JP2007004765A - Liquid-cooled computer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a computer device having one kind of liquid-cooled heat radiating system. <P>SOLUTION: A heat radiating fan of a liquid-cooled computer system is installed on a side plate of a power source supplier, and heat energy is taken by making its generating air current flow to a heat sink in the first place, and is also sent inside a power source supplier case, and is thereby sent outside a computer case together with the heat radiating fan of the power source supplier. Thus, not only the air current volume flowing in the power source supplier is increased but also more heat energy is dissipated to the power source supplier, and an effective air field is formed in an inside space of the computer case, and intense heat generated by various electronic devices is guided, and is smoothly made to flow to the power source supplier, and is also discharged outside the computer case. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a kind of computer device, and more particularly to a computer device having a liquid cooling type heat dissipation system.

  FIG. 1 is a plan view of the inside of a known liquid-cooled computer apparatus. In the figure, a well-known liquid-cooled heat dissipation system 4 is shown. The liquid-cooled heat dissipation system 4 includes a heat-dissipating fan 45. The main functions of the liquid-cooled heat dissipation system 4 are as follows. It is to dissipate the high heat that is generated.

  However, there is no specific direction at the position where the heat radiating fan 45 is installed, and only hot air is sent to the internal space of the computer case. The liquid cooling heat radiating system 4 absorbs the thermal energy from the CPU in an effective manner. The heat cannot be discharged out of the case, and only turbulence is generated inside the case, so the heat dissipation efficiency is not ideal.

  The present invention aims to provide a kind of liquid-cooled computer device, which includes a computer case, a power supply, and a liquid-cooled heat dissipation system. The computer case includes an upper lid and a bottom case, and an air outlet is provided on the side of the computer case. Both the power supply unit and the liquid cooling type heat dissipation system are installed in the internal space of the computer case.

  The power supply also includes a case and a heat dissipation fan. The power supply case includes a front plate, a rear plate, and a side plate. A front air inlet is opened in the front plate and communicates with the interior space of the computer case, a rear air outlet is opened in the rear plate, communicates with the air outlet on the side of the computer case, and the side plate also has at least one side. An air inlet is provided. The heat radiating fan of the power supply unit is mounted in the case and is mounted at a position corresponding to the front air inlet of the front plate.

  The liquid cooling type heat radiation system includes a liquid storage box, a pump, a heat collector, a heat sink, a plurality of communication pipes, a circulation pipe, and a heat radiation fan. The liquid storage box, the pump, the heat collector, and the heat sink are connected in series by a plurality of communication pipes in order to form a circulation pipe. The heat collector is attached above the CPU and collects high heat generated by the CPU during operation. The heat sink is a module including fins, the inside of the heat sink is attached to the outside of the side plate of the power supply unit, and corresponds to at least one side air inlet of the side plate of the power supply unit, and the heat dissipation fan is attached to the outside of the heat sink. .

  In this way, the heat dissipation fan of the liquid cooling type heat dissipation system rotates to send out the airflow, the airflow first flows through the heat sink and takes heat energy, and further enters the power supply case from at least one side air inlet of the side plate of the power supply. Then, the air flow generated by the rotation of the heat radiating fan of the power supply unit is received. At the same time, it passes through the rear exhaust port on the rear plate of the power supply unit and the air outlet port on the side of the computer case. Discharged.

  As a result, the present invention increases the air flow rate flowing into the power supply unit to take more heat energy from the power supply unit, and also forms an effective wind field in the internal space of the computer case to form various electronic devices. The high heat generated by the device is guided, smoothly entered into the power supply unit, and discharged outside the computer case.

  Among them, the liquid flowing in the circulation pipe of the present invention is water, alcohol, or other fluid.

  In addition, the heat collector of the present invention can be attached to other heat generating electronic devices such as a display card chip and a 3D drawing chip.

The invention of claim 1 is a liquid-cooled computer apparatus,
A computer case including an internal space, a side surface, and an air outlet passing through the side surface;
The computer case is installed in the internal space of the computer case and includes a case and a heat radiating fan. The case includes a front plate, a side plate, and a rear plate, and the front plate communicates with the internal space of the computer case. An air inlet is opened, at least one side air inlet is opened in the side plate, a rear air outlet is opened in the rear plate corresponding to the air outlet of the computer case, and the heat radiating fan is placed in the case A power supply attached and corresponding to the front inlet of the front plate;
A liquid-cooled heat dissipation system including a heat sink and a heat dissipating fan attached to the outside of the heat sink, the inside of the heat sink being attached to the outside of the side plate of the power supply, and corresponding to at least one side air inlet; ,
The liquid-cooled computer apparatus is characterized by including the above.
The invention according to claim 2 is the liquid-cooled computer apparatus according to claim 1, wherein the heat sink of the liquid-cooled heat dissipation system includes a fin module.
According to a third aspect of the present invention, in the liquid-cooled computer apparatus according to the first aspect, the liquid-cooled heat dissipation system includes a liquid storage box, a pump, a heat collector, and a plurality of communication pipes. A liquid-cooled computer apparatus is characterized in that a circulation line is formed by sequentially connecting a box, a pump, a heat collector, and a heat sink in series.
According to a fourth aspect of the present invention, there is provided the liquid-cooled computer apparatus according to the third aspect, wherein the heat collector is attached above the CPU.
The invention of claim 5 is the liquid-cooled computer apparatus according to claim 1, wherein the computer case includes an upper lid and a bottom case.

  The present invention increases the air flow rate flowing into the power supply unit to take more heat energy from the power supply unit, and also forms an effective wind field in the internal space of the computer case to generate various electronic devices. The high heat to be guided is smoothly entered into the power supply unit and discharged out of the computer case.

  FIG. 2 is a plan view of the embodiment of the present invention, and FIG. 3 is a local exploded view of the embodiment of the present invention. In the figure, a computer case 1, a power supply 2 and a liquid cooling type heat radiation system 3 of the present invention are shown.

  The computer case 1 of this embodiment is formed by closing a bottom case 12 with an upper lid 11, and has a side surface 121 on the side of the bottom case 12. An internal space 10 is formed inside the computer case 1, and an air outlet 122 is provided on the side surface 121.

  The power supply 2 is mounted in the internal space 10 and includes a case 21 and a heat radiating fan 22. The case 21 further includes a front plate 211, a side plate 212, and a rear plate 213. A front air inlet 214 is opened in the front plate 211, and the front air inlet 214 communicates with the internal space 10 of the computer case 1. The side plate 212 is provided with a plurality of side air inlets 215. A rear air outlet 216 is provided in the rear plate 213, and the rear air outlet 216 communicates with the air outlet 122. The heat radiating fan 22 is attached to the inside of the case 21 and corresponds to the front air inlet 214.

  FIG. 4 is a cooling circuit diagram of a specific embodiment of the heat dissipation fan 22. In the figure, a liquid cooling type heat radiation system 3 is shown, which includes a liquid storage box 31, a pump 32, a heat collector 33, a heat sink 34, a plurality of communication pipes 30, and a heat radiation fan 35. A plurality of communication pipes 30 sequentially connect a liquid storage box 31, a pump 32, a heat collector 33, and a heat sink 34 to form a circulation pipe line. The heat collector 33 is attached above the CPU and collects high heat generated by the CPU during operation. The heat sink 34 is a module having fins and includes an outer side 341 and an inner side 342. The heat radiating fan 35 is attached to the outer side 341, the inner side 342 is attached to the outer side of the side plate 212, and corresponds to the plurality of side air inlets 215.

  As a result, the heat radiating fan 35 of the liquid cooling type heat radiating system 3 is rotated to send out an air current. The air current first flows through the heat sink 34 and takes heat energy, and further supplies power from a plurality of side air inlets 215 on the side plate of the power supply 2. Entering the case 21 of the power supply 2 and subsequently receiving the flow of the airflow generated by the rotation of the heat radiating fan 22 of the power supply 2, together with the rear exhaust port 216 on the rear plate of the power supply 2, and the computer case It passes through the air outlet 122 on the side and is discharged to the outside of the computer case 1.

  As a result, the present invention increases the air flow rate flowing into the power supply 2 to take more heat energy from the power supply 2 and forms an effective wind field in the internal space 10 of the computer case 1. The high heat generated by the various electronic devices is guided, smoothly entered into the power supply 2 and discharged together with the computer case 1.

It is a top view inside a known liquid-cooled computer apparatus. It is a top view of the Example of this invention. It is a local exploded view of the Example of this invention. It is a cooling circuit diagram of the Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Computer case 10 Internal space 11 Top cover 12 Bottom case 121 Side 122 Outlet 2 Power supply 21 Case 211 Front board 212 Side board 213 Rear board 214 Front inlet 215 Side inlet 216 Rear outlet 22 Heat radiation fan 3 Liquid cooling type heat radiation System 30 Communication pipe 31 Liquid storage box 32 Pump 33 Heat collector 34 Heat sink 341 Outside 342 Inside 35 Heat radiation fan 4 Liquid cooling type heat radiation system 45 Heat radiation fan

Claims (5)

In a liquid-cooled computer device,
A computer case including an internal space, a side surface, and an air outlet passing through the side surface;
The computer case is installed in the internal space of the computer case and includes a case and a heat radiating fan. The case includes a front plate, a side plate, and a rear plate, and the front plate communicates with the internal space of the computer case. An air inlet is opened, at least one side air inlet is opened in the side plate, a rear air outlet is opened in the rear plate corresponding to the air outlet of the computer case, and the heat radiating fan is placed in the case A power supply attached and corresponding to the front inlet of the front plate;
A liquid-cooled heat dissipation system including a heat sink and a heat dissipating fan attached to the outside of the heat sink, the inside of the heat sink being attached to the outside of the side plate of the power supply, and corresponding to at least one side air inlet; ,
A liquid-cooled computer apparatus comprising:   2. The liquid-cooled computer apparatus according to claim 1, wherein the heat sink of the liquid-cooled heat dissipation system includes a fin module.   2. The liquid-cooled computer apparatus according to claim 1, wherein the liquid-cooled heat dissipation system includes a liquid storage box, a pump, a heat collector, and a plurality of communication pipes, and the communication pipes are the liquid storage box, the pump, and the heat collector. , And a heat-sink connected in series to form a circulation line.   4. The liquid-cooled computer apparatus according to claim 3, wherein the heat collector is attached above the CPU. 2. The liquid-cooled computer apparatus according to claim 1, wherein the computer case includes an upper lid and a bottom case.

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