TWI812334B - Camera module - Google Patents

Abstract

A camera module including a circuit board, a lens, and a positioning bracket is provided. The circuit board has a first through hole and a second through hole. The lens is disposed on the circuit board and locates between the first through hole and the second through hole. The positioning bracket has a main body, a first positioning piece, and a second positioning piece. The circuit board is disposed in the main body. The first positioning piece is bendably connected to the main body. The second positioning piece is bendably connected to the main body. The first positioning piece and the second positioning piece are located over the circuit board and respectively fastened with the first through hole and the second through hole.

Description

camera module

The present invention relates to a camera module, and in particular, to a thin camera module.

Existing portable electronic devices such as tablets and laptops have developed towards thinner structures. Therefore, the thickness of the display body will be greatly reduced, resulting in limited internal space of the display body. The camera module is installed on the display body. The existing technology is to combine the camera module with a bracket, form multiple positioning parts on the bracket and penetrate multiple positioning holes of the camera module. After the two are combined, they are buried together in the display body. Most of the positioning parts are from The bottom extends upward and space needs to be reserved, so it is difficult to achieve thinning requirements.

Under the trend of thinning of existing portable electronic devices, the display body no longer has enough space for the bracket to form a positioning part. The positioning method currently used is to stick the camera module to the bracket or against the bracket. However, there is a lack of positioning parts. When the positioned camera module is used for a long time, the camera module is prone to offset problems, which affects the appearance and even the shooting function.

The present invention provides a camera module, which is suitable for thin electronic devices and has a flexible positioning component that is snap-connected to a circuit board from above to accurately position the lens.

The camera module of the present invention includes a circuit board, a lens and a positioning frame. The circuit board has a first through hole and a second through hole. The lens is disposed on the circuit board and is located between the first through hole and the second through hole. The positioning frame has a main body, a second positioning part and a second positioning part. The circuit board is arranged on the main body. The first positioning component is connected to the main body. The second positioning component is connected to the main body. The first positioning member and the second positioning member are located above the circuit board and are respectively engaged with the first through hole and the second through hole.

In an embodiment of the present invention, the above-mentioned first positioning member has a first bending part and a first clamping part. The first clamping part is connected to the first bending part and is suitable for bending at a first angle relative to the main body. .

In an embodiment of the present invention, the above-mentioned second positioning member has a second bending part and a second clamping part. The second clamping part is connected to the second bending part and is suitable for bending at a second angle relative to the main body. .

In an embodiment of the present invention, a first length of the above-mentioned first positioning member relative to the main body is greater than a second length of the second positioning member relative to the main body.

In one embodiment of the present invention, the above-mentioned positioning frame has two positioning blocks, which are formed on the main body and form a groove. The circuit board is arranged in the groove and abuts against the two positioning blocks and the main body.

In one embodiment of the present invention, a housing is further included, and two positioning blocks of the positioning frame are clamped to the housing.

In an embodiment of the present invention, it further includes two covers, which are arranged on the circuit board and located on both sides of the lens. The first positioning member and the second positioning member are respectively penetrated through the two covers.

In an embodiment of the present invention, a baffle is further included, which is arranged on the positioning frame and covers the circuit board. An opening of the baffle is aligned with the lens.

In an embodiment of the present invention, the above-mentioned lens is a complementary metal oxide semiconductor device or a photosensitive coupling device.

In an embodiment of the present invention, the above-mentioned circuit board is a flexible printed circuit board or a printed circuit board.

Based on the above, the camera module of the present invention is suitable for thin electronic devices. The positioning frame has a bendable first positioning member and a second positioning member. The circuit board is clamped to the first positioning member through bending. and the second positioning member, and then restore the first positioning member and the second positioning member to their original positions, thereby positioning the circuit board and the lens in the body. Compared with the existing pasting or abutment methods of camera modules, which have large dimensional tolerances and are prone to lens offset problems after the whole machine is assembled, the camera module of the present invention adopts a top-down positioning method. To achieve the goal of thinning and accurately positioning the circuit board and lens.

1A is a schematic three-dimensional view of the positioning frame and housing of the camera module according to an embodiment of the present invention. FIG. 1B is a schematic diagram of the bending of the positioning frame of the camera module of FIG. 1A . FIG. 1C is a schematic diagram of the positioning frame of FIG. 1B combined with the circuit board and lens. Figure 1D is a schematic diagram of the positioning frame of Figure 1A driving the circuit board and lens back into place. FIG. 2A is a schematic top view of the camera module of FIG. 1D.

Referring to Figure 1D, the camera module of the present invention is suitable for notebook computers, tablet computers or similar portable electronic devices as front-facing photography equipment. When the portable electronic device is unfolded or placed in front of the user, it can be switched to a photography mode or a photo mode for video conferencing or selfies.

Referring to FIGS. 1A to 1D , the camera module 100 of the present invention includes a circuit board 110 , a lens 120 and a positioning bracket 130 .

With reference to FIG. 1C and FIG. 2A , the circuit board 110 has a first through hole H1 and a second through hole H2, where the first through hole H1 and the second through hole H2 are asymmetrically arranged. In other embodiments, the first through hole and the second through hole may be arranged symmetrically or more than two through holes may be used, depending on the structural requirements. In addition, the circuit board is, for example, a printed circuit board (PCB) or a flexible printed circuit board (FPC). Among them, the flexible printed circuit board (FPC) has the characteristics of being freely bendable and light and thin. Therefore, the use of the flexible printed circuit board (FPC) can reduce the space occupied by the camera module in the portable electronic device.

Referring to FIG. 1C and FIG. 2A , the lens 120 is disposed on the circuit board 110 and is located between the first through hole H1 and the second through hole H2. The lens 120 is, for example, a complementary metal oxide semiconductor device (CMOS) or a photosensitive coupling device (CCD). ), this depends on the needs.

FIG. 2B is a schematic cross-sectional view of the camera module of FIG. 2A along line A-A. FIG. 2C is a schematic cross-sectional view of the camera module in FIG. 2A along line B-B. FIG. 2D is a schematic cross-sectional view of the camera module in FIG. 2A along line C-C. FIG. 3A is a schematic diagram of the bending action of the camera module in FIG. 2C. Figure 3B is a schematic diagram of the bending action of the camera module in Figure 2D.

Referring to FIG. 1A , FIG. 1B and FIG. 2A , the positioning frame 130 has a main body 131 , a first positioning member 132 , a second positioning member 133 and two positioning blocks 134 . The main body 131 has a long strip structure, and the circuit board 110 is arranged in the main body 131 .

The first positioning member 132 is flexibly connected to the main body 131, the second positioning member 133 is flexibly connected to the main body 131, and the first positioning member 132 and the second positioning member 133 are parallel to each other. Referring to FIG. 1D and FIG. 2A , the first positioning member 132 and the second positioning member 133 are located above the circuit board 110 and are respectively engaged with the first through hole H1 and the second through hole H2 of the circuit board 110 , thereby fixing the circuit board 110 Positioned in body 131.

Referring to FIG. 2A and FIG. 2C , the first positioning member 132 has a first bending part 1321 and a first clamping part 1322 . The first bending part 1321 is formed on the main body 131, the first clamping part 1322 is vertically connected to the first bending part 1321, and the first clamping part 1322 is suitable for driving the first bending part 1321 to bend relative to the main body 131 at a first angle A1 ( See Figure 3A).

Referring to FIG. 2A and FIG. 2D , the second positioning member 133 has a second bending part 1331 and a second clamping part 1332 . The second bending part 1331 is formed on the main body 131, the second clamping part 1332 is vertically connected to the second bending part 1331, and the second clamping part 1332 is suitable for driving the second bending part 1331 to bend relative to the main body 131 at a second angle A2 ( See Figure 3B).

Referring to FIGS. 2A and 2B , a first length L1 of the first positioning member 132 relative to the main body 131 is greater than a second length L2 of the second positioning member 133 relative to the main body 131 . In other embodiments, the first length is, for example, less than or equal to the second length, which depends on structural requirements and is not limited by the present invention.

Referring to FIG. 1A and FIG. 2A , two positioning blocks 134 are respectively formed at both ends of the main body 131 and form a groove AG. The circuit board 110 is disposed in the groove AG and abuts against the main body 131 . The camera module 100 further includes a housing 140. The two positioning blocks 134 of the positioning frame 130 are clamped on the surface of the housing 140, and the housing 140 is used to carry the circuit board 110 and the lens 120. Furthermore, the housing 140 is made of metal and is in surface contact with the circuit board 110, thereby achieving the effect of heat dissipation.

Referring to FIG. 1D and FIG. 2A , the camera module 100 further includes two covers 150 , which are arranged on the circuit board 110 and located on both sides of the lens 120 . The first positioning member 132 and the second positioning member 133 are respectively inserted through the two covers 150 . It is clamped in the first through hole H1 and the second through hole H2. Specifically, the first engaging portion 1322 and the second engaging portion 1332 are respectively penetrated through the two covers 150 and enter the first through hole H1 and the second through hole H2 respectively, thereby improving the positioning effect of the circuit board 110 .

Referring to Figures 2A and 2B, the camera module 100 also includes a baffle 160, which is disposed on the positioning frame 130 and covers the circuit board 110. The baffle 160 has an opening 161 and a transparent lens 162. The opening 161 is aligned with the lens 120. And the transparent lens 162 covers the opening 161. In addition, the baffle 160 is used to prevent dust in the environment from accumulating on the circuit board 110 and the lens 120 .

Referring to FIGS. 1A to 1D , the assembly process of the camera module 100 will be described in detail below. Referring to FIG. 1A , the positioning frame 130 is positioned on the housing 140 , and the first positioning member 132 and the second positioning member 133 are in the initial state (not bent). fold). Referring to FIG. 1B , external force is applied to the first positioning member 132 and the second positioning member 133 , so that the first clamping part 1322 drives the first bending part 1321 to bend relative to the main body 131 at a first angle A1 (see FIG. 3A ), and the second The clamping portion 1332 is adapted to drive the second bending portion 1331 to bend at a second angle A2 relative to the main body 131 (see Figure 3B). Referring to FIG. 1C , the first through hole H1 and the second through hole H2 of the circuit board 110 are respectively inserted by the first engaging portion 1322 and the second engaging portion 1332 . Referring to FIG. 1D and FIG. 2A , the first clamping part 1322 and the second clamping part 1332 are elastically restored to drive the circuit board 110 into the groove AG of the positioning frame 130 and attached to the housing 140 .

To sum up, the camera module of the present invention is suitable for thin electronic devices. The positioning frame has a bendable first positioning member and a second positioning member. Through bending, the circuit board is clamped to the second positioning member. A positioning member and a second positioning member are used to restore the first positioning member and the second positioning member to their original positions, thereby positioning the circuit board and the lens in the body. Compared with the existing pasting or abutment methods of camera modules, which have large dimensional tolerances and are prone to lens offset problems after the whole machine is assembled, the camera module of the present invention adopts a top-down positioning method. To achieve the goal of thinning and accurately positioning the circuit board and lens.

Furthermore, in the camera module of the present invention, the bottom of the positioning frame is hollowed out to form a groove, which is convenient for placing the circuit board and lens, and can reduce the structural thickness of the camera module. The positioning of the first positioning member and the second positioning member helps to maintain the concentricity between the lens and the opening of the baffle, and prevents the lens from deviating from the opening of the baffle and being blocked.

100:Camera module 110:Circuit board 120: Lens 130: Positioning frame 131:Subject 132: First positioning piece 1321: First bending part 1322: The first clamping part 133:Second positioning piece 1331:Second bending part 1332: The second clamping part 134: Positioning block 140: Shell 150:Cover 160:Baffle 161:Open your mouth 162:Transparent lens AG: Groove A1: first angle A2: Second angle H1: first piercing H2: Second piercing L1: first length L2: second length

1A is a schematic three-dimensional view of the positioning frame and housing of the camera module according to an embodiment of the present invention. FIG. 1B is a schematic diagram of the bending of the positioning frame of the camera module of FIG. 1A . FIG. 1C is a schematic diagram of the positioning frame of FIG. 1B combined with the circuit board and lens. Figure 1D is a schematic diagram of the positioning frame of Figure 1A driving the circuit board and lens back into place. FIG. 2A is a schematic top view of the camera module of FIG. 1D. FIG. 2B is a schematic cross-sectional view of the camera module of FIG. 2A along line A-A. FIG. 2C is a schematic cross-sectional view of the camera module in FIG. 2A along line B-B. FIG. 2D is a schematic cross-sectional view of the camera module in FIG. 2A along line C-C. FIG. 3A is a schematic diagram of the bending action of the camera module in FIG. 2C. Figure 3B is a schematic diagram of the bending action of the camera module in Figure 2D.

100:Camera module

110:Circuit board

120: Lens

130: Positioning frame

131:Subject

132: First positioning piece

1321: First bending part

1322: The first clamping part

133:Second positioning piece

1331:Second bending part

1332: The second clamping part

134: Positioning block

140: Shell

150:Cover

Claims (10)

A camera module including: A circuit board having a first through hole and a second through hole; a lens disposed on the circuit board and between the first through hole and the second through hole; and A certain spacer with: A main body, the circuit board is arranged on the main body; a first positioning member bendably connected to the main body; and a second positioning member bendably connected to the main body, The first positioning member and the second positioning member are located above the circuit board and are respectively engaged with the first through hole and the second through hole. The camera module of claim 1, wherein the first positioning member has a first bending part and a first clamping part, the first clamping part is connected to the first bending part and is adapted to bend relative to the main body. Fold to the first angle. The camera module of claim 2, wherein the second positioning member has a second bending part and a second clamping part, the second clamping part is connected to the second bending part and is adapted to bend relative to the main body. Fold to a second angle. The camera module of claim 1, wherein a first length of the first positioning member relative to the main body is greater than a second length of the second positioning member relative to the main body. The camera module of claim 1, wherein the positioning frame has two positioning blocks, which are formed on the main body and form a groove, and the circuit board is disposed in the groove and abuts against the main body. The camera module of claim 5 further includes a housing, and the two positioning blocks of the positioning frame are snap-connected to the housing. The camera module of claim 1 further includes two covers, which are arranged on the circuit board and located on both sides of the lens, and the first positioning member and the second positioning member are respectively penetrated through the two covers. The camera module of claim 1 further includes a baffle disposed on the positioning frame and covering the circuit board, and an opening of the baffle is aligned with the lens. The camera module of claim 1, wherein the lens is a complementary metal oxide semiconductor element or a photosensitive coupling element. The camera module according to claim 1, wherein the circuit board is a flexible printed circuit board or a printed circuit board.

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