M330571 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種燈源模組〇amp m〇dule)，且特 別疋有關於-種發光二極體燈源模組。 - 【先前技術】 a隨著半導體科技的進步，現今的發光二極體已可以發 , 出呵冗度的光線，加上發光二極體還具有省電、體積小、 • 低電壓驅動以及不含汞等優點，因此發光二極體已廣泛地 應用在照明方面的領域，例如車燈、路燈以及檯燈等。 然而’目前的發光二極體在發出高亮度的光線的時 候’同時也會產生大量的熱能。倘若這些熱能堆積在發光 —極體内’則發光二極體的溫度上升而導致過熱。一般而 吕’如果發光二極體的溫度超過12〇°c，則會造成發光二 極體不可恢復的損壞。因此，現今的發光二極體照明燈具 都會加裝散熱鳍片（heat sink)以降低發光二極體的溫度。 圖1是習知發光二極體照明燈具的剖面示意圖。請參 閱圖1，發光二極體照明燈具1〇〇包括多個發光二極體 110、一電路板120、一散熱鳍片130以及一燈罩140。這 些發光二極體110與散熱鳍片13〇分別組裝於電路板120 ’ 的相對二表面上，而這些發光二極體110、電路板120以 ， 及散熱鳍片130皆固設於燈罩140内。 這些發光二極體110在發光時所產生的熱能會傳遞至 政熱韓片130。之後’利用熱對流（thermal convection) 的方式，散熱鳍片130得以將熱能排出至外界環境中。 4 M330571 然而，燈罩140内的空氣，其流動性很差，所以燈罩 140内的空氣會具有絕熱性（adiabaticity )。也就是說，燈 罩140内的空氣具有保溫的效果。位於燈罩14〇内的這些 發光二極體110以及散熱鳍片13〇會因為受到空氣的絕熱 性之影響而造成散熱鰭片130來不及將熱能及時排出，以 致於發光^一極體110發生過熱的情形。這種過熱的情形會 縮短發光二極體110的壽命，嚴重的話甚至造成發光二極 體110永久性的損壞。 【新型内容】 本創作是提供一種發光二極體燈源模組，以避免發光 二極體過熱。 本創作提出一種發光二極體燈源模組，包括一光機 (light engine)以及一燈罩。光機包括至少一發光二極體 與一電路板，其中發光二極體組裝於電路板上。光機固設 於丈且罩内’且光機熱耗接（thermally couple to)至燈罩。 在本創作之一實施例中，上述之燈罩的材質為金屬或 陶瓷。 在本創作之一實施例中，上述之發光二極體燈源模組 更包括一散熱鳍片，其中散熱鳍片配置於燈罩的外表面 上，且散熱鳍片熱輕接至燈罩。 在本創作之一實施例中，上述之發光二極體燈源模組 更包括一端子座，其中端子座配置於燈罩的外表面上。 在本創作之一實施例中，上述之發光二極體燈源模組 5 其中電源供應裝置固設於燈罩的 f勹括一帝之一實施例中，上述之發光二極體燈源模組 〇在太供應裝置，其中電源供應裝置固設於燈罩内。 费勹括一吟為之、Γ實施例中，上述之發光二極體燈源模組 匕卢士1、、、材料’其中散熱材料配置於光機與燈罩之間。 7作之—實施例中，上述之散減料包括散熱膏 grease)、散熱膠或散熱墊（thermal pad)。 f本，之一實施例中，上述之燈罩包括一燈罩殼體 /木。光機配置於燈罩殼體内，且電路板熱麵接至 。框架包括―固定條與—連接固定條之環形框 -’而燈罩殼體配置於固定條與環形框體之間。M330571 VIII. New description: [New technical field] This creation is about a kind of light source module 〇amp m〇dule), and especially about a kind of light-emitting diode light source module. - [Prior Art] a With the advancement of semiconductor technology, today's light-emitting diodes have been able to emit light, and the light-emitting diodes have power saving, small size, low voltage drive and no With the advantages of mercury, light-emitting diodes have been widely used in lighting fields such as lamps, street lamps and table lamps. However, the current light-emitting diodes also generate a large amount of heat energy when emitting high-intensity light. If these thermal energy accumulates in the illuminating body, the temperature of the illuminating diode rises and causes overheating. Generally, if the temperature of the light-emitting diode exceeds 12 °C, it will cause irreparable damage to the light-emitting diode. Therefore, today's LED lighting fixtures are equipped with heat sinks to reduce the temperature of the LEDs. 1 is a schematic cross-sectional view of a conventional light-emitting diode lighting fixture. Referring to FIG. 1, the LED lighting fixture 1 includes a plurality of LEDs 110, a circuit board 120, a heat sink fin 130, and a lamp cover 140. The light-emitting diodes 110 and the heat-dissipating fins 13 are respectively assembled on the opposite surfaces of the circuit board 120 ′, and the light-emitting diodes 110 , the circuit board 120 , and the heat-dissipating fins 130 are all fixed in the lamp cover 140 . . The heat energy generated by these light-emitting diodes 110 upon light emission is transmitted to the political hot film 130. Then, by means of thermal convection, the heat dissipation fins 130 discharge heat energy into the external environment. 4 M330571 However, the air in the lampshade 140 is poor in fluidity, so the air in the lampshade 140 will be adiabatic. That is to say, the air in the lamp cover 140 has a heat insulating effect. The light-emitting diodes 110 and the heat-dissipating fins 13 located in the lamp housing 14 are caused by the heat insulation of the air, so that the heat-dissipating fins 130 are not able to discharge the heat energy in time, so that the light-emitting body 110 is overheated. situation. This overheating situation shortens the life of the light-emitting diode 110 and, in severe cases, causes permanent damage to the light-emitting diode 110. [New content] This creation is to provide a light-emitting diode light source module to avoid overheating of the light-emitting diode. The present invention proposes a light emitting diode light source module comprising a light engine and a light cover. The optical machine includes at least one light emitting diode and a circuit board, wherein the light emitting diode is assembled on the circuit board. The light machine is fixed in the cover and the light machine is thermally coupled to the lamp cover. In an embodiment of the present invention, the lamp cover is made of metal or ceramic. In one embodiment of the present invention, the light emitting diode lamp source module further includes a heat dissipating fin, wherein the heat dissipating fin is disposed on the outer surface of the lamp cover, and the heat dissipating fin is thermally connected to the lamp cover. In an embodiment of the present invention, the LED light source module further includes a terminal block, wherein the terminal block is disposed on an outer surface of the lamp cover. In an embodiment of the present invention, the above-mentioned light-emitting diode lamp source module 5 is configured to be fixed in the lampshade, and the above-mentioned light-emitting diode lamp source module The power supply device is fixed in the lamp cover. In the embodiment, the above-mentioned light-emitting diode lamp source module 匕Lu Shi 1, material 'where the heat-dissipating material is disposed between the light machine and the lamp cover. In the embodiment, the above-mentioned material is a thermal grease or a thermal pad. In one embodiment, the lamp cover comprises a lamp housing/wood. The optical machine is disposed in the lamp housing, and the thermal surface of the circuit board is connected. The frame includes a "fixing strip and a ring frame -" to which the fixing strip is attached - and the lamp housing is disposed between the fixing strip and the annular frame.
M330571 更包括一電源供應裝置 外表面上。 在本創作之一實施例中，上述之端子座配置於固定條 上。 在本創作的發光二極體燈源模組中，由於光機熱耦接 至^罩因此燈罩可作為光機的散熱裝置。如此，光機的 發光二極體所產生的熱能會傳遞至燈罩。由於燈罩外的空 氣具有很好的流動性，因此藉由燈罩與燈罩外的空氣之間 的熱對流’燈罩能有效地將熱能排出，以避免熱能堆積在 光機中。如此，這些發光二極體的溫度得以受到控制，同 時避免發光二極體發生過熱的情形。 為讓本創作之上述和其他目的、特徵和優點能更明顯 易丨董’下文特舉一些實施例’並配合所附圖式’作詳細說 明如下。 6 M330571 【實施方式】 圖2A是本創作一實施例之發光二極體燈源模組的立 體示意圖。請參閱圖2A，本實施例的發光二極體燈源模組 200可應用於照明方面的用途，即發光二極體燈源模組2〇〇 可作為車燈、棱燈、女裝於天花板上的炭燈或其他照明燈 具。圖2A所不的發光二極體燈源模組200之型熊為天花 板上的崁燈，但是圖2A只是舉例說明，在此強調，並非 限制發光二極體燈源模組200的用途。 圖2B是圖2A中沿線I-Ι的剖面示意圖。請參閱圖 與圖2B，發光二極體燈源模組200包括一光機21〇以及一 燈罩220，其中燈罩220的材質可以是金屬或其他具有良 好散熱能力的非金屬材料’例如多孔陶甍或其他陶竟材 料。光機210固設於燈罩220内，且光機210熱輕接至燈 罩220，其中光機210可以是以鎖固、卡合或其他機械= 式固設於燈罩220内。 圖2C是圖2B中區域R的放大示意圖。請參閱圖 與圖2C，光機210包括多個發光二極體212 (圖2B與圖 2C繪示為三個）以及一電路板214，其中這些發光二 212組裝於電路板214上，並電性連接電路板214，而各個 發光二極體212具有一個或多個晶片（未緣示）。在本實 施例中，電路板214可以與燈罩220熱性接觸（therm^ contact)，以致於光機210得以熱耦接至燈罩220。 必須事先說明的是，在其他未緣示的實施例中，光機 210可以只包括一個發光二極體212。因此，圖2A與圖2b 7 M330571 所示的發光二極體212之數量只是用來舉例說明，並非限 定本創作。 在本實施例中，發光二極體燈源模組200更可包括一 散熱材料230 (如圖2C所示），而散熱材料230配置於光 機210與燈罩220之間，其中散熱材料230可以是散熱膏、 散熱膠或散熱墊。電路板214可藉由散熱材料230間接與 燈罩220熱性接觸。也就是說，光機21〇可以透過散熱材 料230以熱耦接至燈罩220。 當然，電路板214可以不經由散熱材料230而直接熱 耦接至燈罩220。也就是說，散熱材料230並非為本實施 例之發光二極體燈源模組200的必要構件，因此圖2B所 示的散熱材料230僅為舉例說明，並非限定本創作。 由於光機210熱搞接至燈罩220，因此燈罩220可以 幫助這些發光二極體212所產生的熱能適時地排出，以避 免這些發光二極體212因溫度過高而發生過熱的情形。如 此，燈罩220可以作為發光二極體燈源模組2〇()的散熱裝 置。 在本實施例中，發光二極體燈源模組2〇〇更可包括一 散熱鰭片240，其中散熱鳍片240配置於燈罩220的外表 面上，且散熱鳍片240熱耦接至燈罩220。舉例而言，散 熱鰭片240可以直接貼附在燈罩22〇的外表面上，或是散 熱鳍片240與燈罩220為一體成型。如此，這些發光二極 體212所產生的熱能不僅會傳遞至燈罩22〇，同時也會傳 遞至散熱鳍片240。藉由燈罩220與散熱鳍片24〇,這些發 8 M330571 光一極體212所產生的熱能可大量排出。如此，這些發光 二極體212的溫度能更有效地受到控制，以防止發光二極 體212發生過熱的情形。 圖2D是圖2A中的發光二極體燈源模組的分解示意 圖。請參閱圖2A與圖2D，在本實施例中，燈罩220還可 . 以包括一燈罩殼體222以及一框架224，其中框架224包 •, 括一固定條224a與一環形框體224b，而燈罩殼體222配 ^ 置於固定條224a與環形框體224b之間。光機210固設於 燈罩殼體222内，且電路板214熱耦接至燈罩殼體222。 發光一極體燈源模組200更可包括一電源供應裝置 250’其固設於燈罩220的外表面上，並電性連接光機21〇。 =源供應裝置250具有將交流電轉換成直流電以及調變電 壓的功能，且電源供應裝置250可供給光機210穩定的電 壓與電流。 在本實施例中，電源供應裝置250可以固設於燈罩殼 體222的外表面上，或是固設於框架224的固定條22知 • 上（如圖2A與圖2D所示）。然而，在其他未繪示的實施 . 例中，電源供應裝置250可以固設於燈罩220内。因此， 圖2A與圖2D中的電源供應裝置25〇之位置只是用來舉例 ，· 說明，並非限定本創作。 ， 另外，發光二極體燈源模組200更可包括一端子座 260其配置於燈罩220的外表面上，例如端子座26〇可配 置於k罩设體222的外表面上或是框架224上。端子座26〇 八有夕個螭子262，且端子座260的内部包括多條連接電 9The M330571 also includes a power supply unit on the outer surface. In an embodiment of the present invention, the terminal block is disposed on the fixing strip. In the light-emitting diode lamp source module of the present invention, since the light machine is thermally coupled to the cover, the lamp cover can be used as a heat sink for the light machine. In this way, the thermal energy generated by the light-emitting diode of the optical machine is transmitted to the lampshade. Since the air outside the lampshade has good fluidity, the heat can be efficiently discharged by the heat convection between the lampshade and the air outside the lampshade to prevent heat from accumulating in the machine. Thus, the temperature of these light-emitting diodes can be controlled while avoiding overheating of the light-emitting diodes. The above and other objects, features and advantages of the present invention will become more apparent from the following description. 6 M330571 [Embodiment] FIG. 2A is a schematic perspective view of a light-emitting diode lamp source module according to an embodiment of the present invention. Referring to FIG. 2A , the LED module 200 of the present embodiment can be applied to lighting applications, that is, the LED module 2 can be used as a lamp, a rib lamp, or a woman in a ceiling. Charcoal lamps or other lighting fixtures. The bear of the light-emitting diode lamp source module 200 shown in Fig. 2A is a xenon lamp on the ceiling board, but Fig. 2A is only an example, and it is emphasized that the use of the light-emitting diode lamp source module 200 is not limited. Figure 2B is a schematic cross-sectional view taken along line I-Ι of Figure 2A. Referring to FIG. 2B, the LED module 200 includes a light unit 21A and a lamp cover 220. The material of the lamp cover 220 can be metal or other non-metallic materials with good heat dissipation capability, such as porous ceramics. Or other ceramic materials. The optical device 210 is fixed in the lamp cover 220, and the optical device 210 is thermally connected to the lamp cover 220. The optical device 210 can be fixed in the lamp cover 220 by locking, snapping or other mechanical means. 2C is an enlarged schematic view of a region R in FIG. 2B. Referring to FIG. 2C, the optical device 210 includes a plurality of LEDs 212 (three are illustrated in FIGS. 2B and 2C) and a circuit board 214. The LEDs 212 are assembled on the circuit board 214 and electrically Each of the light emitting diodes 212 has one or more wafers (not shown). In the present embodiment, the circuit board 214 can be in thermal contact with the lamp housing 220 such that the optical machine 210 is thermally coupled to the lamp housing 220. It must be noted in advance that in other embodiments not shown, the optical machine 210 may include only one light emitting diode 212. Therefore, the number of light-emitting diodes 212 shown in Fig. 2A and Fig. 2b 7 M330571 is for illustrative purposes only and is not intended to limit the creation. In this embodiment, the light emitting diode module 200 can further include a heat dissipating material 230 (as shown in FIG. 2C ), and the heat dissipating material 230 is disposed between the optical device 210 and the lamp cover 220 , wherein the heat dissipating material 230 can be It is a thermal grease, a thermal grease or a cooling pad. The circuit board 214 can be in thermal contact with the lamp housing 220 indirectly by the heat dissipating material 230. That is, the optical unit 21 can be thermally coupled to the globe 220 through the heat dissipating material 230. Of course, the circuit board 214 can be directly thermally coupled to the globe 220 without the heat sink material 230. That is to say, the heat dissipating material 230 is not an essential component of the light emitting diode lamp source module 200 of the present embodiment. Therefore, the heat dissipating material 230 shown in FIG. 2B is merely illustrative and not limiting. Since the optical device 210 is thermally connected to the lamp cover 220, the lamp cover 220 can help the heat generated by the light-emitting diodes 212 to be discharged in a timely manner to avoid overheating of the light-emitting diodes 212 due to excessive temperature. Thus, the lamp cover 220 can function as a heat sink for the light emitting diode source module 2(). In this embodiment, the LED module 2 can further include a heat sink fin 240, wherein the heat sink fin 240 is disposed on the outer surface of the lamp cover 220, and the heat sink fin 240 is thermally coupled to the lamp cover. 220. For example, the heat sink fins 240 may be directly attached to the outer surface of the lamp cover 22, or the heat radiating fins 240 may be integrally formed with the lamp cover 220. Thus, the thermal energy generated by the light-emitting diodes 212 is transmitted not only to the globe 22 but also to the heat sink fins 240. By the lamp cover 220 and the heat dissipation fins 24, the heat energy generated by the light-emitting diodes 212 can be discharged in a large amount. Thus, the temperature of these light-emitting diodes 212 can be more effectively controlled to prevent overheating of the light-emitting diode 212. 2D is an exploded schematic view of the light emitting diode lamp source module of FIG. 2A. Referring to FIG. 2A and FIG. 2D, in the embodiment, the lamp cover 220 can also include a lamp housing 222 and a frame 224, wherein the frame 224 includes a fixing strip 224a and an annular frame 224b. The lamp housing 222 is disposed between the fixing strip 224a and the annular frame 224b. The optical machine 210 is fixed in the lamp housing 222, and the circuit board 214 is thermally coupled to the lamp housing 222. The light source module 200 further includes a power supply device 250' fixed to the outer surface of the lamp cover 220 and electrically connected to the optical unit 21〇. The source supply device 250 has a function of converting alternating current into direct current and a modulated voltage, and the power supply device 250 can supply the stabilized voltage and current of the optical device 210. In this embodiment, the power supply device 250 may be fixed to the outer surface of the lamp housing 222 or fixed to the fixing strip 22 of the frame 224 (as shown in FIGS. 2A and 2D). However, in other embodiments not shown, the power supply device 250 may be fixed in the lamp cover 220. Therefore, the positions of the power supply device 25A in FIGS. 2A and 2D are for illustrative purposes only, and are not intended to limit the creation. In addition, the LED module 200 can further include a terminal block 260 disposed on the outer surface of the lamp cover 220. For example, the terminal block 26 can be disposed on the outer surface of the cover body 222 or the frame 224. on. The terminal block 26〇 has a scorpion 262, and the interior of the terminal block 260 includes a plurality of connected wires.
M330571 源供應裝置250與光機210的配線（未繪示）。這些配線 連制這些端子262，而使用者可以將外部電源^如市 電’連接到這些端子262。如此，這些發光二極體2 以獲得電能而發光。 值得一提的是，在其他未繪示的實施例中，發光二極 體燈源模組200可以不包括電源供應裝置25〇，而端子座 260的接點262可以直接電性連接外部的電源供應器。如 此，光機210的發光二極體212亦可以獲得電能而發光。M330571 sources the wiring of the device 250 and the optical device 210 (not shown). These wirings connect these terminals 262, and the user can connect an external power source such as a commercial power supply to these terminals 262. Thus, these light-emitting diodes 2 obtain electric energy to emit light. It should be noted that, in other embodiments not shown, the LED light source module 200 may not include the power supply device 25, and the contact 262 of the terminal block 260 may be directly electrically connected to the external power supply. Supply. Thus, the light-emitting diode 212 of the optomechanical device 210 can also obtain electrical energy to emit light.
此外，本實施例的燈罩220可以設計成多種不^的造 型與結構，而燈罩220可以是由多個獨立構件所構成。當 然，燈罩220亦可以是一個獨立構件，例如燈罩僅包 括燈罩殼體222,而未包括框架224。因此，圖2A至圖2D 所示的燈罩殼體222與框架224僅是舉例說明，在此強調 並非限定本創作。 u 另外，本實施例的發光二極體燈源模組2〇〇亦可以包 括一鏡片270以及一前框280。鏡片270與前框280皆配 置於燈罩220的出光截面，且前框280與環形框體224b 可以夾持鏡片270，以固定住鏡片270。 矣示上所述’本創作利用光機與燈罩之間的熱_接來排 出發光二極體所產生的熱能。由於燈罩外的空氣具有彳艮好 的流動性，因此藉由燈罩與燈罩外的空氣之間的熱對流， 燈罩能有效地將熱能排出，以避免熱能堆積在光機中。相 較於習知技術而言，本創作的燈罩更能適時地排出光機内 的熱能，以致於這些發光二極體的溫度更能受到控制，同In addition, the lampshade 220 of the present embodiment can be designed in a variety of configurations and configurations, and the lampshade 220 can be constructed of a plurality of separate components. Of course, the lampshade 220 can also be a separate component, such as a lampshade that only includes the lampshade housing 222, and does not include the frame 224. Accordingly, the shade housing 222 and frame 224 illustrated in Figures 2A-2D are merely illustrative and are not intended to limit the present invention. In addition, the LED module 2 本 of the embodiment may also include a lens 270 and a front frame 280. Both the lens 270 and the front frame 280 are disposed in the light exiting section of the lamp cover 220, and the front frame 280 and the annular frame 224b can clamp the lens 270 to fix the lens 270. In the above description, the creation uses the heat between the light machine and the lamp cover to discharge the heat generated by the light-emitting diode. Since the air outside the lampshade has good fluidity, the lampshade can effectively discharge heat energy by heat convection between the lampshade and the air outside the lampshade to prevent heat energy from accumulating in the machine. Compared with the prior art, the lampshade of the present invention can discharge the heat energy in the optical machine in a timely manner, so that the temperature of the light-emitting diodes can be more controlled,
的立 圖2D是圖2Α 圖0 M330571 日守防止發光二極體發生過熱的情形。 此外，本創作的發光二極體燈源模組還可包括 燈罩外表面的散熱鰭片。藉由散熱則與燈罩之間的= 接’以及散熱鰭片與燈罩外的空氣之_熱對流，這^ 光二極_溫度更能有效地受顺制，明加這些於^ 極體的壽命，同時更有效地防止發光二 永久性的損壞。 而發生 雖然本創作已以實施例揭露如上，然其並非 本創作，任何熟習本創作所屬領域之具有通常知、定 不脫離本創作之精神和範圍内，當可作些許之更，在 !老=本創作之保護範圍當視後附之申請專利範C 【圖式簡單說明】 圖1是習知發光二極體照明燈具的剖面示意圖。 圖2A是本創作一實施例之發光二極體燈ς 體示意圖。 '汲 圖2Β是圖2Α中沿線14的剖面示意圖。 圖2C是圖2Β中區域r的放大示意圖。 中的發光二極體燈源模組的分解示音 【主要元件符號說明】 1〇〇 :發光二極體照明燈具 110 :發光二極體 120 :電路板 11 M330571 130 :散熱鳍片 140 ··燈罩 200 :發光二極體燈源模組 210 :光機 212 :發光二極體 • 214 :電路板 ' 220 :燈罩 222 :燈罩殼體 ❿ 224 :框架 224a :固定條 224b :環形框體 230 :散熱材料 240 :散熱鳍片 250 :電源供應裝置 260 :端子座 262 :接點 • 270 :鏡片 280 :前框 12Figure 2D is the case of Figure 2Α Figure 0 M330571 The Guardian prevents the LED from overheating. In addition, the light-emitting diode lamp source module of the present invention may further comprise heat-dissipating fins on the outer surface of the lamp cover. By means of heat dissipation, the connection between the lampshade and the heat convection of the heat sink fins and the air outside the lampshade, the temperature of the two poles is more effectively controlled, and the life of the body is increased. At the same time, it is more effective to prevent permanent damage of the illuminating two. However, although this creation has been disclosed as an example in the above, it is not the creation of this creation. Any familiarity in the field of this creation has the usual knowledge and scope, and can be made a little more, in the old! = The scope of protection of this creation is attached to the patent application C. [Schematic description of the drawings] Fig. 1 is a schematic cross-sectional view of a conventional light-emitting diode lighting fixture. Fig. 2A is a schematic view showing the body of a light-emitting diode lamp according to an embodiment of the present invention. '汲 Figure 2Β is a schematic cross-sectional view along line 14 in Figure 2Α. 2C is an enlarged schematic view of a region r in FIG. Decomposition sound of the light-emitting diode lamp source module [Main component symbol description] 1〇〇: Light-emitting diode lighting device 110: Light-emitting diode 120: Circuit board 11 M330571 130: Heat-dissipating fin 140 ·· Lampshade 200: Light-emitting diode light source module 210: Light machine 212: Light-emitting diodes • 214: Circuit board '220: Lampshade 222: Lamp housing ❿ 224: Frame 224a: Fixing strip 224b: Ring frame 230: Heat dissipating material 240: heat sink fin 250: power supply device 260: terminal block 262: contact point 270: lens 280: front frame 12