US20120241133A1 - Vapor chamber and method for manufacturing the same - Google Patents

Vapor chamber and method for manufacturing the same Download PDF

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Publication number
US20120241133A1
US20120241133A1 US13/172,597 US201113172597A US2012241133A1 US 20120241133 A1 US20120241133 A1 US 20120241133A1 US 201113172597 A US201113172597 A US 201113172597A US 2012241133 A1 US2012241133 A1 US 2012241133A1
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US
United States
Prior art keywords
grooves
vapor chamber
heat absorbing
plate
absorbing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/172,597
Inventor
Qing-Ping Yan
De-Yu Wang
Jiang-Jun Hu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HU, JIANG-JUN, WANG, DE-YU, YAN, Qing-ping
Publication of US20120241133A1 publication Critical patent/US20120241133A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the present disclosure relates to vapor chambers and, more particularly, to a vapor chamber having stable and reliable performance and a method for manufacturing such vapor chamber.
  • Vapor chambers are used to dissipate and transfer heat generated by electronic components.
  • Vapor chambers include a plate-shaped container, a wick structure formed on inner surfaces of the container, and working fluid sealed inside the container.
  • the working fluid is generally limited by the wick structure and flows in a single direction, thereby negatively influencing heat dissipation efficiency of the vapor chamber.
  • FIG. 1 is an assembled, isometric view of a vapor chamber in accordance with a first embodiment of the disclosure.
  • FIG. 2 is an exploded view of the vapor chamber of FIG. 1 .
  • FIG. 3 is an enlarged view of a circled portion III of FIG. 2 .
  • FIG. 4 is an inverted view of the vapor chamber of FIG. 2 .
  • FIG. 5 is an isometric view of a vapor chamber in accordance with a second embodiment of the present disclosure.
  • a vapor chamber 100 in accordance with a first embodiment of the present disclosure comprises a heat absorbing plate 10 , a heat dissipating plate 30 , a first wick structure 20 integrally extending from a top surface of the heat absorbing plate 10 and facing the heat dissipating plate 30 , and a second wick structure 40 tightly attached to a bottom surface of the heat dissipating plate 30 .
  • the heat dissipating plate 30 covers the heat absorbing plate 10 to form a hermetic container in the vapor chamber 100 .
  • Working fluid is hermetically contained in the container of the vapor chamber 100 to act as a heat transfer liquid.
  • the heat absorbing plate 10 is made of aluminum.
  • the heat absorbing plate 10 is rectangular and a protrusion 11 integrally extends from a central portion thereof. Outer edges of the heat absorbing plate 10 are exposed for connecting to the heat dissipating plate 30 .
  • the first wick structure 20 is integrally formed at the protrusion 11 .
  • the first wick structure 20 includes a number of parallel first grooves 21 and a number of parallel second grooves 23 intersecting the first grooves 21 .
  • the first grooves 21 are made during forming the protrusion 11 .
  • the second grooves 23 are made by machining after the protrusion 11 is formed.
  • Each of the first grooves 21 extends lengthways from one end to an opposite end of the protrusion 11 .
  • Each of the first grooves 21 is substantially perpendicular to each of the second grooves 23 .
  • Each of the first grooves 21 and the second grooves 23 has a V-shaped cross-section.
  • the heat dissipating plate 30 is made of metal having good thermal conductivity, such as aluminum.
  • the heat dissipating plate 30 includes a top plate 31 and two sidewalls 33 extending down from edges of the top plate 31 .
  • the top plate 31 is rectangular and corresponds to the heat absorbing plate 10 .
  • the sidewalls 33 are soldered in place to the exposed edges of the heat absorbing plate 10 .
  • the second wick structure 40 can be made of metal powders such as copper powders via sintering, or can be made by weaving of metal wires.
  • heat generated by an electronic component is absorbed by the heat absorbing plate 10 .
  • the heat absorbed by the heat absorbing plate 10 vaporizes the working fluid in the vapor chamber 100 .
  • the vapor flows along the intersecting first grooves 21 and the second grooves 23 to the heat dissipating plate 30 .
  • the vapor exchanges the heat to the heat dissipating plate 30 , and in so doing, condenses into working fluid and returns back by the second wick structure 40 to the heat absorbing plate 10 for another cycle.
  • the vapor can quickly flow along the first grooves 21 and the second grooves 23 , and the working fluid can be uniformly guided back to the heat absorbing plate 10 for another cycle, thereby improving the heat dissipation efficiency of the vapor chamber 100 .
  • An exemplary method for manufacturing a vapor chamber 100 includes steps as follows:
  • a heat absorbing plate 10 is provided.
  • the heat absorbing plate 10 is made of aluminum.
  • the heat absorbing plate 10 is extruded to form the protrusion 11 with a plurality of first grooves 21 defined therein;
  • a plurality of second grooves 23 are machined into the heat absorbing plate 10 intersecting the first grooves 21 , thereby forming the heat absorbing plate 10 with a first wick structure 20 having the first grooves 21 and the second grooves 23 ;
  • a heat dissipating plate 30 is provided with a second wick structure 40 tightly attached to a bottom surface thereof.
  • the heat dissipating plate 30 is soldered to the heat absorbing plate 10 to form a container;
  • a vapor chamber in accordance with a second embodiment of the present disclosure comprises a heat absorbing plate 10 a.
  • the heat absorbing plate 10 a includes a first wick structure 20 a defining a number of parallel first grooves 21 a and a number of parallel second grooves 23 a.
  • the first grooves 21 a and the second grooves 23 a each have a rectangular cross-section.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A vapor chamber includes a heat absorbing plate and a heat dissipating plate attached to the heat absorbing plate. The heat absorbing plate includes a wick structure thereon facing the heat dissipating plate. The wick structure defines a plurality of first grooves and a plurality of second grooves intersecting the first grooves. The heat dissipating plate forms a hermetically sealed container in cooperation with the heat absorbing plate. The hermetically sealed container receives the wick structure therein. Working fluid is sealed inside the container and flows in the first grooves and the second grooves.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to vapor chambers and, more particularly, to a vapor chamber having stable and reliable performance and a method for manufacturing such vapor chamber.
  • 2. Description of Related Art
  • Generally, vapor chambers are used to dissipate and transfer heat generated by electronic components. Vapor chambers include a plate-shaped container, a wick structure formed on inner surfaces of the container, and working fluid sealed inside the container. The working fluid is generally limited by the wick structure and flows in a single direction, thereby negatively influencing heat dissipation efficiency of the vapor chamber.
  • What is needed, therefore, is a vapor chamber which can overcome the limitation described.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of a vapor chamber in accordance with a first embodiment of the disclosure.
  • FIG. 2 is an exploded view of the vapor chamber of FIG. 1.
  • FIG. 3 is an enlarged view of a circled portion III of FIG. 2.
  • FIG. 4 is an inverted view of the vapor chamber of FIG. 2.
  • FIG. 5 is an isometric view of a vapor chamber in accordance with a second embodiment of the present disclosure.
    •  DETAILED DESCRIPTION
  • Referring to FIGS. 1-2, a vapor chamber 100 in accordance with a first embodiment of the present disclosure comprises a heat absorbing plate 10, a heat dissipating plate 30, a first wick structure 20 integrally extending from a top surface of the heat absorbing plate 10 and facing the heat dissipating plate 30, and a second wick structure 40 tightly attached to a bottom surface of the heat dissipating plate 30. The heat dissipating plate 30 covers the heat absorbing plate 10 to form a hermetic container in the vapor chamber 100. Working fluid is hermetically contained in the container of the vapor chamber 100 to act as a heat transfer liquid.
  • Referring also to FIG. 3, the heat absorbing plate 10 is made of aluminum. The heat absorbing plate 10 is rectangular and a protrusion 11 integrally extends from a central portion thereof. Outer edges of the heat absorbing plate 10 are exposed for connecting to the heat dissipating plate 30. The first wick structure 20 is integrally formed at the protrusion 11. The first wick structure 20 includes a number of parallel first grooves 21 and a number of parallel second grooves 23 intersecting the first grooves 21. The first grooves 21 are made during forming the protrusion 11. The second grooves 23 are made by machining after the protrusion 11 is formed. Each of the first grooves 21 extends lengthways from one end to an opposite end of the protrusion 11. Each of the first grooves 21 is substantially perpendicular to each of the second grooves 23. Each of the first grooves 21 and the second grooves 23 has a V-shaped cross-section.
  • Referring to FIG. 4, the heat dissipating plate 30 is made of metal having good thermal conductivity, such as aluminum. The heat dissipating plate 30 includes a top plate 31 and two sidewalls 33 extending down from edges of the top plate 31. The top plate 31 is rectangular and corresponds to the heat absorbing plate 10. The sidewalls 33 are soldered in place to the exposed edges of the heat absorbing plate 10. The second wick structure 40 can be made of metal powders such as copper powders via sintering, or can be made by weaving of metal wires.
  • In operation of the vapor chamber 100, heat generated by an electronic component is absorbed by the heat absorbing plate 10. The heat absorbed by the heat absorbing plate 10 vaporizes the working fluid in the vapor chamber 100. The vapor flows along the intersecting first grooves 21 and the second grooves 23 to the heat dissipating plate 30. The vapor exchanges the heat to the heat dissipating plate 30, and in so doing, condenses into working fluid and returns back by the second wick structure 40 to the heat absorbing plate 10 for another cycle. Since the first grooves 21 and the second grooves 23 intersect each other, the vapor can quickly flow along the first grooves 21 and the second grooves 23, and the working fluid can be uniformly guided back to the heat absorbing plate 10 for another cycle, thereby improving the heat dissipation efficiency of the vapor chamber 100.
  • An exemplary method for manufacturing a vapor chamber 100 includes steps as follows:
  • Firstly, a heat absorbing plate 10 is provided. The heat absorbing plate 10 is made of aluminum. The heat absorbing plate 10 is extruded to form the protrusion 11 with a plurality of first grooves 21 defined therein;
  • Secondly, a plurality of second grooves 23 are machined into the heat absorbing plate 10 intersecting the first grooves 21, thereby forming the heat absorbing plate 10 with a first wick structure 20 having the first grooves 21 and the second grooves 23;
  • Thirdly, a heat dissipating plate 30 is provided with a second wick structure 40 tightly attached to a bottom surface thereof. The heat dissipating plate 30 is soldered to the heat absorbing plate 10 to form a container; and
  • Finally, filling the container with working liquid and sealing the container.
  • Referring to FIG. 5, a vapor chamber in accordance with a second embodiment of the present disclosure comprises a heat absorbing plate 10 a. The heat absorbing plate 10 a includes a first wick structure 20 a defining a number of parallel first grooves 21 a and a number of parallel second grooves 23 a. Different from the vapor chamber 100 of the first embodiment of the present disclosure, the first grooves 21 a and the second grooves 23 a each have a rectangular cross-section.
  • It is to be understood, however, that even though numerous characteristics and advantages of certain embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (12)

1. A vapor chamber comprising:
a heat absorbing plate for contacting a heat-generating component, the heat absorbing plate comprising a wick structure thereon, the wick structure defining a plurality of first grooves and a plurality of second grooves intersecting the first grooves;
a heat dissipating plate attached on the heat absorbing plate, and forming a hermetically sealed container in cooperation with the heat absorbing plate, the hermetically sealed container receiving the wick structure; and
working fluid being sealed inside the container and flowing in the first grooves and the second grooves.
2. The vapor chamber of claim 1, wherein each of the first grooves is approximately perpendicular to the second grooves.
3. The vapor chamber of claim 1, wherein each of the first grooves and the second grooves has a substantially V-shaped cross-section.
4. The vapor chamber of claim 1, wherein each of the first grooves and the second grooves has a substantially rectangular cross-section.
5. The vapor chamber of claim 1, further comprising an additional wick structure in the container and tightly attached to the heat dissipating plate.
6. The vapor chamber of claim 5, wherein the additional wick structure is metal powders or waved metal wires.
7. The vapor chamber of claim 1, wherein a protrusion integrally extends from the heat absorbing plate toward the heat dissipating plate, the first grooves and the second grooves of the wick structure are defined at the protrusion.
8. The vapor chamber of claim 7, wherein the heat dissipating plate comprises a top plate and two sidewalls extending down from edges of the top plate, the sidewalls soldered in place to edges of the heat absorbing plate.
9. A method for manufacturing a vapor chamber, the method comprising:
providing an aluminum heat absorbing plate extruded to define a plurality of first grooves thereon;
machining a plurality of second grooves on the heat absorbing plate and intersecting the first grooves;
providing a heat dissipating plate and soldering the heat dissipating plate on the heat absorbing plate to form a container; and
filling the container with working liquid and sealing the container.
10. The method of claim 9, wherein each of the first grooves is approximately perpendicular to the second grooves.
11. The method of claim 9, wherein each of the first grooves and the second grooves has a substantially V-shaped cross-section.
12. The method of claim 9, wherein each of the first grooves and the second grooves has a substantially rectangular cross-section.
US13/172,597 2011-03-22 2011-06-29 Vapor chamber and method for manufacturing the same Abandoned US20120241133A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110068436.0A CN102693949A (en) 2011-03-22 2011-03-22 Heat spreader
CN201110068436.0 2011-03-22

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687455A (en) * 2013-12-31 2014-03-26 上海交通大学 Vapor chamber
CN103997878A (en) * 2014-05-16 2014-08-20 中国电子科技集团公司第二十九研究所 Phase change heat dissipation device and manufacturing method thereof
GB2511354A (en) * 2013-03-01 2014-09-03 Iceotope Ltd A module for cooling one or more heat generating components
CN105333759A (en) * 2014-08-06 2016-02-17 双鸿科技股份有限公司 Etching temperature uniformization board
US20170020026A1 (en) * 2015-07-14 2017-01-19 Celsia Technologies Taiwan, Inc. Vapor chamber structure
US9835383B1 (en) 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick
US20190113290A1 (en) * 2017-10-12 2019-04-18 Tai-Sol Electronics Co., Ltd. Vapor chamber with inner ridge forming passage
US20190215988A1 (en) * 2018-01-05 2019-07-11 Getac Technology Corporation Vapor chamber and heat dissipation device
US10744603B2 (en) 2015-03-16 2020-08-18 Dana Canada Corporation Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same
CN114485240A (en) * 2022-01-12 2022-05-13 清华大学 Directional soaking plate and chip
US11466937B2 (en) * 2017-12-13 2022-10-11 Asia Vital Components Co., Ltd. Basic structural body for constructing heat dissipation device and heat dissipation device

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CN103712496A (en) * 2012-10-09 2014-04-09 元镫金属股份有限公司 Thin composite-type guide plate pipe
CN105636406A (en) * 2014-11-07 2016-06-01 泰硕电子股份有限公司 Radiating module of mobile device
CN104534906B (en) * 2015-01-14 2016-04-20 厦门大学 A kind of flat-plate heat pipe and manufacture method thereof with nested type porous wick structure
WO2017041708A1 (en) * 2015-09-07 2017-03-16 Fantome Limited Vapor chamber for mobile communication devices
CN105352351B (en) * 2015-11-03 2018-07-06 刘树宇 A kind of temperature-uniforming plate improved structure
CN105865243A (en) * 2016-05-14 2016-08-17 广东工业大学 Novel flat plate thiele tube and preparation method thereof
US11578927B2 (en) * 2017-02-24 2023-02-14 Dai Nippon Printing Co., Ltd. Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamber
CN109121354A (en) * 2017-06-23 2019-01-01 泽鸿(广州)电子科技有限公司 Temperature-uniforming plate
CN107560475B (en) * 2017-09-07 2019-07-23 中微冷却技术（深圳）有限公司 Temperature-uniforming plate and its manufacturing method
CN111822712B (en) * 2019-04-15 2021-08-24 广州力及热管理科技有限公司 Method for manufacturing thin type temperature-equalizing plate
CN111043895B (en) * 2019-12-27 2021-12-14 哈尔滨工业大学（威海） Small-sized flat heat pipe evaporation cover plate and micro-mould pressing forming mould thereof
CN111660025A (en) * 2019-12-27 2020-09-15 东莞市万维热传导技术有限公司 Sealing welding method for multi-cavity type temperature-equalizing plate
CN113891620B (en) * 2021-09-27 2023-05-23 联想(北京)有限公司 Heat abstractor and electronic equipment

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US7392836B2 (en) * 2005-09-15 2008-07-01 National Tsing Hua University Flat-plate heat pipe containing channels
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US6679318B2 (en) * 2002-01-19 2004-01-20 Allan P Bakke Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability
US7392836B2 (en) * 2005-09-15 2008-07-01 National Tsing Hua University Flat-plate heat pipe containing channels
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2511354A (en) * 2013-03-01 2014-09-03 Iceotope Ltd A module for cooling one or more heat generating components
US9835383B1 (en) 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick
CN103687455A (en) * 2013-12-31 2014-03-26 上海交通大学 Vapor chamber
CN103997878A (en) * 2014-05-16 2014-08-20 中国电子科技集团公司第二十九研究所 Phase change heat dissipation device and manufacturing method thereof
CN105333759A (en) * 2014-08-06 2016-02-17 双鸿科技股份有限公司 Etching temperature uniformization board
US10744603B2 (en) 2015-03-16 2020-08-18 Dana Canada Corporation Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same
US20170020026A1 (en) * 2015-07-14 2017-01-19 Celsia Technologies Taiwan, Inc. Vapor chamber structure
US20190113290A1 (en) * 2017-10-12 2019-04-18 Tai-Sol Electronics Co., Ltd. Vapor chamber with inner ridge forming passage
US11466937B2 (en) * 2017-12-13 2022-10-11 Asia Vital Components Co., Ltd. Basic structural body for constructing heat dissipation device and heat dissipation device
US20190215988A1 (en) * 2018-01-05 2019-07-11 Getac Technology Corporation Vapor chamber and heat dissipation device
CN114485240A (en) * 2022-01-12 2022-05-13 清华大学 Directional soaking plate and chip

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Publication number Publication date
CN102693949A (en) 2012-09-26
TW201240587A (en) 2012-10-01

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Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

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Effective date: 20110615

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