M295763 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種散敎 機之水冷式散熱模組裝置尤心一種適用於電腦主 【先前技術】 現今電腦工鞏之姦口 個人電子產品，除了體;=越趨向精密，如積體電路， 增加，特別在電腦令，：二熱量的產生也越趨 電腦整體發熱量亦隨之…:：效"的不斷提升，使得 只褐限於CPU，其他嗜：：。尸的主要發熱來源不再 /、他堵如晶片模組、圖形處理 記憶體及硬碟等高速裝置 悲 ,,.^ 罝也同守產生相當可觀之埶量，因 ，為使電腦可在容許的卫作溫度範圍内了 藉助於額外之散埶事晋 則必須 不良影響。…置’以減低熱量對於電腦元件運作的 而風扇即為—種簡便且最被廣泛使用的散埶來 ==使發熱元件周遭之空氣產生快速流動，將發‘ 1几戶之熱源迅速被帶離，以達到其散熱作用，但因 'I:之=了屬有限，使其散熱效果仍無法有效改善 風扇之氣流量，卻因受限於”二:風1旨武增加其 Μ又吸於空間的限制而難以 加馬達轉速來增強其氣流量，、於 " 馬達轉速的增加亦有上限，甚 且 叙Β抽曰选主谷易產生大置的噪音、雳 動及熱1，造成其難以實施之限度。 辰 如前所述，風扇本身效能的提升有其難以突破的限制 5 M295763 電果：以提升，降溫幅度仍屬有限，但為解決 決方案= ; = = _，勢，求其他的解 —^ 揭露—種水冷式散熱裝置，係利用 f 於發熱元件上，如CPU或磁碟機，係由- 泵浦自水相將冷卻水抽出導入其吸熱元件中，兮 吸熱元件從發熱元件所吸附0 水與 、人知、六$丄χ …、里、、、工田熟父換作用後，i /“P液再由吸熱元件流出至一水冷器向曼： 冷卻後再逆Θ4 L A 丁月丈…、、、星由 1恭# 冷卻水循環來幫助散熱，降低盆 I…、元件溫度，使其機組順利運作。 …、 上述之水冷式散熱裝置是藉由水冷 ::進r纖用，但因該水冷式散熱裝置二 == 表内部，其所散逸之熱源仍是留在主機内， 部的溫升效應’因此另一項習知技術提出一種增設風肩 助將主機内部熱氣抽出之水冷式散熱裝置，如第曰：圖：_ 置的气/之熱空乳向外抽離’希冀提升其水冷式散執裝 同一1=率且ΐ由於水冷裝置與其他的電腦組件配置於 2工間内’且電腦組件所產生的熱源與水冷器所散 :、源仍滯留在同-空間，導致風扇無法讓主機Η)内棒 ㈣成循環，造成主卿内部所產生的溫 = 大幅則弱水冷式散熱裝置的散熱作用，成為' 有 置未盡理想之處。 Χ衣 【新型内容】 針對上述之缺失，本創作之主要目的在於提供一種水 6 M295763 冷式散熱模組裝置，藉由將水冷式散 於電腦主機之最上屏，盘甘从_ 、、置叙、、且化，並設 扇之設置將外界冷空氣帶進盒體 ：硪，透過風 再帶離主機外部，7々益進行散熱， 、1以臭升主機内部之散熱效率。 二了達成上述之目的，本創作係提供一人 模組裝置，苴处槎孫，、；人_ 、種水々式散熱 …口構係以一盒體為主體，該各 設分別設有複數穿孔形 /皿-之别後板面 -泵浦、-水箱、-二二::？該盒體内更具有 浦及水箱係透過連通管：：=1連通官及-風扇，該泵 體外之-吸心並再透過連通管連接盒 元件間之遠π 連通狀恶，同時連接於泵浦與吸敎 凡件間之相t更穿設於 次… 器之後面㈣&亥風扇係設於水冷 動，同時在㈣組内之冷卻水產生流 勒_在㈣件内產生熱交換 熱源散逸至水冷哭上m π β #透過熱傳導將 主機外。 °°上㈤後由風扇所引進之風力帶至電腦 【實施方式】 閱第二圖’係為本創作之立體 本創作之散熱模組13 了看出 2之:t卜Μ目+ 兒月自主枝2上，該電腦主機 恭施例中^ 容置槽21 ’用以裝設該散熱模組1，本 貝士把例中係利用-隔板22於主機2内形成 %在該隔板22上預設管〇 胃 同 21正對之後面板23位置m圖不為兩個），該容置槽 位置上δ又有锼數風孔231 ;此外，該容 直h d亦可利用設置滑軌 置形成-容置槽㈣式於電腦主機2之最上層位 M295763 ▲接續上圖，而該散熱模組〗係以—中空盒體u為主體 ，該盒體π之前後板面上開設複數穿孔m ，同時在盒體 η之前板面上設有一把手112，且在該盒體n下方透：： 連通管12a A 12b連接-吸熱元件13，並與該吸熱元㈣ 上之一入水口 131及一出水口 132相連接（如第三圖所示 )，用以貼附於發熱元件24上（如第四 =細内部更設有一水冷系統，其包括一= 相15、-水冷n16及複數連通#12，同時在該盒體u内設 有-風扇17，如第三圖所示，其中該泵浦14係透過連通管 既與水箱15相連接’該水箱15則是透過連通管他與吸 熱兀件13相連接’錢泵浦14則透過連通f既與吸熱元 件13相連接，使該各組件形成—直通流道，而同時該連通 管12b則以穿設方式與該水冷器16相連結，該水冷器關 由複數散熱>W61所組成，該散熱片161可為㈣型或籍 片組；最後，該風扇17係設於水冷器16與盒體^之後板面 之間，同時該風扇17之風向係與盒體^之前後板面形成— 直線，使該盒體11實質形成一流道。 請參閱第四圖及第五圖，係為本創作之組合示意圖及 操作示意圖，可看出，當該散熱模幻之盒體裝置於電腦 主機2上之容置槽21後，同時將該吸熱元件13直接連接於 發熱兀件24上，且透過兩連通管12a及丨沈經由管口 與裝設於盒體11内之水箱15及泵浦14產生連通狀態，俾使 設於散熱模組丨㈣之冷卻水能透料通㈣通過各散熱 同時散熱模組1内 組件；因此當電腦主機2開始運作時 M295763 目連通管12a 之泵浦14也一併運作，使冷卻水產生流動 _ _ p 一“ 流入該吸熱元件13中，而電腦主機2内之發熱元件24所產 生之熱源即與貼附其上之吸熱元件13產生熱傳導作用，使 该熱源與流動於吸熱元件13内之冷卻水充分產生熱交換後 由連通官13b流出並帶離該吸熱元件13，在此同時，已吸 足熱量之冷卻水便流向盒體n中之水冷器16，使熱源隔 於盒體11之内部，之後該冷卻水回到盒體u後便與水冷器 16產生熱傳導作[將熱源均勻分散於水冷器化之各散熱 片丨61上，最後再回到水箱15而不斷循環，同時 ㈣風作用，引進電腦主機2外之冷空氣，直接 ，冷益16 ’藉由風力之吹送，將水冷器以上之熱源一併吹 離’透過盒體11後方上之穿孔1U及電腦主機2後面板23 風孔231 $至主機2外，使電腦主機2能保持在正工 作溫度下運作。M295763 VIII. New description: [New technical field] This is a kind of water-cooled heat-dissipating module device for a diverting machine. It is especially suitable for computer main [pre-technical]. In addition to the body; = the more precise, such as the integrated circuit, increased, especially in the computer order: the second heat generation is also the more the computer's overall heat is also followed by ...:: effect " continues to improve, making only brown limited to the CPU Other hobbies::. The main source of fever of the corpse is no longer, and he blocks the high-speed devices such as chip modules, graphics processing memory and hard disk. The ^ 罝 同 产生 产生 产生 产生 产生 产生 产生 产生 产生 相当 相当 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生Within the scope of the temperature range of the guards, it is necessary to have an adverse effect by means of additional scatter. ... set 'to reduce heat for the operation of computer components and the fan is a simple and most widely used divergence == to make the air around the heating element produce rapid flow, will send 'a few households' heat source quickly Separate to achieve its heat dissipation effect, but because 'I: it is limited, its heat dissipation effect can not effectively improve the fan's air flow, but it is limited by the "two: wind 1 It is difficult to add motor speed to increase the air flow rate, and there is an upper limit on the increase of the motor speed. Even the selection of the main valley is likely to generate large noise, turbulence and heat. The limit is difficult to implement. As mentioned above, the improvement of the efficiency of the fan itself has its limit that is difficult to break. 5 M295763 Electric fruit: To improve, the cooling rate is still limited, but to solve the solution = ; = = _, potential, seeking Other solutions - ^ expose - a water-cooled heat sink, using f on the heating element, such as CPU or disk drive, is pumped from the water phase to draw cooling water into its heat absorbing element, 兮 heat absorbing element from The heating element absorbs 0 water and , people know, six $ 丄χ ..., Li,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, , Star by 1 Gong # cooling water circulation to help heat, reduce the basin I ..., component temperature, so that the unit operates smoothly. ..., the above-mentioned water-cooled heat sink is used for water cooling: into the r fiber, but because the water-cooled heat sink 2 == inside the table, the heat source that is dissipated is still left in the host, and the temperature rise effect of the part Therefore, another conventional technique proposes a water-cooled heat sink that adds a wind shoulder to help extract the hot air inside the host, such as the first: Figure: _ The gas/hot air is pumped away from the 'Hill's water-cooled The same 1= rate is installed and the water cooling device and other computer components are placed in the 2 work room' and the heat source and water cooler generated by the computer components are scattered: the source is still stuck in the same space, causing the fan to fail to let the host Η) The inner rod (4) is circulated, causing the temperature generated inside the main clerk to be large. The heat dissipation effect of the weak water-cooled heat sink device becomes a 'unsatisfactory.' Χ衣 [New Content] In view of the above-mentioned shortcomings, the main purpose of this creation is to provide a water 6 M295763 cold heat-dissipating module device, which is cooled by water-cooled type on the top screen of the computer host. And, and set the fan to bring the outside cold air into the box: 硪, through the wind and then take off the outside of the host, 7 benefits to heat, 1 to smell the internal heat dissipation efficiency of the host. In order to achieve the above objectives, the creative department provides a one-person modular device, which is located in the grandson, and the human body _, the water-type heat-dissipating heat-dissipating system is mainly composed of a box body, and each of the devices is provided with a plurality of perforations. Shape / dish - the other back surface - pump, - water tank, - 22::? The inside of the box further has a pump and a water tank through the communication tube::=1 connects the official and the fan, and the pump body is externally connected to the heart and then communicates with the connecting tube to connect the box element to the far π connected state, and is connected to the pump. The phase between the pump and the sucking piece is set in the second... The rear fan (4) & the Haifan fan is set in the water-cooling motion, and the cooling water in the (four) group generates the flow _ heat exchange heat source is generated in the (four) piece. To the water cold crying on m π β # through heat conduction will be outside the host. ° ° (5) after the wind introduced by the fan to the computer [implementation] Read the second picture 'based on the creation of the three-dimensional creation of the thermal module 13 to see 2: t Bu Yumu + child independence On the branch 2, the computer host adopts a case for accommodating the slot 21' for mounting the heat dissipation module 1, and in the example of the present invention, the partition 22 is formed in the main body 2 by the partition 22 in the partition 22 After the preset tube is opposite to the 21st, the position of the panel 23 is not two, and the position of the accommodating groove is δ and there are a plurality of wind holes 231; in addition, the straight hd can also be set by using the slide rail Forming-accommodating groove (4) in the uppermost level of the computer host 2 M295763 ▲Continued in the above figure, and the heat dissipating module is based on the hollow box body u, and the box body π is provided with a plurality of perforations before the rear plate surface At the same time, a handle 112 is disposed on the front surface of the casing η, and under the casing n: the communication pipe 12a A 12b is connected to the heat absorbing element 13 and is connected to one of the water inlets 131 and one of the heat absorbing element (4). The water outlet 132 is connected (as shown in the third figure) for attaching to the heating element 24 (for example, the fourth=fine interior is further provided with a water cooling system) The method includes a phase 15, a water-cooling n16, and a plurality of connections #12, and a fan 17 is disposed in the casing u, as shown in the third figure, wherein the pump 14 is transmitted through the communication pipe to the water tank 15 The water tank 15 is connected to the heat absorbing element 13 through the communication tube. The money pump 14 is connected to the heat absorbing element 13 through the communication f, so that the components form a through-flow passage while the communication tube 12b is connected to the water cooler 16 in a laying manner, and the water cooler is composed of a plurality of heat sinks > W61, and the heat sink 161 may be a (four) type or a film set; finally, the fan 17 is provided in a water cooler. 16 and the rear surface of the casing, while the wind direction of the fan 17 forms a straight line with the front and rear surface of the casing, so that the casing 11 substantially forms a first-class road. Please refer to the fourth and fifth figures. The schematic diagram of the combination of the creation and the operation diagram of the present invention, it can be seen that when the heat-dissipating module is mounted on the receiving slot 21 of the computer main body 2, the heat-absorbing element 13 is directly connected to the heating element 24 at the same time. And being installed in the casing 11 through the two communicating tubes 12a and the sinking through the nozzle The box 15 and the pump 14 are in a connected state, so that the cooling water provided in the heat dissipation module (4) can pass through the heat dissipation module (4) through the heat dissipation and simultaneously dissipate the components in the module 1; therefore, when the computer main unit 2 starts to operate, the M295763 mesh communication tube The pump 14 of 12a also operates together to cause the cooling water to flow __p" into the heat absorbing element 13, and the heat source generated by the heat generating component 24 in the computer main unit 2 and the heat absorbing element 13 attached thereto The heat conduction is generated, and the heat source is sufficiently exchanged with the cooling water flowing in the heat absorbing element 13 to be discharged from the communication member 13b and carried away from the heat absorbing member 13, and at the same time, the cooling water that has absorbed the heat flows to the casing. The water cooler 16 in n separates the heat source from the inside of the casing 11, and then the cooling water returns to the casing u to generate heat conduction with the water cooler 16 [distributing the heat source uniformly to the respective fins of the water cooler 丨 61 Finally, return to the water tank 15 and continue to circulate, and at the same time (4) the wind acts, the cold air outside the computer main unit 2 is introduced, directly, the cold benefit 16' is blown away by the wind, and the heat source above the water cooler is blown away Box 11 1U host computer 2 and the perforated panel on the rear side of the vent hole 23 to the outer body 2 $ 231, the computer host 2 can be maintained at the operating temperature of the positive work.
惟以上所述之實施方式 能以此限定本創作實施範圍 說明書内容所作之等效變化 專利涵蓋範圍。 【圖式簡單說明】 ’疋為較佳之實施實例，當不 ’若依本創作申請專利範圍及 或修飾，皆應屬本創作下述之 ^圖、係為習知之立體示意圖。 為本創作之裝設結構示意圖。 :三圖、係為本創作之散熱模組結構示意圖。 弟四圖、係為本創作之組合示意圖。 第五圖、係為本創作之操作示意圖。 9 M295763 【主要元件符號說明】 ίο............電腦主機（習知） 20............風扇（習知） I ............散熱模組 II ............盒體 III ............穿孔 112............把手 12 ( a〜c ).....連通管However, the embodiments described above can be used to limit the scope of the scope of the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [ 疋 疋 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若A schematic diagram of the structure of the creation of this creation. : The three pictures are the schematic diagram of the heat dissipation module structure of the creation. The four figures of the younger brother are the combination diagram of the creation. The fifth picture is a schematic diagram of the operation of the creation. 9 M295763 [Description of main component symbols] ίο............ Computer host (conventional) 20............Fan (Practical) I .... ........ Thermal Module II ............Box III ............Perforation 112......... ...handle 12 ( a~c ).....Connecting tube
13 ............吸熱元件 31............入水口 132............ 出水口 14 ............泵浦 15 ............水箱 16 ............水冷器 161............散熱片 17 ............ϋΐ Μ 2............電腦主機 21 ............容置槽 22 ............隔板 221............管口 23 ............背面板 231............風孔 24 ............發熱元件 1013 ............heat absorption element 31............water inlet 132............ water outlet 14 .... ........Pump 15............Water Tank 16............Water Cooler 161.......... .. heat sink 17 ............ϋΐ Μ 2............computer host 21 ............ accommodating slot 22 ............ partition 221............ nozzle 23 ............ back panel 231.... ........wind hole 24............heating element 10