TWM514922U - 3D printing platform and 3D printing device - Google Patents

Abstract

A 3D printing platform adapted for a 3D printing device including a photo-curing resin tank accommodating photo-curing resin and having an inner surface includes a piezoelectricity layer. During 3D printing process, the 3D printing platform is adapted to get into the photo-curing resin tank. After the photo-curing resin between the 3D printing platform and the inner surface is cured and transformed to a 3D printing object, the piezoelectricity layer is adapted to contract by voltage so that the 3D printing object cured on the 3D printing platform can be separated from the inner surface. A 3D printing device having the 3D printing platform is further provided.

Description

Three-dimensional printing stage and three-dimensional printing device

The present invention relates to a printing stage and a printing apparatus, and more particularly to a three-dimensional printing stage and a three-dimensional printing apparatus.

With the development of technology, 3D printing technology and Additive Manufacturing (AM) technology have become one of the most important development technologies. These technologies are one of the rapid prototyping technologies. They can directly produce the desired finished product directly by the user-designed digital model file, and the finished product is almost a three-dimensional entity of any shape.

In general, the additive manufacturing technique converts design data of a 3D model constructed using software such as computer aided design (CAD) into a plurality of thin (quasi-two-dimensional) cross-section layers that are continuously stacked. At the same time, many technical means for forming a plurality of thin cross-section layers have also been proposed. For example, the printing module of the printing device can generally move along the XY plane above the pedestal according to the space coordinate XYZ constructed by the design data of the 3D model, so that the construction material forms the correct cross-sectional layer shape. The deposited build material can then be naturally hardened or cured by heating or illumination of the source to form the desired cross-sectional layer. Therefore, by moving the printing module layer by layer along the axial direction Z, a plurality of cross-sectional layers can be gradually stacked along the Z-axis, thereby forming the three-dimensional object in the layer-by-layer curing state.

The existing three-dimensional printing technology has various molding mechanisms according to various types of machines and materials, such as liquid photo-curing resin, slurry and the like, and constructs a three-dimensional entity of a desired shape by stacking layers by layer. Among them, Stereolithography (SLA) and Digital Light Processing (DLP) have high precision and better surface quality. For example, a technique of forming a three-dimensional object by curing a building material by a light source is suitable for immersing in a photocurable resin contained in a photocurable resin bath, and the light source module is irradiated with a photocurable resin under the photocurable resin tank. The photocurable resin on the XY plane (that is, between the three-dimensional printing stage and the inner bottom surface of the photocurable resin tank) is cured and stacked on the three-dimensional printing stage of the printing module. In this way, by moving the three-dimensional printing stage by the moving mechanism and moving layer by layer along the axial direction Z, the photo-curable resin can be layer-by-layer cured and stacked into a three-dimensional printed object.

However, even if the inner bottom surface of the photocurable resin tank is a relatively non-stick material such as Teflon coating or PDMS silicone, the three-dimensional printing object may adhere to the inner bottom surface of the photocurable resin tank during the printing process. Therefore, the three-dimensional printed matter is not easily separated from the inner bottom surface of the photocurable resin tank.

The present invention provides a three-dimensional printing stage that allows three-dimensional printing articles to be easily separated from the inner bottom surface of the photocurable resin tank.

The present invention provides a three-dimensional printing apparatus having the above-described three-dimensional printing stage.

A three-dimensional printing device created by the present invention comprises a photocurable resin tank and a three-dimensional printing stage. The photocurable resin tank is adapted to hold a photocurable resin, and the photocurable resin tank has an inner bottom surface. The three-dimensional printing stage is adapted to enter the photocurable resin tank, and the three-dimensional printing stage comprises a piezoelectric layer, wherein in the process of three-dimensional printing, the photocurable resin is positioned between the three-dimensional printing stage and the inner bottom surface. After curing into a three-dimensional printed object, the piezoelectric layer is adapted to be shrunk by a voltage application to separate the three-dimensional printed matter solidified on the three-dimensional printing stage from the inner bottom surface.

In an embodiment of the present invention, the piezoelectric layer comprises a piezoelectric single crystal, a piezoelectric polycrystal or a piezoelectric polymer.

In an embodiment of the present invention, the piezoelectric single crystal includes a quartz piezoelectric crystal, a ferroelectric piezoelectric crystal lithium niobate or tantalum ruthenate, the piezoelectric polycrystal includes lead zirconate titanate, and the piezoelectric polymer includes Polyvinylidene fluoride, polyvinyl fluoride or polyvinyl chloride.

In an embodiment of the present invention, the three-dimensional printing stage includes a surface layer. In the process of three-dimensional printing, the three-dimensional printing object is adapted to contact the surface layer, and the entire surface layer is a piezoelectric layer.

In an embodiment of the present invention, the three-dimensional printing stage comprises a surface layer. In the process of three-dimensional printing, the three-dimensional printing object is adapted to contact the surface layer, and the surface layer comprises a central area and a surrounding central area. A surrounding area, and the piezoelectric layer is located in the surrounding area.

The three-dimensional printing stage created by the novel is suitable for a three-dimensional printing device. The three-dimensional printing device comprises a photo-curing resin tank, and the photo-curing resin tank is adapted to receive a photo-curing resin and has an inner bottom surface, a three-dimensional column. The printing stage comprises a piezoelectric layer, wherein in the process of three-dimensional printing, the three-dimensional printing stage is adapted to enter the photo-curing resin tank, and the photo-curing resin located between the three-dimensional printing stage and the inner bottom surface is cured to After printing the object in three dimensions, the piezoelectric layer is adapted to be shrunk by the voltage applied to separate the three-dimensional printed object solidified on the three-dimensional printing stage from the inner bottom surface.

In an embodiment of the present invention, the piezoelectric layer comprises a piezoelectric single crystal, a piezoelectric polycrystal or a piezoelectric polymer.

In an embodiment of the present invention, the piezoelectric single crystal includes a quartz piezoelectric crystal, a ferroelectric piezoelectric crystal lithium niobate or tantalum ruthenate, the piezoelectric polycrystal includes lead zirconate titanate, and the piezoelectric polymer includes Polyvinylidene fluoride, polyvinyl fluoride or polyvinyl chloride.

In an embodiment of the present invention, the three-dimensional printing stage includes a surface layer. In the process of three-dimensional printing, the three-dimensional printing object is adapted to contact the surface layer, and the entire surface layer is a piezoelectric layer.

In an embodiment of the present invention, the three-dimensional printing stage comprises a surface layer. In the process of three-dimensional printing, the three-dimensional printing object is adapted to contact the surface layer, and the surface layer comprises a central area and a surrounding central area. A surrounding area, and the piezoelectric layer is located in the surrounding area.

Based on the above, the three-dimensional printing stage of the three-dimensional printing device of the present invention comprises a piezoelectric layer, and the photocuring resin between the three-dimensional printing stage and the inner bottom surface of the photocurable resin tank is solidified into three-dimensional printing. After the object, the piezoelectric layer is adapted to be shrunk by the voltage applied to separate the three-dimensional printed object solidified on the three-dimensional printing stage from the inner bottom surface. The piezoelectric layer can be positioned over the entire surface layer in contact with the three-dimensional printed object. When the piezoelectric layer is energized, the volume of the entire surface layer of the three-dimensional printing stage shrinks, and the three-dimensional printed object moves up. Alternatively, the piezoelectric layer may also be located in a peripheral region of the surface layer in contact with the three-dimensional printed object. When the piezoelectric layer is energized, the volume of the surrounding area of the three-dimensional printing stage is contracted, and the surrounding area is lifted, three-dimensional. The printed article is then moved up at the peripheral portion, and the liquid photocurable resin enters the inner bottom surface of the three-dimensional printed object and the photo-curable resin groove, so that the three-dimensional printed article can be easily separated from the inner bottom surface of the photo-curable resin groove.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

1 is a schematic diagram of a three-dimensional printing apparatus in accordance with an embodiment of the present invention. Referring to FIG. 1 , the three-dimensional printing apparatus 100 of the present embodiment is exemplified by a three-dimensional printing apparatus using a technique of Stereolithography (SLA) and Digital Light Processing (DLP). The three-dimensional printing apparatus 100 includes a photo-curable resin tank 110 and a three-dimensional printing stage 120. The photocurable resin tank 110 contains a liquid photocurable resin 10 therein. As shown in FIG. 1, the photo-curable resin tank 110 has an inner bottom surface 112. The material of the inner bottom surface 112 of the photocurable resin tank 110 may be a relatively non-stick material such as a Teflon coating or a PDMS silicone. Of course, the material of the inner bottom surface 112 of the photo-curable resin tank 110 is not limited to the above.

The three-dimensional printing stage 120 is disposed on a moving mechanism (not shown), and the three-dimensional printing stage 120 is adapted to be immersed in the liquid photo-curing resin 10 contained in the photo-curing resin tank 110, and the light source module is photo-cured. The photocurable resin 10 is irradiated under the resin tank 110 such that the layer of the photocurable resin 10 between the three-dimensional printing stage 120 and the inner bottom surface 112 of the photocurable resin tank 110 is solidified on the three-dimensional printing stage 120. Thus, by the three-dimensional printing stage 120 being driven by the moving mechanism and moving layer by layer along the axial direction Z, the photocurable resin 10 can be solidified layer by layer and stacked into a three-dimensional printing object 20 (only schematically in FIG. 1) Show a layer).

In the present embodiment, the three-dimensional printing stage 120 includes a surface layer 122 at the bottom, and the surface layer 122 is a position where the three-dimensional printing object 20 is in direct contact. At the beginning of the three-dimensional printing, the three-dimensional printing stage 120 is lowered to a small distance (for example, about 50 μm) from the inner bottom surface 112 of the photo-curing resin tank 110. That is, the height of the photocurable resin 10 positioned between the surface layer 122 of the three-dimensional printing stage 120 and the inner bottom surface 122 of the photocurable resin bath 110 is about 50 μm. Then, the light source module irradiates the portion of the photocurable resin 10, so that the photocurable resin 10 which is originally liquid is solidified into one layer of the three-dimensional printing article 20 (as shown in FIG. 1). Further, the three-dimensional printing stage 120 will continue to move up a short distance to repeat the above-described curing operation.

However, at this stage, since there is adhesion between this layer of the three-dimensionally printed article 20 (that is, the layer designated as 20 in FIG. 1) and the inner bottom surface 112 of the photocurable resin tank 110, three-dimensional printing is performed. This layer of the article 20 is difficult to easily disengage the layer of the three-dimensional printing article 20 from the inner bottom surface 112 of the photo-curable resin tank 110 by directly moving up the three-dimensional printing stage 120. If the three-dimensional printing stage 120 is forcibly moved up, it may cause partial cracking of this layer of the solidified three-dimensional printing object 20, resulting in printing failure.

In order to avoid the above problem, in the present embodiment, the bottom surface layer 122 of the three-dimensional printing stage 120 is a piezoelectric layer 124, and the surface layer 122 which is in contact with the three-dimensional printing object 20 is made of a piezoelectric material. After the photocurable resin 10 between the three-dimensional printing stage 120 and the inner bottom surface 112 of the photocurable resin tank 110 is solidified into a three-dimensional printing object 20, the three-dimensional printing stage 120 can be transmitted through the piezoelectric layer 124. The mode of energization causes the volume of the piezoelectric layer 124 to shrink, and the three-dimensional printed object 20 moves up, and the liquid photocurable resin 10 can enter the solid three-dimensional printed object 20 and the inner bottom surface 112 of the photocurable resin tank 110. The space between the three-dimensional printed matter 20 can be easily separated from the inner bottom surface 112 of the photo-curable resin tank 110.

In this embodiment, the material of the piezoelectric layer 124 includes a piezoelectric single crystal, a piezoelectric polycrystal, or a piezoelectric polymer. In more detail, the piezoelectric single crystal includes a quartz piezoelectric crystal, a ferroelectric piezoelectric crystal lithium niobate or tantalum ruthenate, the piezoelectric polycrystal includes lead zirconate titanate, and the piezoelectric polymer includes polyvinylidene fluoride and poly Vinyl fluoride or polyvinyl chloride. Of course, the material type of the piezoelectric layer 124, the piezoelectric single crystal, the piezoelectric polycrystal, and the material of the piezoelectric polymer are not limited to the above.

It should be noted that in other embodiments, the piezoelectric layer 124 may not be located on the surface layer 122, but may be located inside the three-dimensional printing stage 120, as long as the piezoelectric layer 124 is shrunk when energized. The three-dimensional printing stage 120 has an effect of shrinking as a whole.

Other embodiments are described below, and the same or similar elements are denoted by the same or similar symbols and will not be described again.

2 is a schematic diagram of a three-dimensional printing apparatus in accordance with another embodiment of the present invention. Referring to FIG. 2, the main difference between the three-dimensional printing apparatus 100a of the present embodiment and the three-dimensional printing apparatus 100 of FIG. 1 is that, in FIG. 1, the entire surface layer 122 of the three-dimensional printing stage 120 is the piezoelectric layer 124. In the present embodiment, the surface layer 122a of the three-dimensional printing stage 120a includes a central region 126 and a surrounding region 128 surrounding the central region 126, and the piezoelectric layer 124 is located in the peripheral region 128.

In the present embodiment, since the piezoelectric layer 124 of the three-dimensional printing stage 120a is located in the peripheral area 128 of the surface layer 122a, when the piezoelectric layer 124 is energized, the three-dimensional printing stage 120a is in the peripheral area of the surface layer 122a. The volume of 128 is contracted, and similar to the state of the surrounding lift, the portion of the three-dimensional printed object 20 that is attached to the peripheral region 128 (i.e., the periphery of the three-dimensional printed object 20) also moves up slightly with the piezoelectric layer 124, and the liquid The photocurable resin 10 can enter the surrounding area between the three-dimensional printing article 20 and the inner bottom surface 112 of the photocurable resin tank 110. At this time, if the three-dimensional printing stage 120a is slightly moved upward, the liquid photocurable resin 10 is liquid. The central region between the three-dimensional printed matter 20 and the inner bottom surface 112 of the photo-curable resin tank 110 is gradually infiltrated, so that the three-dimensional printed matter member 20 can be easily separated from the inner bottom surface 112 of the photo-curable resin tank 110.

In this embodiment, the material of the central region 126 of the surface layer 122a of the three-dimensional printing stage 120a may be metal, such as stainless steel or aluminum, but the material of the central region 126 is not limited thereto, and the central region 126 is The material can also be polymer or ceramic. In addition, compared to FIG. 1, the entire surface layer 122 of the three-dimensional printing stage 120 is the piezoelectric layer 124, and the piezoelectric layer 124 of the present embodiment can have a lower cost only in the peripheral area 128 of the surface layer 122a. .

In summary, the three-dimensional printing stage of the three-dimensional printing device of the present invention comprises a piezoelectric layer, and the photocurable resin between the three-dimensional printing stage and the inner bottom surface of the photocurable resin tank is cured into one. After three-dimensionally printing the article, the piezoelectric layer is adapted to be shrunk by a voltage application to separate the three-dimensional printed article solidified on the three-dimensional printing stage from the inner bottom surface. The piezoelectric layer can be positioned over the entire surface layer in contact with the three-dimensional printed object. When the piezoelectric layer is energized, the volume of the entire surface layer of the three-dimensional printing stage shrinks, and the three-dimensional printed object moves up. Alternatively, the piezoelectric layer may also be located in a peripheral region of the surface layer in contact with the three-dimensional printed object. When the piezoelectric layer is energized, the volume of the surrounding area of the three-dimensional printing stage is contracted, and the surrounding area is lifted, three-dimensional. The printed article is then moved up at the peripheral portion, and the liquid photocurable resin enters the inner bottom surface of the three-dimensional printed object and the photo-curable resin groove, so that the three-dimensional printed article can be easily separated from the inner bottom surface of the photo-curable resin groove.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

10‧‧‧Photocuring resin
20‧‧‧3D printed objects
100, 100a‧‧‧3D printing device
110‧‧‧Light curing resin tank
112‧‧‧ inside bottom
120, 120a‧‧‧3D printing stage
122, 122a‧‧‧ surface layer
124‧‧‧Piezoelectric layer
126‧‧‧Central District
128‧‧‧ surrounding area

1 is a schematic diagram of a three-dimensional printing apparatus in accordance with an embodiment of the present invention. 2 is a schematic diagram of a three-dimensional printing apparatus in accordance with another embodiment of the present invention.

10‧‧‧Photocuring resin

20‧‧‧3D printed objects

100‧‧‧3D printing device

110‧‧‧Light curing resin tank

112‧‧‧ inside bottom

120‧‧‧Three-dimensional printing stage

122‧‧‧ surface layer

124‧‧‧Piezoelectric layer

Claims (10)

A three-dimensional printing device comprising: a photocurable resin tank adapted to receive a photocurable resin, the photocurable resin tank having an inner bottom surface; and a three-dimensional printing stage adapted to enter the photocurable resin tank The three-dimensional printing stage includes a piezoelectric layer, wherein during the three-dimensional printing, when the photocurable resin between the three-dimensional printing stage and the inner bottom surface is solidified into a three-dimensional printing object, The piezoelectric layer is adapted to be shrunk by a voltage applied to separate the three-dimensional printed article solidified on the three-dimensional printing stage from the inner bottom surface. The three-dimensional printing apparatus according to claim 1, wherein the piezoelectric layer comprises a piezoelectric single crystal, a piezoelectric polycrystal or a piezoelectric polymer. The three-dimensional printing apparatus according to claim 2, wherein the piezoelectric single crystal comprises a quartz piezoelectric crystal, a ferroelectric piezoelectric crystal lithium niobate or strontium ruthenate, and the piezoelectric polycrystal comprises lead zirconate titanate. The piezoelectric polymer comprises polyvinylidene fluoride, polyvinyl fluoride or polyvinyl chloride. The three-dimensional printing apparatus according to claim 1, wherein the three-dimensional printing stage comprises a surface layer, and the three-dimensional printing object is adapted to contact the surface layer during three-dimensional printing, and the whole The surface layer is the piezoelectric layer. The three-dimensional printing apparatus according to claim 1, wherein the three-dimensional printing stage comprises a surface layer, and the three-dimensional printing object is adapted to contact the surface layer during the three-dimensional printing process, the surface layer A central zone and a surrounding zone surrounding the central zone are included, and the piezoelectric layer is located in the surrounding zone. a three-dimensional printing stage suitable for a three-dimensional printing device, the three-dimensional printing device comprising a photo-curable resin tank adapted to receive a photo-curable resin and having an inner bottom surface, the three-dimensional printing The stage includes: a piezoelectric layer, wherein the three-dimensional printing stage is adapted to enter the photo-curing resin tank during three-dimensional printing, when the position between the three-dimensional printing stage and the inner bottom surface After the photocurable resin is cured into a three-dimensional printed article, the piezoelectric layer is adapted to be shrunk by a voltage application to separate the three-dimensional printed article solidified on the three-dimensional printing stage from the inner bottom surface. The three-dimensional printing stage according to claim 6, wherein the piezoelectric layer comprises a piezoelectric single crystal, a piezoelectric polycrystal or a piezoelectric polymer. The three-dimensional printing stage according to claim 7, wherein the piezoelectric single crystal comprises a quartz piezoelectric crystal, a ferroelectric piezoelectric crystal lithium niobate or strontium ruthenate, and the piezoelectric polycrystal comprises zirconium titanate. Lead, the piezoelectric polymer comprises polyvinylidene fluoride, polyvinyl fluoride or polyvinyl chloride. The three-dimensional printing stage according to claim 6, wherein the three-dimensional printing stage comprises a surface layer, and the three-dimensional printing object is adapted to contact the surface layer during three-dimensional printing, and the whole The surface layer is the piezoelectric layer. The three-dimensional printing stage according to claim 6, wherein the three-dimensional printing stage comprises a surface layer, and the three-dimensional printing object is adapted to contact the surface layer during the three-dimensional printing process, the surface The layer includes a central region and a surrounding region surrounding the central region, and the piezoelectric layer is located in the peripheral region.