.M311119 八、新型說明： 【新型所屬之技術領域】 本創作係有關-種可提升發光二極體散熱效率之發光二極體散熱模 組’適用於高贵度或超高亮度之發光二極體或類似结構者。 【先前技術】 現今LED的應用面不斷擴大，目前已普遍用於資訊、通訊與消費性電 子產品的指示燈與顯示裝置’如液晶電視、手機、pM、Gps顯示面板及照 明等市場領域，也因此LED晶片的輸入功率須不斷的提高，但持續熱量的 累積所造成發熱的現象將會降低發光效率並加速LED元件本身增溫，其增 溫效應所形成之應力將造成LED結構不良而毁損；故，無論是生產手機用 或照明設備用的發光二極體各廠商，普遍均須面臨散熱問題，尤其是應用 在高亮度或超高亮度照明設備的發光二極體，更須面對高熱所造成材料之 質變或壽命減少的問題。 請參第4圖，習狀發光二極體散熱模組，主要係於發光二極體丄下 方結合-導熱層4 ’該導熱層4下方再結合電路板2，該電路板2係黏合 有-銘板3，於該#§板3下方可再接—散熱塊5，_加速散熱速度。 然’上述發光二極體散熱模組其發光二極體工散熱時，熱須先透過導 熱層4傳導至電路板2，經由電路板2與銘板3傳導至其下方之散熱塊 5，因電路板2之材料組成並不利熱的傳導作用，故阻隔減緩了熱的傳導 ，令散熱速率大幅地降低，乃為其主要之缺失。 有鑑於上述習用缺失，本創作人期能提供一種可提升發光二極體散熱 5 M311119 效率之發光二極體散熱模組， ^ 乃/曰心研心、没汁組製，以提供消費大眾使 用，為本創作所欲研創之創作動機者。 【新型内容】 本創作之主要目的’缺供—種可提升發光二鋪之賴效率之發光 二極體散熱模組者。.M311119 VIII. New Description: 【New Technology Fields】 This is a kind of light-emitting diode for improving the efficiency of light-emitting diodes. It is suitable for noble or ultra-high brightness LEDs. Or similar structure. [Prior Art] Today's LED applications continue to expand, and are now widely used in the market for information, communication and consumer electronics indicators and display devices such as LCD TVs, mobile phones, pM, GPS display panels and lighting. Therefore, the input power of the LED chip must be continuously improved, but the phenomenon of heat generation caused by the accumulation of continuous heat will reduce the luminous efficiency and accelerate the temperature increase of the LED element itself, and the stress formed by the warming effect will cause the LED structure to be poor and damaged; Therefore, whether it is a manufacturer of light-emitting diodes for mobile phones or lighting equipment, it is generally necessary to face heat dissipation problems, especially for light-emitting diodes used in high-brightness or ultra-high-brightness lighting equipment, and even in the face of high heat. A problem that causes a qualitative change in the material or a decrease in life. Please refer to FIG. 4, the light-emitting diode heat-dissipating module is mainly connected under the light-emitting diode --heat-conducting layer 4', and the circuit board 2 is combined under the heat-conducting layer 4, and the circuit board 2 is bonded with - Nameplate 3, which can be reconnected under the #§板3, the heat sink block 5, _ accelerates the heat dissipation speed. However, when the light-emitting diode of the above-mentioned light-emitting diode heat-dissipating module is cooled, the heat must first be transmitted to the circuit board 2 through the heat-conducting layer 4, and transmitted to the heat-dissipating block 5 below it via the circuit board 2 and the nameplate 3, due to the circuit The material composition of the plate 2 is not conducive to the heat conduction, so the barrier slows down the heat conduction, and the heat dissipation rate is greatly reduced, which is the main defect. In view of the above-mentioned lack of use, this creator can provide a light-emitting diode cooling module that can improve the efficiency of the light-emitting diode 5 M311119, ^ is a heart-warming, no juice system, to provide consumer use , is the creative motive for the creative research. [New content] The main purpose of this creation is the lack of supply - a kind of light-emitting diode that can improve the efficiency of the light-emitting two-story.
為達上述目的，本創作係包含：一電路板、至少一發光二極體、至少 -導熱層及-散熱塊’其巾該電路板係設有氣，該發光二極體係跨設於 該電路板之開孔上方’該至少—導熱層係設於發光二極體底部，該導熱層 係透過電路板之開孔而結合—散熱塊；藉此，俾概升發光二極體之散熱 效率者。 本創作之其他特點及具體實施例可於以下配合附圖之詳細說明中，進 一步瞭解。 【實施方式】 請參第1〜3圖，本創作之發光二極體散熱模組，係包括：一電路板 10、至少—發光二極體2 0、至少一導熱層3 0及一散熱塊4 0，其中 该電路板1〇設有開孔11，並於開孔11周緣佈設有複數連接電路12 ’至少一發光二極體2 0係跨設於開孔1 1之上方，其中該發光二極體2 Q係設有一結合座2 2以及複數根支架21，該至少一導熱層3 0係可配 合電路板1〇之開孔11形狀而設，或配合發光二極體2 〇之結合座2 2 形狀而設’本實施例係配合發光二極體2 0之結合座2 2形狀而設為圓形 ’同時在該導熱層3 0下方再結合一設有多片散熱鰭片之散熱塊4 0(實際 使用時亦可採用其他形式之散熱塊4 0)。 6In order to achieve the above object, the present invention comprises: a circuit board, at least one light emitting diode, at least a heat conducting layer, and a heat dissipating block, wherein the circuit board is provided with gas, and the light emitting diode system is disposed across the circuit. Above the opening of the board, the at least the heat conducting layer is disposed at the bottom of the light emitting diode, and the heat conducting layer is coupled to the heat sink through the opening of the circuit board; thereby, the heat dissipation efficiency of the light emitting diode . Other features and embodiments of the present invention can be further understood from the following detailed description in conjunction with the drawings. [Embodiment] Referring to Figures 1 to 3, the LED light-emitting diode module of the present invention comprises: a circuit board 10, at least a light-emitting diode 20, at least one heat-conducting layer 30, and a heat-dissipating block. 40, wherein the circuit board 1 is provided with an opening 11 and a plurality of connecting circuits 12 are disposed on the periphery of the opening 11. At least one light emitting diode 20 is disposed above the opening 1 1 , wherein the light is emitted The diode 2 is provided with a joint 2 2 and a plurality of brackets 21, and the at least one heat conducting layer 30 can be matched with the shape of the opening 11 of the circuit board 1 or with the combination of the light emitting diodes 2 The shape of the seat 2 2 is set to 'the present embodiment is matched with the shape of the joint 2 2 of the light-emitting diode 20 and is set to a circular shape'. At the same time, the heat-dissipating layer 30 is combined with a heat dissipation fin provided with a plurality of heat-dissipating fins. Block 40 (other forms of heat sink 40 can also be used in actual use). 6
M311119 其應用於高亮度之發光二極體2 〇時，須將該發光二極體2 q之支架 21銲接於該電路板10之連接電路12上，本實施例中係設有三個發光 二極體2 0，依電路板10上之連接電路12佈設該些發光二極體2 〇， 以利將該些發光二極體2 0作電性連接，因電路板1〇設有開孔^丄，故 利用該複數根支架21將該些發光二極體2〇銲接於電路板1〇之開孔丄 1兩側，以使該發光二極體2 0跨設於該電路板1〇之開孔i i上方，且 每一發光二極體2 0之結合座2 2内係結合一凹杯2 3，該凹杯2 3底面 係結合-圓形之導熱層3 Q，_該導熱層3 Q作為熱傳導媒介，將發光 二極體2 0内之熱源傳導出來，該導熱層3 0於實際應用時可使用散熱片 或月欠熱g，再於$熱層3 0下方結合一設有多片鰭片之散熱塊4 〇，該具 大範圍散熱面積之散熱塊4 0更有利於將熱源快速排出，而該組散熱塊4 0與空氣接觸面積甚大，可達迅速降低該發光二極體2 〇之溫度；其中， 因該組散熱塊4 0係直接貼附於導熱層3 Q下方，少了電路板i⑽阻隔 作用，該發光二極體2 0之散熱效率將大幅提升。 綜上所述，本創作確可達到創作之預期目的，提供一種發光二極體散 熱模組’利用1路_有開孔之設計’令高亮度發光二極體散熱模組得以 大幅提升散触率，具有實Μ絲疑，爰依法提出新型專利申請。 惟以上所述者，僅為本創作之較佳實施例，當不能用以限定本創作可 實施之範® ’凡習於《之人士所_可作變化與修飾’皆應視為不悼離 本創作之實質内容。 M311119 【圖式簡單說明】 第1圖係為本創作實施例之立體外觀圖。 第2圖係為本創作實施例之元件分解圖。 第3圖係為本創作實施例之結合剖面示意圖。 第4圖係為習用發光二極體散熱模組之結合剖面示意圖。 【主要元件符號說明】 1、 發光二極體 2、 電路板 3、 鋁板 4、 導熱層 5、 散熱塊 1 0、電路板 1 1、開孔 12、連接電路 2 0、發光二極體 2 1、支架 2 2、結合座 2 3、凹杯 3 0、導熱層 4 0、散熱塊 8M311119 is applied to the high-brightness light-emitting diode 2 ,, and the bracket 21 of the light-emitting diode 2 q is soldered to the connecting circuit 12 of the circuit board 10. In this embodiment, three light-emitting diodes are provided. The light-emitting diodes 2 are arranged according to the connection circuit 12 on the circuit board 10, so as to electrically connect the light-emitting diodes 20, and the openings of the circuit board 1 are provided. Therefore, the plurality of light-emitting diodes 2 are soldered to the two sides of the opening 丄1 of the circuit board 1 by using the plurality of base brackets 21, so that the light-emitting diodes 20 are spanned across the circuit board. Above the hole ii, and a coupling seat 2 2 of each of the light-emitting diodes 20 is coupled with a concave cup 23, the bottom surface of the concave cup 23 is combined with a circular heat conducting layer 3 Q, the heat conducting layer 3 Q As a heat conduction medium, the heat source in the light-emitting diode 20 is conducted out. The heat conductive layer 30 can be used in a practical application, or a heat sink or a monthly heat, and then a plurality of sheets can be combined under the hot layer 30. The heat sink block 4 of the fin has a heat dissipation block 40 with a large heat dissipation area, which is more advantageous for quickly discharging the heat source, and the heat sink block 40 has a contact area with air. Large, up to rapidly reduce the temperature of the light-emitting diode 2; wherein, because the heat-dissipating block 40 is directly attached to the heat-conducting layer 3 Q, the circuit board i (10) has a barrier function, and the light-emitting diode 2 The heat dissipation efficiency of 0 will be greatly improved. In summary, this creation can indeed achieve the intended purpose of creation, providing a light-emitting diode cooling module 'Using a 1-way _ open hole design' to enable the high-brightness light-emitting diode thermal module to greatly enhance the touch Rate, with real doubts, and file a new type of patent application according to law. However, the above is only a preferred embodiment of the present invention, and cannot be used to limit the scope of the creation of the creation. The substance of this creation. M311119 [Simple description of the drawings] Fig. 1 is a perspective view of the present embodiment. Fig. 2 is an exploded view of the present embodiment. Figure 3 is a schematic cross-sectional view of the present embodiment. Figure 4 is a schematic cross-sectional view of a conventional light-emitting diode heat dissipation module. [Description of main component symbols] 1. Light-emitting diode 2, circuit board 3, aluminum plate 4, heat-conducting layer 5, heat-dissipating block 10, circuit board 1 1, opening 12, connecting circuit 2 0, light-emitting diode 2 1 , bracket 2 2, joint seat 2 3, concave cup 30, heat conductive layer 40, heat sink 8