TWI747363B - An optical transceiver module and an optical cable module - Google Patents

Abstract

The present invention provides an optical transceiver module and an optical cable module. The optical transceiver module comprises a substrate, a plurality of optical receiving devices and at least one optical transmitting device. The optical transmitting device is connected to the substrate, and the optical receiving devices are cylindrical optical receiving devices connected to the substrate. The air tightness of each of the cylindrical optical receiving devices is in the range of 1 x10^-9 atm*cc/sec to 5*10^-8 atm*cc/sec. The plurality of cylindrical optical receiving devices are assembled by an optical receiving holder. The optical cable module comprises an optical fiber cable and the optical transceiver module.

Description

Optical transceiver module and optical fiber cable module

The present invention relates to the technical field of optical fiber communication, in particular to an optical transceiver module and an optical fiber cable module used in the same.

In the application of optical fiber communication technology, the electrical signal needs to be converted into an optical signal through a light emitting element (such as a laser), and then the optical signal is coupled into an optical fiber that conducts the optical signal.

Traditional telecommunications transmission systems are gradually being replaced by optical fiber transmission systems. Since optical fiber transmission systems do not have bandwidth limitations, they have the advantages of high-speed transmission, long transmission distances, and materials that are not interfered by electromagnetic waves. Therefore, the current electronics industry is mostly researching and developing in the direction of optical fiber transmission.

However, in recent years, further sealing and miniaturization of optical modules such as optical transceivers have been required. Therefore, the structure of the optical fiber transmission system needs to be improved.

The present invention provides an optical transceiver module to realize the miniaturization and high sealing performance of the optical transceiver module.

The present invention provides an optical transceiver module. The optical transceiver module includes a substrate, a plurality of light receiving elements, and light emitting elements. The light emitting element is connected to the substrate, a plurality of light receiving elements, a plurality of light receiving elements is cylindrical, and is connected to the substrate, each of the plurality of cylindrical hermetic degree between the light receiving element is 1 x 10 ^{- Between 9} atm*cc/sec and 5 x 10 ^-8 atm*cc/sec. The light receiving holder is used to assemble the plurality of cylindrical light receiving elements, wherein the plurality of cylindrical light receiving elements are fixed in the light receiving holder.

The present invention also provides an optical fiber cable module. The optical fiber cable module includes: an optical fiber cable and an optical transceiver module. , The optical transceiver module includes a substrate, a plurality of light receiving elements and light emitting elements. The light emitting element is connected to the substrate, a plurality of light receiving elements, a plurality of light receiving elements is cylindrical, and is connected to the substrate, each of the plurality of cylindrical hermetic degree between the light receiving element is 1 x 10 ^{- Between 9} atm*cc/sec and 5 x 10 ^-8 atm*cc/sec. The light receiving holder is used to assemble the plurality of cylindrical light receiving elements, wherein the plurality of cylindrical light receiving elements are fixed in the light receiving holder.

The present invention provides a light emitting element, an optical transceiver module and an application thereof. The optical transceiver module has a simple structure and can realize the miniaturization and high sealing performance of the optical transceiver module.

In order to have a more detailed understanding of the purpose, efficacy, features, and structure of the present invention, preferred embodiments are described below in conjunction with the drawings.

100: Optical cable module

101: electronic device

102: matching port

103: processor

104: Shell

105: Peripheral devices

106: Path

110: Optical transceiver module

111: substrate

111a: first surface

111b: second surface

111c: convex

111d: recess

112: processor

113: light emitting element

113a: optical transmitter

113b: sealed housing

113c: cylinder

113d: Damping unit

113e: The first pillar

113f: second pillar

113g: base

113h: The first circuit board

113i: second circuit board

113j: connecting wire

113L: Optical lens

113m: support block

113n: Support block

113w: optical window

113r: base recess

114: light receiving element

114a: Cylindrical light receiving element

114c: light receiving chip

114p: Optical receiver

114s: counter abutment

114m: Alignment mark

114h: Light receiving fixture

114i: Support unit

114j: fixed plane

114k: positioning groove

114L: positioning column

115: Connector

116: shell

116a: upper shell

116b: lower shell

117: connecting plate

117a: The first connecting plate

117b: second connecting plate

117c: flexible circuit board

118: Light emission holder

118a: First light emission holder

118b: Second light emission holder

118c: fixed groove

119: Temperature control unit

119a: Thermistor

119b: Refrigerator

120: Optical receiver holder

120a: fixed through hole

121: connecting plate

122a: The first connection pad

122b: second connection pad

130: Optical fiber cable

131: Fiber

G: interval

Figure 1 is a block diagram of a system using the optical cable module of the present invention; Figures 2 to 4 are schematic diagrams of an embodiment of the optical transceiver module of the present invention; Figures 5A to 9 are schematic diagrams of different embodiments of the substrate of the present invention 10 to 11 are schematic diagrams of different embodiments of the light emitting element and substrate of the present invention; FIG. 12 is a schematic diagram of an embodiment of the light emitting element of the present invention; FIG. 13 is a schematic diagram of an embodiment of the light emitting element of the present invention 14 is a schematic diagram of an embodiment of the optical transceiver module of the present invention; FIGS. 14A and 14B are schematic diagrams of the light emitting fixture of the present invention; FIGS. 15 to 17 are schematic diagrams of different embodiments of the substrate of the present invention; 18 is a schematic diagram of an embodiment of the light receiving element and substrate of the present invention; FIGS. 19A and 19B are schematic diagrams of an embodiment of the light receiving holder of the present invention; FIG. 20 is a schematic view of an embodiment of the light receiving element and substrate of the present invention Schematic diagram

21-27 are schematic diagrams of different embodiments of the optical transceiver module of the present invention;

Fig. 28 is a schematic diagram of an embodiment of a light emitting element of the present invention;

Fig. 29 is a schematic diagram of an embodiment of a light emitting element of the present invention;

30A and 30B are schematic diagrams of an embodiment of the light receiving chip of the present invention;

31A is a schematic diagram of an embodiment of the light receiving element and the light receiving fixing member of the present invention;

FIG. 31B is a schematic diagram of an embodiment of the light receiving fixing member of the present invention;

32A to FIG. 36 are schematic diagrams of different embodiments of the light emitting element of the present invention.

The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that the present invention can be implemented. The directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inner", "outer", "side", etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention.

The drawings and descriptions are to be regarded as illustrative in nature and not restrictive. In the figure, units with similar structures are indicated by the same reference numerals. In addition, for understanding and ease of description, the size and thickness of each element shown in the drawings are arbitrarily shown, but the present invention is not limited thereto.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In the drawings, the thickness of some layers and regions are exaggerated for understanding and ease of description. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element can be directly on the other element, or intervening elements may also be present.

In addition, in the specification, unless expressly described to the contrary, the word "comprising" will be understood to mean that the element is included, but does not exclude any other elements. In addition, in the specification, "on" means to be located above or below the target group element, and does not mean that it must be located on the top based on the direction of gravity.

Please refer to FIG. 1. This embodiment provides an optical cable module 100. FIG. 1 is a flowchart of using the optical cable module 100. The optical cable module 100 includes an optical transceiver module 110 and an optical fiber cable 130. And electronic device 101. The electronic device 101 can be any of many computing or display devices, including but not limited to data centers, desktop or laptop computers, notebook computers, ultra-thin notebooks, tablet computers, notebooks, or other Computing device. In addition to computing devices, it can be understood that many other types of the electronic device 101 can include one or more of the optical transceiver module 110 and/or the matching port 102 described in the present invention, and are described in the present invention The embodiments can be equivalently applied to these electronic devices. Examples of these other electronic devices 101 may include electric vehicles, palmtop devices, smart phones, media devices, personal digital assistants (PDAs), mobile personal computers, mobile phones, multimedia devices, memory devices, cameras, answering machines, I/O devices, servers, set-top boxes, printers, scanners, monitors, televisions, electronic signs, projectors, entertainment control units, portable music players, digital cameras, Internet devices, game devices , A game console, or any other electronic device 101 that can include the optical transceiver module 110 and/or the matching port 102. In other embodiments, the electronic device 101 may be any other electronic device that processes data or images.

As shown in FIG. 1, the optical fiber cable 130 is connected to the optical transceiver module 110 for transmitting optical signals. The optical fiber cable 130 may include at least one or more optical fiber cores for allowing optical signals to be transmitted within the optical fiber cores.

Please refer to FIG. 1, the electronic device 101 may include a processor 103, which may represent any type of processing element for processing electrical and/or optical I/O signals. It is understandable that the processor 103 may be a single processing device or multiple separate devices. The processor 103 may include or may be a microprocessor, programmable logic device or array, microcontroller, signal processor, or some combination.

Please refer to FIG. 1, the matching port 102 of the electronic device 101 can be used as an interface to connect to the optical transceiver module 110. The optical transceiver module 110 can allow another peripheral The device 105 and the electronic device 101 are connected to each other. The optical transceiver module 110 of this embodiment can support communication via an optical interface. In various embodiments, the optical transceiver module 110 can also support communication through an electrical interface.

Please refer to FIG. 1, the peripheral device 105 may be a peripheral I/O device. In various embodiments, the peripheral device 105 may be any of a variety of computing devices, including but not limited to desktop or laptop computers, notebook computers, ultra-thin notebooks, tablet computers, notebooks, or Other computing devices. In addition to computing devices, it can be understood that peripheral devices 105 may include electric vehicles, palm-sized devices, smart phones, media devices, personal digital assistants (PDAs), ultra-mobile personal computers, mobile phones, multimedia devices, and memory Body devices, cameras, answering machines, I/O devices, servers, set-top boxes, printers, scanners, monitors, televisions, electronic signs, projectors, entertainment control units, portable music players , Digital cameras, Internet devices, game devices, game consoles, or other electronic devices.

Please refer to FIG. 1. In an embodiment, the electronic device 101 may also include an internal optical path. The optical path may represent one or more components, which may include processing and/or termination components that transmit an optical signal between the processor 103 and the matching port 102. Transmitting a signal can include generating and converting to optical, or receiving and converting to electrical. In an embodiment, the device may also include an electrical path. The electrical path represents one or more components that transmit an electrical signal between the processor 103 and the matching port 102.

Please refer to FIG. 1, the optical transceiver module 110 can be used to correspond to the matching port 102 of the electronic device 101. In this embodiment, mating a connector plug with another can be used to provide a mechanical connection. Mating a connector plug with another usually also provides a communication connection. The mating port 102 may include a housing 104, which may provide the mechanical connection mechanism. The matching port 102 may include one or more optical interface components. The path 106 may represent one or more components, which may include processing and/or termination components for transmitting optical signals (or optical signals and electrical signals) between the processor 103 and the matching port 102. Transmitting signals can include generating and converting into optical signals, or receiving and Converted into electrical signals.

Please refer to FIG. 1, the optical transceiver module 110 of the present invention may be referred to as an optical connector or an optical connector. Generally speaking, this optical connector can be used to provide a physical connection interface that interfaces with a matching connector and optical element. The optical transceiver module 110 may be a light engine for generating optical signals and/or receiving and processing optical signals. The optical transceiver module 110 can provide conversion from electrical to optical signals or from light to electrical signals.

In some embodiments, the optical transceiver module 110 can be used to process the optical signals in compliance with or in accordance with one or more communication protocols. For the embodiment in which the optical transceiver module 110 is used to transmit an optical signal and an electrical signal, the optical interface and the electrical interface can be based on the same agreement, but this is not absolutely necessary. Regardless of whether the optical transceiver module 110 processes signals according to an electrical I/O interface protocol, or according to a different protocol or standard, the optical transceiver module 110 can be used for an intended protocol. Constructed or programmed in a specific module, and different transceiver modules or light engines can be constructed for different protocols.

Please refer to FIGS. 2-4, which are schematic diagrams of an embodiment of the optical transceiver module of the present invention. The optical transceiver module 110 proposed in this embodiment may include a substrate 111, a processor 112, a light emitting element 113, a light receiving element 114, a connector 115, a housing 116, a connecting board 117, and a light emitting fixture 118. The substrate 111 may have a first surface 111a and a second surface 111b opposite to each other. The substrate 111 is, for example, a printed circuit board (PCB) or a ceramic substrate, and may include, for example, pins or connecting balls for connecting to an external device. The processor 112 is connected to the substrate 111, and the processor 112 can be any type of processor die or optical IC, and is not limited to any specific processor type. The light emitting element 113 and the light receiving element 114 are the processor 112 connected to the substrate 111, and are used for transmitting and receiving optical signals, respectively. The light emitting element 113 and the light receiving element 114 may include a transmitting circuit and a receiving circuit for transmitting electronic signals, more specifically, processing the timing or other agreement matters of the electronic signal corresponding to the optical signal. The housing 116 may have an internal space for accommodating the substrate 111, the processor 112, the light emitting element 113, the light receiving element 114, the connector 115, the connecting board 117, and the light Launch holder 118. The connecting plate 117 is connected between the substrate 111 and the light emitting element 113. The light emitting holder 118 can be used to position and fix the setting of the light emitting element 113 to maintain the characteristic loss and reliability of the joint between the optical fiber channel and the optical transceiver. .

4-9, the substrate 111 is disposed in the housing 116. The substrate 111 may include at least one convex portion 111c and at least one concave portion 111d. The convex portion 111c protrudes from the substrate 111, and the concave portion 111d is formed in At least one side of the convex portion 111c. Wherein, the light emitting element 113 can be accommodated in the recess 111d. That is, the light emitting element 113 may be disposed on at least one side of the convex portion 111c. It is worth noting that the circuit or IC chip can also be formed on the surface of the convex portion 111c of the substrate 111 to increase the area of the circuit.

In different embodiments, as shown in FIGS. 5 to 7, the substrate 111 may have one or more convex shapes. In this case, a plurality of concave portions 111d may be respectively located on opposite sides of the convex portion 111c. Wherein, as shown in FIG. 7, the plurality of recesses 111d may also have different lengths or depths. In this way, light emitting elements 113 of different sizes can be accommodated according to requirements. Furthermore, by using the embossed shape of the substrate 111, different circuits (for example, a flexible circuit board connected to the light emitting element 113) can be isolated to avoid mutual interference due to spatial overlap.

In different embodiments, as shown in FIG. 8, the substrate 111 may have at least one L-shape. In this case, at least one concave portion 111d may be located on at least one side of the convex portion 111c. As shown in FIG. 9, the substrate 111 may have at least one stepped shape. In this case, a plurality of concave portions 111d may be located on at least one side of the convex portion 111c.

In addition, in some embodiments, the first surface 111a and the second surface 111b of the substrate 111 opposite to each other may be provided with different circuits for setting circuits, chips or components with different functions. For example, the light receiving element 114 may be disposed on the first surface 111a of the substrate 111, and the processor 112 and IC chips (such as but not limited to LDD, PA, CDR, DSP chips, etc.) may be disposed on the second surface of the substrate 111 On 111b. In this way, the installation space of the circuit or the chip can be increased, and the size of the substrate 111 can be correspondingly reduced. In some embodiments, the light receiving element 114 may also use The chip is fixed on the first surface 111a of the substrate 111 in a chip on board method.

In this embodiment, the optical transceiver module 110 can be applied to, for example, a four-fiber channel parallel transmission (Parallel Single Mode 4 lane, PSM4) technology, which uses a plurality of light emitting elements 113 to separate four laser sources with different wavelengths. The light is introduced into the optical fiber, and the medium and long-distance transmission is carried out through the optical fiber. The light receiving element 114 can receive light signals, and can respectively guide the processed light signals to different channels. However, it is not limited to this. In addition to applying PSM4 technology, the optical transceiver module 110 can also be applied to various multi-channel wavelength division multiplexing, such as binary phase shift keying (Binary Phase Shift Keying, BPSK), Quadrature Phase Shift Keying (QPSK), Coarse Wavelength Division Multiplexing (Conventional/Coarse Wavelength Division Multiplexing, CWDM), Dense Wavelength Division Multiplexing (DWDM) , Optical Add/Drop Multiplexer (OADM), Reconfigurable Optical Add/Drop Multiplexer (ROADM), LR4 or similar related optical communication technology.

As shown in FIG. 4, one or more light emitting elements 113 can be connected to the substrate 111 through a connecting plate 117, and a plurality of light emitting elements 113 can be arranged in a staggered manner. Wherein, there is an angle between the light emitting directions of the light emitting elements 113 (that is, the emitting direction of the light signal). The angle is, for example, between 90 degrees and 180 degrees, that is, the light emitting elements 113 can be The arrangement is arranged staggered back and forth. When the light emitting elements 113 are arranged alternately in front and back, the light emitting directions of the light emitting elements 113 may be approximately opposite to each other or different from each other, that is, the angle between the light emitting directions of the light emitting elements 113 It is about 180 degrees.

As shown in FIG. 4, each light emitting element 113 includes a light emitter 113a, a sealed housing 113b, and a cylindrical member 113c, and the light emitter 113a is completely sealed in one or more sealed housings 113b. That is, the light emitter 113a in the light emitting element 113 will not come into contact with the external environment or the air outside the light emitting element 113, so as to avoid the aging of the light emitter 113a, ensure the performance of the light emitter 113a, and greatly extend it. The service life of the component. Wherein, the sealing degree of the light emitting element 113 meets the airtight requirement of TO (Transmitter Optical Sub-Assembly) type packaging for industrial use. For example, the sealing degree of each light emitting element 113 may be 1 ^{×10 -12} ~5×10 ^-8 (atm*cc/sec).

In various embodiments, the wavelength of the light signal emitted by the light emitter 113a of the light emitting element 113 may be in the range of near-infrared light to infrared light, which is about 830 nanometers (nm) to 1660 nanometers. The light emitter 113a can be any type of laser chip suitable for generating optical signals (for example, edge-fire type laser device, FP/DFB/EML laser, or vertical cavity surface-emission type laser, VCSEL).

In different embodiments, the light emitter 113a can be directly sealed in the sealed housing 113b without an exposed gap, so as to ensure the airtightness of the light emitting element 113. In some embodiments, the sealed housing 113b is, for example, a cylindrical housing. The cylindrical member 113c is provided on one side of the sealed casing 113b. A light coupling lens (not shown), such as a convex lens or a spherical lens, may be provided inside the cylindrical member 113c for coupling the light signal emitted by the light transmitter 113a to an external optical fiber via the cylindrical member 113c. Therefore, the light emitting direction of each light receiving element is from the light emitter 113a in the sealed housing 113b toward the cylindrical member 113c.

In different embodiments, the diameter or width of the sealed housing 113b may be greater than the diameter or width of the cylindrical member 113c. In this way, the use of the staggered arrangement of the plurality of light emitting elements 113 allows the plurality of light emitting elements 113 to be arranged more closely, so as to reduce the configuration space of the plurality of light emitting elements 113, so that more light emitting elements 113 can be arranged. The component 113 is arranged and packaged in a small optical transceiver module 110 to realize the miniaturization of the optical transceiver module.

As shown in FIG. 10, in different embodiments, a plurality of light emitting elements 113 may be respectively located on the upper and lower sides of the substrate 111, and arranged in a staggered manner, so as to realize the staggering of the plurality of light emitting elements 113 on the upper and lower sides of the substrate 111. arrangement.

As shown in FIG. 11, in different embodiments, a plurality of light emitting elements 113 may be respectively located on the same side of the substrate 111 and arranged in a staggered manner, thereby realizing a staggered arrangement of the plurality of light emitting elements 113 on the same side of the substrate 111.

As shown in FIG. 12, in different embodiments, two or more (for example, three or more) light emitting elements 113 may be arranged in a staggered arrangement with each other, so as to realize more light emitting elements 113 in a staggered arrangement.

In some embodiments, as shown in FIGS. 4 and 10, there may be an oblique angle between the light emitting element 113 and the substrate 111, that is, there may be an oblique angle between the light emitting direction of the light emitting element 113 and the substrate 111. The inclination angle between the light emitting element 113 and the substrate 111 may be less than 90 degrees, such as 5 degrees to 85 degrees, such as 30 degrees, 60 degrees, or 45 degrees. Therefore, the light emitting elements 113 can be arranged obliquely to reduce the configuration space of the light emitting elements 113. Specifically, in some embodiments, the light emitting fixture 118 may be used to realize and fix the inclination angle of the light emitting element 113. However, it is not limited to this. In different embodiments, different structures or methods can also be used to realize and fix the inclination angle of the light emitting element 113. For example, in some embodiments, fixing glue can also be used to fix the inclination angle of the light emitting element 113.

In the embodiment of the present invention, as shown in FIG. 4, a plurality of light emitting elements 113 can also be arranged in a staggered manner up and down, and arranged at an angle at the same time. At this time, since the front and rear ends of the light emitting element 113 have different sizes, they can be arranged more closely in the optical transceiver module 110, and the miniaturization of the optical transceiver module can be better realized.

Please refer to FIG. 13, in different embodiments, each light emitting element 113 may further include a temperature control unit 119, and the temperature control unit 119 may be disposed in the sealed housing 113 b. In some embodiments, the temperature control unit 119 may include a thermistor 119a and a refrigerator 119b. The thermistor 119a is fixed on the base of the light emitter 113a. The refrigerator 119b may be, for example, thermoelectric cooling. A TEC or a semiconductor refrigerator (TEC), for example, can be fixed in the sealed housing 113b and close to the light emitter 113a, and the thermistor 119a is electrically connected to the refrigerator 119b. In this embodiment, the temperature of the light emitter 113a is used to change the resistance value of the thermistor 119a, so the thermistor 119a can be used to detect the temperature of the light emitter 113a. Then, by controlling the current flow of the refrigerator 119b, the temperature of the light emitter 113a can be cooled, In order to control the light emitter 113a to work within a reasonable temperature range (for example, 40-50 degrees), the phenomenon of wavelength drift of the light emitter 113a caused by temperature changes is reduced. Furthermore, since the overall thermal load of the light emitting element 113 can be greatly reduced, the power consumption of the light emitting element 113 can be reduced. For example, the power consumption range of a single light emitting element 113 can be reduced to 0.1-0.2W, for example, the power consumption range of four light emitting elements 113 can be reduced to 0.4-0.8W. In this embodiment, the thermistor 119a and the refrigerator 119b can be fixed on the base of the light emitter 113a by using thermally conductive glue, for example.

However, it is not limited to this. In some embodiments, a single temperature control unit 119 can also be used to control the temperature of a plurality of light emitting elements 113.

As shown in FIG. 3, the connector 115 may provide a redirection mechanism to change the light between the optical transceiver module 110 and some external object (for example, another device) across an optical fiber (not shown). For example, the connector 115 may utilize a reflective surface to provide redirection of optical signals. The angle, general size, and shape of the connector 115 depend on the wavelength of the light, the material used to make the coupler, and the requirements of the overall system. In an embodiment, the connector 115 may be designed to provide a reset direction of the vertical light from the substrate 111 and the horizontal light transmitted to the substrate 111.

In addition, the size, shape, and configuration of the connector 115 are related to its standards, including tolerances for mating corresponding connectors. Therefore, the layout of the connector used to integrate the optical I/O components may be different due to various standards. Those skilled in the art can understand that the optical interface requires a line-of-sight connection to have an optical signal transmitter interfaced with the receiver (both can be called a lens). Therefore, the configuration of the connector will prevent the lens from being blocked by the corresponding electrical contact element. For example, the optical interface lens can be arranged on the side, or above or below the contact elements, depending on the available space in the connector.

In this embodiment, the connector 115 may be, for example, an MPO (Multi-Fibre Push On) specification, and the optical fibers may be connected in a one-to-one manner in a multi-channel manner. In some embodiments, the CWDM/WDM system can be used to achieve the LR4 specification through the steps of light splitting and de-splitting need.

As shown in FIG. 3, the outer shell 116 is used to protect and assemble the substrate 111, the processor 112, a plurality of light emitting elements 113, the light receiving element 114 and the connecting board 117. In other embodiments, the optical transceiver module 110 may further include a planar light-wave chip (PLC) and a modulator. The planar light-wave chip can provide a planar integrated element for the transmission of light and its conversion into electronic signals, and vice versa. It can be understood that the function of a planar light-wave chip (PLC) can also be integrated in the connector 115. In this embodiment, the housing 116 may include an upper housing 116a and a lower housing 116b. The upper housing 116a and the lower housing 116b may be combined into one body, and an internal space may be formed to accommodate the substrate 111 and the processor. 112. A plurality of light emitting elements 113, light receiving elements 114, and a connecting board 117. In some embodiments, the housing 116 can be made of metal, for example, to have the function of not only electrically shielding the circuit enclosed therein, but also effectively dissipating the heat generated by the electronic circuit to the outside of the housing 116 .

As shown in FIG. 4, the connecting plate 117 is connected between the substrate 111 and the light emitting element 113 to fix the light emitting element 113 and allow the light emitting element 113 to be electrically connected to the substrate 111. That is, by using the connecting plate 117, the substrate 111 and the light emitting element 113 can transmit signals to each other. Specifically, the connecting board 117 may be, for example, a flexible circuit board or a flexible printed circuit board (FPC) to transmit signals between the substrate 111 and the light emitting element 113.

Furthermore, as shown in FIG. 4, the use of the connecting plate 117 allows the light emitting element 113 to be disposed in the recess 111d of the substrate 111. Specifically, the connecting plate 117 may be disposed in the recess 111 d of the substrate 111 and connected to the substrate 111. In addition, the light emitting element 113 can be disposed on the connecting board 117 and connected to the connecting board 117. Therefore, by using the connecting plate 117, the light emitting element 113 is disposed in the recess 111d of the substrate 111 and is electrically connected to the substrate 111.

Furthermore, as shown in FIG. 4, the connecting plate 117 may include a first connecting plate 117a and a second connecting plate 117b. In some embodiments, one end of the first connecting plate 117a may be connected to the first surface 111a of the substrate 111, and one end of the second connecting plate 117b may be connected to the second surface 111b of the substrate 111. Therefore, by using the first connecting plate 117a and the second connecting plate 117b, the plurality of light emitting elements 113 It can be electrically connected to the circuits on the opposite sides of the substrate 111, and can form a staggered arrangement of upper and lower positions, so that multiple light emitting elements 113 can be arranged and packaged in a smaller optical transceiver module 110 to achieve Miniaturization of optical transceiver modules.

However, it is not limited to this. In some embodiments, the first connecting plate 117a and the second connecting plate 117b can also be connected to the same side surface (the first surface 111a or the second surface 111b) of the substrate 111.

As shown in FIG. 4, the first connecting plate 117a and the second connecting plate 117b may have different lengths. Specifically, in some embodiments, the length of the second connecting plate 117b may be greater than the length of the first connecting plate 117a. Therefore, by using the different lengths of the first connecting plate 117a and the second connecting plate 117b, a plurality of light emitting elements 113 can be formed in a staggered arrangement of front and rear positions, so that the plurality of light emitting elements 113 can be arranged and packaged in a smaller size at the same time. In the optical transceiver module 110, the miniaturization of the optical transceiver module is realized.

Furthermore, as shown in FIG. 4, one end of the connecting plate 117 may have a bent structure and be connected to the light emitting element 113, and this bent structure (not labeled) may correspond to the inclination angle, position or other arrangement of the light emitting element 113 To form a bend to correspond to the arrangement of the light emitting elements 113.

Furthermore, when the IC on the substrate 111 of the optical transceiver module 110 is performing high-speed operations, greater power consumption and heat will be generated. At this time, by using the connecting plate 117, the substrate 111 and the light emitting element 113 can be appropriately separated to avoid direct heat transfer to the light emitting element 113, thus effectively reducing the power consumption of the temperature control unit 119 and the overall consumption of the optical transceiver module 110. Power.

As shown in FIG. 14, in different embodiments, the light emitting fixture 118 can be used to fix the position and arrangement of the light emitting element 113 in the optical transceiver module 110. Specifically, the light emitting fixture 118 can be disposed on the housing 116 or the substrate 111 of the optical transceiver module 110 to fix the light emitting element 113. In some embodiments, the light emitting holder 118 may be integrally formed on the housing 116, for example. In some embodiments, the light emitting holder 118 may include a first light emitting holder 118a and a second light emitting holder 118b for fixing a plurality of light emitting elements 113, And allow the light emitting elements 113 to form a staggered arrangement. As shown in FIG. 3, the first light emission holder 118a may be disposed on the upper housing 116a, for example, and the second light emission holder 118b may be disposed on the lower housing 116b, for example. Furthermore, the light emitting holder 118 may include at least one fixing groove 118c, and the groove shape of the fixing groove 118c corresponds to the shape of the light emitting element 113 (for example, the shape of the sealed housing 113 or the cylindrical member 113c), It is used for accommodating and engaging the light emitting element 113 to fix the light emitting element 113. Furthermore, the groove shape of the fixing groove 118c can also be formed corresponding to the inclination angle of the light emitting element 113, so that the light emitting element 113 is obliquely fixed.

Specifically, as shown in FIGS. 14A and 14B, the fixing groove 118c of the light emitting holder 118 (for example, the first light emitting holder 118a and the second light emitting holder 118b) may have an inclination angle, and the fixing groove 118c The inclination angle of may be the same as the inclination angle of the light emitting element 113 to fix the inclination angle of the light emitting element 113.

As shown in FIG. 15, in some embodiments, the recess 111 d of the substrate 111 may be a hollowed-out cavity formed on the substrate 111. In addition, as shown in FIGS. 16 and 17, a plurality of recesses 111d are formed on the substrate 111, and the substrate 111 may have an I-shaped or F-shaped structure. Therefore, by using the plurality of recesses 111 d on the substrate 111, a plurality of light emitting elements 113 can be accommodated on the substrate 111.

In different embodiments, using the arrangement and arrangement of the light emitting elements 113 and/or the design of the substrate 111, the size of the substrate 111 can be a design that meets the requirements of QSFP28, QSFP+ or Micro QSFP+. For example, in some embodiments, the width of the substrate 111 may be about 11-18 mm, and in some embodiments, the length of the substrate 111 may be about 58-73 mm to meet the requirements of QSFP+ or QSFP28. Therefore, by using the arrangement of the light emitting elements 113 and/or the design of the substrate 111, a plurality of light emitting elements 113 can be arranged and packaged in a small optical transceiver module 110 to realize the miniaturization of the optical transceiver module.

In different embodiments, the plurality of light receiving elements 114 may also be arranged in a staggered arrangement, and the light receiving directions of the plurality of light receiving elements 114 may have an angle between 90 degrees and 180 degrees. Between degrees.

In different embodiments, there may be another tilt angle between the light receiving element 114 and the substrate, and the tilt angle between the light receiving element and the substrate may be less than 90 degrees, for example, between 0 degrees and 90 degrees, such as 1 degree. , 5 degrees, 30 degrees, 60 degrees or 45 degrees.

As shown in FIG. 18, in some embodiments, the light receiving element may be, for example, a cylindrical light receiving element 114a, or for example, a TO-CAN light receiving element. Wherein, the degree of sealing of the cylindrical light receiving element 114a meets the airtight requirement of the TO (Transmitter Optical Sub-Assembly) type package for industrial use. For example, the sealing degree of each of the plurality of cylindrical light receiving elements 114a may be 1 x 10- ¹² ~5*10 ^-7 (atm*cc/sec). In an embodiment, more specifically, the sealing degree of each of the plurality of cylindrical light receiving elements 114a may be 1 x 10 ^-9 to 5 x 10 ^-8 (atm*cc/sec).

As shown in FIG. 18, a plurality of cylindrical light receiving elements 114a can be assembled using the light receiving holder 120. The light receiving holder 120 is used to assemble the plurality of cylindrical light receiving elements 114 a into one body, wherein the plurality of cylindrical light receiving elements 114 a are fixed in the light receiving holder 120. The plurality of cylindrical light receiving elements 114a can be connected to the circuit on the substrate 111 through the connection board 121. The connecting board 121 may be, for example, a flexible circuit board or a flexible printed circuit board (FPC), which is used to transmit signals between the substrate 111 and the cylindrical light receiving element 114a. Specifically, in an embodiment, as shown in FIG. 18, a plurality of cylindrical light-receiving elements 114a can be respectively connected to the first connection pad (Pad) 122a and the second connection pad 122b on the substrate 111 through the connection plate 121 The first connection pad 122a and the second connection pad 122b can be bonded and fixed on the substrate 111 by surface bonding, and are electrically connected to a circuit (not shown) on the substrate 111.

As shown in FIGS. 19A and 19B, specifically, the light receiving holder 120 may be provided with a plurality of fixing through holes 120a, and the number of the fixing through holes 120a may correspond to the number of the plurality of cylindrical light receiving elements 114a to provide The cylindrical light receiving element 114a is inserted through the fixing through hole 120a, so that a plurality of cylindrical light receiving elements 114a can be fixed in the light receiving holder 120. The inner diameter or size of each fixing through hole 120a corresponds to the external size of the cylindrical light receiving element 114a to closely The cylindrical light receiving element 114 a is sleeved and fixed in the light receiving holder 120. Specifically, for example, the cylindrical light receiving element 114a may have a first width and a second width of different sizes (as shown in FIG. 19), and the fixing through hole 120a may also have a first inner aperture and a second inner aperture of different sizes. The aperture corresponds to the first width and the second width of the cylindrical light receiving element 114a.

As shown in FIG. 20, in an embodiment, the light receiving holder 120 can be fixed on the substrate 111 to fix a plurality of cylindrical light receiving elements 114 a on the substrate 111. However, it is not limited to this. In some embodiments, the light receiving holder 120 may not be fixed on the substrate 111 (as shown in FIG. 18).

It is worth noting that in different embodiments, the light emitting element 113 and the light receiving element 114 may have different arrangements, combinations, and/or configurations. For example, in some embodiments, the light emitting element 113 and the light receiving element 114 may be disposed on the same side of the substrate 111. However, it is not limited to this. In some embodiments, the light emitting element 113 and the light receiving element 114 may also be respectively disposed on different sides of the substrate 111.

In some embodiments, one or more light receiving elements 114 may be disposed on the substrate 111, and one or more light emitting elements 113 may be obliquely disposed on one side of the substrate 111 (as shown in FIG. 21) or on the substrate 111 (As shown in Figure 22).

Furthermore, in some embodiments, one or more light receiving elements 113 may be disposed on the substrate 111, and one or more light receiving elements 114 may be obliquely disposed on one side of the substrate 111 (as shown in FIG. 23) or the substrate 111 on (as shown in Figure 24).

However, it is not limited to this. In some embodiments, the light emitting element 113 and the light receiving element 114 may also be disposed on one side of the substrate 111 (not shown) or on the substrate 111 (as shown in FIG. 25) at the same time.

It is worth noting that when one or more light receiving elements 114 can be arranged on one side of the substrate 111 (for example, as shown in FIG. 18), the light emitting elements 113 can be arranged on the substrate 111 in parallel or obliquely (as shown in FIGS. 26 and Shown in Figure 27).

Referring to FIG. 28, in different embodiments, each light emitting element 113 may further include a damping unit 113d, pillars 113e, 113f, and a base 113g, and the light emitter 113a and pillars 113e, 113f may be arranged in a sealed housing In 113b, the light emitter 113a can be arranged on the pillar 113e, the damping unit 113d can be arranged between the sealed housing 113b and the pillars 113e, 113f, and the pillars 113e, 113f are arranged on the base 113g.

As shown in FIG. 28, the sealed housing 113b and the base 113g can form a closed space for accommodating the light emitter 113a and the pillars 113e, 113f. The pillars 113e and 113f are extended from the base 113g to support the circuit boards (sub-mount) 113h and 113i inside the light emitting element 113. The pillars 113e and 113f may include a first pillar 113e and a second pillar 113f, and the second pillar 113f may be disposed on one side of the first pillar 113e and close to the sealed housing 113b. The first post 113e is used to support the first circuit board 113h, the light emitter 113a is electrically connected to the first circuit board 113h, the second post 113f is used to support the second circuit board 113i, and the second circuit board 113i is Used to electrically connect to external signal lines (not labeled). The circuit boards 113h and 113 can be provided with circuits, and the circuit boards 113h and 113 can be made of materials with good thermal conductivity (for example, ceramics, metallic copper) to improve heat dissipation efficiency.

In different embodiments, the pillars 113e, 113f may be integrally formed on the base 113g, that is, the pillars 113e, 113f and the base 113g may have the same material, for example, a metal with good thermal conductivity. In some embodiments, the pillars 113e, 113f may be rectangular pillars, but are not limited thereto. In some embodiments, the pillars 113e, 113f may be cylindrical, semicircular pillars, cones, or other three-dimensional shapes.

In different embodiments, the damping unit 113d is disposed between the pillars 113e, 113f and the sealed housing 113b, and is used to absorb the electromagnetic energy inside the light emitting element 113 to destroy the high frequency resonance mode in the light emitting element 113. Improve the resonance phenomenon that occurs when transmitting high-frequency signals, thereby improving the signal distortion, so that higher-frequency signals can be transmitted, for example, it can be used for 25Gbps~50Gbps NRZ, 25Gbps~100Gbps PAM4 or higher frequency signals.

In different embodiments, the damping unit 113d may be made of a predetermined damping material. One or more units formed of sheet, thin film, thick film, block, strip, powder or any shape are used to absorb the electromagnetic energy inside the light emitting element 113 and reduce the high frequency resonance in the light emitting element 113 Phenomenon. The resistance of the damping unit 113d may be between 1 ohm (Ω) and 500 ohms, for example, between 5 ohms (Ω) and 100 ohms.

In some embodiments, the damping unit 113d may be, for example, a resistance unit formed of one or more materials to improve the high-frequency resonance phenomenon in the light emitting element 113. The material of the damping unit 113d may include, for example, pure metal, metal alloy, metal compound, metal oxide, metal mixed material (for example, a combination of ceramic and metal), semiconductor or other materials.

In some embodiments, the damping unit 113d may include a thin film layer and a metal layer (not shown). The thin film layer is, for example, formed of an insulating material (such as ceramic) or a composite material. The metal layer may be formed on both sides of the thin film layer. The layer is formed of titanium, platinum, gold, other metals, or any alloy, for example.

In some embodiments, the thickness of the damping unit 113d may be less than 1 mm, for example, 0.01 mm to 0.4 mm.

In some embodiments, the damping unit 113d may be formed on the sides of the pillars 113e and 113f closest to the sealed housing 113b, for example. For example, in one embodiment, the damping unit 113d may be formed on the side surface of the second pillar 113f and close to the sealed housing 113b to improve the high-frequency resonance phenomenon in the light emitting element 113. However, it is not limited to this, and the damping unit 113d can also be formed on other positions of the pillars 113e and 113f to improve the high-frequency resonance phenomenon in the light emitting element 113. For example, in another embodiment, the damping unit 113d may also be formed on the side surface of the first pillar 113e and located between the pillar 113e and the sealed housing 113b to improve the high-frequency resonance phenomenon in the light emitting element 113 .

Please refer to FIG. 28 again. In different embodiments, each light emitting element 113 may further include a plurality of connecting wires 113j. The connecting wires 113j may be formed of conductive metal materials and connected to the first pillar 113e and the second pillar 113f, used to improve the light emitting element 113 The phenomenon of high-frequency resonance.

Please refer to FIG. 29 again. In different embodiments, each light emitting element 113 may further include at least one optical lens 113L and an optical window 113w. The optical lens 113L is disposed in the sealed housing 113b, and is located at the light emitter 113a to optically improve the light signal emitted by the light emitter 113a, such as focusing, collimating, and diverging. In some embodiments, the optical lens 113L may be disposed on the pillar 113e, and opposed to the light emitter 113a. However, in different embodiments, the optical lens 113L and the light emitter 113a can also be arranged on the same circuit board.

As shown in FIG. 29, the optical window 113w is provided on the sealed housing 113b, for example, at the front end of the sealed housing 113b, and is located opposite to the optical lens 113L to allow the optical signal improved by the optical lens 113L to be sent Outside the sealed housing 113b. In some embodiments, the optical window 113w may be a flat light-transmitting plate to allow the optical signal improved by the optical lens 113L to be sent out of the sealed housing 113b. However, in different embodiments, the optical window 113w can further optically improve the optical signal after passing through the optical lens 113L, so as to improve the optical path after passing through the optical lens 113L.

It is worth noting that, since the optical lens 113L can be directly disposed in the sealed housing 113b, and the pair is located in the light emitter 113a, the optical alignment between the optical lens 113L and the light emitter 113a can be more accurately controlled to Improve the accuracy of the optical path, thereby reducing the energy loss of the optical signal. In some embodiments, the material of the optical lens 113L may be different from the material of the optical window 113w. Specifically, the material of the optical lens 113L can be, for example, various glass materials or invented silicon-based materials (Silicon based micro-lens). These materials have a very high absorption rate for specific application wavelengths (for example, 1200nm~1600nm). Small optically transparent medium.

Please refer to FIG. 30A again. In some embodiments, the light-receiving element 114 may include one or more light-receiving chips 114c. The light-receiving chips 114c are, for example, elongated chips and can be connected to the substrate 111. Each light receiving chip 114c may be provided with a plurality of light receivers (PD) 114p, and the plurality of light receivers 114p are arranged along one direction, for example, may be along the long axis of the light receiving chip 114c The number of optical fibers 131 connected to the light receiving chip 114c is less than the number of light receivers 114p of the light receiving chip 114c.

As shown in FIG. 30A, specifically, as an example, in an embodiment, for example, two light receiving chips 114c can be arranged (for example, soldered) on the substrate 111 in a row. Among them, each light receiving chip 114c may be provided with four light receivers 114p, at this time, two optical fibers 131 may be connected to two of the light receivers 114p on the light receiving chip 114c. With this configuration, the connection margin between the optical fiber 131 and the optical receiver 114p can be increased, and the connection accuracy between the optical fiber 131 and the optical receiver 114p can be improved, so as to increase the coupling accuracy between the optical fiber 131 and the optical receiver 114p . It is worth noting that, however, it is not limited to this. In other embodiments, each light receiving chip 114c may also be provided with more or less than 4 light receivers 114p.

Please refer to FIG. 30B again. In some embodiments, the light receiving element 114 may include a sub-mount 114s, and the sub-mount 114s may be disposed on the substrate 111 to align the light receiving chip 114c. . The alignment base 114s can be provided with one or more alignment marks 114m. The light receiving chip 114c can be set on the alignment base 114s, and the alignment marks 114m can be used to perform alignment to improve the optical fiber 131 and the light. The alignment accuracy between the receiving chip 114c is further improved to increase the optical coupling accuracy between the optical fiber 131 and the light receiving chip 114c.

Please refer to FIGS. 31A and 31B again. In some embodiments, the optical transceiver module 110 may further include a light receiving fixing member 114h for disposing the light receiving element 114 on the substrate 111 and forming a gap G (eg Between the light receiving fixture 114h and the substrate 111 to allow more components (such as IC and/or passive components) to be placed in the gap G, thereby increasing the number of components on the substrate 111 Set up space. The light receiving fixing member 114h may include at least one supporting unit 114i, a fixing plane 114j, a positioning groove 114k, and a positioning pillar 114L. The supporting unit 114i is formed on one side of the light receiving fixing member 114h to support the light receiving fixing member 114h on the substrate 111, and a gap G is formed between the light receiving fixing member 114h and the substrate 111. The fixing plane 114j is formed on the opposite side of the light receiving fixing member 114h for the light receiving element 114 to enter. Line settings. The positioning groove 114k is formed on the light receiving fixing member 114h for positioning the light receiving element 114 and the optical fiber 131 on the light receiving fixing member 114h. In some embodiments, the fixing plane 114j may be formed in the positioning groove 114k. The positioning pillar 114L may be formed on the supporting unit 114i for positioning the light receiving fixing member 114h on the substrate 111.

As shown in FIG. 31A, the light receiving element 114 can be disposed on the fixing plane 114j of the light receiving fixing member 114h, and is electrically connected to the substrate 111 through a flexible circuit board 117c. By using the light receiving fixing member 114h, a gap G can be formed between the light receiving fixing member 114h and the substrate 111, so as to increase the space for disposing components on the substrate 111. It is worth noting that, in some embodiments, the light receiving fixing member 114h may form more fixing planes 114j to provide more components.

As shown in FIG. 31B, specifically, the light receiving fixing member 114h may include, for example, two supporting units 114i to form an inverted U-shaped structure, but it is not limited to this. In other embodiments, the light receiving fixing member 114h may include One or more supporting units 114i are used to support the light receiving element 114 on the substrate 111.

As shown in FIGS. 32A to 35, in some embodiments, the temperature control unit 119 in the light emitting element 113 may be disposed on the pillar 113e. The pillar 113e can be arranged in the enclosed space formed by the sealed casing 113b and the base 113g, and is extended from the base 113g. The refrigerator 119b of the temperature control unit 119 may be disposed on one side surface of the pillar 113e, and the light emitter 113a may be disposed on the refrigerator 119b. With this configuration, the heat of the light emitter 113a can be greatly transferred to the refrigerator 119b, which reduces the total heat capacity of the chip end of the light emitter 113a without adding additional heat sinks, so the refrigerator 119b can use less The driving current can achieve a wide temperature control range, and at the same time improve the response time of thermal balance, and specifically achieve the effect of reducing product power consumption. It is worth noting that in different embodiments, the configuration of the light emitter 113a on the refrigerator 119b can also be applied to a non-sealed housing.

As shown in FIGS. 32A to 35, specifically, the largest surface of the circuit board 113h provided with the light emitter 113a can be directly attached to the largest surface of the refrigerator 119b, thereby allowing light to be emitted The heat of the radiator 113a can be directly and greatly transferred to the refrigerator 119b. At this time, the maximum surface of the refrigerator 119b may be approximately perpendicular to the base 113g. Specifically, there may be an angle between the maximum surface of the refrigerator 119b and the maximum inner surface of the base 113g, and the angle may be 80 degrees. 100 degree. In addition, the thermistor 119a can be arranged on the circuit board 113h and electrically connected to the refrigerator 119b, and the temperature of the light emitter 113a can be detected by the thermistor 119a.

It is worth noting that, in different embodiments, the pillar 113e may be formed of a material with good thermal conductivity and extended from the base 113g, and thus may be used as a heat sink of the light emitter 113a.

As shown in FIGS. 32A to 35, in different embodiments, the light emitting element 113 further includes support blocks 113m and 113n, and the support blocks 113m and 113n can be used to shorten the length of the circuit board 113h for grounding and bonding. Specifically, the supporting blocks 113m and 113n can be arranged between the pillar 113e and the base 113g, or on both sides of the circuit board 113h (as shown in FIG. 35). In addition, the support blocks 113m and 113n are connected between the ground terminal of the circuit board 113h and the base 113g. Therefore, the ground terminal of the circuit board 113h and the base 113g can be electrically connected through the support blocks 113m and 113n made of conductive material. Between the ground terminals of the light emitting element 113, thereby shortening the wire bonding length inside the light emitting element 113, so as to achieve high-speed signal performance.

In some embodiments, one or more supporting blocks 113m can be directly integrally formed on the base 113g (as shown in FIGS. 32A and 32B). However, it is not limited to this. In some embodiments, one supporting block 113n (as shown in FIGS. 33A and 33B) or a plurality of supporting blocks 113n (as shown in FIGS. 34A and 34B) may also be separated from the base 113g. Outside.

As shown in FIG. 35, in some embodiments, a plurality of supporting blocks 113m and 113n may also be provided on both sides of the circuit board 113h to support the circuit board 113h and shorten the length of the circuit board 113h to be grounded.

As shown in FIGS. 32A to 34B, in different embodiments, the light receiver 114p may also be integrated in the light emitting element 113. Specifically, the base 113g may be provided with a base recess 113r, For accommodating the circuit board 114m, the light receiver 114p can be fixed on the circuit board 114m, so the light receiver 114p can be arranged on the base 113g. It is worth noting that the optical receiver 114p and the optical transmitter 113a can be located in the same optical axis direction, so that the optical receiver 114p can obtain a larger backlight monitoring current value, which is beneficial to the design of matching the functions of the TO and TRX circuits.

Furthermore, as shown in FIGS. 32A to 34B, the base recess 113r of the base 113g may have an inclination angle (for example, 5 degrees to 45 degrees) for adjusting according to the incident angle of the light receiver 114p to improve The light receiving efficiency of the light receiver 114p.

Furthermore, as shown in FIG. 36, a plurality of pillars 113e, 113f can be arranged on the base 113g, the first pillar 113e is used to support the first circuit board 113h and the refrigerator 119b, and the light emitter 113a is electrically connected On the first circuit board 113h, the second post 113f is used to support the second circuit board 113i, and the second circuit board 113i is used to electrically connect to external signal lines (not labeled).

The terms "in some embodiments" and "in various embodiments" are used repeatedly. The term usually does not refer to the same embodiment; but it can also refer to the same embodiment. The terms "including", "having" and "including" are synonyms, unless the context indicates other meanings.

Although examples of various methods, devices, and systems have been described herein, the scope covered by the present disclosure is not limited thereto. On the contrary, this disclosure covers all methods, equipment, systems, and manufactured things that reasonably fall within the scope defined by the claims, and the scope of the claims should be interpreted based on the established principles of interpretation of the scope of patent applications. For example, although the examples of the systems disclosed above include software or firmware that can be executed from the hardware in addition to other components, it should be understood that these systems are merely exemplary examples and should be interpreted as It is a restrictive example. In detail, any or all of the disclosed hardware, software, and/or firmware components may be specifically embodied as hardware, specifically software, specifically embodied as firmware, or hardware, Some combination of software and/or firmware.

In summary, although the present invention has been disclosed as above in preferred embodiments, the above-mentioned preferred embodiments The examples are not intended to limit the present invention. Those of ordinary skill in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention is subject to the scope defined by the claims.

Therefore, the present invention has excellent advancement and practicability among similar products. At the same time, after searching through domestic and foreign technical documents about this kind, it is indeed not found that the same or similar structure or technology exists before the application of this case. Therefore, This case should have met the patent requirements of "inventiveness", "applicability for industry" and "progressiveness", and the application was filed in accordance with the law.

However, the above is only a preferred embodiment of the present invention. Any other equivalent structural changes made by applying the specification of the present invention and the scope of the patent application should be included in the scope of the patent application of the present invention.

Claims (8)

An optical transceiver module includes: a substrate; a light emitting element connected to the substrate; a plurality of light receiving elements, which are a plurality of cylindrical light receiving elements and connected to the substrate, each of the plurality of cylindrical light receiving elements The airtightness of the element is between 1 x 10 ^-9 atm*cc/sec and 5 x 10 ^-8 atm*cc/sec; and a light receiving fixture for assembling the plurality of cylindrical light receiving elements, The plurality of cylindrical light-receiving elements are fixed in the light-receiving holder; wherein the light-receiving holder is provided with a plurality of fixed through holes, and the inner diameter or size of each of the fixed through holes corresponds to the barrel The external dimensions of the type light receiving element; wherein the cylindrical light receiving elements have different sizes of first width and second width, and the fixed through hole has different sizes of first and second inner apertures, the first An inner aperture corresponds to the first width, and the second inner aperture corresponds to the second width. For example, the optical transceiver module of the first item of the scope of patent application, wherein the cylindrical light receiving fixtures are fixed on the substrate. For example, the optical transceiver module of the first item of the scope of patent application, wherein the plurality of cylindrical light receiving elements are respectively connected to the first connection pad and the second connection pad on the substrate through a connection board, wherein the first connection The pad and the second connection pad are electrically connected to the circuit on the substrate. For example, in the optical transceiver module of the first item of the scope of patent application, the light receiving components are arranged on the substrate, and the light emitting components are arranged obliquely on one side of the substrate or on the substrate. For example, the optical transceiver module of the first item of the scope of patent application, wherein the light receiving components are arranged on the substrate, and the light receiving components are obliquely arranged on one side of the substrate or on the substrate. For example, the optical transceiver module of the first item of the scope of patent application, wherein the light emitting element and the light receiving elements are simultaneously arranged obliquely on one side of the substrate or on the substrate. For example, in the optical transceiver module of the first item of the scope of patent application, the light receiving components are arranged on one side of the substrate, and the light emitting components are arranged on the substrate in parallel or obliquely. An optical fiber cable module includes: an optical fiber cable; and an optical transceiver module, including: a substrate; at least one light emitting element connected to the substrate; a plurality of light receiving elements, which are a plurality of cylindrical lights The receiving element is connected to the substrate, and the air tightness of each of the plurality of cylindrical light receiving elements is between 1 x 10 ^-9 atm*cc/sec and 5 x 10 ^-8 atm*cc/sec; And at least one light receiving holder for assembling the plurality of cylindrical light receiving elements, wherein the plurality of cylindrical light receiving elements are fixed in the light receiving holder; wherein, the light receiving holder is provided with a plurality of Fixed through holes, the inner aperture or size of each fixed through hole corresponds to the external size of the cylindrical light receiving element; wherein the cylindrical light receiving elements have different sizes of first width and second width, and The fixed through hole has a first inner hole and a second inner hole of different sizes, the first inner hole corresponds to the first width, and the second inner hole corresponds to the second width.

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