be removed. Also, a condensing unit is installed adjacent to the outer surface of the casing, and in order to maintain sealability between the condensing unit and an ebullient unit, a connection between the heat-generating part and the ebullient unit needed to be removed. - However, when the connection between the heat-generating part and the ebullient unit is removed each time the casing is removed, in case an enough thermal connection is not made between both of them, thermal resistance between a heat-generating body and the ebullient unit rises. As a result, there was a problem that cooling performance deteriorates each time maintenance is performed.
- An object of the present invention is to provide a sealed casing which solves the problem mentioned above.
- A sealed casing according to the present invention includes a container provided with a plurality of openings and housing at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.
- [
FIG. 1 ] A sectional view of a sealed casing according to the first exemplary embodiment of the present invention. - [
FIG. 2A ] A sectional view of a sealed casing according to the second exemplary embodiment of the present invention. - [
FIG. 2B ] A sectional view of a sealed casing according to the second exemplary embodiment of the present invention. - [
FIG. 3 ] An oblique drawing of a sealed casing according to the second exemplary embodiment of the present invention. - [
FIG. 4 ] A sectional view of a sealed casing according to the third exemplary embodiment of the present invention. - [
FIG. 5 ] A sectional view of a sealed casing according to the fourth exemplary embodiment of the present invention. - [
FIG. 6 ] A sectional view of a sealed casing according to the fifth exemplary embodiment of the present invention. - [
FIG. 7 ] An oblique drawing of a sealed casing according to the fifth exemplary embodiment of the present invention. - In the following, desirable modes for carrying out the present invention will be explained using drawings. However, in exemplary embodiments described below, although technically desirable limitations are made to carry out the present invention, the scope of the invention is not limited to the following.
- [The first exemplary embodiment] This exemplary embodiment will be explained in detail with reference to drawings.
FIG. 1 is a sectional view of a sealedcasing 1 according to this exemplary embodiment. - [Explanation of structure] The sealed
casing 1 according to this exemplary embodiment includes acontainer 2, atop board 3 and acooling unit 10 as shown inFIG. 1 . - The
container 2 is provided with a plurality of openings and houses at least one heat-generatingbody 5 in the inside. And the plurality of openings is sealed by the plurality oftop boards 3 respectively. - At least one of the openings is installed above a heat-generating area where the heat-generating
body 5 is disposed. Thetop board 3 which seals the opening of the heat-generating area is connected with thecooling unit 10 which cools the heat-generatingbody 5. - [Explanation of effect] The sealed
casing 1 according to this exemplary embodiment is provided with thetop board 3 which seals the plurality of openings respectively. Therefore, without removing thetop board 3 which seals the opening of the heat-generating area and by removing othertop board 3, it becomes possible to check or replace parts inside thecontainer 2. As a result, maintenance can be performed without deteriorating cooling capability of the sealedcasing 1. - [The second exemplary embodiment] This exemplary embodiment will be explained in detail with reference to drawings.
FIG. 2( a) andFIG. 2( b) are sectional views of a sealed casing l according to this exemplary embodiment, andFIG. 3 is an oblique drawing of the sealedcasing 1. - [Explanation of structure] As shown in
FIG. 2 andFIG. 3 , the sealedcasing 1 according to this exemplary embodiment includes acontainer 2, a firsttop board 3, a secondtop board 4 and acooling unit 10. Further, thecooling unit 10 includes anevaporator 6, a connectingpipe 7 and acondensing unit 8. - The
container 2 is a box type shape, and installs a frame shapedcomponent 9 on an upper surface part. In thecontainer 2, the frameshaped component 9 installed on the upper surface part forms a plurality of openings. The frameshaped component 9 is composed of materials with high sealability such as silicone rubber and foamed material, and is stuck by an adhesive material such as a seal on the upper surface part of thecontainer 2 and is connected with it. - In this exemplary embodiment, explanation will be made with a
top board 3 being distinguished between the firsttop board 3 and the secondtop board 4. The firsttop board 3 and the secondtop board 4 are disposed so that the openings of the frameshaped component 9 may be covered respectively. The firsttop board 3 and the secondtop board 4 compose a sealed structure of thecontainer 2 by being connected with resin material such as silicone rubber which is the frame shapedcomponent 9 by contact bonding using adhesives so that water and dust do not enter from outside. - The
container 2 houses inside a heat-generatingbody 5 which becomes a cooling object and theevaporator 6. The firsttop board 3 is connected with theevaporator 6, and the firsttop board 3 is installed on a frame shapedcomponent 9 above a heat-generating area where the heat-generatingbody 5 is disposed. The secondtop board 4 is installed on the frame shapedcomponent 9 above an area except for the heat-generating area where the heat-generatingbody 5 is disposed. Further, if sealability of thecontainer 2 can be maintained by being connected with the frame shapedcomponent 9, the firsttop board 3 and the secondtop board 4 may be divided into plural. - Here, connection of the
container 2, the firsttop board 3 and the secondtop board 4 will be explained in detail. In case the firsttop board 3 and the secondtop board 4 which compose the top boards of thecontainer 2 are made a structure such that they can be removed independently of each other, since the firsttop board 3 and the secondtop board 4 cannot be connected fittingly, thecontainer 2 cannot be made a sealed structure. - Accordingly, the
container 2 according to this exemplary embodiment installs the frameshaped component 9 including at least no smaller than two openings on the upper surface part. (InFIG. 3 , in the oblique drawing of thesealed casing 1, the openings are three.) And the firsttop board 3 and the secondtop board 4 are connected via the frameshaped component 9 without being connected each other. - As a result, the first
top board 3 and the secondtop board 4 can make the container 2 a sealed structure by contact bonding and by being connected with thecontainer 2 via the frameshaped component 9 via adhesives. On the other hand, although the firsttop board 3 and the secondtop board 4 are connected via the frame shapedcomponent 9, they are not connected each other. Therefore, the secondtop board 4 can be removed from the frameshaped component 9 independently. - The
container 2 may be formed by thin plate working of a metal plate or metal plates created separately may be assembled together. However, in case thecontainer 2 is composed by assembling the metal plates created separately together, connections such as a joint of metal plates are made a sealed structure sealed with resin such as silicone rubber so that water and dust do not enter from outside. Although materials of thecontainer 2 are composed of metal, iron and stainless steel, they are not limited to the above and may be other materials. - The heat-generating
body 5 is not limited in particular as far as it is one which generates heat along with operation, for example, such as a CPU. Further, in this exemplary embodiment, although the heat-generatingbody 5 is mounted on asubstrate 11, it may be disposed directly on a bottom part of thecontainer 2. The heat-generatingbody 5 is connected with theevaporator 6 thermally via adhesives with high thermal conductivity such as heat conductive grease on an upper surface part which is a surface of opposite side from a surface connected with thesubstrate 11. - The
evaporator 6 is a box type shape and provided with a refrigerant inside. In this exemplary embodiment, although HFC (hydro fluorocarbon: hydrofluorocarbon) and HFE (hydro fluoro ether: hydrofluoroether) are being used as a specific refrigerant, the material is not limited to them. Further, since theevaporator 6 contacts with the heat-generatingbody 5 thermally on a lower surface part, the refrigerant receives heat which the heat-generatingbody 5 generates and boils. - The
evaporator 6 is connected with the firsttop board 3 installed above and is fixed. In case there exists a plurality of heat-generatingbodies 5, there is a case when heights are different depending on the kinds of the heat-generatingbodies 5. Accordingly, theevaporator 6 and the firsttop board 3 may be connected via aspring 12. - To be explained in detail, as shown in
FIG. 2 (a), ascrew 15 passes through a center of thespring 12 and is connected with the frame shapedcomponent 9 from upward. Further, thespring 12 is installed, between thescrew 15 and the firsttop board 3. When thescrew 15 is screwed into a frame shapedmaterial 9, and distance between thescrew 15 and the firsttop board 3 is decreased, thespring 12 presses the firsttop board 3 installed downward. - Since the
evaporator 6 contacts with the firsttop board 3, by the power by which the firsttop board 3 is pressed by thespring 12, theevaporator 6 presses down the heat-generatingbody 5 installed downward. As a result, thermal connection between theevaporator 6 and the heat-generatingbody 5 can be made stronger. Further, as shown inFIG. 2 (b), thescrew 15 may be connected, not with the frame shapedcomponent 9, by with a bottom surface of thecontainer 2 or thesubstrate 11. - Also, the
evaporator 6 is connected with at least two of the connectingpipes pipes unit 8. Materials of theevaporator 6 are not limited in particular as far as they are the materials with high thermal conductivity such as copper and aluminum. Further, locations where theevaporator 6 is connected with the connectingpipes container 2, in other words, above the firsttop board 3 or may be inside thecontainer 2 as far as scalability of thecontainer 2 can be kept. - The connecting
pipes - The condensing
unit 8 is installed on the firsttop board 3. Further, the condensingunit 8 is connected, at a top end part, with at least one connectingpipe 7, and also at a bottom end part, with at least one connectingpipe 7′. Further, the connectingpipe 7 carries vapor of the refrigerant which evaporated in theevaporator 6 to thecondensing unit 8, and the connectingpipe 7′ carries the refrigerant which is condensed and liquefied in thecondensing unit 8 to theevaporator 6 again. Further, materials of the condensingunit 8 are not limited in particular as far as they are ones with high thermal conductivity such as copper and aluminum. - In case a plurality of heat-generating
bodies 5 whose heat-generating values are different is included inside thecontainer 2, the firsttop boards 3 installed above the heat-generating areas respectively may preferably be provided with different coolers having cooling performance corresponding to the heat-generating values. At that time, the cooling performance of the plurality of condensingunits 8 corresponds to the heat-generating values of the heat-generatingbodies 5 - In the
condensing unit 8, when vapor of the refrigerant pours into the condensingunit 8 from the connectingpipe 7 which is connected with the top end part, the vapor flows to the bottom end part through a central part of the condensingunit 8. When the condensingunit 8 is cooled by such as an outside air, it condenses and liquefies the vapor poured into. The liquefied refrigerant flows to theevaporator 6 via the connectingpipe 7′ which is connected with the bottom end part. - [Explanation of action] The
evaporator 6 installed inside thecontainer 2 contacts thermally with the heat-generatingbody 5 mounted on thesubstrate 11 on the lower surface part. Therefore, the refrigerant installed inside theevaporator 6 boils by receiving the heat which the heat-generatingbody 5 generates. - The vapor which is generated by the refrigerant inside the
evaporator 6 boiling is carried, by buoyancy due to a difference in density of vapor-liquid, and via the connectingpipe 7 which is connected with theevaporator 6, to thecondensing unit 8 which is installed outside thecontainer 2. - The vapor of the refrigerant carried to the
condensing unit 8 performs heat exchange with the outside air while it flows through the condensingunit 8 from the top end part to the bottom end part. By the condensingunit 8 being cooled, the evaporated refrigerant is condensed from gas to liquid, and radiates the heat generated in the heat-generatingbody 5 to the outside air - And the refrigerant which liquefied in the bottom end part of the condensing
unit 8 is carried to theevaporator 6 via the connectingpipe 7′ connected with the bottom end part. - In a cooling method of the heat-generating
body 5 mentioned above, the heat generated by the heat-generatingbody 5 is radiated to the outside air by, in theevaporator 6 and the condensingunit 8, changing the phases of the refrigerant from liquid to gas and also from gas to liquid. In other words, since the refrigerant which absorbed the heat in theevaporator 6 becomes gas and moves to thecondensing unit 8, it is necessary to maintain high scalability between theevaporator 6 and the condensingunit 8. - Inside the
container 2, various parts are built-in in addition to the heat-generatingbody 5, and such as a fan (not illustrated) which makes an inner air circulate is also installed. For those built-in parts, not only when a failure occurred, checks or parts replacement need to be performed periodically. - However, in case of the cooling device described in
patent document 1, in case parts other than the heat-generating body installed inside the sealed casing are to be replaced, the entire casing needs to be removed. Also, the condensing unit is installed adjacent to the outer surface of the casing, and in order to maintain the sealability between the condensing unit and the ebullient unit, the connection between the heat generating part and the ebullient unit needed to be removed. - When the connection between the heat generating part and the ebullient unit is removed each time the casing is removed, since there is a case when an enough thermal connection between both of them might not be made, there was a problem that thermal resistance between the heat generating part and the ebullient unit rises and the cooling performance deteriorates.
- Accordingly, the sealed
casing 1 according to this exemplary embodiment installs thecontainer 2 provided with a plurality of the openings, the firsttop board 3 and the secondtop board 4 sealing the openings respectively. And the firsttop board 3 which is installed above the heat-generating area where the heat-generatingbody 5 and theevaporator 6 are disposed installs the condensingunit 8. Also, although theevaporator 6 is connected with the firsttop board 3, it is not connect with the secondtop board 4. - And since the first
top board 3 and the secondtop board 4 are not connected directly, they can be removed independently. As a result, even if the secondtop board 4 is removed, since it is not necessary to remove the connection between the heat-generatingbody 5 and theevaporator 6, maintenance such as a checking and replacing the parts inside thecontainer 2 can be performed without deteriorating the cooling performance, - [Explanation of effect] Next, the effect according to this exemplary embodiment will be explained.
- The sealed
casing 1 according to this exemplary embodiment is provided with the container 2 a the box type shape provided with a plurality of openings and installs the firsttop board 3 and the secondtop board 4 which seal the respective openings. And the firsttop board 3 and the secondtop board 4 are connected with thecontainer 2 via the frame shapedcomponent 9 respectively, and they can be removed independently of each other. - Also, the first
top board 3 is installed above the heat-generating area where the heat-generatingbody 5 and theevaporator 6 are disposed, and is connected fixedly with theevaporator 6 via thespring 12 and thescrew 15. In other words, although the firsttop board 3 is installed above the heat-generatingbody 5 and theevaporator 6, the secondtop board 4 is installed in the area other than that. - By the structure mentioned above, and by removing the second
top board 4, replacement or inspection of parts other than the heat-generatingbody 5 installed inside thecontainer 2 can be performed. As a result, since it is not necessary to remove the connection relationship between the heat-generatingbody 5 and theevaporator 6, maintenance to check or replace the parts inside thecontainer 2 can be performed without deteriorating the cooling performance. - [The third exemplary embodiment] The third exemplary embodiment will be explained in detail with reference to drawings.
FIG. 4 is a sectional view of a sealedcasing 1 according to this exemplary embodiment. - [Explanation of structure] A point different from the second exemplary embodiment is that a connecting
pipe 7 is connected to a side surface part of anevaporator 6 as shown inFIG. 4 . Structure and connection relationship other than that are the same as that of the first exemplary embodiment and the sealedcasing 1 includes acontainer 2, a firsttop board 3, a secondtop board 4 and acondensing unit 8. - The
evaporator 6 of the sealedcasing 1 according to this exemplary embodiment is installed inside thecontainer 2. Theevaporator 6 is a box type shape and is provided with a refrigerant inside. And theevaporator 6 contacts with a heat-generatingbody 5 thermally on a lower surface part, performs boiling of the refrigerant by heat which the heat-generatingbody 5 generates, and is connected with the firsttop board 3 on an upper surface part and is fixed. - Also, the
evaporator 6 is connected with at least two connectingpipes pipes unit 8. Materials of the connectingpipes - The
evaporator 6 and the connectingpipe 7 are connected on the upper surface part of theevaporator 6. Locations where theevaporator 6 and the connectingpipe 7 are connected may be outside thecontainer 2, in other words, above the firsttop board 3 or may be inside thecontainer 2. - Also, the
evaporator 6 and the connectingpipe 7′ are connected on the side surface part of theevaporator 6 which is inside thecontainer 2. - Further, it is desirable that the connecting
pipe 7′ is connected at a sufficiently low location than a liquid surface of the refrigerant on the side surface part of theevaporator 6. - The connecting
pipe 7 connected with the upper surface part of theevaporator 6 is connected with a top end part of the condensingunit 8. Also, the connectingpipe 7′ connected with the side surface part of theevaporator 6 is connected with a bottom end part of the condensingunit 8. - [Explanation of action and effect] Next, the action and the effect according to this exemplary embodiment will be explained.
- The sealed
casing 1 according to this exemplary embodiment installs the connectingpipe 7 which connects the upper surface part of theevaporator 6 and the top end part of the condensingunit 8, and the connectingpipe 7′ which connects the side surface part of theevaporator 6 and the bottom end part of the condensingunit 8. - The refrigerant installed inside the
evaporator 6 boils by receiving the heat which the heat-generatingbody 5 connected thermally on the lower surface part generates. And the vapor which the refrigerant boiled is carried, to thecondensing unit 8 via the connectingpipe 7 which is connected with the upper surface of theevaporator 6 by buoyancy due to a difference in density of vapor-liquid. - And while it flows through the condensing
unit 8 from the top end part to the bottom end part, the vapor of the refrigerant carried to thecondensing unit 8 performs heat exchange with the outside air. By the entire body of the condensingunit 8 being cooled, the evaporated refrigerant is condensed from gas to liquid and radiates the heat generated in the heat-generatingbody 5 to the outside air. The refrigerant which liquefied at the bottom end part of the condensingunit 8 is carried to theevaporator 6 through the side surface part via the connectingpipe 7′ which is connected with the bottom end part of the condensingunit 8. - To be explained in detail, since the vapor of the refrigerant which evaporates in the
evaporator 6 by the heat which the heat-generatingbody 5 generates moves upward by the buoyancy, although it is carried to the connectingpipe 7 which is connected with the upper surface part of theevaporator 6, it is not carried to the connectingpipe 7′ which is connected with the side surface part of theevaporator 6. - In other words, the
evaporator 6 can, by changing the connecting locations of the connectingpipes pipe 7 which carries the vapor of the refrigerant which boiled to thecondensing unit 8 and the connectingpipe 7 which carries the refrigerant which is cooled and liquefied in thecondensing unit 8 to the evaporator again. - Therefore, it is possible to prevent the vapor of the evaporated refrigerant being carried to the connecting
pipe 7′ and flowing backward. As a result, heat cycle in which the vapor of the refrigerant is carried to the top end part of the condensingunit 8 via the connectingpipe 7 and is carried to theevaporator 6 through the side surface part via the connectingpipe 7′ which is connected with the bottom end part of the condensingunit 8 can be maintained. As a result, the heat which the heat-generatingbody 5 generates can be radiated efficiently and the cooling performance of the sealedcasing 1 can be raised. - [The fourth exemplary embodiment] Next, the fourth exemplary embodiment will be explained in detail with reference to drawings.
FIG. 5 is a sectional view of a sealedcasing 1 according to this exemplary embodiment. - [Explanation of structure] A point different from the second exemplary embodiment is, as shown in
FIG. 5 , the point that heatradiators top board 4. Structure and connection relationship other than that are the same as that of the first exemplary embodiment and the sealedcasing 1 includes acontainer 2, a firsttop board 3, the secondtop board 4, anevaporator 6, connectingpipes condensing unit 8. - As shown in
FIG. 5 , the sealedcasing 1 according to this exemplary embodiment installs theheat radiators units 10 whose cooling performance is different from the condensingunit 8 on at least one of an inner surface part and an outer surface part of the secondtop board 4. Further, theheat radiators heat radiators - In case the
heat radiators top board 4, it is desirable that theheat radiator 13′ installed on the inner surface part and theheat radiator 13 installed on the outer surface part are disposed in opposite locations via the secondtop board 4. Further, theheat radiator 13′ installed on the inner surface part of the secondtop board 4 and theheat radiator 13 installed on the outer surface part may be connected directly by similar components or materials of high thermal conductivity which penetrate thecontainer 2. - [Explanation of action and effect] The sealed
casing 1 according to this exemplary embodiment can, by installing theheat radiator 13 on the outer surface part of the secondtop board 4, conduct heat from a device other than the heat-generatingbody 5 inside thecontainer 2 to theheat radiator 13 via thecontainer 2, and radiate the heat efficiently outside thecontainer 2. - Also, by installing the
heat radiator 13 on the inner surface part of the secondtop board 4, it can conduct the heat which the heat-generatingbody 5 in thecontainer 2 generates efficiently to thecontainer 2 via theheat radiator 13′ and radiate the heat outside via theheat radiator 13. - Further, according to the sealed
casing 1 according to this exemplary embodiment, the condensingunit 8 and theheat radiators units 10 having the cooling performance corresponding to the heat-generating values of such as the heat-generating body which becomes a cooling object are disposed on the opposing top board respectively. It becomes possible, not to deteriorate the cooling performance but to improve it, and to perform maintenance such as to check and replace parts inside thecontainer 2. - [The fifth exemplary embodiment] Next, the fifth exemplary embodiment will be explained in detail with reference to drawings. FIG.
- 6 is a sectional view of a sealed
casing 1 according to this exemplary embodiment, andFIG. 7 is an oblique drawing of the sealedcasing 1. - [Explanation of structure] A point different from the second exemplary embodiment is, as shown in
FIGS. 6 and 7 , the point that, by installing astep part 14, distance between a firsttop board 3 and a bottom surface of acontainer 2 is made smaller than that between a secondtop board 4 and the bottom surface of thecontainer 2. Structure and connection relationship other than that are the same as that of the first exemplary embodiment and the sealedcasing 1 includes thecontainer 2, the firsttop board 3, the secondtop board 4, a heat-generatingbody 5, anevaporator 6, a connectingpipe 7 and acondensing unit 8. - The
container 2 is a box type shape, and installs a frame shapedcomponent 9 including at least two openings on an upper surface part. The firsttop board 3 is disposed on the frame shapedcomponent 9 so that the opening located above the heat-generatingbody 5 and theevaporator 6 may be covered. Also, the secondtop board 4 is disposed on the frame shapedcomponent 9 so that other openings may be covered. Further, all of the openings are covered with the firsttop board 3 or the secondtop board 4, and the sealedcasing 1 is made a sealed structure. - The first
top board 3 and the secondtop board 4 are connected with thecontainer 2 via the frame shapedcomponent 9 without being connected each other. Therefore, the firsttop board 3 and the secondtop board 4 can maintain the sealability of thecontainer 2, and also, since they are not connected with each other, can be removed independently of each other respectively. - Here, in this exemplary embodiment, the distance between the first
top board 3 installed above the heat-generatingbody 5 and theevaporator 6 and the bottom surface of thecontainer 2 is smaller than the distance between the secondtop board 4 and the bottom surface of thecontainer 2. In other words, the height of the firsttop board 3 is lower than the height of the secondtop board 4 against the bottom surface of thecontainer 2. - To be explained in detail, in a part which forms the opening above the heat-generating
body 5 and theevaporator 6, the frame shapedcomponent 9 installs thestep part 14. And the firsttop board 3 is installed on a low part of thestep part 14, in other words, the part where the distance between thestep part 14 and the bottom surface of thecontainer 2 is closer. Also, the secondtop board 4 is installed on a high part of thestep part 14, in other words, the part where the distance between thestep part 14 and the bottom surface of thecontainer 2 is farther. - [Explanation of action and effect] In the sealed
casing 1 according to this exemplary embodiment, the condensingunit 8 is disposed on the firsttop board 3 which is outside thecontainer 2. Therefore, when the condensingunit 8 is made larger while trying to improve the cooling performance, the height became larger as an entire device, and there was a problem in terms of downsizing of the device. - Therefore, the sealed
casing 1 according to this exemplary embodiment is made a structure which made the height of the firsttop board 3 on which thecondensing unit 8 is installed lower than the height of the secondtop board 4. In other words, the distance between the firsttop board 3 and the bottom surface of thecontainer 2 is smaller than the distance between the secondtop board 4 and the bottom surface of thecontainer 2. Therefore, a new space can be installed on the firsttop board 3. - Heat radiation characteristics of the sealed
casing 1 result from a surface area of the condensingunit 8. Therefore, in proportion to the amount by which the height of the firsttop board 3 is lower, the surface area of the condensingunit 8 can be made larger. As a result, since the height of the condensingunit 8 can be made higher without increasing the sealedcasing 1 in size, it becomes possible to raise the heat radiation characteristics and improve the cooling performance. Further, the present invention is not limited only to the exemplary embodiments mentioned above, and it goes without saying that various changes are possible within the range which do not deviate from the points of the present invention already described. - This application claims the benefit of priority based on Japanese Patent Application No. 2011-116003, filed on May 24, 2011, and the disclosure of which is incorporated herein in its entirety by reference.
- The present invention relates to a sealed casing provided with a cooling device for a heat-generating body housed inside a container which forms a sealed space.
- 1 Sealed casing
- 2 Container
- 3 First top board
- 4 Second top board
- 5 Heat-generating body
- 6 Evaporator
- 7 Connecting pipe
- 8 Condensing unit
- 9 Frame shaped component
- 10 Cooling unit
- 11 Substrate
- 12 Spring
- 13 Heat radiator
- 14 Step part
Claims (20)
1. A sealed casing comprising a container provided with a plurality of openings and housing at least one heat-generating body, and a plurality of top boards sealing said openings respectively, and characterized in that at least one of said openings is disposed in a heat-generating area where the said heat-generating body is disposed, and that said top board sealing said openings of said heat-generating area and a cooling unit cooling said heat-generating body are connected.
2. The sealed casing according to claim 1 , wherein said plurality of top boards are connected with said container independently of each other.
3. The sealed casing according to claim 1 , wherein a frame shaped component is provided between said container and said top board, and that said container and said plurality of top boards, and each of said plurality of top boards are connected via said frame shaped component.
4. The sealed casing according to claim 3 , wherein said frame shaped component is silicone rubber or foamed material.
5. The sealed casing according to claim 1 wherein said cooling unit is provided with an evaporator which is connected with said heat-generating body thermally and is provided with a refrigerant inside, a condensing unit which condenses said refrigerant, and at least two connecting pipes which connect said evaporator and said condensing unit.
6. The sealed casing according to claim 5 , wherein at least one of said connecting pipes connects said evaporator and an upper part of said condensing unit, and at least one of said connecting pipes connects a lower part of said condensing unit and said evaporator.
7. The sealed casing according to claim 6 , wherein said connecting pipe which is connected with the upper part of said condensing unit is connected with an upper surface part of said evaporator, and said connecting pipe which is connected with the lower part of said condensing unit is connected with a side surface part of said evaporator.
8. The sealed casing according to claim 6 , wherein said connecting pipe which is connected with the upper part of said condensing unit carries vapor of said refrigerant evaporated in said evaporator by the heat which said heat-generating body generates to said condensing unit, and said connecting pipe which is connected with the lower part of said condensing unit carries the refrigerant liquefied in said condensing unit to said evaporator.
9. The sealed casing according to claim 1 , wherein a plurality of cooling units which is disposed respectively on said top boards which seal the openings of a plurality of heat-generating areas is provided, and said cooling units include cooling performance corresponding to heart-generating values of the corresponding heat-generating bodies.
10. The sealed casing according to claim 1 , wherein a heat radiator is installed at least on either one of an inner surface part or an outer surface part of said top board.
11. The sealed casing according to claim 5 , wherein the top board on which said condensing unit is disposed is smaller in distance with a bottom surface of said container than the top board on which said condensing unit is not disposed.
12. The sealed casing according to claim 5 , wherein said evaporator and said top board are connected via a spring.
13. The sealed casing according to claim 5 , wherein said heat-generating body and said evaporator are connected via heat conductive grease.
14. The sealed casing according to claim 5 , wherein said connecting pipe is composed by an inner layer being a metal layer and an outer layer being a resin layer, or only metal layers.
15. The sealed casing according to claim 5 , wherein said evaporator, said connecting pipe and said condensing unit are sealed and connected.
16. The sealed casing according to claim 5 , wherein materials of said evaporator and said condensing unit are aluminum or copper.
17. The sealed casing according to claim 5 , wherein said refrigerant is hydrofluorocarbon or hydrofluoroether.
18. The sealed casing according to claim 2 wherein said cooling unit is provided with an evaporator which is connected with said heat-generating body thermally and is provided with a refrigerant inside, a condensing unit which condenses said refrigerant, and at least two connecting pipes which connect said evaporator and said condensing unit.
19. The sealed casing according to claim 3 wherein said cooling unit is provided with an evaporator which is connected with said heat-generating body thermally and is provided with a refrigerant inside, a condensing unit which condenses said refrigerant, and at least two connecting pipes which connect said evaporator and said condensing unit.
20. The sealed casing according to claim 4 wherein said cooling unit is provided with an evaporator which is connected with said heat-generating body thermally and is provided with a refrigerant inside, a condensing unit which condenses said refrigerant, and at least two connecting pipes which connect said evaporator and said condensing unit.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2011-116003 | 2011-05-24 | ||
JP2011116003 | 2011-05-24 | ||
PCT/JP2012/063571 WO2012161334A1 (en) | 2011-05-24 | 2012-05-21 | Sealed casing |
Publications (1)
Publication Number | Publication Date |
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US20140083652A1 true US20140083652A1 (en) | 2014-03-27 |
Family
ID=47217398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US14/118,556 Abandoned US20140083652A1 (en) | 2011-05-24 | 2012-05-21 | Sealed casing |
Country Status (4)
Country | Link |
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US (1) | US20140083652A1 (en) |
JP (1) | JP5962656B2 (en) |
CN (1) | CN103597309B (en) |
WO (1) | WO2012161334A1 (en) |
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US11744044B2 (en) * | 2020-11-05 | 2023-08-29 | Deeia, Inc. | Loop thermosyphon devices and systems, and related methods |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP6390225B2 (en) * | 2014-07-11 | 2018-09-19 | 富士通株式会社 | Cooling system and electronic device |
JP2022158103A (en) * | 2021-04-01 | 2022-10-17 | 三菱重工業株式会社 | cooling system |
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Also Published As
Publication number | Publication date |
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WO2012161334A1 (en) | 2012-11-29 |
JP5962656B2 (en) | 2016-08-03 |
CN103597309B (en) | 2016-10-12 |
CN103597309A (en) | 2014-02-19 |
JPWO2012161334A1 (en) | 2014-07-31 |
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