M339197 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱單元，特別是關於一種具高導熱效能的導熱板 之應用。 【先前技術】 近年來隨著資訊、通信及光電產業的快速發展，電子產品逐漸走 •向高階化及㈣化，在高速度、高頻率及小型化之需求下，電子元件 春的發熱密度越來越高，因此散熱效率已經成為決定電子產品穩定性的 重要因素；由於熱導管或導熱X具有高效率的熱傳導特性，已是電子 產品中廣泛應用的導熱元件之—。熱導管或導刻主要藉由在其内壁 、凡、口有毛、、讀之m的真空銅該細，咖管内之工作流體在蒸發 端吸收熱源(如CUP等）而氣化，受熱端之蒸氣在冷凝端經散熱(例如以 散熱鰭片及風鱗）後凝結成液體而受毛細層之毛細力作用迴流到蒸 發端，構成一密閉循環。 月多閱第1圖所示’係為習知技術散熱模組之立體組合圖，由圖 中可清楚看出該散熱模組丨係由一散熱鰭片組u、一導熱管所構 =亥政熱鰭片1W設有至少—孔洞112，該散熱韓片組U底部係 …有-基座ill可與發熱源13接觸；所述導熱管 :隐η之孔_並結合於該基座ηι上;當熱源丨心 接觸後將熱源ls傳導至導熱管u，該導 源至散觸版11上’-^絲效果。 熱 然而抑知的散熱模組1，係*贱將料管12與散熱鰭片組 M339197 11組合後，再將導熱管12與基座111進行結合，方可令該基座m 直接與發熱源13進行接觸，並將熱源帶引至導熱管12上，而將熱源 帶往遠端進行散熱者。因此習知的導熱管12係無法直接與發熱源接 觸’在熱軸傳遞上必爵透絲座，目此造成導熱管必須依賴基座 ，而與基座結合，但二者之間彼此結合時，雖為緊密貼合或塗布抖熱 霄’但仍有間隙產生之現象’❿造成熱阻現象之發生，致使熱傳導效 率大為下降。M339197 VIII. New Description: [New Technology Field] This paper is about a heat dissipating unit, especially for the application of a heat conducting plate with high thermal conductivity. [Prior Art] In recent years, with the rapid development of the information, communication and optoelectronic industries, electronic products have gradually moved toward higher levels and (four). Under the demand of high speed, high frequency and miniaturization, the heat density of electronic components in spring is increasing. The higher the efficiency, the heat dissipation efficiency has become an important factor in determining the stability of electronic products; because of the high heat transfer characteristics of heat pipes or heat conduction X, it has become a widely used heat conduction element in electronic products. The heat pipe or the guide is mainly vaporized by the vacuum copper on the inner wall, the mouth, the hair, and the m, and the working fluid in the coffee tube is vaporized by absorbing the heat source (such as CUP, etc.) at the evaporation end, and the heated end is heated. The vapor is condensed into a liquid at the condensation end by heat dissipation (for example, by fins and wind scales) and is returned to the evaporation end by the capillary force of the capillary layer to form a closed cycle. Read more in the first section of the month as a three-dimensional combination diagram of the conventional technology cooling module. It can be clearly seen from the figure that the heat dissipation module is composed of a heat dissipation fin group u and a heat pipe. The heat fin 1W is provided with at least a hole 112, and the bottom of the heat sink Korean group U has a base ill which can be in contact with the heat source 13; the heat pipe: a hole _ and is coupled to the base ηι When the heat source is in contact with the core, the heat source ls is conducted to the heat pipe u, and the source is applied to the '-^ wire effect on the dislocation plate 11. The heat-dissipating heat-dissipating module 1 is combined with the heat-dissipating fin group M339197 11 and then combined with the heat-radiating tube 12 and the base 111 to directly connect the base m to the heat source. 13 is contacted, and the heat source is led to the heat pipe 12, and the heat source is taken to the far end for heat dissipation. Therefore, the conventional heat pipe 12 cannot directly contact the heat source. In the hot shaft transmission, the wire must be passed through the wire. Therefore, the heat pipe must depend on the base and be combined with the base, but when the two are combined with each other. Although it is closely attached or coated with heat enthalpy, but there is still a phenomenon of gaps, which causes thermal resistance, resulting in a significant decrease in heat transfer efficiency.
而另一種習知散熱模組係以導熱板做為散熱之用，該導敎板大都 應用於筆記型電腦或空間較小的需要散熱的裝置内，由於導熱板其結 ^係:兩金屬片相疊組而成，且其内可設有流道及或毛細結構，用以 供内設之工作流體在蒸發端吸收熱源(如cup等）而氣化，受敎端之玄 =在冷凝散熱⑷如以散熱鰭片及風鱗)後凝結成液㈣受杨 層之毛細力_迴朗蒸發端，但受限導熱片其結構雜肥 制’使其蒸發端至冷凝端的路徑過短，造成散熱效率過低。义 故以上習知技術中係有下列之缺點： - 1. 導熱管錄雜此結合易有空_產生熱阻現象 2·體積過大過度佔用使用空間。 3· 散熱效能差。 6 M339197 【新型内容】 爰此為解决上述習知技術之缺點，本創作之主要目的，係提供 -種可直接與發_觸並料缝，且藉由其本體向外延伸之支 部，將熱源傳遞至遠端進行散熱之散熱單元。 本創作之次要目的’係提供—種可節省賴之散熱單元； 本創作之另—次要目的’錢供-觀構鮮且節韻本之散熱 單元； 為達上狀目的’本卿贿供—紐解元，該散熱單元係為 一具導熱之板體，該板體定餘—平面，被料成為接觸部，該接觸 部係可直接賴發飾接觸以傳導熱源，於接觸部至少—側向外延伸 ^一體細之支部’可藉由接觸部與發熱源直接接觸後所傳導之敎 源，透過該延伸的支部將熱源傳導至遠端而達到散熱之效果。 故本創作具備下列之優點： 1. 板體可齡接觸部直接與發熱源接觸，直接傳導熱源至向外 的支部以將》傳至遠端，而具有絕佳的散熱效果。 2. 因與發熱源直接接觸故無熱阻現象產生之情事。 3·結構簡單可節省空間。 4·無複雜機構，故可節省工時及成本 【實施方式】 為達成上述目的及功效， 就本創作較佳實施例詳加說 本創作所_之技術手段及構造，兹_ 明其特徵與魏如下，俾利完全了解。 7 M339197 請參閱第2、3圖所示，係為本創作較佳實施例之立體分解與組合 圖，由圖中可清楚看出，本創作之散熱單元可係為一具導熱之板體2， 該板體2又有工作流體及毛細結構（此結構組成與習知的導熱管或 導熱板或均溫板結構相同，在此則不在重贅），該板體2定義出有— 平面，該平面可被設為直接與發熱源3接觸之接觸部2卜並且於接觸 部21至少一端向外延伸有一體成型之支部&，藉由該接觸部可直 接與發熱源3涵，並且透過鋪部21將脑j[接料至板體2本體 φ後再傳遞至向外延伸之支部22，以將熱源傳導至遠端達到散熱之效 果；故藉由本創作之設計接觸部21及延伸支部22的設計，可改善習 知散熱模組需透過基座再傳遞熱源至導熱管所產生之熱阻問題。 請參閱第4、5圖所示，係為本創作之另一較佳實施例之立體分解 與組合圖，由圖中可清楚看出，本創作可在支部22上穿設有散熱鱗片 4，令支部22可透過散熱鰭片4更快速的將熱能散溢至外界者。 請參閱第6圖所示，係為本創作之另一較佳實施例之立體組合 ⑩圖，由圖中可清楚看出，係於該支部22所設置之散熱縛片4上再增設 • 一具散熱效果之風扇5，藉由板體2之接觸部21與發熱源3接觸時， 熱源由接觸部21直接傳導至板體2之支部22，透過支部22再傳導至 散熱鰭片4後，藉由一具散熱效果之風扇5對該散熱鰭片4強制進行 散熱，可達到更佳之散熱效果。 需陳明者，以上所述僅為本案之較佳實施例，並非用以限制本創 作，若依本創作之構想所作之改變，在不脫離本創作精神範圍内，例 如：對於構形或佈置型態加以變換，對於各種變化，修飾與應用，所 8 M339197 產生等效侧，均應包含於核之權娜_，合予陳明。 综上職，摘叙散鮮元雜科，為骑料雜功效及 的，故本創作誠為-實用性優異之創作 妻依法提出申請，盼_日賜准本宰，利之申請要件 倘甚叫茶雜ρ确作人之辛苦創作 * ，揭料有任何，請不絲秘示 實感德便。 酉己口 【圖式簡單說明】 第1圖所示係為習知技術散熱模組之立體組合圖。 第2圖所不係為本創作較佳實施例之立體分解圖。 第3圖所示係為本創作較佳實施例之立體組合圖。 =4圖所讀為本卿另—較佳實麵之立體分解圖。 #圖所不係為本創作另一較佳實施例之立體組合圖。 圖所不係為本創作另一較佳實施例之立體組合圖。 【主要元件符號說明】 散熱模組1 散熱鰭片組11 基座111 孔洞112 導熱管12 M339197 β發熱源13 板體2 接觸部21 支部22 發熱源3 '散熱鰭片4 具散熱效果之風扇5Another conventional heat-dissipating module uses a heat-conducting plate for heat dissipation. The guide plate is mostly used in a notebook computer or a device that requires less heat in a space, because the heat-conducting plate is connected: two metal pieces It is formed by stacking, and can be provided with a flow channel and a capillary structure for the internal working fluid to be vaporized by absorbing heat source (such as cup) at the evaporation end, and the heat is absorbed by the enthalpy. (4) If the heat sink fins and wind scales are condensed into liquid (4) The capillary force of the Yang layer is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The heat dissipation efficiency is too low. The above-mentioned conventional technologies have the following disadvantages: - 1. The heat transfer tube is recorded and the combination is easy to be empty. _ The thermal resistance phenomenon occurs. 2. The volume is too large and the occupied space is excessively occupied. 3. The heat dissipation performance is poor. 6 M339197 [New content] In order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a heat source that can be directly connected to the hair splicing joint and extended by the body. A heat sink that is delivered to the remote end for heat dissipation. The secondary purpose of this creation is to provide a kind of cooling unit that can save the cost; the other secondary purpose of this creation is 'money supply--viewing the heat-dissipating unit of the rhyme and the rhyme; The heat-dissipating unit is a heat-conducting plate body, and the plate body is made to be a flat surface, and is made into a contact portion, and the contact portion can directly contact the hair accessories to conduct the heat source, and the contact portion is at least at the contact portion. - the side outwardly extending ^ integral thin portion ' can be transmitted by the contact portion directly in contact with the heat source, and the heat source is transmitted to the distal end through the extended branch to achieve the heat dissipation effect. Therefore, the creation has the following advantages: 1. The ageable contact portion of the plate directly contacts the heat source, and directly transmits the heat source to the outward branch to transmit the "to the far end", and has an excellent heat dissipation effect. 2. There is no thermal resistance due to direct contact with the heat source. 3. Simple structure saves space. 4. No complicated mechanism, so it can save man-hours and cost. [Embodiment] In order to achieve the above objectives and effects, the technical means and structure of the present invention are described in detail in the preferred embodiment of the present invention. Wei is as follows, and Philip fully understands. 7 M339197 Please refer to Figures 2 and 3 for the three-dimensional decomposition and combination of the preferred embodiment of the present invention. It can be clearly seen from the figure that the heat dissipation unit of the present invention can be a heat-conducting plate 2 The plate body 2 has a working fluid and a capillary structure (this structure is the same as the conventional heat pipe or the heat conducting plate or the temperature equalizing plate structure, and is not heavy), and the plate body 2 defines a plane. The plane may be disposed as a contact portion 2 directly contacting the heat source 3 and extending outwardly from at least one end of the contact portion 21 with an integrally formed branch portion, which is directly permeable to the heat source 3 and transmitted through the contact portion The paving portion 21 passes the brain j [to the body 2 of the plate body 2 and then transfers it to the outwardly extending branch portion 22 to conduct the heat source to the distal end to achieve the effect of dissipating heat; therefore, the contact portion 21 and the extended branch portion are designed by the present invention. The design of 22 can improve the thermal resistance of the conventional heat dissipation module through the base and then transfer the heat source to the heat pipe. Please refer to FIG. 4 and FIG. 5 , which are perspective exploded and combined views of another preferred embodiment of the present invention. As can be clearly seen from the figure, the heat sinking scale 4 can be disposed on the branch portion 22 . The branch portion 22 allows the heat sink fins 4 to more quickly dissipate heat energy to the outside world. Please refer to FIG. 6 , which is a three-dimensional combination 10 of another preferred embodiment of the present invention. It can be clearly seen from the figure that it is further added to the heat dissipation tab 4 disposed on the branch portion 22 . When the contact portion 21 of the plate body 2 is in contact with the heat source 3, the heat source is directly transmitted from the contact portion 21 to the branch portion 22 of the plate body 2, and then transmitted through the branch portion 22 to the heat dissipation fins 4, The heat dissipation fins 4 are forced to dissipate heat by the heat dissipation fan 5 to achieve better heat dissipation. It should be noted that the above is only the preferred embodiment of the present case and is not intended to limit the creation. If the changes made in accordance with the concept of the creation are within the scope of the spirit of the creation, for example, for the configuration or arrangement The type is transformed. For various changes, modifications and applications, the equivalent side of 8 M339197 should be included in the nuclear power _, and combined with Chen Ming. In the above-mentioned post, I picked up the fresh-spotted hybrids, which are suitable for riding materials. Therefore, this creative creation----------------------------------------------------------------------------------------------------- Tea miscellaneous ρ is indeed the hard work of people*, there are any uncoverings, please don’t show the real feelings.酉己口 [Simple description of the diagram] Figure 1 shows a three-dimensional combination of the conventional technology cooling module. Figure 2 is not a perspective exploded view of the preferred embodiment of the present invention. Figure 3 is a perspective view of a preferred embodiment of the present invention. The figure in Fig. 4 reads the stereoscopic exploded view of the other good-looking real face. The figure is not a three-dimensional combination diagram of another preferred embodiment of the present invention. The drawings are not intended to be a three-dimensional combination of another preferred embodiment of the present invention. [Main component symbol description] Thermal module 1 Heat sink fin group 11 Base 111 Hole 112 Heat pipe 12 M339197 β Heat source 13 Plate body 2 Contact portion 21 Branch 22 Heat source 3 'Cool fins 4 Fan with heat dissipation effect 5