M349179 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種導熱模組，尤指一種具有熱管及 銅導熱塊之導熱模組。 【先前技術】 由於熱官（heat pipe)具有高熱傳能力、高熱傳導率、 >重量輕、結構簡單及多用途等特性，並可傳遞大量之妖 量、不消耗電力及低價格等諸多優點，故在使用上，通常 係與-基座相整合而構成一導熱模組，並將該導熱模組廣 泛地應用於電子發熱元件之導熱上，藉由對電子發敎元件 進行熱量的快速導離，以有效的解決現階段之電子發熱元 件的熱聚集現象。 “如習知的導熱模組’供貼設於—發熱元件表面，該導 ’、、、杈組係由一基座以及„熱管所構成；該基座係由一銅材 而㈣管則穿設於該基座，該熱管具有—受熱段及 仗〜文熱段延伸出的一放熱段，該受熱段係穿設於該基座 2部’而該放熱段則穿出該基座的—側，並以該基座貼接 於所述發熱S件的表面，藉此，以進行導熱之作用。 然而，習知的導熱模組，在實際使用上仍存在有以下 、缺失’因該基座係由銅材所製，其重 =成本較高;此外，僅以該基座贴附所逑== ，’並無法完全有效導離所述發熱元件之熱能且埶阻較 鬲’故其導熱效果有限。 …早 M349179 有鑑於此，本創作人係為改善並解決上述之缺失，乃 特潛心研究並配合學理之運用，終於提出—種設計合理且 有效改善上述缺失之本創作。 【新型内容】 …^創作之—目’在於可提供—種導熱模組，其藉由敎 :、基座及銅導熱塊同時貼接所述發熱元件表面 = 提昇整體之導熱效能。 w 其藉由 以增加 本創作之另-目，在於可提供—種導熱模組 在基座上嵌入銅導熱塊並使銅導熱塊與熱管接觸 熱傳導面積，俾有效提昇整體之導熱逮率。 為二成上述之目的，本創作係提供—種導熱模組， 係由一基座、-銅導熱塊以及一熱管所構成；該基座之一 端面開設有-容置槽及在該容置槽—側邊開設一固定样. ,該銅導熱塊係嵌入至該固定槽而結合；該熱管具有一㈣ ==熱段成型有一平面，該受熱段係容設爽擎在； ^槽及_導熱塊之間，而該平面則與該基座之該端面 "士創作之又一目，在於可提供—種導熱模叙，其藉由 從熱官之受熱段所延伸出並形成於基座—側或同時於乂座 兩側的放熱段，俾增加熱管之導熱面積，進本： 之導熱效能。 +別β 本創作之再一目，在於可提供一種導熱模組，且藉由 基座係為-銘務型座體，其重量較輕，並有效節省整體製 M349179 作的成本。 【實施方式】 之觀點，但非 以下之實施例係進-步詳細說明本創作 以任何觀點限制本創作之範畛。 請參閲第一圖至第三圖 、一銅導熱塊20以及一 座]〇 由一基 ’本創作導熱模組1係 熱管30所構成。 該基座1〇具有一端面13以及相對於該端面13的另一端 面14，並在該端面！3上開設有—容置槽n及在該容置㈣ -側邊開設-固定槽12，該固定槽12可為—_尾槽，^亥 f 一端面14則可供貼接一散熱片3(如第四圖所示），所述 絲座10可為-紹擠型散熱座或由紹鎂合金材料所製成， 其重量較輕，且可有效節省整體製作的成本。 該銅導熱塊20係嵌入至該固定槽12而結合，該銅導執 塊20係由-底段21、連接該底段21的—中㈣以及連接該 ^段23的一頂段22所構成的一鳩尾座，該底段“係嵌入至 f基座10之該固定槽12内固定，而其頂段22則外露出該固 疋槽12，且該頂段22的寬度係大於該中段23的寬度，其 中，該銅導熱塊2〇之頂段22的寬度係大於該固定槽12寬 度，且該鋼導熱塊2〇之導熱係數係大於該基座之導熱係 數，而上述該基座1〇的比重則低於該銅導熱塊20的比重。 該熱管30具有一受熱段31及從該受熱段31延伸出的一 放熱段32，該受熱段31係容設夾掣在該容置槽^及該銅導 熱塊20之間，並在該受熱段31上成型有一平面3ιι ，因 M349179 此’該党熱段31的斷面係呈d字型者（如第三圖所示）， 且該平面311係與該基座10之該端面13齊平，而該放熱段 32則形成於該基座丨〇之一侧，所述該熱管3〇係可由銅材所 製成者’以具有較佳的導熱效率，而該受熱段31之該平面 311係可以鍛造或沖壓的加工方式而予以成型者。 組接本創作時，復參閱第一圖及第二圖，首先將該熱 •管30之受熱段31容設於該基座之容置槽〗！内後，再將該 籲銅導熱塊20嵌入至該基座1〇之該固定槽12内（其可以鉚接 之加工方式進行），以使該銅導熱塊2〇之頂段22抵壓並接 觸該熱管30之受熱段31而與其相緊固，以完成本創作之組 接工作。 使用本創作時，請參閱第四圖，首先可在該基座丨〇之 另一端面14貼設於前述該散熱片3後，再將該基座1〇之該 端面13貼設於一發熱元件2表面，即可將該發熱元件2所 產生之熱能，能有效經由該基座1〇、熱管3〇以及該銅導熱 塊20傳導至該散熱片3上，再以該散熱片3散除該發熱元 件2之熱能。 由於本創作係藉由在該基座1〇上嵌入該銅導熱塊並 使其與該熱管30接觸，以增加熱傳導面積，俾有效提昇整 體之導熱速率’此外，另藉由該基座1〇、熱管3〇以及該銅 導熱塊20同時貼接該發熱元件2表面，俾有效提昇整體之 導熱效能。 請參閱第五圖，係為本創作之另一實施例圖，本實施 例與前述實施例之差別在於該熱管3〇之該放熱段犯可連接 8 M349179 另一散熱片4，以快速有效地散除該發熱元件2所產生的 熱能，同樣具有前述實施例相同的效果。 练上所述’應用本創作可達成有效提昇整體之導熱速 率及導熱效能並有效節省製作的成本，以解決習知技術之 種種缺失’實已具備高度產業利用價值。 ， 【圖式簡單說明】 .第一圖為本創作之立體分解示意圖。 第二圖為本創作之立體組合示意圖。 第二圖為第二圖之3_3剖面的示意圖。 第四圖為本創作之使用狀態圖。 第五圖為本創作之另一實施例圖。 【主 1 . 10 . 要元件符號說明】 ....導熱模組 ....基座 11 . _ 容置槽 12 _ · ·. •固定槽 13 . 20 . • . . ·端面 • · . ·銅導熱塊 14··.· •另一端面 21 . 23 . 30 . .·..底段 • . ·.中段 • ·..熱管 22···· •頂段 31 . 32 . • · · ·受熱段 _ · · ·放熱段 311 · · ·. •平面 M349179 2.....發熱元件 3、4 · . ·散熱片M349179 VIII. New Description: [New Technology Field] This creation is about a heat conduction module, especially a heat conduction module with a heat pipe and a copper heat conduction block. [Prior Art] Because the heat pipe has high heat transfer capability, high thermal conductivity, > light weight, simple structure and versatility, it can transfer a large amount of demon, no power consumption and low price. Therefore, in use, it is usually integrated with the pedestal to form a heat conducting module, and the heat conducting module is widely applied to the heat conduction of the electronic heating element, and the heat is quickly guided by the electronic hairpin element. To effectively solve the thermal accumulation phenomenon of electronic heating elements at this stage. "The conventional heat conduction module" is attached to the surface of the heating element, and the group of ', ', and 杈 is composed of a base and a heat pipe; the base is made of a copper material and the (four) tube is worn. Provided on the base, the heat pipe has a heat release section extending from the heat receiving section and the 仗~wen heat section, the heat receiving section is disposed on the base portion 2 and the heat releasing section is passed through the base. The side is attached to the surface of the heat generating S member with the base, thereby performing heat conduction. However, the conventional heat conduction module still has the following defects in actual use. Because the base is made of copper, its weight = high cost; in addition, only the base is attached. = , 'The thermal energy of the heating element cannot be completely and effectively guided away and the resistance is relatively low, so its thermal conductivity is limited. ...早 M349179 In view of this, the creator has made great efforts to improve and solve the above-mentioned shortcomings, and has devoted himself to the use of academics, and finally proposed a design that is reasonable in design and effective in improving the above-mentioned defects. [New content] ...^Creation--the purpose is to provide a heat-conducting module which simultaneously attaches the surface of the heating element by means of 敎:, pedestal and copper heat-conducting block = improving the overall thermal conductivity. By adding another dimension of the creation, it is possible to provide a thermal conduction module in which a copper thermal conductive block is embedded on the pedestal and the copper thermal conduction block is in contact with the heat pipe to heat the conductive area, thereby effectively improving the overall heat conduction rate. For the purpose of the above-mentioned purposes, the present invention provides a heat-conducting module which is composed of a base, a copper heat-conducting block and a heat pipe; one end of the base is provided with a receiving groove and is accommodated therein. The groove-side is provided with a fixed sample. The copper heat-conducting block is embedded in the fixing groove and combined; the heat pipe has a (four) == hot section formed with a plane, the heated section is provided with a cool engine; Another aspect of the creation of the heat-conducting block between the heat-conducting block and the end face of the pedestal is that a heat-conducting model can be provided which is extended from the heat-receiving section of the heat official and formed on the base - Side or at the same time on the heat release section on both sides of the stern, 俾 increase the heat transfer area of the heat pipe, into the heat conduction performance. + 别β Another creation of this creation is that a heat-conducting module can be provided, and the base is a type of body, which is light in weight and saves the cost of the overall M349179. [Embodiment] The present invention is not limited by the following examples, and the present invention is intended to limit the scope of the present invention in any way. Referring to the first to third figures, a copper heat conducting block 20 and a housing 〇 are constructed by a base heat pipe module 1 heat pipe 30. The base 1 has an end face 13 and the other end face 14 with respect to the end face 13, and is at the end face! 3 is provided with a receiving groove n and a fixing groove 12 at the side of the receiving (four)-side, the fixing groove 12 can be a tail groove, and an end surface 14 can be attached to a heat sink 3 (As shown in the fourth figure), the wire base 10 can be a squeezing type heat sink or made of a magnesium alloy material, which is light in weight and can effectively save the overall manufacturing cost. The copper heat conducting block 20 is embedded and coupled to the fixing slot 12, and the copper guiding block 20 is composed of a bottom section 21, a middle (four) connecting the bottom section 21, and a top section 22 connecting the section 23. a tailstock seat, the bottom section is "fixed into the fixing groove 12 of the f base 10, and the top section 22 exposes the fixing groove 12, and the width of the top section 22 is larger than the middle section 23 The width of the top portion 22 of the copper heat conducting block 2 is greater than the width of the fixing groove 12, and the thermal conductivity of the steel heat conducting block 2 is greater than the thermal conductivity of the base, and the base 1 is The specific gravity of the crucible is lower than the specific gravity of the copper thermal block 20. The heat pipe 30 has a heat receiving portion 31 and a heat releasing portion 32 extending from the heat receiving portion 31, and the heat receiving portion 31 is configured to receive the clip in the receiving groove. And the copper heat conducting block 20, and a flat surface 3 ιιι is formed on the heated section 31, because the section of the party hot section 31 of the M349179 is d-shaped (as shown in the third figure), and The flat surface 311 is flush with the end surface 13 of the base 10, and the heat releasing portion 32 is formed on one side of the base, and the heat pipe 3 is The copper material is made to have a better heat conduction efficiency, and the plane 311 of the heat receiving section 31 can be formed by a forging or stamping process. When the composition is created, refer to the first figure and the first In the second embodiment, after the heat receiving portion 31 of the heat pipe 30 is received in the receiving groove of the base, the copper heat conducting block 20 is embedded in the fixing groove 12 of the base 1 (It can be carried out by riveting) so that the top section 22 of the copper heat-conducting block 2 is pressed against and contacted with the heated section 31 of the heat pipe 30 to complete the assembly work of the present creation. When creating, please refer to the fourth figure. First, after the other end surface 14 of the base is attached to the heat sink 3, the end surface 13 of the base 1 is attached to a heat generating component 2. The heat generated by the heating element 2 can be efficiently conducted to the heat sink 3 via the susceptor 1 , the heat pipe 3 〇 and the copper heat conducting block 20 , and the heat is dissipated by the heat sink 3 . Thermal energy of component 2. Since the present invention is embedded in the susceptor 1 并 and the copper thermal conductive block The heat pipe 30 is in contact with each other to increase the heat conduction area, and the heat conduction rate of the whole is effectively increased. In addition, the surface of the heat generating component 2 is simultaneously attached by the base 1 , the heat pipe 3 , and the copper heat conducting block 20 . The heat conduction performance of the whole. Please refer to the fifth figure, which is another embodiment of the present invention. The difference between this embodiment and the foregoing embodiment is that the heat dissipation section of the heat pipe 3 can be connected to 8 M349179 and the other heat sink 4 In order to quickly and effectively dissipate the heat energy generated by the heat generating component 2, the same effect as the foregoing embodiment is achieved. The application of the present invention can achieve an effective improvement of the overall heat conduction rate and thermal conductivity and effectively save the manufacturing cost. In order to solve the various shortcomings of the prior art, it has a high degree of industrial utilization. [Simplified description of the diagram] The first diagram is a three-dimensional exploded view of the creation. The second picture is a three-dimensional combination diagram of the creation. The second figure is a schematic view of the 3_3 section of the second figure. The fourth picture is the usage state diagram of the creation. The fifth figure is a diagram of another embodiment of the creation. [Main 1.10. Description of component symbols] .... Thermal module.... pedestal 11. _ accommodating groove 12 _ · ·. • fixing groove 13 . 20 . • . . . · Copper heat-conducting block 14···· • The other end face 21 . 23 . 30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . · Heated section _ · · · Heat release section 311 · · ·. • Plane M349179 2... Heating element 3, 4 · . · Heat sink