TWM466295U - Heat dissipation module - Google Patents

Description

Thermal module

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module applied to an electronic device.

Generally, electronic components such as a central processing unit (CPU) or a graphics processing unit (GPU) in an electronic device generate heat during operation, and the operating temperature of the electronic component directly determines the service life and stability of the electronic device. In order to keep the operating temperature of the electronic components within a reasonable range, a heat dissipating device must be added to the electronic components that generate heat to promote heat exchange between the electronic components and the external environment, thereby achieving heat dissipation of the electronic components and making the electrons The device can operate normally.

At present, a heat dissipating device mounted on an electronic component is usually attached to an electronic component with a heat sink having heat radiating fins, and a fan is mounted on the heat radiating fin to electrically connect the electronic component by heat conduction and forced convection. The generated heat is directed to the outside environment. However, in general, the heat sink on the market is a heat dissipating fin having a sheet-like structure arranged in parallel on a heat conducting block, the thickness of which is thin, the heat transfer efficiency is low, and the spacing between the fins is limited by the processing die. Reduced, so in a limited space, high-density fins cannot be configured. Since the main heat dissipation area of the heat dissipation fin can only be provided by the two sides of the sheet structure, the air flow driven by the fan cannot effectively contact the surface of the heat dissipation fin, and is blocked by the heat conduction block and hits the heat conduction block. Further, turbulence is formed in the air flow passage between the heat dissipation fins, so that the heat dissipation performance of the heat dissipation device is affected, and the heat dissipation effect of the electronic component cannot be effectively provided.

In view of the above problems, the present invention provides a heat dissipation module, which solves the problem that the conventional heat dissipation fins have a thin thickness and low heat transfer efficiency, and the spacing between the heat dissipation fins is limited by the processing mold and cannot be reduced, and when the fan airflow The surface of the heat dissipating fin cannot be effectively contacted, and is blocked by the heat conducting block to impinge on the heat conducting block, thereby forming a problem of turbulence in the air flow passage between the heat radiating fins.

The present invention provides a heat dissipation module including a first heat sink, a second heat sink, a plurality of heat pipes, and a fan. The first heat sink includes a plurality of heat dissipating fins and a plurality of clips, and each of the heat dissipating fins and the clips are arranged in a staggered manner and are combined with each other. The second heat sink includes two fin sets, respectively disposed on the first heat sink, and a gap is maintained between the two fin sets, and the gap corresponds to the plurality of clips; the plurality of heat pipes are combined with the first A heat sink is opposite to the other side of the second heat sink, and the two ends of the heat pipe are respectively connected to the two fin sets, and the fan is installed on the top surface of the second heat sink, and corresponds to the gap for auxiliary heat dissipation.

The effect of the novel is that the heat dissipation module not only uses the cross-shaped fins to cross each other, but also is staggered, and at the same time, the structural features of the triangular clips are combined to increase the heat dissipation area, and the fan airflow can be smoothly and quickly exported. Improve the overall heat exchange rate of the heat dissipation module. At the same time, a good heat dissipation path can be formed by the arrangement relationship between the two heat sinks and the heat pipe, which also helps to further improve the operating efficiency of the heat dissipation module to achieve good heat dissipation efficiency and heat dissipation efficiency.

The features, implementations, and effects of the present invention are described in detail below with reference to the drawings.

100‧‧‧ Thermal Module

110‧‧‧First radiator

111‧‧‧Heat fins

112‧‧‧ Clips

1121‧‧‧ Guide surface

113‧‧‧ card slot

120‧‧‧second radiator

121‧‧‧Fin set

1211‧‧‧Main fins

1212‧‧‧Sub fins

122‧‧‧ gap

130‧‧‧heat pipe

131‧‧‧ first end

132‧‧‧ second end

133‧‧‧ middle section

140‧‧‧fan

150‧‧‧Locker

FIG. 1 is an exploded perspective view of the heat dissipation module of the first embodiment of the present invention.

Fig. 2 is a perspective assembled view of the heat dissipation module of the first embodiment of the present invention.

Figure 3 is a plan side view of the heat dissipation module of the first embodiment of the present invention.

4 is a schematic view showing the combination of the first heat sink of the heat dissipation module of the first embodiment of the present invention.

FIG. 5A is a schematic diagram showing the combination of the two fin sets of the heat dissipation module of the first embodiment of the present invention.

FIG. 5B is a partial enlarged view of the fin set of the heat dissipation module of the first embodiment of the present invention.

Figure 6 is a plan side view of the heat dissipation module of the second embodiment of the present invention.

Please refer to the exploded view and the perspective combination diagram of the heat dissipation module of the first embodiment of the present invention shown in FIGS. 1 to 3 . The heat dissipation module 100 of the embodiment is configured to be coupled to a heat source to derive thermal energy of the heat source, wherein the heat source may be a central processing unit (CPU) or a graphic processing unit (GPU). An electronic component that generates a lot of heat when it is in operation. The heat dissipation module 100 includes a first heat sink 110, a second heat sink 120, a plurality of heat pipes 130, and a fan 140. The first heat sink 110 and the second heat sink 120 may be made of copper, aluminum or other materials. A good metal, which is advantageous for forming by extrusion or casting.

The first heat sink 110 of the embodiment includes a plurality of heat dissipating fins 111 and a plurality of clips 112, and each of the heat dissipating fins 111 and the clips 112 are staggered and integrated with each other, and the bonding manner thereof may be The second heat sink 120 includes two fin sets 121 respectively disposed on the first heat sink 110, and a gap 122 is maintained between the two fin sets 121, and the gap 122 is exactly corresponding. The plurality of heat pipes 130 are coupled to the other side of the first heat sink 110 opposite to the second heat sink 120, and the two ends of the heat pipe 130 are respectively connected to the two fin sets 121, and the fan 140 is installed. The top surface of the second heat sink 120 corresponds to the gap 122 for auxiliary heat dissipation. Wherein, the above fan 140 form may be but is not limited to Axial fan.

Please refer to the combined schematic diagram of the first heat sink of the heat dissipation module of the first embodiment of the present invention shown in FIG. 4 . The detailed structure of the heat dissipation module 100 is further described. The positions of the clips 112 of the first heat sink 110 are located at the center of each of the heat dissipation fins 111, and the thickness of each clip 112 is greater than the thickness of each heat dissipation fin 111. And the length of each of the heat dissipation fins 111 is greater than the length of each of the clips 112. Each of the clips 112 has two guiding surfaces 1121, which are respectively inclined from a side adjacent to the heat pipe 130 toward the second heat sink 120, so that the shape of the clip 112 can be, but not limited to, a trapezoid or The heat dissipation path formed by the triangles and the two guiding surfaces 1121 can guide the airflow generated by the fan 140 to the outside of the heat dissipation module 100, so that the airflow can smoothly and quickly flow. In addition, after the plurality of clips 112 and the plurality of heat dissipating fins 111 are coupled to each other, a card slot 113 is formed at the bottom thereof, and the shape of the card slot 113 is matched with the shape of the heat pipe 130 for being combined with the heat pipe 130.

Please refer to the combined schematic diagram and partial enlarged view of the two fin sets of the heat dissipation module of the first embodiment of the present invention shown in FIGS. 5A and 5B. Further, the second fins 121 of the second heat sink 120 of the present embodiment each include a plurality of main fins 1211, and each of the main fins 1211 is provided with a plurality of sub fins 1212 spaced apart from each other. The fins 1211 and the respective sub fins 1212 are perpendicular to each other, and the thickness of the main fins 1211 is greater than the thickness of the sub fins 1212, and each of the sub fins 1212 is outward toward the adjacent two side main fins 1211. The extensions are such that the respective sub-fins 1212 and the respective main fins 1211 cross each other and are staggered, and the shape of the main fins 1212 is roughly cross-shaped, so that the entire fin group 121 forms a small air flow passage. Therefore, the total area of the second heat sink 120 in contact with the surrounding air can be greatly increased by the above fin structure, a good heat dissipation effect can be achieved, and a plurality of small-sized air flow channels can be utilized to jointly improve the heat exchange rate.

In the embodiment, the three heat pipes 130 are exemplified, but not limited thereto. And the plurality of heat pipes 130 respectively have opposite numbers The shape of the heat pipe 130 of one end 131 and the second end 132 and the intermediate section 133 may be, but not limited to, a cylindrical shape of a two-end bending form. The intermediate portion 133 of the heat pipe 130 is connected between the first end 131 and the second end 132, and the heat pipe 130 is embedded in the card slot 113 with the intermediate portion 133 and is coplanar with the bottom surface of the first heat sink 110. Then, the first end 131 is connected in series with each of the main fins 1211 of one of the fin sets 121, and the second end 132 is connected in the opposite direction to each of the main fins 1211 of the other fin set 121, and The fin sets 121 are respectively suspended above the first heat sink 110 while the position of the gap 122 corresponds to the position of the clip 112, and the fan 140 is mounted on the top surface of the second heat sink 120 and corresponds to the gap. 122.

It should be noted that when the fan 140 generates an air flow toward the second heat sink 120, part of the airflow is directly blown to the clip 112 position of the first heat sink 110 by the gap 122 between the two fin sets 121. The two guiding surfaces 1121 on the clip 112 guide the airflow to quickly dissipate the heat source along the heat dissipation path to form a smooth heat dissipation channel, and the other part of the airflow first passes through the plurality of fin groups 121 on the left and right sides. After the small-sized airflow passages, they flow into the heat dissipation fins 111 of the first heat sink 110, and then dissipate heat along the heat dissipation path.

In addition, the heat dissipation module 100 of the present embodiment further includes a plurality of fasteners 150, and a plurality of openings are formed at positions where the respective heat dissipation fins 111 and the respective clips 112 overlap each other. The fastener 150 can be, but is not limited to, a rivet or a bolt having a stud and a nut. In the present embodiment, three bolts are exemplified, but not limited thereto. Wherein, one end of the stud penetrates the plurality of heat dissipation fins 111 and the plurality of clips 112 along the opening to be connected to each other, and the other end of the stud abuts against the outermost clip 112, and then the nut Locking the bolt through one end of the plurality of heat dissipation fins 111 and the plurality of clips 112, and abutting the outermost clip 112 on the other side, the plurality of heat dissipation fins 111 and the plurality of clips 112 are clamped The system is fixed between the nut and the stud and is more closely combined to improve the heat conduction performance of the heat dissipation module 100.

The overall structure of the heat dissipation module 100 disclosed in the second embodiment of the present invention is similar to that of the heat dissipation module of the first embodiment described above. Therefore, the following content is only described in detail for the difference between the two.

Please refer to the plan side view of the heat dissipation module of the second embodiment of the present invention shown in FIG. The heat dissipation module 100 disclosed in the second embodiment of the present invention includes a first heat sink 110, a second heat sink 120, a heat pipe 130, and a fan 140. The difference between the two is that the heat pipe 130 and the lock 150 of the second embodiment are used in only one quantity, and each clip 112 of the first heat sink 110 has only one guiding surface 1121. Therefore, when the fan 140 When an air flow is generated toward the second heat sink 120, part of the air flow is directly blown to the position of the clip 112 of the first heat sink 110 by the gap 122 between the two fin sets 121, and the guiding surface on the clip 112 The 1121 directs the airflow along the heat path to quickly remove the heat source to create a smooth heat sink. Based on the above structure, the heat dissipation module 100 of the embodiment can also achieve the same heat dissipation effect as the heat dissipation module of the first embodiment.

According to the embodiment of the present invention, it can be clearly seen that the heat dissipation module of the present invention utilizes a structure in which the fins have a cross shape, and at the same time, the technical method of the heat dissipation path formed by the clips can solve the thin thickness of the conventional heat dissipation fins. The heat transfer efficiency is low, and the spacing between the heat dissipation fins is limited by the processing die and cannot be reduced, and when the fan airflow cannot effectively contact the surface of the heat dissipation fin, and is blocked by the heat conduction block and hits the heat conduction block, Further, problems such as turbulence are formed in the air flow passage between the heat radiating fins.

Therefore, compared with the prior art, the heat dissipation module of the present invention not only uses the cross-shaped fins to cross each other, but also is staggered, and at the same time, the structural features of the triangular clips are combined to increase the heat dissipation area and increase the airflow of the fan. Smooth and fast export, which improves the overall heat exchange rate of the thermal module. At the same time, a good heat dissipation path can be formed by the arrangement relationship between the two heat sinks and the heat pipe, which also helps to further improve the operating efficiency of the heat dissipation module to achieve good heat dissipation efficiency and heat dissipation efficiency.

Although the embodiments of the present invention are disclosed as described above, it is not intended to limit the present invention, and those skilled in the art can, without departing from the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of the patents may be changed, and the scope of patent protection of the present invention is subject to the scope of the patent application attached to the specification.

100‧‧‧ Thermal Module

110‧‧‧First radiator

111‧‧‧Heat fins

112‧‧‧ Clips

113‧‧‧ card slot

120‧‧‧second radiator

121‧‧‧Fin set

122‧‧‧ gap

130‧‧‧heat pipe

131‧‧‧ first end

132‧‧‧ second end

133‧‧‧ middle section

140‧‧‧fan

150‧‧‧Locker

Claims (10)

A heat dissipation module includes: a first heat sink, comprising a plurality of heat dissipation fins and a plurality of clips, wherein the heat dissipation fins are staggered with the clips; and a second heat sink comprising two fins The second fin set is disposed on the first heat sink, and a gap is maintained between the two fin sets, the gap corresponding to the clips, and the two fin sets each include a plurality of main fins And each of the main fins is spaced apart from the plurality of sub fins, the sub fins intersect with the main fins, and the auxiliary fins of the adjacent two main fins are staggered; at least one heat pipe The first heat sink is coupled to the other side of the second heat sink, and the two ends of the heat pipe are respectively connected to the main fins of the two fin sets; and a fan is disposed on the second heat sink. And on the gap. The heat dissipation module of claim 1, wherein each of the main fins has a thickness greater than a thickness of each of the sub fins. The heat dissipation module of claim 1, wherein each of the main fins and the sub fins are perpendicular to each other. The heat dissipation module of claim 1, wherein the first heat sink has at least one card slot, the heat pipe is embedded in the card slot, and one end of the heat pipe is connected in series to one of the fin sets. The other end of the heat pipe is connected in series in the opposite direction to the other of the fin sets. The heat dissipation module of claim 4, wherein the heat pipe has a first end and a second end and an intermediate portion, the intermediate portion being connected to the first Between one end and the second end, and embedded in the card slot, the first end and the second end are respectively connected to the two fin sets. The heat dissipation module of claim 5, wherein the intermediate section of the heat pipe is coplanar with the first heat sink. The heat dissipation module of claim 1, further comprising at least one locker, the fasteners are connected in series with the heat dissipation fins and the clips, and the heat dissipation fins are pressed against the clips. . The heat dissipation module of claim 1, wherein each of the clips has at least one guiding surface that is inclined from a side adjacent to the heat pipe toward the second heat sink, and corresponds to the gap. The heat dissipation module of claim 8, wherein each of the clips has a trapezoidal shape or a triangular shape. The heat dissipation module of claim 1, wherein each of the clips has a thickness greater than a thickness of each of the heat dissipation fins, and each of the heat dissipation fins has a length greater than a length of each of the clips.