US20130048251A1 - Heat dissipation device incorporating heat spreader - Google Patents

Heat dissipation device incorporating heat spreader Download PDF

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Publication number
US20130048251A1
US20130048251A1 US13/227,460 US201113227460A US2013048251A1 US 20130048251 A1 US20130048251 A1 US 20130048251A1 US 201113227460 A US201113227460 A US 201113227460A US 2013048251 A1 US2013048251 A1 US 2013048251A1
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United States
Prior art keywords
chamber
partition board
base
wick structure
dissipation device
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/227,460
Inventor
Jun Xiao
Min Li
Meng Fu
Chun-Chi Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHUN-CHI, FU, MENG, LI, MIN, XIAO, JUN
Publication of US20130048251A1 publication Critical patent/US20130048251A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating a heat spreader.
  • Electronic components such as central processing units (CPUs) comprising numerous circuits operate at high speed and generate substantive heat. Under most circumstances, it is necessary to cool the electronic components in order to maintain safe operating conditions and assure that the electronic components function properly and reliably.
  • a finned metal heat dissipation device is attached to an outer surface of the electronic component to remove the heat therefrom. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
  • FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with an exemplary embodiment of the disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 3 is a cross sectional view of the heat dissipation device of FIG. 1 , taken along a line III-III thereof.
  • FIG. 4 is an enlarged view of a part IV of FIG. 3 .
  • FIG. 5 is an inverted, exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 6 is an inverted view of the heat dissipation device of FIG. 1 .
  • a heat dissipation device in accordance with an exemplary embodiment of the disclosure is used for dissipating heat generated by an electronic component (not shown) mounted on a printed circuit board (not shown).
  • the heat dissipation device comprises a heat spreader 10 for thermally contacting the electronic component, and a fin set 20 disposed on the heat spreader 10 .
  • the heat spreader 10 is flat. In this embodiment, the heat spreader 10 is rectangular in shape.
  • Four through holes 100 are defined at four corners of the heat spreader 10 for extension of four fasteners (not shown).
  • the heat spreader 10 comprises a base 11 , a partition board 12 hermetically placed on the base 11 , and a covering plate 13 hermetically placed on the partition board 12 .
  • the base 11 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof.
  • the base 11 has a rectangular profile. A central portion of the base 11 is recessed downwardly, thereby forming a first receiving portion 110 (as shown in FIG. 2 ).
  • the partition board 12 seals the first receiving portion 110 to corporately form a first chamber 111 between the base 11 and the partition board 12 . In use, the first chamber 111 is vacuum-exhausted, and accommodates working medium therein.
  • the working medium is selected from a liquid which has a relatively low boiling point, such as water, methanol, and alcohol.
  • a first wick structure 114 is formed on a total inner face of the central portion of the base 11 defining the first receiving portion 110 .
  • the first wick structure 114 is selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, and bundle of fibers.
  • An empty zone 112 is defined below a periphery of the base 11 and surrounds the first chamber 111 .
  • the first chamber 111 is placed just above the electronic component. Besides the electronic component mounted on the printed circuit board, there are some other electronic components, so an area of the first chamber 111 is limited in a certain extent for avoiding interference with the other electronic components, and the other electronic components could be received in the empty zones 112 .
  • the partition board 12 is a rectangular plate.
  • the partition board 12 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof.
  • a second wick structure 120 is formed on a bottom face of the partition board 12 in the first chamber 111 .
  • the second wick structure 120 is selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, and bundle of fibers.
  • an outer periphery of the second wick structure 120 is connected to the first wick structure 114 .
  • the first wick structure 114 cooperates with the second wick structure 120 to spread on a total inner face of the first chamber 111 .
  • a third wick structure 122 is formed on a top face of the partition board 12 .
  • the third wick structure 122 is selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, and bundle of fibers.
  • the covering plate 13 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof.
  • the covering plate 13 has a rectangular profile.
  • a center portion of the covering plate 13 is protruded upwardly, thereby forming a second receiving portion 130 .
  • a periphery of the covering plate 13 is an annular frame 132 surrounding the second receiving portion 130 (as shown in FIG. 3 ).
  • the frame 132 is hermetically attached on the partition board 12 , whereby the covering plate 13 cooperates with the partition board 12 to define a second chamber 131 between the covering plate 13 and the partition board 12 .
  • the second chamber 131 is vacuum-exhausted, and accommodates working medium therein.
  • the working medium is selected from a liquid which has a relatively low boiling point, such as water, methanol, and alcohol.
  • the second chamber 131 is located above the first chamber 111 .
  • the second chamber 131 is separated from the first chamber 111 by the partition board 12 .
  • a cross sectional area of the second chamber 131 is larger than that of the first chamber 111 .
  • a fourth wick structure 134 is formed on a total inner face of the second receiving portion 130 .
  • the fourth wick structure 134 is selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, and bundle of fibers.
  • an outer periphery of the fourth wick structure 134 is connected to the third wick structure 122 .
  • the third wick structure 122 cooperates with the fourth wick structure 134 to spread on a total inner face of the second chamber 131 .
  • the second chamber 131 is remote from the base 11 and is separated from the base 11 by the partition board 12 .
  • the fin set 20 comprises a plurality of parallel fins 21 .
  • a passage (not labeled) is defined between every two adjacent fins 21 to allow airflow to flow therethrough.
  • Each of the fins 21 comprises an upright sheet body and a pair of flanges bent horizontally from top and bottom of the sheet body and engaging the sheet body of an adjacent fin 21 .
  • the flanges at a bottom face of the fin set 20 thermally contact a top face of the covering plate 13 .
  • the fin set 20 occupies substantially the whole top face of the covering plate 13 except locations where the through holes 100 are located.
  • the base 11 of the heat spreader 10 thermally contacts and absorbs heat from the electronic component.
  • the working medium in the first chamber 111 is heated and vapored upwardly to reach the partition board 12 of the heat spreader 10 .
  • the vapored working medium exchanges heat with the partition board 12 and then is condensed to liquid.
  • the liquid refluences to the base 11 via the second wick structure 120 and the first wick structure 114 .
  • the working medium in the second chamber 131 is heated and vapored upwardly to reach the covering plate 13 of the heat spreader 10 .
  • the vapored working medium exchanges heat with the covering plate 13 and then is condensed to liquid.
  • the liquid refluences to the partition board 12 via the fourth wick structure 134 and the third wick structure 122 .
  • the vapored and condensed cycle continues, so heat absorbed by the heat spreader 10 is efficiently transferred to the fin set 20 placed on the covering plate 13 to be dissipated into ambient.
  • heat dissipation efficiency of the heat dissipation device is greatly improved.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat spreader and a fin set placed on the heat spreader. The heat spreader includes a base, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board. A first chamber is defined between the base and the partition board, and a second chamber is defined between the partition board and the covering plate.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating a heat spreader.
  • 2. Description of Related Art
  • Electronic components, such as central processing units (CPUs) comprising numerous circuits operate at high speed and generate substantive heat. Under most circumstances, it is necessary to cool the electronic components in order to maintain safe operating conditions and assure that the electronic components function properly and reliably. Typically, a finned metal heat dissipation device is attached to an outer surface of the electronic component to remove the heat therefrom. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
  • However, as the operating speed of the electronic components has been continually upgraded, these kinds of conventional heat dissipation devices can no longer meet the heat dissipation requirements of modern electronic components.
  • What is needed, therefore, is a heat dissipation device which can overcome the above-described problems.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with an exemplary embodiment of the disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.
  • FIG. 3 is a cross sectional view of the heat dissipation device of FIG. 1, taken along a line III-III thereof.
  • FIG. 4 is an enlarged view of a part IV of FIG. 3.
  • FIG. 5 is an inverted, exploded view of the heat dissipation device of FIG. 1.
  • FIG. 6 is an inverted view of the heat dissipation device of FIG. 1.
    •  DETAILED DESCRIPTION
  • Referring to FIGS. 1 and 2, a heat dissipation device in accordance with an exemplary embodiment of the disclosure is used for dissipating heat generated by an electronic component (not shown) mounted on a printed circuit board (not shown). The heat dissipation device comprises a heat spreader 10 for thermally contacting the electronic component, and a fin set 20 disposed on the heat spreader 10. The heat spreader 10 is flat. In this embodiment, the heat spreader 10 is rectangular in shape. Four through holes 100 are defined at four corners of the heat spreader 10 for extension of four fasteners (not shown).
  • Referring to FIGS. 3 and 4 also, the heat spreader 10 comprises a base 11, a partition board 12 hermetically placed on the base 11, and a covering plate 13 hermetically placed on the partition board 12. The base 11 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The base 11 has a rectangular profile. A central portion of the base 11 is recessed downwardly, thereby forming a first receiving portion 110 (as shown in FIG. 2). The partition board 12 seals the first receiving portion 110 to corporately form a first chamber 111 between the base 11 and the partition board 12. In use, the first chamber 111 is vacuum-exhausted, and accommodates working medium therein. The working medium is selected from a liquid which has a relatively low boiling point, such as water, methanol, and alcohol. A first wick structure 114 is formed on a total inner face of the central portion of the base 11 defining the first receiving portion 110. The first wick structure 114 is selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, and bundle of fibers. An empty zone 112 is defined below a periphery of the base 11 and surrounds the first chamber 111. The first chamber 111 is placed just above the electronic component. Besides the electronic component mounted on the printed circuit board, there are some other electronic components, so an area of the first chamber 111 is limited in a certain extent for avoiding interference with the other electronic components, and the other electronic components could be received in the empty zones 112.
  • Referring to FIGS. 5 and 6 also, the partition board 12 is a rectangular plate. The partition board 12 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. A second wick structure 120 is formed on a bottom face of the partition board 12 in the first chamber 111. The second wick structure 120 is selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, and bundle of fibers. When the partition board 12 is assembled on the base 11, an outer periphery of the second wick structure 120 is connected to the first wick structure 114. In other words, the first wick structure 114 cooperates with the second wick structure 120 to spread on a total inner face of the first chamber 111. A third wick structure 122 is formed on a top face of the partition board 12. The third wick structure 122 is selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, and bundle of fibers.
  • The covering plate 13 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The covering plate 13 has a rectangular profile. A center portion of the covering plate 13 is protruded upwardly, thereby forming a second receiving portion 130. A periphery of the covering plate 13 is an annular frame 132 surrounding the second receiving portion 130 (as shown in FIG. 3). The frame 132 is hermetically attached on the partition board 12, whereby the covering plate 13 cooperates with the partition board 12 to define a second chamber 131 between the covering plate 13 and the partition board 12. In use, the second chamber 131 is vacuum-exhausted, and accommodates working medium therein. The working medium is selected from a liquid which has a relatively low boiling point, such as water, methanol, and alcohol. The second chamber 131 is located above the first chamber 111. The second chamber 131 is separated from the first chamber 111 by the partition board 12. A cross sectional area of the second chamber 131 is larger than that of the first chamber 111. A fourth wick structure 134 is formed on a total inner face of the second receiving portion 130. The fourth wick structure 134 is selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, and bundle of fibers. When the covering plate 13 is assembled on the partition board 12, an outer periphery of the fourth wick structure 134 is connected to the third wick structure 122. In other words, the third wick structure 122 cooperates with the fourth wick structure 134 to spread on a total inner face of the second chamber 131. The second chamber 131 is remote from the base 11 and is separated from the base 11 by the partition board 12.
  • The fin set 20 comprises a plurality of parallel fins 21. A passage (not labeled) is defined between every two adjacent fins 21 to allow airflow to flow therethrough. Each of the fins 21 comprises an upright sheet body and a pair of flanges bent horizontally from top and bottom of the sheet body and engaging the sheet body of an adjacent fin 21. The flanges at a bottom face of the fin set 20 thermally contact a top face of the covering plate 13. The fin set 20 occupies substantially the whole top face of the covering plate 13 except locations where the through holes 100 are located.
  • In use of the heat dissipation device, the base 11 of the heat spreader 10 thermally contacts and absorbs heat from the electronic component. The working medium in the first chamber 111 is heated and vapored upwardly to reach the partition board 12 of the heat spreader 10. At the partition board 12, the vapored working medium exchanges heat with the partition board 12 and then is condensed to liquid. The liquid refluences to the base 11 via the second wick structure 120 and the first wick structure 114. As heat accumulated in the partition board 12, the working medium in the second chamber 131 is heated and vapored upwardly to reach the covering plate 13 of the heat spreader 10. Then the vapored working medium exchanges heat with the covering plate 13 and then is condensed to liquid. The liquid refluences to the partition board 12 via the fourth wick structure 134 and the third wick structure 122. The vapored and condensed cycle continues, so heat absorbed by the heat spreader 10 is efficiently transferred to the fin set 20 placed on the covering plate 13 to be dissipated into ambient. Thus, heat dissipation efficiency of the heat dissipation device is greatly improved.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present embodiment(s) have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (20)

1. A heat dissipation device comprising:
a heat spreader comprising a base for absorbing heat from a heat source, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board, a first chamber sealed being defined between the base and the partition board, and a second sealed chamber being defined between the partition board and the covering plate, the second chamber being remote from the base; and
a fin set placed on the heat spreader.
2. The heat dissipation device of claim 1, wherein a central portion of the base is recessed downwardly to form a first receiving portion, and the partition board seals the first receiving portion to form the first chamber.
3. The heat dissipation device of claim 2, wherein an empty zone is defined under a periphery of the base and surrounds the first chamber.
4. The heat dissipation device of claim 2, wherein a central portion of the covering plate is protruded upwardly to form a second receiving portion, and the partition board seals the second receiving portion to form the second chamber.
5. The heat dissipation device of claim 4, wherein an area of the first chamber is smaller than that of the second chamber.
6. The heat dissipation device of claim 4, wherein a first wick structure is formed on an inner face of the first receiving portion.
7. The heat dissipation device of claim 6, wherein a second wick structure is formed on a bottom face of the partition board, and an outer periphery of the second wick structure is communicated with the first wick structure.
8. The heat dissipation device of claim 4, wherein a fourth wick structure is formed on an inner face of the second receiving portion.
9. The heat dissipation device of claim 8, wherein a third wick structure is formed on a top face of the partition board, and an outer periphery of the third wick structure is communicated with the fourth wick structure.
10. The heat dissipation device of claim 1, wherein the first chamber and the second chamber are both vacuum-exhausted, and accommodate working medium therein.
11. The heat dissipation device of claim 1, wherein the second chamber is located above the first chamber.
12. A heat spreader comprising:
a base for absorbing heat from a heat source;
a partition board hermetically placed on the base, and a first chamber being defined between the base and the partition board; and
a covering plate hermetically placed on the partition board, a second chamber being defined between the partition board and the covering plate, and the second chamber being separated from the base by the partition board.
13. The heat spreader of claim 12, wherein a center portion of the base is recessed downwardly to form a first receiving portion, and the partition board seals the first receiving portion to form the first chamber.
14. The heat spreader of claim 13, wherein a plurality of empty zones are defined at a bottom of the base and surround the first chamber.
15. The heat spreader of claim 13, wherein a center portion of the covering plate is protruded upwardly to form a second receiving portion, and the partition board seals the second receiving portion to form the second chamber.
16. The heat spreader of claim 15, wherein an area of the first chamber is smaller than that of the second chamber.
17. The heat spreader of claim 15, wherein a first wick structure is formed on an inner face of the first receiving portion, a second wick structure is formed on a bottom face of the partition board, and an outer periphery of the second wick structure is communicated with the first wick structure.
18. The heat spreader of claim 15, wherein a fourth wick structure is formed on an inner face of the second receiving portion, a third wick structure is formed on a top face of the partition board, and an outer periphery of the third wick structure is communicated with the fourth wick structure.
19. The heat spreader of claim 12, wherein the first chamber and the second chamber are both vacuum-exhausted, and accommodate a working medium or fluid therein.
20. A heat spreader comprising a base and a cover cooperatively defining a sealed space therein, a partition board being placed on the sealed base and dividing the sealed base into two separated chambers, each of the two separated chambers accommodating working medium therein.
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