201005216 •九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體路燈。 ^ 【先前技術】 目前，發光二極體（Light Emitting Diode，LED)已經被廣 泛應用於很多領域，尤其係廣泛應用於路燈。於此，一種 新型發光二極體可參見Daniel A. Steigerwald等人於文獻 IEEE Journal on Selected Topics in Quantum C Electronics,Vol.8,No.2，March/April 2002 中之 Illumination With Solid State Lighting Technology —文。 由於發光二極體路燈之工作時間一般較長，其產生之 熱量亦較多，當溫度達到一定程度時，將會導致低落之内 部量子效應並且明顯縮短其壽命。因此，通常之採用發光 二極體之路燈除發光模組之外還包括散熱模組。該發光模 組通常包括金屬框、收容於金屬框内之電路板及設置於電 爲路板上之發光二極體。該金屬框用以固定該電路板及發光 _二極體。該散熱模組通常為散熱鰭片等，該散熱模組可及 時散除發光模組產生之熱量，從而保證路燈之正常工作。 然而，該種採用發光二極體之路燈結構較為複雜且重量較 大’其使得該種路燈之組裝難度較高，並且對該種路燈之 安裝以及維修造成極大不便。 有鑒於此，提供一種結構簡單、重量輕之發光二極體 路燈實為必要。 【發明内容】 201005216 以下將以實施例說明一種結構簡單、重量輕之 ^ 極體路燈。 ^ 一 - 一種發光二極體路燈，其包括一個發光二極體光源， 一個擴散板以及一個散熱模組，該發光二極體光源包括一 個電路板及複數個發光二極體，該電路板包括第一=面及 與該第一表面相對之第二表面，該複數個發光二極體設置 於该電路板之第一表面上並與該電路板電性連接；該擴散 ◎板設置於電路板之第一表面一側；該散熱模組包括—個導 熱板，複數個熱管以及複數個散熱鰭片，該導熱板包括一 接σ面及與该接合面相對之散熱面，該複數個熱管之蒸 f端與該導熱板之散熱面熱連接，該複數個熱管之冷凝端 遠離該導熱板並穿設於複數個散熱鰭片中；該發光二極體 光源之電路板固定於該導熱板之接合面上以與導熱板形成 熱連接，且電路板之第二表面朝向該接合面。 相對於先㈤技術，該發光二極體路燈之電路板固定於 G =熱板上並與該導熱㈤熱接觸，從而該發光二極體光源無 需採用金屬框固定，簡化了發光二極體路燈之結構並減輕 了發光二極體路燈之重量，同時還能達到良好之散熱效果。 【實施方式】 咕參見圖1及圖2’本發明實施方式提供之發光二極體 路燈10，其包括··一個發光二極體光源11、一個擴散板12 以及一個散熱模組13。 ^孩發光二極體光源11包括一個電路板112及複數個發 光二極體114。該電路板112包括一第一表面112〇以及一 8 201005216 •第二表面1122。該第一表面1120與第二表面1122相對設 置。該電路板112内部形成有電路（圖未示），用於向複數個 發光二極體光源114提供電力。該複數個發光二極體114 . 設置於該電路板112之第一表面1120上，並與形成於電路 板112内部之電路電性連接。該電路板可為金屬核心印刷 電路板（Metal Core Printed Circuit Board，MCPCB)。 該擴散板12設置於電路板112之第一表面1120 —侧’ 用於擴散從複數個發光二極體114發出之光線。該擴散板 <0 12可為一内部分散有大量微粒子之樹脂層，從而光線於經 過該擴散板12時會產生反射、散射之現象，進而造成光學 擴散之效果。當然，該擴散板12亦可為其他結構，如形成 有微結構之透明板、分散有大量微粒子之玻璃板等。 該散熱模組13包括一組散熱鰭片131、複數個熱管132 及一個導熱板133。該導熱板133由具有良好之導熱性能之 鋁等金屬製成，其包括一散熱面1330以及一與該散熱面 & 1330相對設置之接合面1332。該電路板112固定於導熱板 133之接合面1332上，且該導熱板133之接合面1332與該 電路板112之第二表面1122相對並形成熱連接。該導熱板 133之散熱面1330與該複數個熱管132之蒸發端1320熱連 接。該複數個熱管132之冷凝端1322遠離該導熱板133， 且嵌於該組散熱鰭片131内並與其熱連接。該複數個熱管 132相互平行且間隔設置。 該複數個發光二極禮114工作時產生之熱量由該電路 板112傳給該導熱板133,從而避免了大量熱量聚集於該電 9 201005216 路板112上，而造成溫度過高而影響該複數個發光二極體 114之正常工作。該導熱板133將吸收之熱量均勻之傳送給 與該導熱板133熱連接之該複數個熱管132之蒸發端 1320。該複數個熱管132之工作流體於蒸發端1320吸收上 述熱量而變成氣態，氣態之工作流體到達冷凝端1322釋放 所吸收之熱量並轉變成液態，再經由毛細結構層流回蒸發 端1320。該冷凝端1322嵌於該組散熱鰭片131内並與該組 散熱鰭片131形成熱連接，該組散熱鰭片131直接與空氣 Θ進行熱交換，達到散熱之目的。 優選的，為提高電路板112與該導熱板133間之熱傳 遞效率，電路板112之第二表面1122與導熱板133之接合 面1332藉由散熱膏形成熱連接。 參見圖3,為進一步提高發光二極體114之出光均勻 度，可將發光二極體114於電路板112之第一表面1120上 交錯分佈，亦即：複數個發光二極體114沿圖3所示y方 ^ 向排成多列，每一列之發光二極體114於圖3所示X方向 上以等間距D排列，任意相鄰兩列發光二極體114於X方 向上錯開一預定間隔d。 參見圖4,為提高發光二極體114所發出之光之利用效 率，可於電路板112之第一表面1120上設置一個反射膜 14，該反射膜14覆蓋該第一表面1120上之未被發光二極 體114覆蓋之位置。當然，該反射膜14亦可替換為反射板。 該發光二極體路燈10之電路板112固定於導熱板133 上並與該導熱板133熱接觸，從而該發光二極體光源11無 201005216 需採用金屬框固定， 輕了發光二極體路燈 效果。 簡化了發曰光二極體路燈10之結構並減 10之重Ϊ ’㈣還能達職好之散熱 综上所述，本發明確已符合發明專利之要件，遂依法 ^專财請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝=人士援依本發明之精神所作之等效修飾或變化，皆 υ應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例提供之發光二極體路燈之立體示 圖2係圖1所示發光二極體路燈之結構分解圖。 圖3係本發明實施例提供之具有交錯排佈發光二極體 之電路板之示意圖。 圖4係本發明 電路板之側視圖。 實施例提供之設置有反射膜或反射板之 10 11 12 13 112 114 1120 【主要元件符號說明】 發光二極體路燈 發光二極體光源 擴散板 散熱模組 電路板 發光二極體 第一表面 11 201005216 ‘第二表面 1122 散熱鰭片 131 熱管 132 導熱板 133 散熱面 1330 接合面 1332 蒸發端 1320 ^冷凝端 1322 V反射膜 14201005216 • Nine, invention description: [Technical Field of the Invention] The present invention relates to a light-emitting diode street lamp. ^ [Prior Art] At present, Light Emitting Diode (LED) has been widely used in many fields, especially in street lamps. Here, a novel light-emitting diode can be found in Daniel A. Steigerwald et al., IEEE Journal on Selected Topics in Quantum C Electronics, Vol. 8, No. 2, March/April 2002, Illumination With Solid State Lighting Technology. Text. Since the working time of the LED street lamp is generally long, it generates more heat. When the temperature reaches a certain level, it will cause a low internal quantum effect and significantly shorten its life. Therefore, in general, the street lamp using the light-emitting diode includes a heat-dissipating module in addition to the light-emitting module. The illuminating module generally includes a metal frame, a circuit board housed in the metal frame, and a light emitting diode disposed on the circuit board. The metal frame is used to fix the circuit board and the light-emitting diode. The heat dissipation module is usually a heat dissipation fin, and the heat dissipation module can dissipate the heat generated by the illumination module to ensure the normal operation of the street lamp. However, the street lamp structure using the light-emitting diode is relatively complicated and heavy in weight, which makes the assembly of the street lamp difficult, and causes great inconvenience in the installation and maintenance of the street lamp. In view of this, it is necessary to provide a light-emitting diode street lamp which is simple in structure and light in weight. SUMMARY OF THE INVENTION 201005216 Hereinafter, a polar body street lamp having a simple structure and a light weight will be described by way of embodiments. ^一- A light-emitting diode street lamp comprising a light-emitting diode light source, a diffusing plate and a heat-dissipating module, the light-emitting diode light source comprising a circuit board and a plurality of light-emitting diodes, the circuit board comprising a first surface and a second surface opposite to the first surface, the plurality of light emitting diodes are disposed on the first surface of the circuit board and electrically connected to the circuit board; the diffusion ◎ plate is disposed on the circuit board The first surface of the first surface; the heat dissipation module includes a heat conducting plate, a plurality of heat pipes and a plurality of heat radiating fins, the heat conducting plate includes a σ plane and a heat dissipating surface opposite to the joint surface, and the plurality of heat pipes The vapor-emitting end is thermally connected to the heat-dissipating surface of the heat-conducting plate, and the condensation end of the plurality of heat pipes is away from the heat-conducting plate and is disposed in the plurality of heat-dissipating fins; the circuit board of the light-emitting diode light source is fixed to the heat-conducting plate The joint surface is in thermal connection with the heat conducting plate, and the second surface of the circuit board faces the joint surface. Compared with the first (5) technology, the circuit board of the LED street lamp is fixed on the G=hot plate and is in thermal contact with the heat conduction (5), so that the LED light source does not need to be fixed by a metal frame, which simplifies the LED street lamp. The structure also reduces the weight of the LED street light, and at the same time achieves a good heat dissipation effect. [Embodiment] Referring to FIG. 1 and FIG. 2', a light-emitting diode street lamp 10 according to an embodiment of the present invention includes a light-emitting diode light source 11, a diffusion plate 12, and a heat dissipation module 13. The child light emitting diode source 11 includes a circuit board 112 and a plurality of light emitting diodes 114. The circuit board 112 includes a first surface 112A and an 8 201005216 • second surface 1122. The first surface 1120 is disposed opposite the second surface 1122. A circuit (not shown) is formed inside the circuit board 112 for supplying power to the plurality of light emitting diode sources 114. The plurality of LEDs 114 are disposed on the first surface 1120 of the circuit board 112 and electrically connected to the circuit formed inside the circuit board 112. The board can be a Metal Core Printed Circuit Board (MCPCB). The diffuser 12 is disposed on the first surface 1120 of the circuit board 112 for diffusing light emitted from the plurality of light emitting diodes 114. The diffusion plate <0 12 may be a resin layer in which a large amount of fine particles are dispersed, so that light rays may be reflected and scattered when passing through the diffusion plate 12, thereby causing an optical diffusion effect. Of course, the diffusing plate 12 may have other structures such as a transparent plate in which a microstructure is formed, a glass plate in which a large amount of fine particles are dispersed, or the like. The heat dissipation module 13 includes a set of heat dissipation fins 131, a plurality of heat pipes 132 and a heat conduction plate 133. The heat conducting plate 133 is made of a metal such as aluminum having good thermal conductivity, and includes a heat dissipating surface 1330 and a joint surface 1332 disposed opposite the heat dissipating surface & 1330. The circuit board 112 is fixed to the bonding surface 1332 of the heat conducting board 133, and the bonding surface 1332 of the heat conducting board 133 is opposite to the second surface 1122 of the circuit board 112 and forms a thermal connection. The heat dissipating surface 1330 of the heat conducting plate 133 is thermally coupled to the evaporation end 1320 of the plurality of heat pipes 132. The condensation end 1322 of the plurality of heat pipes 132 is away from the heat conducting plate 133 and embedded in the heat dissipation fins 131 and thermally connected thereto. The plurality of heat pipes 132 are arranged parallel to each other and at intervals. The heat generated by the plurality of LEDs 114 is transmitted from the circuit board 112 to the heat conducting plate 133, thereby preventing a large amount of heat from accumulating on the circuit board 112, and causing the temperature to be too high to affect the plurality The normal operation of the light-emitting diodes 114. The heat conducting plate 133 uniformly transfers the absorbed heat to the evaporation end 1320 of the plurality of heat pipes 132 thermally connected to the heat conducting plate 133. The working fluid of the plurality of heat pipes 132 absorbs the heat at the evaporation end 1320 to become a gaseous state, and the gaseous working fluid reaches the condensation end 1322 to release the absorbed heat and is converted into a liquid state, and then flows back to the evaporation end 1320 via the capillary structure layer. The condensing end 1322 is embedded in the heat dissipating fins 131 and is thermally connected to the heat dissipating fins 131. The heat dissipating fins 131 directly exchange heat with the air rafts for heat dissipation. Preferably, in order to improve the heat transfer efficiency between the circuit board 112 and the heat conducting plate 133, the second surface 1122 of the circuit board 112 and the bonding surface 1332 of the heat conducting plate 133 are thermally connected by a thermal grease. Referring to FIG. 3, in order to further improve the light uniformity of the light emitting diodes 114, the light emitting diodes 114 may be staggered on the first surface 1120 of the circuit board 112, that is, a plurality of light emitting diodes 114 along FIG. The y-squares are arranged in a plurality of columns, and the light-emitting diodes 114 of each column are arranged at an equal interval D in the X direction shown in FIG. 3, and any two adjacent columns of the light-emitting diodes 114 are staggered in the X direction. Interval d. Referring to FIG. 4, in order to improve the utilization efficiency of the light emitted by the LEDs 114, a reflective film 14 may be disposed on the first surface 1120 of the circuit board 112, and the reflective film 14 covers the first surface 1120. The position where the light emitting diode 114 covers. Of course, the reflective film 14 can also be replaced with a reflective plate. The circuit board 112 of the LED street lamp 10 is fixed on the heat conducting board 133 and is in thermal contact with the heat conducting board 133, so that the LED light source 11 does not have a metal frame fixed by 201005216, and the light emitting diode street light effect is light. . It simplifies the structure of the dimming diode street lamp 10 and reduces the weight of 10'. (4) It can also achieve the heat dissipation of the job. In summary, the invention has indeed met the requirements of the invention patent, and is legally required. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by the person skilled in the art, in accordance with the spirit of the present invention, are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a light-emitting diode street lamp according to an embodiment of the present invention. FIG. FIG. 3 is a schematic diagram of a circuit board having a staggered arrangement of LEDs according to an embodiment of the invention. Figure 4 is a side elevational view of the circuit board of the present invention. 10 11 12 13 112 114 1120 provided with a reflective film or a reflector provided in the embodiment [Description of main component symbols] Light-emitting diode street light emitting diode light source diffusion plate heat dissipation module circuit board light-emitting diode first surface 11 201005216 'Second surface 1122 heat sink fin 131 heat pipe 132 heat transfer plate 133 heat sink surface 1330 joint surface 1332 evaporation end 1320 ^ condensation end 1322 V reflection film 14
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