TWM507528U - Illumination device - Google Patents

Illumination device Download PDF

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Publication number
TWM507528U
TWM507528U TW104203212U TW104203212U TWM507528U TW M507528 U TWM507528 U TW M507528U TW 104203212 U TW104203212 U TW 104203212U TW 104203212 U TW104203212 U TW 104203212U TW M507528 U TWM507528 U TW M507528U
Authority
TW
Taiwan
Prior art keywords
light
carrier
angle
transparent substrate
support member
Prior art date
Application number
TW104203212U
Other languages
Chinese (zh)
Inventor
Zhi-Ting Ye
Fen-Ren Chien
Shyi-Ming Pan
Original Assignee
Formosa Epitaxy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/218,869 external-priority patent/US9488321B2/en
Application filed by Formosa Epitaxy Inc filed Critical Formosa Epitaxy Inc
Publication of TWM507528U publication Critical patent/TWM507528U/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

An illumination device includes at least one light emitting element, a supporting base, and at least one support coupled to the supporting base. The at least one light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) structures. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with at least a part of the support surface without the LED structures, wherein light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. The light emitting element is disposed on the support, and at least a part of the support is inclined inward or outward relative to a central axis of the supporting base.

Description

照明裝置Lighting device

本創作係有關於一種照明裝置,尤指一種包含至少雙面發光之發光元件之照明裝置。The present invention relates to a lighting device, and more particularly to a lighting device comprising a light-emitting element that emits at least two sides.

發光二極體(light emitting diode,LED)本身所發出來的光是一種具有指向性的光源,並非如一般習知燈泡為一種發散型的光源,因此在應用上會受到限制。舉例而言,習知發光二極體難以提供甚至無法提供室內或戶外照明燈具所要求的發光效果。另外,習知發光二極體照明裝置僅可單面發光,因此照明效率也不高。The light emitted by the light emitting diode (LED) itself is a light source with directivity. It is not a conventional light source as a divergent light source, and thus it is limited in application. For example, conventional light-emitting diodes are difficult to provide or even provide the illumination effects required for indoor or outdoor lighting fixtures. In addition, the conventional light-emitting diode lighting device can emit light only on one side, and thus the illumination efficiency is not high.

為改善先前技術的缺點與限制,本創作提供一種照明裝置,該照明裝置包含至少一發光元件、一承載座與耦接於該承載座之一支撐件。該發光元件包含一透明基板與複數個發光二極體結構。該透明基板具有一承載面與一第二主表面,該承載面與該第二主表面彼此相對設置。該複數個發光二極體結構設置於該承載面上,並與未設置該發光二極體結構之部分該承載面形成可發光之一第一主表面。其中該複數個發光二極體結構中的至少一發光二極體結構發出的光線穿過該透明基板並由該第二主表面出光。該發光元件設置於該支撐件上,且該支撐件之至少一局部相對該承載座之一中心軸向內或向外傾斜。In order to improve the disadvantages and limitations of the prior art, the present invention provides a lighting device comprising at least one light-emitting element, a carrier and a support coupled to the carrier. The light emitting element comprises a transparent substrate and a plurality of light emitting diode structures. The transparent substrate has a bearing surface and a second main surface, and the bearing surface and the second main surface are disposed opposite to each other. The plurality of light emitting diode structures are disposed on the bearing surface, and the bearing surface forms a first main surface that can emit light, and a portion where the light emitting diode structure is not disposed. Light emitted by at least one of the plurality of light emitting diode structures passes through the transparent substrate and is emitted by the second main surface. The illuminating element is disposed on the support member, and at least a portion of the support member is inclined inward or outward with respect to a central axis of the carrier.

本創作之一較佳實施例的照明裝置,該發光元件與該承載座之間有一第一夾角,且該第一夾角之角度在45度至75度之間。In a lighting device according to a preferred embodiment of the present invention, the light-emitting element has a first angle with the carrier, and the angle of the first angle is between 45 degrees and 75 degrees.

本創作之另一較佳實施例的照明裝置,該支撐件更包含一第一連接部與一第二連接部,且該第二連接部設置於該承載座,其中該第一連接部連接於該第二連接部,並與該第二連接部之間有一第二夾角。In a lighting device of another preferred embodiment of the present invention, the support member further includes a first connecting portion and a second connecting portion, and the second connecting portion is disposed on the carrying base, wherein the first connecting portion is connected to The second connecting portion has a second angle with the second connecting portion.

本創作之又一較佳實施例的照明裝置,其中該第一連接部相對於該承載座之該中心軸向外延伸,且該第二夾角之角度在135度至175度之間。A lighting device according to still another preferred embodiment of the present invention, wherein the first connecting portion extends outwardly with respect to the central axis of the carrier, and the angle of the second angle is between 135 degrees and 175 degrees.

本創作之另一較佳實施例的照明裝置,其中該第一連接部相對於該承載座之該中心軸向內延伸,且該第二夾角之角度在5度至45度之間。A lighting device according to another preferred embodiment of the present invention, wherein the first connecting portion extends axially with respect to the center of the carrier, and the angle of the second angle is between 5 degrees and 45 degrees.

本創作之又一較佳實施例的照明裝置,其中該第二連接部與該承載座之間有一第三夾角,且該第三夾角之角度在45度至85度之間。A lighting device according to another preferred embodiment of the present invention, wherein the second connecting portion has a third angle with the carrier, and the angle of the third angle is between 45 degrees and 85 degrees.

本創作之另一較佳實施例的照明裝置,其中該支撐件為一弧形結構。A lighting device according to another preferred embodiment of the present invention, wherein the support member has an arcuate structure.

本創作之又一較佳實施例的照明裝置,其中該弧形結構之弧半徑在10mm至200mm之間,且該弧形結構之圓心位置為接近或遠離該承載座之該中心軸。A lighting device according to still another preferred embodiment of the present invention, wherein the arc-shaped structure has an arc radius of between 10 mm and 200 mm, and a center position of the arc-shaped structure is near or away from the central axis of the carrier.

本創作之另一較佳實施例的照明裝置,其中該支撐件為一拋物線形結構或一橢圓形結構。A lighting device according to another preferred embodiment of the present invention, wherein the support member is a parabolic structure or an elliptical structure.

1、310‧‧‧發光元件1, 310‧‧‧Lighting elements

2‧‧‧透明基板2‧‧‧Transparent substrate

3、14‧‧‧發光二極體結構3, 14‧‧‧Lighting diode structure

4‧‧‧能量轉換層4‧‧‧ energy conversion layer

5、26、324‧‧‧承載座5, 26, 324‧‧‧ bearing seat

6‧‧‧電路基板6‧‧‧ circuit board

7‧‧‧燈罩7‧‧‧shade

8‧‧‧反射鏡8‧‧‧Mirror

9、25‧‧‧類鑽碳膜9,25‧‧‧Drilling carbon film

10、10’、11、50、301、302、303、304、305、306、307‧‧‧照明裝置10, 10', 11, 50, 301, 302, 303, 304, 305, 306, 307‧‧‧ lighting devices

12M‧‧‧非平面結構12M‧‧‧ non-planar structure

16、31A‧‧‧第一電極16, 31A‧‧‧ first electrode

18、31B‧‧‧第二電極18, 31B‧‧‧ second electrode

20、23A‧‧‧第一連接導線20, 23A‧‧‧First connecting wire

21A‧‧‧第一主表面21A‧‧‧ first major surface

21B‧‧‧第二主表面21B‧‧‧Second major surface

22、23B‧‧‧第二連接導線22, 23B‧‧‧ second connecting wire

28‧‧‧晶片接合層28‧‧‧ wafer bonding layer

28A‧‧‧第一晶片接合層28A‧‧‧First wafer bonding layer

28B‧‧‧第二晶片接合層28B‧‧‧Second wafer bonding layer

30、32‧‧‧電極30, 32‧‧‧ electrodes

34‧‧‧發光面34‧‧‧Lighting surface

51、62、321‧‧‧支撐件51, 62, 321 ‧ ‧ support

52、63‧‧‧元件接合層52, 63‧‧‧ component joint layer

60‧‧‧承載機構60‧‧‧Loading mechanism

61‧‧‧插槽61‧‧‧ slots

141‧‧‧基底141‧‧‧Base

142‧‧‧N型半導體層142‧‧‧N type semiconductor layer

143‧‧‧主動層143‧‧‧ active layer

144‧‧‧P型半導體層144‧‧‧P type semiconductor layer

210‧‧‧承載面210‧‧‧ bearing surface

311A‧‧‧第一連接電極311A‧‧‧First connection electrode

311B‧‧‧第二連接電極311B‧‧‧Second connection electrode

322‧‧‧裝置基座322‧‧‧Device base

330、G‧‧‧缺口330, G‧‧‧ gap

342‧‧‧條狀部342‧‧‧ Strip

D‧‧‧距離D‧‧‧Distance

D1‧‧‧中心軸D1‧‧‧ central axis

H‧‧‧孔洞H‧‧‧ Hole

L‧‧‧光線L‧‧‧Light

P‧‧‧電路圖案P‧‧‧ circuit pattern

V+、V-‧‧‧驅動電壓V+, V-‧‧‧ drive voltage

θ1‧‧‧第一夾角Θ1‧‧‧ first angle

θ2‧‧‧第二夾角Θ2‧‧‧second angle

θ3‧‧‧第三夾角Θ3‧‧‧ third angle

第1圖與第2圖繪示了本創作之一較佳實施例之發光元件之結構示意圖。1 and 2 are schematic views showing the structure of a light-emitting element of a preferred embodiment of the present invention.

第3圖至第5圖繪示了本創作之一較佳實施例不同種類之發光二極體結構3耦接於導線之示意圖。3 to 5 are schematic views showing a preferred embodiment of the present invention in which different types of LED structures 3 are coupled to wires.

第6圖與第7圖繪示了本創作之一較佳實施例之能量轉換層之設置示意圖。6 and 7 illustrate schematic diagrams of the arrangement of the energy conversion layer of a preferred embodiment of the present invention.

第8圖繪示了本創作之另一較佳實施例之發光元件之剖面圖。Figure 8 is a cross-sectional view showing a light-emitting element of another preferred embodiment of the present invention.

第9圖繪示了本創作之另一較佳實施例之發光元件之剖面圖。Figure 9 is a cross-sectional view showing a light-emitting element of another preferred embodiment of the present invention.

第10圖繪示了本創作之另一較佳實施例之發光元件之立體示意圖。FIG. 10 is a perspective view showing a light-emitting element of another preferred embodiment of the present invention.

第11圖繪示了本創作之一較佳實施例承載座之示意圖。Figure 11 is a schematic view showing a carrier of a preferred embodiment of the present invention.

第12圖繪示了本創作之一較佳實施例承載座與電路板之示意圖。FIG. 12 is a schematic view showing a carrier and a circuit board according to a preferred embodiment of the present invention.

第13圖繪示了本創作之一較佳實施例之反射鏡之示意圖。Figure 13 is a schematic view showing a mirror of a preferred embodiment of the present invention.

第14圖繪示了本創作之一較佳實施例之類鑽碳膜之示意圖。Figure 14 is a schematic view showing a carbon film of a preferred embodiment of the present invention.

第15圖繪示了本創作之一較佳實施例之照明裝置之示意圖。Figure 15 is a schematic view showing a lighting device of a preferred embodiment of the present invention.

第16圖繪示了本創作之另一較佳實施例之照明裝置的外觀示意圖。FIG. 16 is a schematic view showing the appearance of a lighting device according to another preferred embodiment of the present invention.

第17圖繪示了本創作之另一較佳實施例之照明裝置的外觀示意圖。FIG. 17 is a schematic diagram showing the appearance of a lighting device according to another preferred embodiment of the present invention.

第18圖至第20圖繪示了本創作之一較佳實施例之透明基板插接或黏接於承載座之示意圖。18 to 20 are schematic views showing the insertion or bonding of a transparent substrate of a preferred embodiment of the present invention to a carrier.

第21圖與第22圖繪示了本創作之一較佳實施例之透明基板黏接於具有支撐件之承載座之示意圖。21 and 22 illustrate a schematic view of a transparent substrate of a preferred embodiment of the present invention bonded to a carrier having a support member.

第23圖繪示了本創作之另一較佳實施例之照明裝置的立體示意圖。Figure 23 is a perspective view showing a lighting device of another preferred embodiment of the present invention.

第24圖繪示了本創作之另一較佳實施例之照明裝置之裝置基座之立體示意圖。Figure 24 is a perspective view showing the base of the device of the lighting device of another preferred embodiment of the present invention.

第25圖繪示了本創作之另一較佳實施例之照明裝置之立體示意圖。Figure 25 is a perspective view showing a lighting device of another preferred embodiment of the present invention.

第26圖至第29圖繪示了本創作之一較佳實施例之以點對稱或線對稱排 列透明基板於承載機構上之俯視圖。Figures 26 to 29 illustrate a preferred embodiment of the present invention in a point symmetry or line symmetry row A top view of the column of transparent substrates on the support mechanism.

第30圖繪示了本創作之另一較佳實施例之照明裝置的示意圖。Figure 30 is a schematic view showing a lighting device of another preferred embodiment of the present invention.

第31圖與第32圖繪示了本創作之一較佳實施例之燈罩之示意圖。31 and 32 illustrate schematic views of a lampshade of a preferred embodiment of the present invention.

第33圖至第37圖繪示了本創作之不同實施例之照明裝置之示意圖。33 to 37 are schematic views of lighting devices of different embodiments of the present invention.

請參考第1圖與第2圖,第1圖與第2圖繪示了本創作之一較佳實施例發光元件1之結構示意圖。如第1圖與第2圖所示,發光元件1係包括:一透明基板2、一承載面210、一第一主表面21A、一第二主表面21B以及至少一多方向出光之發光二極體結構3。其中,為平板薄片狀的透明基板2本身具有兩個主要表面,其中之任一主要表面係可為承載面210。具有發光功能的發光二極體結構3設置於此承載面210之上,且發光二極體結構3未被透明基板2遮蔽之一發光面34,與未設置發光二極體結構3之至少部分承載面210共同形成可發光的第一主表面21A。透明基板2未設有發光二極體結構3的另一主要表面則為第二主表面21B。前述配置方式反之亦可,且亦可於透明基板2之該兩個表面均佈置發光二極體結構3。在其他實施例中,該承載面210的發光二極體結構3係對應於設置於第二主表面21B之發光二極體結構3交錯排列,使各面上的發光二極體結構3發光時,光線可順利穿透透明基板2並從另一面出光,而不被另一面上的發光二極體結構3遮蔽,以增加單位面積之發光強度(亮度)。透明基板2的材質可為藍寶石、陶瓷、玻璃、塑膠或是橡膠,並可包含氧化鋁(Al2O3)、氧化鎂、氧化鈹、氧化釔、氧化釷、氧化銡、鋯鈦酸鉛、砷化鎵、硫化鋅、硒化鋅、氟化鈣、氟化鎂、碳化矽(SiC)或其聚合物等元素其中之一。其中,本創作較佳實施例之一係採用藍寶石基板,因為此材料大體上為單晶結構,不但具有較好的透光率,且散熱能力佳,可延長發光元件1的壽命;但使用傳統藍寶石基板於本創作中會有易碎裂的問題,故本創作經實驗驗證,本創作之透明基板2較佳係選用厚 度在大於或等於200微米(um)的藍寶石基板,如此可達成較佳的可靠度,並有較佳的承載以及透光功能。同時為有效達成發光元件1雙向或多方向甚至全方向出光之目的,本創作之發光二極體結構3較佳係可選用出光角度大於180度者。如此一來,設置於透明基板2上的發光二極體結構3發光面34會發出遠離透明基板2方向之光線,且發光二極體結構3會發出至少部分進入透明基板2之光線,而進入透明基板2之光線除從透明基板2上對應第一主表面21A的第二主表面21B出光外,亦可從透明基板2的未設置發光二極體結構3之部分承載面210與其他表面出光,使發光元件1可以至少雙面出光、多方向出光或全方向出光。於本創作中,第一主表面21A或第二主表面21B之面積係為發光面34之總和面積的五倍以上,此係兼顧到發光效率以及散熱等條件而為較佳的配置比例。Please refer to FIG. 1 and FIG. 2 . FIG. 1 and FIG. 2 are schematic diagrams showing the structure of a light-emitting element 1 according to a preferred embodiment of the present invention. As shown in FIG. 1 and FIG. 2, the light-emitting element 1 includes a transparent substrate 2, a bearing surface 210, a first major surface 21A, a second major surface 21B, and at least one multi-directional light emitting diode. Body structure 3. Among them, the transparent substrate 2 which is a flat sheet shape itself has two main surfaces, and any one of the main surfaces may be the bearing surface 210. A light-emitting diode structure 3 having a light-emitting function is disposed on the bearing surface 210, and the light-emitting diode structure 3 is not shielded by the transparent substrate 2 from one of the light-emitting surfaces 34, and at least a portion of the light-emitting diode structure 3 is not disposed. The bearing faces 210 collectively form a first major surface 21A that is illuminable. The other main surface of the transparent substrate 2 not provided with the light emitting diode structure 3 is the second main surface 21B. The foregoing configuration may be reversed, and the light emitting diode structure 3 may also be disposed on both surfaces of the transparent substrate 2. In other embodiments, the light emitting diode structure 3 of the bearing surface 210 is arranged in a staggered manner corresponding to the light emitting diode structures 3 disposed on the second main surface 21B, so that the light emitting diode structures 3 on the respective surfaces emit light. The light can smoothly penetrate the transparent substrate 2 and emit light from the other surface without being shielded by the light-emitting diode structure 3 on the other surface to increase the luminous intensity (brightness) per unit area. The transparent substrate 2 may be made of sapphire, ceramic, glass, plastic or rubber, and may contain aluminum oxide (Al2O3), magnesium oxide, cerium oxide, cerium oxide, cerium oxide, cerium oxide, lead zirconate titanate, gallium arsenide. One of the elements such as zinc sulfide, zinc selenide, calcium fluoride, magnesium fluoride, lanthanum carbide (SiC) or a polymer thereof. Among them, one of the preferred embodiments of the present invention uses a sapphire substrate because the material is substantially a single crystal structure, which not only has good light transmittance, but also has good heat dissipation capability, and can extend the life of the light-emitting element 1; The sapphire substrate has the problem of fragility in this creation. Therefore, the creation of this transparent substrate 2 is preferably thick. The sapphire substrate is greater than or equal to 200 micrometers (um), so that better reliability can be achieved, and better carrying and light transmitting functions are achieved. At the same time, in order to effectively achieve the two-way or multi-directional or even omnidirectional light-emitting of the light-emitting element 1, the light-emitting diode structure 3 of the present invention is preferably selected to have a light-emitting angle greater than 180 degrees. As a result, the light-emitting surface 34 of the light-emitting diode structure 3 disposed on the transparent substrate 2 emits light away from the transparent substrate 2, and the light-emitting diode structure 3 emits light at least partially into the transparent substrate 2, and enters The light of the transparent substrate 2 may be emitted from the second main surface 21B of the transparent substrate 2 corresponding to the first main surface 21A, or may be emitted from the partial bearing surface 210 of the transparent substrate 2 where the light emitting diode structure 3 is not disposed. The light-emitting element 1 can emit light at least on both sides, emit light in multiple directions, or emit light in all directions. In the present creation, the area of the first main surface 21A or the second main surface 21B is five times or more the total area of the light-emitting surface 34, which is a preferable arrangement ratio in consideration of conditions such as luminous efficiency and heat dissipation.

另外,本創作之另一較佳實施例是發光元件1之第一主表面21A與第二主表面21B所發出光線之色溫差異等於或小於1500K,使發光元件1有更全面一致之發光效果。而於透明基板2的透光特性上,當發光二極體結構3發出光線之波長範圍大於或等於420奈米,及/或當該光線之波長範圍小於或等於470奈米時,在前述透明基板2厚度條件下,透明基板2之光穿透率係大於或等於70%。In addition, another preferred embodiment of the present invention is that the color temperature difference between the first main surface 21A and the second main surface 21B of the light-emitting element 1 is equal to or less than 1500K, so that the light-emitting element 1 has a more uniform and uniform illumination effect. In the light transmission characteristic of the transparent substrate 2, when the wavelength range of the light emitted by the light emitting diode structure 3 is greater than or equal to 420 nm, and/or when the wavelength range of the light is less than or equal to 470 nm, the transparent Under the condition of the thickness of the substrate 2, the light transmittance of the transparent substrate 2 is greater than or equal to 70%.

本創作並不以上述實施例為限。下文將依序介紹本創作之其它較佳實施例,且為了便於比較各實施例之相異處並簡化說明,在下文之各實施例中使用相同的符號標注相同的元件,且主要針對各實施例之相異處進行說明,而不再對重覆部分進行贅述。This creation is not limited to the above embodiments. Other preferred embodiments of the present invention will be described in the following, and in order to facilitate the comparison of the different embodiments and simplify the description, the same components are denoted by the same symbols in the following embodiments, and mainly for each implementation. The differences between the examples are explained, and the repeated parts are not described again.

請參考第3圖至第5圖,第3圖至第5圖繪示了本創作之一較佳實施例不同種類之發光二極體結構3耦接於導線23A、23B之示意圖。發光 二極體結構3包括第一電極31A與第二電極31B,此第一電極31A與第二電極31B則分別與位於透明基板2上之第一連接導線23A以及第二連接導線23B電性連接。第3圖係為橫式發光二極體結構,其中發光二極體結構3係形成於透明基板2之承載面210上,第一電極31A與第二電極31B係以打線方式分別電性耦接於第一連接導線23A與第二連接導線23B;第4圖係為覆晶式發光二極體結構,發光二極體結構3係倒置並藉第一電極31A與第二電極31B與透明基板2耦接,其中第一電極31A與第二電極31B係分別以焊接或黏接方式電性耦接於第一連接導線23A與第二連接導線23B;第5圖則是於發光二極體結構3之兩端設置第一電極31A與第二電極31B,並將發光二極體結構3以直立設置的方式使第一電極31A與第二電極31B分別與第一連接導線23A以及第二連接導線23B相連接。Please refer to FIG. 3 to FIG. 5 . FIG. 3 to FIG. 5 are schematic diagrams showing a preferred embodiment of the present invention in which different types of LED structures 3 are coupled to the wires 23A and 23B. Illuminate The diode structure 3 includes a first electrode 31A and a second electrode 31B. The first electrode 31A and the second electrode 31B are electrically connected to the first connecting wire 23A and the second connecting wire 23B on the transparent substrate 2, respectively. The third embodiment is a horizontal LED structure, wherein the LED structure 3 is formed on the bearing surface 210 of the transparent substrate 2, and the first electrode 31A and the second electrode 31B are electrically coupled by wire bonding. The first connecting wire 23A and the second connecting wire 23B; the fourth figure is a flip-chip light emitting diode structure, the light emitting diode structure 3 is inverted and the first electrode 31A and the second electrode 31B and the transparent substrate 2 are borrowed The first electrode 31A and the second electrode 31B are electrically coupled to the first connecting wire 23A and the second connecting wire 23B respectively by soldering or bonding; the fifth figure is the light emitting diode structure 3 The first electrode 31A and the second electrode 31B are disposed at both ends, and the first electrode 31A and the second electrode 31B are respectively disposed with the first connection electrode 23A and the second connection wire 23B in an upright manner. Connected.

請參考第6圖與第7圖,第6圖與第7圖繪示了本創作之一較佳實施例之能量轉換層4之設置示意圖。本創作之發光元件1可更包括一能量轉換層4,其係選擇性地設置於第一主表面21A或/與第二主表面21B之上,或是直接設置於發光二極體結構3上,且其可直接接觸於發光二極體結構3,或是與發光二極體結構3相鄰一段距離而不直接接觸。能量轉換層4係含有至少一種螢光粉,如石榴石系、硫酸鹽系或矽酸鹽系等無機或有機材質之螢光粉,以接收並轉換至少部分發光二極體結構3所發出光線之波長為另一種波長範圍。例如,當發光二極體結構3發出藍光,能量轉換層4就會轉換部分藍光為黃光,而使發光元件1在藍光與黃光混合之下最後發出白光。另外由於第一主表面21A光源主要是發光二極體結構3的發光面直接出光,而第二主表面21B光源則是發光二極體結構3的光線穿透透明基板2發出的光,兩個表面的光線強度不同,故本創作之另一較佳實施例係發光元件1於第一主表面21A與第二主表面21B上的能量轉換層4之螢光粉含量係相應配置,其中第一主表面21A對第二主表面21B上的螢光粉(或發光二極體結構上的 螢光粉對第二主表面21B上的螢光粉)含量比例範圍較佳的可從1比0.5至1比3,使發光元件1的光線強度或光形可以符合應用需求,以及使發光元件1之第一主表面21A與第二主表面21B所發出光線之色溫差異等於或小於1500K,提升發光元件1之波長轉換效率與發光效果。Please refer to FIG. 6 and FIG. 7 . FIG. 6 and FIG. 7 are schematic diagrams showing the arrangement of the energy conversion layer 4 according to a preferred embodiment of the present invention. The light-emitting element 1 of the present invention may further include an energy conversion layer 4 selectively disposed on the first main surface 21A or/and the second main surface 21B or directly disposed on the LED structure 3. And it may be in direct contact with the light emitting diode structure 3 or adjacent to the light emitting diode structure 3 without a direct contact. The energy conversion layer 4 contains at least one phosphor powder, such as a garnet, sulfate or citrate inorganic or organic phosphor, to receive and convert at least part of the light emitted by the LED structure 3. The wavelength is another wavelength range. For example, when the light-emitting diode structure 3 emits blue light, the energy conversion layer 4 converts part of the blue light into yellow light, and causes the light-emitting element 1 to finally emit white light under the mixture of blue light and yellow light. In addition, since the light source of the first main surface 21A is mainly the light emitting surface of the light emitting diode structure 3, and the light source of the second main surface 21B is the light of the light emitting diode structure 3, the light emitted by the transparent substrate 2, two The light intensity of the surface is different, so another preferred embodiment of the present invention is that the phosphor powder content of the energy conversion layer 4 on the first main surface 21A and the second main surface 21B of the light-emitting element 1 is correspondingly configured, wherein the first The main surface 21A is on the phosphor powder on the second main surface 21B (or on the structure of the light emitting diode) The proportion of the phosphor powder to the phosphor powder on the second main surface 21B may preferably range from 1 to 0.5 to 1 to 3, so that the light intensity or shape of the light-emitting element 1 can meet the application requirements, and the light-emitting element can be made. The color temperature difference of the light emitted by the first main surface 21A and the second main surface 21B of 1 is equal to or less than 1500K, and the wavelength conversion efficiency and the light-emitting effect of the light-emitting element 1 are improved.

請參考第8圖。第8圖繪示了本創作之另一較佳實施例之發光元件1之剖面圖。如第8圖所示,本實施例之發光元件1包括一透明基板2與至少一多方向出光之發光二極體結構14。透明基板2具有一承載面210與一第二主表面21B彼此相對設置。發光二極體結構14設置於透明基板2之承載面210上,且發光二極體結構14包括一第一電極16與一第二電極18,用以作外部電性連接。發光二極體結構14未被透明基板2遮蔽的一發光面34,與未被發光二極體結構14覆蓋之部分承載面210共同形成一第一主表面21A。Please refer to Figure 8. Figure 8 is a cross-sectional view showing a light-emitting element 1 of another preferred embodiment of the present invention. As shown in FIG. 8, the light-emitting element 1 of the present embodiment includes a transparent substrate 2 and at least one light-emitting diode structure 14 that emits light in multiple directions. The transparent substrate 2 has a bearing surface 210 and a second main surface 21B disposed opposite to each other. The LED structure 14 is disposed on the bearing surface 210 of the transparent substrate 2, and the LED structure 14 includes a first electrode 16 and a second electrode 18 for external electrical connection. A light-emitting surface 34 of the light-emitting diode structure 14 that is not shielded by the transparent substrate 2 forms a first main surface 21A together with a portion of the load-bearing surface 210 that is not covered by the light-emitting diode structure 14.

發光二極體結構14可包括一基底141、一N型半導體層142、一主動層143與一P型半導體層144。在本實施例中,發光二極體結構14之基底141可利用一晶片接合層28黏著於透明基板2上。晶片接合層28除了用來黏著發光二極體結構14之外,在材料的選擇上,晶片接合層28的折射率較佳可介於基底141的折射率與透明基板2的折射率之間,藉此可增加出光量。此外,晶片接合層28可為一透明膠或其他適合之接合材料。第一電極16與第二電極18係相對晶片接合層28設置於發光二極體結構14之另一面,並分別與P型半導體層144以及N型半導體層142電性連接(圖未示第二電極18與N型半導體層142之連接關係)。第一電極16與第二電極18的上表面係位於相同水平位置且可為金屬電極,但不以此為限。此外,發光元件1更包括一第一連接導線20、一第二連接導線22以及一能量轉換層4。第一連接導線20與第二連接導線22係設置於透明基板2上。第一連接導線20與第 二連接導線22可為例如金屬連接導線或其他導電圖案,但不以此為限。第一電極16與第二電極18係分別與第一連接導線20與第二連接導線22電性連接,且連接方式可利用打線方式(wire bonding)或焊接方式,但不以此為限。能量轉換層4係設置於透明基板2上,並可包覆發光二極體結構14。此外,能量轉換層4更可進一步設置並覆蓋透明基板2之第二主表面21B。The LED structure 14 can include a substrate 141, an N-type semiconductor layer 142, an active layer 143, and a P-type semiconductor layer 144. In this embodiment, the substrate 141 of the LED structure 14 can be adhered to the transparent substrate 2 by using a wafer bonding layer 28. The wafer bonding layer 28 is preferably used to adhere the light emitting diode structure 14. The refractive index of the wafer bonding layer 28 may be between the refractive index of the substrate 141 and the refractive index of the transparent substrate 2 in terms of material selection. Thereby, the amount of light can be increased. Additionally, the die attach layer 28 can be a clear adhesive or other suitable bonding material. The first electrode 16 and the second electrode 18 are disposed on the other side of the LED structure 14 opposite to the wafer bonding layer 28, and are electrically connected to the P-type semiconductor layer 144 and the N-type semiconductor layer 142, respectively. The connection relationship between the electrode 18 and the N-type semiconductor layer 142). The upper surface of the first electrode 16 and the second electrode 18 are at the same horizontal position and may be metal electrodes, but not limited thereto. In addition, the light-emitting element 1 further includes a first connecting wire 20, a second connecting wire 22, and an energy conversion layer 4. The first connecting wire 20 and the second connecting wire 22 are disposed on the transparent substrate 2. First connecting wire 20 and The two connecting wires 22 may be, for example, metal connecting wires or other conductive patterns, but are not limited thereto. The first electrode 16 and the second electrode 18 are respectively electrically connected to the first connecting wire 20 and the second connecting wire 22, and the connection manner can be by wire bonding or welding, but not limited thereto. The energy conversion layer 4 is disposed on the transparent substrate 2 and can cover the LED structure 14. Further, the energy conversion layer 4 can be further disposed and covered the second main surface 21B of the transparent substrate 2.

另外,為了增加光線從透明基板2離開之出光量並使出光的分布均勻,透明基板2之第一主表面21A與第二主表面21B可選擇性地分別具有一非平面結構12M。非平面結構12M可為各式凸出或凹陷的幾何結構,例如金字塔、圓錐體、半球體或三角柱等,且非平面結構12M的排列可為規則性排列或隨機性排列。再者,第一主表面21A以及第二主表面21B上可選擇性地設置有一類鑽碳(diamond-like carbon,DLC)膜25,用以增加導熱及散熱效果。In addition, in order to increase the amount of light emitted from the transparent substrate 2 and to distribute the light distribution uniformly, the first main surface 21A and the second main surface 21B of the transparent substrate 2 may selectively have a non-planar structure 12M, respectively. The non-planar structure 12M may be a variety of convex or concave geometric structures, such as pyramids, cones, hemispheres, or triangular columns, and the arrangement of the non-planar structures 12M may be a regular arrangement or a random arrangement. Furthermore, a first diamond-like carbon (DLC) film 25 is selectively disposed on the first main surface 21A and the second main surface 21B for increasing heat conduction and heat dissipation.

請參考第9圖。第9圖繪示了本創作之另一較佳實施例之發光元件1之剖面圖。與第4A圖之實施例相較,在本實施例之發光元件1中,第一電極16與第二電極18係與一第一晶片接合層28A設置於發光二極體結構14之同一表面,並以覆晶方式(flip chip)分別與第一連接導線20與第二連接導線22電性連接。其中,第一連接導線20與第二連接導線22可分別延伸至第一電極16與第二電極18的下方,且第一電極16與第二電極18可利用一第二晶片接合層28B分別與第一連接導線20與第二連接導線22電性連接。第二晶片接合層28B可為導電凸塊(conductive bump)例如金凸塊(gold bump)或錫鉛凸塊(solder bump)、導電膠(conductive glue)例如銀膠,或共晶層(eutectic layer)例如金錫(Au-Sn)合金共晶層或銦鉍錫合金(In-Bi-Sn alloy)共晶層,但不以此為限。在使用第二晶片接合層28B的狀況下,發光二極體結構14之下方之第一晶片接合層28A例如透明膠可省略,或是由能量轉換層4加以取代。Please refer to Figure 9. Figure 9 is a cross-sectional view showing a light-emitting element 1 of another preferred embodiment of the present invention. In the light-emitting element 1 of the present embodiment, the first electrode 16 and the second electrode 18 are disposed on the same surface of the light-emitting diode structure 14 as the first wafer bonding layer 28A. And electrically connected to the first connecting wire 20 and the second connecting wire 22 respectively by a flip chip. The first connecting wire 20 and the second connecting wire 22 may extend below the first electrode 16 and the second electrode 18, respectively, and the first electrode 16 and the second electrode 18 may be respectively connected by a second wafer bonding layer 28B. The first connecting wire 20 is electrically connected to the second connecting wire 22 . The second wafer bonding layer 28B may be a conductive bump such as a gold bump or a solder bump, a conductive glue such as a silver paste, or a eutectic layer. For example, a gold-tin (Au-Sn) alloy eutectic layer or an indium-bismuth-tin alloy (In-Bi-Sn alloy) eutectic layer, but not limited thereto. In the case where the second wafer bonding layer 28B is used, the first wafer bonding layer 28A under the LED structure 14 such as a transparent paste may be omitted or replaced by the energy conversion layer 4.

請參考第10圖,第10圖繪示了本創作之另一較佳實施例之發光元件310的立體示意圖。如第10圖所示,本創作之發光元件310包括透明基板2、至少一發光二極體結構3、一第一連接電極311A、一第二連接電極311B與至少一能量轉換層4。其中發光二極體結構3係設置於透明基板2之承載面210上,而形成發光之一第一主表面21A。在此實施例中,發光二極體結構3之一出光角度係大於180度,且發光二極體結構3所發出之至少部分光線會射入透明基板2,而射入光線至少部分會從對應第一主表面21A之一第二主表面21B出光,部分從透明基板2其他表面出光,進而達到六面發光的發光效果。第一連接電極311A以及第二連接電極311B係分別設置於透明基板2上兩端或同側(圖未示),並分別為透明基板2上之一第一連接導線與一第二連接導線所延伸的元件對外電極,故第一連接電極311A與第二連接電極311B係分別與發光二極體結構3電性連結。能量轉換層4係至少覆蓋發光二極體結構3並暴露至少部分第一連接電極311A與第二連接電極311B,其中能量轉換層4係至少部分吸收發光二極體結構3及/或透明基板2所發出之光線,並轉換成另一波長範圍之光線,然後與未被吸收之光線混光,增加發光元件310的發光波長範圍與發光效果。由於本實施例之發光元件310具有分別設置於透明基板2上相對兩端之第一連接電極311A與第二連接電極311B,故發光元件310可獨自完成製作後再與適合之承載座進行結合,因此可達到提升整體製造良率、簡化結構以及增加所配合之承載座設計變化等效果。Please refer to FIG. 10, which illustrates a perspective view of a light-emitting element 310 according to another preferred embodiment of the present invention. As shown in FIG. 10, the light-emitting element 310 of the present invention comprises a transparent substrate 2, at least one light-emitting diode structure 3, a first connection electrode 311A, a second connection electrode 311B and at least one energy conversion layer 4. The light emitting diode structure 3 is disposed on the bearing surface 210 of the transparent substrate 2 to form one of the first main surfaces 21A. In this embodiment, one of the light-emitting diode structures 3 has a light-emitting angle greater than 180 degrees, and at least part of the light emitted by the light-emitting diode structure 3 is incident on the transparent substrate 2, and the incident light is at least partially corresponding. The second main surface 21B of one of the first main surfaces 21A emits light, and partially emits light from other surfaces of the transparent substrate 2, thereby achieving a luminous effect of six-sided illumination. The first connecting electrode 311A and the second connecting electrode 311B are respectively disposed on the two ends or the same side (not shown) of the transparent substrate 2, and are respectively a first connecting wire and a second connecting wire on the transparent substrate 2. Since the extended element is external to the electrode, the first connection electrode 311A and the second connection electrode 311B are electrically connected to the LED structure 3, respectively. The energy conversion layer 4 covers at least the light emitting diode structure 3 and exposes at least a portion of the first connection electrode 311A and the second connection electrode 311B, wherein the energy conversion layer 4 at least partially absorbs the light emitting diode structure 3 and/or the transparent substrate 2 The emitted light is converted into light of another wavelength range, and then mixed with the unabsorbed light to increase the light-emitting wavelength range and the light-emitting effect of the light-emitting element 310. Since the light-emitting element 310 of the present embodiment has the first connection electrode 311A and the second connection electrode 311B respectively disposed at opposite ends of the transparent substrate 2, the light-emitting element 310 can be fabricated by itself and then combined with a suitable carrier. Therefore, it is possible to improve the overall manufacturing yield, simplify the structure, and increase the design change of the mated seat.

請參考第11圖,第11圖繪示了本創作之一較佳實施例承載座5之示意圖。本創作之一實施例係使用前述發光元件之照明裝置11,其中照明裝置11可更包括承載座5,使發光元件之透明基板2可以立設或橫躺於其上並耦接於承載座5,且透明基板2與承載座5之間具有一第一夾角θ1,該第一夾角θ1角度可為固設或根據照明裝置光形需要調動,其中較佳實施例的第 一夾角θ1角度範圍係介於30度至150度之間。Please refer to FIG. 11 , which illustrates a schematic view of a preferred embodiment of the carrier 5 of the present invention. An embodiment of the present invention is an illumination device 11 using the foregoing light-emitting elements, wherein the illumination device 11 can further include a carrier 5 such that the transparent substrate 2 of the light-emitting element can be erected or lie thereon and coupled to the carrier 5 And a first angle θ1 between the transparent substrate 2 and the carrier 5, the angle of the first angle θ1 may be fixed or mobilized according to the light shape of the illumination device, wherein the preferred embodiment An angle θ1 angle range is between 30 degrees and 150 degrees.

請參考第12圖,第12圖繪示了本創作之一較佳實施例承載座5與電路基板6之示意圖。本創作之照明裝置11的承載座5還可更包括一電路基板6與外部電源耦接,並電性耦接於透明基板2上的第一連接導線以及第二連接導線(圖未示),而與發光二極體結構3電性連接,使外部電源透過電路基板6供應發光二極體結構3發光所需電源。若無設置此電路基板6,發光二極體結構3亦可直接透過第一連接導線以及第二連接導線(圖未示)而電性連接於承載座5,使外部電源可經由承載座5對該發光二極體結構3供電。Please refer to FIG. 12, which shows a schematic diagram of a carrier 5 and a circuit substrate 6 according to a preferred embodiment of the present invention. The cradle 5 of the illuminating device 11 of the present invention may further include a circuit substrate 6 coupled to an external power source, and electrically coupled to the first connecting wire and the second connecting wire (not shown) on the transparent substrate 2, The electrical connection is electrically connected to the LED structure 3, so that the external power source supplies the power supply for the illumination of the LED structure 3 through the circuit substrate 6. If the circuit board 6 is not provided, the LED structure 3 can be directly connected to the carrier 5 through the first connecting wire and the second connecting wire (not shown), so that the external power source can be connected via the carrier 5 The light emitting diode structure 3 is powered.

請參考第13圖,第13圖繪示了本創作之一較佳實施例之反射鏡8之示意圖。本創作之照明裝置11還可包括反射鏡8設置於第二主表面21B上,此反射鏡8可反射該發光二極體結構3所發出至少部分穿透該透明基板2之該光線,而使該光線至少部分改由該第一主表面21A射出。此反射鏡8可包括至少一金屬層或一布拉格反射鏡(Bragg reflector),但不以此為限。其中,布拉格反射鏡可由多層具有不同折射率的介電薄膜所堆疊而構成,或是由多層具有不同折射率的介電薄膜與多層金屬氧化物所堆疊而構成。Please refer to FIG. 13, which shows a schematic view of a mirror 8 of a preferred embodiment of the present invention. The illuminating device 11 of the present invention may further include a mirror 8 disposed on the second main surface 21B, the mirror 8 reflecting the light emitted by the LED structure 3 at least partially penetrating the transparent substrate 2, The light is at least partially altered by the first major surface 21A. The mirror 8 may include at least one metal layer or a Bragg reflector, but is not limited thereto. The Bragg mirror may be formed by stacking a plurality of dielectric films having different refractive indices, or by stacking a plurality of dielectric films having different refractive indices and a plurality of metal oxides.

請參考第14圖,第14圖繪示了本創作之一較佳實施例之類鑽碳膜之示意圖。本創作之照明裝置11的透明基板2還可包括一類鑽碳(diamond-like carbon,DLC)膜9,其中該類鑽碳膜9係設置於透明基板2之承載面210及/或第二主表面21B上,以增加導熱及散熱效果。Please refer to FIG. 14 , which illustrates a schematic view of a carbon film of a preferred embodiment of the present invention. The transparent substrate 2 of the illuminating device 11 of the present invention may further comprise a diamond-like carbon (DLC) film 9 which is disposed on the bearing surface 210 of the transparent substrate 2 and/or the second main On the surface 21B, to increase heat conduction and heat dissipation.

請參考第15圖。第15圖繪示了本創作之一較佳實施例之照明裝置之示意圖。如第15圖所示,本實施例之照明裝置10包括一如先前實施例 所述之發光元件與一承載座26,其中該發光元件包括一透明基板2與至少一發光二極體結構14,且該發光元件係嵌入該承載座26內,透過連接導線20、22分別與該承載座之電極30、32電性連接,使一電源可透過該電極30、32提供驅動電壓V+,V-以驅動該發光二極體結構14發出光線L。發光二極體結構14包括一第一電極16與一第二電極18係利用打線方式(wire bonding)與第一連接導線20與第二連接導線22電性連接,但不以此為限。另外發光二極體結構14所發出光線L之出光角係大於180度或具有多個發光面,使得該發光元件的出光方向包括從第一主表面21A及第二主表面21B出光,且部分光線亦會由發光二極體結構14及/或透明基板2的四個側壁所射出,使照明裝置10具有六面發光或全方向出光特性。Please refer to Figure 15. Figure 15 is a schematic view showing a lighting device of a preferred embodiment of the present invention. As shown in FIG. 15, the lighting device 10 of the present embodiment includes a previous embodiment as The light-emitting element and a carrier 26, wherein the light-emitting element comprises a transparent substrate 2 and at least one light-emitting diode structure 14, and the light-emitting element is embedded in the carrier 26 through the connecting wires 20, 22 respectively The electrodes 30, 32 of the carrier are electrically connected, such that a power source can provide a driving voltage V+, V- through the electrodes 30, 32 to drive the LED structure 14 to emit light L. The light-emitting diode structure 14 includes a first electrode 16 and a second electrode 18 electrically connected to the first connecting wire 20 and the second connecting wire 22 by wire bonding, but is not limited thereto. In addition, the light emitting L emitted by the LED structure 14 has an exit angle greater than 180 degrees or has a plurality of light emitting surfaces, so that the light emitting direction of the light emitting element includes light from the first main surface 21A and the second main surface 21B, and part of the light is emitted. It is also emitted from the four sides of the light-emitting diode structure 14 and/or the transparent substrate 2, so that the illumination device 10 has six-sided illumination or omnidirectional light-emitting characteristics.

該發光元件可更包括一能量轉換層4設置於發光二極體結構14、第一主表面21A或第二主表面21B上。其中能量轉換層4可轉換至少部分發光二極體結構14所發出之光線為另一波長範圍的光,使照明裝置10發出特定光色或波長範圍較大的光線,例如發光二極體結構14產生的部分藍光在照射到能量轉換層4後可轉換成為黃光,而照明裝置10即可發出由藍光與黃光混合成的白光。另外,透明基板2係可以非平行方式及/或平行方式直接或間接固設於承載座26上。例如,透明基板2之側壁係以垂直方式固設於承載座26上,或將透明基板2平放於承載座26上,但不以此為限。由於透明基板2係選擇具有良好的熱傳導特性的材料,發光二極體結構14所產生的熱能可快速透過透明基板2傳遞至承載座26以進行散熱,故本創作之照明裝置10可使用高功率之發光二極體結構,但較佳實施例之照明裝置是在同樣功率條件下,改用多個較小功率的發光二極體結構設置於透明基板2上,以充分利用透明基板2的熱傳導特性,如本實施例之發光二極體結構14之功率係可小於例如0.2瓦特,但不以此為限。The light emitting element may further include an energy conversion layer 4 disposed on the light emitting diode structure 14, the first main surface 21A or the second main surface 21B. The energy conversion layer 4 can convert the light emitted by at least part of the LED structure 14 into light of another wavelength range, so that the illumination device 10 emits light of a specific light color or a wide wavelength range, for example, the LED structure 14 The generated partial blue light can be converted into yellow light after being irradiated to the energy conversion layer 4, and the illumination device 10 can emit white light mixed by blue light and yellow light. In addition, the transparent substrate 2 can be directly or indirectly fixed to the carrier 26 in a non-parallel manner and/or in a parallel manner. For example, the side wall of the transparent substrate 2 is fixed on the carrier 26 in a vertical manner, or the transparent substrate 2 is placed on the carrier 26, but not limited thereto. Since the transparent substrate 2 selects a material having good heat conduction characteristics, the thermal energy generated by the LED structure 14 can be quickly transmitted to the carrier 26 through the transparent substrate 2 for heat dissipation, so that the illumination device 10 of the present invention can use high power. The light-emitting diode structure, but the illumination device of the preferred embodiment is disposed on the transparent substrate 2 under the same power condition, and uses a plurality of light-emitting diode structures to fully utilize the heat conduction of the transparent substrate 2. The power system of the light-emitting diode structure 14 of the present embodiment may be less than, for example, 0.2 watts, but is not limited thereto.

請參考第16圖。第16圖繪示了本創作之另一較佳實施例之照明裝置10’的外觀示意圖。相較於第15圖,本實施例之照明裝置10’包括複數個發光二極體結構14,且至少部份發光二極體結構14以串聯方式彼此電性連接。其中,各發光二極體結構14分別包括第一電極16與一第二電極18,串聯頭端之一個發光二極體結構14的第一電極16與第一連接導線20電性連接,而尾端之另一個發光二極體結構14的第二電極18與第二連接導線22電性連接,但不以此為限,發光二極體結構14亦可利用並聯或串並聯方式電性連接。本實施例之發光二極體結構14可以選自發出同一色光的發光二極體結構,例如藍光發光二極體結構,或根據應用需求使用組合不同色光之發光二極體結構。在此狀況下搭配能量轉換層4的作法更可增加照明裝置10’發出各種光色的彈性。Please refer to Figure 16. Fig. 16 is a view showing the appearance of a lighting device 10' according to another preferred embodiment of the present invention. In contrast to Fig. 15, the illumination device 10' of the present embodiment includes a plurality of light emitting diode structures 14, and at least a portion of the light emitting diode structures 14 are electrically connected to each other in series. Each of the LED structures 14 includes a first electrode 16 and a second electrode 18, and the first electrode 16 of the LED structure 14 at the head end of the series is electrically connected to the first connecting wire 20, and the tail The second electrode 18 of the other LED structure 14 is electrically connected to the second connecting wire 22, but not limited thereto, the LED structure 14 can also be electrically connected by parallel or series-parallel connection. The light emitting diode structure 14 of the present embodiment may be selected from a light emitting diode structure emitting the same color light, such as a blue light emitting diode structure, or a light emitting diode structure combining different color lights according to application requirements. The use of the energy conversion layer 4 in this case further increases the elasticity of the illumination device 10' to emit various light colors.

請參考第17圖。第17圖繪示了本創作之另一較佳實施例之照明裝置50的外觀示意圖。相較於第15圖以及第16圖,本實施例之照明裝置50包括包括一如先前實施例所述之發光元件以及一支撐件51,支撐件51用以連結該發光元件與承載座26,其中該發光元件的透明基板2係藉由一元件接合層52固設於支撐件51之一側,而支撐件51之另一側可嵌設於承載座26上。另外支撐件51為可彈性調整角度,使該發光元件0與承載座26之夾角介於30度至150度之間。支撐件51的材質可包括複合式金屬材料、銅導線、電線或其他適合的材料。Please refer to Figure 17. FIG. 17 is a schematic diagram showing the appearance of a lighting device 50 according to another preferred embodiment of the present invention. The illumination device 50 of the present embodiment includes a light-emitting element as described in the previous embodiment and a support member 51 for connecting the light-emitting element and the carrier 26, as compared with the first and sixth embodiments. The transparent substrate 2 of the light-emitting element is fixed on one side of the support member 51 by an element bonding layer 52, and the other side of the support member 51 can be embedded on the carrier 26. In addition, the support member 51 is elastically adjustable to make the angle between the light-emitting element 0 and the carrier 26 between 30 degrees and 150 degrees. The material of the support member 51 may include a composite metal material, a copper wire, a wire, or other suitable material.

請參考第18圖至第20圖,第18圖至第20圖繪示了本創作之一較佳實施例之透明基板2插接或黏接於承載座5之示意圖。當本創作中的透明基板2設置於承載座5之上時,透明基板2係為插接或是黏接於承載座5上。Please refer to FIG. 18 to FIG. 20 . FIG. 18 to FIG. 20 are schematic diagrams showing the transparent substrate 2 of the preferred embodiment of the present invention being inserted or bonded to the carrier 5 . When the transparent substrate 2 in the present invention is disposed on the carrier 5 , the transparent substrate 2 is inserted or adhered to the carrier 5 .

如第18圖所示,當透明基板2佈置於承載座5之上時,其係插接於承載座5的單孔式插槽61,而使發光二極體元件透過連接導線與此插槽61電性耦接。此時透明基板2上的發光二極體結構(圖未示)為了要與承載座5的電源供應相耦接,因此電路圖案或連接導線集中至透明基板2邊緣並整合為具有複數個導電觸片的金手指結構或如連接電極311A和311B,也就是電性連接埠。而插槽61則可讓透明基板2插入,使得發光二極體結構(圖未示)在獲得承載座5供電的同時,透明基板2也被固設於承載座5的插槽61。As shown in FIG. 18, when the transparent substrate 2 is disposed on the carrier 5, it is inserted into the single-hole slot 61 of the carrier 5, and the LED component is transmitted through the connecting wire and the slot. 61 electrical coupling. At this time, the light emitting diode structure (not shown) on the transparent substrate 2 is coupled to the power supply of the carrier 5, so that the circuit pattern or the connecting wires are concentrated to the edge of the transparent substrate 2 and integrated into a plurality of conductive contacts. The gold finger structure of the sheet or the connection electrodes 311A and 311B, that is, the electrical connection port. The slot 61 allows the transparent substrate 2 to be inserted, so that the light-emitting diode structure (not shown) is fixed to the socket 61 of the carrier 5 while the power supply of the carrier 5 is obtained.

接著,請參考第19圖,其係為透過插接透明基板2於承載座5上多孔式插槽之結構示意圖。此時透明基板2具有至少一雙插腳結構,其中一個插腳為元件正極,另一個則為元件負極,兩處皆為具有導電觸片作為連接埠。而對應地,在承載座5則具有至少兩個與插腳插入面尺寸相符的插槽61,使得透明基板2可以與承載座5順利接合,並讓發光二極體結構獲得供電。Next, please refer to FIG. 19 , which is a schematic structural view of the porous slot on the carrier 5 through the transparent substrate 2 . At this time, the transparent substrate 2 has at least one double pin structure, one of which is a positive electrode of the element, and the other is a negative electrode of the element, and both have a conductive contact as a connection port. Correspondingly, the carrier 5 has at least two slots 61 corresponding to the size of the pin insertion surface, so that the transparent substrate 2 can be smoothly engaged with the carrier 5 and the light emitting diode structure can be powered.

請參考第20圖,其元件接合層係以黏接的方式將透明基板2與承載座5接合。在黏接的過程中,可以透過金、錫、銦、鉍、銀等金屬做焊接輔助而接合,或是使用具導電性的矽膠或是環氧樹脂輔助固設透明基板2於承載座5上,使發光元件之導電圖案或連接導線藉此元件接合層與承載座5上之電極電性連接。Referring to FIG. 20, the component bonding layer bonds the transparent substrate 2 to the carrier 5 in an adhesive manner. In the process of bonding, it can be joined by welding with gold, tin, indium, antimony, silver or the like, or by using a conductive silicone or epoxy resin to fix the transparent substrate 2 on the carrier 5. The conductive pattern or the connecting wire of the light-emitting element is electrically connected to the electrode on the carrier 5 by the element bonding layer.

請參考第21圖與第22圖,第21圖與第22圖繪示了本創作之一較佳實施例之透明基板2黏接於具有支撐件62之承載座5之示意圖。本實施例之照明裝置11主要組成同先前實施例所述,其中承載座5為一鋁板或金屬基板如可彎折之複合式含鋁材料、銅導線或電線構成。承載座5的表面或是側邊具有至少一支撐件62,該支撐件62為與承載座5分離或一體化之機構 件。一發光元件係可透過黏接的方式與支撐件62相耦接,也就是藉由元件接合層63將透明基板2固設於承載座5,並與承載座5無支撐件的部分的表面維持具有第一夾角θ1,且承載座5無支撐件62的部分的表面亦可設置發光二極體結構提昇照明裝置11之發光效果;另外,該發光元件亦可透過插接(圖未示)的方式與支撐件62相連接,也就是藉由連接器結合元件與支撐件62及/或支撐件26與承載座5,而將透明基板2固設於承載座5上。由於承載座5與支撐件62係可彎折,因此增加了在應用時的靈活性,同時因可使用複數個發光元件,故亦可透過不同光色之發光元件組合,使照明裝置11具有色彩變化性以滿足不同需求。Please refer to FIG. 21 and FIG. 22 . FIG. 21 and FIG. 22 are schematic diagrams showing the transparent substrate 2 of a preferred embodiment of the present invention being adhered to the carrier 5 having the support member 62 . The illuminating device 11 of the present embodiment is mainly composed of the same embodiment as the previous embodiment, wherein the carrier 5 is formed of an aluminum plate or a metal substrate such as a bendable composite aluminum-containing material, copper wire or wire. The surface or side of the carrier 5 has at least one support member 62, and the support member 62 is a mechanism separate or integrated with the carrier 5. Pieces. A light-emitting component is coupled to the support member 62 by means of bonding, that is, the transparent substrate 2 is fixed to the carrier 5 by the component bonding layer 63, and is maintained on the surface of the portion of the carrier 5 having no support. The surface having a first angle θ1 and the portion of the carrier 5 having no support member 62 may also be provided with a light-emitting diode structure to enhance the illumination effect of the illumination device 11; in addition, the light-emitting element may also be inserted through a plug (not shown). The transparent substrate 2 is fixed to the carrier 5 by being connected to the support member 62, that is, by the connector coupling member and the support member 62 and/or the support member 26 and the carrier 5. Since the carrier 5 and the support member 62 are bendable, flexibility in application is increased, and since a plurality of light-emitting elements can be used, the illumination device 11 can be colored by combining light-emitting elements of different light colors. Variability to meet different needs.

請參考第23圖。第23圖繪示了本創作之另一較佳實施例之照明裝置的立體示意圖。如第23圖所示,本實施例之照明裝置包括至少一發光元件1及一承載座5,其中該承載座5包括至少一支撐件62以及至少一電路圖案P。發光元件1之主要組成如先前實施例所述,並以透明基板之一端與支撐件62相耦接,以避免或減少支撐件62對發光元件1出光的遮蔽效果。承載座5係複合式鋁質金屬基板、銅導線或電線構成,支撐件62係自承載座5之一部分加以切割彎折一角度(如上述第21圖與第22圖之第一夾角θ1)而成。電路圖案P係設置於承載座5上,並具有至少1組電性端點與一電源電性連接,且有一部分延伸至支撐件62與發光元件1電性連接,使該發光元件1可透過承載座5之電路圖案P與電源電性連接。另外承載座5可更包括至少一孔洞H或至少一缺口G,使固設件如螺絲、釘子或插銷等等可透過該孔洞H或缺口G將承載座5與其他組件依照明裝置應用情形作進一步構裝或安裝,同時孔洞H或缺口G亦增加承載座5之散熱面積,提昇照明裝置之散熱效果。Please refer to Figure 23. Figure 23 is a perspective view showing a lighting device of another preferred embodiment of the present invention. As shown in FIG. 23, the illumination device of the present embodiment includes at least one light-emitting element 1 and a carrier 5, wherein the carrier 5 includes at least one support member 62 and at least one circuit pattern P. The main component of the light-emitting element 1 is as described in the previous embodiment, and is coupled to the support member 62 at one end of the transparent substrate to avoid or reduce the shielding effect of the support member 62 on the light emitted from the light-emitting element 1. The carrier 5 is composed of a composite aluminum metal substrate, a copper wire or a wire, and the support member 62 is bent and bent at an angle from one portion of the carrier 5 (such as the first angle θ1 of the above 21 and 22). to make. The circuit pattern P is disposed on the carrier 5 and has at least one set of electrical terminals electrically connected to a power source, and a portion of the support member 62 is electrically connected to the light-emitting component 1 to make the light-emitting component 1 transparent. The circuit pattern P of the carrier 5 is electrically connected to the power source. In addition, the carrier 5 can further include at least one hole H or at least one notch G, such that a fixing member such as a screw, a nail or a pin can pass the hole H or the gap G to make the carrier 5 and other components according to the application situation of the device. Further assembly or installation, at the same time, the hole H or the gap G also increases the heat dissipation area of the carrier 5, thereby improving the heat dissipation effect of the lighting device.

請參考第24圖。第24圖繪示了本創作之另一較佳實施例之照明裝置之裝置基座322的立體示意圖。如第24圖所示,本實施例之裝置基座 322包括一承載座5以及至少一支撐件62,與第11圖之實施例相較,本實施例之支撐件62更包括至少一條狀部342與一缺口330,其中電極30、32係分別設置於缺口330的兩側,條狀部342至少構成該缺口330的一邊牆。一發光元件係對應該缺口330與該支撐件62耦接,且該發光元件的連接導線係與電極30、32電性連接,使該發光元件可透過支撐件62及承載座上的電路圖案與一電源電性耦接而被驅動。其中缺口330尺寸需不小於發光元件之一主要出光面,使發光元件面對支撐件62方向的出光不會被支撐件62遮蔽。支撐件62與承載座5之間的連接處可為一可活動設計,以使支撐件62與承載座5之間夾角可視需要進行調整。Please refer to Figure 24. Figure 24 is a perspective view of the device base 322 of the illumination device of another preferred embodiment of the present invention. As shown in Fig. 24, the device base of this embodiment The 322 includes a carrier 5 and at least one support member 62. Compared with the embodiment of FIG. 11, the support member 62 of the embodiment further includes at least one strip portion 342 and a notch 330, wherein the electrodes 30 and 32 are respectively disposed. On both sides of the notch 330, the strip portion 342 constitutes at least one side wall of the notch 330. A light-emitting element is coupled to the support member 62 corresponding to the notch 330, and the connecting wire of the light-emitting element is electrically connected to the electrodes 30 and 32, so that the light-emitting element can pass through the support member 62 and the circuit pattern on the carrier. A power source is electrically coupled to be driven. The size of the notch 330 needs to be not less than one of the main light-emitting surfaces of the light-emitting element, so that the light emitted from the light-emitting element in the direction of the support member 62 is not blocked by the support member 62. The joint between the support member 62 and the carrier 5 can be a movable design so that the angle between the support member 62 and the carrier 5 can be adjusted as needed.

請參考第24圖至第25圖。第25圖繪示了本創作之另一較佳實施例之照明裝置302的立體示意圖。與第24圖之實施例相較,第25圖所示之照明裝置302更包括至少一有複數個缺口330的支撐件62,其中該複數個缺口330係分別設置於支撐件62的對應兩邊,使條狀部342至少同時構成該複數個缺口330的一邊牆。複數個發光元件310係與該複數個缺口330對應設置,且各發光元件310之電路圖案或連接電極(圖未示)係分別與電極30以及電極32對應設置並電性連結。本實施例之照明裝置302更進一步可包括複數個支撐件62,各設置有發光元件310之支撐件62與承載座5之間夾角可視需要各自進行調整,換句話說,至少部分之支撐件62與承載座5之間的夾角可彼此相異以達到所需之發光效果,但並不以此為限。另外亦可在相同或不同支撐件62上設置不同發光波長範圍之發光元件310組合,使照明裝置302之色彩效果更豐富。Please refer to Figures 24 to 25. Figure 25 is a perspective view of a lighting device 302 of another preferred embodiment of the present invention. The illumination device 302 shown in FIG. 25 further includes at least one support member 62 having a plurality of notches 330, wherein the plurality of notches 330 are respectively disposed on corresponding sides of the support member 62. The strip portion 342 is configured to at least simultaneously form a side wall of the plurality of notches 330. A plurality of light-emitting elements 310 are disposed corresponding to the plurality of notches 330, and a circuit pattern or a connection electrode (not shown) of each of the light-emitting elements 310 is electrically connected to the electrodes 30 and 32, respectively. The illumination device 302 of the present embodiment may further include a plurality of support members 62, and the angle between the support member 62 and the carrier 5 each provided with the light-emitting elements 310 may be adjusted separately, in other words, at least a portion of the support members 62. The angles with the carrier 5 can be different from each other to achieve the desired luminous effect, but are not limited thereto. In addition, a combination of the light-emitting elements 310 of different illumination wavelength ranges may be disposed on the same or different support members 62 to make the color effect of the illumination device 302 more abundant.

為了提高亮度與改善發光效果,本創作之另一實施例的照明裝置係將複數個透明基板2所形成的發光元件同時佈置於諸如前述實施例之承載座或其他承載機構之上,此時係可採對稱或非對稱排列的形式做佈置,較佳 的對稱佈置方式也就是將多個透明基板2所形成的發光元件以點對稱或線對稱的形式設置於承載機構60之上。請參考第26圖至第29圖,各實施例之照明裝置11係在各種不同形狀的承載機構60上設置複數個發光元件,並且以點對稱或線對稱的形式讓整體照明裝置11的出光能夠均勻(發光二極體結構省略示意),此些照明裝置11的出光效果還可藉由改變上述之第一夾角的大小而再做進一步的調整與改善。如第26圖所示,發光元件之間係以點對稱方式夾90度角,此時從照明裝置11四面的任一面往照明裝置11看均正對至少二個發光元件;第27圖所示之照明裝置11的發光元件之間夾角係小於90度;第29圖所示之照明裝置11的發光元件之間夾角係大於90度。另一實施例則以非對稱佈置方式將多個發光元件至少部分集中或分散設置,以達成照明裝置11於不同應用時的光形需要(圖未示)。In order to improve the brightness and improve the illuminating effect, the illuminating device of another embodiment of the present invention simultaneously arranges the illuminating elements formed by the plurality of transparent substrates 2 on a carrier or other supporting mechanism such as the foregoing embodiment. It can be arranged in a symmetrical or asymmetric arrangement, preferably The symmetrical arrangement means that the light-emitting elements formed by the plurality of transparent substrates 2 are arranged on the support mechanism 60 in a point symmetrical or line symmetrical manner. Referring to FIGS. 26 to 29, the illumination device 11 of each embodiment is provided with a plurality of light-emitting elements on various different shapes of the load-bearing mechanism 60, and the light of the entire illumination device 11 can be made in a point-symmetric or line-symmetric manner. Evenly (the light-emitting diode structure is omitted), the light-emitting effect of the illumination device 11 can be further adjusted and improved by changing the size of the first angle described above. As shown in Fig. 26, the light-emitting elements are angularly symmetrically placed at a 90-degree angle. At this time, at least two light-emitting elements are aligned with each other from the four sides of the illumination device 11 toward the illumination device 11; The angle between the light-emitting elements of the illumination device 11 is less than 90 degrees; the angle between the light-emitting elements of the illumination device 11 shown in Fig. 29 is greater than 90 degrees. In another embodiment, the plurality of light-emitting elements are at least partially concentrated or dispersed in an asymmetric arrangement to achieve the light shape requirements of the illumination device 11 for different applications (not shown).

請參考第30圖。第30圖繪示了本創作之另一較佳實施例之照明裝置301的剖面示意圖。如第15圖所示,照明裝置301包括發光元件310以及一支撐件321。支撐件321包括一缺口330,且發光元件310係與缺口330對應設置。其中,本實施例之支撐件321之下部亦可當作插腳或彎折成表面焊接所需接墊,用以固設或/及電性連結於其他所需之元件例如承載座。由於發光元件310之一出光面係設置於缺口330內,故不論支撐件321是否為透光材料,照明裝置301皆可保有六面發光的發光效果。Please refer to Figure 30. Figure 30 is a cross-sectional view showing a lighting device 301 of another preferred embodiment of the present invention. As shown in FIG. 15, the illumination device 301 includes a light-emitting element 310 and a support member 321 . The support member 321 includes a notch 330, and the light-emitting element 310 is disposed corresponding to the notch 330. The lower portion of the support member 321 of the embodiment can also be used as a pin or bent into a pad for surface soldering for fixing or/and electrically connecting to other required components such as a carrier. Since one of the light-emitting elements 310 is disposed in the notch 330, the illumination device 301 can maintain the illumination effect of the six-sided illumination regardless of whether the support member 321 is a light-transmitting material.

請參考第31圖與第32圖,第31圖與第32圖繪示了本創作之一較佳實施例之燈罩7之示意圖。該照明裝置包括一長管形之燈罩7、至少一發光元件1以及其承載機構60,其中發光元件1設置於承載機構60上並至少一部分位於長管形之燈罩7所形成之空間內。如第32圖所示,當更多發光元件1設置於燈罩7之內時,此些發光元件1的第一主表面21A之間是以不互相平行的方式做排列。另外,發光元件1至少部分置於燈罩7所形成之空 間內,且不緊貼燈罩7的內壁,較佳的實施例為發光元件1與燈罩7之間有一大於500微米(μm)的距離D;但亦可設計以灌膠方式形成燈罩7,並使該燈罩7至少部分包覆並直接接觸於該發光元件1。Please refer to FIG. 31 and FIG. 32. FIG. 31 and FIG. 32 are schematic diagrams showing a lampshade 7 of a preferred embodiment of the present invention. The illuminating device comprises a long tubular lampshade 7, at least one illuminating element 1 and a carrying mechanism 60 thereof, wherein the illuminating element 1 is disposed on the carrying mechanism 60 and at least partially located in the space formed by the long tubular lampshade 7. As shown in Fig. 32, when more of the light-emitting elements 1 are disposed within the globe 7, the first major surfaces 21A of the light-emitting elements 1 are arranged in a manner that is not parallel to each other. In addition, the light-emitting element 1 is at least partially placed in the space formed by the lamp cover 7. The inner wall of the lamp cover 7 is not in close contact with the inner wall of the lamp cover 7. The preferred embodiment has a distance D between the light-emitting element 1 and the lamp cover 7 of more than 500 micrometers (μm); however, it is also possible to form the lampshade 7 by means of potting. The lampshade 7 is at least partially covered and directly in contact with the light-emitting element 1.

請參考第33圖,本創作之又一較佳實施例之照明裝置303包含至少一發光元件1、一承載座5以及至少一支撐件62。發光元件1係設置於支撐件62上且支撐件62係耦接於承載座5。相較於第21圖之實施例,本實施例之支撐件62為傾斜設置,因此至少支撐件62的一部分可更靠近承載座5之一中心軸D1。更具體地說,本實施例的照明裝置303包含兩支撐件62以及分別設置於兩支撐件62上的發光元件1。兩支撐件62係與承載座5連接以使熱傳導效果更佳。支撐件62係相對於承載座5之中心軸D1向內傾斜,且如圖中所示,發光元件1與承載座5之間係形成有一第一夾角θ1(即支撐件62與承載座5間之夾角)。第一夾角θ1之角度可在45度至75度之間,因此照明裝置303之尺寸可相較第21圖之實施例來得更為縮小,且可提升該照明裝置303在靠近該中心軸D1位置之亮度。Referring to FIG. 33, a lighting device 303 according to another preferred embodiment of the present invention includes at least one light emitting element 1, a carrier 5, and at least one support member 62. The light-emitting element 1 is disposed on the support member 62 and the support member 62 is coupled to the carrier 5. Compared to the embodiment of Fig. 21, the support member 62 of the present embodiment is disposed obliquely, so that at least a portion of the support member 62 can be closer to a central axis D1 of the carrier 5. More specifically, the illumination device 303 of the present embodiment includes two support members 62 and light-emitting elements 1 respectively disposed on the two support members 62. The two support members 62 are coupled to the carrier 5 for better heat transfer. The support member 62 is inclined inwardly with respect to the central axis D1 of the carrier 5, and as shown in the drawing, a first angle θ1 is formed between the light-emitting element 1 and the carrier 5 (ie, between the support member 62 and the carrier 5). The angle). The angle of the first angle θ1 may be between 45 degrees and 75 degrees, so that the size of the illumination device 303 can be further reduced compared to the embodiment of FIG. 21, and the position of the illumination device 303 near the central axis D1 can be improved. Brightness.

請參考第34圖至第37圖,相較於上述實施例,第34圖至第37圖之照明裝置304/305/306/307具有更多變化性與應用,其中照明裝置304/305/306/307可為水晶燈。如第34圖所示,照明裝置304包含至少一發光元件1、一承載座5以及至少一支撐件62。支撐件62更包含一第一連接部621與一第二連接部623。第二連接部623之一端設置於承載座5,另一端連接於第一連接部621之一端。發光元件1設置於第一連接部621相對應於第二連接部623之另一端。第一連接部621可進一步地相對於第二連接部623轉動。更具體地說,本實施例中的第一連接部621相對承載座5之中心軸D1向內或向外傾斜,而在第一連接部621與第二連接部623之間形成有一第二夾角θ2,第二夾角θ2之角度可在135度至175度之間,藉此在接近中心軸 D1位置之亮度可進一步提高或降低,端視實際應用而定。第二連接部623係垂直於承載座5,但不限於此。於本創作其他實施例中,第二連接部623與承載座5之間可形成有一第三夾角θ3,且第三夾角θ3之角度可在45度至85度之間。此外,第二連接部623亦可進一步地相對承載座5轉動。於本實施例中,照明裝置304在接近承載座5之中心軸D1位置之亮度相較於第21圖之實施例更高,且尺寸更小。Please refer to Figures 34 to 37. Compared with the above embodiment, the illumination device 304/305/306/307 of Figures 34 to 37 has more variability and application, wherein the illumination device 304/305/306 /307 can be a crystal lamp. As shown in FIG. 34, the illumination device 304 includes at least one light-emitting element 1, a carrier 5, and at least one support member 62. The support member 62 further includes a first connecting portion 621 and a second connecting portion 623. One end of the second connecting portion 623 is disposed on the carrier 5 and the other end is connected to one end of the first connecting portion 621. The light emitting element 1 is disposed at the other end of the first connecting portion 621 corresponding to the second connecting portion 623. The first connecting portion 621 is further rotatable relative to the second connecting portion 623. More specifically, the first connecting portion 621 in the embodiment is inclined inward or outward with respect to the central axis D1 of the carrier 5, and a second angle is formed between the first connecting portion 621 and the second connecting portion 623. Θ2, the angle of the second angle θ2 may be between 135 degrees and 175 degrees, thereby being close to the central axis The brightness of the D1 position can be further increased or decreased depending on the actual application. The second connecting portion 623 is perpendicular to the carrier 5, but is not limited thereto. In other embodiments of the present invention, a third angle θ3 may be formed between the second connecting portion 623 and the carrier 5, and the angle of the third angle θ3 may be between 45 degrees and 85 degrees. In addition, the second connecting portion 623 can further rotate relative to the carrier 5. In the present embodiment, the brightness of the illumination device 304 at a position close to the central axis D1 of the carrier 5 is higher than that of the embodiment of Fig. 21, and the size is smaller.

請參考第35圖,相較於第34圖之實施例,本實施例之照明裝置305包含至少一支撐件62,支撐件62包含一第一連接部621與一第二連接部623,其中一發光元件1係設置於第一連接部621之一端且該端還連接於第二連接部623之一端。第二連接部623之另一端係耦接於一承載座5。第一連接部621未與第二連接部623連接之一端係相對於承載座5的一中心軸D1向內或向外傾斜,且第一連接部621與該第二連接部623之間形成有一第二夾角θ2。第二夾角θ2之角度可在5度至45度之間,以提高在接近中心軸D1位置之亮度。照明裝置305之其他元件可與照明裝置304相同,於此不再贅述。Referring to FIG. 35, the illumination device 305 of the present embodiment includes at least one support member 62. The support member 62 includes a first connecting portion 621 and a second connecting portion 623, one of which is different from the embodiment of FIG. The light emitting element 1 is disposed at one end of the first connecting portion 621 and the end is also connected to one end of the second connecting portion 623. The other end of the second connecting portion 623 is coupled to a carrier 5 . One end of the first connecting portion 621 not connected to the second connecting portion 623 is inclined inward or outward with respect to a central axis D1 of the carrier 5 , and a first connecting portion 621 and the second connecting portion 623 are formed between the first connecting portion 621 and the second connecting portion 623 . The second angle θ2. The angle of the second included angle θ2 may be between 5 degrees and 45 degrees to increase the brightness at a position close to the central axis D1. Other components of the illumination device 305 may be the same as the illumination device 304 and will not be described herein.

另外,請參考第36圖,本實施例之照明裝置306包含一支撐件62,支撐件62可彎曲以形成一弧形結構。弧形支撐件62之半徑在10mm至200mm之間,且該弧形結構之圓心位置可為接近(如圖37所示)或遠離(如圖36所示)該承載座5之中心軸D1。請參考第37圖,本實施例之照明裝置307包含一支撐件62,支撐件62進一步為一拋物線形結構。兩發光元件1係設置於此支撐件62之相對兩側。本創作可不限於此,支撐件62也可進一步為一橢圓形結構。In addition, referring to Fig. 36, the illumination device 306 of the present embodiment includes a support member 62 that can be bent to form an arcuate structure. The radius of the arcuate support member 62 is between 10 mm and 200 mm, and the center position of the arcuate structure can be close (as shown in FIG. 37) or away from (as shown in FIG. 36) the central axis D1 of the carrier 5. Referring to Figure 37, the illumination device 307 of the present embodiment includes a support member 62. The support member 62 is further a parabolic structure. The two light-emitting elements 1 are disposed on opposite sides of the support member 62. The present invention is not limited thereto, and the support member 62 may further be an elliptical structure.

1‧‧‧發光元件1‧‧‧Lighting elements

303‧‧‧照明裝置303‧‧‧Lighting device

5‧‧‧承載座5‧‧‧ bearing seat

62‧‧‧支撐件62‧‧‧Support

D1‧‧‧中心軸D1‧‧‧ central axis

θ1‧‧‧第一夾角Θ1‧‧‧ first angle

Claims (9)

一種照明裝置,其包含:至少一發光元件,其包含:一透明基板,具有一承載面與一第二主表面,該承載面與該第二主表面彼此相對設置;以及複數個發光二極體結構,設置於該承載面上,並與未設置該複數個發光二極體結構之部分該承載面形成可發光之一第一主表面,其中該複數個發光二極體結構中的至少一發光二極體結構發出的光線穿過該透明基板並由該第二主表面出光;一承載座;以及至少一支撐件,耦接於該承載座;其中該發光元件設置於該支撐件上,且該支撐件之至少一局部相對該承載座之一中心軸向內或向外傾斜。A lighting device comprising: at least one light emitting element, comprising: a transparent substrate having a bearing surface and a second main surface, the bearing surface and the second main surface being disposed opposite to each other; and a plurality of light emitting diodes a first surface of the plurality of light emitting diode structures Light emitted from the diode structure passes through the transparent substrate and is emitted by the second main surface; a carrier; and at least one support member coupled to the carrier; wherein the light emitting element is disposed on the support member, and At least a portion of the support member is inclined inwardly or outwardly relative to a central axis of the carrier. 如請求項1所述之照明裝置,其中該發光元件與該承載座之間形成有一第一夾角,且該第一夾角之角度在45度至75度之間。The lighting device of claim 1, wherein a first angle is formed between the light-emitting element and the carrier, and the angle of the first angle is between 45 degrees and 75 degrees. 如請求項1或2所述之照明裝置,其中該支撐件包含一第一連接部與一第二連接部,該第二連接部設置於該承載座,其中該第一連接部連接於該第二連接部,並與該第二連接部之間形成有一第二夾角。The illuminating device of claim 1 or 2, wherein the support member comprises a first connecting portion and a second connecting portion, wherein the second connecting portion is disposed on the carrying base, wherein the first connecting portion is connected to the first connecting portion a second connecting portion and a second angle formed between the connecting portion and the second connecting portion. 如請求項3所述之照明裝置,其中該第一連接部相對於該承載座之該中心軸向外延伸,且該第二夾角之角度在135度至175度之間。The lighting device of claim 3, wherein the first connecting portion extends axially outward relative to the center of the carrier, and the angle of the second angle is between 135 degrees and 175 degrees. 如請求項3所述之照明裝置,其中該第一連接部相對於該承載座之該中心軸向內延伸,且該第二夾角之角度在5度至45度之間。The lighting device of claim 3, wherein the first connecting portion extends axially with respect to the center of the carrier, and the angle of the second angle is between 5 degrees and 45 degrees. 如請求項3所述之照明裝置,其中該第二連接部與該承載座之間形成有一第三夾角,且該第三夾角之角度在45度至85度之間。The illuminating device of claim 3, wherein a third angle is formed between the second connecting portion and the carrier, and the angle of the third angle is between 45 degrees and 85 degrees. 如請求項1或2所述之照明裝置,其中該支撐件為一弧形結構。The lighting device of claim 1 or 2, wherein the support member has an arcuate structure. 如請求項7所述之照明裝置,其中該弧形結構之弧半徑在10mm至200mm之間,該弧形結構之圓心位置為接近或遠離該承載座之該中心軸。The illuminating device of claim 7, wherein the arc of the arc has a radius of between 10 mm and 200 mm, and the center of the arc is located close to or away from the central axis of the carrier. 如請求項1或2所述之照明裝置,其中該支撐件為一拋物線形結構或一橢圓形結構。The lighting device of claim 1 or 2, wherein the support member is a parabolic structure or an elliptical structure.
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CN204459854U (en) 2015-07-08
TW201537742A (en) 2015-10-01

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