TWM520852U - Temperature-variable liquid container improvement structure - Google Patents

Temperature-variable liquid container improvement structure Download PDF

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Publication number
TWM520852U
TWM520852U TW104218392U TW104218392U TWM520852U TW M520852 U TWM520852 U TW M520852U TW 104218392 U TW104218392 U TW 104218392U TW 104218392 U TW104218392 U TW 104218392U TW M520852 U TWM520852 U TW M520852U
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TW
Taiwan
Prior art keywords
space
liquid container
conductive member
bottom portion
temperature change
Prior art date
Application number
TW104218392U
Other languages
Chinese (zh)
Inventor
jia-fang Zhang
Original Assignee
jia-fang Zhang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by jia-fang Zhang filed Critical jia-fang Zhang
Priority to TW104218392U priority Critical patent/TWM520852U/en
Priority to KR2020160001748U priority patent/KR20170001831U/en
Priority to US15/088,892 priority patent/US20170138647A1/en
Publication of TWM520852U publication Critical patent/TWM520852U/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/20—External fittings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/20—External fittings
    • B65D25/24—External fittings for spacing bases of containers from supporting surfaces, e.g. legs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D43/00—Lids or covers for rigid or semi-rigid containers
    • B65D43/02—Removable lids or covers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/002—Liquid coolers, e.g. beverage cooler
    • F25D31/003—Liquid coolers, e.g. beverage cooler with immersed cooling element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/005—Combined cooling and heating devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/006—Other cooling or freezing apparatus specially adapted for cooling receptacles, e.g. tanks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D9/00—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2205/00—Venting means
    • B65D2205/02—Venting holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Description

可變溫之液體容器改良結構Variable temperature liquid container improved structure


　　本創作係有關一種液體容器結構，尤指一種可變溫之液體容器改良結構。
The present invention relates to a liquid container structure, and more particularly to an improved structure of a variable temperature liquid container.


　　如第5圖所示，為一種習用可變溫之液體容器結構，其具有一本體81，該本體81具有一可供液體容置的空間82，為使該空間82內的液體能變溫（變冷或變熱），故在該本體1之空間82下方設置一致冷晶片83，該致冷晶片83係平貼於該空間82之底部84，而當該致冷晶片83進行變溫時，則可透過該底部84傳導至該空間82內以對液體進行致冷或加熱之動作。
　　又如第6圖所示，為另一種習用可變溫之液體容器結構，其亦係一本體91具有一空間92，而一致冷晶片93設在其底部94，且亦另設一加熱元件95在該底部94，該致冷晶片93在此僅提供致冷效果，而加熱部分則完全由該加熱元件95所提供。
　　前述兩種習用可變溫之液體容器結構，雖然皆具有對液體變溫的功能，惟其底部84、94皆為平板狀，且當致冷晶片83、93和加熱元件95所產生的冷和熱在其底部84、94進行傳導時，於該空間82、92內之液體和底部84、94是以面接觸的方式進行導冷或導熱，然後在空間82、92中再由下逐漸往上擴散，由於傳導面積有限，實務上難以將冷或熱傳導至空間82、92之頂部，導致空間82、92內的液體在致冷或加熱的效果上，有傳導效果慢且均溫度不佳的問題。
　　因此，如何解決上述習用可變溫之液體容器結構之問題者，即為本創作之重點所在。
As shown in Fig. 5, it is a conventional variable temperature liquid container structure having a body 81 having a space 82 for liquid accommodation, so that the liquid in the space 82 can be warmed (cooled). Or heating up, so that a uniform cold wafer 83 is disposed under the space 82 of the body 1. The cooled wafer 83 is flatly attached to the bottom portion 84 of the space 82, and is permeable when the cooling wafer 83 is temperature-changed. The bottom 84 is conducted into the space 82 to cool or heat the liquid.
Further, as shown in FIG. 6, it is another conventional variable temperature liquid container structure, which is also a body 91 having a space 92, and a uniform cold wafer 93 is provided at the bottom portion 94 thereof, and a heating element 95 is also provided. The bottom portion 94, the cooled wafer 93 provides only a cooling effect here, and the heating portion is entirely provided by the heating element 95.
The two conventional variable temperature liquid container structures have the function of temperature-changing the liquid, but the bottoms 84, 94 are all flat, and the cold and heat generated by the cooling chips 83, 93 and the heating element 95 are When the bottoms 84, 94 are conducting, the liquid and the bottom portions 84, 94 in the spaces 82, 92 are cooled or thermally conducted in a surface contact manner, and then gradually diffused upward from the bottom in the spaces 82, 92 due to The conduction area is limited, and it is practically difficult to conduct cold or heat to the top of the spaces 82, 92, resulting in a problem that the liquid in the spaces 82, 92 has a slow conduction effect and a poor temperature in the effect of cooling or heating.
Therefore, how to solve the problem of the above-mentioned conventional variable temperature liquid container structure is the focus of the creation.


　　本創作之主要目的，在於解決上述的問題而提供一種可變溫之液體容器改良結構，以達到傳導效果快且均溫度佳的功效。
　　為達前述之目的，本創作係包括：
　　一本體，以一環牆和一底部圍設成一供液體容置的第一空間，且該本體頂部具有一開口連通該第一空間，且以一蓋體設於該本體之開口處以密閉該開口；
　　一傳導件，和該本體之底部結合，且由該本體之底部往該第一空間內伸設，該第一空間內形成一環繞在該傳導件周圍的傳導區；
　　一座體，結合該本體之底部且位在該本體下方，該座體具有一第二空間，該第一空間以其底部與該第二空間區隔；
　　一變溫元件，於該座體之第二空間內結合在該傳導件下方，且以傳導的方式經由該第一空間之底部對該傳導件進行導冷或導熱，該變溫元件在該第二空間內並設有一散熱件；
　　一電源供應器，設於該座體之第二空間內，且和該變溫元件電性連接，以提供該變溫元件所需之電源。
　　其中，該傳導件於該第一空間內結合在該底部，且在該底部上方裸露在該第一空間內。
　　其中，該底部具有一往該第一空間內伸設之隆起部，該隆起部中形成一凹穴，該凹穴以該隆起部和該第一空間隔開，該傳導件於該凹穴中結合該隆起部而往該第一空間內伸設。
　　其中，該變溫元件為致冷晶片。
　　其中，該座體具有複數散熱孔。
　　其中，該座體具有一頂部，該本體以其底部和該座體之頂部對接而結合，該變溫元件於該第二空間內嵌設在該頂部，且經由該座體之頂部與該本體之底部對該傳導件進行導冷或導熱。
　　本創作之上述及其他目的與優點，不難從下述所選用實施例之詳細說明與附圖中，獲得深入了解。
　　當然，本創作在某些另件上，或另件之安排上容許有所不同，但所選用之實施例，則於本說明書中，予以詳細說明，並於附圖中展示其構造。
The main purpose of the present invention is to solve the above problems and provide an improved structure of a variable temperature liquid container to achieve a fast conduction effect and a good average temperature.
For the purposes of the foregoing, this creative department includes:
a body is defined by a ring wall and a bottom portion as a first space for liquid accommodation, and the top of the body has an opening communicating with the first space, and a cover body is disposed at the opening of the body to seal the opening ;
a conductive member is coupled to the bottom of the body and extends from the bottom of the body into the first space, and a conductive region surrounding the conductive member is formed in the first space;
a body, coupled to the bottom of the body and located below the body, the seat body has a second space, the first space is separated from the second space by a bottom portion thereof;
a temperature change element is coupled to the conductive member in a second space of the base body, and conducts cooling or heat conduction of the conductive member through the bottom of the first space in a conductive manner, the temperature change element is in the second space There is a heat sink inside;
A power supply is disposed in the second space of the base and electrically connected to the temperature change component to provide a power supply required for the temperature change component.
Wherein the conductive member is bonded to the bottom portion in the first space, and is exposed in the first space above the bottom portion.
Wherein the bottom portion has a ridge extending into the first space, and a recess is formed in the ridge, the recess is separated from the first space by the ridge, and the conductive member is in the recess The ridge is coupled to the first space.
Wherein, the temperature change element is a refrigerated wafer.
Wherein, the base body has a plurality of heat dissipation holes.
Wherein, the base body has a top portion, and the body is coupled with the bottom portion thereof and the top of the base body. The temperature change element is embedded in the top portion in the second space, and the top portion of the base body and the body are The bottom portion conducts cooling or heat conduction to the conductive member.
The above and other objects and advantages of the present invention will become more apparent from the detailed description and the accompanying drawings.
Of course, the present invention is allowed to differ in some of the parts, or the arrangement of the parts, but the selected embodiments are described in detail in the present specification, and the construction thereof is shown in the drawings.

（習用部分）
81‧‧‧本體
82‧‧‧空間
83‧‧‧致冷晶片
84‧‧‧底部
91‧‧‧本體
92‧‧‧空間
93‧‧‧致冷晶片
94‧‧‧底部
95‧‧‧加熱元件
（本創作部分）
1‧‧‧本體
11‧‧‧環牆
12‧‧‧底部
13‧‧‧第一空間
14‧‧‧開口
15‧‧‧蓋體
16‧‧‧傳導區
2‧‧‧傳導件
21‧‧‧頂面
22‧‧‧環周面
3‧‧‧座體
31‧‧‧第二空間
32‧‧‧頂部
33‧‧‧散熱孔
4‧‧‧變溫元件
41‧‧‧散熱件
5‧‧‧電源供應器
12A‧‧‧底部
121A‧‧‧隆起部
122A‧‧‧凹穴(customized part)
81‧‧‧Ontology
82‧‧‧ Space
83‧‧‧Chilled wafer
84‧‧‧ bottom
91‧‧‧Ontology
92‧‧‧ Space
93‧‧‧Cold wafer
94‧‧‧ bottom
95‧‧‧Heating elements (this creation part)
1‧‧‧ Ontology
11‧‧‧Circle wall
12‧‧‧ bottom
13‧‧‧First space
14‧‧‧ openings
15‧‧‧ cover
16‧‧‧Transmission zone
2‧‧‧Transmission parts
21‧‧‧ top surface
22‧‧‧Circular surface
3‧‧‧ body
31‧‧‧Second space
32‧‧‧ top
33‧‧‧ vents
4‧‧‧Variable temperature components
41‧‧‧ Heat sink
5‧‧‧Power supply
12A‧‧‧ bottom
121A‧‧‧Uplift
122A‧‧‧ recess


第1圖係本創作之第一實施例之液體容器內部構造示意圖。
第2圖係第1圖之傳導件對傳導區之液體導冷或導熱之局部放大示意圖。
第3圖係本創作之第二實施例之液體容器內部構造示意圖。
第4圖係第3圖之傳導件對傳導區之液體進行導冷或導熱之局部放大示意圖。
第5圖係習用可變溫之液體容器結構之內部構造示意圖。
第6圖係另一習用可變溫之液體容器結構之內部構造示意圖。
Fig. 1 is a schematic view showing the internal structure of a liquid container according to a first embodiment of the present invention.
Fig. 2 is a partially enlarged schematic view showing the liquid conduction or heat conduction of the conductive member to the conduction region of Fig. 1.
Fig. 3 is a schematic view showing the internal structure of a liquid container according to a second embodiment of the present invention.
Fig. 4 is a partially enlarged schematic view showing the conduction or cooling of the liquid in the conducting zone by the conducting member of Fig. 3.
Fig. 5 is a schematic view showing the internal structure of a liquid container structure of a variable temperature.
Figure 6 is a schematic view showing the internal structure of another conventional variable temperature liquid container structure.


　　請參閱第1圖至第4圖，圖中所示者為本創作所選用之實施例結構，此僅供說明之用，在專利申請上並不受此種結構之限制。
　　本實施例提供一種可變溫之液體容器改良結構，其係包括一容器之本體1、一傳導件2、一座體3、一變溫元件4和一電源供應器5，其中：
　　如第1圖所示，該本體1具有一環牆11和一底部12，且以該環牆11和底部12圍設成一第一空間13，該第一空間13可供液體容置，且該本體1頂部具有一開口14，該開口14連通該第一空間13，並以一蓋體15設於該本體1之開口14處，藉以密閉該開口14，而使該第一空間13可形成一密閉空間。
　　此外，該傳導件2和該本體1之底部12結合，且由該本體1之底部12往該第一空間13內伸設，該第一空間13內形成一傳導區16，該傳導區16環繞在該傳導件2周圍，此述傳導件2周圍包含一頂面21和一環周面22。於本實施例中，該傳導件2於該第一空間13內結合在該底部12，且於該底部12上方裸露在該第一空間13內，故在該第一空間13內的液體是直接和該傳導件2在該第一空間13內露出的部位進行接觸。
　　再者，該座體3結合於該本體1之底部12，且位在該本體1下方，該座體3具有一第二空間31，該第一空間13以其底部12與該第二空間31作為區隔。於本實施例中，該座體3具有一頂部32，該本體1以其底部12與該座體3之頂部32對接而結合。
　　該變溫元件4位於該座體3之第二空間31內並結合於該傳導件2下方，且以傳導的方式經由該本體1底部12對該傳導件2進行導冷或導熱，該變溫元件4在該第二空間31內並設有一散熱件41，該座體3並具有複數散熱孔33，各該散熱孔33係可供該座體3內之熱空氣向外散出，以輔助該散熱器41進行散熱。於本實施例中，該變溫元件4係為致冷晶片，其於該第二空間31內嵌設在其頂部32，且經由該頂部32和該本體1底部12對該傳導件2進行導冷或導熱。
　　另外，該電源供應器5設於該座體3之第二空間31內，且和該變溫元件4電性連接，以提供該變溫元件4所需之電源。於本實施例中，該電源供應器5係為電池。
　　如第2圖所示，當該變溫元件4進行變溫(變冷或變熱)時，其所產生的冷或熱經該底部12傳導至該傳導件2，且在該傳導件2周圍對著該傳導區16發散，此時在該傳導區16的液體直接與該傳導件2周圍接觸，因而受該傳導件2變溫而可快速的致冷或加熱，並透過液體在該第一空間13內有上下的溫差而形成對流，讓液體在該第一空間13內可獲得均溫的效果。
　　由於藉由該傳導件2伸設在該第一空間13內，因此可提供液體接觸的面積在該傳導件2的周圍(如前述頂面21和環周面22)，相較於習知可變溫之液體容器結構以面接觸的方式導冷或導熱而言，相對能提供較大的傳導面積以對該第一空間13內的液體進行變溫，而當同時變溫的液體量大時，在該第一空間13內形成對流的現象則愈快速且明顯，故能達到傳導效果快且均溫度佳的功效。
　　當然，本創作仍存在許多例子，其間僅細節上之變化。請參閱第3至4圖，其係本創作之第二實施例，和第一實施例之主要差異，在於該本體1之底部12A具有一隆起部121A，該隆起部121A是往該第一空間13內伸設，該隆起部121A中形成一凹穴122A，該凹穴122A以該隆起部121A和該第一空間13隔開，該傳導件2於該凹穴122A中結合該隆起部121A而往該第一空間13內伸設，藉此達到與第一實施例相同之功效。
　　以上所述實施例之揭示係用以說明本創作，並非用以限制本創作，故舉凡數值之變更或等效元件之置換仍應隸屬本創作之範疇。
　　由以上詳細說明，可使熟知本項技藝者明瞭本創作的確可達成前述目的，實已符合專利法之規定，爰提出專利申請。
Please refer to Fig. 1 to Fig. 4, which shows the structure of the embodiment selected for the present invention, which is for illustrative purposes only and is not limited by this structure in the patent application.
The embodiment provides a variable temperature liquid container improved structure, which comprises a body 1 of a container, a conductive member 2, a body 3, a temperature change element 4 and a power supply 5, wherein:
As shown in FIG. 1 , the body 1 has a ring wall 11 and a bottom portion 12 , and the ring wall 11 and the bottom portion 12 are surrounded by a first space 13 , and the first space 13 is for liquid accommodation, and the first space 13 is The top of the main body 1 has an opening 14 . The opening 14 communicates with the first space 13 and is disposed at the opening 14 of the body 1 with a cover 15 to seal the opening 14 , so that the first space 13 can form a first space 13 . hermetic space.
In addition, the conductive member 2 is coupled to the bottom portion 12 of the body 1 and extends from the bottom portion 12 of the body 1 into the first space 13. A conductive region 16 is formed in the first space 13, and the conductive region 16 is surrounded. Around the conductive member 2, the conductive member 2 is surrounded by a top surface 21 and a circumferential surface 22. In this embodiment, the conductive member 2 is coupled to the bottom portion 12 in the first space 13 and exposed in the first space 13 above the bottom portion 12, so that the liquid in the first space 13 is directly Contact with the portion of the conductive member 2 exposed in the first space 13 is made.
Furthermore, the base 3 is coupled to the bottom 12 of the body 1 and is located below the body 1. The base 3 has a second space 31 with a bottom portion 12 and a second space 31. As a division. In the present embodiment, the base 3 has a top portion 32 that is joined by its bottom portion 12 abutting against the top portion 32 of the base body 3.
The temperature change element 4 is located in the second space 31 of the base body 3 and is coupled under the conductive member 2, and conducts cooling or heat conduction of the conductive member 2 via the bottom portion 12 of the body 1 in a conductive manner. A heat dissipating member 41 is disposed in the second space 31. The seat body 3 has a plurality of heat dissipating holes 33. The heat dissipating holes 33 are configured to dissipate the hot air in the seat body 3 to assist the heat dissipating. The device 41 performs heat dissipation. In the present embodiment, the temperature change element 4 is a refrigerated wafer embedded in the top portion 32 of the second space 31, and the conductive member 2 is cooled through the top portion 32 and the bottom portion 12 of the body 1. Or heat conduction.
In addition, the power supply device 5 is disposed in the second space 31 of the base 3 and electrically connected to the temperature change element 4 to provide the power required for the temperature change element 4. In this embodiment, the power supply 5 is a battery.
As shown in FIG. 2, when the temperature change element 4 is subjected to temperature change (cooling or heating), the cold or heat generated is conducted to the conductive member 2 via the bottom portion 12, and is opposed to the conductive member 2 The conductive region 16 is diverged, and the liquid in the conductive region 16 is directly in contact with the periphery of the conductive member 2, so that the conductive member 2 is heated to be rapidly cooled or heated, and the liquid is permeated in the first space 13. There is a temperature difference between the upper and lower sides to form a convection, so that the liquid can obtain a uniform temperature effect in the first space 13.
Since the conductive member 2 is extended in the first space 13, the area in which the liquid contact can be provided is around the conductive member 2 (such as the aforementioned top surface 21 and circumferential surface 22), as compared with the conventional one. The temperature-changing liquid container structure can provide a relatively large conductive area to change the temperature of the liquid in the first space 13 in the case of cold contact or heat conduction in a surface contact manner, and when the amount of liquid simultaneously changing temperature is large, The phenomenon that convection is formed in the first space 13 is faster and more obvious, so that the conduction effect is fast and the average temperature is good.
Of course, there are still many examples of this creation, only the details change. Referring to FIGS. 3 to 4, which is a second embodiment of the present invention, the main difference from the first embodiment is that the bottom portion 12A of the body 1 has a ridge portion 121A, and the ridge portion 121A is toward the first space. 13 is formed in the ridge portion 121A, and a recess 122A is formed in the ridge portion 121A. The recess 122A is separated from the first space 13 by the ridge portion 121A. The conductive member 2 is coupled to the ridge portion 121A in the recess 122A. The first space 13 is extended to achieve the same effect as the first embodiment.
The above description of the embodiments is intended to be illustrative of the present invention and is not intended to limit the scope of the present invention.
From the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the aforementioned objectives, and has been in compliance with the provisions of the Patent Law, and has filed a patent application.

1‧‧‧本體 1‧‧‧ Ontology

11‧‧‧環牆 11‧‧‧Circle wall

12‧‧‧底部 12‧‧‧ bottom

13‧‧‧第一空間 13‧‧‧First space

14‧‧‧開口 14‧‧‧ openings

15‧‧‧蓋體 15‧‧‧ cover

16‧‧‧傳導區 16‧‧‧Transmission zone

2‧‧‧傳導件 2‧‧‧Transmission parts

21‧‧‧頂面 21‧‧‧ top surface

22‧‧‧環周面 22‧‧‧Circular surface

3‧‧‧座體 3‧‧‧ body

31‧‧‧第二空間 31‧‧‧Second space

32‧‧‧頂部 32‧‧‧ top

33‧‧‧散熱孔 33‧‧‧ vents

4‧‧‧變溫元件 4‧‧‧Variable temperature components

41‧‧‧散熱件 41‧‧‧ Heat sink

5‧‧‧電源供應器 5‧‧‧Power supply

Claims (7)

一種可變溫之液體容器改良結構，其係包括：
　　一本體，以一環牆和一底部圍設成一供液體容置的第一空間，且該本體頂部具有一開口連通該第一空間，且以一蓋體設於該本體之開口處以密閉該開口；
　　一傳導件，和該本體之底部結合，且由該本體之底部往該第一空間內伸設，該第一空間內形成一環繞在該傳導件周圍的傳導區；
　　一座體，結合該本體之底部且位在該本體下方，該座體具有一第二空間，該第一空間以其底部與該第二空間區隔；
　　一變溫元件，於該座體之第二空間內結合在該傳導件下方，且以傳導的方式經由該第一空間之底部對該傳導件進行導冷或導熱，該變溫元件在該第二空間內並設有一散熱件；
　　一電源供應器，設於該座體之第二空間內，且和該變溫元件電性連接，以提供該變溫元件所需之電源。 A variable temperature liquid container improved structure, comprising:
a body is defined by a ring wall and a bottom portion as a first space for liquid accommodation, and the top of the body has an opening communicating with the first space, and a cover body is disposed at the opening of the body to seal the opening ;
a conductive member is coupled to the bottom of the body and extends from the bottom of the body into the first space, and a conductive region surrounding the conductive member is formed in the first space;
a body, coupled to the bottom of the body and located below the body, the seat body has a second space, the first space is separated from the second space by a bottom portion thereof;
a temperature change element is coupled to the conductive member in a second space of the base body, and conducts cooling or heat conduction of the conductive member through the bottom of the first space in a conductive manner, the temperature change element is in the second space There is a heat sink inside;
A power supply is disposed in the second space of the base and electrically connected to the temperature change component to provide a power supply required for the temperature change component. 依請求項1所述之可變溫之液體容器改良結構，其中，該傳導件於該第一空間內結合在該底部，且於該底部上方裸露在該第一空間內。The variable temperature liquid container improvement structure of claim 1, wherein the conductive member is bonded to the bottom portion in the first space and exposed in the first space above the bottom portion. 依請求項1所述之可變溫之液體容器改良結構，其中，該底部具有一往該第一空間內伸設之隆起部，該隆起部中形成一凹穴，該凹穴以該隆起部和該第一空間隔開，該傳導件於該凹穴中結合該隆起部而往該第一空間內伸設。The variable temperature liquid container improvement structure according to claim 1, wherein the bottom portion has a ridge extending into the first space, and a recess is formed in the ridge portion, the recess is formed by the ridge portion and The first space is spaced apart, and the conducting member is coupled to the ridge in the recess to extend into the first space. 依請求項1所述之可變溫之液體容器改良結構，其中，該變溫元件為致冷晶片。The variable temperature liquid container improved structure of claim 1, wherein the temperature change element is a refrigerant wafer. 依請求項1所述之可變溫之液體容器改良結構，其中，該座體具有複數散熱孔。The variable temperature liquid container improvement structure according to claim 1, wherein the base body has a plurality of heat dissipation holes. 依請求項1所述之可變溫之液體容器改良結構，其中，該座體具有一頂部，該本體以其底部和該座體之頂部對接而結合，該變溫元件於該第二空間內嵌設在該頂部，且經由該座體之頂部與該本體之底部對該傳導件進行導冷或導熱。The variable temperature liquid container improvement structure according to claim 1, wherein the base body has a top portion, the body is coupled with the bottom portion thereof and the top of the base body, and the temperature change element is embedded in the second space. At the top, the conductive member is cooled or thermally conducted via the top of the body and the bottom of the body. 依請求項1所述之可變溫之液體容器改良結構，其中，該電源供應器為電池。The variable temperature liquid container improved structure of claim 1, wherein the power supply is a battery.
TW104218392U 2015-11-17 2015-11-17 Temperature-variable liquid container improvement structure TWM520852U (en)

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KR2020160001748U KR20170001831U (en) 2015-11-17 2016-04-01 Liquid container featuring an improved temperature-regulating structure
US15/088,892 US20170138647A1 (en) 2015-11-17 2016-04-01 Liquid container featuring improved temperature-regulating structure

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US11219099B2 (en) 2018-07-19 2022-01-04 Group B Labs, Inc. Multiple pillar liquid heater
US11785674B2 (en) 2017-07-19 2023-10-10 Group B Labs, Inc. Multiple pillar liquid heater
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US3549861A (en) * 1969-04-28 1970-12-22 Leonard Trachtenberg Self-heated thermos bottle
US5042258A (en) * 1989-08-07 1991-08-27 Sundhar Shaam P Drinking container
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