CN105843346A - Low-noise computer mainboard - Google Patents
Low-noise computer mainboard Download PDFInfo
- Publication number
- CN105843346A CN105843346A CN201610178538.0A CN201610178538A CN105843346A CN 105843346 A CN105843346 A CN 105843346A CN 201610178538 A CN201610178538 A CN 201610178538A CN 105843346 A CN105843346 A CN 105843346A
- Authority
- CN
- China
- Prior art keywords
- serpentine channel
- semiconductor chilling
- chilling plate
- batten
- computer motherboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a low-noise computer mainboard, comprising a substrate. The substrate is separated by spacer plates to form a serpentine channel; a cover plate covers one surface that is opposite to the substrate and that is on the serpentine channel, so as to make air flows entering the channel from one end of the serpentine channel pass through the whole serpentine channel and then go out of the other end; a micro fan for supplying air to the outside is arranged at the one end of the serpentine channel, and a semiconductor refrigerating plate is arranged at the other end, and a cold side of the semiconductor refrigerating plate faces the serpentine channel inwardly, and a hot side keeps in a thermal contact with a metal chassis via the cover plate; a portion that is of the cover plate and that is in contact with the hot side of the semiconductor refrigerating plate is composed of a thermal conducting material; and a component of which heat needs to be dissipated on the computer mainboard is arranged in the serpentine channel. The mainboard can achieve an excellent heat dissipation effect without a large power heat dissipation fan, and can effectively prevent condensed water from being generated on the computer mainboard.
Description
Technical field
Computer equipment field of the present invention, especially, relates to a kind of computer motherboard.
Background technology
Current computer motherboard; generally need to arrange radiator fan; owing to computer load is increasing; required radiating requirements is the most increasing, and this causes heat radiation noise relatively big, in particular with the change of weather; due to expanding with heat and contract with cold of parts each in cabinet; cause radiator fan that stucking phenomena often occurs, thus produce huge noise, have a strong impact on the experience of user.
In addition, at present in some DIY fields, player uses semiconductor chilling plate to substitute radiator fan in computer, and current way is, by the huyashi-chuuka (cold chinese-style noodles) of cooling piece directly against the surface being located at heater element；The problem that this kind of method relates to is, computer components surface usually can be too low and condensed water occur due to temperature, even frosting, it is most likely that cause whole calculating mainboard to damage.
Summary of the invention
For the problems referred to above, it is an object of the invention to provide a kind of low noise computer motherboard, this mainboard is without using high-power heat-dissipation fan can produce good radiating effect, and can effectively prevent from producing on computer motherboard condensed water.
The technical solution adopted for the present invention to solve the technical problems is: this low noise computer motherboard includes substrate, and described substrate is become a serpentine channel by divides；One side relative with described substrate on described serpentine channel is coated with cover plate, makes the air-flow in the flow channel of serpentine channel one end flow out from the other end after need to flowing through whole serpentine channel again；One end of described serpentine channel is provided with the mini-fan of externally air-supply, and the other end is provided with semiconductor chilling plate, and the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate is towards in serpentine channel, and hot side is thermally contacted with metal chassis by described cover plate；The part that described cover plate contacts with the hot side of described semiconductor chilling plate is made up of heat-conducting；On described computer motherboard, the components and parts of required heat radiation are arranged in described serpentine channel.
As preferably, the components and parts that cannot be arranged at the individual paths of serpentine channel in relatively big for area on described computer motherboard, described demarcation strip directly strides across from this components and parts upper surface, makes these components and parts be in two or more path.
As preferably, described cover plate is put together by batten, and each block of batten corresponds to the individual paths of described serpentine channel；The batten thermally contacted with described semiconductor chilling plate is made up of bonding jumper, and, this batten be in serpentine channel, do not contact with semiconductor chilling plate be partially covered with heat-insulation layer, the outer surface of this batten then contacts with cabinet inner surface heat completely；Remaining described batten is constituted by warming plate；So that described semiconductor chilling plate produces cold and is entirely used for lowering the temperature the components and parts in serpentine channel, its heat produced then the most outwards is dissipated by the huge metal surface of cabinet.
As preferably, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate is sticked the heat exchanger being located in serpentine channel, makes the cold on described huyashi-chuuka (cold chinese-style noodles) efficiently spill in the air-flow in serpentine channel.
The beneficial effects of the present invention is: this low noise computer motherboard is operationally, effect due to the mini-fan of described serpentine channel one end, external air flow is made to continuously flow into from the serpentine channel other end, flow into the air-flow in serpentine channel after the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, cold is brought in serpentine channel, make the components and parts in serpentine channel all can obtain good cooling, and, due to the air-flow in serpentine channel the most outwardly, even if generation steam, also will discharge continuously, and be difficult on components and parts liquefaction.
Accompanying drawing explanation
Fig. 1 is an embodiment schematic diagram of this low noise computer motherboard.
Fig. 2 is the side schematic view of Fig. 1 embodiment.
Detailed description of the invention
The present invention is further described with embodiment below in conjunction with the accompanying drawings:
In the embodiment shown in Fig. 1, Fig. 2, this low noise computer motherboard includes substrate 1, and described substrate 1 is separated into a serpentine channel 20 by demarcation strip 2；One side relative with described substrate 1 on described serpentine channel 20 is coated with cover plate 21, makes the air-flow in the flow channel of serpentine channel 20 one end flow out from the other end after need to flowing through whole serpentine channel again；In the present embodiment, described cover plate 21 is put together by batten, illustrates the position of each batten in cover plate 21 only with dotted line, and be not drawn into cover plate in Fig. 1；It can be seen that each block of batten of cover plate 21 corresponds to the individual paths of described serpentine channel 20 in Fig. 2.
One end of described serpentine channel 20 is provided with the mini-fan 3 of externally air-supply, and the other end is provided with semiconductor chilling plate 4, and the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate 4 is towards in serpentine channel 20, and hot side is thermally contacted with metal chassis by described cover plate 21；On described computer motherboard, the components and parts 6 of required heat radiation are arranged in described serpentine channel 20；Without the components and parts of heat radiation, it is located at outside serpentine channel.
In the present embodiment, that block batten that described cover plate 21 contacts with the hot side of described semiconductor chilling plate 4 is made up of bonding jumper, and, this batten be in serpentine channel 20, be not partially covered with heat-insulation layer with semiconductor chilling plate 4 contacts, the outer surface of this batten then contacts with cabinet inner surface heat completely；Remaining described batten is constituted by warming plate；So that described semiconductor chilling plate 4 produces cold and is entirely used for lowering the temperature the components and parts 6 in serpentine channel 20, its heat produced then the most outwards is dissipated by the huge metal surface of cabinet.
As it is shown in figure 1, components and parts relatively big for area on described computer motherboard, that cannot be arranged in the individual paths of serpentine channel 20, described demarcation strip 2 directly strides across from this components and parts upper surface, makes these components and parts be in two or more path.
The heat exchanger 5 being located in serpentine channel 20 it addition, be sticked on the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate 4 in this enforcement, makes the cold on described huyashi-chuuka (cold chinese-style noodles) efficiently spill in the air-flow in serpentine channel 20.
Above-mentioned low noise computer motherboard is operationally, effect due to the mini-fan 3 of described serpentine channel 20 one end, external air flow is made to continuously flow into from serpentine channel 20 other end, flow into the air-flow in serpentine channel 20 after the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate 4, cold is brought in serpentine channel 20, make the components and parts 6 in serpentine channel 20 all can obtain good cooling, and, due to the air-flow in serpentine channel 20 the most outwardly, even if generation steam, also will discharge continuously, and be difficult on components and parts 6 liquefaction.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any amendment of being made, equivalent, should be included within the scope of the present invention.
Claims (5)
1. a low noise computer motherboard, including substrate (1), it is characterised in that: it is separated into a serpentine channel (20) by demarcation strip (2) on described substrate (1)；The upper one side relative with described substrate (1) of described serpentine channel (20) is coated with cover plate (21), makes the air-flow in the flow channel of serpentine channel (20) one end flow out from the other end after need to flowing through whole serpentine channel again；One end of described serpentine channel (20) is provided with the mini-fan (3) of externally air-supply, the other end is provided with semiconductor chilling plate (4), and the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate (4) is interior towards serpentine channel (20), hot side is thermally contacted with metal chassis by described cover plate (21)；The part that described cover plate (21) contacts with the hot side of described semiconductor chilling plate (4) is made up of heat-conducting；On described computer motherboard, the components and parts (6) of required heat radiation are arranged in described serpentine channel (20).
Low noise computer motherboard the most according to claim 1, it is characterized in that:, the components and parts that cannot be arranged at the individual paths of serpentine channel (20) in relatively big for area on described computer motherboard, described demarcation strip (2) directly strides across from this components and parts upper surface, makes these components and parts be in two or more path.
Low noise computer motherboard the most according to claim 1 and 2, it is characterised in that: described cover plate (21) is put together by batten, and each block of batten corresponds to the individual paths of described serpentine channel (20)；The batten thermally contacted with described semiconductor chilling plate (4) is made up of bonding jumper, and, this batten be in serpentine channel (20), be not partially covered with heat-insulation layer with semiconductor chilling plate (4) contacts, the outer surface of this batten then contacts with cabinet inner surface heat completely；Remaining described batten is constituted by warming plate；So that described semiconductor chilling plate (4) produces cold and is entirely used for lowering the temperature the components and parts (6) in serpentine channel (20), its heat produced then the most outwards is dissipated by the huge metal surface of cabinet.
Low noise computer motherboard the most according to claim 1 and 2, it is characterized in that: be sticked on the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate (4) heat exchanger (5) being located in serpentine channel, makes the cold on described huyashi-chuuka (cold chinese-style noodles) efficiently spill in the air-flow in serpentine channel (20).
Low noise computer motherboard the most according to claim 3, it is characterized in that: be sticked on the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate (4) heat exchanger (5) being located in serpentine channel, makes the cold on described huyashi-chuuka (cold chinese-style noodles) efficiently spill in the air-flow in serpentine channel (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610178538.0A CN105843346A (en) | 2016-03-28 | 2016-03-28 | Low-noise computer mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610178538.0A CN105843346A (en) | 2016-03-28 | 2016-03-28 | Low-noise computer mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105843346A true CN105843346A (en) | 2016-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610178538.0A Pending CN105843346A (en) | 2016-03-28 | 2016-03-28 | Low-noise computer mainboard |
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| Country | Link |
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| CN (1) | CN105843346A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455424A (en) * | 2016-09-26 | 2017-02-22 | 珠海格力电器股份有限公司 | Mobile terminal and operation control method and device of mobile terminal |
| CN107296420A (en) * | 2017-07-06 | 2017-10-27 | 宜宾学院 | A kind of new cold-warm chair |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1270335A (en) * | 1999-04-14 | 2000-10-18 | 海尔集团公司 | Method and device for cooling computer chips |
| US20100290187A1 (en) * | 2009-05-15 | 2010-11-18 | Hon Hai Precision Industry Co., Ltd. | Airflow guiding cover and electronic device having the same |
| CN203282073U (en) * | 2013-05-30 | 2013-11-13 | 四川东方能源科技股份有限公司 | Electric welding equipment radiating side plate |
| US20140016264A1 (en) * | 2012-07-13 | 2014-01-16 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
| US20140098493A1 (en) * | 2011-10-27 | 2014-04-10 | Huawei Technologies Co., Ltd. | Heat dissipation system for communication device with box type chassis, box type chassis, and communication device |
| CN204808171U (en) * | 2015-06-09 | 2015-11-25 | 曹国震 | Computer motherboard heat abstractor |
-
2016
- 2016-03-28 CN CN201610178538.0A patent/CN105843346A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1270335A (en) * | 1999-04-14 | 2000-10-18 | 海尔集团公司 | Method and device for cooling computer chips |
| US20100290187A1 (en) * | 2009-05-15 | 2010-11-18 | Hon Hai Precision Industry Co., Ltd. | Airflow guiding cover and electronic device having the same |
| US20140098493A1 (en) * | 2011-10-27 | 2014-04-10 | Huawei Technologies Co., Ltd. | Heat dissipation system for communication device with box type chassis, box type chassis, and communication device |
| US20140016264A1 (en) * | 2012-07-13 | 2014-01-16 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
| CN203282073U (en) * | 2013-05-30 | 2013-11-13 | 四川东方能源科技股份有限公司 | Electric welding equipment radiating side plate |
| CN204808171U (en) * | 2015-06-09 | 2015-11-25 | 曹国震 | Computer motherboard heat abstractor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455424A (en) * | 2016-09-26 | 2017-02-22 | 珠海格力电器股份有限公司 | Mobile terminal and operation control method and device of mobile terminal |
| CN106455424B (en) * | 2016-09-26 | 2019-05-14 | 珠海格力电器股份有限公司 | The progress control method and device of a kind of mobile terminal, mobile terminal |
| CN107296420A (en) * | 2017-07-06 | 2017-10-27 | 宜宾学院 | A kind of new cold-warm chair |
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Application publication date: 20160810 |