TWM524593U - light transceiver device with heat dissipation structure - Google Patents

Description

Optical transceiver with heat dissipation structure

The present invention relates to an optical transceiver device, and more particularly to an optical transceiver device having a heat dissipation structure.

In recent years, due to the increasing demand for information, the industry has continuously developed more and newer communication transmission technologies in response to this urgent need, in order to provide a faster transmission speed, longer distance and higher stability. Communication system. Over time, the transmission medium has been upgraded from the general signal line to the coaxial cable, and then to the fiber-optic communication system. Since the optical fiber communication system uses optical signals instead of electrical signals for information transmission, the information transmission through the optical fiber communication system is not affected by electromagnetic interference, and the process of transmitting traditional electrical signals through copper wires can be avoided. Problems such as power loss and transmission attenuation.

The optical fiber interface transceiver plays an extremely important role in the optical fiber communication network. The optical interface transceiver converts the electrical signal and the optical signal through the photoelectric conversion module provided therein to make various electronic devices Can be connected to each other through a fiber optic communication network. In general, fiber optic interface transceivers have evolved into a variety of package formats, including early 1×9 pin analog connectors, Gigabit Interface converter (GBIC), and small Package Form Transceiver (SFF), Small Form Factor Pluggable (SFP), Quad Small Form Factor Pluggable (QSFP) and 10,000 10 Gigabit Small Form Factor Pluggable (XFP), among which GBIC, SFP, QSFP, Micro QSFP and XFP are hot-swappable packages.

The above-mentioned optical fiber interface transceiver is generally installed and thermally contacted with the metal shell member of the electronic device, and a heat dissipating structure is designed on the metal shell member of the electronic device to allow the heat generated by the optical fiber interface receiver to be conducted to the metal. The heat dissipation structure on the shell member is used for heat dissipation. However, due to the recent development of new packaging formats, such as: Micro Quad Small Form Factor Pluggable (Micro QSFP). Therefore, it is necessary for the R&D personnel to design a heat dissipation structure for the fiber-optic interface transceiver of the new package to improve the transmission and reception performance of the Micro Quad Small Form Factor Pluggable (Micro QSFP).

The invention provides an optical transceiver device with a heat dissipation structure, thereby improving the heat dissipation performance of the optical transceiver device.

The optical transceiver device with the heat dissipation structure disclosed in one embodiment of the present invention is adapted to be detachably mounted on an assembly shell. The optical transceiver device having the heat dissipation structure comprises a heat conduction shell and an optical transceiver assembly. The heat conducting shell is mounted in the assembled casing. The heat conducting shell comprises a body and a plurality of heat dissipating structures. The body has an accommodating space and an opening corresponding to the accommodating space. These heat dissipating structures protrude from one side of the body with respect to the accommodating space. The optical transceiver assembly has a plug interface. The optical transceiver component is located in the accommodating space, and the opening exposes the plug interface.

According to the optical transceiver device with the heat dissipation structure disclosed in the above embodiments, since the heat dissipation structure is directly formed on the body of the heat conduction case instead of the assembly case, the variation of the contact quality between the heat conduction case and the assembly case can be eliminated, and Improve the heat dissipation effect of the optical transceiver.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the present invention, and to provide a further explanation of the scope of the present patent application.

Please refer to Figure 1 to Figure 3. 1 is an exploded perspective view of an optical transceiver and an assembly case according to a first embodiment of the present invention. 2 is a top plan view of the optical transceiver of FIG. 1. 3 is a side elevational view of the optical transceiver of FIG. 1.

The optical transceiver 10 having the heat dissipation structure of the present embodiment is adapted to be detachably mounted to an assembly case 20. The assembly housing 20 is mounted on a circuit board (not shown) and can be inserted into the optical transceiver 10. That is, the assembly housing 20 has an insertion space 22 and a heat dissipation opening 24 corresponding to the insertion space 22. The optical transceiver device 10 is, for example, a Micro Quad Small Form Factor Pluggable (Micro QSFP).

The optical transceiver 10 having a heat dissipation structure includes a heat conducting housing 100 and an optical transceiver assembly 200. The heat conducting case 100 is mounted in the insertion space 22 of the assembly case 20. The heat conducting shell 100 includes a body 110 and a plurality of heat dissipation structures 120. The body 110 has an accommodating space 111 and an opening 112 corresponding to the accommodating space 111.

The heat dissipation structures 120 protrude from one side of the body 110 relative to the accommodating space 111 , and the heat dissipation openings 24 of the assembly case 20 expose the heat dissipation structures 120 . In detail, the body 110 has a top surface 113 and a bottom surface 114 opposite to each other. The top surface 113 and the bottom surface 114 both face away from the accommodating space 111, and the top surface 113 is located above the bottom surface 114. The top surface 113 has a long side 113a. The long side 113a is parallel to one of the central axes L of the opening 112. These heat dissipation structures 120 are, for example, sheet-like heat dissipation fins. The heat dissipation structures 120 protrude from the top surface 113 of the body 110 and are at an angle θ with the long sides 113a. In this embodiment, the angle θ between the heat dissipation structure 120 and the long side 113a is 45 degrees, but is not limited thereto. In other embodiments, the angle θ may also be the remaining angles that conform to the acute angle.

It should be noted that, in this embodiment, the body 110 and the heat dissipation structure 120 are integrally formed, but not limited thereto. In other embodiments, the body 110 and the heat dissipation structure 120 may also be a combined structure. For example, the system between the two is bonded through a thermal conductive adhesive.

In addition, the heat dissipation structures 120 of the embodiment have a guiding slope 121 on a side away from the opening 120. The light transmissive device 10 can be more smoothly inserted into the assembly case 20 by the assistance of the guide bevel 121.

The optical transceiver assembly 200 has a plug interface 210. The plug interface 210 is used for plugging in an optical fiber (not shown). The optical transceiver assembly 200 is located in the accommodating space 110, and the opening 120 exposes the insertion interface 210.

Compared with the case where the heat dissipation fins are fabricated on the metal shell member, the optical transceiver assembly 200 is directly formed on the body 110 of the heat conduction case 100 instead of the assembly case 20, so that the heat conduction case 100 and the assembly can be eliminated. The variation in the contact quality between the shells 20 further enhances the heat dissipation effect of the optical transceiver 10.

The heat dissipation structure 120 is a tilted fin, but is not limited thereto. In other embodiments, the designer can adjust the heat dissipation structure 120 according to the distribution of the gas field, please refer to FIG. 4 to FIG. 4 is an exploded perspective view of an optical transceiver and an assembly case according to a second embodiment of the present invention. FIG. 5 is a top plan view of the optical transceiver of FIG. 4. FIG. Figure 6 is a side elevational view of the optical transceiver of Figure 4.

The optical transceiver 10a of the present embodiment having a heat dissipation structure is adapted to be detachably mounted to an assembly case 20. The assembly housing 20 is mounted on a circuit board (not shown) and is detachable for the optical transceiver 10a. That is, the assembly housing 20 has an insertion space 22 and a heat dissipation opening 24 corresponding to the insertion space 22.

The optical transceiver 10a having a heat dissipation structure includes a heat conducting housing 100a and an optical transceiver assembly 200. The heat conducting case 100a is mounted in the insertion space 22 of the assembly case 20. The heat conducting housing 100a includes a body 110 and a plurality of heat dissipation structures 120a. The body 110 has an accommodating space 111 and an opening 112 corresponding to the accommodating space 111.

The heat dissipation structures 120a protrude from one side of the body 110 relative to the accommodating space 111, and the heat dissipation openings 24 of the assembly case 20 expose the heat dissipation structures 120a. In detail, the body 110 has a top surface 113 and a bottom surface 114 opposite to each other. The top surface 113 and the bottom surface 114 both face away from the accommodating space 111, and the top surface 113 is located above the bottom surface 114. These heat dissipation structures 120a protrude from the top surface 113 of the body 110. The heat dissipation structures 120a are, for example, wavy heat dissipation fins, and the heat dissipation structures 120a have a plurality of curvature center lines C1 to C3. These curvature centerlines C1 to C3 are parallel to the normal direction N of the top surface 130.

The optical transceiver assembly 200 has a plug interface 210. The plug interface 210 is used for plugging in an optical fiber (not shown). The optical transceiver assembly 200 is located in the accommodating space 110, and the opening 120 exposes the insertion interface 210.

Please refer to Figure 7 to Figure 9. FIG. 7 is an exploded perspective view of an optical transceiver device and an assembly case according to a third embodiment of the present invention. 8 is a top plan view of the optical transceiver of FIG. 7. 9 is a side elevational view of the optical transceiver of FIG. 7.

The optical transceiver 10b of the present embodiment having a heat dissipation structure is adapted to be detachably mounted to an assembly case 20. The assembly housing 20 is mounted on a circuit board (not shown) and can be inserted into the optical transceiver 10b. That is, the assembly housing 20 has an insertion space 22 and a heat dissipation opening 24 corresponding to the insertion space 22.

The optical transceiver 10b with a heat dissipation structure includes a heat conducting shell 100b and an optical transceiver assembly 200. The heat conducting case 100b is mounted in the insertion space 22 of the assembly case 20. The heat conducting shell 100b includes a body 110 and a plurality of heat dissipation structures 120b. The body 110 has an accommodating space 111 and an opening 112 corresponding to the accommodating space 111.

The heat dissipation structures 120b protrude from one side of the body 110 relative to the accommodating space 111, and the heat dissipation openings 24 of the assembly case 20 expose the heat dissipation structures 120b. In detail, the body 110 has a top surface 113 and a bottom surface 114 opposite to each other. The top surface 113 and the bottom surface 114 both face away from the accommodating space 111, and the top surface 113 is located above the bottom surface 114. These heat dissipation structures 120 protrude from the top surface 113 of the body 110. The heat dissipating structures 120a are, for example, columnar in shape and arranged in an array to form a plurality of intersecting straight channels 130 and a plurality of lateral channels 140.

The optical transceiver assembly 200 has a plug interface 210. The plug interface 210 is used for plugging in an optical fiber (not shown). The optical transceiver assembly 200 is located in the accommodating space 110, and the opening 120 exposes the insertion interface 210.

According to the optical transceiver device with the heat dissipation structure disclosed in the above embodiments, since the heat dissipation structure is directly formed on the body of the heat conduction case instead of the assembly case, the variation of the contact quality between the heat conduction case and the assembly case can be eliminated, and Improve the heat dissipation effect of the optical transceiver.

Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the present invention, and it is intended that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of the new patent protection shall be subject to the definition of the scope of the patent application attached to this specification.

10, 10a, 10b‧‧‧ optical transceiver

20‧‧‧Assembled shell

22‧‧‧Interposed space

24‧‧‧ vents

100, 100a, 100b‧‧‧ heat-conducting shell

110‧‧‧ body

111‧‧‧ accommodating space

112‧‧‧ openings

113‧‧‧ top surface

113a‧‧‧Longside

114‧‧‧ bottom

120, 120a, 120b‧‧‧ heat dissipation structure

121‧‧‧Bevel

130‧‧‧Direct channel

140‧‧‧transverse channel

200‧‧‧Optical transceiver components

210‧‧‧ Plug interface

Θ‧‧‧ angle

C1, C2, C3‧‧‧ curvature centerline

N‧‧‧ normal direction

1 is an exploded perspective view of an optical transceiver and an assembly case according to a first embodiment of the present invention. 2 is a top plan view of the optical transceiver of FIG. 1. 3 is a side elevational view of the optical transceiver of FIG. 1. 4 is an exploded perspective view of an optical transceiver and an assembly case according to a second embodiment of the present invention. FIG. 5 is a top plan view of the optical transceiver of FIG. 4. FIG. Figure 6 is a side elevational view of the optical transceiver of Figure 4. FIG. 7 is an exploded perspective view of an optical transceiver device and an assembly case according to a third embodiment of the present invention. 8 is a top plan view of the optical transceiver of FIG. 7. 9 is a side elevational view of the optical transceiver of FIG. 7.

10‧‧‧Optical transceiver

20‧‧‧Assembled shell

22‧‧‧Interposed space

24‧‧‧ vents

100‧‧‧thermal shell

110‧‧‧ body

111‧‧‧ accommodating space

112‧‧‧ openings

113‧‧‧ top surface

113a‧‧‧Longside

114‧‧‧ bottom

120‧‧‧heat dissipation structure

121‧‧‧Bevel

200‧‧‧Optical transceiver components

210‧‧‧ Plug interface

Claims (10)

An optical transceiver device having a heat dissipation structure is adapted to be detachably mounted on an assembly shell. The optical transceiver device comprises: a heat-conducting shell mounted in the assembly shell, the heat-conducting shell comprising a body and a plurality of heat dissipation structures The body has an accommodating space and an opening corresponding to the accommodating space, the heat dissipating structure protrudes from the side of the body relative to the accommodating space; and an optical transceiver assembly has a plug interface, the light The transceiver component is located in the accommodating space, and the opening exposes the plug interface. The optical transceiver device of claim 1, wherein the body has an opposite top surface and a bottom surface facing away from the receiving space, and the heat dissipating structures protrude from the top surface. The optical transceiver device with a heat dissipation structure according to claim 2, wherein the top mask has a long side, the long side is parallel to a central axis of the opening, and the heat dissipation structures are in a sheet shape, and The long side clip has an acute angle. The optical transceiver device with a heat dissipation structure according to claim 3, wherein the heat dissipation structures are clamped to the long side by 45 degrees. The optical transceiver device with a heat dissipation structure according to claim 2, wherein the heat dissipation structures are all wave-shaped. The optical transceiver device with a heat dissipation structure according to claim 5, wherein the heat dissipation structures have a plurality of curvature center lines, and the curvature center lines are parallel to a normal direction of the top surface. The optical transceiver device with a heat dissipation structure according to claim 2, wherein the heat dissipation structures are columnar and arranged in an array. The heat transmitting and receiving device with a heat dissipating structure according to claim 7, wherein the heat dissipating structures form at least a straight channel and at least one lateral channel intersecting each other. The optical transceiver device with a heat dissipation structure according to claim 1, wherein the body and the heat dissipation structure are integrally formed. The optical transceiver device with a heat dissipation structure according to claim 1, wherein the heat dissipation structures have a guiding slope away from one side of the opening.